TWI455376B - Method for producing electro-thermal separation type light emitting diode support structure - Google Patents

Description

Electrothermal separation type light-emitting diode support structure manufacturing method

A method for fabricating a light-emitting diode support structure, in particular, a heat sink plate coupled to a support plate to form at least two heat dissipation bases and at least two sets of conductive supports, or a thick plate to form at least two heat dissipation bases and at least two groups The conductive support enables the electrothermal split type light-emitting diode support structure of the different types of light-emitting diode chips to be respectively disposed on the heat-dissipating base.

In recent years, Light Emitting Diode (LED) has the advantages of low power consumption, long component life, no need for warm-up time and fast response speed, and its small size, vibration resistance, and mass production. Light-emitting diodes have been commonly used in indicator lights and display devices for information, communication and consumer electronics, such as mobile phones and personal digital assistant (PDA) screen backlights, various outdoor displays, traffic lights And lights, etc.

Generally, the LED chip is fixed to a bracket having a recessed portion through a surface mount device (SMD) or a flip chip bonding. Please refer to "FIG. 1". As shown, "FIG. 1" is a side cross-sectional view showing a configuration of a light-emitting diode package of the first conventional light-emitting diode support structure.

In the rubber seat 81 having the recessed portion 82, at least two brackets 83 are embedded, and the portions of the brackets 83 are respectively exposed in the recessed portions 82 of the rubber seat 81, and the respective brackets 83 are respectively extended from both sides of the rubber seat 81. The electrical connection portion 84 is formed to be electrically connected to other electronic devices (not shown).

Then, the LED chip 85 is fixed to one of the brackets 83 exposed in the recessed portion 82 of the rubber seat 81 through surface bonding technology, and the LED chip is bonded by a wire bonding technique or a flip chip bonding technique. 85 can be electrically connected to the other bracket 83 through the electrical conductor 86. Finally, the encapsulant 87 is formed on the recess 82 of the rubber seat 81. The encapsulant 87 can cover the LED in the recess 82. Wafer 85 and bracket 83.

However, in the above-described light emitting diode support structure, the heat dissipation of the light emitting diode chip 85 is to provide heat dissipation to the light emitting diode chip 85 through the bracket 83 fixed to the light emitting diode chip 85, and the bracket 83 provides illumination. The multiple functions of the electrical connection of the diode chip 85, which results in insufficient heat dissipation efficiency of the holder 83 to the LED array 85, is therefore not applicable to the high power LED array 85.

Therefore, an electrothermal split type light-emitting diode support structure is proposed, and please refer to FIG. 2, and FIG. 2 is a second known light-emitting diode structure of the light-emitting diode support structure. A schematic view of the bulk wafer configuration.

In the rubber seat 81 having the recessed portion 82, a heat dissipation base 88 and at least two brackets 83 are embedded, and the heat dissipation base 88 and the respective bracket 83 portions are respectively exposed in the recessed portions 82 of the rubber seat 81, and the respective brackets 83 are provided. The electrical connection portion 84 is formed by the electrical connection portion 84 to be electrically connected to other electronic devices (not shown).

Then, the light-emitting diode chip 85 is fixed to the heat-dissipating pedestal 88 exposed in the recessed portion 82 of the rubber seat 81 through a surface-adhesive technique, and the light-emitting diode chip 85 is bonded through a wire bonding technique or a flip chip bonding technique. The electrical connection 86 can be electrically connected to the bracket 83. Finally, the encapsulant 87 is formed on the recess 82 of the plastic holder 81. The encapsulant 87 can cover the LED assembly 85 in the recess 82. The heat sink base 88 and the bracket 83.

The heat dissipation pedestal 88 and the bracket 83 are respectively embedded in the rubber seat 81 through the above-mentioned light-emitting diode support structure, so that the heat dissipation and the electrical connection separation design of the light-emitting diode chip 85 can be effectively performed, that is, in the rubber seat 81. The embedded heat dissipation base 88 is for providing heat dissipation of the LED chip 85, and the bracket 83 embedded in the rubber holder 81 is for providing electrical connection of the LED chip 85, which can be improved. The heat dissipation efficiency of the light-emitting diode chip 85 solves the problems caused by the first conventional light-emitting diode support structure.

However, since the conventional second-sized light-emitting diode support structure has only one heat-dissipating pedestal 88 embedded in the rubber seat 81, when a plurality of light-emitting diode chips 85 are disposed on the heat-dissipating base 88, the same use is required. A light-emitting diode chip 85 of a type (PNP type or NPN type) needs to use a positive-negative type, that is, the same light-emitting diode chip 85, so that a plurality of light-emitting diode chips 85 can be disposed on the heat-dissipating base 88. In the above, the use of the LED array 85 and the electrical connection are limited.

