TWI482700B - Manufacture method of lens sheet - Google Patents
Manufacture method of lens sheet Download PDFInfo
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- TWI482700B TWI482700B TW100136981A TW100136981A TWI482700B TW I482700 B TWI482700 B TW I482700B TW 100136981 A TW100136981 A TW 100136981A TW 100136981 A TW100136981 A TW 100136981A TW I482700 B TWI482700 B TW I482700B
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Description
本發明是有關於一種光學元件的製作方法，且特別是有關於一種鏡頭片(lens sheet)的製作方法。The present invention relates to a method of fabricating an optical component, and more particularly to a method of fabricating a lens sheet.
隨著光電技術的進步，影像感測器的尺寸越作越小，其中影像感測器例如為電荷耦合元件(charge coupled device,CCD)或互補式金氧半導體感測元件(complementary metal oxide semiconductor sensor,CMOS sensor)。如此一來，用以成像於影像感測器的鏡頭亦越作越小。除此之外，由於照像與攝影功能在現今已通常整合於各種電子裝置中，例如整合於行動電話、筆記型電腦、平板電腦等可攜式電子裝置中，因此鏡頭亦須盡量地縮小，以符合可攜式電子裝置的小型化要求。With the advancement of optoelectronic technology, the size of the image sensor is getting smaller and smaller, wherein the image sensor is, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor sensor (complementary metal oxide semiconductor sensor). , CMOS sensor). As a result, the lens used to image the image sensor is also getting smaller and smaller. In addition, since the photo and photography functions are now integrated into various electronic devices, for example, in portable electronic devices such as mobile phones, notebook computers, and tablet computers, the lens must be reduced as much as possible. In order to meet the miniaturization requirements of portable electronic devices.
目前行動電話、筆記型電腦及平板電腦的鏡頭已作得相當的小，如此小的鏡頭的尺寸可達到晶片(chip)的尺寸之等級，所以這樣的鏡頭可利用類似於晶圓製程的製程來大量生產。因此，如此小的鏡頭又可稱之為晶圓級光學元件(wafer level optics)。At present, the lenses of mobile phones, notebook computers and tablet computers have been made quite small. The size of such a small lens can reach the size of a chip, so such a lens can be processed by a process similar to a wafer process. Mass production. Therefore, such a small lens can be called a wafer level optics.
當製作晶圓級光學元件時，通常是在一透光圓片上塗佈一膠材，接著利用膜具使膠材成型而形成多個透鏡。之後，再對膠材及透光圓片進行烘烤，以使膠材固化。然而，在對膠材進行烘烤時，由於膠材與透光圓片的熱膨帳係數不同，因此在烘烤完後膠材與透光圓片會產生翹曲。當透光圓片的相對兩面都要利用膠材來形成透鏡時，烘烤後之圓片的翹曲情形狀更加嚴重。此外，當烘烤完其中一面膠材而形成透鏡時，由於透光圓片已經翹曲，將使之後在透光圓片的另一面形成透鏡時，會有對位上的困難，亦即使透光圓片的相對兩面之透鏡難以對位。When fabricating wafer-level optical components, a glue is usually applied to a light-transmissive wafer, and then the film is molded to form a plurality of lenses. After that, the rubber material and the light-transmissive wafer are baked to cure the rubber material. However, when the rubber material is baked, since the thermal expansion coefficient of the rubber material and the light-transmitting disk is different, the rubber material and the light-transmitting disk may be warped after baking. When the opposite sides of the light-transmissive wafer are to be formed by using a rubber material, the shape of the warp of the wafer after baking is more serious. In addition, when the lens is formed by baking one of the rubber materials, since the light-transmitting disk has been warped, the lens will be formed on the other side of the light-transmissive wafer, and even if it is difficult to face, The lenses on opposite sides of the wafer are difficult to align.
