TWI455195B - A method and a device for cutting a substrate - Google Patents
A method and a device for cutting a substrate Download PDFInfo
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- TWI455195B TWI455195B TW097145410A TW97145410A TWI455195B TW I455195 B TWI455195 B TW I455195B TW 097145410 A TW097145410 A TW 097145410A TW 97145410 A TW97145410 A TW 97145410A TW I455195 B TWI455195 B TW I455195B
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- 239000000758 substrate Substances 0.000 title claims description 191
- 238000005520 cutting process Methods 0.000 title claims description 98
- 238000000034 method Methods 0.000 title claims description 19
- 238000007689 inspection Methods 0.000 claims description 245
- 238000012216 screening Methods 0.000 description 20
- 230000002950 deficient Effects 0.000 description 16
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 230000000694 effects Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
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- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Dicing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
本發明係關於將藉由樹脂材料將所需之複數個IC等電子零件成批密封成形之已成形基板切斷成各個封裝體(切片)之基板之切斷方法及其裝置的改良，特別是，關於檢查各個封裝體者。The present invention relates to a method of cutting a substrate and a device for cutting a substrate into a package (slice) by forming a plurality of electronic components such as ICs required by a resin material, and in particular, , about checking each package.
以往，使用基板之切斷裝置將已成形基板切斷成各個封裝體，此動作係以如下方式進行。Conventionally, the formed substrate has been cut into individual packages by using a substrate cutting device, and this operation is performed as follows.
首先，將所需之複數個電子零件配置於基板上並以樹脂材料成批密封成形之已成形基板，使其基板側之面朝上的狀態下吸附固定，且使用形成於已成形基板上面之基板面的對準標記對準並設定切斷線，以刀片沿此切斷線切斷並分離形成各個封裝體，接著，將各個封裝體洗淨並加以乾燥，且進行各個封裝體之基板面的外觀檢查。First, a plurality of electronic components required are disposed on a substrate, and the formed substrate is formed by batch sealing with a resin material, and the substrate side is adsorbed and fixed in a state in which the substrate side faces upward, and is formed on the formed substrate. The alignment marks on the substrate surface are aligned and set to the cutting line, and the blades are cut along the cutting line and separated to form respective packages. Then, the respective packages are washed and dried, and the substrate surface of each package is performed. Look and feel.
(專利文獻1)日本專利特開2003-168697號(Patent Document 1) Japanese Patent Laid-Open No. 2003-168697
如上述，檢查各個封裝體時，由於僅檢查各個封裝體之基板面，因此，其相反側之面的模組面並未檢查。As described above, when each package is inspected, since only the substrate surface of each package is inspected, the module surface on the opposite side is not inspected.
然而，於模組面側之樹脂部(樹脂成形體)有時會產生刀片切斷造成之缺角等缺陷，因此，封裝體(製品)之品質‧可靠性下降。However, in the resin portion (resin molded body) on the module surface side, defects such as cornering due to blade cutting may occur, and therefore the quality of the package (product) is lowered.
亦即，切斷已成形基板形成各個封裝體(製品)時，有無法獲得高品質‧高可靠性之製品的問題。That is, when the formed substrate is cut to form each package (product), there is a problem that a product of high quality and high reliability cannot be obtained.
又，由於在模組面側之樹脂部產生缺陷部分，因此封裝體(製品)之生產率下降。Further, since the defective portion is formed in the resin portion on the module surface side, the productivity of the package (product) is lowered.
亦即，切斷已成形基板形成各個封裝體(製品)時，有無法使封裝體(製品)之生產率提升的問題。That is, when the formed substrate is cut to form each package (product), there is a problem that the productivity of the package (product) cannot be improved.
因此，為獲得高品質‧高可靠性之製品及提升製品之生產率，亦即，為解決上述基板切斷上之諸問題，需要能檢查封裝體之基板面與模組面之兩面之基板之切斷方法及其裝置。Therefore, in order to obtain high-quality ‧ high-reliability products and increase the productivity of the products, that is, in order to solve the problems of the substrate cutting, it is necessary to inspect the substrate on both sides of the substrate surface and the module surface of the package. Breaking method and its device.
本發明係以切斷已成形基板形成製品(封裝體)時，可獲得高品質‧高可靠性之製品為目的。The present invention is intended to obtain a product of high quality and high reliability when the formed substrate is formed into a product (package).
又，本發明係以切斷已成形基板形成製品(封裝體)時，可提升製品之生產率為目的。Further, the present invention has an object of improving the productivity of the product when the formed substrate is formed into a product (package).
又，本發明為獲得高品質‧高可靠性之製品及提升製品之生產率，以提供可檢查製品(封裝體)之基板面與模組面之表面背面兩面(第一面與第二面)之基板之切斷方法及其裝置為目的。Moreover, the present invention provides high-quality ‧ high-reliability products and improved product productivity to provide both the substrate surface and the back surface (the first side and the second side) of the substrate surface and the module surface of the inspectable product (package) The method of cutting the substrate and the device thereof are for the purpose.
為解決該技術課題之本發明之基板之切斷方法，包含將已成形基板切斷以形成各個封裝體之封裝體形成步驟、及檢查該各個封裝體之封裝體檢查步驟，其特徵在於：該封裝體檢查步驟，包含：第一面檢查步驟，檢查該各個封裝體之第一面；以及第二面檢查步驟，檢查該各個封裝體之第一面之背面之第二面。A method for cutting a substrate according to the present invention to solve the above-described problems includes a package forming step of cutting a formed substrate to form each package, and a package inspection step of inspecting each package, wherein: The package inspection step includes: a first surface inspection step of inspecting the first side of each of the packages; and a second surface inspection step of inspecting a second side of the back side of the first side of each of the packages.
又，為解決該技術課題之本發明之基板之切斷方法，包含將已成形基板切斷以形成各個封裝體之封裝體形成步驟、及檢查該各個封裝體之封裝體檢查步驟，其特徵在於：該封裝體檢查步驟，包含：裝載保持步驟，將該已切斷之各個封裝體裝載並保持於第一檢查板；反轉步驟，使保持該封裝體之第一檢查板反轉；第一面檢查步驟，於該第一檢查板反轉前或反轉後，檢查保持於該第一檢查板之各個封裝體之露出側之面之第一面；第二面露出步驟，於該第一檢查板反轉後，將該封裝體裝載於第二檢查板，並使該封裝體之第一面之背面之第二面露出；以及第二面檢查步驟，檢查裝載於該第二檢查板之各個封裝體之第二面。Moreover, the method for cutting a substrate according to the present invention for solving the above-described problems includes a step of forming a package for forming a molded substrate to form each package, and a step of inspecting a package for inspecting each of the packages, which is characterized in that The package inspection step includes: a load holding step of loading and holding the cut packages on the first inspection board; and a reverse step of reversing the first inspection plate holding the package; a surface inspection step of inspecting a first surface of a surface of the exposed side of each of the first inspection boards before or after the first inspection plate is reversed; and a second surface exposing step, the first After the inspection plate is reversed, the package is loaded on the second inspection plate, and the second surface of the back surface of the first surface of the package is exposed; and the second surface inspection step is performed to check the second inspection plate. The second side of each package.
又，為解決該技術課題之本發明之基板之切斷方法，其特徵在於：於封裝體檢查步驟，該封裝體之第一面與第二面之中，一者為基板面，另一者為模組面。Further, in the method for inspecting a substrate according to the present invention, in the package inspection step, one of the first surface and the second surface of the package is a substrate surface, and the other is For the module surface.
