TWI467190B - - Google Patents

Info

Publication number
TWI467190B
TWI467190B TW100125996A TW100125996A TWI467190B TW I467190 B TWI467190 B TW I467190B TW 100125996 A TW100125996 A TW 100125996A TW 100125996 A TW100125996 A TW 100125996A TW I467190 B TWI467190 B TW I467190B
Authority
TW
Taiwan
Application number
TW100125996A
Other languages
Chinese (zh)
Other versions
TW201305574A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100125996A priority Critical patent/TW201305574A/zh
Priority to CN201210247223.9A priority patent/CN102890168B/zh
Priority to US13/554,528 priority patent/US8816713B2/en
Publication of TW201305574A publication Critical patent/TW201305574A/zh
Application granted granted Critical
Publication of TWI467190B publication Critical patent/TWI467190B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW100125996A 2011-07-22 2011-07-22 高頻訊號路徑調整方式及其測試裝置 TW201305574A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW100125996A TW201305574A (zh) 2011-07-22 2011-07-22 高頻訊號路徑調整方式及其測試裝置
CN201210247223.9A CN102890168B (zh) 2011-07-22 2012-07-17 高频讯号路径调整方式及其测试装置
US13/554,528 US8816713B2 (en) 2011-07-22 2012-07-20 Probe card having adjustable high frequency signal transmission path for transmission of high frequency signal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100125996A TW201305574A (zh) 2011-07-22 2011-07-22 高頻訊號路徑調整方式及其測試裝置

Publications (2)

Publication Number Publication Date
TW201305574A TW201305574A (zh) 2013-02-01
TWI467190B true TWI467190B (https=) 2015-01-01

Family

ID=47533733

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100125996A TW201305574A (zh) 2011-07-22 2011-07-22 高頻訊號路徑調整方式及其測試裝置

Country Status (3)

Country Link
US (1) US8816713B2 (https=)
CN (1) CN102890168B (https=)
TW (1) TW201305574A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750683B (zh) * 2020-06-02 2021-12-21 緯穎科技服務股份有限公司 訊號測試裝置以及訊號測試方法
TWI835608B (zh) * 2022-04-22 2024-03-11 大陸商迪科特測試科技(蘇州)有限公司 探針裝置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114660435A (zh) * 2013-10-12 2022-06-24 深圳市爱德特科技有限公司 一种基于fpga的测试装置
US10406420B2 (en) * 2015-04-29 2019-09-10 More Useless Tools, Inc. Portable lighting apparatus and carrying rack
CN106935524B (zh) 2015-12-24 2020-04-21 台湾积体电路制造股份有限公司 探针卡和晶圆测试系统及晶圆测试方法
CN106053895A (zh) * 2016-07-22 2016-10-26 苏州韬盛电子科技有限公司 一种用于50GHz高频的检测装置及其检测方法
TWI620940B (zh) * 2016-11-14 2018-04-11 旺矽科技股份有限公司 探針卡及其多重訊號傳輸板
TWI612312B (zh) * 2017-05-03 2018-01-21 創意電子股份有限公司 探針卡系統、探針載體裝置及探針載體裝置之製法
CN108802443B (zh) * 2017-05-03 2021-03-12 创意电子股份有限公司 探针卡系统、探针载体装置及探针载体装置的制法
CN107765164A (zh) * 2017-09-28 2018-03-06 国营芜湖机械厂 一种电路板高频信号调整方法
TWI647457B (zh) 2017-10-23 2019-01-11 旺矽科技股份有限公司 探針卡及訊號路徑切換模組總成
US10914756B2 (en) * 2018-08-14 2021-02-09 Keysight Technologies, Inc. Miniature test probe
TWI705255B (zh) * 2019-09-20 2020-09-21 中華精測科技股份有限公司 用於檢測晶片的測試裝置
CN112788865A (zh) * 2019-11-08 2021-05-11 相互股份有限公司 用于组装测试复合基板的装置及方法
TWI788970B (zh) * 2020-10-14 2023-01-01 旺矽科技股份有限公司 整合不同電性測試之探針卡
CN114295931B (zh) * 2021-11-19 2023-07-14 广东电力通信科技有限公司 一种新型电力物联网配电网数据实时测量装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI312867B (https=) * 2007-01-15 2009-08-01 Microelectonics Technology Inc
US7782070B2 (en) * 2007-06-05 2010-08-24 Mjc Probe Incorporated Probing device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1784843A (zh) * 2003-05-07 2006-06-07 皇家飞利浦电子股份有限公司 通信系统
KR100945369B1 (ko) * 2003-06-30 2010-03-08 엘지디스플레이 주식회사 표시기기의 검사장치 및 그 검사방법
TWI244169B (en) 2004-05-12 2005-11-21 Siliconware Precision Industries Co Ltd High electric performance semiconductor package
TW200804822A (en) 2006-07-06 2008-01-16 Microelectonics Technology Inc High-frequency probe card and transmission line for high-frequency probe card
CN101266262B (zh) * 2007-03-13 2010-09-01 旺矽科技股份有限公司 高速测试卡
CN101526553A (zh) * 2008-03-07 2009-09-09 旺矽科技股份有限公司 探针卡
TWM361631U (en) 2009-03-26 2009-07-21 Mpi Corp Cantilever probe card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI312867B (https=) * 2007-01-15 2009-08-01 Microelectonics Technology Inc
US7782070B2 (en) * 2007-06-05 2010-08-24 Mjc Probe Incorporated Probing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750683B (zh) * 2020-06-02 2021-12-21 緯穎科技服務股份有限公司 訊號測試裝置以及訊號測試方法
TWI835608B (zh) * 2022-04-22 2024-03-11 大陸商迪科特測試科技(蘇州)有限公司 探針裝置

Also Published As

Publication number Publication date
US8816713B2 (en) 2014-08-26
US20130021053A1 (en) 2013-01-24
CN102890168A (zh) 2013-01-23
TW201305574A (zh) 2013-02-01
CN102890168B (zh) 2015-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees