TWI473185B - Work bench - Google Patents

Description

Work platform

The present invention relates to the construction of a work platform, and more particularly to a structure of a work platform for performing a wire bonding operation.

The purpose of semiconductor packaging is to protect bare semiconductor components such as wafers, reduce the density of wafer contacts, and provide good heat dissipation from the wafer. A common packaging method is that the wafer is mounted to a loading board by wire bonding or flip chip bonding so that the contacts on the wafer can be electrically connected to the package carrier. Therefore, the contact distribution of the wafer can be reconfigured by the package carrier to conform to the junction distribution of the external components of the next level.

In addition, reducing the size of integrated circuit component products has been one of the long-standing goals of the electronics manufacturing industry. The reduction in product size means a reduction in production costs, and it also indicates a shortening of the transmission path of the signal and an advantage of improved product performance.

One of the key factors affecting the volume of integrated circuit components is the improvement in packaging technology. Today, the use of leadframes as a package for wafer carriers is still a fairly popular and widely used technology. A Quad Flat Package (QFP) structure is a common example.

In general, a lead frame such as a quad flat planar leadless package is used during a wire bonding operation on a work platform. (Quad Flat No lead package, QFN), it is necessary to pass the working platform or hot plate to heat the wire. During the heating process, it is easy to cause excessive oxidation of the lead frame and cause the risk of delamination. In more detail, the hot plates on the general wire machine are made of iron, and the temperature of the hot plate will continue to be as high as 200 °C during the wire bonding operation, and such temperature will be on the wire machine. Conducting the lead frame during the wire bonding process, causing risks such as delamination. In particular, when the condition of the wire machine is unstable or has special conditions, the lead frame is continuously baked for a longer period of time, which may cause a greater risk of delamination of the lead frame.

The invention provides a working platform, which can reduce the risk of delamination of the product due to excessive heating in the wire bonding operation process.

The present invention provides a work platform suitable for the operation of wire bonding an integrated circuit component to a circuit board, including a flat panel and at least one panel. The plate has an upper surface and a lower surface. The upper surface has a working area and a non-working area surrounding one of the working areas. The non-working area has at least one groove. The panel is embedded in the recess and the surface of the panel is substantially coplanar with the surface of the non-working area. The wire bonding operation of the integrated circuit component is adapted to be performed in the working area of the upper surface. The flat plate is composed of a first material and the panel is composed of a second material. The first material is different from the second material.

In an embodiment of the invention, the first material has a heat transfer coefficient greater than a heat transfer coefficient of the second material.

In an embodiment of the invention, the heat conduction system of the second material is The number is less than 1/2 times the heat transfer coefficient of the first material.

In an embodiment of the invention, the working platform has a thickness in the working area that is greater than a thickness in the non-working area such that the working area is higher on the upper surface than the non-working area. .

In an embodiment of the invention, the number of panels described above corresponds to the number of grooves.

In an embodiment of the invention, the first material is iron.

In an embodiment of the invention, the second material is ceramic.

In an embodiment of the invention, the working area is adapted to place a leadframe package component and perform a wire bonding process.

In one embodiment of the invention, the above-described working area is suitable for placing a square planar leadless package component and performing a wire bonding process.

Based on the above, the working platform of the present invention is embedded in the non-working area of the working platform by the panel with low heat conductivity coefficient, so that the working temperature of the non-working area is reduced during the wire bonding operation, so as to reduce the wire caused by excessive heating. The rack creates the risk of delamination.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a cross-sectional view of a work platform in accordance with an embodiment of the present invention. Referring to FIG. 1, a work platform 100 according to an embodiment of the present invention may be mounted on a wire binding machine for wire bonding work. The work platform 100 of this embodiment includes a flat plate 110 and at least one panel 120. Tablet 110 There is an upper surface 112 and a lower surface 114. The upper surface 112 has a working area 112a and a non-working area 112b surrounding one of the working areas 112a. In the present embodiment, a semiconductor element 50 is placed on the working area 112a of the upper surface 112 for wire bonding work. The semiconductor device 50 of this embodiment is, for example, a lead frame or a Quad Flat No lead package (QFN). Other semiconductor components may be placed on the work platform 100 for wire bonding operations in other embodiments, and the invention is not limited thereto.

The non-working area 112b of the working platform 100 of the present embodiment has at least one groove R for embedded baking in order to avoid the situation that the lead frame is delaminated due to the long-time baking of the hot plate on the wire bonding machine. The panel 120 is not too hot. 2 is a top plan view of the work platform of FIG. 1. Referring to both FIG. 1 and FIG. 2, the panel 120 is embedded in the recess R and the surface of the panel 120 is substantially coplanar with the surface of the non-working area 112b. In the present embodiment, the number of the grooves R of the non-working area 112b is two and is disposed on both sides of the working area 112a as an example. Therefore, the panel 120 corresponding to the groove R is also provided in two. However, in other embodiments, the number and position of the grooves R may be set as desired, and the present invention is not limited thereto.