又，為解決該技術課題之本發明之基板之切斷裝置，包含檢查切斷已成形基板而形成之各個封裝體的封裝體檢查單元，其特徵在於：該封裝體檢查單元，具備：第一檢查部，檢查該各個封裝體之第一面；以及第二檢查部，檢查經該第一檢查部檢查後之各個封裝體之第一面之背面之第二面。Moreover, the apparatus for cutting a substrate according to the present invention, which is a problem of the present invention, includes a package inspection unit that inspects each package formed by cutting a formed substrate, and the package inspection unit includes: The inspection unit checks the first surface of each of the packages, and the second inspection unit checks the second surface of the back surface of the first surface of each of the packages that has been inspected by the first inspection unit.
又，為解決該技術課題之本發明之基板之切斷裝置，包含檢查切斷已成形基板而形成之各個封裝體的封裝體檢查單元，其特徵在於：該封裝體檢查單元，具備：第一檢查板，裝載該各個封裝體，並一邊保持該封裝體一邊反轉；第一檢查機構，於該第一檢查板反轉前或反轉後，檢查保持於該第一檢查板之各個封裝體之露出側之面之第一面；第二檢查板，於該第一檢查板反轉後，裝載保持於該第一檢查板之封裝體；以及第二檢查機構，檢查裝載於該第二檢查板並露出之各個封裝體之第一面之背面之第二面。Moreover, the apparatus for cutting a substrate according to the present invention, which is a problem of the present invention, includes a package inspection unit that inspects each package formed by cutting a formed substrate, and the package inspection unit includes: Inspecting the board, loading the respective packages, and inverting while maintaining the package; the first inspection mechanism checks the respective packages held on the first inspection board before or after the first inspection plate is reversed a first surface of the exposed side surface; a second inspection plate loaded with the package body held on the first inspection plate after the first inspection plate is reversed; and a second inspection mechanism for checking loading on the second inspection The board exposes the second side of the back side of the first side of each package.
又，為解決該技術課題之本發明之基板之切斷裝置，其特徵在於：各個封裝體之第一面與第二面之中，一者為基板面，另一者為模組面。Further, in the substrate cutting apparatus of the present invention which solves the above-described problems, one of the first surface and the second surface of each package is a substrate surface, and the other is a module surface.
此外，該第一面及第二面若為封裝體之表面與背面即可，例如以樹脂披覆基板整體且未露出基板面之封裝體之表面與背面亦可。Further, the first surface and the second surface may be the front surface and the back surface of the package. For example, the surface and the back surface of the package in which the entire substrate is not covered with a resin and the substrate surface is not exposed may be used.
根據本發明，切斷已成形基板形成製品(封裝體)時，可達到獲得高品質‧高可靠性之製品的優良效果。According to the present invention, when the formed substrate is formed into a product (package), an excellent effect of obtaining a product of high quality and high reliability can be achieved.
又，根據本發明，切斷已成形基板形成製品(封裝體)時，可達到提升製品之生產率的優良效果。Moreover, according to the present invention, when the formed substrate-formed product (package) is cut, an excellent effect of improving the productivity of the product can be achieved.
又，根據本發明，為獲得高品質‧高可靠性之製品及提升製品之生產率，可達到提供能檢查製品(封裝體)之基板面與模組面之表面與背面兩面(第一面與第二面)之基板之切斷方法及其裝置的優良效果。Moreover, according to the present invention, in order to obtain high-quality ‧ high-reliability products and productivity of the reinforced products, it is possible to provide both the surface and the back surface of the substrate surface and the module surface of the inspection product (package) (first surface and The method for cutting the substrate of the two sides) and the excellent effect of the device thereof.
以下，根據實施例圖詳述本發明。Hereinafter, the present invention will be described in detail based on the embodiment.
圖1、圖2、圖3係本發明之基板之切斷裝置。1, 2, and 3 are cutting devices for a substrate of the present invention.
圖4(1)～圖4(3)、圖5(1)～圖5(3)、圖6(1)～圖6(2)、圖7(1)～圖7(3)係用以說明使用本發明之基板之切斷裝置依序且連續檢查切斷已成形基板所形成之各個封裝體之基板面與模組面之步驟的圖。4(1) to 4(3), Fig. 5(1) to Fig. 5(3), Fig. 6(1) to Fig. 6(2), and Fig. 7(1) to Fig. 7(3) are used for A description will be given of a step of sequentially and continuously checking the steps of cutting the substrate surface and the module surface of each package formed by the formed substrate by using the cutting device of the substrate of the present invention.
圖8(1)係表示本發明所使用之已成形基板，圖8(2)係表示以本發明之基板之切斷裝置所切斷之封裝體。Fig. 8 (1) shows a molded substrate used in the present invention, and Fig. 8 (2) shows a package cut by the cutting device of the substrate of the present invention.
(關於已成形基板與封裝體)(About formed substrate and package)
如圖8(1)所示，於已成形基板1設有基板面1a和其相反側之面的模組面1b。As shown in Fig. 8 (1), the molded substrate 1 is provided with a module surface 1b on the surface of the substrate surface 1a and its opposite side.
又，於已成形基板1，設有基板2、與設置於已成形基板1(基板2)之模組面1b側的樹脂成形體3，且於已成形基板1(基板2)之基板面1a設定切斷線4。Further, on the molded substrate 1, the substrate 2 and the resin molded body 3 provided on the module surface 1b side of the molded substrate 1 (substrate 2) are provided, and the substrate surface 1a of the formed substrate 1 (substrate 2) is provided. Set the cutting line 4.
又，如圖8(2)所示，於已成形基板1之切斷線4切斷並分離形成的封裝體5，與已成形基板1相同地設有基板面5a與其相反側之面的模組面5b。Further, as shown in Fig. 8 (2), the package 5 which is cut and separated from the cutting line 4 of the formed substrate 1 is provided with a mold having the surface of the substrate surface 5a and the surface opposite thereto as in the case of the formed substrate 1. Set face 5b.
又，於封裝體5，設有基板部6、與設置於封裝體5(基板部6)之模組面5a側的樹脂部7。Further, the package 5 is provided with a substrate portion 6 and a resin portion 7 provided on the module surface 5a side of the package 5 (substrate portion 6).
又，有時於基板部6(基板2)之基板面5a(1a)形成球形電極8。Further, the spherical electrode 8 may be formed on the substrate surface 5a (1a) of the substrate portion 6 (substrate 2).
在圖8(1)，從已成形基板1切斷分離之各個封裝體5之集合體(外觀與已成形基板1的大小相同)係以5(1c)表示。In Fig. 8 (1), the assembly of the respective packages 5 that are cut and separated from the formed substrate 1 (the appearance is the same as the size of the formed substrate 1) is represented by 5 (1c).
此外，本發明係各別且連續檢查封裝體5之基板面5a與模組面5b。Further, in the present invention, the substrate surface 5a and the module surface 5b of the package 5 are individually and continuously inspected.
