KR20140039563A - Process of encapsulating non-rigid substrate and the substrate - Google Patents

Abstract

The present invention relates to a process for manufacturing packing of a flexible substrate and, more specifically, to completing the process for manufacturing the packing of the flexible substrate through an order such as entire manufacturing processes, load, packing, unload, and laser. The present invention is provided to install a load weight stiffening plate on the flexible substrate to decrease the generation of bending and deformation in the process for manufacturing the packing, thereby accurately completing a packing process of a chip. The present invention is provided to effectively increase an amount ratio of the process for manufacturing the packing of the chip, thereby reducing manufacturing costs. A packing structure of the flexible substrate is installed by connecting a conductive material and the flexible substrate on the upper part and the lower part of a flexible load plate. An external boundary frame is formed on the flexible substrate. A chip substrate is formed into the external boundary frame in a plurality of square array formations. A plurality of chips is installed on the chip substrate and is covered by a thermosetting material. [Reference numerals] (10) All manufacturing processes; (11) Load; (12) Laser; (13) Packing

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a process for manufacturing a packing of a flexible substrate,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a packing of a soft substrate and a structure thereof, and more particularly to a process for manufacturing a packing of a soft substrate through the steps of pre-manufacturing, loading, packing, It is possible to reduce the occurrence of bending, warpage, and deformation of the flexible substrate during the manufacturing process of the chip, thereby completing the packing work of the chip accurately and increasing the efficiency of the chip packing manufacturing process Refers to a packing manufacturing process and its structure of a soft substrate which can lower the manufacturing cost.

Due to the rapid development of the electronics industry and the increase in the production of information products, the demand for semiconductor electronic components is increasing day by day, and the pace of development of the patching technology of semiconductor components is changing very rapidly according to the progress of scientific technology and market demand. In particular, in the case of a packing technology in which a lead substrate is manufactured through a manufacturing process such as press cutting, etching, or stamping a copper foil, and a chip is packed on the lead substrate, the packing technology of the lead substrate is already matured to some extent. Is in the stage.

However, the conventional packing technique of lead frame substrate is a ball grid array (BGA) packing technique. The conventional BGA packing technique depends on the lead substrate material used, and PBGA (Plastic BGA) It is divided into packing technology such as PBGA) and TBGA (Tab BGA).

1 is a perspective view of a packaging structure of a packing technique of a conventional TBGA (tape ball grid array) system. Referring to the contents of FIG. 1, as can be seen from the figure, the lead base material 4 is composed of a combination of an electroplating layer 40, a conductive material 41 and a flexible mounting plate 42, and the conductive material 41 The electroplating layer 40 is formed on the upper and lower sides, and the adhesive layer C is formed on the electroplating layer 40 above the conductive material 41, and the electroplating layer 40 below the conductive material 41 is formed. A flexible mounting plate 42 is formed on the flexible mounting plate 42, and the solder mounting plate 42 is penetrated through the solder ball A, and the insulation layer B is connected to the place where the lead substrate 4 is broken. The chip E is provided on the insulating layer B, the insulating layer B is formed on both sides of the chip E, and the thermosetting material F is covered and installed above the chip E. The cooling layer (D) is covered and installed above the adhesive layer (C) and the thermosetting material (F).

Since the conductive material 41 of the lead base material 4 uses copper flakes, and the flexible mounting plate 42 uses PI (Polyimide, PI), the lead base material 4 can be made light and thin. As a result, a smaller packing size could be completed. Therefore, it is widely used for memory or communication IC or high value IC.

However, this TBGA packing technique uses a flammable TBGA substrate (the lead substrate 4 composed of the electroplating layer 40, the conductive material 41 and the flexible plate 42 described above) There is a disadvantage in that warping, bending, deformation, and the like occur in the combustible TBGA substrate when the packing is proceeded, thereby lowering the rate of production of the packing.

The main object of the present invention is to provide a process for manufacturing a packing of a flexible substrate and a structure thereof, wherein the packing manufacturing process and its structure of the flexible substrate are carried out through a pre-manufacturing process, loading, packing, Completion of the packing process and precise packing work of the chip by reducing the occurrence of bending, warpage, deformation, etc., of the soft substrate in the process of manufacturing the packing by connecting the load weight reinforcing plate to the flexible substrate in the stacking order in particular And the manufacturing cost can be lowered by effectively increasing the rate of production of the chip packing manufacturing process.

In order to achieve the above object, the packing manufacturing process of the square flexible mounting plate of the present invention includes approximately the entire manufacturing process, loading, laser and packing, etc., in particular the flexible material connected to the upper and lower conductive material and flexible loading plate It is formed into an outer border frame through a thin film, a mask, and an etching manufacturing process, and a chip substrate formed in a plurality of rectangular arrays is formed in the outer border frame, wherein the chip substrate includes a pad, a plurality of broken leads, and a PI (Polyimide). , PI) is completed by connecting the upper and lower flexible loading plates of each other, and the upper side of the lead and the flexible loading plate can be applied to the anti-soldering coating if necessary.