本發明提供一種鏡頭片的製作方法，其可有效降低鏡頭片的翹曲程度。The invention provides a method for manufacturing a lens sheet, which can effectively reduce the degree of warpage of the lens sheet.
本發明之一實施例提出一種鏡頭片的製作方法，包括下列步驟。提供一透光基板，其中透光基板具有相對之一第一表面及一第二表面。將一第一支撐基板貼附於透光基板的第二表面上。在透光基板的第一表面上形成一第一透鏡膜。在將第一支撐基板貼附於透光基板的第二表面上之後，對第一透鏡膜加熱。將第一支撐基板從透光基板的第二表面上移除。One embodiment of the present invention provides a method of fabricating a lens sheet, including the following steps. A light transmissive substrate is provided, wherein the light transmissive substrate has a first surface and a second surface. A first support substrate is attached to the second surface of the light transmissive substrate. A first lens film is formed on the first surface of the light transmissive substrate. After attaching the first support substrate to the second surface of the light-transmitting substrate, the first lens film is heated. The first support substrate is removed from the second surface of the light transmissive substrate.
在本發明之實施例之鏡頭片的製作方法中，由於在對第一透鏡膜加熱之前先將第一支撐基板貼附於透光基板上，因此第一透鏡膜在加熱過程中所產生的應力可被第一支撐基板吸收，亦即藉由第一支撐基板的支撐可有效降低第一透鏡膜與透光基板受到熱應力時所產生的形變。如此一來，本發明之實施例之鏡頭片的製作方法便可製作出翹曲程度較小或無翹曲之鏡頭片。In the method of fabricating a lens sheet according to an embodiment of the present invention, since the first support substrate is attached to the light-transmitting substrate before the first lens film is heated, the stress generated by the first lens film during the heating process It can be absorbed by the first supporting substrate, that is, the deformation of the first lens film and the transparent substrate when subjected to thermal stress can be effectively reduced by the support of the first supporting substrate. In this way, the lens sheet of the embodiment of the present invention can be used to produce a lens sheet having a small degree of warpage or no warpage.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1D為繪示本發明之一實施例之鏡頭片的製作方法的流程之剖面示意圖。請參照圖1A至圖1D，本實施例之鏡頭片的製作方法包括下列步驟。首先，請參照圖1A，提供一透光基板110，其中透光基板110具有相對之一第一表面112及一第二表面114。在本實施例中，透光基板110為玻璃基板，例如為玻璃圓片(glass wafer)。然而，在其他實施例中，透光基板110亦可以是其他材質之透光基板。接著，請參照圖1B，將一第一支撐基板120貼附於透光基板110的第二表面114上。在本實施例中，將第一支撐基板120貼附於透光基板110的第二表面114上的步驟為藉由一第一黏著層130將第一支撐基板120貼附於透光基板110的第二表面114上。此外，在本實施例中，第一黏著層130例如為熱解離黏著層。再者，在本實施例中，第一支撐基板120為一硬質基板，例如為厚度較透光基板110厚或質地較透光基板硬的基板。舉例而言，第一支撐基板120可以是厚玻璃板或其他材質的厚板。1A to 1D are schematic cross-sectional views showing the flow of a method of fabricating a lens sheet according to an embodiment of the present invention. Referring to FIG. 1A to FIG. 1D, the manufacturing method of the lens sheet of this embodiment includes the following steps. First, referring to FIG. 1A, a transparent substrate 110 is provided, wherein the transparent substrate 110 has a first surface 112 and a second surface 114 opposite to each other. In the present embodiment, the light transmissive substrate 110 is a glass substrate, such as a glass wafer. However, in other embodiments, the transparent substrate 110 may also be a transparent substrate of other materials. Next, referring to FIG. 1B , a first support substrate 120 is attached to the second surface 114 of the transparent substrate 110 . In this embodiment, the step of attaching the first supporting substrate 120 to the second surface 114 of the transparent substrate 110 is to attach the first supporting substrate 120 to the transparent substrate 110 by using a first adhesive layer 130. On the second surface 114. Further, in the present embodiment, the first adhesive layer 130 is, for example, a thermal dissociative adhesive layer. Furthermore, in the present embodiment, the first supporting substrate 120 is a rigid substrate, for example, a substrate thicker than the transparent substrate 110 or harder than the transparent substrate. For example, the first support substrate 120 may be a thick glass plate or a thick plate of other materials.
然後，請參照圖1C，在透光基板110的第一表面112上形成一第一透鏡膜140。在本實施例中，形成第一透鏡膜140的步驟包括在透光基板110的第一表面112上塗佈一材料層。然後，利用一模具將此材料層壓印出第一透鏡膜140的形狀。之後，再使此材料層固化成第一透鏡膜140，其中第一透鏡膜140包括複數個透鏡部142及一連接這些透鏡部142的薄膜部144。在本實施例中，此材料層的材質為光固化樹脂，例如為紫外光膠(ultraviolet adhesive,UV adhesive)，而使此材料層固化成第一透鏡膜140的方法為利用光(例如紫外光)照射此材料層，以使此材料層固化成第一透鏡膜140。接著，在將第一支撐基板120貼附於透光基板110的第二表面114上之後，對第一透鏡膜140加熱，以使第一透鏡膜140進一步固化，而形成結構較為穩定的第一透鏡膜140。在本實施例中，對第一透鏡膜140加熱的步驟為烘烤第一透鏡膜140。然而，在其他實施例中，亦可採用其他適當的方式對第一透鏡膜140加熱，以使其進一步固化。在本實施例中，透鏡部142是以凸透鏡為例，然而，在其他實施例中，透鏡部142亦可以是凹透鏡或其他形式的透鏡。Then, referring to FIG. 1C, a first lens film 140 is formed on the first surface 112 of the transparent substrate 110. In the present embodiment, the step of forming the first lens film 140 includes coating a material layer on the first surface 112 of the light transmissive substrate 110. Then, the material is laminated and printed out of the shape of the first lens film 140 by a mold. Thereafter, the material layer is cured into a first lens film 140, wherein the first lens film 140 includes a plurality of lens portions 142 and a film portion 144 connecting the lens portions 142. In this embodiment, the material layer is made of a photocurable resin, such as an ultraviolet adhesive (UV adhesive), and the method of curing the material layer into the first lens film 140 is to utilize light (for example, ultraviolet light). The material layer is irradiated to cure the material layer into the first lens film 140. Next, after the first supporting substrate 120 is attached to the second surface 114 of the transparent substrate 110, the first lens film 140 is heated to further solidify the first lens film 140 to form a first stable structure. Lens film 140. In the present embodiment, the step of heating the first lens film 140 is baking the first lens film 140. However, in other embodiments, the first lens film 140 may be heated in other suitable manners for further curing. In the present embodiment, the lens portion 142 is exemplified by a convex lens. However, in other embodiments, the lens portion 142 may also be a concave lens or other form of lens.
之後，請參照圖1D，將第一支撐基板120從透光基板110的第二表面114上移除。在本實施例中，由於第一黏著層130為熱解離黏著層，因此將第一支撐基板120從透光基板110的第二表面114上移除的步驟包括加熱解離第一黏著層130。在本實施例中，加熱解離第一黏著層130的溫度大於圖1C的步驟中對第一透鏡膜140加熱的溫度。換言之，圖1C的步驟中對第一透鏡膜140加熱的溫度還不至於使第一黏著層130解離，而使第一黏著層130解離的溫度為更高的溫度。然而，在其他實施例中，第一黏著層130亦可以是電磁波解離黏著層，而將第一支撐基板120從透光基板110的第二表面114上移除的步驟可包括以電磁波照射並解離第一黏著層130，例如是以具有某一波長範圍的光照射第一黏著層130，以使第一黏著層130解離。如此一來，即完成本實施例之鏡頭片100，其中鏡頭片100包括透光基板110與第一透鏡膜140。Thereafter, referring to FIG. 1D, the first support substrate 120 is removed from the second surface 114 of the transparent substrate 110. In the embodiment, since the first adhesive layer 130 is a thermal dissociative adhesive layer, the step of removing the first support substrate 120 from the second surface 114 of the transparent substrate 110 includes heating to dissociate the first adhesive layer 130. In the present embodiment, the temperature at which the first adhesive layer 130 is heated and dissociated is greater than the temperature at which the first lens film 140 is heated in the step of FIG. 1C. In other words, the temperature at which the first lens film 140 is heated in the step of FIG. 1C is not so high that the first adhesive layer 130 is dissociated, and the temperature at which the first adhesive layer 130 is dissociated is a higher temperature. However, in other embodiments, the first adhesive layer 130 may also be an electromagnetic wave dissociation adhesive layer, and the step of removing the first support substrate 120 from the second surface 114 of the transparent substrate 110 may include irradiating and dissociating with electromagnetic waves. The first adhesive layer 130, for example, illuminates the first adhesive layer 130 with light having a certain wavelength range to dissociate the first adhesive layer 130. In this way, the lens sheet 100 of the embodiment is completed, wherein the lens sheet 100 includes the light-transmitting substrate 110 and the first lens film 140.
在實施例之鏡頭片100的製作方法中，由於在對第一透鏡膜140加熱之前先將第一支撐基板120貼附於透光基板110上，因此第一透鏡膜140在加熱過程中所產生的應力可被第一支撐基板120吸收，亦即藉由第一支撐基板120的支撐可有效降低第一透鏡膜140與透光基板110受到熱應力時所產生的形變。如此一來，本實施例之鏡頭片100的製作方法便可製作出翹曲程度較小或無翹曲之鏡頭片100。In the manufacturing method of the lens sheet 100 of the embodiment, since the first supporting substrate 120 is attached to the light-transmitting substrate 110 before the first lens film 140 is heated, the first lens film 140 is generated during the heating process. The stress can be absorbed by the first supporting substrate 120, that is, the deformation of the first lens film 140 and the transparent substrate 110 when subjected to thermal stress can be effectively reduced by the support of the first supporting substrate 120. In this way, the lens sheet 100 of the present embodiment can be fabricated into a lens sheet 100 having a small degree of warpage or no warpage.
以上的實施例是敘述在透光基板110的其中一側製作透鏡膜的方法，而以下將敘述在透光基板110的相對兩側皆製作透鏡膜的方法。The above embodiment describes a method of forming a lens film on one side of the light-transmitting substrate 110, and a method of forming a lens film on both opposite sides of the light-transmitting substrate 110 will be described below.