(關於基板之切斷裝置的構成)(Regarding the structure of the cutting device for the substrate)
如圖1所示，本發明之基板之切斷裝置9係由下列單元構成：基板裝填單元A，用以裝填已成形基板1；基板切斷單元B，用以將自基板裝填單元A輸送來之已成形基板1切斷(分離)成各個封裝體5；封裝體檢查單元C，用以對基板切斷單元B所切斷之各個封裝體5進行外觀檢查並篩選良品與不良品；封裝體收容單元D，用以將封裝體檢查單元C所檢查篩選之封裝體各別收容於良品與不良品托盤。As shown in FIG. 1, the substrate cutting device 9 of the present invention is composed of the following units: a substrate loading unit A for loading the formed substrate 1 and a substrate cutting unit B for transporting the substrate loading unit A. The formed substrate 1 is cut (separated) into individual packages 5; and the package inspection unit C is used for visual inspection of each package 5 cut by the substrate cutting unit B and screening for good and defective products; The accommodating unit D is configured to store the package to be inspected and screened by the package inspection unit C in a good product and a defective product tray.
因此，首先，可將裝填於基板裝填單元A之已成形基板1輸送至基板切斷單元B並切斷成各個封裝體5，接著，以封裝體檢查單元C檢查切斷後之各個封裝體5並篩選，再以封裝體收容單元D將封裝體各別收容成良品與不良品。Therefore, first, the formed substrate 1 loaded in the substrate loading unit A can be transported to the substrate cutting unit B and cut into individual packages 5, and then the packaged inspection unit C can be inspected by the package inspection unit C. After the screening, the package storage unit D is used to store the package as a good product and a defective product.
又，於本發明之基板之切斷裝置9，構成為上述各單元A‧B‧C‧D可以此順序彼此拆裝自如地連結安裝。Further, in the cutting device 9 for a substrate according to the present invention, each of the units A‧B‧C‧D can be detachably attached to each other in this order.
又，於本發明之基板之切斷裝置9，構成為例如可以連結具10將各單元A‧B‧C‧D拆裝自如地連結。Further, in the cutting device 9 for a substrate of the present invention, for example, the connecting device 10 can be connected to each other, and the respective units A‧B‧C‧D can be detachably attached.
又，於圖1所示之基板之切斷裝置9，9a為裝置前面，9b為裝置背面。Further, the cutting device 9, 9a of the substrate shown in Fig. 1 is the front side of the device, and 9b is the back surface of the device.
此外，本發明於圖1所示之基板之切斷裝置9之封裝體檢查單元C具有特徵。Further, the package inspection unit C of the cutting device 9 of the substrate shown in Fig. 1 has a feature.
(關於基板裝填單元之構成)(About the structure of the substrate loading unit)
於基板裝填單元A，例如，設有裝填已成形基板1之基板裝填部38、與擠壓基板裝填部38之已成形基板1之推進器等的擠壓構件(未圖示)。The substrate loading unit A is provided with, for example, a substrate loading portion 38 on which the molded substrate 1 is mounted, and a pressing member (not shown) such as a pusher for pressing the formed substrate 1 of the substrate mounting portion 38.
因此，於基板裝填單元A，可以擠壓構件將已成形基板1自基板裝填部38擠壓並輸送至基板切斷單元C側。Therefore, in the substrate loading unit A, the formed substrate 1 can be pressed from the substrate loading portion 38 and conveyed to the substrate cutting unit C side by the pressing member.
(關於基板切斷單元之構成)(Regarding the structure of the substrate cutting unit)
於基板切斷單元B，例如設置：基板排列機構32，用以將自基板裝填單元A輸送來之已成形基板1排列於所需方向；切斷用平台(切斷平台)33，用以裝載基板排列機構32所排列之已成形基板1；切斷平台之移動機構34，用以使切斷平台33於基板裝載位置34a與基板切斷位置34b間移動；對準機構35，用以使裝載於切斷平台33之已成形基板1對準；基板切斷機構(刀片)36，用以沿切斷線4切斷裝載於切斷平台33之已成形基板1；封裝體洗淨機構37，用以洗淨基板切斷機構36所切斷之各個封裝體5；以及第一封裝體裝扣機構(第一傳送機構)11，用以將切斷平台33上之封裝體5輸送至封裝體檢查單元C側。The substrate cutting unit B is provided, for example, with a substrate arranging mechanism 32 for arranging the formed substrate 1 transported from the substrate loading unit A in a desired direction, and a cutting platform (cutting platform) 33 for loading The formed substrate 1 in which the substrate arranging mechanism 32 is arranged; the moving mechanism 34 for cutting the platform for moving the cutting platform 33 between the substrate loading position 34a and the substrate cutting position 34b; the alignment mechanism 35 for loading The formed substrate 1 on the cutting platform 33 is aligned; the substrate cutting mechanism (blade) 36 is used to cut the formed substrate 1 mounted on the cutting platform 33 along the cutting line 4; the package cleaning mechanism 37, a package body 5 for cleaning the substrate cutting mechanism 36; and a first package fastening mechanism (first transfer mechanism) 11 for conveying the package 5 on the cutting platform 33 to the package Check unit C side.
因此，首先，以基板排列機構32將來自基板裝填單元A側之已成形基板1排列於所需方向，再將該已成形基板1在其已成形基板1之樹脂成形體3側朝下的狀態下輸送安裝於切斷平台33，且以切斷平台33之移動機構34使其自基板裝載位置34a移動至基板切斷位置34b，接著，在將已成形基板1吸附固定於切斷平台33之狀態下，以基板切斷機構(刀片)36切斷藉由對準機構35所對準之已成形基板1來形成各個封裝體5(1c)。Therefore, first, the formed substrate 1 from the substrate loading unit A side is arranged in a desired direction by the substrate array mechanism 32, and the formed substrate 1 is placed on the resin molded body 3 side of the formed substrate 1 downward. The lower conveyance is attached to the cutting platform 33, and is moved from the substrate loading position 34a to the substrate cutting position 34b by the moving mechanism 34 of the cutting platform 33, and then the formed substrate 1 is adsorbed and fixed to the cutting platform 33. In the state, the respective package body 5 (1c) is formed by cutting the formed substrate 1 aligned by the alignment mechanism 35 by the substrate cutting mechanism (blade) 36.
進一步，在此狀態下，可以封裝體洗淨機構37洗淨各個封裝體5並使切斷平台33返回基板裝載位置34a。Further, in this state, the package cleaning mechanism 37 can clean the respective packages 5 and return the cutting platform 33 to the substrate loading position 34a.
因此，可以第一封裝體裝扣機構11將基板裝載位置34a之切斷平台33上之各個封裝體5(1c)輸送至封裝體檢查單元C側。Therefore, the first package body locking mechanism 11 can convey the respective packages 5 (1c) on the cutting platform 33 of the substrate loading position 34a to the package inspection unit C side.
此外，於本發明，基板切斷機構36之刀片(旋轉切斷刀)、切斷平台33、以及封裝體洗淨機構37等，可分別設置任意個。Further, in the present invention, any one of the blade (rotation cutting blade), the cutting platform 33, and the package cleaning mechanism 37 of the substrate cutting mechanism 36 may be provided.
(關於封裝體收容單元之構成)(Regarding the structure of the package housing unit)
於封裝體收容單元D，設有收容已檢查之封裝體5的托盤31。A tray 31 for accommodating the package 5 to be inspected is provided in the package housing unit D.
亦即，於封裝體收容單元D，例如設有：良品托盤裝填部，用以裝填收容良品之良品托盤31(31a)；以及不良品托盤裝填部，用以裝填收容不良品之不良品托盤31(31b)。In other words, the package storage unit D is provided with, for example, a good tray loading unit for loading a good product tray 31 (31a), and a defective product tray loading unit for loading a defective product tray 31 for accommodating defective products. (31b).