Subsequently, the flexible weight plate is connected to the flexible loading plate on the outer edge frame of the flexible base material, the flexible loading plate under the outer edge frame, or the flexible loading plate on the upper edge frame of the flexible base material and the lower edge of the outer edge frame. Can improve the structural strength.

Subsequently, a laser drilling operation is carried out on the flexible mounting plate to form guide holes connected to and connected to the leads on the flexible mounting plate, and an integer number of induction holes connected to and connected to the pads on the flexible mounting plate as necessary. The lead and pad surfaces, which are connected to each other through the induction hole, may be formed by plating a metal protective layer, and then the packing operation of the chip on the pad may be performed.

Finally, the molding operation is performed on the chip substrate of the chip using the thermosetting material, and the laser and packing order can be changed according to the user's need. If the laser order is followed after the packing order, The metal protective layer is not formed on the surfaces of the leads and the pad connected to each other through the holes. In addition, when the bottom of the flexible loading plate is completely connected to the loading weight reinforcement plate, the user must maintain the laser quality by removing the loading weight reinforcement plate under the flexible loading plate through the lowering order prior to the laser order. The present invention based on the above description can improve the structural strength of the soft substrate by using the stacked weight reinforcing plate, increase the rate of charge in the process of manufacturing the chip packing effectively, and at the same time lower the production cost.

Therefore, as can be seen from the packing manufacturing process described above, the packing structure of the soft substrate according to the present invention is formed by connecting and bonding a soft substrate on and under the conductive material and the soft substrate, forming an outer frame on the soft substrate, Wherein the chip base is formed by connecting a pad and a plurality of mutually interlocked leads and a flexible substrate in such a manner that they are connected to each other, A lead is formed on the chip, a solder ball or a metal wire and a lead are connected to each other to communicate with each other, and a thermosetting material is covered on the chip substrate on which the chip is formed And an outer edge frame of the soft substrate or an outer edge The loading weight reinforcement plate is connected at the same time on the flexible loading plate below the reframe or on the upper edge frame of the flexible substrate and on the corresponding flexible loading plate below the external frame.

As can be seen from the above description, the process and the structure of the packing of the soft substrate of the present invention can achieve the following advantages and effects.

1. The user is able to determine the priority order of the laser and packing operations, if necessary, via the load weight reinforcement plate connected to the flexible plate.

2. It is possible to greatly reduce problems such as bending, warping, deformation and the like that may occur on the flexible substrate during the packing manufacturing process through the load-weight reinforcing plate connected to the outer frame frame of the flexible substrate and the flexible plate Thus, it is possible to improve the rate of the chip packing manufacturing process by proceeding the packing work of the accurate chip.

1 is a perspective view of a packaging structure of a packing technique of a conventional TBGA (tape ball grid array) system.
2 is a flow chart of the first embodiment and its structure.
3 is a flow chart of the second embodiment and its structure.
4 is a flow chart of the third embodiment and its structure.
5 is a flow chart of the fourth embodiment and its structure.
6 is a flowchart and a structure of the fifth embodiment.
7 is a flowchart and a structure of the sixth embodiment.
8 is a flowchart and a structure of the seventh embodiment.
Fig. 9 is a flow chart of the eighth embodiment and its structure.
10 is a perspective view of the chip substrate bumping of the ninth embodiment.
11 is a perspective view of the chip substrate bumping of the tenth embodiment.
12A is a view showing the chip base of the eleventh embodiment from above.
12B is a downside exploded view of the chip base of Example 11. Fig.

The structure and technical contents of the present invention will be described in detail below with reference to comparative examples and drawings together with a description of the process and the structure of the packing of the soft substrate of the present invention.

Example 1:

Fig. 2 shows a packing manufacturing process (1) of a soft substrate, which includes the following steps.

Pre-manufacturing process (10): The flexible substrate (2) completed by connecting the conductive material (G) and the flexible mounting plate (212) up and down through a thin film, mask, etching manufacturing process to form an outer border frame 20 And a chip substrate 21 arranged in a plurality of rectangular arrays in an outer edge frame 20 of the flexible substrate 2, wherein the chip substrate 21 is a pad 210 and a plurality of broken leads 211. ) And the flexible mounting plate 212 is completed by connecting to each other up and down. The pad 210 and the lead 211 connect the first conductive material G0 and the second conductive material G1 to each other by vertically connecting the pad 210 and the lead 211, The first conductive material G0 may be a copper foil and the second conductive material G1 may be a structural layer composed of a single combination or multiple combinations of copper, silver, nickel, palladium or gold Can be used.

