JP2008256870A - Optical cable module and electronic device incorporating it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical cable module which does not degrade the optical coupling efficiency, has a high productivity, and can reduce its defects when manufacturing, and which can reduce the troubles due to contacts of the components caused by the vibrations and impacts when using. <P>SOLUTION: The optical cable module 1 has a substrate mounting a light receiving and emitting element 3 and electrical wiring 5 connected to it, an electric connector 6 formed at an end of this electrical wiring 5, and an optical wave-guide film 2 with at least its one end made aslant. Further, it has a height compensation component 4 to maintain a certain distance between the optical wave-guide film 2 and the light receiving and emitting element 3. The area including the electrical wiring 5 and the light receiving and emitting element 3 is surrounded by the height compensation component 4 or by the side of a recess in the direction parallel to the surface of the substrate 7. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical module for optical data transmission, and particularly to an optical cable module having flexibility.

  In recent years, optical communication networks capable of high-speed and large-capacity data communication have been expanded. In the future, this optical communication network is expected to be installed in consumer equipment. In particular, as an application for transmitting data between boards in an apparatus, there is a demand for an optical input / output optical data transmission cable (optical cable) that can be used without changing from the current electric cable. As this optical cable, it is desirable to use a film optical waveguide in consideration of flexibility.

  An optical waveguide is formed by a core having a high refractive index and a clad having a low refractive index provided in contact with the periphery of the core, and an optical signal incident on the core is repeatedly totally reflected at the boundary between the core and the clad. It propagates while. Further, the film optical waveguide has flexibility because the core and the clad are made of a flexible polymer material.

  When this flexible film optical waveguide is used as an optical cable, it is necessary to align and optically couple with a photoelectric conversion element (light emitting / receiving element). The light emitting / receiving element is an element that converts an electrical signal into an optical signal and transmits it, receives an optical signal, and converts it into an electrical signal.

  However, since the film optical waveguide has flexibility, it is very difficult to align the light emitting / receiving element and the film optical waveguide. In addition, since this alignment affects the optical coupling efficiency, precision is required.

  Conventionally, the alignment between the light receiving and emitting element and the film optical waveguide requires the coincidence of the position and the optical axis. Therefore, it is necessary to adjust the film optical waveguide in the 5-axis direction. That is, as shown in FIG. 40, the distance D between the light emitting / receiving element and the film optical waveguide, the X axis in the XY plane, the Y axis, the rotation direction φ, and the Z axis direction orthogonal to the XY plane. Adjustment is necessary.

  Generally, as a method of manufacturing a film optical waveguide for the above alignment, a method in which a light receiving / emitting element and an end surface of a film optical waveguide are fixed with rigid members and individually coupled is used. . An example of a method for producing this film optical waveguide is described in Patent Document 1.

  FIG. 41 is a side view showing the method for manufacturing the flexible (film) optical waveguide substrate described in Patent Document 1. This manufacturing method will be specifically described below.

  First, adhesive strength improvers 131 and 132 are applied in advance to both ends of the base substrate 110 (FIG. 41A). Next, after forming the clad 121 on the base substrate 110 (FIG. 41B), the core 122 is formed (FIG. 41C). And the film optical waveguide board | substrate 100 by which the edge part was fixed can be manufactured by removing a part corresponding to the adhesive strength improvement agents 131 and 132 other than the part to which the adhesive force improvement agents 131 and 132 are adhered.

  And by using the film optical waveguide board | substrate 100, as shown to Fig.40 (a) (b), alignment with a film optical waveguide and a light emitting / receiving element can be performed.

40A and 40B are diagrams showing a schematic configuration of an optical cable module 101 including the above-described film optical waveguide substrate 100. FIG. As shown in the figure, the distance D, the X axis, the Y axis, the rotational direction φ, and the Z axis are adjusted by attaching a rigid member 105 to the film optical waveguide 102 and fixing the flexible film optical waveguide 102. Thus, alignment with the light emitting / receiving element 103 on the substrate 107 can be performed.
Japanese Patent Laid-Open No. 4-281406 (released on October 7, 1992) Japanese Patent Laying-Open No. 2005-321560 (published on November 17, 2005)

  However, in the conventional configuration, productivity is poor because man-hours for fixing the end face of the film optical waveguide are required. In addition, as described above, in order to optically couple the film light guide and the light emitting / receiving element, adjustment in five axial directions (distance D, X axis, Y axis, rotational direction φ, Z axis) is necessary. There is a problem that the productivity of the optical cable module is poor.

  Here, as another method for facilitating the above positioning, the following configuration obtained by developing the above prior art can be considered.

  42 (a) and 42 (b) are side views showing a configuration in which a fixed connection member 104 such as a ferrule as a holding member is provided at the tip of a film optical waveguide 102 whose end face is processed into an inclined surface of 45 degrees. According to the configuration shown in the figure, since the distance D between the light emitting / receiving element 103 and the film optical waveguide 102 can be kept constant at all times, alignment is easier than in the conventional method.

  However, in the configuration shown in the figure, it is necessary to increase the distance D so that the fixed connection member 104 and the light emitting / receiving element 103 do not come into contact with each other. Therefore, the film optical waveguide 102 cannot obtain a sufficient optical signal output from the light emitting / receiving element 103, and the optical coupling efficiency is lowered.

  In addition, according to the configuration shown in FIGS. 43 (a) and 43 (b), in order to align with the film optical waveguide 102 whose end face is processed at a right angle, it is necessary to mount the light emitting / receiving element 103 upright. Increases and productivity is poor.

  Furthermore, as shown in FIGS. 44 (a) and 44 (b), a method in which the film optical waveguide 102 and the flip-chip circuit element 111 are separately formed with the substrate 107 interposed therebetween to integrate the circuit portion 112 is conceivable. .

  However, in the configuration shown in the figure, when the integrated circuit unit 112 is modularized, the overall outer shape of the optical cable module is increased. In addition, since the connection portion is optical coupling that requires alignment in the five-axis directions, pins and buckles that compensate the connection are required, and the outer shape is also enlarged. Further, in terms of construction, double-sided mounting is required on the substrate 107, which increases the number of mounting steps.

  On the other hand, Patent Document 2 discloses the following optical waveguide module. 45 (a) is a perspective view of the conventional optical waveguide module 201, FIG. 45 (b) is a side sectional view thereof, and FIG. 45 (c) is an airtight packaged optical waveguide module 201. It is a perspective view.

  As shown in these drawings, an optical waveguide film 210 is mounted on a submount 220, and light is transmitted to and from the light emitting / receiving element 232 through mirror surface reflection at the end face. In such a configuration, it is necessary to protect the light emitting / receiving element 232, the electrode 242 provided in the IC package 240, and the like in order to improve the reliability of the module components. As this general method, it is assumed that the component is covered with a sealing resin. However, in this structure, when the light emitting / receiving element 232 is to be sealed, the sealing resin is assumed to adhere to the 45 ° mirror end face. Therefore, sealing is very difficult.

  In addition, it is conceivable that only the end face of the optical waveguide film 210 and the optical component region such as the light emitting / receiving element 232 are hermetically protected, but the electrode 242 and the wiring 246 connecting the light emitting / receiving element 232 and the electrode 242 are exposed. The reliability is low. Therefore, as shown in FIG. 45C, an airtight package structure is formed so as to cover the entire optical waveguide module. That is, since the electrode 242 is provided outside the submount 220, the space required for the hermetic package is increased to cover the electrode 242 and the wiring 246. Thereby, there exists a problem that the whole module enlarges.

  The present invention has been made in view of the above-mentioned various problems, and the object thereof is high productivity without deteriorating the optical coupling efficiency, generation of defects at the time of production, and vibration at the time of use. An object of the present invention is to provide an optical cable module that can reduce the occurrence of problems associated with contact between components due to impact or the like, and an electronic device including the optical cable module.

  In order to solve the above-described problems, an optical cable module according to the present invention includes a substrate on which a surface-emitting / emitting optical element and electrical wiring connected to the optical element are mounted, and a film in which at least one end face is processed obliquely In an optical cable module comprising an optical waveguide, a height compensation member is provided for maintaining a constant distance between the film optical waveguide and the optical element, and the height compensation member is a substrate surface of the substrate. The region surrounding the electric wiring and the optical element is surrounded in a direction parallel to the optical element.

  The film optical waveguide is formed by a core portion having a high refractive index and a clad portion having a low refractive index provided around the core portion, and an optical signal incident on the core portion is a boundary between the core portion and the clad portion. It propagates while repeating total reflection.

  According to the above configuration, the height compensation member is provided outside the projection region of the optical element on the substrate on the surface of the substrate on which the optical element is mounted, and the film optical waveguide is provided on the height compensation member. The film optical waveguide and the optical element are optically coupled with the distance between the two being kept constant.

  As a result, the distance between the two can always be kept constant by the height compensation member provided between the film optical waveguide and the optical element, so there is no need to adjust the distance between the two. Further, since a member for fixing the film optical waveguide and connecting it to the substrate is not necessary, the distance between the film optical waveguide and the optical element can be set optimally. Therefore, the film optical waveguide and the optical element can be easily optically coupled by simple alignment without degrading the optical coupling efficiency.

  Further, according to the above configuration, since the optical element and the electric wiring are surrounded on the substrate by the height compensation member, it is possible to suppress contact of an external member with the optical element and the electric wiring. . Therefore, it is possible to reduce the occurrence of defects due to contact between parts due to generation of defects during production and vibration / impact during use.

  In the optical cable module of the present invention, in the optical cable module described above, one of a surface on which the film optical waveguide is mounted on the height compensation member or a surface on which the film optical waveguide is mounted on the substrate is provided. The film optical waveguide is preferably formed so as to sandwich both side surfaces thereof.

  According to said structure, any one of a height compensation member or a board | substrate is formed so that the both sides | surfaces of a film optical waveguide may be pinched. Thereby, since the position which mounts a film optical waveguide is preset, the alignment with a film optical waveguide and an optical element can be performed still more easily.

  In the optical cable module of the present invention, it is preferable that the electrical wiring and the optical element are fixed with a sealant in the optical cable module described above.

  Thereby, since electrical wiring and an optical element can be protected from the exterior, the deterioration of the transmission characteristic of an electrical signal can be prevented, and a highly reliable optical cable module can be realized.

  In the optical cable module of the present invention, it is preferable that the electrical wiring, the optical element, and the film optical waveguide are package-fixed in the optical cable module described above.

  As a result, the distance between the film optical waveguide and the optical element can be reliably fixed, so that it is possible to prevent the deterioration of the transmission characteristics of the electric signal and realize an optical cable module with higher optical coupling efficiency. be able to.

  Further, the optical cable module of the present invention is the above-described optical cable module, wherein the electric wiring and the optical element are disposed in a region surrounded by the height compensation member or a region surrounded by a side surface of the recess. It is good also as a structure by which the sealing material is provided so that it may be covered.

  According to the above configuration, the optical element and the electrical wiring do not come into contact with outside air, so that it is possible to suppress the deterioration over time due to oxidation, corrosion, etc., and to prevent the occurrence of defects due to adhesion of dust, etc. Can do. In addition, it is possible to completely prevent the contact of external members with the optical element and the electric wiring, so that the occurrence of defects during manufacturing and the occurrence of defects due to contact between parts due to vibration and impact during use are further increased. Can be reduced.