因此，關於封裝體檢查單元C所檢查篩選之各個封裝體5，可將良品收容於良品托盤31a，且將不良品收容於不良品托盤31b。Therefore, in each of the packages 5 inspected and inspected by the package inspection unit C, the good product can be accommodated in the good product tray 31a, and the defective product can be stored in the defective product tray 31b.
(關於封裝體檢查單元之構成)(About the structure of the package inspection unit)
於本發明之封裝體檢查單元C，例如設有：反轉卡止板(第一檢查板)12，用以將移載於基板切斷單元B之第一封裝體裝扣機構11所裝扣之封裝體裝載面(上面)12a的封裝體5(1c)吸附卡止，並反轉；以及第一檢查機構(下攝影機)13，用以對吸附卡止於已反轉之反轉卡止板12之封裝體裝載面(下面)12a的各個封裝體5(1c)，自其下方位置進行外觀檢查。The package inspection unit C of the present invention is provided with, for example, a reverse locking plate (first inspection plate) 12 for fastening the first package body locking mechanism 11 transferred to the substrate cutting unit B. The package 5 (1c) of the package loading surface (upper) 12a is slidably latched and reversed; and the first inspection mechanism (lower camera) 13 is used to lock the adsorption to the reversed reverse rotation. The respective packages 5 (1c) of the package loading surface (lower surface) 12a of the board 12 are visually inspected from the lower position.
反轉卡止板12於停止設定成其封裝體裝載面12a成為上面時，將各個封裝體5(1c)輸送安裝於封裝體裝載面12a並吸附卡止，且在此狀態下反轉並停止設定成封裝體裝載面12a側成為下面側。When the reverse locking plate 12 is stopped and set so that the package mounting surface 12a becomes the upper surface, each package 5 (1c) is transported and attached to the package mounting surface 12a, and is suction-locked, and is reversed and stopped in this state. The side of the package mounting surface 12a is set to be the lower side.
因此，首先，可將各個封裝體5(1c)吸附卡止於反轉卡止板(第一檢查板)12之封裝體裝載面12a，接著，在各個封裝體5(1c)吸附卡止於封裝體裝載面(上面)12a的狀態下，將反轉卡止板12反轉使封裝體裝載面(上面)12a朝下，進一步，以第一檢查機構(下攝影機)13，對吸附卡止於反轉卡止板(第一檢查板)12之封裝體裝載面(下面)12a的各個封裝體5(1c)進行外觀檢查。Therefore, first, each package 5 (1c) can be adsorbed and locked to the package loading surface 12a of the reverse locking plate (first inspection plate) 12, and then the respective packages 5 (1c) are adsorbed and locked. In the state of the package loading surface (upper surface) 12a, the reverse locking plate 12 is reversed so that the package loading surface (upper surface) 12a faces downward, and further, the first inspection mechanism (lower camera) 13 is used to chuck the adsorption. The package inspection 5 (1c) of the package loading surface (lower surface) 12a of the reverse locking plate (first inspection plate) 12 is visually inspected.
此外，反轉卡止板12係設置成可藉由後述之反轉卡止板之往返移動手段沿裝置前面9a於水平方向往返移動自如，且上下移動自如。Further, the reverse locking plate 12 is provided so as to be reciprocally movable in the horizontal direction along the front surface 9a of the apparatus by the reciprocating means of the reverse locking plate, which will be described later, and is movable up and down.
又，於本發明之檢查單元C，例如設有：裝載板(第二檢查板)14，用以承接吸附卡止於反轉卡止板12之封裝體裝載面(下面)12a之各個第一已檢查封裝體5(1c)並移載；第二檢查機構(上攝影機)15，用以對移載於設置在裝載板14上面側之封裝體裝載面14a的各個第一已檢查封裝體5(1c)，自其上方位置進行外觀檢查；以及第二封裝體裝扣機構(第二傳送機構)16，用以裝扣裝載板14之封裝體裝載面14a之各個第二已檢查封裝體5(1c)。Further, in the inspection unit C of the present invention, for example, a loading plate (second inspection plate) 14 is provided for receiving the first of each of the package loading faces (lower) 12a of the reverse locking plate 12. The package 5 (1c) has been inspected and transferred; a second inspection mechanism (upper camera) 15 is provided for each of the first inspected packages 5 that are transferred to the package loading surface 14a disposed on the upper side of the loading plate 14 (1c), performing a visual inspection from the upper position thereof; and a second package fastening mechanism (second transfer mechanism) 16 for mounting each of the second inspected packages 5 of the package loading surface 14a of the loading plate 14 (1c).
因此，首先，可使裝載板(第二檢查板)14往上移動，使裝載板14之封裝體裝載面14a抵接卡止於反轉卡止板12之封裝體裝載面(下面)12a的第一已檢查封裝體5(1c)，藉此，承接第一已檢查封裝體5(1c)並移載至裝載板14之封裝體裝載面14a，接著，以第二檢查機構(上攝影機)15，對裝載於封裝體裝載面14a之第一已檢查封裝體5(1c)進行外觀檢查，再以第二封裝體裝扣機構(第二傳送機構)16裝扣該第二已檢查封裝體5(1c)並移載至後述之裝載平台17(封裝體裝載面17a)。Therefore, first, the loading plate (second inspection plate) 14 can be moved upward, so that the package loading surface 14a of the loading plate 14 abuts against the package loading surface (lower surface) 12a of the reverse locking plate 12. The first inspected package 5 (1c), whereby the first inspected package 5 (1c) is received and transferred to the package loading surface 14a of the loading plate 14, and then, the second inspection mechanism (upper camera) 15. Performing a visual inspection on the first inspected package 5 (1c) mounted on the package loading surface 14a, and then attaching the second inspected package to the second package mounting mechanism (second transfer mechanism) 16. 5(1c) is transferred to a loading platform 17 (package loading surface 17a) which will be described later.
進一步，於本發明之檢查單元C，例如設有：裝載平台(索引平台)17，用以輸送安裝裝扣於第二封裝體裝扣機構16之第二已檢查封裝體5(1c)；裝載平台移動手段18，用以使裝載平台17自封裝體裝載位置18a移動至封裝體篩選位置18b(自裝置前面9a側至裝置背面9b側)；以及封裝體移載機構19，用以自封裝體篩選位置18b之裝載平台17分別篩選良品與不良品並收容於托盤31。Further, in the inspection unit C of the present invention, for example, a loading platform (index platform) 17 is provided for transporting the second inspected package 5 (1c) mounted to the second package fastening mechanism 16; The platform moving means 18 is configured to move the loading platform 17 from the package loading position 18a to the package screening position 18b (from the device front 9a side to the device back 9b side); and the package transfer mechanism 19 for self-packaging The loading platform 17 of the screening position 18b separately screens the good and defective products and stores them in the tray 31.
裝載平台17係設置成其本體(封裝體裝載面17a)能上下移動自如。The loading platform 17 is provided such that its body (package loading surface 17a) can move up and down.