Stacking (11): The stacking (11) sequence is installed by connecting the load weight reinforcement plate (3) above the outer edge frame 20 of the flexible base material (2), wherein the load weight reinforcement plate (3) A metal material such as aluminum or stainless steel or a material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or PI (polyimide, PI) may be used. The strength can be increased.

Laser 12: A laser drilling operation is performed on the flexible plate 212 to form an induction hole 2120 communicating with the lead 211 on the flexible plate 212, An integral number of induction holes 2100 connected to the pad 210 are formed on the redistribution plate 212 as needed (two guide holes 2100 are used as an example in the embodiment of FIG. 2 of the present invention) The surfaces of the leads 211 and the pads 210 connected to the induction hole 2120 and the induction hole 2100 are connected to the surface of the metal 210 by a single or multiple combination of copper, silver, nickel, palladium, The protective layer 23 can be formed.

Packing 13: The chip 213 is packed on the chip base 21, and the contents of the present work are connected to the pad 210, and then the wire bonder is processed again. In this way, the chip 213 is connected to each other through the lead 211 of the chip base material 21 through the metal wire 214 or solder balls (not shown in the figure), and then again a thermosetting material such as epoxy, silicon or ceramics Molding operation is performed above the flexible mounting plate 212 and between the pad 210 and the lead 211 using the 215 to isolate the chip 213 from the outside, thereby preventing the metal wire 214 from being damaged. At the same time, it is possible to prevent moisture from penetrating into contact with the chip 213 and to corrode the chip 213, and also to avoid unnecessary signal interference, and to effectively prevent the chip 213 from operating. Since the heat can be discharged to the outside, the cooling effect of the chip 213 can be improved. It is good.

Therefore, the present invention is used as one of the components of the soft substrate 2 by using the soft substrate 212 composed of PI (Polyimide, PI), thereby indirectly increasing the structural strength of the soft substrate 2, The operation of the laser 12 and the packing 13 can be performed accurately on the substrate 2 and the rate of production of the packing process of the chip 213 using the soft substrate 2 can be improved and the unit cost can be lowered.

In addition, as can be seen in the above-described packing manufacturing process, the flexible substrate packing structure described in the first embodiment of the present invention is provided with a flexible base material 2 having a conductive material and a flexible mounting plate 212 connected up and down, An outer border frame 20 is formed on the flexible substrate, and the chip substrate 21 arranged in a plurality of rectangular arrays is formed in the outer border frame 20, and the chip substrate 21 is formed of a pad 210 and a plurality of chips. It is completed by connecting the two broken leads 211 and the flexible mounting plate 212 of PI (Polyimide, PI) up and down with each other, separately loaded on the outer rim frame 20 of the flexible base material (2) The weight reinforcing plate (3) is connected and installed, and the induction hole (2120) connected to and connected with the lead 211 in the flexible mounting plate (212) and the integer number of induction holes (2100) connected to and communicated with the pad (210) Form and connect the chip 213 on the pad 210 And a solder ball or metal wire 214 on the chip 213 to be connected to the lead 211, and a thermosetting material of epoxy, silicon, or porcelain on the chip substrate 21 of the chip 213. 215 is covered and installed.

Example 2:

Referring to FIG. 3, FIG. 3 is a second embodiment of the present invention, the contents of which are similar to those of the first embodiment. The main difference is that, in the second embodiment of the present invention, After proceeding with the ordering and loading step 11, the packing 13 process is proceeded first and the laser 12 process is proceeded again. If the laser 12 order is followed by the packing 13 order, The metal protective layer (not shown in the drawings) is not provided on the surface of the lead 211 and the pad 210 connected to the induction hole 2100 and the induction hole 2100.

In the second embodiment of the present invention, since the packing manufacturing process of the chip 213 can be accurately performed on the soft substrate 2 of the load weight reinforcing plate 3 connected on the outer frame 20, Since the effect is the same as that of the first embodiment, detailed description will be omitted.

Example 3:

Referring to the contents of FIG. 4, FIG. 4 is Embodiment 3 of the present invention, the content of which is largely similar to that of Example 1, and the main difference is that in Example 3 of the present invention, the loading after the sequence of the previous manufacturing process 10 is carried out. (11) The loading weight reinforcement plate 3 used in the sequence is connected and installed on the flexible loading plate 212 below the corresponding outer edge frame 20 of the flexible substrate 2, thereby indirectly providing the flexible substrate. The structural strength of (2) is increased, and as a result, the laser 12 and the packing 13 can be precisely performed, and the yield of the process of manufacturing the chip 213 packing process using the flexible substrate 2 is improved. It can be improved.

As can be seen from the packing manufacturing process of Example 3, the difference between the packing structure of the flexible substrate of Example 3 of the present invention and the packing structure of the flexible substrate of Example 1 is that the loading weight reinforcement plate 3 of the present embodiment is flexible. It is connected to the flexible mounting plate 212 below the outer edge frame 20 of the base material 2 is installed.

Example 4:

Referring to the contents of FIG. 5, FIG. 5 is an embodiment 4 of the present invention, the content of which is mostly similar to that of the second embodiment, and the main difference is that the embodiment 4 of the present invention is carried out according to the entire manufacturing process 10 as necessary. After the loading 11 sequence, the packing 13 sequence is first performed, and then the laser 12 sequence is performed, and the chip is loaded on the flexible substrate 2 having the loading weight reinforcement plate 3 connected thereto. The packing manufacturing process of 213 may be performed, and the effect obtained through this is the same as in Example 2, and thus a detailed description thereof will be omitted.

Example 5:

Referring to the contents of FIG. 6, FIG. 6 is a fifth embodiment of the present invention, the contents of which are largely similar to those of the first embodiment and the third embodiment, and the main difference is that in the fifth embodiment of the present invention, the entire manufacturing process (10) The stacking weight reinforcing plate 3 is simultaneously placed on the flexible stacking plate 212 corresponding to the top of the outer frame 20 and the bottom of the outer frame 20 of the flexible base material 2 in the order of stacking 11 after the order. By connecting and installing, the structural strength of the flexible substrate 2 is greatly increased, and as a result, the laser 12 and the packing 13 can be more precisely processed, and the chip 213 packing is manufactured using the flexible substrate 2. The yield can be lowered by improving the yield of the process.

As can be seen from the packing manufacturing process of Example 5, the difference between the packing structure of the flexible substrate of Example 5 of the present invention and the packing structure of the flexible substrate of Example 1 is the outer edge of the flexible substrate 2 of the present embodiment. The loading weight reinforcement plate 3 is connected to each other on the flexible loading plate 212 corresponding to the upper side of the frame 20 and the lower outer frame 20.

Example 6:

Referring to FIG. 7, FIG. 7 is a sixth embodiment of the present invention, and its contents are mostly similar to those of the fifth embodiment. The main difference is that, in the sixth embodiment of the present invention, The order of the stacking of the flexible substrate 2 is the same as that of the stacking of the flexible substrate 2 by using the stacking weight reinforcing plate 3, The strength is greatly increased, and the effect obtained by the packing manufacturing process is the same as that of the fifth embodiment, and thus a detailed description thereof will be omitted.

Example 7:

Referring to the contents of FIG. 8, FIG. 8 is Embodiment 7 of the present invention, the content of which is largely similar to that of Example 4, and the main difference is the loading of the entire manufacturing process 10 sequence of Embodiment 7 of the present invention. (11) in order to fully install the loading weight reinforcement plate 3 under the flexible loading plate 212, through the loading weight reinforcement plate (3) the flexible base material (2) may occur during the packing manufacturing process The problem of bending or bending, deformation, etc., is greatly reduced, and as a result, the packing 13 of the accurate chip 213 can proceed. In addition, after the chip substrate 21 completes the packing 13 order, the lowering 14 is further performed first, and the main purpose of the lowering operation is the loading weight reinforcing plate 3 below the flexible loading plate 212. In this way, when the flexible loading plate 212 proceeds with the laser 12, debris or other residues of the loading weight reinforcement plate 3 are not left to ensure the quality of the chip 213 operation. That is, it is possible to prevent a problem from occurring in the process of conducting the chip substrate 21 to the substrate (not shown in the drawing) without removing the debris or other residues of the loading weight reinforcing plate (3). In addition, it is possible to maintain the laser quality effectively and to increase the rate of the chip packing manufacturing process.

Example 8:

Referring to the contents of Fig. 9, Fig. 9 is an eighth embodiment of the present invention, the content of which is largely similar to that of the seventh embodiment, and the main difference is that the eighth embodiment of the present invention is loaded after the pre-manufacturing process 10 sequence. (11) In addition to fully connecting and installing the loading weight reinforcement plate 3 under the flexible loading plate 212 at the time of carrying out the procedure, at the same time loading on the outer rim frame 20 of the flexible base material 2. The installation of the weight reinforcement plate 3 is completely connected, and this also reduces the problems of bending, bending, and deformation that may occur during the manufacturing process of the flexible substrate 2 through the loading weight reinforcement plate 3. As a result, the packing manufacturing process of the correct chip 213 can be performed. The effects obtained in the packing manufacturing process are the same as those in the seventh embodiment, and a detailed description thereof will be omitted.