  In addition, since the sealing material is injected into the space surrounded by the height compensation member or the side surface of the recess and the substrate, the sealing material does not flow out to an unnecessary area at the time of manufacture. It is possible to accurately inject a necessary and sufficient amount of the sealing material into a necessary portion.

  The optical cable module of the present invention is the above-described optical cable module, wherein the space enclosed by the height compensation member and the substrate or the space enclosed by the side surface and the bottom surface of the recess is sealed. It is good also as a structure in which the member is provided.

  According to the above configuration, since the optical element and the electrical wiring are arranged in a sealed space, it is possible to suppress the deterioration over time due to oxidation, corrosion, etc., and to prevent the occurrence of problems due to adhesion of dust, etc. Can do. In addition, it is possible to completely prevent contact of external members with optical elements and electrical wiring, thus reducing the occurrence of defects during manufacturing and the occurrence of defects due to contact between parts due to vibration and impact during use. can do.

  Further, the optical cable module of the present invention is the above-described optical cable module, wherein the film optical waveguide is at least one of a portion protruding to the optical element side from a surface in contact with the height compensation member or a surface in contact with the substrate. On the surface, a region in the vicinity of at least one of the two side surfaces parallel to the light transmission direction of the film optical waveguide may be supported by the height compensation member or the substrate.

  According to the above configuration, since one lateral side of the protruding portion of the film optical waveguide with respect to the protruding direction is supported by the height compensation member or the substrate, the bending of the protruding portion due to gravity, impact, vibration, or the like is suppressed. Can do. Thereby, the reliability of the optical coupling between the film optical waveguide and the optical element can be improved.

  The optical cable module of the present invention is the optical cable module described above, wherein the height compensation member or the substrate has a lower surface contact surface that contacts the lower surface of the film optical waveguide, and a surface perpendicular to the lower surface contact surface. It is good also as a structure provided with the two side surface opposing surfaces which respectively oppose the two side surfaces with respect to the optical transmission direction of the said film optical waveguide.

  According to the above configuration, since the side surface of the film optical waveguide is guided by the two side surface facing surfaces, the rotation of the film optical waveguide when the film optical waveguide is placed on the height compensation member or the substrate. Directional position accuracy and X-direction position accuracy can be ensured. That is, it is possible to loosen the mounting position accuracy of the film optical waveguide in the manufacturing process of the optical cable module.

  In the optical cable module of the present invention, in the optical cable module described above, the substrate is provided with a through hole penetrating from the upper surface to the lower surface of the substrate in a region surrounded by the height compensation member or the recess. The optical element is provided on the side of the substrate opposite to the side on which the film optical waveguide is provided, and optical coupling between the end face of the film optical waveguide and the optical element is performed through the through hole. It is good also as a structure to be called.

  According to the above configuration, since the optical element is provided on one surface of the substrate and the electric wiring is provided on the other surface, the area of the region where the optical element and the electric wiring are formed on the surface of the substrate is further reduced. It becomes possible. That is, the area saving of the optical cable module can be realized.

  Further, the optical cable module of the present invention is the optical cable module described above, further comprising electrical connection means electrically connected to the electrical wiring and electrically connected to external wiring, the electrical connection means comprising: It is good also as a structure provided in the said height compensation member.

  According to the above configuration, the height compensation member has the above-described height compensation function, and the function of installing the electrical connection means and the function of connecting to the external wiring board in addition to the function of protecting the optical element and the electrical wiring. It becomes possible to have. Therefore, for example, the outer shape of the optical cable module can be made smaller as compared with the case where the function of installing the electrical connection means and the function of connecting to the external wiring board are configured by different members.

  The optical cable module of the present invention is the optical cable module described above, wherein a plurality of the film optical waveguides are provided, and a plurality of the optical elements are provided corresponding to the respective film optical waveguides. The substrate has a shape such that a distance between the predetermined film optical waveguide and the corresponding optical element and a distance between another film optical waveguide and the corresponding optical element are different from each other. It is good also as a structure.

  According to the above configuration, for example, even when the plurality of optical elements are of different types and the optimum distance to the end face of the film optical waveguide is different, the film optical waveguide is disposed at the optimum distance for each optical element. Is possible. Therefore, stable optical coupling can be realized in any set of film optical waveguides and optical elements.

  The optical cable module of the present invention is the optical cable module described above, wherein the optical element on the light emitting side optically coupled to one end face of the film optical waveguide and the other end face of the film optical waveguide are optically coupled. The optical element on the light receiving side to be coupled is preferably provided on the substrate.

  Thereby, the optical cable module for optical communications with high optical coupling efficiency is realizable.

  The optical cable module of the present invention is an electronic circuit having the driving IC for driving the optical element on the light emitting side and the amplifying IC for amplifying an output signal from the optical element on the light receiving side in the optical cable module described above. It is preferable to provide.

  According to said structure, a film optical waveguide, an optical element, and an electronic circuit can be closely mounted. Thereby, since the distance between the optical element and the electronic circuit can be set optimally, a small driving IC and an amplification IC such as an amplifier can be used. Further, since the board space can be used effectively, the optical cable module can be miniaturized. Furthermore, it is possible to reduce the attenuation of the electrical signal as occurs conventionally.

  The optical cable module of the present invention is preferably the optical cable module described above, wherein the electronic circuit further includes a parallel-serial conversion IC.

  This makes it possible to optimally design an electronic circuit including an optical element, a driving IC, and a parallel-serial conversion IC, and to arrange the terminals of the parallel-serial conversion IC with high density, thereby realizing a small parallel-serial conversion type optical cable module. can do.

  The optical cable module of the present invention is preferably the above-described optical cable module, wherein the electrical wiring is made of a flexible printed circuit board (FPC).

  Thereby, since an optical element and electrical wiring can be directly mounted on a flexible printed circuit board (FPC), a connection terminal becomes unnecessary and the cost of an optical cable module can be reduced.

  In the optical cable module according to the present invention, it is preferable that the electrical wiring is a coaxial cable.

  Thereby, an optical cable module having high noise resistance can be realized.

  The optical cable module of the present invention is preferably the above-described optical cable module, wherein the electrical connection means is an electrical connector.

  Thereby, since an existing electrical connector can be used, an optical cable module that is excellent in versatility and easy to mount can be realized.

  In the optical cable module of the present invention, in the optical cable module described above, the electrical connection means is preferably an electrical connector having a connection direction different from a longitudinal direction of the electrical wiring.

  As a result, a board-to-board electrical connector can be used, so that the optical cable module can be easily connected to an external device.

  The optical cable module of the present invention is preferably the above optical cable module, wherein the electrical connection means is a thermocompression connector.

  Thereby, the optical cable module can be easily connected to an external device using a method by thermocompression bonding.

  In the optical cable module of the present invention, it is preferable that in the optical cable module described above, the optical element and the end face of the film optical waveguide are built in a cylindrical noise shielding housing.

  Thereby, since electromagnetic noise generated from the optical element can be shielded, deterioration of the optical transmission efficiency of the optical cable module can be prevented.

  The optical cable module of the present invention is the optical cable module described above, wherein at least one film optical waveguide is formed on a single optical transmission medium and is optically coupled to each end face of the film optical waveguide. As described above, the optical elements are preferably provided on the substrate.

  Thereby, since the several film optical waveguide is formed with the single optical transmission medium, the optical cable module with high optical transmission efficiency which reduced the manufacturing cost is realizable.

  The optical cable module of the present invention is the optical cable module described above, wherein the substrate is provided at both ends of the single optical transmission medium, and the optical element on the light emitting side and the light receiving side are provided on each of the substrates. It is preferable that at least one set of the above optical elements is provided.

  Thereby, an optical cable module capable of bidirectional optical transmission can be realized.

  The optical cable module of the present invention is the above-described optical cable module, wherein the optical element on the light emitting side and the optical element on the light receiving side are different from each other in the longitudinal direction of the film optical waveguide on each of the substrates. It is preferable that it is provided.

  Accordingly, in the bidirectional transmission type optical cable module, it is possible to prevent stray light from the light emitting side optical element from reaching and receiving the light receiving side optical element, thereby reducing crosstalk.

  In the optical cable module of the present invention, it is preferable that the electrical wiring is integrated with an electrical cable different from the electrical wiring in the optical cable module described above.

  Thereby, since data transmission of an electric signal and an optical signal can be performed, a small optical cable module integrated with an electric cable can be realized.

  In the optical cable module of the present invention, it is preferable that the integrated electrical wiring is mounted on the substrate in the optical cable module described above.

  Thereby, an optical cable module integrated with electric wiring with a small width can be realized.

  In the optical cable module of the present invention, it is preferable that the integrated electrical wiring is subjected to a light shielding process in the optical cable module described above.

  Thereby, since the light from the outside can be blocked in the electrical wiring, it is possible to prevent the outside light from entering the film optical waveguide. Therefore, it is possible to prevent deterioration of the S / N ratio and crosstalk of data transmission. An optical cable module that is not easily affected by external light can be realized.

  In the optical cable module of the present invention, it is preferable that the integrated electrical wiring is subjected to a noise shielding process in the optical cable module described above.

  As a result, an optical cable module that is less susceptible to external electromagnetic noise can be realized.

  In the optical cable module of the present invention, in the optical cable module described above, in the integrated electrical wiring, the length of the electrical cable portion is shorter than the length of the electrical wiring portion including the film optical waveguide. preferable.

  Thereby, even when a tensile force is applied to the entire cable, a load is not applied to the film optical waveguide, so that it is possible to realize a highly flexible optical cable module using a flexible film optical waveguide having a low tensile resistance.

  The optical cable module of the present invention is the above-described optical cable module, wherein the electrical wiring and the electrical cable are made of a flexible printed circuit board (FPC), and the optical waveguide and the electrical wiring are the electrical cable. It is preferable that it is folded back so as to face.

  Thereby, since electrical wiring can be comprised with a single member, an optical cable module with high productivity is realizable. In addition, since the space of the cable width can be reduced, the optical cable module integrated with the electric cable can be downsized.

  Moreover, the electronic device of the present invention is characterized in that in the electronic device provided with the optical cable module described above, the electrical connection means at both ends of the film optical waveguide are respectively connected to different device substrates inside the electronic device. Yes.

  Thereby, optical data transmission between the apparatus substrates in the electronic apparatus can be performed. In addition, since an optical cable module can be mounted and data can be transmitted, the electronic device can be downsized.

  In the electronic device according to the present invention, in the electronic device described above, it is preferable that the light receiving and emitting element and the end face of the film optical waveguide in the optical cable module are provided in a casing portion of the electronic device. .

  Thereby, since it is not necessary to provide in a housing | casing part the board | substrate for mounting the said light emitting / receiving element and the end surface of the said film optical waveguide, an electronic device can be reduced further.

  In the electronic device according to the present invention, in the electronic device described above, in the folding electronic device including a hinge portion, the optical cable module is preferably provided in the hinge portion.

  As a result, noise that tends to occur at the bent portion can be reduced, so that data transmission between the device boards inside the hinged electronic device can be reliably and efficiently performed. In addition, since the optical cable module is small and flexible, it can be mounted after the hinge is incorporated in the hinged electronic device, so that a highly productive electronic device can be realized.