In summary, it has been known in the prior art that when a plurality of light-emitting diode chips are disposed on a heat-dissipating susceptor for a long time, it is necessary to use the same type of light-emitting diode wafer, so that the use of the light-emitting diode chip is limited. Therefore, it is necessary to propose improved technical means to solve this problem.

In view of the prior art, when a plurality of light-emitting diode chips are disposed on a heat dissipation base, it is necessary to use the same type of light-emitting diode wafer to limit the use of the light-emitting diode wafer. The present invention discloses an electrothermal separation type. A method for fabricating a light-emitting diode support structure, wherein:

The method for fabricating the electrothermal split type light-emitting diode support structure disclosed in the present invention comprises the following steps in the first embodiment:

First, at least two heat dissipation pedestals are formed on the heat dissipation plate; then, at least two sets of conductive supports are formed on the support plate; then, the heat dissipation plate and the support plate are coupled to each other, so that at least two heat dissipation pedestals are disposed on at least two sets of conductive supports And at least two heat dissipation pedestals are not connected to at least two sets of conductive supports; finally, at least two heat dissipation pedestals and at least two sets of conductive support portions are buried in the plastic seat, and at least two heat dissipation pedestals and at least two sets of conductive The bracket portion is exposed to the recess of the rubber seat, and at least the two sets of conductive bracket portions extend outside the rubber seat.

The method for fabricating an electrothermal split type light-emitting diode support structure as described above, wherein the step of forming at least two heat dissipation bases on the heat dissipation plate is to form at least two heat dissipation bases by a stamping process, and form at least two heat dissipation bases on the support plate The two sets of conductive supports are formed by a stamping process to form at least two sets of conductive supports.

The method for fabricating an electrothermal split type light-emitting diode support structure as described above, wherein at least two heat-dissipating bases and at least two sets of conductive bracket portions are embedded in the rubber seat, and at least two heat-dissipating bases and at least two sets of conductive brackets Part of the step of exposing to the recess of the rubber seat, and at least two sets of the conductive support portion extending outside the plastic seat, wherein at least two portions of the heat dissipation base are exposed to the recess for respectively fixing the LED, and the light emitting diode The body wafers are respectively electrically connected to any one of the conductive brackets partially exposed to the recesses, and the recessed portions of the rubber seats are further covered with an encapsulant for covering the LEDs to form the SMD light-emitting diodes.

The method for fabricating an electrothermally separated light-emitting diode support structure disclosed in the present invention comprises the following steps:

First, a thick plate having two thickness differences is formed; then, at least two heat dissipation pedestals are formed at a thick thickness of the thick plate; then, at least two sets of conductive supports are formed at a small thickness of the thick plate, and at least two groups are electrically conductive The bracket is not connected to the at least two heat dissipation bases; finally, at least two heat dissipation bases and at least two sets of conductive bracket portions are buried in the rubber seat, and at least two heat dissipation bases and at least two sets of conductive bracket portions are exposed to the rubber seat The recessed portion and the at least two sets of conductive bracket portions extend outside the rubber seat.

The method for fabricating an electrothermal split type light-emitting diode support structure as described above, wherein the step of forming at least two heat-dissipating pedestals at a thick portion of the thick-thickness plate is formed by a stamping process to form at least two heat-dissipating pedestals, and the thick-thin plate The step of forming at least two sets of conductive supports at a small thickness and the at least two sets of conductive supports not being connected to the at least two heat dissipation bases is performed by a stamping process to form at least two sets of conductive supports.

The method for fabricating an electrothermal split type light-emitting diode support structure as described above, wherein at least two heat-dissipating bases and at least two sets of conductive bracket portions are embedded in the rubber seat, and at least two heat-dissipating bases and at least two sets of conductive brackets Part of the step of exposing to the recess of the rubber seat, and at least two sets of the conductive support portion extending outside the plastic seat, wherein at least two portions of the heat dissipation base are exposed to the recess for respectively fixing the LED, and the light emitting diode The body wafers are respectively electrically connected to any one of the conductive brackets partially exposed to the recesses, and the recessed portions of the rubber seats are further covered with an encapsulant for covering the LEDs to form the SMD light-emitting diodes.

The manufacturing method disclosed in the present invention is as above, and the difference from the prior art is that one of the specific embodiments of the present invention is that the heat dissipation plate is coupled with the support plate to form at least two heat dissipation bases and at least two sets of conductive supports to maintain the electrothermal separation. Another specific embodiment is a design in which at least two heat dissipation pedestals and at least two sets of conductive supports are formed by thick plates to maintain electrothermal separation, and different types of light emitting diode chips can be simultaneously used, that is, different The light-emitting diode chips are respectively arranged on the heat dissipation base and electrically connected to different conductive bracket groups respectively, that is, different types of light-emitting diode chips can be freely selected, so as to avoid the use of the light-emitting diode wafer. limits.