Example 9:

Referring to the contents of FIG. 10, referring to the contents of FIGS. 10 and 2 to 9 together, as can be seen from the drawing, the packing structure of the flexible substrate described in the ninth embodiment of the present invention is the flexible substrate described above. The cross-sectional view of the chip substrate 21 in the ready-made flexible substrate 2 in the packing manufacturing process of the present invention was used as a relatively excellent embodiment, wherein the chips 213 were connected to each other and connected to the leads 211 by a wire bonder method. Done.

The chip base 21 having the guide hole 2120 can continue bumping operation so that the chips 213 on the chip base 21 are bonded to the substrate through the solder ball 22 And are connected to each other to conduct.

Example 10:

Referring to FIG. 11, FIG. 11 is a tenth embodiment of the present invention, the contents of which are similar to those of the ninth embodiment, and the main difference is that the lead 211 on the chip base 21 described in the tenth embodiment The chip 213 may be connected to the leads 211 by using a plurality of metal wires 214 so that a plurality of conduction signals may be connected to the leads 210. [ Lt; / RTI >

In addition, in order to prevent a situation in which excessive heat is generated when the chip 213 operates, an induction hole 2100 is separately installed below the pad 210, and the fissure 24 is formed on the induction hole 2100. By installing the heat transfer through the sulcus 24, to dissipate the heat generated from the chip 213, it is possible to extend the service life of the chip 213.

Example 11:

12A and 12B, as can be seen from FIG. 12A, the packing structure of the flexible substrate described in Embodiment 11 of the present invention is mostly similar to Embodiments 9 and 10, A plurality of guide holes 2120 on the substrate 21 may be formed in a rectangular array shape in such a manner as to surround the periphery of the pad 210 and one end of each of the plurality of leads 211 may have a plurality of guide holes 2120 And the other end of the plurality of leads 211 is connected to the chip 213 to be conductive.

The chip is connected to a plurality of leads 211 and a pad 210 through a solder ball 216. The chip is electrically connected to a plurality of leads 211 through a solder ball 216, And are connected to a plurality of signals. The pad 210 and the plurality of leads 211 are connected to the first conductive material G0 and the second conductive material G1.

In order to maintain the excellent conductivity of the plurality of leads 211, if necessary, the surface of the chip base 21 around the outside of the chip 213 is subjected to brazing prevention application 25, The molding operation is performed using the thermosetting material 215.

In addition, in order to prevent a situation in which excessive heat is generated when the chip 213 is operated, an induction hole 2100 is separately installed below the pad 210 and a fissure 24 is installed on the induction hole 2100. In addition, heat is transferred through the fissures 24, the heat generated from the chip 213 may be dispersed, and the service life of the chip 213 may be extended.

In the eleventh embodiment of the present invention based on the above-described structure, the chip base 21 can proceed through a bumping operation through the guide hole 2120, whereby the chip 213 on the chip base 21, (Not shown in the drawing) through the through-hole 22.

Description of the Related Art
1 Packing manufacturing process of flexible substrate
10 Whole manufacturing process
11 Loading
12 laser
13 Packing
14 Unloading
2 soft substrate
20 Outer border frame
21 chip
210 Pad
2100 guide hole
211 Lead
212 ductile trial
2120 guide hole
213 chip
214 metal wire
215 Thermosetting materials
216 solder balls
22 Solder balls
23 metal protective layer
24 fins
25 Solder prevention application
3 Load weight reinforcing plate
4 lead substrate
40 electroplating layer
41 conductive material
42 ductile trial
A solder ball
B insulation layer
C adhesive layer
D cooling layer
E chip
F Thermosetting material
G conductive material
G0 first conductive material
G1 second conductive material

Claims (62)