圖2A至圖2F為繪示本發明之另一實施例之鏡頭片的製作方法的部分流程之剖面示意圖。請參照圖2A至圖2F，本實施例之鏡頭片的製作方法的前幾個步驟與圖1A至圖1C的步驟相同，且本實施例之鏡頭片的製作方法除了包括上述圖1A至圖1C的步驟之外，更包括下列步驟。請參照圖2A，在圖1C的步驟之後，在本實施例中可在第一透鏡膜140上形成一保護層150。保護層150的材質例如為矽氧樹脂(silicone)。接著，請參照圖2B，在對第一透鏡膜140加熱之後，將一第二支撐基板160貼附於第一透鏡膜140上。在本實施例中，將第二支撐基板160貼附於第一透鏡膜140上的步驟為將第二支撐基板160貼附於保護層150上。當保護層150形成於第一透鏡膜140上時，可形成一平坦的表面，如此有助於第二支撐基板160的貼附，且可避免第一透鏡膜140的透鏡部142在製程中受到損壞。在本實施例中，第二支撐基板160為一硬質基板，例如為厚度較透光基板110厚或質地較透光基板硬的基板。舉例而言，第二支撐基板160可以是厚玻璃板或其他材質的厚板。2A to 2F are cross-sectional views showing a part of the flow of a method for fabricating a lens sheet according to another embodiment of the present invention. Referring to FIG. 2A to FIG. 2F, the first steps of the method for fabricating the lens sheet of the embodiment are the same as those of FIG. 1A to FIG. 1C, and the method for fabricating the lens sheet of the embodiment includes the above-mentioned FIG. 1A to FIG. 1C. In addition to the steps, the following steps are included. Referring to FIG. 2A, after the step of FIG. 1C, a protective layer 150 may be formed on the first lens film 140 in this embodiment. The material of the protective layer 150 is, for example, silicone. Next, referring to FIG. 2B, after the first lens film 140 is heated, a second support substrate 160 is attached to the first lens film 140. In the embodiment, the step of attaching the second supporting substrate 160 to the first lens film 140 is to attach the second supporting substrate 160 to the protective layer 150. When the protective layer 150 is formed on the first lens film 140, a flat surface can be formed, which facilitates the attachment of the second supporting substrate 160, and the lens portion 142 of the first lens film 140 can be prevented from being subjected to the process. damage. In the embodiment, the second supporting substrate 160 is a hard substrate, for example, a substrate thicker than the transparent substrate 110 or harder than the transparent substrate. For example, the second support substrate 160 may be a thick glass plate or a thick plate of other materials.
將第二支撐基板160貼附於第一透鏡膜140上的步驟可為藉由一第二黏著層180將第二支撐基板160貼附於第一透鏡膜140上。在本實施例中，即藉由第二黏著層180將第二支撐基板160貼附於保護層150上。在本實施例中，第二黏著層180例如為熱解離黏著層。The step of attaching the second supporting substrate 160 to the first lens film 140 may be to attach the second supporting substrate 160 to the first lens film 140 by using a second adhesive layer 180. In the embodiment, the second supporting substrate 160 is attached to the protective layer 150 by the second adhesive layer 180. In the embodiment, the second adhesive layer 180 is, for example, a thermal dissociative adhesive layer.
然後，請參照圖2C，將第一支撐基板120從透光基板110的第二表面114上移除，其中此步驟的細節與圖1D的步驟之細節相同，可參照上述對圖1D的步驟之描述，在此不再重述。Then, referring to FIG. 2C, the first supporting substrate 120 is removed from the second surface 114 of the transparent substrate 110, wherein the details of this step are the same as the steps of the step of FIG. 1D, and the steps of FIG. 1D can be referred to. Description, no longer repeat here.
再來，請參照圖2D，在將第一支撐基板120從透光基板110的第二表面114上移除之後，在透光基板110的第二表面114上形成一第二透鏡膜170。在本實施例中，形成第二透鏡膜170的步驟包括在透光基板110的第二表面114上塗佈一材料層。然後，利用一模具將此材料層壓印出第二透鏡膜170的形狀。之後，再使此材料層固化成第二透鏡膜170，其中第二透鏡膜170包括複數個透鏡部172及一連接這些透鏡部172的薄膜部174。在本實施例中，用以形成第二透鏡膜170的材料層的材質為光固化樹脂，例如為紫外光膠(ultraviolet adhesive,UV adhesive)，而使此材料層固化成第二透鏡膜170的方法為利用光(例如紫外光)照射此材料層，以使此材料層固化成第二透鏡膜170。在本實施例中，第二透鏡膜170的步驟包括使第二透鏡膜170的這些透鏡部172分別與第一透鏡膜140的這些透鏡部142對齊，例如是使這些透鏡部172的光軸分別與這些透鏡部142的光軸對齊。舉例而言，可使形成第二透鏡膜170的模具之對應於透鏡部172的部分與透鏡部142對齊，進而壓出與透鏡部142對齊的透鏡部172。Referring to FIG. 2D, after the first support substrate 120 is removed from the second surface 114 of the transparent substrate 110, a second lens film 170 is formed on the second surface 114 of the transparent substrate 110. In the present embodiment, the step of forming the second lens film 170 includes coating a material layer on the second surface 114 of the light transmissive substrate 110. Then, the material is laminated and printed out of the shape of the second lens film 170 by a mold. Thereafter, the material layer is further cured into a second lens film 170, wherein the second lens film 170 includes a plurality of lens portions 172 and a film portion 174 connecting