TWI464818B - 利用光學量測及感測器裝置之蝕刻製程控制 - Google Patents

利用光學量測及感測器裝置之蝕刻製程控制 Download PDF

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Publication number
TWI464818B
TWI464818B TW101105282A TW101105282A TWI464818B TW I464818 B TWI464818 B TW I464818B TW 101105282 A TW101105282 A TW 101105282A TW 101105282 A TW101105282 A TW 101105282A TW I464818 B TWI464818 B TW I464818B
Authority
TW
Taiwan
Prior art keywords
etch
measurement
etch phase
etching
optical
Prior art date
Application number
TW101105282A
Other languages
English (en)
Chinese (zh)
Other versions
TW201241949A (en
Inventor
Xinkang Tian
Manuel B Madriaga
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201241949A publication Critical patent/TW201241949A/zh
Application granted granted Critical
Publication of TWI464818B publication Critical patent/TWI464818B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW101105282A 2011-02-17 2012-02-17 利用光學量測及感測器裝置之蝕刻製程控制 TWI464818B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/029,349 US8193007B1 (en) 2011-02-17 2011-02-17 Etch process control using optical metrology and sensor devices

Publications (2)

Publication Number Publication Date
TW201241949A TW201241949A (en) 2012-10-16
TWI464818B true TWI464818B (zh) 2014-12-11

Family

ID=46148020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101105282A TWI464818B (zh) 2011-02-17 2012-02-17 利用光學量測及感測器裝置之蝕刻製程控制

Country Status (5)

Country Link
US (1) US8193007B1 (enrdf_load_stackoverflow)
JP (1) JP6019043B2 (enrdf_load_stackoverflow)
KR (2) KR20140006039A (enrdf_load_stackoverflow)
TW (1) TWI464818B (enrdf_load_stackoverflow)
WO (1) WO2012112959A1 (enrdf_load_stackoverflow)

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US8445296B2 (en) * 2011-07-22 2013-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for end point determination in reactive ion etching
US9287097B2 (en) * 2011-11-30 2016-03-15 Sony Corporation Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing process
US9875946B2 (en) 2013-04-19 2018-01-23 Kla-Tencor Corporation On-device metrology
KR102242414B1 (ko) 2013-10-02 2021-04-21 에이에스엠엘 네델란즈 비.브이. 산업 공정과 관련된 진단 정보를 얻는 방법 및 장치
US10217681B1 (en) * 2014-08-06 2019-02-26 American Air Liquide, Inc. Gases for low damage selective silicon nitride etching
US20160240366A1 (en) * 2015-02-17 2016-08-18 Infineon Technologies Ag Processing of Semiconductor Devices
US10386829B2 (en) * 2015-09-18 2019-08-20 Kla-Tencor Corporation Systems and methods for controlling an etch process
US10192763B2 (en) * 2015-10-05 2019-01-29 Applied Materials, Inc. Methodology for chamber performance matching for semiconductor equipment
US10372114B2 (en) * 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
DE112017007219B4 (de) * 2017-03-10 2022-09-29 Mitsubishi Electric Corporation Einrichtung zur Halbleiterherstellung und Verfahren zur Halbleiterherstellung
US10784174B2 (en) * 2017-10-13 2020-09-22 Lam Research Corporation Method and apparatus for determining etch process parameters
US11164768B2 (en) * 2018-04-27 2021-11-02 Kla Corporation Process-induced displacement characterization during semiconductor production
JP2020181959A (ja) 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
JP7413081B2 (ja) * 2020-02-28 2024-01-15 東京エレクトロン株式会社 基板処理システム
GB202010471D0 (en) * 2020-07-08 2020-08-19 Univ Exeter Control of processing equipment
US20230163001A1 (en) * 2021-11-23 2023-05-25 Applied Materials, Inc. Method to eliminate first wafer effects on semiconductor process chambers
US12400888B2 (en) * 2022-03-31 2025-08-26 Tokyo Electron Limited Data fusion of multiple sensors
CN120019479A (zh) * 2023-09-14 2025-05-16 株式会社日立高新技术 等离子处理装置以及等离子处理方法

Citations (4)

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US20070225851A1 (en) * 2004-07-08 2007-09-27 Timbre Technologies, Inc. Optical metrology model optimization for process control
US20080074658A1 (en) * 2003-12-23 2008-03-27 Davis Matthew F Method and apparatus for performing limited area spectral analysis
US20080170242A1 (en) * 2007-01-12 2008-07-17 Tokyo Electron Limited Determining one or more profile parameters of a structure using optical metrology and a correlation between profile models and key profile shape variables
US20090248341A1 (en) * 2008-03-27 2009-10-01 Tokyo Electron Limited Process control using an optical metrology system optimized with signal criteria

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US5288367A (en) 1993-02-01 1994-02-22 International Business Machines Corporation End-point detection
US5658423A (en) 1995-11-27 1997-08-19 International Business Machines Corporation Monitoring and controlling plasma processes via optical emission using principal component analysis
US5862060A (en) 1996-11-22 1999-01-19 Uop Llc Maintenance of process control by statistical analysis of product optical spectrum
US6943900B2 (en) 2000-09-15 2005-09-13 Timbre Technologies, Inc. Generation of a library of periodic grating diffraction signals
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US7216045B2 (en) 2002-06-03 2007-05-08 Timbre Technologies, Inc. Selection of wavelengths for integrated circuit optical metrology
US6979578B2 (en) 2002-08-13 2005-12-27 Lam Research Corporation Process endpoint detection method using broadband reflectometry
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KR20060005830A (ko) 2004-07-14 2006-01-18 삼성전자주식회사 통합 슬롯이 탑재된 인쇄 회로 기판
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US20080074658A1 (en) * 2003-12-23 2008-03-27 Davis Matthew F Method and apparatus for performing limited area spectral analysis
US20070225851A1 (en) * 2004-07-08 2007-09-27 Timbre Technologies, Inc. Optical metrology model optimization for process control
US20080170242A1 (en) * 2007-01-12 2008-07-17 Tokyo Electron Limited Determining one or more profile parameters of a structure using optical metrology and a correlation between profile models and key profile shape variables
US20090248341A1 (en) * 2008-03-27 2009-10-01 Tokyo Electron Limited Process control using an optical metrology system optimized with signal criteria

Also Published As

Publication number Publication date
KR20140006039A (ko) 2014-01-15
JP6019043B2 (ja) 2016-11-02
US8193007B1 (en) 2012-06-05
JP2014514727A (ja) 2014-06-19
KR20170107094A (ko) 2017-09-22
WO2012112959A1 (en) 2012-08-23
TW201241949A (en) 2012-10-16

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