The present invention relates to a packing manufacturing process of a flexible substrate, and includes a manufacturing process, a loading, a laser, a packing, and the like, among which the previous manufacturing process includes a thin film, It is formed into an outer border frame through a mask and an etching manufacturing process, and chip substrates formed in a plurality of rectangular arrays are formed in the outer border frame, wherein the chip substrate is formed of pads and a plurality of broken leads and PIs (Polyimide, PI). It is completed by connecting the upper and lower flexible stacking plates of each other), and the anti-soldering coating treatment can be applied on the upper side of the lead and the flexible stacking plate as needed, and the stacking operation is reinforced on the upper frame of the outer frame of the flexible substrate. The plate is connected and installed, and the laser work is carried out by laser drilling on the flexible loading plate, and then on the flexible loading plate. And guide holes connected to each other to form an induction hole, and on the flexible mounting plate, if necessary, an integer number of induction holes connected to and connected to the pad can be formed, among which leads and pad surfaces connected to and connected to each other are protected by metal. It is formed by plating the layer, the packing operation is to proceed the packing operation of the chip on the chip substrate, and then to manufacture a flexible substrate packing characterized in that the molding operation on the chip substrate with the chip using a thermosetting material fair. The process according to claim 1, wherein the soft substrate is a polyimide (PI). The method of claim 1, wherein the pad and the lead is formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is used copper foil, the second conductive material is copper, silver, nickel, It can be composed of a single combination or multiple combinations of palladium or gold, and the metal protective layer can be composed of a single combination or multiple combinations of copper, silver, nickel, palladium or gold. . The process according to claim 1, wherein the thermosetting material is epoxy, silicone or ceramics. The method of manufacturing a packing of a flexible base material according to claim 1, wherein the loading weight reinforcement plate can be simultaneously connected to and installed on the lower flexible loading plate corresponding to the outer rim frame when carrying out the loading sequence. The process for producing a packing of a flexible substrate according to claim 1, wherein the loaded weight reinforcing plate is made of a metal material. The method of claim 1, wherein the loading weight reinforcement plate is manufactured of a flexible substrate packing characterized in that a material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or PI (Polyimide, PI) can be used fair. The present invention relates to a packing manufacturing process of a flexible substrate, and includes a manufacturing process, a loading process, a laser, a packing process, and the like, wherein all the manufacturing processes include a thin film, It is formed into an outer rim frame through a mask and an etching manufacturing process, and chip substrates arranged in a plurality of rectangular arrays are formed in the outer rim frame, wherein the chip substrates are formed by pads and a plurality of broken leads and flexible loading plates. It is completed by connecting to each other, the lead and the flexible loading plate can be applied to the anti-soldering coating treatment as necessary, the loading operation is connected to the loading weight reinforcement plate installed on the outer edge frame of the flexible substrate, The laser work is performed by a laser drilling operation on the flexible mounting plate, the lead is connected to each other on the flexible mounting plate It is possible to form an induction hole for communicating, and to form an integral number of induction holes connected to and connected with the pads as needed on the flexible mounting plate, among which leads and pad surfaces connected to and in contact with the induction hole are plated with a metal protective layer. And the packing operation proceeds with the packing operation of the chip on the chip substrate, and then the molding operation is performed on the chip substrate with the chip using a thermosetting material. The process for producing a packing of a flexible substrate according to claim 8, wherein the flexible substrate is made of polyimide (PI). The method of claim 8, wherein the pad and the lead is formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is copper foil, the second conductive material is copper, silver, nickel, It can be composed of a single combination or multiple combinations of palladium or gold, and the metal protective layer can be composed of a single combination or multiple combinations of copper, silver, nickel, palladium or gold. . The process according to claim 8, wherein the thermosetting material is epoxy, silicone or ceramics. The method of manufacturing a packing of a flexible base material according to claim 8, wherein, when the loading sequence is performed, a loading weight reinforcement plate can be simultaneously connected to and installed on a lower flexible loading plate corresponding to the outer border frame. The process for manufacturing a packing of a flexible substrate according to claim 8, wherein the load weight reinforcing plate is made of a metal material. The method of claim 8, wherein the loading weight reinforcement plate is made of a flexible substrate packing, characterized in that a polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or PI (Polyimide, PI) or the like material can be used fair. The present invention relates to a packing manufacturing process of a flexible substrate, and includes a manufacturing process, a loading, a packing, a laser, and the like, among which the previous manufacturing process includes a thin film, It is formed into an outer rim frame through a mask and an etching manufacturing process, and chip substrates arranged in a plurality of rectangular arrays are formed in the outer rim frame, wherein the chip substrates are formed by pads and a plurality of broken leads and flexible loading plates. It is completed by connecting to each other, the lead and the flexible loading plate can be applied to the anti-soldering coating treatment as necessary, the loading operation is connected to the loading weight reinforcement plate installed on the outer edge frame of the flexible substrate, The packing operation is a packing operation of the chip on the chip substrate, and then the chip with the chip using a thermosetting material The molding operation is carried out on the material, and the laser operation is performed by laser drilling on the flexible mounting plate to