  In the electronic device according to the present invention, it is preferable that the optical cable module is provided on an IC mounted on the device substrate.

  As a result, since the optical cable module with less noise generation can be provided on the IC, the influence of noise in the electronic device can be reduced.

  As described above, the optical cable module of the present invention is provided with the height compensation member for keeping the distance between the film optical waveguide and the optical element constant, and the height compensation member is the substrate. In the direction parallel to the substrate surface, the region surrounding the electric wiring and the optical element is surrounded.

  As a result, it is possible to reduce the occurrence of defects due to the occurrence of defects during manufacturing and the contact between parts due to vibration / impact during use.

  Moreover, the electronic device of this invention is the structure by which the electrical connection means of the both ends in the said film optical waveguide is each connected to the different apparatus board | substrate inside the said electronic device as mentioned above.

  Thereby, optical data transmission between the apparatus substrates in the electronic apparatus can be performed. In addition, since an optical cable module can be mounted and data can be transmitted, the electronic device can be downsized.

(Embodiment 1)
An embodiment of the present invention will be described below with reference to the drawings.

  Fig.1 (a) is a top view which shows schematic structure of the optical cable module 1 in this embodiment, FIG.1 (b) is the side view. In addition, this Embodiment shows the structure used as the premise of the optical cable module 1 which concerns on this invention shown in Embodiment 2 mentioned later, and its manufacturing method.

  The optical cable module 1 includes a film optical waveguide 2, a light emitting / receiving element (optical element) 3, a height compensation member 4, an electrical wiring 5, an electrical connection part (electrical connection means) 6, and a substrate 7. Yes.

  The film optical waveguide 2 is formed by a core part 2a having a high refractive index and a clad part 2b having a low refractive index provided in contact with the periphery of the core part 2a, and an optical signal incident on the core part 2a is transmitted to the core part 2a. It propagates while repeating total reflection at the boundary between 2a and the clad part 2b. Since the core part 2a and the clad part 2b are made of a polymer material having flexibility, the film optical waveguide 2 has flexibility. Both end surfaces of the film light guide 2 have a 45 ° inclined surface, and the optical signal is reflected on the inclined surface. Note that the angle of the end face of the film optical waveguide 2 is not limited to 45 degrees, and it is sufficient that the incident optical signal can be reflected into the film optical waveguide 2 and can be changed as appropriate.

  The light emitting / receiving element 3 converts an electrical signal into an optical signal and an optical signal into an electrical signal. The light emitting / receiving element 3 is a surface light receiving / emitting element, and transmits and receives an optical signal from a surface opposite to the mounting surface mounted on the substrate 7. The light emitting side optical element and the light receiving side optical element are referred to as a light emitting element 3a and a light receiving element 3b, respectively.

  The height compensation member 4 is a holding member for mounting the film optical waveguide 2 and maintaining a constant distance between the film optical waveguide 2 and the light receiving and emitting element 3. The height of the height compensation member 4 is set in advance so that the optical coupling efficiency between the film optical waveguide 2 and the light emitting / receiving element 3 is optimized.

  The electrical wiring 5 connects the light emitting / receiving element 3 and an electronic circuit 8 such as a driving circuit described later to transmit an electrical signal. Specifically, a flexible printed circuit board (FPC), a coaxial cable, a lead frame, etc. are mentioned, for example.

  The electrical connection portion 6 is for electrically connecting the light emitting / receiving element 3 and the electronic circuit 8 via the electrical wiring 5. Specifically, an electrical connector, a thermocompression connector, etc. are mentioned, for example.

  The substrate 7 is for mounting the film optical waveguide 2, the light emitting / receiving element 3, the height compensating member 4, the electric wiring 5, and the electric connecting portion 6 described above.

  Here, the manufacturing method of the optical cable module 1 is demonstrated below using FIG. 2 and FIG. In FIG. 2, the axis parallel to the longitudinal direction of the film optical waveguide 2 is the Y axis, the axis orthogonal to the Y axis is the X axis, the coordinate plane is the XY plane, and the rotation direction in the XY plane is φ, X The axis orthogonal to the −Y plane is taken as the Z axis.

  First, the light emitting / receiving element 3, the electric wiring 5, and the electric connecting portion 6 are mounted in advance on the upper surface of the substrate 7 fixed by a jig or the like by a method such as soldering (FIG. 3A). Next, an adhesive is applied to the surface on which the height compensation member 4 is mounted on the upper surface of the substrate 7 and the surface on which the film optical waveguide 2 is mounted in the height compensation member 4 (FIG. 3B). Various commercially available adhesives can be used.

  Next, the film optical waveguide 2 and the height compensation member 4 are handled using an air chuck or the like (FIG. 3C), and an image recognition device (not shown) installed above the substrate 7 (Z-axis direction). The position of the film optical waveguide 2 and the light emitting / receiving element 3 is adjusted (FIG. 2B).

  The position adjustment may be performed only for the X axis, the Y axis, and the rotation direction φ in the XY plane. That is, the position adjustment of the distance D from the light receiving / emitting element 3 to the film optical waveguide 2 shown in FIG. 2A is not necessary because it is preset by the height compensating member 4. In addition, since the cross-sectional shape of the film optical waveguide 2 in the present embodiment is rectangular, the adjustment of the position in the rotational direction in the position adjustment does not need to consider the rotation angle around the central axis of the film optical waveguide 2, When the cross-sectional shape is a circle or an ellipse, the adjustment of the rotation angle is also included.

  Then, as shown in FIG. 2B, the image of the image recognition device is such that the substrate 7, the height compensation member 4, and the film optical waveguide are positioned where the inclined end surface of the film optical waveguide 2 and the light emitting / receiving element 3 coincide. 2 is executed (FIG. 3D).

  Thereby, in the state which kept the distance D between the film optical waveguide 2 and the light receiving and emitting element 3 optimally, both can be optically coupled easily. Further, since the film optical waveguide 2 and the height compensating member 4 can be simultaneously bonded to the substrate 7, the manufacturing time can be shortened as compared with the conventional case.

  Thus, it is preferable to use the passive alignment method for the position adjustment. Thereby, since it is not necessary to operate the light emitting / receiving element 3, productivity can be further improved.

  In the present embodiment, the substrate 7, the height compensation member 4 and the film optical waveguide 2 are bonded with an adhesive, but the present invention is not limited to this. For example, an adhesive sheet, heat fusion In addition, a structure in which bonding is performed by UV fusion or the like may be used.

  Further, the substrate 7 and the height compensation member 4 may be coupled by solder. In this case, it is preferable that the adhesion surface in each of the board | substrate 7 and the height compensation member 4 is comprised by the metal pad which consists of Al, Au, etc.

  Here, as shown in FIG. 4, the height compensation member 4 may be formed integrally with the substrate 7. Moreover, as shown in FIG. 5, the structure by which the height compensation member 4 is integrally formed with the film optical waveguide 2 may be sufficient. Thereby, since the height compensation member 4 becomes unnecessary, the number of manufacturing steps can be reduced and the manufacturing cost can be reduced.

  Also, as shown in FIGS. 6A to 6D, the optical cable module 1 is manufactured by simultaneously bonding both end faces of the film optical waveguide 2 and optically coupling the light receiving and emitting element 3. Also good. Thereby, manufacturing time can be further shortened. In this case, since the film optical waveguide 2 has flexibility, it is also possible to handle both ends with one air chuck and simultaneously adjust both ends with an image recognition device to perform an adhesion process.

  In the present embodiment, the end face of the film light guide 2 is processed into an inclined surface of 45 degrees and is aligned with the light emitting / receiving element from above the substrate 7, but the present invention is not limited to this. For example, the end surface of the film optical waveguide 2 may be processed at 90 degrees and directly bonded to the substrate 7. In this case, the light emitting / receiving element 3 is preferably configured to receive and transmit optical signals in the end face direction of the film optical waveguide 2, that is, in the X-axis direction.

(Embodiment 2)
Another embodiment of the present invention will be described below with reference to the drawings. In the present embodiment, members having the same functions as those in the first embodiment are given the same member numbers. In addition, the optical cable module 1 in the present embodiment can be basically manufactured by a technique according to the manufacturing method shown in the first embodiment.

  Fig.7 (a) is side sectional drawing which shows schematic structure of the optical cable module 1 in this embodiment, FIG.7 (b) is the top view. As shown in FIG. 1, the optical cable module 1 includes a film optical waveguide 2, a light emitting / receiving element 3, a height compensation member 4, an electrical wiring 5, and a substrate 7. In addition, although the electrical connection part 6 is not described in this drawing, the electrical connection part 6 is actually provided in the optical cable module 1.

  In the present embodiment, as shown in FIG. 7B, the height compensation member 4 is provided on the substrate 7 so as to surround the area where the light emitting / receiving element 3 and the electrical wiring 5 are provided. . The term “periphery” as used herein refers to a periphery in a direction parallel to the substrate surface of the substrate 7 (surface in the extending direction of the substrate 7) as seen from the region where the light emitting / receiving element 3 and the electric wiring 5 are provided. Show.

  In the example shown in the figure, the height compensation member 4 is provided with a predetermined width and a predetermined height in a portion corresponding to a rectangular side when the substrate surface of the substrate 7 is viewed from the vertical direction. The predetermined width corresponds to the width in the direction parallel to the surface of the substrate 7, and the predetermined height corresponds to the height from the upper surface of the substrate 7. The light emitting / receiving element 3 and the electric wiring 5 are provided on the substrate 7 surrounded by the height compensation member 4.

  The light emitting / receiving element 3 and the electrical wiring 5 are electrically connected by a wire 3p formed by wire bonding. Note that the number of wires 3p may be one or plural.

  As described above, since the light emitting / receiving element 3 and the electric wiring 5 are enclosed on the substrate 7 by the height compensation member 4, the contact of external members with respect to the light emitting / receiving element 3 and the electric wiring 5 is suppressed. It becomes possible to do. In particular, when the wire 3p receives a force from the outside, the wire 3p is easily bent or disconnected, so that the effect of the above structure is great.

  Note that the height of the height compensation member 4 from the surface of the substrate 7 may vary depending on the location. For example, the height of the height compensation member 4 where the film optical waveguide 2 is placed may be different from the height of other portions. In particular, when the height of the height compensation member 4 other than the portion on which the film optical waveguide 2 is placed is made higher than the height of the upper surface of the film optical waveguide 2, the contact of external members with the film optical waveguide 2 is suppressed. It becomes possible to do. Further, when the height of the height compensation member 4 other than the portion on which the film optical waveguide 2 is placed is set higher than the height of the light receiving / emitting element 3 and the wire 3p from the surface of the substrate 7 is higher, It is possible to suppress contact of external members with respect to the light emitting / receiving element 3 and the wire 3p.

  Further, the height compensation member 4 may be constituted by a plurality of members. For example, the member of the part in which the film optical waveguide 2 is mounted and the member of the other part may be comprised by another member. Further, when the height compensation member 4 is constituted by a plurality of members, there may be a gap between the members.

  Further, as shown in FIG. 8, a sealing material 7 d may be provided in a space surrounded by the height compensation member 4 and the substrate 7. In the example shown in the figure, the sealing material 7 d is provided so as to fill the space surrounded by the height compensation member 4 and the substrate 7. Thereby, the light emitting / receiving element 3 and the electric wiring 5 are completely covered with the sealing material 7d.