因此，首先，可以第二封裝體裝扣機構16將封裝體5移載至封裝體裝載位置18a之裝載平台17的封裝體裝載面17a，並以裝載平台移動手段18使裝載平台17移動至封裝體篩選位置18b，接著，根據第一檢查機構13與第二檢查機構15之檢查結果，從移動至封裝體篩選位置18b之裝載平台17的封裝體裝載面17a，將封裝體5篩選出良品與不良品並藉由封裝體移載機構19移載至托盤31(31a‧31b)。Therefore, first, the package body 5 can be transferred to the package loading surface 17a of the loading platform 17 of the package loading position 18a by the second package locking mechanism 16, and the loading platform 17 can be moved to the package by the loading platform moving means 18. The body screening position 18b, and then, based on the inspection result of the first inspection mechanism 13 and the second inspection mechanism 15, the package 5 is screened out from the package loading surface 17a of the loading platform 17 moved to the package screening position 18b. The defective product is transferred to the tray 31 (31a‧31b) by the package transfer mechanism 19.
此外，於封裝體檢查單元C，例如，在裝置前面9a側，自基板切斷單元B側朝封裝體收容單元D側依序配置：第一檢查位置(第一檢查部)20，具有反轉卡止板12與第一檢查機構(下攝影機)13；裝載平台17之封裝體裝載位置18a；以及第二檢查位置(第二檢查部)21，具有裝載板14與第二檢查機構(上攝影機)。Further, in the package inspection unit C, for example, on the device front surface 9a side, the first inspection position (first inspection portion) 20 is reversed from the substrate cutting unit B side toward the package storage unit D side. a locking plate 12 and a first inspection mechanism (lower camera) 13; a package loading position 18a of the loading platform 17; and a second inspection position (second inspection portion) 21 having a loading plate 14 and a second inspection mechanism (upper camera) ).
又，於封裝體檢查單元C，設有反轉卡止板之往返移動手段22，用以使反轉卡止板12於第一檢查位置(第一檢查部)20與第二檢查位置(第二檢查部)21間往返移動，在各個封裝體5(1c)吸附卡止於反轉卡止板12下面之封裝體裝載面12a的狀態下(各個封裝體5(1c)裝載於封裝體裝載面12a的狀態)，可自第一檢查位置(第一檢查部)20移動至第二檢查位置(第二檢查部)21。Further, the package inspection unit C is provided with a reciprocating means 22 for reversing the locking plate for reversing the locking plate 12 at the first inspection position (first inspection portion) 20 and the second inspection position (the The two inspection units are moved back and forth in a state in which the respective packages 5 ( 1 c ) are sucked and locked by the package mounting surface 12 a under the reverse locking plate 12 (each package 5 ( 1 c ) is loaded on the package; The state of the surface 12a can be moved from the first inspection position (first inspection portion) 20 to the second inspection position (second inspection portion) 21.
又，在封裝體檢查單元C之步驟，封裝體5按照下述順序移動，亦即：第一檢查位置20，用以檢查封裝體5之第一面(例如，基板面5a)；第二檢查位置21，用以檢查封裝體5之第二面(例如，模組面5b)；封裝體裝載位置18a；以及封裝體篩選位置18b。Moreover, in the step of the package inspection unit C, the package 5 is moved in the following order, that is, the first inspection position 20 for inspecting the first side of the package 5 (for example, the substrate surface 5a); the second inspection The position 21 is for inspecting the second side of the package 5 (for example, the module face 5b); the package loading position 18a; and the package screening position 18b.
(關於第一檢查部)(about the first inspection department)
如上述，於第一檢查部20設有反轉卡止板12與第一檢查機構(下攝影機)13。As described above, the first inspection unit 20 is provided with the reverse locking plate 12 and the first inspection mechanism (lower camera) 13.
於反轉卡止板12，例如於水平面上並與反轉卡止板12之移動方向成直角方向設有旋轉軸12b之軸芯方向。The inversion locking plate 12 is provided with a shaft core direction of the rotating shaft 12b at a right angle to the moving direction of the reverse locking plate 12, for example, on a horizontal surface.
因此，以該旋轉軸12b為軸芯，例如，可使之旋轉180度以使反轉卡止板12反轉(之後停止)。Therefore, the rotation shaft 12b is used as the core, and for example, it can be rotated by 180 degrees to reverse the reverse locking plate 12 (after stopping).
又，雖未圖示，但於反轉卡止板12設有適當的吸附固定手段(卡止手段)，以將各個封裝體5分別吸附固定(卡止)。Further, although not shown, an appropriate adsorption/fixing means (locking means) is provided in the reverse locking plate 12 to suction-fix (lock) each of the packages 5.
因此，如圖4(1)所示，將封裝體5(1c)吸附卡止於停止設定在反轉卡止板12上面側之封裝體裝載面12a，在此狀態下，可使反轉卡止板12以旋轉軸12c為中心反轉並停止設定成使該封裝體裝載面12a成為下面側。Therefore, as shown in Fig. 4 (1), the package 5 (1c) is suction-locked to the package mounting surface 12a which is set on the upper surface side of the reverse locking plate 12, and in this state, the reverse card can be made. The stopper plate 12 is reversed around the rotation shaft 12c, and is stopped so that the package mounting surface 12a becomes the lower surface side.
此時，由於封裝體5吸附卡止於反轉卡止板12下面側之封裝體裝載面12a，因此可防止封裝體5自封裝體裝載面12a(下面)落下。At this time, since the package 5 is suction-applied to the package mounting surface 12a on the lower surface side of the reverse locking plate 12, the package 5 can be prevented from falling from the package mounting surface 12a (lower surface).
又，如圖4(2)所示，於第一檢查部20，可以第一檢查機構(下攝影機)13對保持於反轉卡止板12下面之封裝體裝載面12a的各個封裝體5(1c)，自其下方位置進行檢查。Further, as shown in Fig. 4 (2), in the first inspection unit 20, the first inspection unit (lower camera) 13 can hold the respective packages 5 of the package mounting surface 12a held under the inversion locking plate 12 ( 1c), check from below.
此時，如圖4(3)所示，第一檢查機構(下攝影機)13係構成為可自裝置背面9b側往裝置前面9a側掃描，以進行第一檢查。At this time, as shown in Fig. 4 (3), the first inspection mechanism (lower camera) 13 is configured to be scanable from the apparatus back surface 9b side toward the apparatus front surface 9a side to perform the first inspection.
由於以第一封裝體裝扣機構11裝扣封裝體5之基板面5a側，因此在設定於反轉卡止板12上面側之封裝體裝載面12a上，基板面5a成為封裝體5的上面。Since the first package body fastening mechanism 11 is attached to the substrate surface 5a side of the package 5, the substrate surface 5a becomes the upper surface of the package 5 on the package mounting surface 12a set on the upper surface side of the reverse locking plate 12. .
反轉卡止板12反轉時，基板面5a成為封裝體5的下面，將成為下面之封裝體5之基板面5a作為第一檢查面，並自其下方位置以第一檢查機構(下攝影機)13進行第一檢查。When the reverse locking plate 12 is reversed, the substrate surface 5a becomes the lower surface of the package 5, and the substrate surface 5a of the lower package 5 is used as the first inspection surface, and the first inspection mechanism is provided from the lower position (lower camera) ) 13 performs the first check.
(關於第二檢查部)(about the second inspection department)
如上述，於第二檢查部21設有裝載板14與第二檢查機構(上攝影機)15。As described above, the second inspection unit 21 is provided with the loading plate 14 and the second inspection mechanism (upper camera) 15.
裝載板14係構成為可上下往返移動。The loading plate 14 is configured to be movable up and down.