form guide holes connected to and connected with the leads on the flexible loading plate, and on the flexible loading plate as needed. A process for producing a flexible substrate packing, characterized in that it forms an integral number of guide holes communicating with the pad. [16] The process of claim 15, wherein the flexible substrate is made of polyimide (PI). The method of claim 15, wherein the pad and the lead is formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is used copper foil, the second conductive material is copper, silver, nickel, A packing manufacturing process for a flexible substrate, which can be composed of a single combination or multiple combinations of palladium or gold. 16. The process of claim 15, wherein the thermosetting material is epoxy, silicone or ceramics. The process for manufacturing a flexible substrate packing according to claim 15, wherein, when the loading sequence is carried out, a loading weight reinforcement plate can be simultaneously connected to and installed on a lower flexible loading plate corresponding to the outer edge frame. 16. The process of claim 15, wherein the load weight reinforcing plate is made of a metal material. 16. The method of claim 15, wherein the loading weight reinforcement plate is manufactured of a flexible substrate packing characterized in that a material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or PI (Polyimide, PI) can be used fair. The present invention relates to a packing manufacturing process for a flexible substrate, and includes a manufacturing process, a loading, a packing, a laser, and the like, wherein all the above manufacturing processes include a thin film and a mask formed by connecting a flexible substrate mounted on top of and below a conductive material and a flexible loading plate. And forming an outer rim frame through an etching manufacturing process, and forming chip substrates arranged in a plurality of rectangular arrays in the outer rim frame, wherein the chip substrates have pads, a plurality of broken leads, and upper and lower flexible loading plates each other. It is completed by connecting, and can be applied to the anti-soldering coating on the lead and the flexible loading plate as needed, the loading operation is to install the load weight reinforcement plate connected to the lower flexible frame and the corresponding flexible loading plate. The packing operation is a packing operation of the chip on the chip substrate, and then the chip using a thermosetting material The molding operation is carried out on the chip substrate, and the laser operation is performed by laser drilling on the flexible mounting plate to form guide holes connected to and connected with the leads on the flexible mounting plate, and on the flexible mounting plate. And forming an integer number of induction holes connected to and connected to each other according to the pad. 23. The process of claim 22, wherein the flexible substrate is made of polyimide (PI). The method of claim 22, wherein the pad and the lead is formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is used copper foil, the second conductive material is copper, silver, nickel, A packing manufacturing process for a flexible substrate, which can be composed of a single combination or multiple combinations of palladium or gold. 23. The process of claim 22, wherein the thermosetting material is epoxy, silicone or ceramics. The process for manufacturing a flexible base material packing according to claim 22, wherein the loading weight reinforcement plate can be connected and installed at the same time above the outer border frame when the loading sequence is performed. The process for manufacturing a packing of a flexible substrate according to claim 22, wherein the load weight reinforcing plate is made of a metal material. 23. The method of claim 22, wherein the loading weight reinforcement plate is manufactured of a flexible substrate packing characterized in that a material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or polyimide (PI) such as PI can be used fair. The present invention relates to a packing manufacturing process of a flexible substrate, and includes a manufacturing process, loading, packing, unloading, laser, and the like, wherein all the manufacturing processes include a flexible substrate connected to upper and lower conductive materials and a flexible loading plate. It is formed into an outer border frame through a thin film, a mask, and an etching manufacturing process, and a chip substrate formed in a plurality of rectangular arrays is formed in the outer border frame, wherein the chip substrate includes a pad and a plurality of broken leads and a flexible mounting plate. The upper and lower sides are connected to each other, and the upper part of the lead and the flexible mounting plate can be subjected to a soldering prevention coating treatment as necessary, and the loading operation is to install and install the loading weight reinforcement plate under the flexible loading plate. The packing operation proceeds the packing operation of the chip on the chip substrate, followed by moulding on the chip substrate with the thermosetting material. The ding operation is performed, and the lowering operation removes the loading weight reinforcement plate under the flexible loading plate, and the laser operation is performed by laser drilling on the flexible loading plate to be connected with the lead on the flexible loading plate. Forming an induction hole, and forming an integer number of induction hole connected to the pad and connected with each other, if necessary, on the flexible mounting plate. The process according to claim 29, wherein the soft trial can use PI (Polyimide, PI). 30. The method of claim 29, wherein the pad and the lead are formed by vertically connecting the first conductive material and the second conductive material, the first conductive material is copper foil, and the second conductive material is copper, silver, nickel, A packing manufacturing process for a flexible substrate, which can be composed of a single combination or multiple combinations of palladium or gold. 30. The process of claim 29, wherein the thermosetting material is epoxy, silicone or ceramics. The process for manufacturing a flexible base material packing according to claim 29, wherein the loading weight reinforcement plate can be connected and installed at the same time above the outer border frame when the loading sequence is performed. The process of claim 29, wherein the load weight reinforcing plate is made of a metal material. 