TWI470841B - - Google Patents

Info

Publication number
TWI470841B
TWI470841B TW101116665A TW101116665A TWI470841B TW I470841 B TWI470841 B TW I470841B TW 101116665 A TW101116665 A TW 101116665A TW 101116665 A TW101116665 A TW 101116665A TW I470841 B TWI470841 B TW I470841B
Authority
TW
Taiwan
Application number
TW101116665A
Other languages
Chinese (zh)
Other versions
TW201347244A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101116665A priority Critical patent/TW201347244A/zh
Priority to JP2012223119A priority patent/JP2013236047A/ja
Priority to KR1020120114027A priority patent/KR101401919B1/ko
Priority to DE202013100293U priority patent/DE202013100293U1/de
Priority to DE201310100611 priority patent/DE102013100611A1/de
Priority to MYUI2013700153A priority patent/MY164690A/en
Publication of TW201347244A publication Critical patent/TW201347244A/zh
Application granted granted Critical
Publication of TWI470841B publication Critical patent/TWI470841B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW101116665A 2012-05-10 2012-05-10 一體化高效率多層式照明裝置 TW201347244A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW101116665A TW201347244A (zh) 2012-05-10 2012-05-10 一體化高效率多層式照明裝置
JP2012223119A JP2013236047A (ja) 2012-05-10 2012-10-05 一体化高効率多層式照明装置
KR1020120114027A KR101401919B1 (ko) 2012-05-10 2012-10-15 일체화 고효율 다층식 조명장치
DE202013100293U DE202013100293U1 (de) 2012-05-10 2013-01-22 Intergral ausgebildete hocheffiziente mehrschichtige lichtemittierende Vorrichtung
DE201310100611 DE102013100611A1 (de) 2012-05-10 2013-01-22 Integral ausgebildete hocheffiziente mehrschichtige lichtemittierende Vorrichtung
MYUI2013700153A MY164690A (en) 2012-05-10 2013-01-25 Integrally formed high-efficient multi-layer light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101116665A TW201347244A (zh) 2012-05-10 2012-05-10 一體化高效率多層式照明裝置

Publications (2)

Publication Number Publication Date
TW201347244A TW201347244A (zh) 2013-11-16
TWI470841B true TWI470841B (enExample) 2015-01-21

Family

ID=48084865

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101116665A TW201347244A (zh) 2012-05-10 2012-05-10 一體化高效率多層式照明裝置

Country Status (5)

Country Link
JP (1) JP2013236047A (enExample)
KR (1) KR101401919B1 (enExample)
DE (2) DE202013100293U1 (enExample)
MY (1) MY164690A (enExample)
TW (1) TW201347244A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6115826B2 (ja) * 2013-11-26 2017-04-19 東芝ライテック株式会社 移動体用照明装置
JP6467206B2 (ja) * 2014-01-28 2019-02-06 株式会社小糸製作所 光源ユニット
CN103899955A (zh) * 2014-03-14 2014-07-02 魏百远 一种高效散热的led模组结构
CN115604982B (zh) * 2022-09-09 2025-07-22 英业达科技有限公司 液冷板装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200725940A (en) * 2005-12-29 2007-07-01 Anteya Technology Corp LED package structure
JP2009528695A (ja) * 2006-03-03 2009-08-06 エルジー イノテック カンパニー リミテッド 発光ダイオードパッケージ及びその製造方法
TWM409367U (en) * 2011-01-28 2011-08-11 Fin Core Corp Heat-dissipation module and LED lamp having heat-dissipation module
TWM422041U (en) * 2011-09-16 2012-02-01 Zi-Hua Chen High-power lightweight LED bulb
TWM424620U (en) * 2011-08-03 2012-03-11 Gem Weltronics Twn Corp Multi-layer array type LED light engine structure improvement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311471A (ja) * 2007-06-15 2008-12-25 Toyoda Gosei Co Ltd 発光装置
KR100705011B1 (ko) 2005-08-31 2007-04-13 바이오닉스(주) 발광 장치
KR100714749B1 (ko) 2006-03-21 2007-05-04 삼성전자주식회사 발광 소자 패키지 모듈 및 이의 제조 방법
KR101048440B1 (ko) 2010-04-29 2011-07-11 금호전기주식회사 Ｌｅｄ모듈 가변 장착형 방열판 및 이를 이용한 조명 장치
JP3162599U (ja) * 2010-06-25 2010-09-09 李家茂 リング状パッケージ構造
KR101054305B1 (ko) 2010-12-30 2011-08-08 금강전기 (주) Ｌｅｄ 조명장치 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200725940A (en) * 2005-12-29 2007-07-01 Anteya Technology Corp LED package structure
JP2009528695A (ja) * 2006-03-03 2009-08-06 エルジー イノテック カンパニー リミテッド 発光ダイオードパッケージ及びその製造方法
TWM409367U (en) * 2011-01-28 2011-08-11 Fin Core Corp Heat-dissipation module and LED lamp having heat-dissipation module
TWM424620U (en) * 2011-08-03 2012-03-11 Gem Weltronics Twn Corp Multi-layer array type LED light engine structure improvement
TWM422041U (en) * 2011-09-16 2012-02-01 Zi-Hua Chen High-power lightweight LED bulb

Also Published As

Publication number Publication date
KR20130126434A (ko) 2013-11-20
MY164690A (en) 2018-01-30
TW201347244A (zh) 2013-11-16
DE102013100611A1 (de) 2013-11-14
KR101401919B1 (ko) 2014-06-27
DE202013100293U1 (de) 2013-03-11
JP2013236047A (ja) 2013-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees