TWI478660B - 散熱器固定裝置 - Google Patents

散熱器固定裝置 Download PDF

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Publication number
TWI478660B
TWI478660B TW100148139A TW100148139A TWI478660B TW I478660 B TWI478660 B TW I478660B TW 100148139 A TW100148139 A TW 100148139A TW 100148139 A TW100148139 A TW 100148139A TW I478660 B TWI478660 B TW I478660B
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Taiwan
Prior art keywords
heat sink
circuit board
nuts
fixing device
bottom plate
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TW100148139A
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English (en)
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TW201328563A (zh
Inventor
Lei Liu
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Hon Hai Prec Ind Co Ltd
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Publication of TW201328563A publication Critical patent/TW201328563A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

散熱器固定裝置
本發明是關於一種散熱器固定裝置。
在習知技術中,要將一散熱器固定於裝設有發熱電子元件的一電路板時,通常都採用複數鎖固件分別穿過伸縮彈簧及該散熱器,然後將該等鎖固件鎖於該電路板。然而,一般的鎖固件及伸縮彈簧只能適用於一定厚度的發熱電子元件及電路板,當發熱電子元件及電路板的厚度變化較大時,該等鎖固件可能因長度不夠而無法使用,或該等鎖固件可能由於長度太長而導致該等伸縮彈簧未被壓縮,進而不能固定散熱器。
鑒於以上,有必要提供一種可調節固定高度的散熱器固定裝置。
一種散熱器固定裝置,用於將底板設有兩穿孔的一散熱器固定於設有兩穿孔的一電路板上,該散熱器固定裝置包括兩鎖固件、兩螺母及兩伸縮彈簧,每一鎖固件包括一頭部、由該頭部向下延伸出的一螺紋柱及由該螺紋柱的底部向下延伸出的兩間隔的穿過該散熱器的一穿孔與該電路板的一對應穿孔而卡置於該電路板底部的兩卡腳,該兩螺母分別可上下活動地螺鎖於該兩鎖固件的螺紋柱,該兩伸縮彈簧分別套設於該兩鎖固件的螺紋柱,每一伸縮彈簧的兩端分別抵頂於該散熱器的底板與對應的螺母。
相較習知技術,該散熱器固定裝置的螺母可鎖固於不同的高度,當電路板及裝設於電路板上的發熱電子元件的厚度變更時,使用者可調節該兩螺母的高度,使該兩螺母始終壓緊該兩伸縮彈簧與該散熱器,從而固定該散熱器。
請參照圖1,本發明散熱器固定裝置的較佳實施方式,用於將一散熱器10固定於裝設有一發熱電子元件21的一電路板20。該散熱器固定裝置包括兩鎖固件30、兩螺母40及兩伸縮彈簧50。
該散熱器10包括一底板12。該底板12的兩對角處分別設有一貫穿該底板12上下兩側的穿孔125。
該電路板20於鄰近該發熱電子元件21的兩對角處分別設有一穿孔24。
每一鎖固件30包括一頭部31、由該頭部31的一側的中部垂直延伸出的一螺紋柱33及由該螺紋柱33遠離該頭部31的一端延伸出的兩間隔的卡腳35。每一卡腳35於遠離螺紋柱33的一端背向另一卡腳35凸設一鉤扣部351。
請參照圖2,要將該散熱器10固定於該電路板20,以給該發熱電子元件21進行散熱時,首先將該兩螺母40分別套設於該兩鎖固件30的螺紋柱33的上部。然後再將該兩伸縮彈簧50分別套設於該兩鎖固件30的螺紋柱33,使每一伸縮彈簧50位於對應的鎖固件30的鉤扣部351與螺母40之間。將該兩鎖固件30的卡腳35分別由上向下彈性變形地穿過該散熱器10的兩穿孔125及該電路板20的兩穿孔24,之後卡腳35彈性回復使對應的鉤扣部351卡置於該電路板20的底部。此時,該兩伸縮彈簧50的底部分別抵接於該散熱器10的底板12的頂部。向下旋動該兩螺母40,直至該兩螺母40分別向下抵緊該兩伸縮彈簧50的頂部,該散熱器10的底部緊密貼合於該發熱電子元件21。從而,該散熱器10被固定於該電路板20。
當該發熱電子元件21和該電路板20的厚度變更時,使用者可調節該兩螺母40的高度,使該兩螺母40始終壓緊該兩伸縮彈簧50與該散熱器10,從而,可將該散熱器10固定於電路板。
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
10...散熱器
12...底板
125、24...穿孔
20...電路板
21...發熱電子元件
30...鎖固件
31...頭部
33...螺紋柱
35...卡腳
351...鉤扣部
40...螺母
50...伸縮彈簧
圖1是本發明散熱器固定裝置的較佳實施方式與一散熱器及一電路板的立體分解圖。
圖2是圖1的立體組裝圖。
10...散熱器
12...底板
125、24...穿孔
20...電路板
21...發熱電子元件
30...鎖固件
31...頭部
33...螺紋柱
35...卡腳
351...鉤扣部
40...螺母
50...伸縮彈簧

Claims (2)

  1. 一種散熱器固定裝置,用於將底板設有兩穿孔的一散熱器固定於設有兩穿孔的一電路板上,該散熱器固定裝置包括兩鎖固件、兩螺母及兩伸縮彈簧,每一鎖固件包括一頭部、由該頭部向下延伸出的一螺紋柱及由該螺紋柱的底部向下延伸出的兩間隔的穿過該散熱器的一穿孔與該電路板的一對應穿孔而卡置於該電路板底部的兩卡腳,該兩螺母分別可上下活動地螺鎖於該兩鎖固件的螺紋柱,該兩伸縮彈簧分別套設於該兩鎖固件的螺紋柱,每一伸縮彈簧的兩端分別抵頂於該散熱器的底板與對應的螺母。
  2. 如申請專利範圍第1項所述之散熱器固定裝置,其中每一鎖固件的兩卡腳於遠離螺紋柱的一端相互遠離分別凸設一鉤扣部。
TW100148139A 2011-12-20 2011-12-22 散熱器固定裝置 TWI478660B (zh)

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CN2011104294833A CN103179838A (zh) 2011-12-20 2011-12-20 散热器固定装置

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TWI478660B true TWI478660B (zh) 2015-03-21

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CA2825918C (en) 2011-02-15 2018-08-07 Rotation Medical, Inc. Methods and apparatus for delivering and positioning sheet-like materials
CN112930025B (zh) * 2021-01-26 2022-07-05 深圳市优联电气技术有限公司 一种通讯设备电路用散热鳍片装载组件
CN114158185B (zh) * 2022-02-10 2022-05-06 宁波均联智行科技股份有限公司 一种车机

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CN103179838A (zh) 2013-06-26
US20130153268A1 (en) 2013-06-20

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