30. The method of claim 29, wherein the loading weight reinforcement plate is made of a flexible base material packing, characterized in that a polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or PI (Polyimide, PI), or the like material can be used fair. The present invention relates to a packing structure for a flexible substrate, which comprises connecting and forming a conductive substrate and a soft substrate above and below a conductive substrate, forming an outer frame on the flexible substrate, forming a chip substrate arranged in a plurality of rectangular arrays in the outer frame, Wherein the chip base is constituted by connecting a pad and a plurality of mutually interlocked leads and a flexible plate, and connecting a load weight reinforcing plate to the outer frame of the flexible substrate, Characterized in that a chip is formed on a pad and a thermosetting material is disposed on the chip base on which the chip is formed, characterized in that the chip is formed with an induction hole communicating with the lead, Of the packing structure. 37. The packing structure of a soft substrate as claimed in claim 36, wherein the flexible substrate is made of polyimide (PI). The method of claim 36, wherein the pad and the lead is formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is copper foil, the second conductive material is copper, silver, nickel, A packing structure of a flexible substrate, which can be composed of a single combination or multiple combinations of palladium or gold. 37. The packing structure of claim 36, wherein the thermoset material is epoxy, silicone or ceramics. 37. The packing structure of a flexible substrate according to claim 36, wherein the load weight reinforcing plate is made of a metal material. 37. The flexible structure of claim 36, wherein the loaded weight reinforcing plate may use a material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide (PI), or PI. . 37. The flexible substrate according to claim 36, wherein a metal protective layer can be plated on the surfaces of the leads and lead pads connected to the induction holes by a single combination or multiple combinations of copper, silver, nickel, palladium or gold Of the packing structure. 37. The packing structure of claim 36, wherein the chip is electrically connected to the leads through a metal wire. 37. The packing structure of claim 36, wherein the chip is electrically connected to the lead via a solder ball. A packing structure of a flexible substrate, the flexible material is formed by connecting a flexible substrate on the upper and lower conductive materials and the flexible mounting plate, the flexible substrate to form an outer border frame, chip substrate arranged in a plurality of rectangular arrays formed in the outer border frame The chip substrate is configured by connecting pads and a plurality of broken leads and flexible loading plates up and down to each other, and installing a loading weight reinforcement plate on a flexible loading plate below the outer border frame, wherein the flexible loading plate In the trial, the induction hole connected to each other and connected to the lead is formed with an integer number of induction holes connected to each other, the chip is formed on the pad, the chip substrate on which the chip is formed, characterized in that the thermosetting material is covered Packing structure of flexible substrate. 46. The packing structure of a flexible substrate according to claim 45, wherein the soft substrate is made of polyimide (PI). 46. The method of claim 45, wherein the pad and the lead is formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is copper foil, the second conductive material is copper, silver, nickel, A packing structure of a flexible substrate, which can be composed of a single combination or multiple combinations of palladium or gold. 46. The packing structure of claim 45, wherein the thermosetting material is epoxy, silicone or ceramics. 46. The packing structure of a flexible substrate according to claim 45, wherein the load weight reinforcing plate is made of a metal material. 46. The flexible structure of claim 45, wherein the loaded weight reinforcing plate may be made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), or PI. . 46. The flexible substrate according to claim 45, wherein a metal protective layer can be plated on the surfaces of the lead and lead pads connected to the induction hole by a single combination or multiple combinations of copper, silver, nickel, palladium or gold Of the packing structure. 46. The packing structure of claim 45, wherein the chip is electrically connected to the leads through a metal wire. 46. The packing structure of claim 45, wherein the chip is electrically connected to the leads through a solder ball. The present invention relates to a packing structure for a flexible substrate, which comprises connecting and forming a conductive substrate and a soft substrate above and below a conductive substrate, forming an outer frame on the flexible substrate, forming a chip substrate arranged in a plurality of rectangular arrays in the outer frame, Wherein the chip substrate is formed by connecting a pad and a plurality of mutually interlocked leads and a lower and a lower flexible substrate, and a flexible substrate corresponding to the upper frame of the soft substrate and the lower frame of the outer frame, And a plurality of induction holes communicating with the leads and an induction hole communicating with the induction holes and the pad are formed in the flexible plate, wherein a chip is formed on the pad, Characterized in that a thermosetting material is disposed on the substrate The packing structure. 55. The packing structure of a flexible substrate according to claim 54, wherein the soft substrate is made of polyimide (PI). 55. The method of claim 54, wherein the pad and the lead are formed by connecting the first conductive material and the second conductive material up and down, the first conductive material is copper foil, and the second conductive material is copper, silver, nickel, A packing structure of a flexible substrate, which can be composed of a single combination or multiple combinations of palladium or gold. 55. The packing structure of claim 54, wherein the thermosetting material is epoxy, silicone or ceramics. 56. The packing structure of a flexible substrate according to claim 54, wherein the loading weight reinforcing plate is made of a metal material. 55. The flexible structure of claim 54, wherein the loaded weight reinforcing plate may be made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), or PI. . 54. The flexible substrate according to claim 54, wherein a metal protective layer can be plated on the surfaces of the lead and lead pads connected to the induction hole by a single combination or multiple combinations of copper, silver, nickel, palladium or gold Of the packing structure. 55. The packing structure of claim 54, wherein the chip is electrically connected to the leads through a metal wire. 55. The packing structure of claim 54, wherein the chip is electrically connected to the lead via a solder ball.

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