the lens portions 172. In this embodiment, the material layer of the second lens film 170 is made of a photocurable resin, such as an ultraviolet adhesive (UV adhesive), and the material layer is cured into the second lens film 170. The method is to illuminate the layer of material with light (eg, ultraviolet light) to cure the layer of material into the second lens film 170. In the present embodiment, the step of the second lens film 170 includes aligning the lens portions 172 of the second lens film 170 with the lens portions 142 of the first lens film 140, for example, by respectively making the optical axes of the lens portions 172 It is aligned with the optical axes of these lens portions 142. For example, the portion of the mold forming the second lens film 170 corresponding to the lens portion 172 may be aligned with the lens portion 142, thereby pressing out the lens portion 172 aligned with the lens portion 142.
接著，在將第二支撐基板160貼附於第一透鏡膜140上之後，對第二透鏡膜170加熱，以使第二透鏡膜170進一步固化，而形成結構較為穩定的第二透鏡膜170。在本實施例中，對第二透鏡膜170加熱的步驟為烘烤第二透鏡膜170。然而，在其他實施例中，亦可採用其他適當的方式對第二透鏡膜170加熱，以使其進一步固化。在本實施例中，透鏡部172是以凸透鏡為例，然而，在其他實施例中，透鏡部172亦可以是凹透鏡或其他形式的透鏡。Next, after the second supporting substrate 160 is attached to the first lens film 140, the second lens film 170 is heated to further cure the second lens film 170 to form a second lens film 170 having a relatively stable structure. In the present embodiment, the step of heating the second lens film 170 is baking the second lens film 170. However, in other embodiments, the second lens film 170 may be heated in other suitable manners for further curing. In the present embodiment, the lens portion 172 is exemplified by a convex lens. However, in other embodiments, the lens portion 172 may also be a concave lens or other form of lens.
然後，請參照圖2E，從第一透鏡膜140上移除第二支撐基板160。在本實施例中，從第一透鏡膜140上移除第二支撐基板160的步驟為從保護層150上移除第二支撐基板160。在本實施例中，由於第二黏著層180為熱解離黏著層，因此將第二支撐基板160從第一透鏡膜140上移除的步驟包括加熱解離第二黏著層180。在本實施例中，加熱解離第二黏著層180的溫度大於圖2D的步驟中對第二透鏡膜170加熱的溫度。換言之，圖2D的步驟中對第二透鏡膜170加熱的溫度還不至於使第二黏著層180解離，而使第二黏著層180解離的溫度為更高的溫度。然而，在其他實施例中，第二黏著層180亦可以是電磁波解離黏著層，而將第二支撐基板160從第一透鏡膜140上移除的步驟可包括以電磁波照射並解離第二黏著層180，例如是以具有某一波長範圍的光照射第二黏著層180，以使第二黏著層180解離。Then, referring to FIG. 2E, the second support substrate 160 is removed from the first lens film 140. In the present embodiment, the step of removing the second support substrate 160 from the first lens film 140 is to remove the second support substrate 160 from the protective layer 150. In the present embodiment, since the second adhesive layer 180 is a thermally dissociative adhesive layer, the step of removing the second support substrate 160 from the first lens film 140 includes heating to dissociate the second adhesive layer 180. In the present embodiment, the temperature at which the second adhesive layer 180 is heated and dissociated is greater than the temperature at which the second lens film 170 is heated in the step of FIG. 2D. In other words, the temperature at which the second lens film 170 is heated in the step of FIG. 2D is not so high that the second adhesive layer 180 is dissociated, and the temperature at which the second adhesive layer 180 is dissociated is a higher temperature. However, in other embodiments, the second adhesive layer 180 may also be an electromagnetic wave dissociation adhesive layer, and the step of removing the second support substrate 160 from the first lens film 140 may include irradiating and dissociating the second adhesive layer by electromagnetic waves. 180, for example, illuminating the second adhesive layer 180 with light having a certain wavelength range to dissociate the second adhesive layer 180.