  According to such a configuration, the light emitting / receiving element 3 and the electrical wiring 5 do not come into contact with external air, so that the deterioration over time due to oxidation, corrosion, etc., and the prevention of malfunction due to adhesion of dust, etc. Can be realized. In addition, since it is possible to completely prevent contact of external members with respect to the light emitting / receiving element 3 and the electric wiring 5, defects due to the occurrence of defects during manufacture and inter-component contact due to vibration and impact during use, etc. Generation can be reduced.

  Further, since the sealing material 7d is injected into the space surrounded by the height compensation member 4 and the substrate 7, the sealing material 7d does not flow out to an unnecessary area at the time of manufacture. It becomes possible to accurately inject a necessary and sufficient amount of the sealing material 7d into a necessary portion.

  In the configuration shown in FIG. 8, the wire 3p is exposed from the sealing material 7d to the outside, but may be wired inside the sealing material 7d. In this case, it is possible to prevent aging of the wire 3p and damage due to external force.

  In the configuration shown in FIG. 8, the light emitting / receiving element 3 and the electric wiring 5 are completely covered with the sealing material 7d, but only one of the light receiving / emitting element 3 and the electric wiring 5 is covered with the sealing material 7d. A covered configuration may also be used.

  Moreover, as shown in FIG. 9, it is good also as a structure which provided the cover member 21 on the upper surface of the height compensation member 4. As shown in FIG. In the example shown in the figure, the height of the upper surface of the height compensation member 4 with respect to the surface of the substrate 7 is uniform, and the lid member 21 is provided so as to be in contact with the entire upper surface of the height compensation member 4. . Thereby, the space enclosed by the board | substrate 7, the height compensation member 4, and the cover member 21 is sealed. The upper surface of the height compensation member 4 indicates a surface that is not a surface in contact with the substrate 7 out of two surfaces parallel to the surface of the substrate 7 in the height compensation member 4.

  Here, in the height compensation member 4, a portion on which the film optical waveguide 2 is placed is also provided on the upper side of the film optical waveguide 2 in order to make the height of the upper surface of the height compensation member 4 uniform. It will be. As a method for manufacturing such a configuration, for example, there is the following method. As a first method, there is a method in which a hole in which the film optical waveguide 2 is placed is provided in the height compensation member 4, and the film optical waveguide 2 is inserted and placed in this hole. As a second method, the height compensation member 4 is constituted by two members, the first member is set to a height such that the film optical waveguide 2 is placed on the upper surface, and the first member is placed on the surface of the substrate 7. And a method of disposing a second member on the upper portion of the film optical waveguide 2 after the film optical waveguide 2 is placed on the upper surface.

  According to such a configuration, the light emitting / receiving element 3 and the electrical wiring 5 are disposed in a sealed space, so that it is possible to suppress deterioration over time due to oxidation, corrosion, etc., and to prevent occurrence of problems due to adhesion of dust, etc. Can be realized. In addition, since it is possible to completely prevent contact of external members with respect to the light emitting / receiving element 3 and the electric wiring 5, defects due to the occurrence of defects during manufacture and inter-component contact due to vibration and impact during use, etc. Generation can be reduced.

  In the configuration shown in FIG. 9, the lid member 21 completely covers the space surrounded by the height compensation member 4, but it may be configured to cover at least a part thereof. In this case, although the effect by arrange | positioning the light emitting / receiving element 3 and the electrical wiring 5 in sealed space is lost, the effect of reducing the contact of the external member with respect to the light emitting element 3 and the electrical wiring 5 can be anticipated.

  In addition, in the configuration shown in FIG. 9, a sealing material 7 d may be provided in a space surrounded by the height compensation member 4 and the substrate 7 as in the configuration shown in FIG. 8. According to this structure, the sealing effect of the light emitting / receiving element 3 and the electric wiring 5 can be made more reliable.

  Next, variations in the shape of the height compensation member 4 in the portion where the film optical waveguide 2 is placed will be described. In addition, the variation shown below is applicable to any structure shown in FIG. 7, FIG. 8, and FIG. FIG. 10A is a side sectional view showing a schematic configuration of the optical cable module 1 as an example of the variation of the shape of the height compensation member 4, and FIG. 10B is a plan view thereof.

  In the configuration example shown in the figure, the light of the film optical waveguide 2 is formed on the lower surface of the portion where the film optical waveguide 2 protrudes from the upper surface of the height compensation member 4 toward the light emitting / receiving element 3 (hereinafter referred to as the protruding portion). A region in the vicinity of one of the two side surfaces parallel to the transmission direction is supported by the height compensation member 4. In other words, the shape of the wall surface on the side of the light receiving / emitting element 3 in the height compensation member 4 is L-shaped, and has a structure in which the lower surface of the protruding portion of the film optical waveguide 2 is supported by two sides.

  According to this configuration, since one side of the protruding portion of the film optical waveguide 2 with respect to the protruding direction is supported by the height compensation member 4, it is possible to suppress bending of the protruding portion due to gravity, impact, vibration, or the like. it can. Thereby, the reliability of the optical coupling between the film optical waveguide 2 and the light receiving and emitting element 3 can be improved.

  FIG. 11A is a side sectional view showing a schematic configuration of the optical cable module 1 as another example of the variation of the shape of the height compensation member 4, and FIG. 11B is a plan view thereof.

  In the configuration example shown in the figure, a region near two side surfaces parallel to the light transmission direction of the film optical waveguide 2 is supported by the height compensation member 4 on the lower side surface of the protruding portion of the film optical waveguide 2. It has become. In other words, the shape of the wall surface of the height compensation member 4 on the side of the light emitting / receiving element 3 is a U-shape, and the bottom surface of the protruding portion of the film optical waveguide 2 is supported by three sides.

  According to this configuration, both lateral sides of the protruding portion of the film optical waveguide 2 with respect to the protruding direction are supported by the height compensation member 4, thereby further suppressing the bending of the protruding portion due to gravity, impact, vibration, or the like. Can do. Thereby, the reliability of the optical coupling between the film optical waveguide 2 and the light receiving and emitting element 3 can be improved.

  In the configuration shown in FIGS. 10 (a) and 10 (b), one lateral side of the protruding portion is supported by the height compensation member 4, so that it is shown in FIGS. 11 (a) and 11 (b). Compared to the configuration, the support structure is weak, but it is advantageous in terms of ease of attachment of the light emitting / receiving element 3.

  12A is a plan view showing a schematic configuration of the optical cable module 1 as another example of the variation of the shape of the height compensation member 4, and FIG. 12B is a cross-sectional view taken along line A- in FIG. It is sectional drawing in A line.

  In the configuration example shown in the figure, the portion of the height compensation member 4 on which the film optical waveguide 2 is placed has a concave shape. More specifically, the height compensation member 4 includes a lower surface contact surface that contacts the lower surface of the film optical waveguide 2 and a surface perpendicular to the lower surface contact surface, and two side surfaces of the film optical waveguide 2 with respect to the optical transmission direction. Are provided with two side-facing surfaces that face each other. There may be a slight gap between the side facing surface and the film optical waveguide 2, or it may be in contact with the side surface of the film optical waveguide 2.

  According to this configuration, since the side surface of the film optical waveguide 2 is guided by the two side surface opposing surfaces, the film optical waveguide 2 when the film optical waveguide 2 is placed on the height compensation member 4 is arranged. Rotational direction position accuracy and X-direction position accuracy can be ensured. That is, it is possible to loosen the placement position accuracy of the film optical waveguide 2 in the manufacturing process of the optical cable module 1.

  Next, variations in the arrangement positions of the light emitting / receiving elements 3 will be described with reference to FIG. In the configuration shown in the figure, the substrate 7 is provided with a through hole 7 h penetrating from the upper surface to the lower surface of the substrate 7 in a region surrounded by the height compensation member 4. The light emitting / receiving element 3 is provided on the lower surface of the substrate 7, that is, on the surface side of the substrate 7 opposite to the side on which the film optical waveguide 2 is provided. And the optical coupling between the end surface of the film optical waveguide 2 and the light receiving and emitting element 3 is performed through the through hole 7h.

  The light emitting / receiving element 3 is attached to the substrate 7 by a connecting member 3r. The connection member 3r also functions as an electrical signal terminal in the light emitting / receiving element 3, and the electrical wiring 5 provided on the upper surface of the substrate 7 and the connection member 3r are electrically connected.

  According to this configuration, since the light receiving / emitting element 3 is provided on one surface of the substrate 7 and the electric wiring 5 is provided on the other surface, the light receiving / emitting element 3 and the electric wiring 5 on the surface of the substrate 7 are formed. The area of the region can be further reduced. That is, the area saving of the optical cable module 1 can be realized.

  Next, an example of attachment of the electrical connection portion 6 will be described. FIG. 14A is a side sectional view showing a schematic configuration of the optical cable module 1 in which the electrical connecting portion 6 is provided on the outer side surface of the height compensating member 4, and FIG. 14B is a plan view thereof. In the configuration shown in the figure, the outer side surface of the height compensation member 4, that is, the surface on the opposite side to the surface surrounding the light emitting / receiving element 3 and the electric wiring 5 among the surfaces perpendicular to the surface of the substrate 7. Are provided with a plurality of electrical connection portions 6. More specifically, among the four outer side surfaces of the height compensation member 4, a plurality of electrical connection portions 6 are provided on three outer side surfaces other than the surface on which the film optical waveguide 2 is placed. .

  Each electrical connection portion 6 is electrically connected to the electrical wiring 5 via a wiring (not shown). Note that it is not necessary for all the electrical connection portions 6 to be electrically connected to the electrical wiring 5, and it is sufficient that at least one electrical connection portion 6 is electrically connected to the electrical wiring 5 as necessary.

  According to this configuration, it is possible to detachably connect to an external wiring board provided with the electrical connection portion so as to face the electrical connection portions 6 provided on the outer side surface of the height compensation member 4. Can be possible. FIG. 15A is a side sectional view showing a schematic configuration of the optical cable module 1 in which the electrical connection portion 6 is provided on the outer side surface of the height compensation member 4, and FIG. 15B is a diagram in FIG. A sectional view taken along line AA and a sectional view of an external wiring board 31 detachably connected to the optical cable module 1 are shown.

  A connection holding member 32 having a side surface perpendicular to the surface is provided on the surface of the external wiring board 31. The connection holding member 32 is shaped to surround the outer side surface of the height compensation member 4 of the optical cable module 1 in a state where it is connected to the optical cable module 1. And the electrical connection part 33 ... is provided in the surface which faces the outer side surface of the height compensation member 4 in the state connected with the optical cable module 1 among the side surfaces of the connection holding member 32. Each electrical connection portion 33 is provided at a position corresponding to each electrical connection portion 6 in a state of being connected to the optical cable module 1.

  According to such a configuration, the external wiring board 31 and the optical cable module 1 are both electrically connected by bringing them closer to each other in the direction in which the board surfaces face each other, and both are moved away from each other in the opposite direction. Can be disconnected. Here, for example, the electrical connection portion 6 has a structure having elasticity, and the electrical connection portion 6 is in a state of pushing the electrical connection portion 33 by elasticity in a state where the external wiring board 31 and the optical cable module 1 are connected. Then, the connection state between the two can be maintained by this elastic pressing force. Thereby, it becomes possible to attach and detach the external wiring board 31 and the optical cable module 1 very easily.

  In the optical cable module 1, the height compensation member 4 has an electrical connection portion 6 installation function and an external wiring board in addition to the height compensation function and the protection function of the light emitting / receiving element 3 and the electrical wiring 5 as described above. It is possible to provide a connection function. Therefore, for example, the outer shape of the optical cable module 1 can be made smaller as compared with the case where the function of installing the electrical connection unit 6 and the function of connecting to an external wiring board are configured by a member different from the height compensation member 4. It becomes.

  In the configuration shown in FIGS. 15A and 15B, in the optical cable module 1, the size of the substrate 7 is the same as the shape of the outer side surface of the height compensation member 4. That is, the wiring on the substrate 7 is provided only in the region surrounded by the height compensation member 4. According to this configuration, the optical cable module 1 can be configured more compactly.

  Next, another example of attachment of the electrical connecting portion 6 will be described. FIG. 16 is a plan view showing a schematic configuration of the optical cable module 1 in which the electrical connection portion 6 is provided on the inner side surface of the height compensation member 4. In the configuration shown in the drawing, a plurality of electrical connection portions are provided on the inner side surface of the height compensation member 4, that is, the surface surrounding the light receiving / emitting element 3 and the electrical wiring 5 among the surfaces perpendicular to the surface of the substrate 7. 6 ... are provided. More specifically, among the four inner side surfaces of the height compensation member 4, a plurality of electrical connection portions 6 are provided on three inner side surfaces other than the surface on which the film optical waveguide 2 is placed. .

  Each electrical connection portion 6 is electrically connected to the electrical wiring 5 via a wiring (not shown). Note that it is not necessary for all the electrical connection portions 6 to be electrically connected to the electrical wiring 5, and it is sufficient that at least one electrical connection portion 6 is electrically connected to the electrical wiring 5 as necessary.

  According to this configuration, it is possible to detachably connect to an external wiring board provided with the electrical connection portion so as to face the electrical connection portions 6 provided on the inner side surface of the height compensation member 4. Can be possible. In this case, in the external wiring board 31 shown in FIG. 15B, the connection holding member 32 faces the inner side surface of the height compensation member 4 of the optical cable module 1 in a state where it is connected to the optical cable module 1. Shape. And the electrical connection part 33 ... is provided in the surface facing the inner side surface of the height compensation member 4 in the state connected with the optical cable module 1 among the side surfaces of the connection holding member 32. Each electrical connection portion 33 is provided at a position corresponding to each electrical connection portion 6 in a state of being connected to the optical cable module 1. According to such a configuration, the same effects as the configurations shown in FIGS. 15A and 15B can be obtained.

  Next, still another example of attachment of the electrical connecting portion 6 will be described. FIG. 17A is a plan view showing a schematic configuration of the optical cable module 1 in which the electrical connection portion 6 is provided in a shape protruding in a direction parallel to the surface of the substrate 7, and FIG. FIG. In the configuration shown in the figure, an electrical connection portion 6 having a shape protruding from a side surface perpendicular to the substrate surface of the substrate 7 in a direction parallel to the substrate surface is provided. More specifically, of the four side surfaces of the substrate 7, four electrical connection portions 6 are provided on the side surface facing the side surface on which the film optical waveguide 2 is placed.

  Each electrical connection portion 6 is electrically connected to the electrical wiring 5 via a wiring (not shown). Note that it is not necessary for all the electrical connection portions 6 to be electrically connected to the electrical wiring 5, and it is sufficient that at least one electrical connection portion 6 is electrically connected to the electrical wiring 5 as necessary.

  According to this configuration, it is possible to detachably connect to the external wiring substrate 31 provided with the electrical connection portion 33 so as to sandwich the electrical connection portion 6 protruding in a direction parallel to the substrate surface. be able to. As shown in FIG. 17B, a connection holding member 32 is provided on the surface of the external wiring board 31. The connection holding member 32 is provided with a recess having a shape for receiving the insertion of the electrical connection portion 6 from a direction parallel to the substrate surface, and electrical connection portions 33 are provided on the upper and lower surfaces of the recess. Each electrical connection portion 33 is provided at a position corresponding to each electrical connection portion 6 in a state where it is connected to the optical cable module 1 so as to be conductive.

  According to such a configuration, the external wiring board 31 and the optical cable module 1 are both electrically connected by bringing them both close to each other in a direction parallel to the board surface, and both are moved away from each other in the opposite direction. Can be disconnected. Here, for example, the electrical connection portion 31 has a structure having elasticity, and the electrical connection portion 31 is in a state in which the electrical connection portion 6 is elastically pressed in a state where the external wiring board 31 and the optical cable module 1 are connected. Then, the connection state between the two can be maintained by this elastic pressing force. Thereby, it becomes possible to attach and detach the external wiring board 31 and the optical cable module 1 very easily.

  17A and 17B, in the optical cable module 1, the size of the substrate 7 is the same as the shape of the outer side surface of the height compensation member 4. That is, the wiring on the substrate 7 is provided only in the region surrounded by the height compensation member 4. According to this configuration, the optical cable module 1 can be configured more compactly.

  Next, a specific example of the optical cable module 1 that realizes inter-substrate wiring will be described. 18A is a side sectional view showing a schematic configuration of the optical cable module 1 in which the substrates are connected by the substrate 7 and the film optical waveguide 2, and FIG. 18B is a plan view thereof. In the configuration shown in the figure, one film optical waveguide 2 is provided on one substrate 7, and light receiving and emitting elements 3 and electrical wirings are respectively provided corresponding to two ends of the film optical waveguide 2. 5 and a height compensating member 4 provided so as to surround them.

  FIG. 19 is a side sectional view showing a state where two external wiring boards 31A and 31B are connected to each other by the optical cable module 1. FIG. The optical cable module 1 is the same as the optical cable module 1 shown in FIGS. 18 (a) and 18 (b). As shown in FIGS. 14 (a) and 14 (b), the height compensation member is used. Electrical connection portions 6 are provided on the outer side surface of 4. Further, as shown in FIG. 15B, the external wiring boards 31A and 31B include connection holding members 32A and 32B and electrical connection portions 33A and 33B, respectively. By connecting these external wiring boards 31A and 31B to the optical cable module 1, it is possible to signal-connect the external wiring board 31A and the wiring board 31B by optical transmission.

  In the configuration shown in FIG. 18, two units each including the height compensation member 4, the light emitting / receiving element 3, and the electric wiring 5 are provided on one substrate 7, but FIG. 20A and FIG. As shown in 20 (b), the units may be provided on different substrates 7. In this configuration, the film optical waveguide 2 is the only member that connects the external wiring board 31A and the wiring board 31B. Therefore, for example, even when the wiring board 31A and the wiring board 31B are not on the same plane, the flexibility of the film optical waveguide 2 can be used to increase the degree of freedom of the path connecting the two.

  In the configuration shown in FIG. 18, it is possible to increase the degree of freedom of the connection path between the wiring substrate 31A and the wiring substrate 31B by configuring the substrate 7 with a flexible substrate. However, in the case where the substrate 7 and the film optical waveguide 2 are provided between the two wiring substrates 31A and 31B, the substrate 7 and the film optical waveguide 2 physically interfere with each other so that the path is free. It is conceivable that the degree of freedom is limited, but when the connection is made only with the film optical waveguide 2, since there is no such interference, the degree of freedom of the path can be further increased.

  20 (a) and 20 (b), the cover member 21 may be provided on the surface opposite to the substrate 7 side of the height compensation member 4 as shown in FIG. . FIG. 21 shows a configuration when the lid member 21 is provided in the optical cable module 1. In the case of this configuration, the effect obtained by providing the lid member 21 is obtained.

  In the example shown in FIG. 21, the lid member 21 and the film optical waveguide 2 are provided between the two wiring boards 31A and 31B. However, the lid member 21 is formed of a flexible member. Thus, it is possible to increase the degree of freedom of the connection path between the wiring board 31A and the wiring board 31B. Moreover, it is good also as a structure which provided the cover member 21 respectively independent with respect to the unit provided with the height compensation member 4, the light emitting / receiving element 3, and the electrical wiring 5. FIG.

  Further, as shown in FIGS. 17A and 17B, the electrical connection portion 6 may be provided in a shape protruding in a direction parallel to the surface of the substrate 7. This configuration is shown in FIGS. 22 (a) and 22 (b). According to such a configuration, the external wiring boards 31A and 31B and the optical cable module 1 are electrically connected to each other by moving them in a direction parallel to the board surfaces, and away from each other in the opposite direction. It is possible to cancel the connection between the two.

  Next, a configuration in which a plurality of film optical waveguides 2 are provided in the optical cable module 1 will be described. FIG. 23A is a side sectional view showing a schematic configuration of the optical cable module 1 provided with two film optical waveguides 2X and 2Y, and FIG. 23B is a plan view thereof.

  In this configuration, light receiving and emitting elements 3X and 3Y are provided corresponding to the two film optical waveguides 2X and 2Y, respectively. Here, for example, assuming that the light emitting / receiving element 3X is a light emitting element and the light receiving / emitting element 3Y is a light receiving element, the optimum distance to the end surface of the film optical waveguide 2 in the case of the light emitting element and the film in the case of the light receiving element It is conceivable that the optimum distance to the end face of the optical waveguide 2 is different. In order to cope with this, the height of the height compensation member 4X that determines the height of the film optical waveguide 2X is made different from the height of the height compensation member 4Y that determines the height of the film optical waveguide 2Y.

  According to this configuration, even when the plurality of light receiving / emitting elements 3 are of different types and the optimal distance to the end face of the film optical waveguide 2 is different, the film optical waveguides have the optimal distances for the respective light receiving / emitting elements 3. 2 can be arranged. Therefore, it is possible to realize stable optical coupling in any set of the film light guide 2 and the light emitting / receiving element 3.

  In the configurations shown in FIGS. 23A and 23B, the positions of the end portions of the film optical waveguide 2 in the optical transmission direction are different between the film optical waveguide 2X and the film optical waveguide 2Y. Thereby, since the freedom degree of arrangement | positioning of the light emitting / receiving element 3X and the light receiving / emitting element 3Y can be improved, it becomes possible to implement | achieve a more efficient board | substrate wiring structure in relation to wiring.

  In FIG. 23A and FIG. 23B, the electric wiring 5 and other portions of the height compensation member 4 are not shown, but can be applied to various configuration examples of the optical cable module 1 described above. .

  In the above configuration, the heights of the two film optical waveguides 2X and 2Y to the respective substrates 7 are different from each other, but the heights of both may be the same. FIG. 24A is a side sectional view showing a schematic configuration of the optical cable module 1 in which two film optical waveguides 2X and 2Y are provided with the same height, and FIG. 24B is a plan view thereof. In this case, the two film optical waveguides 2X and 2Y are arranged at the same height, and the positions of the end portions of the film optical waveguide 2 in the light transmission direction may be different between the film optical waveguide 2X and the film optical waveguide 2Y. it can.

  Further, the film optical waveguide 2 may include two cores, and the light receiving / emitting element 3X and the light receiving / emitting element 3Y may be provided corresponding to light incident / exiting by the respective cores. FIG. 25A is a side sectional view showing a schematic configuration of the optical cable module 1 provided with the film optical waveguide 2 having two cores, and FIG. 25B is a plan view thereof.