In this embodiment, as shown in FIG. 2, two grooves R are disposed on both sides of the working area 112a, and two panels 120 are respectively embedded in the grooves R. The area of the panel 120 of the present embodiment on the upper surface 112a and the area of the non-working area 112b are set to be substantially equal. In other words, the ratio of the area of the two panels 120 on the upper surface 112 to the area of the non-working area is almost 100%. However, in other embodiments, the panels can be set according to different needs. The ratio of the area on the upper surface 112a to the area of the non-working area 112b is not limited to the present invention.

As shown in FIG. 1, since the panel 120 of the present embodiment is in the shape of a panel, the recess R is also correspondingly disposed to accommodate the panel 120, and the volume of the recess R is substantially equal to the volume of the panel 120. In other embodiments not shown, the shape of the groove R may be set to have a shape of a groove, and the panel 120 may be correspondingly provided with a convex shape to firmly insert the panel 120 into the groove. Within R. In this regard, the invention is not limited.

In the present embodiment, the flat plate 110 is composed of a first material, and the panel 120 is composed of a second material. The first material is different from the second material. The first material is, for example, iron, and the heat transfer coefficient of iron is about 80.4 W/m. K. The second material is, for example, ceramic, and the thermal conductivity of the ceramic is about 20~28W/m. K. As such, the conductivity of the material disposed in the non-working region 112b is less than 1/2 times the thermal conductivity of the material disposed in the working region 112a, and such a configuration allows the working platform 100 to withstand long periods of high temperature baking. The temperature of the working area 112b is significantly lowered. In addition, in such a configuration, during the wire bonding operation, the working temperature of the non-working area 112b can be lowered to 110 to 200 ° C, that is, the working area 112a and the non-working area, with the working temperature of the working area 112a being about 200 ° C. 112b has a temperature difference of 80~90 °C. Therefore, it is possible to avoid the risk of long-term baking during the wire bonding process and high temperature causing delamination of the lead frame.

For example, the working platform 100 of the embodiment can be used to heat the flat plate 110 by using the different material properties of the flat plate 110 and the panel 120, so that the volume of the groove R is larger than that of the panel 120. The volume can easily embed the panel 120 in the recess R. After cooling, the panel 110 can be compacted to form a tight relationship with the panel 120. However, in other embodiments, the manner in which the panel 120 is embedded in the recess R of the flat plate 110 may be a powder metallurgy process, and the invention is not limited thereto.

Further, in the present embodiment, the thickness of the work platform 100 in the work area 112a is greater than the thickness of the non-working area 112b, and the work area 112b is higher on the upper surface 112 than the non-working area 112b. In more detail, as shown in FIG. 1, in order to facilitate the work, the present embodiment designs the working area 112a of the upper surface 112 to be higher in height than the non-working area 112b.

In summary, the working platform of the present invention is embedded in the non-working area of the working platform by the panel with lower heat conductivity coefficient, so that the working temperature of the non-working area is reduced during the wire bonding operation, so that the heating is too long. Causes the risk of delamination of the lead frame. Therefore, by using the simple working platform of the invention on the wire machine, the risk of delamination of the product due to baking under a constant temperature can be avoided, and the product yield is further improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

50‧‧‧Semiconductor components

100‧‧‧Working platform

110‧‧‧ tablet

112‧‧‧ upper surface

112a‧‧‧Working area

112b‧‧‧Non-work area

114‧‧‧ lower surface

120‧‧‧ panels

R‧‧‧ groove

1 is a cross-sectional view of a work platform in accordance with an embodiment of the present invention.

2 is a top plan view of the work platform of FIG. 1.

50‧‧‧Semiconductor components

100‧‧‧Working platform

110‧‧‧ tablet

112‧‧‧ upper surface

112a‧‧‧Working area

112b‧‧‧Non-work area

114‧‧‧ lower surface

120‧‧‧ panels

Claims (9)

A work platform suitable for wire bonding an integrated circuit component to a circuit board, comprising: a flat plate having an upper surface and a lower surface, the upper surface having a working area and surrounding the working area a non-working area having at least one recess; and at least one panel embedded in the recess, and a surface of the panel being substantially coplanar with a surface of the non-working area, wherein the integrated circuit component The wire bonding operation is performed on the working area of the upper surface, the flat plate is composed of a first material, and the panel is composed of a second material different from the second material. The working platform of claim 1, wherein the first material has a heat transfer coefficient greater than a heat transfer coefficient of the second material. The working platform of claim 2, wherein the second material has a heat transfer coefficient less than 1/2 times a heat transfer coefficient of the first material. The work platform of claim 1, wherein the working platform has a thickness in the working area that is greater than a thickness in the non-working area such that the working area is higher on the upper surface than the non-working area. The work platform of claim 1, wherein the number of the panels corresponds to the number of the grooves. The working platform of claim 1, wherein the first material is iron. For example, the working platform described in claim 1 of the patent scope, wherein the The second material is ceramic. The work platform of claim 1, wherein the work area is for placing a lead frame package component and performing a wire bonding process. The working platform of claim 8, wherein the working area is for placing a square planar leadless package component and performing a wire bonding process.