之後，請參照圖2F，從第一透鏡膜140上移除保護層150。如此一來，即完成本實施例之鏡頭片100a。Thereafter, referring to FIG. 2F, the protective layer 150 is removed from the first lens film 140. In this way, the lens sheet 100a of the present embodiment is completed.
在實施例之鏡頭片100a的製作方法中，由於在對第一透鏡膜140加熱之前先將第一支撐基板120貼附於透光基板110上，且在對第二透鏡膜170加熱之前先將第二支撐基板160貼附於第一透鏡膜140上，因此第一透鏡膜140與第二透鏡膜170在加熱過程中所產生的應力可分別被第一支撐基板120與第二支撐基板160吸收，亦即藉由第一支撐基板120與第二支撐基板160的支撐可有效降低第一透鏡膜140與透光基板110受到熱應力時所產生的形變及有效降低第二透鏡膜170與透光基板110受到熱應力時所產生的形變。如此一來，本實施例之鏡頭片100a的製作方法便可製作出翹曲程度較小或無翹曲之鏡頭片100a。In the manufacturing method of the lens sheet 100a of the embodiment, since the first supporting substrate 120 is attached to the transparent substrate 110 before heating the first lens film 140, and before the second lens film 170 is heated, The second supporting substrate 160 is attached to the first lens film 140. Therefore, the stress generated by the first lens film 140 and the second lens film 170 during heating can be absorbed by the first supporting substrate 120 and the second supporting substrate 160, respectively. The support of the first supporting substrate 120 and the second supporting substrate 160 can effectively reduce the deformation caused by the thermal stress of the first lens film 140 and the transparent substrate 110 and effectively reduce the second lens film 170 and the light transmission. The deformation of the substrate 110 when subjected to thermal stress. In this way, in the manufacturing method of the lens sheet 100a of the present embodiment, the lens sheet 100a having a small degree of warpage or no warpage can be produced.
另外，由於在製作第二透鏡膜170的時候，第一透鏡膜140與透光基板110可處於較無翹曲或無翹曲的情況，所以第二透鏡膜170的透鏡部172與第一透鏡膜140的透鏡部142的對位便可以較為準確，進而提升鏡頭片100a的光學品質。In addition, since the first lens film 140 and the light-transmitting substrate 110 can be in a state of no warping or warping when the second lens film 170 is formed, the lens portion 172 of the second lens film 170 and the first lens The alignment of the lens portion 142 of the film 140 can be more accurate, thereby improving the optical quality of the lens sheet 100a.
在本實施例中，可藉由切割鏡頭片100或鏡頭片100a來使鏡頭片100或鏡頭片100a上的這些透鏡部142彼此分離，例如往相鄰兩透鏡部142間的薄膜部144切割，以分離出彼此獨立的透鏡部142。分離而成的透鏡部142及透光基板110(或者再加上透鏡部172)即可形成鏡頭，此鏡頭可用於微形影像感測器中。In the present embodiment, the lens portions 142 on the lens sheet 100 or the lens sheet 100a can be separated from each other by cutting the lens sheet 100 or the lens sheet 100a, for example, by cutting the thin film portion 144 between the adjacent two lens portions 142. The lens portions 142 that are independent of each other are separated. The lens portion 142 and the light-transmitting substrate 110 (or the lens portion 172) are separated to form a lens, which can be used in a micro image sensor.