Through the above technical means, the present invention can achieve the technical effect of simultaneously using different types of light-emitting diode chips.

The embodiments of the present invention will be described in detail below with reference to the drawings and embodiments, so that the application of the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.

The first embodiment of the method for fabricating the electrothermal split type light-emitting diode support structure disclosed in the present invention will be described below, and please refer to "Fig. 3" and "Fig. 4" at the same time; "3rd picture" The flow chart of the first embodiment of the structure of the electrothermal split type light-emitting diode support of the present invention is shown in FIG. 4; FIG. 4 is a heat dissipation plate and the support structure of the electrothermal split type light-emitting diode support structure of the present invention. The board is coupled to form a three-dimensional schematic.

First, the heat dissipation plate 10 having at least two heat dissipation pedestals 11 is formed in a stamping manner, that is, at least two heat dissipation pedestals 11 are formed on the heat dissipation plate 10 (step 110), and are formed by punching to have at least two groups. The bracket plate 20 of the conductive bracket 21, that is, at least two sets of conductive brackets 21 are formed on the bracket plate 20 (step 120).

The number of the conductive brackets 21 formed on the bracket plate 20 is determined according to the number of the heat dissipation bases 11 formed by the heat dissipation plates 10, that is, the number of the conductive brackets 21 is the same as the number of the heat dissipation bases 11 formed by the heat dissipation plates 10, and each A set of conductive brackets 21 has a positive conductive support 22 and a negative conductive support 23, respectively.

In the "Fig. 4", three heat dissipation pedestals 11 are formed on the heat dissipation plate 10. Therefore, three sets of conductive supports 21 are formed on the support plate 20, and the heat dissipation pedestal 11 and the conductive support 21 are illustrated in the drawings. The number of the embodiments is merely illustrative, and the scope of the invention is not limited by the drawings.

The heat dissipating plate 10 and the bracket plate 20 are respectively positioned and coupled to each other through the positioning portions (12, 24) disposed on the heat dissipating plate 10 and the bracket plate 20, that is, the heat dissipating plate 10 and the bracket plate 20 are coupled to each other to enable at least two heat dissipating bases. The seat 11 is disposed between at least two sets of conductive brackets 21 (step 130). It is noted that at least two heat sink bases 11 and at least two sets of conductive brackets 21 are not connected to each other, thereby separating heat dissipation and electrical connection. To form a form of electrothermal separation.

At this time, the heat dissipation plate 10 and the bracket plate 20 are integrally formed. The above description and drawings are merely illustrative of the manufacturing method of the heat dissipation plate 10 and the support plate 20, and the scope of application of the present invention is not limited by the description and the drawings.

The heat sink 10 having at least two heat sink bases 11 and the at least two sets of conductive brackets 21 are formed by stamping, and the brackets 20 can be made of a metal plate or an alloy plate having good electrical conductivity and thermal conductivity, for example, a heat sink. 10 and the bracket plate 20 can be made of copper, iron, aluminum alloy or other materials with good electrical conductivity and thermal conductivity, that is, the heat dissipation base 11 and the conductive support 21 have good electrical conductivity and thermal conductivity, and only The materials of the heat dissipation plate 10 and the support plate 20 are exemplified, and are not limited to the application scope of the present invention.

Next, please refer to "Fig. 3" and "Fig. 5", and "Fig. 5" is a schematic plan view showing the structure of the electrothermal split type light-emitting diode support of the present invention; a heat dissipation plate 10 having at least two heat dissipation pedestals 11 and a support plate 20 having at least two sets of conductive supports 21 separated from each other, and coupling the heat dissipation plate 10 and the support plate 20 to each other in an insert molding manner The plastic holder 30 is formed such that each of the heat dissipation bases 11 and each of the sets of conductive brackets 21 are partially embedded in the rubber seat 30 (step 140). In the actual manufacturing process, only the upper mold is required to pass through (not shown) And a lower mold (not shown) embedding each of the heat dissipation bases 11 and each set of the conductive brackets 21 therein, and in the injection molding of the rubber holders 30, each of the heat dissipation bases 11 and each of the heat dissipation bases 11 can be simultaneously A set of conductive brackets 21 are partially embedded in the rubber seat 30, and the upper mold and the lower mold can be demolded at one time to complete the process of burying the plastic seat 30, and the material of the plastic seat 30 can be poly-orthobenzene. Dimethyl amide (polyphthalamide, PP) A) or other thermoplastic resin commonly used as the base 30 of the light-emitting diode structure is merely illustrative of the material of the rubber seat 30, and is not intended to limit the scope of application of the present invention.

