TWI456341B - 大型護膜用框體及大型護膜 - Google Patents

大型護膜用框體及大型護膜 Download PDF

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Publication number
TWI456341B
TWI456341B TW100108220A TW100108220A TWI456341B TW I456341 B TWI456341 B TW I456341B TW 100108220 A TW100108220 A TW 100108220A TW 100108220 A TW100108220 A TW 100108220A TW I456341 B TWI456341 B TW I456341B
Authority
TW
Taiwan
Prior art keywords
protective film
frame
joined
sized
joint
Prior art date
Application number
TW100108220A
Other languages
English (en)
Other versions
TW201135351A (en
Inventor
Shintaro Kitajima
Noriko Tani
Hiroji Matsue
Yukiya Yamanaka
Seiji Iwakura
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010053520A external-priority patent/JP5619436B2/ja
Priority claimed from JP2010196230A external-priority patent/JP5653691B2/ja
Priority claimed from JP2010196223A external-priority patent/JP5653690B2/ja
Priority claimed from JP2010196228A external-priority patent/JP5731147B2/ja
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201135351A publication Critical patent/TW201135351A/zh
Application granted granted Critical
Publication of TWI456341B publication Critical patent/TWI456341B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor

Claims (9)

  1. 一種大型護膜用框體，其特徵在於：其係具備俯視下為矩形狀之開口部者，且上述開口部之面積為1000cm2 以上、35000cm2 以下，形成上述開口部之周緣之框部沿著該框部之軸方向具有3個部位以上之接合部，上述接合部之接合強度為10kgf以上。
  2. 如請求項1之大型護膜用框體，其中於上述大型護膜用框體之角部具有上述接合部。
  3. 如請求項1或2之大型護膜用框體，其中上述框部包含選自由鋁及鋁合金所組成之群中之至少一種金屬構件，且於上述大型護膜用框體之軸方向剖面之XRD測定結果中，(111)面之峰值強度/(200)面之峰值強度之比率為1.0以下。
  4. 如請求項3之大型護膜用框體，其中於上述大型護膜用框體之軸方向剖面之XRD測定結果中，(111)面之峰值強度/(200)面之峰值強度之比率為0.8以下。
  5. 如請求項1或2之大型護膜用框體，其中於在上述接合部所接合之一個構件之端部設置有向所接合之另一個構件突出之至少一個凸部，於上述另一個構件之端部設置有使上述凸部嵌合之凹部，且藉由將上述凸部嵌合於上述凹部中而使上述一個構件之端部接合於上述另一個構件之端部。
  6. 如請求項3之大型護膜用框體，其中於在上述接合部所 接合之一個構件之端部設置有向所接合之另一個構件突出之至少一個凸部，於上述另一個構件之端部設置有使上述凸部嵌合之凹部，且藉由將上述凸部嵌合於上述凹部中而使上述一個構件之端部接合於上述另一個構件之端部。
  7. 如請求項1或2之大型護膜用框體，其中上述接合部係所接合之上述構件之端部彼此藉由化學反應型之接著劑接合而形成。
  8. 如請求項7之大型護膜用框體，其中上述化學反應型之接著劑包含選自由丙烯酸系接著劑及環氧系接著劑所組成之群中之至少一種接著劑。
  9. 一種大型護膜，其包括：如請求項1至8中任一項之大型護膜用框體、以及以覆蓋上述開口部之方式展開支撐於該大型護膜用框體上之大型表膜。
TW100108220A 2010-03-10 2011-03-10 大型護膜用框體及大型護膜 TWI456341B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010053520A JP5619436B2 (ja) 2010-03-10 2010-03-10 大型ペリクル用枠体、及び大型ペリクル
JP2010196230A JP5653691B2 (ja) 2010-09-01 2010-09-01 ペリクル枠体及びペリクル
JP2010196223A JP5653690B2 (ja) 2010-09-01 2010-09-01 ペリクル用枠体及びペリクル
JP2010196228A JP5731147B2 (ja) 2010-09-01 2010-09-01 ペリクル用枠体及びペリクル

Publications (2)

Publication Number Publication Date
TW201135351A TW201135351A (en) 2011-10-16
TWI456341B true TWI456341B (zh) 2014-10-11