  Next, a configuration for connecting the electrical wiring 5 and the external wiring through the height compensation member 4 will be described. FIG. 26 shows a configuration in which one or more through holes 4A... Are provided in the height compensation member 4 and an electrical connection portion 6 including a through pin is provided inside the through hole 4A. The through hole 4 </ b> A is provided with openings on the lower surface of the height compensation member 4 that is in contact with the substrate 7 and the upper surface that faces the lower surface.

  The electric wiring 5 on the substrate 7 is provided with a pin hole 5A for receiving a through pin. When the pin hole 5A is electrically connected to the through pin, the electric wiring 5 and the electric connecting portion 6 are electrically connected. . The electrical wiring 5 and the through pin may be connected not only by inserting the through pin into the pin hole 5A but also by bonding with solder, fusion by local heating using a laser, connection with a conductive adhesive, or the like. good. Moreover, the penetration pin can be connected to an external wiring (not shown) by protruding from the upper surface of the through hole 4A.

  Note that it is not necessary to provide a through pin in all of the through holes 4A, and it is sufficient to provide a through pin only at a location where conduction is required. Further, the through pin may be provided only for the purpose of fixing the height compensation member 4 and the substrate 7 without being used for conduction. Further, as shown in FIG. 27, after the through pins are installed in the pin holes 5A on the substrate 7, the height compensating member 4 is mounted on the substrate 7 so that each through pin passes through each through hole 4A. You may manufacture so that it may fix on top.

  As shown in FIG. 28, conduction between the through pin and the electric wiring 5 may be performed by bending the through pin on the substrate 7 and providing a metal pad 5B that conducts with the bent portion. It is assumed that the metal pad 5B is electrically connected to the electric wiring 5. In FIG. 28, the penetrating pin is bent to the outside of the space surrounded by the height compensation member 4, but it may be bent to the inside.

  In addition, as shown in FIG. 29, a portion protruding from the upper surface of the through hole 4 </ b> A in the through pin may be configured to be connected to the external wiring by bending outside the space surrounded by the height compensation member 4. The penetrating pin may be bent into the space enclosed by the height compensation member 4.

  Next, a specific example of the connection structure with the external wiring board 31 when using the through pin will be described. 30A is an exploded cross-sectional view showing a cross section of the surface perpendicular to the optical transmission direction of the film optical waveguide 2 in the optical cable module 1, and FIG. 30B is an optical cable module 1 and an external wiring board 31. It is a perspective view which shows a connection state with.

  In the configuration shown in the figure, the outer side surface of the height compensation member 4, that is, the surface on the opposite side to the surface surrounding the light emitting / receiving element 3 and the electric wiring 5 among the surfaces perpendicular to the surface of the substrate 7. Are provided with a plurality of electrical connection portions 6. More specifically, among the four outer side surfaces of the height compensation member 4, a plurality of electrical connection portions 6 are provided on three outer side surfaces other than the surface on which the film optical waveguide 2 is placed. .

  Each electrical connection portion 6 is electrically connected to the electrical wiring 5 by a through pin and a pin hole 5A. Further, the upper part of the penetrating pin (the part protruding from the upper surface of the height compensation member 4) is bent outside the space surrounded by the height compensation member 4, and elastic deformation is caused on the outer side surface of the height compensation member 4. Arranged in an acceptable shape. Note that it is not necessary for all the electrical connection portions 6 to be electrically connected to the electrical wiring 5, and it is sufficient that at least one electrical connection portion 6 is electrically connected to the electrical wiring 5 as necessary.

  A connection holding member 32 having a side surface perpendicular to the surface is provided on the surface of the external wiring board 31. The connection holding member 32 is shaped to surround the outer side surface of the height compensation member 4 of the optical cable module 1 in a state where it is connected to the optical cable module 1. And the electrical connection part 33 ... is provided in the surface which faces the outer side surface of the height compensation member 4 in the state connected with the optical cable module 1 among the side surfaces of the connection holding member 32. Each electrical connection portion 33 is provided at a position corresponding to each electrical connection portion 6 in a state of being connected to the optical cable module 1.

  According to such a configuration, the external wiring board 31 and the optical cable module 1 are both electrically connected by bringing them closer to each other in the direction in which the board surfaces face each other, and both are moved away from each other in the opposite direction. Can be disconnected. In addition, the electrical connection portion 6 has an elastic structure so that the electrical connection portion 6 is in a state where the electrical connection portion 33 is elastically pressed in a state where the external wiring board 31 and the optical cable module 1 are connected. Therefore, the connection state between the two can be maintained by the pressing force due to this elasticity. Thereby, it becomes possible to attach and detach the external wiring board 31 and the optical cable module 1 very easily.

  Moreover, it is good also as a structure detachably connected with the external wiring board in which the electrical connection part was provided so that the electrical connection part 6 ... provided in the inner side surface of the height compensation member 4 might be opposed. FIG. 31A is an exploded cross-sectional view showing a cross section of a plane perpendicular to the optical transmission direction of the film optical waveguide 2 in the optical cable module 1 having this configuration, and FIG. 3 is a perspective view showing a connection state with a wiring board 31. FIG.

  In the configuration shown in the drawing, a plurality of electrical connection portions are provided on the inner side surface of the height compensation member 4, that is, the surface surrounding the light receiving / emitting element 3 and the electrical wiring 5 among the surfaces perpendicular to the surface of the substrate 7. 6 ... are provided. More specifically, among the four inner side surfaces of the height compensation member 4, a plurality of electrical connection portions 6 are provided on three inner side surfaces other than the surface on which the film optical waveguide 2 is placed. .

  Each electrical connection portion 6 is electrically connected to the electrical wiring 5 via a wiring (not shown). Note that it is not necessary for all the electrical connection portions 6 to be electrically connected to the electrical wiring 5, and it is sufficient that at least one electrical connection portion 6 is electrically connected to the electrical wiring 5 as necessary.

  In the case of this configuration, in the external wiring board 31, the connection holding member 32 is shaped to face the inner side surface of the height compensation member 4 of the optical cable module 1 in a state where it is connected to the optical cable module 1. And the electrical connection part 33 ... is provided in the surface facing the inner side surface of the height compensation member 4 in the state connected with the optical cable module 1 among the side surfaces of the connection holding member 32. Each electrical connection portion 33 is provided at a position corresponding to each electrical connection portion 6 in a state of being connected to the optical cable module 1. According to such a configuration, the same effect as the configuration shown in FIGS. 30A and 30B can be obtained.

  In the configuration shown in FIGS. 30A and 30B, the electrical connection portion 6 side in the optical cable module 1 has a structure that allows elastic deformation. However, the electrical connection portion 33 in the external wiring board 31 is used. The side may have a structure that allows elastic deformation. FIG. 32A is an exploded cross-sectional view showing a cross section of a plane perpendicular to the optical transmission direction of the film optical waveguide 2 in the optical cable module 1 having this configuration, and FIG. 3 is a perspective view showing a connection state with a wiring board 31. FIG.

  In addition, the electrical connection portion 6 may be electrically connected not only to the electrical connection portion 33 in the external wiring substrate 31 but also to another second external wiring substrate 41. FIG. 33 (a) is an exploded cross-sectional view showing a cross section of a plane perpendicular to the optical transmission direction of the film optical waveguide 2 in the optical cable module 1 having this configuration, and FIG. 33 (b) shows the optical cable module 1 and an external wiring board. It is a perspective view which shows a connection state with 31. FIG. As shown in these drawings, the electrical connection portion 6 is provided with a length extending from the outer side surface of the height compensation member 4 to the lower side surface of the substrate 7, and is bent outward at the position of the lower side surface of the substrate 7. ing. This bent portion is electrically connected to the second external wiring board 41. According to such a configuration, the optical cable module 1 can be connected to an external wiring board on the two surfaces of the upper surface side and the lower surface side, respectively.

  Next, the configuration of the optical cable module 1 in which the height compensation member 4 and the substrate 7 are detachable will be described. FIG. 34 is an exploded perspective view showing a schematic configuration of the optical cable module 1 in this configuration. As shown in the figure, an electrical connection portion 6 made of a metal pad is provided on the outer side surface and the upper surface of the height compensation member 4.

  On the surface of the substrate 7, a connection holding member 7B having a side surface perpendicular to the surface is provided. The connection holding member 7 </ b> B is shaped to surround the outer side surface of the height compensation member 4 in a state where it is connected to the height compensation member 4. And electrical connection part 7A ... is provided in the surface facing the outer side surface of the height compensation member 4 among the side surfaces of the connection holding member 7B. Each electrical connection portion 7A is provided at a position corresponding to each electrical connection portion 6 in a state where it is connected to the height compensation member 4. In addition, each electrical connection portion 7A is electrically connected to the electrical wiring 5, whereby the electrical connection portion 6 and the electrical wiring 5 are electrically connected.

  According to such a configuration, the substrate 7 and the height compensation member 4 are electrically connected by bringing the substrate 7 and the height compensation member 4 close to each other in a direction in which the substrate surfaces face each other, and both of them are moved away in the opposite direction. The connection can be released. In addition, since the electrical connection portion 7A has a structure having elasticity, the electrical connection portion 7A is in a state where the electrical connection portion 6 is elastically pushed in a state where the substrate 7 and the height compensation member 4 are connected. The connection state between the two can be maintained by the pushing force by the elasticity. Thereby, it becomes possible to attach and detach the substrate 7 and the height compensation member 4 very easily.

  In addition, since it is possible to connect to the wiring provided on the external wiring board by the electrical connecting portion 6 provided on the upper surface of the height compensation member 4, the optical cable that can be connected to the external wiring board. The module 1 can be provided. In the above example, the electrical connection portion 6 that is connected to the wiring provided on the external wiring board is provided along the upper surface of the height compensation member 4. The shape may protrude upward from the side surface.

  In the above configuration, the height compensation member 4 and the substrate 7 are detachable. However, when the height compensation member 4 and the substrate 7 are fixed, the configuration as shown in FIG. Also good. In the example shown in the figure, electrical connection portions 6 made of metal pads are provided on the outer side surface, upper surface, and lower surface of the height compensation member 4. Further, on the surface of the substrate 7, an electrical connection portion 7 </ b> A as an electrical pad provided at a position corresponding to the metal pad on the lower surface of the height compensation member 4 is provided. In addition, each electrical connection portion 7A is electrically connected to the electrical wiring 5, whereby the electrical connection portion 6 and the electrical wiring 5 are electrically connected. When the metal pad on the lower surface of the height compensation member 4 and the electrical connection portion 7A are connected to each other by soldering or the like, electrical connection between them is performed.

  Next, another configuration for connecting the electrical wiring 5 and the external wiring via the height compensation member 4 will be described. FIG. 36A is a cross-sectional view showing a cross section of a plane perpendicular to the optical transmission direction of the film optical waveguide 2 in the optical cable module 1 as still another example of the connection structure with the external wiring board 31. FIG. 36B is a perspective view showing a connection state between the optical cable module 1 and the external wiring board 31. In the example shown in the figure, the electrical connection portion 6 is provided on the outer side surface of the height compensation member 4, and the electrical wiring 5 on the substrate 7 penetrates the substrate 7 and is connected to the electrical connection portion 6. Yes. According to such a configuration, the connection between the optical cable module 1 and the external wiring board 31 can be realized in the same manner as the configuration shown in FIGS. 30 (a) and 30 (b).

  The optical cable module 1 shown in the above-described second embodiment can be basically manufactured by the manufacturing method described in the first embodiment with reference to FIG. In the second embodiment, the height compensation member 4 is provided on the substrate 7 so as to surround the area where the light emitting / receiving element 3 and the electrical wiring 5 are provided. A recess for providing the light emitting / receiving element 3 may be formed. That is, the periphery of the region where the light emitting / receiving element 3 and the electrical wiring 5 are provided may be surrounded by the side surface of the recess (a surface perpendicular to the surface of the substrate 7).

(Application examples)
The optical cable module 1 of the present embodiment can be applied to the following application examples, for example.

  First, as a first application example, it is used for a hinge part in a foldable electronic device such as a foldable mobile phone, a foldable PHS (Personal Handyphone System), a foldable PDA (Personal Digital Assistant), and a foldable notebook personal computer. it can.

  FIGS. 37A to 37C show an example in which the optical cable module 1 is applied to a foldable mobile phone 40. That is, FIG. 37A is a perspective view showing the appearance of a foldable mobile phone 40 incorporating the optical cable module 1.

  FIG. 37B is a block diagram of a portion to which the optical cable module 1 is applied in the foldable mobile phone 40 shown in FIG. As shown in this figure, the control unit 41 provided on the main body 40a side in the foldable mobile phone 40, and the lid (drive unit) 40b provided on one end of the main body so as to be rotatable about a hinge part. An external memory 42, a camera unit (digital camera) 43, and a display unit (liquid crystal display display) 44 are connected by the optical cable module 1.

  FIG. 37 (c) is a perspective plan view of the hinge portion (portion surrounded by a broken line) in FIG. 37 (a). As shown in this figure, the optical cable module 1 is wound around a holding rod in the hinge portion and bent, thereby controlling the control portion provided on the main body side, the external memory 42 provided on the lid side, the camera portion 43, A display unit 44 is connected to each other.

  By applying the optical cable module 1 to these foldable electronic devices, high-speed and large-capacity communication can be realized in a limited space. Therefore, it is particularly suitable for devices that require high-speed and large-capacity data communication, such as a foldable liquid crystal display device, and are required to be downsized.

  As a second application example, the optical cable module 1 can be applied to an apparatus having a drive unit such as a printer head in a printing apparatus (electronic device) or a reading unit in a hard disk recording / reproducing apparatus.

  FIG. 38A to FIG. 38C show an example in which the optical cable module 1 is applied to the printing apparatus 50. FIG. 38A is a perspective view showing the appearance of the printing apparatus 50. As shown in this figure, the printing apparatus 50 includes a printer head 51 that performs printing on the paper 52 while moving in the width direction of the paper 52, and one end of the optical cable module 1 is connected to the printer head 51. ing.

  FIG. 38B is a block diagram of a portion of the printing apparatus 50 to which the optical cable module 1 is applied. As shown in this figure, one end of the optical cable module 1 is connected to the printer head 51, and the other end is connected to the main body side substrate in the printing apparatus 50. The main body side substrate is provided with control means for controlling the operation of each unit of the printing apparatus 50.

  FIG. 38C and FIG. 38D are perspective views showing the curved state of the optical cable module 1 when the printer head 51 is moved (driven) in the printing apparatus 50. As shown in this figure, when the optical cable module 1 is applied to a drive unit such as the printer head 51, the bending state of the optical cable module 1 is changed by driving the printer head 51, and each position of the optical cable module 1 is repeatedly bent. Is done.

  Therefore, the optical cable module 1 according to the present embodiment is suitable for these driving units. Further, by applying the optical cable module 1 to these drive units, high-speed and large-capacity communication using the drive units can be realized.

  FIG. 39 shows an example in which the optical cable module 1 is applied to a hard disk recording / reproducing device 60.

  As shown in this figure, the hard disk recording / reproducing apparatus 60 includes a disk (hard disk) 61, a head (reading / writing head) 62, a substrate introducing part 63, a driving part (driving motor) 64, and the optical cable module 1. .

  The drive unit 64 drives the head 62 along the radial direction of the disk 61. The head 62 reads information recorded on the disk 61 and writes information on the disk 61. The head 62 is connected to the substrate introduction unit 63 via the optical cable module 1, and propagates information read from the disk 61 to the substrate introduction unit 63 as an optical signal, and is propagated from the substrate introduction unit 63. The optical signal of information to be written on the disk 61 is received.

  Thus, by applying the optical cable module 1 to a drive unit such as the head 62 in the hard disk recording / reproducing apparatus 60, high-speed and large-capacity communication can be realized.

(Summary)
As described above, the optical cable module according to the present invention includes a substrate on which a surface-emitting / emitting optical element and an electrical wiring connected to the optical element are mounted, and an electrical connection means provided at an end of the electrical wiring; An optical cable module manufactured by an optical cable module manufacturing method comprising a film optical waveguide having at least one end face processed obliquely, wherein the optical cable module manufacturing method transmits or receives an optical signal as a light emitting / receiving surface. A step of providing the optical element on the substrate facing away from the substrate, a position of the end face of the film optical waveguide with respect to the light receiving / emitting surface of the optical element in a direction parallel to the light emitting / receiving surface of the optical element, and A step of arranging the film optical waveguide so as to face the optical element so that the Y-direction position and the rotational direction position coincide with each other; and the film Providing a height compensation member for maintaining a constant distance between the waveguide and the optical element outside the projection region of the optical element on the substrate between the film optical waveguide and the substrate; And the periphery of the region where the electrical wiring and the optical element are provided is surrounded by the height compensation member in a direction parallel to the substrate surface of the substrate or surrounded by a side surface of the recess. It is possible to adopt a configuration that is

  According to the above configuration, the height compensation member is provided outside the projection region of the optical element on the substrate on the surface of the substrate on which the optical element is mounted, and the film optical waveguide is provided on the height compensation member. The film optical waveguide and the optical element are optically coupled with the distance between the two being kept constant.

  As a result, the distance between the two can always be kept constant by the height compensation member provided between the film optical waveguide and the optical element, so there is no need to adjust the distance between the two. Further, since a member for fixing the film optical waveguide and connecting it to the substrate is not necessary, the distance between the film optical waveguide and the optical element can be set optimally. Therefore, the film optical waveguide and the optical element can be easily optically coupled by simple alignment without degrading the optical coupling efficiency.

  Specifically, when the plane parallel to the light receiving / emitting surface of the optical element is an XY plane, the film optical waveguide is arranged in the X-axis direction, the Y-axis direction, and the optical element so that the end face of the film optical waveguide faces each other. By adjusting in the rotation direction, the optical element and the film optical waveguide can be optically coupled.

  Further, since the optical coupling can be performed by the simple alignment described above, it is not necessary to fix the end face of the film optical waveguide with a rigid member in advance as in the prior art. Therefore, the number of manufacturing steps can be reduced, and the productivity of the optical cable module can be improved.

  The optical cable module of the present invention includes a substrate on which a surface-receiving / emitting optical element and an electric wiring connected to the optical element are mounted, an electric connecting means provided at an end of the electric wiring, and at least one end face An optical cable module manufactured by an optical cable module manufacturing method including a film optical waveguide processed obliquely, wherein the optical cable module manufacturing method includes the film light guide on a surface of the substrate on which the film optical waveguide is mounted. A step of forming a recess for providing the optical element so as to keep the distance between the waveguide and the optical element constant, and a light receiving / emitting surface for transmitting or receiving an optical signal toward the entrance side of the recess. A step of disposing the optical element in the recess; and receiving and receiving the optical element at an end face of the film optical waveguide with respect to the light receiving and emitting surface of the optical element. Mounting the film optical waveguide on the substrate so that the X-direction position, the Y-direction position, and the rotational direction position in a plane parallel to the optical surface coincide with each other, and the electrical wiring and the optical element are provided. The surrounding area may be surrounded by the height compensation member or surrounded by the side surface of the recess in a direction parallel to the substrate surface of the substrate.

  The optical cable module of the present invention is the optical cable module described above, wherein the height compensation member is provided on the substrate, and the film optical waveguide is disposed on the height compensation member so as to face the optical element. Are preferably performed simultaneously.

  According to said structure, since a coupling | bonding with a board | substrate, a height compensation member, and a film optical waveguide is performed simultaneously, a manufacturing man-hour can further be reduced. Therefore, an optical cable module with higher productivity can be obtained.

  In the optical cable module of the present invention, it is preferable that the height compensation member and the substrate are integrally formed in the optical cable module described above.

  According to said structure, since the height compensation member and the board | substrate are integrally formed, the member for keeping constant the distance between an optical element and a film optical waveguide becomes unnecessary. Therefore, the man-hours for manufacturing the optical cable module can be further reduced, and the cost can be reduced.

  In the optical cable module of the present invention, in the optical cable module described above, it is preferable that the height compensation member and the film optical waveguide are integrally formed.

  According to said structure, since the height compensation member and the film optical waveguide are integrally formed, the member for keeping constant the distance between an optical element and a film optical waveguide becomes unnecessary. Therefore, it is possible to reduce the number of manufacturing steps for the optical cable module and reduce the cost.

  The optical cable module of the present invention is the optical cable module described above, wherein the method of manufacturing the optical cable module obliquely processes both end faces of the film optical waveguide, and the end portions of the film optical waveguide, And a step of simultaneously providing the height compensation member or the substrate respectively.

  According to said structure, since the optical coupling | bonding of the both end surfaces of a film optical waveguide is performed simultaneously, manufacturing time can be shortened compared with the case where it couple | bonds with each end surface.

  The optical cable module of the present invention is the above-described optical cable module, wherein the optical cable module manufacturing method includes the step of handling the film optical waveguide, and the film optical waveguide by passive alignment without operating the light emitting / receiving element. It is preferable to include a step of adjusting the position of the waveguide and a step of providing the film optical waveguide on the height compensation member or the substrate.

  Thereby, since it is not necessary to operate a light receiving / emitting element at the time of manufacture of an optical cable module, productivity can further be improved.

  Moreover, the optical cable module of the present invention is such that the angle between the incident direction of the optical signal transmitted from the optical element and the reflection direction at the end face of the film optical waveguide is an obtuse angle in the optical cable module described above. Preferably, either the surface of the substrate on which the optical element is mounted or the surface of the height compensation member on which the film optical waveguide is mounted is formed obliquely.

  According to said structure, either the surface in which the optical element in a board | substrate is mounted, or the surface in which the film optical waveguide in a height compensation member is mounted is transmitted from the optical element in the end surface of a film optical waveguide. It is formed obliquely so that the angle between the incident direction of the optical signal and the reflecting direction becomes an obtuse angle.

  Thereby, since the total reflection conditions for optically coupling the optical element and the film optical waveguide at the end face of the film optical waveguide are relaxed, the optical coupling efficiency can be improved.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims. That is, embodiments obtained by combining technical means appropriately changed within the scope of the claims are also included in the technical scope of the present invention.

  Since optical transmission using a flexible optical cable is possible, it can be used as a data transmission cable between substrates in an electronic device such as a folding cellular phone.