When the molding base 30 is injection molded, the recess 31 is formed in the rubber seat 30 at the same time, and each of the heat dissipation base 11 and each of the conductive brackets 21 are exposed to the recess 31 of the rubber seat 30 (step 140). And each set of conductive brackets 21 will extend out of the glue holder 30 (step 140).

Each set of conductive brackets 21 is exposed to a portion of the recessed portion 31 of the rubber seat 30, and a portion of each set of conductive brackets 21 extending out of the rubber seat 30 is used for providing electrical connection, that is, each set of conductive brackets 21 is exposed. The portion of the recessed portion 31 of the rubber seat 30 is used to electrically connect the light-emitting diode chip (not shown) disposed on each of the heat dissipation bases 11 in the recess portion 31 of the plastic holder 30. The portion of each of the conductive brackets 21 extending out of the base 30 is used to form an electrical connection on the outside of the base 30 to facilitate electrical connection with other electronic devices (not shown), for example, a host The board, the circuit board, etc., are merely illustrative here, and are not intended to limit the scope of application of the present invention.

In other words, the LEDs (not shown) disposed on each of the heat dissipation pedestals 11 of the recesses 31 of the plastic holders 30 are provided with light-emitting diode chips through each of the heat dissipation pedestals 11. For heat dissipation, and through each of the sets of conductive brackets 21 exposed to the recessed portion 31 of the rubber seat 30, an electrical connection of the light emitting diode chips is provided, and the plastic holders 30 extend through the sets of the conductive supports 21 In part, the LED chip is electrically connected to other electronic devices.

The structure of the electrothermal separation type light-emitting diode formed by the above process can be referred to as shown in "figure 5".

Next, a second embodiment of the method for fabricating the electrothermal split type light-emitting diode support structure disclosed in the present invention will be described below, and reference is also made to "Fig. 6" and "Fig. 7A"; Figure 2 is a flow chart showing a second embodiment of the electrothermal split type light-emitting diode support structure of the present invention; "Fig. 7A" is a thick plate of the electrothermal split type light-emitting diode support structure of the present invention. A three-dimensional schematic diagram; first, a thick sheet 40 having two thickness differences is formed in an extrusion manner (step 210). The above manner is merely illustrative and is not intended to limit the scope of application of the present invention.

Next, please refer to "6th" and "7B", and "7B" is shown in the heat sink base and conductive bracket of the thick plate of the electrothermal split type light-emitting diode support structure of the present invention. A three-dimensional schematic view; at least two heat dissipation pedestals 41 are formed in a stamping manner at a thickness of the thick plate 40 (step 220), and at least two sets of conductive supports 42 are formed in a small thickness of the thick plate 40 by stamping (steps) 230)

The number of the conductive brackets 42 formed on the thick plate 40 is determined according to the number of the heat dissipation bases 41 formed on the thick plate 40, that is, the number of the conductive supports 42 is the same as the number of the heat dissipation bases 41 formed by the thick plates 40, And each set of conductive brackets 42 has a positive conductive support 43 and a negative conductive support 44, respectively.

In FIG. 7A and FIG. 7B, three heat dissipation pedestals 41 are formed on the thick plate 40. Therefore, three sets of conductive supports 42 are formed on the thick plate 40, and the heat dissipation base is shown in the drawing. The number of seats 41 and the conductive brackets 42 are merely illustrative, and the scope of application of the present invention is not limited by the drawings.

It should be noted that at least two heat dissipation pedestals 41 and at least two sets of conductive supports 42 formed on the thick plate 40 are not connected to each other, whereby heat dissipation and electrical connection can be separated to form a form of electrothermal separation.

The thick plate 40 can be made of a metal plate or an alloy plate with good electrical conductivity and thermal conductivity. For example, the thick plate 40 can be made of copper, iron, aluminum alloy or other materials with good electrical conductivity and thermal conductivity, that is, heat dissipation. The base 41 and the conductive support 42 have good electrical conductivity and thermal conductivity. The material of the thick plate 40 is merely exemplified herein, and is not limited to the scope of application of the present invention.