綜上所述，在本發明之實施例之鏡頭片的製作方法中，由於在對第一透鏡膜加熱之前先將第一支撐基板貼附於透光基板上，因此第一透鏡膜在加熱過程中所產生的應力可被第一支撐基板吸收，亦即藉由第一支撐基板的支撐可有效降低第一透鏡膜與透光基板受到熱應力時所產生的形變。如此一來，本發明之實施例之鏡頭片的製作方法便可製作出翹曲程度較小或無翹曲之鏡頭片。In summary, in the method of fabricating the lens sheet of the embodiment of the present invention, since the first support substrate is attached to the light-transmitting substrate before the first lens film is heated, the first lens film is heated. The stress generated in the first support substrate can be absorbed by the first support substrate, that is, the deformation of the first lens film and the light-transmitting substrate when subjected to thermal stress can be effectively reduced by the support of the first support substrate. In this way, the lens sheet of the embodiment of the present invention can be used to produce a lens sheet having a small degree of warpage or no warpage.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、100a．．．鏡頭片100, 100a. . . Lens piece
110．．．透光基板110. . . Light transmissive substrate
112．．．第一表面112. . . First surface
114．．．第二表面114. . . Second surface
120．．．第一支撐基板120. . . First support substrate
130．．．第一黏著層130. . . First adhesive layer
140．．．第一透鏡膜140. . . First lens film
142、172．．．透鏡部142, 172. . . Lens unit
144、174．．．薄膜部144, 174. . . Film department
150．．．保護層150. . . The protective layer
160．．．第二支撐基板160. . . Second support substrate
170．．．第二透鏡膜170. . . Second lens film
180．．．第二黏著層180. . . Second adhesive layer
圖1A至圖1D為繪示本發明之一實施例之鏡頭片的製作方法的流程之剖面示意圖。1A to 1D are schematic cross-sectional views showing the flow of a method of fabricating a lens sheet according to an embodiment of the present invention.
圖2A至圖2F為繪示本發明之另一實施例之鏡頭片的製作方法的部分流程之剖面示意圖。2A to 2F are cross-sectional views showing a part of the flow of a method for fabricating a lens sheet according to another embodiment of the present invention.
110．．．透光基板110. . . Light transmissive substrate
112．．．第一表面112. . . First surface
114．．．第二表面114. . . Second surface
120．．．第一支撐基板120. . . First support substrate
130．．．第一黏著層130. . . First adhesive layer
140．．．第一透鏡膜140. . . First lens film
142．．．透鏡部142. . . Lens unit
144．．．薄膜部144. . . Film department
Claims (16)
Priority Applications (1)
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| TW100136981A TWI482700B (en) | 2011-10-12 | 2011-10-12 | Manufacture method of lens sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100136981A TWI482700B (en) | 2011-10-12 | 2011-10-12 | Manufacture method of lens sheet |
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| TW201315590A TW201315590A (en) | 2013-04-16 |
| TWI482700B true TWI482700B (en) | 2015-05-01 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200944365A (en) * | 2008-04-18 | 2009-11-01 | Hon Hai Prec Ind Co Ltd | Method for manufacturing a microlens |
| TW200946328A (en) * | 2008-05-09 | 2009-11-16 | Hon Hai Prec Ind Co Ltd | Method for fabricating double-sided |
| TW201018567A (en) * | 2008-11-14 | 2010-05-16 | Hon Hai Prec Ind Co Ltd | Injection molding mold and injection molding method for lens array |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200944365A (en) * | 2008-04-18 | 2009-11-01 | Hon Hai Prec Ind Co Ltd | Method for manufacturing a microlens |
| TW200946328A (en) * | 2008-05-09 | 2009-11-16 | Hon Hai Prec Ind Co Ltd | Method for fabricating double-sided |
| TW201018567A (en) * | 2008-11-14 | 2010-05-16 | Hon Hai Prec Ind Co Ltd | Injection molding mold and injection molding method for lens array |
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