Family

ID=44563599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108220A TWI456341B (zh) 2010-03-10 2011-03-10 大型護膜用框體及大型護膜

Country Status (4)

Country Link
KR (1) KR101392645B1 (zh)
CN (2) CN108490734A (zh)
TW (1) TWI456341B (zh)
WO (1) WO2011111801A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6008784B2 (ja) * 2013-04-15 2016-10-19 信越化学工業株式会社 ペリクルフレーム及びその製作方法とペリクル
KR101603788B1 (ko) 2014-05-23 2016-03-15 주식회사 에프에스티 대형 포토마스크용 펠리클
JP6423730B2 (ja) * 2014-05-26 2018-11-14 三井化学株式会社 ペリクル用の支持枠
JP6461659B2 (ja) * 2015-03-19 2019-01-30 旭化成株式会社 ペリクル枠体及びペリクル
KR102186010B1 (ko) 2016-01-26 2020-12-04 한양대학교 산학협력단 Euv 펠리클 구조체, 및 그 제조 방법
JP6607574B2 (ja) * 2016-08-24 2019-11-20 信越化学工業株式会社 ペリクルフレーム及びペリクル
JP6899759B2 (ja) * 2017-12-12 2021-07-07 日本軽金属株式会社 Ｆｐｄ（フラットパネルディスプレイ）用ペリクル枠体及びその製造方法
JP7012157B2 (ja) * 2018-06-20 2022-01-27 株式会社アルバック 防着部材及び真空処理装置
TWI670562B (zh) * 2018-06-21 2019-09-01 美商微相科技股份有限公司 光罩保護組件結構

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004354720A (ja) * 2003-05-29 2004-12-16 Semiconductor Leading Edge Technologies Inc マスク用ペリクル
JP2006284927A (ja) * 2005-03-31 2006-10-19 Nippon Light Metal Co Ltd ペリクル、支持枠、枠体および枠体の製造方法
TW200709274A (en) * 2005-05-19 2007-03-01 Shinetsu Chemical Co Pellicle for photolithography and method of manufacturing the same
JP2008083618A (ja) * 2006-09-29 2008-04-10 Asahi Kasei Electronics Co Ltd ペリクル収納容器の補強材
US20090029268A1 (en) * 2007-07-24 2009-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle stress relief

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001312048A (ja) * 2000-04-28 2001-11-09 Mitsui Chemicals Inc ペリクル
JP2002202589A (ja) * 2000-12-27 2002-07-19 Mitsui Chemicals Inc ペリクル
US7110195B2 (en) * 2004-04-28 2006-09-19 International Business Machines Corporation Monolithic hard pellicle
KR20070087967A (ko) * 2006-02-24 2007-08-29 강준모 펠리클 프레임
JP2009063740A (ja) * 2007-09-05 2009-03-26 Shin Etsu Chem Co Ltd ペリクルフレーム
JP5051840B2 (ja) * 2007-11-22 2012-10-17 信越化学工業株式会社 ペリクル収納容器内にペリクルを保管する方法
CN201199755Y (zh) * 2008-03-17 2009-02-25 苏峰平 液晶面板框架结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004354720A (ja) * 2003-05-29 2004-12-16 Semiconductor Leading Edge Technologies Inc マスク用ペリクル
JP2006284927A (ja) * 2005-03-31 2006-10-19 Nippon Light Metal Co Ltd ペリクル、支持枠、枠体および枠体の製造方法
TW200709274A (en) * 2005-05-19 2007-03-01 Shinetsu Chemical Co Pellicle for photolithography and method of manufacturing the same
JP2008083618A (ja) * 2006-09-29 2008-04-10 Asahi Kasei Electronics Co Ltd ペリクル収納容器の補強材
US20090029268A1 (en) * 2007-07-24 2009-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle stress relief

Also Published As

Publication number Publication date
CN108490734A (zh) 2018-09-04
WO2011111801A1 (ja) 2011-09-15
CN102782576A (zh) 2012-11-14
KR101392645B1 (ko) 2014-05-07
TW201135351A (en) 2011-10-16
KR20120128654A (ko) 2012-11-27

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