Next, please refer to "Fig. 6" and "Fig. 8", and "Fig. 8" is a schematic plan view showing the structure of the electrothermal split type light-emitting diode support of the present invention; After at least two heat dissipation pedestals 41 separated from each other and at least two sets of the thick plates 40 of the conductive supports 42, the glue holders 50 are formed in an insert molding manner so that each of the heat dissipation pedestals 41 and each group are electrically conductive. The bracket 42 is partially embedded in the rubber seat 50 (step 240). In the actual manufacturing process, only the upper mold (not shown) and the lower mold (not shown) are used to move each of the heat dissipation bases 41. And each set of conductive brackets 42 is embedded therein, and in the injection molding of the rubber seat 50, each of the heat dissipation bases 41 and each set of the conductive brackets 42 can be simultaneously buried in the rubber seat 50, and the upper mold and the upper mold and The lower mold can be demolded at one time to complete the process of burying the plastic seat 50, and the material of the rubber seat 50 can be polyphthalamide (PPA) or other commonly used as a light-emitting diode. Thermoplastic tree of structural rubber seat 50 , Which are only illustrative gum base material 50 is not intended to limit the scope of the present invention is applied.

When the molding compound 50 is injected, the recess 51 is formed in the rubber seat 50 at the same time, and each of the heat dissipation base 41 and each of the conductive brackets 42 are exposed to the recess 51 of the rubber seat 50 (step 240). And each set of conductive brackets 42 will extend out of the rubber seat 50 (step 240).

Each set of conductive brackets 42 is exposed to a portion of the recess 51 of the rubber seat 50, and a portion of each set of conductive brackets 42 extending out of the base 50 is used for providing electrical connection, that is, each set of conductive brackets 42 is exposed. The portion of the recess 51 of the rubber seat 50 is for electrically connecting with the LED (not shown) disposed on each of the heat dissipation bases 41 in the recess 51 of the rubber seat 50. And a portion of each of the conductive brackets 42 extending out of the rubber seat 50 is used to form an electrical connection outside the rubber seat 50 to facilitate electrical connection with other electronic devices (not shown), for example, a host The board, the circuit board, etc., are merely illustrative here, and are not intended to limit the scope of application of the present invention.

In other words, the LEDs (not shown) disposed on each of the heat dissipation pedestals 41 of the recesses 51 of the plastic housing 50 are respectively provided by the heat dissipation pedestals 41. For heat dissipation, and through each of the sets of conductive brackets 42 exposed to the recess 51 of the rubber seat 50, an electrical connection of the light-emitting diode wafer is provided, and the rubber seat 50 is extended through each set of conductive brackets 42. In part, the LED chip is electrically connected to other electronic devices.

The structure of the electrothermal separation type light-emitting diode formed by the above process can be referred to as shown in "Fig. 8".

Next, please refer to FIG. 9A, and FIG. 9A is a top plan view showing the first configuration of the LED array structure of the electrothermal split type light-emitting diode support structure of the present invention.

Herein, in the first embodiment of the present invention, as a description of the configuration of the light-emitting diode wafer, the second embodiment of the present invention is configured to configure the light-emitting diode wafer as in the first embodiment. The description is merely illustrative here and is not intended to limit the scope of application of the present invention.

The anode of the first LED chip 61 is fixed to the first heat dissipation base 111 exposed to the recess 31 of the rubber seat 30 by a surface mount device (SMD), and the second light emitting diode is The negative electrode of the bulk wafer 62 is fixed to the second heat dissipation base 112 exposed to the recess 31 of the rubber seat 30, and the negative electrode of the third LED chip 63 is fixed to the recess 31 exposed to the rubber seat 30. On the third heat sink base 113.

Then, the positive electrode of the first light-emitting diode chip 61 is electrically connected to the positive electrode conductive support 221 of the first group of conductive brackets 211 exposed to the recess portion 31 of the rubber seat 30 by wire bonding, and The first heat dissipation base 111 (ie, the negative electrode of the first light emitting diode chip 61) is electrically connected to the negative electrode conductive support 231 of the first set of conductive brackets 211 exposed to the recess portion 31 of the rubber seat 30.

And electrically connecting the positive electrode of the second LED chip 62 to the positive conductive support 222 of the second set of conductive brackets 212 exposed to the recess 31 of the rubber seat 30, and the second heat sink base 112 (ie, The negative electrode of the second LED chip 62 is electrically connected to the negative conductive support 232 of the second set of conductive supports 212 exposed to the recess 31 of the plastic holder 30.

Finally, the positive electrode of the third LED chip 63 is electrically connected to the positive conductive support 223 of the third set of conductive brackets 213 exposed to the recess 31 of the rubber seat 30, and the third heat sink base 113 is The negative electrode of the third LED chip 63 is electrically connected to the negative electrode conductive support 233 of the third group of conductive supports 213 exposed to the recess 31 of the rubber holder 30.

The first set of conductive supports 211 can respectively provide different electrical polarities of the first light emitting diode chip 61, and the second set of conductive supports 212 can respectively provide different electrical polarities of the second light emitting diode chip 62, and the third group. The conductive bracket 213 can provide different electrical polarities of the third LED chip 33, respectively.

The first light emitting diode chip 61, the second light emitting diode chip 62, and the third light emitting diode chip 63 are respectively connected to the first group of conductive brackets 211, the second group of conductive brackets 212, and the third, respectively, by a wire bonding technique. In addition to the electrical connection of the set of conductive supports 213, the above-mentioned light-emitting diode wafers can be electrically connected to each set of conductive supports by flip chip bonding, as for wire bonding technology and flip chip bonding. The technical connection manners can be referred to the prior art, and are not described herein again, and are merely illustrative, and the application scope of the present invention is limited in the above manner.

Next, please refer to FIG. 9B, and FIG. 9B is a top plan view showing a second configuration of the LED array structure of the electrothermal split type light-emitting diode support structure of the present invention.

In the second configuration, the positive electrode of the first LED chip 61 is fixed on the first heat dissipation base 111 exposed to the recess 31 of the plastic holder 30, and the positive electrode of the second LED chip 62 is fixed. The second heat dissipation base 112 is exposed on the recessed portion 31 of the plastic holder 30, and the negative electrode of the third LED array 63 is fixed to the third heat dissipation base exposed to the recess 31 of the rubber holder 30. 113 on.

Then, the negative electrode of the first LED chip 61 is electrically connected to the negative electrode conductive bracket 231 of the first group of conductive brackets 211 exposed to the recess 31 of the rubber seat 30 by wire bonding, and The first heat dissipation pedestal 111 (ie, the positive electrode of the first light-emitting diode wafer 61) is electrically connected to the positive conductive support 221 of the first set of conductive supports 211 exposed to the recess 31 of the plastic holder 30.

And electrically connecting the negative electrode of the second LED chip 62 to the negative electrode conductive bracket 232 of the second group of conductive brackets 212 exposed to the recess 31 of the rubber seat 30, and the second heat sink base 112 (ie, The positive electrode of the second LED chip 62 is electrically connected to the positive conductive support 222 of the second set of conductive supports 212 exposed to the recess 31 of the rubber holder 30.

Finally, the positive electrode of the third LED chip 63 is electrically connected to the positive conductive support 223 of the third set of conductive brackets 213 exposed to the recess 31 of the rubber seat 30, and the third heat sink base 113 is The negative electrode of the third LED chip 63 is electrically connected to the negative electrode conductive support 233 of the third group of conductive supports 213 exposed to the recess 31 of the rubber holder 30.

The first set of conductive supports 211 can respectively provide different electrical polarities of the first light emitting diode chip 61, and the second set of conductive supports 212 can respectively provide different electrical polarities of the second light emitting diode chip 62, and the third group. The conductive bracket 213 can provide different electrical polarities of the third LED chip 33, respectively.

Then, as shown in FIG. 9A and FIG. 9B, the first group of conductive brackets 211, the second group of conductive brackets 212, and the third group of conductive brackets 213 can be respectively used to respectively pair the first light-emitting diodes. The body wafer 61, the second light emitting diode chip 62, and the third light emitting diode chip 63 are controlled, and different types (PNP type or NPN type) light emitting diode chips can be respectively used, thereby further improving The use efficiency of the light-emitting diode chip is used.

Further, in the "9A" and "9B", only the arrangement of the two types of light-emitting diodes and the manner of electrical connection are provided, which are merely illustrative and are not intended to limit the scope of application of the present invention.

Next, please refer to FIG. 10, and FIG. 10 is a top plan view showing the light-emitting diode package of the electrothermal split type light-emitting diode support structure of the present invention.

Herein, in the first embodiment of the present invention, as a description of the configuration of the light-emitting diode wafer, the second embodiment of the present invention is configured to configure the light-emitting diode wafer as in the first embodiment. The description is merely illustrative here and is not intended to limit the scope of application of the present invention.

The encapsulant 70 is formed on the recess 31 of the plastic holder 30. The encapsulant 70 can cover the LED assembly 60 in the recess 31. The encapsulant 70 can be formed by dispensing. For example only, it is not limited to the application scope of the present invention, and the encapsulant 70 may be doped with phosphor powder, so that the light emitted by the LED chip 60 is irradiated to the phosphor powder to excite it. In the visible light of another color, the light emitted by the LED wafer 60 can be mixed with the light excited by the phosphor to produce a light mixing effect.

In summary, it can be seen that the difference between the present invention and the prior art is that one of the specific embodiments of the present invention is that the heat sink is coupled with the bracket plate to form at least two heat sink bases and at least two sets of conductive brackets to maintain the electrothermal separation design. Another specific embodiment is a design in which at least two heat dissipation pedestals and at least two sets of conductive supports are formed by thick plates to maintain electrothermal separation, and different types of illuminating diode chips can be simultaneously used, that is, different types can be used. The LED chips are respectively disposed on the heat dissipation base and electrically connected to different conductive bracket groups respectively, that is, different types of LED chips can be freely selected to avoid the limitation of the use of the LED chip. .

By using such a technical means, it is possible to solve the problem that the use of the same type of light-emitting diode wafer is required when the plurality of light-emitting diode chips are disposed on the heat-dissipating susceptor of the prior art, so that the use of the light-emitting diode chip is restricted. In turn, the technical effect of simultaneously using different types of light-emitting diode chips is achieved.

While the embodiments of the present invention have been described above, the above description is not intended to limit the scope of the invention. Any changes in the form and details of the embodiments may be made without departing from the spirit and scope of the invention. The scope of the invention is to be determined by the scope of the appended claims.

10. . . Radiating plate

11. . . Cooling base

111. . . First cooling base

112. . . Second cooling base

113. . . Third cooling base

12. . . Positioning department

20. . . Bracket plate

twenty one. . . Conductive bracket

211. . . First set of conductive brackets

212. . . Second set of conductive brackets

213. . . The third set of conductive brackets

twenty two. . . Positive conductive bracket

221. . . Positive conductive bracket

222. . . Positive conductive bracket

223. . . Positive conductive bracket

twenty three. . . Negative electrode conductive bracket

231. . . Negative electrode conductive bracket

232. . . Negative electrode conductive bracket

233. . . Negative electrode conductive bracket

twenty four. . . Positioning department

30. . . Plastic seat

31. . . Depression

40. . . Thick plate

41. . . Cooling base

42. . . Conductive bracket

43. . . Positive conductive bracket

44. . . Negative electrode conductive bracket

50. . . Plastic seat

51. . . Depression

60. . . Light-emitting diode chip

61. . . First light emitting diode chip

62. . . Second light emitting diode chip

63. . . Third light emitting diode chip

70. . . Encapsulant

81. . . Plastic seat

82. . . Depression

83. . . support

84. . . Electrical connection

85. . . Light-emitting diode chip

86. . . Electrical wire

87. . . Encapsulant

88. . . Cooling base

Step 110: forming at least two heat dissipation bases on the heat dissipation plate

Step 120: forming at least two sets of conductive brackets on the bracket plate

Step 130: The heat dissipation plate and the support plate are coupled to each other, so that at least two heat dissipation bases are disposed between the at least two sets of conductive supports, and at least two heat dissipation bases are not connected to the at least two sets of conductive supports.

Step 140: at least two heat dissipation bases and at least two sets of conductive bracket portions are embedded in the rubber seat, and at least two heat dissipation bases and at least two sets of conductive bracket portions are exposed to the recessed portion of the rubber seat, and at least two sets of conductive bracket portions Extended beyond the plastic seat

Step 210 produces a thick sheet having two thickness differences

Step 220: forming at least two heat dissipation bases at a thickness of the thick plate

Step 230: forming at least two sets of conductive supports at a small thickness of the thick plate, and at least two sets of conductive supports are not connected to the at least two heat dissipation bases

Step 240: at least two heat dissipation bases and at least two sets of conductive bracket portions are embedded in the rubber seat, and at least two heat dissipation bases and at least two sets of conductive bracket portions are exposed to the recessed portion of the rubber seat, and at least two sets of conductive bracket portions Extended beyond the plastic seat

FIG. 1 is a side cross-sectional view showing a configuration of a light-emitting diode package of the first conventional light-emitting diode support structure.

FIG. 2 is a top plan view showing a configuration of a light-emitting diode of the second known light-emitting diode support structure.

FIG. 3 is a flow chart showing a method for fabricating the first embodiment of the electrothermal split type light-emitting diode support structure of the present invention.

FIG. 4 is a perspective view showing the coupling of the heat dissipation plate and the support plate of the electrothermal separation type light-emitting diode support structure of the present invention.

FIG. 5 is a schematic top view showing the structure of the electrothermal separation type light-emitting diode support of the present invention.

FIG. 6 is a flow chart showing a second embodiment of the structure of the electrothermal split type light-emitting diode support structure of the present invention.

FIG. 7A is a perspective view showing a thick plate of the electrothermal separation type light-emitting diode support structure of the present invention.

FIG. 7B is a perspective view showing the heat dissipation base and the conductive support of the thick and thin plate of the electrothermal separation type light-emitting diode support structure of the present invention.

FIG. 8 is a top plan view showing the structure of the electrothermal separation type light-emitting diode support of the present invention.

FIG. 9A is a top plan view showing the first configuration aspect of the LED assembly of the electrothermal split type light-emitting diode support structure of the present invention.

FIG. 9B is a top plan view showing a second configuration of the LED array structure of the electrothermal split type light-emitting diode support structure of the present invention.

