M426Q60 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱模組固定裝置’尤指一種應用於機板與熱模 組之固定裝置者。 - 【先前技術】 按’ 一般用於處理器上之散熱模組之固定結構，請參照第1圓所示， 其為台灣專利第93214499號專利案，該結構揭露有一底座100，該底座1〇〇 係位於機板200下，且該底座100各端邊分別設有向上延伸之支柱1〇1，該 # 等支柱101恰可穿過機板200上之孔洞201，且該等支柱101中分別設有螺 孑L 102 ’另’在機板200上則設有位於孔洞201間之處理器300，該處理器 300上壓靠有一散熱模組400，該散熱模組400在面對處理器300 —面上套 設有一扣件110，該扣件110中心設有一圓環111，該圓環1U係套設固定 在散熱模組400上，而該圓環ill週邊則設有向外延伸之支腳112，該等支 腳112末端分別設有一·^勾113，該等卡勾113係與支柱1〇1相對，如此一 來’雖可藉由螺絲120穿過卡勾113而鎖合在支柱ιοί之螺孔1〇2中，使 支腳112卡扣在螺絲120上，而使散熱模組4〇〇固定在處理器3〇〇上，惟 • 因螺絲120會有鬆動之情形’造成散熱模組400無法緊密貼靠在處理器3〇〇 上，且因螺絲120係位於機板200與散熱模組4〇〇間，令使用者將支腳112 卡扣在螺絲120時’會因空間狹窄，增加操作之困難及增加作業時間及成 本。 請參照第2圖所π，其設有-固定件5〇〇，該固定件5〇〇係固定在散熱 模組600之背面上，且該固定件5〇〇兩端分別接設有與之垂直之卡勾51〇’、，、 另，該散熱模組600下設有一處理器7〇〇或一個以上之晶片，該處理器？〇〇 係固定在-機板800上’該機板8〇〇在處理器7〇〇週邊分別設有一個以上 之穿孔81〇，該等穿孔81〇係與卡勾510相對且恰可供卡勾51〇穿套而過； 又，該機板謂下設有-絕緣墊體52〇，該絕緣整體52〇各端邊分別設有一 M426060 孔洞521，以供卡勾510穿套而過，且該絕緣墊體520下設有一底座530， 該底座530與孔洞521相對位置上分別設有一開孔531，以供卡勾510穿套 而過並凸露在其上，且該底座530上設有兩兩相對之開槽532，該等開槽 532相鄰邊分別設有凸出樞孔533，該等樞孔533分別嵌扣有一扣件534 , 該等扣件534兩端分別設有向内弩折之支腳5341，該等支腳5341自由端分 別可卡扣在卡勾510中，且該扣件534上設有與支腳5341反向延伸之把手 5342，該等把手5342係與支腳5341在同一平面上。 此種裝置在使用時’雖可將散熱模組6〇〇置放在機板8〇〇之處理器7〇〇 上，再使卡勾510穿過機板800並凸露在底座530上，而將樞設在底座530 之扣件534支腳5341壓靠在卡勾510上，並卡扣其中，准因該等扣件534 係插接在底座530上，不但組裝時嵌扣不易，且容易因受到底座53〇壓迫 之力量’從枢接處脫落，在使用上非常不理想。 更何況，上述兩種習用裝置，無論是扣件11〇或是底座53〇或扣件534 在製造上，無法用機器大量生丨產，某些工序，仍需要人工來完成，在成本 上是很大負擔。 【新型内容】 創作人有鐘於上述一般散熱模組之固定裝置於實施時之缺失，爰精心 研究，再進一步發展出本案散熱模組之插槽式固定裝置。 本創作之一目的，在提供一種散熱模組之插槽式固定裝置，其係一種 將散熱裝置固定在機板之裝置，該裝置上設有一固定於散熱模組底部之固 定柱，該固定柱遠離該散熱模組之一端設有嵌槽，又，該機板相對於該散 熱模組之一側設有一彈性件，該彈性件向外延伸之兩端係與直線延伸方向 呈a角之突出’該a角為大於〇度角，該彈性件之兩端各設有一插槽，該 等插槽分別嵌套有一卡扣件，該等卡扣件上各設有一嵌孔；透過彈性件之 彈性作用，將該固定柱分別穿過機板、彈性件，再將彈性件之兩端緊壓在 機板下，然後再將卡扣件順著該插槽推向固定柱，讓固定柱進入嵌孔，而M426Q60 V. New description: [New technical field] This creation is about a heat-dissipation module fixing device, especially one that is applied to the fixing device of the machine board and the hot mold group. - [Prior Art] According to the fixed structure of the heat dissipation module generally used on the processor, please refer to the first circle, which is the patent of Taiwan Patent No. 93214499, which discloses a base 100, which is 1 The rafting system is located under the machine plate 200, and each of the end sides of the base 100 is provided with an upwardly extending pillar 1〇1, and the pillars 101 such as # can pass through the hole 201 in the plate 200, and the pillars 101 respectively A processor 300 is disposed on the board 200, and the processor 300 is mounted on the processor 300. The processor 300 is pressed against a heat dissipation module 400. The heat dissipation module 400 faces the processor 300. A fastener 110 is disposed on the surface, and a ring 111 is disposed in the center of the fastener 110. The ring 1U is sleeved and fixed on the heat dissipation module 400, and the periphery of the ring ill is provided with an outwardly extending branch. The feet 112 are respectively provided with a hook 113 at the end of the legs 112, and the hooks 113 are opposite to the pillars 1〇1, so that the bolts 120 can be locked in the pillars through the hooks 113. Ιοί screw hole 1〇2, so that the foot 112 is snapped on the screw 120, and the heat dissipation module 4〇〇 is fixed in the processing 3〇〇, only because the screw 120 will loosen, the heat dissipation module 400 cannot be closely attached to the processor 3〇〇, and the screw 120 is located between the board 200 and the heat dissipation module 4 When the user buckles the leg 112 to the screw 120, the space is narrow, which increases the difficulty of operation and increases the working time and cost. Please refer to FIG. 2, which is provided with a fixing member 5〇〇, and the fixing member 5 is fixed on the back surface of the heat dissipation module 600, and the two ends of the fixing member 5 are respectively connected thereto. The vertical hooks 51 〇 ',,,,, the heat dissipation module 600 is provided with a processor 7 〇〇 or more than one wafer, the processor? The tether is fixed on the plate 800. The plate 8 is provided with more than one perforation 81〇 around the processor 7〇〇. The perforations 81 are opposite to the hook 510 and are ready for the card. The hook 51 is worn over the sleeve; in addition, the board is provided with an insulating cushion body 52 〇, and an M426060 hole 521 is respectively provided at each end of the insulating 52 , for the hook 510 to pass through, and A base 530 is disposed under the insulating pedestal 520. The base 530 is respectively disposed with an opening 531 at a position opposite to the hole 521 for the hook 510 to pass over and protrude thereon, and the base 530 is disposed on the base 530. The two adjacent holes 532 are respectively provided with protruding pivot holes 533, and the pivot holes 533 are respectively fastened with a fastening member 534, and the two ends of the fastening members 534 are respectively provided inwardly. The legs 5341 are folded, and the free ends of the legs 5341 are respectively fastened in the hooks 510, and the fasteners 534 are provided with handles 5432 extending in opposite directions from the legs 5341. The handles 5342 are supported by the legs 5341. The feet 5341 are on the same plane. When the device is in use, the heat dissipation module 6 can be placed on the processor 7 of the board 8 , and then the hook 510 is passed through the board 800 and protruded on the base 530. The fastener 534 leg 5341 pivoted on the base 530 is pressed against the hook 510 and snapped therein. The fastener 534 is inserted into the base 530, which is not easy to be assembled when assembling. It is easy to fall off from the pivot by the force pressed by the base 53〇, which is very unsatisfactory in use. What's more, the above two conventional devices, whether the fasteners 11〇 or the base 53〇 or the fasteners 534 are manufactured, cannot be produced in large quantities by machines, and some processes still need to be done manually, in terms of cost. A lot of burden. [New content] The creator has the lack of the fixing device of the above-mentioned general heat-dissipating module, and carefully researched it to further develop the slot-type fixing device of the heat-dissipating module of the present case. One of the purposes of the present invention is to provide a slot type fixing device for a heat dissipating module, which is a device for fixing a heat dissipating device to a machine board, and the device is provided with a fixing column fixed to the bottom of the heat dissipating module, the fixing column A slot is disposed away from one end of the heat dissipation module, and an elastic member is disposed on one side of the heat dissipation module, and the two ends of the elastic member extend outward at an angle with a straight line extending direction. The a corner is greater than the twist angle, and the two ends of the elastic member are respectively provided with a slot, and the slots are respectively nested with a latching member, and each of the latching members is provided with a through hole; Elastic effect, the fixing column is respectively passed through the plate and the elastic member, and then the two ends of the elastic member are pressed under the plate, and then the locking member is pushed along the slot toward the fixing column, so that the fixing column enters. Inserted holes, and