亦即，如圖5(1)所示，反轉卡止板12移動至裝載板14之上方位置時，如圖5(2)所示，使裝載板14往上移動並使裝載板14之封裝體裝載面14a抵接卡止於反轉卡止板12下面(封裝體裝載面12a)的各個第一已檢查封裝體5(1c)，藉此，可承接反轉卡止板12之各個第一已檢查封裝體5(1c)並移載至裝載板14之封裝體裝載面14a。That is, as shown in Fig. 5 (1), when the reverse locking plate 12 is moved to the upper position of the loading plate 14, as shown in Fig. 5 (2), the loading plate 14 is moved upward and the loading plate 14 is moved. The package loading surface 14a abuts against each of the first inspected packages 5 ( 1 c ) that are locked under the inversion locking plate 12 (package loading surface 12 a ), whereby each of the reverse locking plates 12 can be received. The first package 5 (1c) has been inspected and transferred to the package loading surface 14a of the loading plate 14.
此時，裝載板14係構成為可將各個第一已檢查封裝體5(1c)(吸附)固定於其封裝體裝載面14a。At this time, the loading plate 14 is configured to be able to fix (adsorb) each of the first inspected packages 5 (1c) to the package loading surface 14a.
裝載板14係如圖5(3)所示，可在將來自反轉卡止板12之各個封裝體5(1c)裝載於裝載板14之封裝體裝載面14a的狀態下，往下移動。As shown in Fig. 5 (3), the loading plate 14 can be moved downward while the respective packages 5 (1c) from the reverse locking plates 12 are mounted on the package loading surface 14a of the loading plate 14.
此時，裝載於裝載板14之封裝體裝載面14a之第一已檢查封裝體5(1c)的上面成為模組面5b。At this time, the upper surface of the first inspected package 5 (1c) mounted on the package loading surface 14a of the loading plate 14 serves as the module surface 5b.
又，此時，例如在裝載板14之封裝體裝載面14a(上面)與反轉卡止板12之封裝體裝載面12a(下面)間設置所需間隔L亦可。藉此，於此所需間隔L內，可以第二檢查機構(上攝影機)15，將裝載於裝載板14之封裝體裝載面14a(上面)之各個封裝體5(1c)的模組面5b作為第二檢查面，自其上方位置進行檢查。Moreover, at this time, for example, a required interval L may be provided between the package mounting surface 14a (upper surface) of the loading plate 14 and the package mounting surface 12a (lower surface) of the reverse locking plate 12. Thereby, in the required interval L, the second inspection mechanism (upper camera) 15 can mount the module face 5b of each package 5 (1c) mounted on the package loading surface 14a (top surface) of the loading plate 14 As the second inspection surface, the inspection is performed from the upper position.
如圖6(1)所示，可使反轉卡止板12從往下移動之裝載板14的上方位置移動至第一檢查部20側。As shown in Fig. 6 (1), the reverse locking plate 12 can be moved from the upper position of the loading plate 14 moving downward to the first inspection portion 20 side.
此時，如上述，可以第二檢查機構(上攝影機)，對裝載板14之封裝體裝載面14a(上面)自其上方位置進行檢查。At this time, as described above, the second inspection mechanism (upper camera) can inspect the package loading surface 14a (upper surface) of the loading plate 14 from the upper position.
又，如圖6(2)所示，藉由使第二檢查機構(上攝影機)自裝置背面9b側掃描至裝置前面9a側，可檢查第一已檢查封裝體5之模組面5b。Further, as shown in Fig. 6 (2), the module surface 5b of the first inspected package 5 can be inspected by scanning the second inspection means (upper camera) from the apparatus back surface 9b side to the apparatus front side 9a side.
亦即，於第二檢查部21，首先，可自反轉卡止板12之封裝體裝載面(下面)12承接第一已檢查封裝體5(1c)，並移載至裝載板14之封裝體裝載面14a，在此狀態下，使裝載板14往下移動，接著，以第二檢查機構(上攝影機)15，對裝載於裝載板14之封裝體裝載面14a(上面)之第一已檢查封裝體5(1c)的模組面5b側進行檢查。That is, in the second inspection unit 21, first, the first inspected package 5 (1c) can be received from the package loading surface (lower surface) 12 of the reverse locking plate 12, and transferred to the package of the loading board 14. The body loading surface 14a moves the loading plate 14 downward in this state, and then, with the second inspection mechanism (upper camera) 15, the first package mounting surface 14a (top surface) mounted on the loading plate 14 is Check the side of the module face 5b of the package 5 (1c) for inspection.
因此，可連續檢查各個檢查前之封裝體5(1c)之基板面5a與模組面5b，得到第二已檢查封裝體5(1c)。Therefore, the substrate surface 5a and the module surface 5b of the package 5 (1c) before each inspection can be continuously inspected to obtain the second inspected package 5 (1c).
接著，可以第二封裝體裝扣機構16，將封裝體裝載面14a(上面)之第二已檢查封裝體5(1c)輸送安裝於裝載平台17(索引平台)。Next, the second package mounting mechanism 16 can be used to transport and mount the second inspected package 5 (1c) of the package loading surface 14a (upper surface) to the loading platform 17 (index platform).
此外，使第二檢查機構與第二封裝體裝扣機構(第二傳送機構)為一體移動之構成亦可。Further, the second inspection mechanism may be configured to move integrally with the second package attachment mechanism (second transfer mechanism).
(關於裝載平台)(about loading platform)
以第二檢查機構15對各個封裝體5進行第二檢查後，可在各個第二已檢查封裝體5中，以第二封裝體裝扣機構16將所需個數輸送安裝於裝載平台(索引平台)17之封裝體裝載面17a並吸附固定。After performing the second inspection on each of the packages 5 by the second inspection mechanism 15, the required number can be transported and mounted on the loading platform in the second package inspection mechanism 5 in each of the second inspected packages 5. The package loading surface 17a of the platform 17 is adsorbed and fixed.
又，於裝載平台(索引平台)17之封裝體裝載面17a，可採用將封裝體5裝載成格子狀的構成。Moreover, the package mounting surface 17a of the loading platform (index platform) 17 can be configured to mount the package 5 in a lattice shape.
此時，例如如圖7所示，將第二已檢查封裝體5裝扣5個於第二封裝體裝扣機構16，並輸送安裝於裝載平台17時，可以3個、2個的順序空出1個封裝體寬度M之間隔來放置第二已檢查封裝體5。At this time, for example, as shown in FIG. 7, the second inspected package 5 is attached to the second package mounting mechanism 16 and transported to the loading platform 17, and may be empty in three or two. The second inspected package 5 is placed at intervals of one package width M.
第一檢查與第二檢查之兩者檢查合格的第二已檢查封裝體(第一第二已檢查封裝體)5為良品。The second inspected package (first and second inspected package) 5 that has passed the inspection of both the first inspection and the second inspection is good.
此外，裝載平台17在封裝體裝載位置18a往上移動，藉此可承接卡止於反轉卡止板12之封裝體裝載面12a的封裝體5(1c)，並移載至其封裝體裝載面17a。Further, the loading platform 17 is moved upward at the package loading position 18a, whereby the package 5 (1c) that is locked to the package loading surface 12a of the reverse locking plate 12 can be received and transferred to its package loading. Face 17a.
(關於封裝體檢查單元之檢查方法)(About the inspection method of the package inspection unit)
首先，於封裝體檢查單元C之第一檢查部20，將第一封裝體裝扣機構(第一傳送機構)11所裝扣之各個封裝體5(1c)輸送安裝於反轉卡止板12上面之封裝體裝載面12a，並吸附卡止。First, in the first inspection unit 20 of the package inspection unit C, each package 5 ( 1 c ) to which the first package fastening mechanism (first transfer mechanism) 11 is attached is transported and mounted to the reverse locking plate 12 . The upper package loading surface 12a is adsorbed and latched.