FIG. 10 is a top plan view showing the light-emitting diode package of the electrothermal separation type light-emitting diode support structure package of the present invention.

11. . . Cooling base

twenty one. . . Conductive bracket

twenty two. . . Positive conductive bracket

twenty three. . . Negative electrode conductive bracket

30. . . Plastic seat

31. . . Depression

Claims (10)

A method for fabricating an electrothermal split type light-emitting diode support structure, comprising the steps of: forming at least two heat dissipation bases on a heat dissipation plate; forming at least two sets of conductive supports on a support plate; the heat dissipation plate and the support plate The at least two heat dissipation pedestals are disposed between the at least two sets of conductive supports, and the at least two heat dissipation pedestals are not connected to the at least two sets of conductive supports; and the at least two heat dissipation pedestals and the at least two groups The conductive support portion is embedded in a plastic seat, and the at least two heat dissipation bases and the at least two sets of conductive support portions are exposed to the recessed portion of the rubber seat, and the at least two sets of conductive support portions extend outside the plastic seat . The method for fabricating an electrothermal split type light-emitting diode support structure according to claim 1, wherein the step of forming the at least two heat dissipation bases on the heat dissipation plate is performed by a stamping process to form the at least two heat dissipation bases. seat. The method of fabricating an electrothermal split type light-emitting diode support structure according to claim 1, wherein the step of forming the at least two sets of conductive supports on the support plate is performed by a stamping process to form the at least two sets of conductive support. The method of fabricating an electrothermal split type light-emitting diode support structure according to claim 1, wherein the at least two heat-dissipating pedestals and the at least two sets of conductive support portions are embedded in the plastic seat, and the at least The two heat dissipation bases and the at least two sets of conductive bracket portions are exposed to the recessed portion of the rubber seat, and the at least two sets of conductive bracket portions extend in the step of the outside of the plastic seat, the at least two heat dissipation base portions being exposed to the recess The portion is for respectively fixing the LED chips, and the LED chips are respectively electrically connected to any one of the conductive brackets partially exposed to the recesses. The method for fabricating an electrothermal split type light-emitting diode support structure according to claim 4, wherein the at least two heat-dissipating pedestals and the at least two sets of conductive support portions are embedded in the plastic seat, and the at least The heat dissipation base and the at least two sets of conductive bracket portions are exposed to the recessed portion of the rubber seat, and the at least two sets of conductive bracket portions extend in the outer portion of the rubber seat, and further comprise the cover portion covered with a package colloid step. An electrothermal separation type light-emitting diode support structure manufacturing method comprising the steps of: forming a thick plate having two thickness differences; forming at least two heat dissipation bases at a thickness of the thick plate; and the thick plate Forming at least two sets of conductive supports at a small thickness, and the at least two sets of conductive supports are not connected to the at least two heat dissipation bases; and the at least two heat dissipation bases and the at least two sets of conductive support parts are embedded in a plastic seat And the at least two heat dissipation bases and the at least two sets of conductive bracket portions are exposed to the recesses of the rubber seat, and the at least two sets of conductive bracket portions extend outside the plastic seat. The method for fabricating an electrothermal split type light-emitting diode support structure according to claim 6, wherein the step of forming the at least two heat-dissipating bases at a thickness of the thick-thickness plate is formed by a stamping process to form the at least Two cooling bases. The method of fabricating an electrothermal split type light-emitting diode support structure according to claim 6, wherein the at least two sets of conductive supports are formed at a small thickness of the thick plate, and the at least two sets of conductive supports and the at least two sets of conductive supports The step of disengaging the two heat dissipation pedestals is to form the at least two sets of conductive supports by a stamping process. The method of fabricating an electrothermal split type light-emitting diode support structure according to claim 6, wherein the at least two heat-dissipating pedestals and the at least two sets of conductive support portions are embedded in the plastic seat, and the at least The two heat dissipation bases and the at least two sets of conductive bracket portions are exposed to the recessed portion of the rubber seat, and the at least two sets of conductive bracket portions extend in the step of the outside of the plastic seat, the at least two heat dissipation base portions being exposed to the recess The portion is for respectively fixing the LED chips, and the LED chips are respectively electrically connected to any one of the conductive brackets partially exposed to the recesses. The method of fabricating an electrothermal split type light-emitting diode support structure according to claim 9, wherein the at least two heat-dissipating pedestals and the at least two sets of conductive support portions are embedded in the plastic seat, and the at least The heat dissipation base and the at least two sets of conductive bracket portions are exposed to the recessed portion of the rubber seat, and the at least two sets of conductive bracket portions extend in the outer portion of the rubber seat, and further comprise the cover portion covered with a package colloid step.