FIG. 1A is a plan view showing a schematic configuration of an optical cable module in the present embodiment, and FIG. 1B is a side view showing a schematic configuration of the optical cable module. FIG. 2A is a diagram showing the distance between the film optical waveguide and the light emitting / receiving element in the optical cable module, and FIG. 2B shows the position adjustment between the film optical waveguide and the light receiving / emitting element. FIG. It is a side view which shows the manufacturing process of the said optical cable module. In the said optical cable module, it is a side view which shows the structure by which the height compensation member is integrally formed with the board | substrate. In the said optical cable module, it is a side view which shows the structure by which the height compensation member is integrally formed with the film optical waveguide. In the said optical cable module, it is a side view which shows the manufacturing process in the case of adhering the both end surfaces of a film optical waveguide simultaneously. (A) is side sectional drawing which shows schematic structure of the optical cable module in this embodiment, (b) is the top view. It is side surface sectional drawing which shows the structure which provided the sealing material in the space enclosed with the height compensation member and the board | substrate. It is side surface sectional drawing which shows the structure which provided the cover member on the upper surface of a height compensation member. (A) is side surface sectional drawing which shows schematic structure of the optical cable module as an example of the variation of the shape of a height compensation member, (b) is the top view. (A) is side surface sectional drawing which shows schematic structure of the optical cable module as another example of the variation of the shape of a height compensation member, (b) is the top view. (A) is a top view which shows schematic structure of the optical cable module as another example of the variation of the shape of a height compensation member, (b) is sectional drawing in the AA in (a). . It is side surface sectional drawing which shows schematic structure of the optical cable module by which the through-hole which penetrates a lower surface from the upper surface of this board | substrate is provided in the board | substrate in the area | region enclosed by a height compensation member. (A) is side sectional drawing which shows schematic structure of the optical cable module which provided the electrical-connection part in the outer side surface of the height compensation member, (b) is the top view. (A) is side sectional drawing which shows schematic structure of the optical cable module which provided the electrical connection part in the outer side surface of the height compensation member, (b) is sectional drawing in the AA in (a), and It is sectional drawing of the external wiring board connected detachably to this optical cable module. It is a top view which shows schematic structure of the optical cable module which provided the electrical connection part in the inner side surface of the height compensation member. (A) is a top view which shows schematic structure of the optical cable module with which the electrical connection part was provided in the shape protruded in the direction parallel to the surface of a board | substrate, (b) is the side sectional drawing. (A) is side surface sectional drawing which shows schematic structure of the optical cable module which connects between board | substrates by a board | substrate and a film optical waveguide, (b) is the top view. It is side surface sectional drawing which shows the state which connected between two board | substrates by the optical cable module between two external wiring boards. (A) is a top view which shows schematic structure of the optical cable module which each provided two units provided with a height compensation member, a light emitting / receiving element, and an electrical wiring on another board | substrate, (b) is the side surface cross section FIG. It is side surface sectional drawing which shows schematic structure of the optical cable module which provided the cover member in the optical cable module. (A) is a top view which shows schematic structure of the optical cable module provided in the shape where the electrical connection part protruded in the direction parallel to the surface of a board | substrate, (b) is the side sectional drawing. (A) is side surface sectional drawing which shows schematic structure of the optical cable module provided with two film optical waveguides, (b) is the top view. (A) is side surface sectional drawing which shows schematic structure of the optical cable module in which two film optical waveguides were provided in equal height, (b) is the top view. (A) is side surface sectional drawing which shows schematic structure of the optical cable module provided with the film optical waveguide provided with two cores, (b) is the top view. It is a perspective view which shows schematic structure of the optical cable module which provided the through-hole in the height compensation member, and provided the electrical-connection part which consists of a penetration pin in this through-hole. It is a perspective view which shows schematic structure of the optical cable module which provided the through-hole in the height compensation member, and provided the electrical-connection part which consists of a penetration pin in this through-hole. It is a perspective view showing a schematic configuration of an optical cable module that conducts conduction between a penetration pin and an electric wiring by bending a penetration pin on a substrate and providing a metal pad that conducts with the bent portion. It is a perspective view which shows schematic structure of the optical cable module connected with an external wiring by bending the part protruded from the upper surface of the through-hole in a penetration pin to the exterior of the space enclosed by the height compensation member. (A) is an exploded sectional view showing a section of a plane perpendicular to the optical transmission direction of a film optical waveguide in an optical cable module as an example of a connection structure with an external wiring board in the case of using a through pin; FIG. 7B is a perspective view showing a connection state between the optical cable module and an external wiring board. (A) is an exploded sectional view showing a section of a plane perpendicular to the optical transmission direction of a film optical waveguide in an optical cable module as another example of a connection structure with an external wiring board when a through pin is used. (B) is a perspective view which shows the connection state of an optical cable module and an external wiring board. (A) is an exploded sectional view showing a section of a plane perpendicular to the optical transmission direction of a film optical waveguide in an optical cable module as still another example of a connection structure with an external wiring board when a through pin is used. FIG. 6B is a perspective view showing a connection state between the optical cable module and an external wiring board. (A) is an exploded sectional view showing a section of a plane perpendicular to the optical transmission direction of a film optical waveguide in an optical cable module as still another example of a connection structure with an external wiring board when a through pin is used. FIG. 6B is a perspective view showing a connection state between the optical cable module and an external wiring board. It is a disassembled perspective view which shows schematic structure of the optical cable module which makes a height compensation member and a board | substrate removable. It is a disassembled perspective view which shows schematic structure of the optical cable module which fixes and connects a height compensation member and a board | substrate. (A) is sectional drawing which shows the cross section of a surface perpendicular | vertical to the optical transmission direction of a film optical waveguide in the optical cable module as another example of a connection structure with an external wiring board, (b) is an optical cable. It is a perspective view which shows the connection state of a module and an external wiring board. (A) is a perspective view which shows the external appearance of the foldable mobile phone provided with the optical waveguide according to the present embodiment, and (b) is an application of the optical waveguide in the foldable mobile phone shown in (a). FIG. 4C is a perspective plan view of a hinge portion in the foldable mobile phone shown in FIG. (A) is a perspective view which shows the external appearance of the printing apparatus provided with the optical waveguide which concerns on this embodiment, (b) is a block diagram which shows the principal part of the printing apparatus shown to (a), (c) and (d) are perspective views showing the curved state of the optical waveguide when the printer head is moved (driven) in the printing apparatus. It is a perspective view which shows the external appearance of the hard-disk recording / reproducing apparatus provided with the optical waveguide which concerns on this embodiment. (A) is a top view which shows the state of the position adjustment of the film optical waveguide in the conventional optical cable module, (b) is a side view which shows this state. It is a perspective view which shows the manufacturing process of the conventional film optical waveguide board | substrate. (A) and (b) are the side views which show the manufacturing process of the optical cable module of the structure which developed the said conventional optical cable module. (A) (b) is a side view which shows the manufacturing process of the optical cable module of the other structure which developed the said conventional optical cable module. (A) (b) is a side view which shows the manufacturing process of the optical cable module of the other structure which developed the said conventional optical cable module. (A) is a perspective view of a conventional optical waveguide module, (b) is a side sectional view thereof, and (c) is a perspective view of a conventional optical waveguide module packaged in an airtight manner.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical cable module 2 Film optical waveguide 3 Light receiving / emitting element (optical element)
3a Light-emitting element (light-emitting optical element)
3b Light receiving element (light receiving type optical element)
4 Height compensation member 5 Electrical wiring 5a Flexible printed circuit board (FPC)
5b Coaxial cable 6 Electrical connection (electrical connection means)
6a Electrical connector 6b Upper insertion type electrical connector 6c Thermocompression connector 7, 7a, 7b Substrate 7c Recess 7d Sealant 8 Electronic circuit 8a Drive IC
8b Amplifier (amplification IC)
8c Parallel serial conversion IC
9 Package 10 Noise shielding housing 11 Electric cable 12 External equipment (electronic equipment)
12a Equipment board

Claims (16)

In an optical cable module comprising a substrate on which a surface-emitting / emitting optical element and an electric wiring connected to the optical element are mounted, and a film optical waveguide in which at least one end face is processed obliquely,
A height compensation member is provided for maintaining a constant distance between the film optical waveguide and the optical element,
The optical cable module, wherein the height compensation member surrounds a region where the electrical wiring and the optical element are provided in a direction parallel to the substrate surface of the substrate.   2. The optical cable module according to claim 1, wherein a surface on which the film optical waveguide is mounted in the height compensation member is formed so as to sandwich both side surfaces of the film optical waveguide.   The optical cable module according to claim 1, wherein the electrical wiring and the optical element are fixed with a sealant.   The optical cable module according to claim 1, wherein the electrical wiring, the optical element, and the film optical waveguide are package-fixed.   The optical cable module according to claim 1, wherein a sealing material is provided in a region surrounded by the height compensation member so as to cover the electrical wiring and the optical element.   The optical cable module according to claim 1, further comprising a lid member that seals a space surrounded by the height compensation member and the substrate.   Two side surfaces parallel to the light transmission direction of the film optical waveguide in at least one surface of the film optical waveguide protruding from the surface in contact with the height compensation member or the surface in contact with the substrate to the optical element side The optical cable module according to claim 1, wherein a region in the vicinity of at least one of the side surfaces is supported by the height compensation member or the substrate.   The height compensation member or the substrate has a lower surface contact surface that contacts the lower surface of the film optical waveguide, and a surface perpendicular to the lower surface contact surface, on two side surfaces with respect to the optical transmission direction of the film optical waveguide. The optical cable module according to claim 1, wherein two side-facing surfaces that face each other are provided. In the substrate, a through hole penetrating from the upper surface to the lower surface of the substrate is provided in a region surrounded by the height compensation member,
The optical element is provided on the side of the substrate opposite to the side on which the film optical waveguide is provided, and optical coupling between the end face of the film optical waveguide and the optical element is performed through the through hole. The optical cable module according to claim 1.   An electrical connection means electrically connected to the electrical wiring and electrically connected to an external wiring is further provided, and the electrical connection means is provided on the height compensation member. Item 5. The optical cable module according to Item 1. A plurality of the film optical waveguides are provided, and a plurality of the optical elements are provided corresponding to the film optical waveguides,
The height compensation member or the substrate is configured such that a distance between a predetermined film optical waveguide and the corresponding optical element differs from a distance between another film optical waveguide and the corresponding optical element. The optical cable module according to claim 1, wherein the optical cable module has a unique shape.   The optical element on the light emitting side optically coupled to one end face of the film optical waveguide and the optical element on the light receiving side optically coupled to the other end face of the film optical waveguide are provided on the substrate, respectively. The optical cable module according to claim 1, wherein the optical cable module is provided. In an electronic device provided with the optical cable module of any one of Claims 1-12,
An electronic apparatus, wherein electrical connection means at both ends of the film optical waveguide are respectively connected to different apparatus substrates in the electronic apparatus.   The electronic device according to claim 13, wherein the light receiving and emitting element and the end face of the film optical waveguide in the optical cable module are provided in a housing portion of the electronic device. In a foldable electronic device having a hinge part,
15. The electronic apparatus according to claim 13, wherein the optical cable module is provided in the hinge portion.   The electronic device according to claim 13, wherein the optical cable module is provided on an IC mounted on the device substrate.

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