此時，卡止於反轉卡止板12之封裝體5上面為基板面5a。At this time, the upper surface of the package 5 locked to the reverse locking plate 12 is the substrate surface 5a.
接著，如圖4(1)所示，使反轉卡止板12以旋轉軸12b為中心反轉，將封裝體裝載面12a作為下面，如圖4(2)所示，以第一檢查機構(下攝影機)13自下方位置掃描該面以進行(第一)檢查。Next, as shown in Fig. 4 (1), the reverse locking plate 12 is reversed about the rotation shaft 12b, and the package loading surface 12a is set as the lower side, as shown in Fig. 4 (2), with the first inspection mechanism. (Lower camera) 13 scans the face from the lower position for the (first) inspection.
接著，使反轉卡止板12反轉的狀態下，藉由反轉卡止板之往返移動手段22移動至第二檢查部21側，使裝載板14往上移動承接第一已檢查封裝體5(1c)，並移載至裝載板14上面側之封裝體裝載面14a，在此狀態下，使裝載板14往下移動至所需位置。Next, in a state where the reverse locking plate 12 is reversed, the reciprocating means 22 of the reverse locking plate is moved to the second inspection portion 21 side, and the loading plate 14 is moved upward to receive the first inspected package. 5 (1c), and transferred to the package loading surface 14a on the upper side of the loading plate 14, in this state, the loading plate 14 is moved downward to the desired position.
此時，以裝載板14之封裝體裝載面14a吸附卡止封裝體5(1c)亦可。At this time, the package mounting body 5 (1c) may be adsorbed by the package mounting surface 14a of the loading board 14.
接著，以第二檢查機構(上攝影機)15，自上方位置掃描裝載於裝載板14之封裝體裝載面(上面)14a之第一已檢查封裝體5(1c)，以進行(第二)檢查。Next, the first inspection package 5 (1c) mounted on the package loading surface (upper surface) 14a of the loading plate 14 is scanned from the upper position by the second inspection mechanism (upper camera) 15 to perform the (second) inspection. .
接著，以第二封裝體裝扣機構(第二傳送機構)16將第二已檢查封裝體5(1c)輸送安裝於封裝體裝載位置18a之裝載平台(索引平台)17。Next, the second inspected package 5 (1c) is transported to the loading platform (index platform) 17 of the package loading position 18a by the second package fastening mechanism (second transfer mechanism) 16.
接著，使裝載第二已檢查封裝體5(1c)之裝載平台17移動至封裝體篩選位置18b，藉由封裝體移載機構19分別將第二已檢查封裝體5(1c)之良品移載至良品托盤31a、不良品移載至不良品托盤31b，以進行篩選。Next, the loading platform 17 loaded with the second inspected package 5 (1c) is moved to the package screening position 18b, and the package of the second inspected package 5 (1c) is transferred by the package transfer mechanism 19, respectively. The good product tray 31a and the defective product are transferred to the defective product tray 31b for screening.
(關於封裝體之檢查面)(About the inspection surface of the package)
於第一檢查部20，以第一封裝體裝扣機構11裝扣各個封裝體5(1c)之基板面5a側，並裝載於反轉卡止板(第一檢查板)12，藉此，可使反轉卡止板12之各個封裝體5之基板面5a為上面。In the first inspection unit 20, the first package body fastening mechanism 11 is attached to the substrate surface 5a side of each package 5 (1c), and is placed on the reverse locking plate (first inspection plate) 12, whereby The substrate surface 5a of each of the packages 5 of the inversion locking plate 12 can be made top.
在此狀態下，藉由使反轉卡止板12反轉，可使各個封裝體5之基板面5a為下面，並以該下面側之基板面5a作為第一檢查面。In this state, by inverting the reverse locking plate 12, the substrate surface 5a of each package 5 can be made lower, and the substrate surface 5a on the lower surface side can be used as the first inspection surface.
此時，各個封裝體5上面之模組面5b接觸反轉卡止板12之封裝體裝載面12a。At this time, the module surface 5b on the upper surface of each package 5 contacts the package loading surface 12a of the reverse locking plate 12.
因此，可以第一檢查機構(下攝影機)13，對裝載於反轉卡止板12之各個封裝體5下面的基板面5a，自其下方位置進行檢查。Therefore, the first inspection mechanism (lower camera) 13 can inspect the lower surface of the substrate surface 5a mounted on the lower surface of each of the packages 5 of the reverse locking plate 12.
又，於第二檢查部21，對藉由反轉卡止板12之往返移動手段22自第一檢查部20移動至第二檢查部(第二檢查位置)21之反轉卡止板12，使裝載板(第二檢查板)14往上移動，藉此，可使裝載板14之封裝體裝載面14a抵接卡止於反轉卡止板12下面(封裝體裝載面12a)之各個第一已檢查封裝體5的基板面5a，承接卡止於反轉卡止板12之各個封裝體5(1c)，並移載至裝載板14。Further, in the second inspection unit 21, the reverse locking plate 12 is moved from the first inspection unit 20 to the second inspection unit (second inspection position) 21 by the reciprocating movement means 22 of the reverse locking plate 12. The loading plate (second inspection plate) 14 is moved upward, whereby the package loading surface 14a of the loading plate 14 can be abutted against the underside of the reverse locking plate 12 (package loading surface 12a). The substrate surface 5a of the package 5 has been inspected, and the respective packages 5 (1c) of the reverse locking plate 12 are received and transferred to the loading plate 14.
此時，移載至裝載板14之封裝體裝載面14a之各個封裝體5的模組面5b為上面，成為第二檢查面。At this time, the module surface 5b of each of the packages 5 transferred to the package loading surface 14a of the loading plate 14 is the upper surface, and becomes the second inspection surface.
因此，可以第二檢查機構(上攝影機)15，對裝載於裝載板14之各個封裝體5上面的模組面5b(第二檢查面)，自其上方位置進行檢查。Therefore, the second inspection mechanism (upper camera) 15 can inspect the module surface 5b (second inspection surface) mounted on the respective packages 5 of the loading plate 14 from the upper position.
(關於封裝體檢查單元之檢查方法的作用效果)(The effect of the inspection method of the package inspection unit)
根據本發明，切斷已成形基板1形成封裝體(製品)5時，由於可連續檢查封裝體(製品)5之基板面5a與模組面5b兩面，因此可獲得高品質‧高可靠性之製品5。According to the present invention, when the packaged substrate 1 is formed by cutting the formed substrate 1, since both the substrate surface 5a and the module surface 5b of the package (product) 5 can be continuously inspected, high quality and high reliability can be obtained. Article 5.
又，根據本發明，切斷已成形基板1形成封裝體(製品)5時，由於可連續檢查封裝體(製品)5之基板面5a與模組面5b兩面，因此可提升製品5之生產率。Moreover, according to the present invention, when the packaged substrate 1 is formed by cutting the formed substrate 1, since both the substrate surface 5a of the package (product) 5 and the module surface 5b can be continuously inspected, the productivity of the product 5 can be improved.
因此，切斷已成形基板形成封裝體(製品)5時，為獲得高品質‧高可靠性之製品5及提升製品5之生產率，能提供基板之切斷方法及其裝置，以檢查製品5之基板面5a與模組面5b表背兩面(第一面與第二面)。Therefore, when the formed substrate is cut into the package (product) 5, in order to obtain the productivity of the high-quality ‧ high-reliability product 5 and the lifted product 5, the method of cutting the substrate and the apparatus thereof can be provided to inspect the product 5 The substrate surface 5a and the module surface 5b are both surfaces (first surface and second surface).
(關於其他封裝體檢查單元之檢查方法)(About the inspection method of other package inspection units)
其他檢查方法所使用之檢查單元的構成，係和自上方觀看第二檢查部(位置)21、與裝載平台17之封裝體裝載位置18a時相同位置的構成，且第一檢查部20之構成與上述實施例相同。The configuration of the inspection unit used in the other inspection method is the same as the configuration in which the second inspection portion (position) 21 and the package loading position 18a of the loading platform 17 are viewed from above, and the configuration of the first inspection portion 20 is The above embodiments are the same.
於此種其他檢查方法所使用之檢查單元，例如可構成為使裝載板(第二檢查板)14、與裝載平台17位於(大致)相同高度位置，且裝載板14、與裝載平台17在封裝體裝載位置18a不會碰撞。The inspection unit used in such other inspection methods may be configured, for example, such that the loading plate (second inspection plate) 14 is at (substantially) the same height position as the loading platform 17, and the loading plate 14 and the loading platform 17 are packaged. The body loading position 18a does not collide.
於此種其他檢查方法所使用之檢查單元，例如可連續進行下列步驟，亦即：裝扣步驟，於封裝體裝載位置18a(第二檢查位置21)，藉由第二封裝體裝扣機構16自裝載板14之封裝體裝載面14a裝扣所需個數封裝體5(例如，如上述之5個封裝體5)；移載步驟，於封裝體裝載位置18a(第二檢查位置21)，將第二封裝體裝扣機構16裝扣之封裝體5(按照3個、2個的順序)移載至裝載平台17之封裝體裝載面17a；以及篩選移載步驟，於封裝體篩選位置18b，藉由封裝體移載機構19將封裝體5篩選出良品與不良品，並移載至托盤31(31a‧31b)。For the inspection unit used in such other inspection methods, for example, the following steps can be continuously performed, that is, the fastening step, at the package loading position 18a (second inspection position 21), by the second package fastening mechanism 16 The package mounting surface 14a of the loading board 14 is loaded with a required number of packages 5 (for example, the five packages 5 as described above); the transfer step is at the package loading position 18a (second inspection position 21), The package 5 (in the order of 3 or 2) to which the second package mounting mechanism 16 is attached is transferred to the package loading surface 17a of the loading platform 17; and the screening transfer step is performed at the package screening position 18b. The package 5 is screened out of the package and the defective product by the package transfer mechanism 19, and transferred to the tray 31 (31a‧31b).
此時，裝載平台17，於封裝體裝載位置18a、和不與裝載板14碰撞之封裝體篩選位置18b間往返移動，並且，在封裝體裝載位置18a移載所需個數封裝體5至封裝體裝載面17a，且在封裝體篩選位置18b，藉由封裝體移載機構19將封裝體5篩選出良品與不良品，並移載至托盤31(31a‧31b)。At this time, the loading platform 17 reciprocates between the package loading position 18a and the package screening position 18b that does not collide with the loading plate 14, and transfers the required number of packages 5 to the package at the package loading position 18a. At the package loading surface 17a, at the package screening position 18b, the package 5 is screened out of the package and the defective product by the package transfer mechanism 19, and transferred to the tray 31 (31a‧31b).
又，此時，裝載板14，例如於裝載平台17之高度位置、和裝載平台17之下方位置且不與裝載平台17碰撞的位置間，上下往返移動。Further, at this time, the loading plate 14 moves up and down, for example, between the height position of the loading platform 17 and the position below the loading platform 17 and does not collide with the loading platform 17.
或者，裝載板14，例如停止於裝載平台17之下方位置且不與裝載平台17碰撞之位置的狀態亦可。Alternatively, the loading plate 14 may be in a state of, for example, stopping at a position below the loading platform 17 and not at a position colliding with the loading platform 17.
關於第一檢查，首先，於封裝體檢查單元C之第一檢查部20，將裝扣於第一封裝體裝扣機構(第一傳送機構)11之各個封裝體5(1c)輸送安裝於反轉卡止板12上面之封裝體裝載面12a，並吸附卡止。Regarding the first inspection, first, in the first inspection unit 20 of the package inspection unit C, each package 5 (1c) attached to the first package fastening mechanism (first transfer mechanism) 11 is transported and mounted on the opposite side. The package loading surface 12a on the card stop plate 12 is transferred and sucked.
接著，以旋轉軸12b為中心使反轉卡止板12反轉，將封裝體裝載面12a作為下面，藉由第一檢查機構(下攝影機)13自下方位置掃描，以對封裝體5之基板面5a進行(第一)檢查。Next, the reverse locking plate 12 is reversed around the rotating shaft 12b, and the package loading surface 12a is used as the lower surface, and the first inspection mechanism (lower camera) 13 scans from the lower position to the substrate of the package 5. Face 5a performs a (first) inspection.
接著，關於第二檢查，使反轉卡止板12反轉的狀態下，藉由反轉卡止板之往返移動手段22移動至封裝體裝載位置18a，且使裝載板14往上移動承接第一已檢查封裝體5(1c)，並移載至裝載板14上面之封裝體裝載面14a，在此狀態下，使裝載板14往下移動至所需位置，藉由第二檢查機構15掃描裝載於封裝體裝載面14a之封裝體5的模組面5a，以進行(第二)檢查。Next, in the second inspection, in a state where the reverse locking plate 12 is reversed, the reciprocating means 22 of the reverse locking plate is moved to the package loading position 18a, and the loading plate 14 is moved upward. The package 5 (1c) has been inspected and transferred to the package loading surface 14a above the loading plate 14, in which state the loading plate 14 is moved down to the desired position, and scanned by the second inspection mechanism 15. The module surface 5a of the package 5 mounted on the package loading surface 14a is subjected to a (second) inspection.
此時，亦即，第二檢查時，先使裝載平台17(17a)位於封裝體篩選位置18b，以使裝載平台17不會和存在於封裝體裝載位置18a之裝載板14(以及第二檢查機構15)互相碰撞。At this time, that is, at the second inspection, the loading platform 17 (17a) is first placed at the package screening position 18b so that the loading platform 17 does not overlap with the loading plate 14 present at the package loading position 18a (and the second inspection). The institutions 15) collide with each other.
此外，第二檢查時，當裝載平台17位於封裝體裝載位置18a時，使裝載板14與第二檢查機構15位於不和裝載平台17碰撞之裝載平台17的下方。Further, at the time of the second inspection, when the loading platform 17 is located at the package loading position 18a, the loading plate 14 and the second inspection mechanism 15 are positioned below the loading platform 17 that does not collide with the loading platform 17.
藉由第二封裝體裝扣機構16，可將封裝體5自裝載板14(14a)移載至裝載平台17(17a)。The package 5 can be transferred from the loading plate 14 (14a) to the loading platform 17 (17a) by the second package fastening mechanism 16.
此時，可將封裝體5自裝載板14(14a)分別逐次移載所需個數至裝載平台17(17a)。At this time, the package 5 can be sequentially transferred from the loading plate 14 (14a) to the loading platform 17 (17a).
又，此時，如上述，使於封裝體裝載位置18a之裝載板14的封裝體裝載面14a、和於封裝體篩選位置18b之裝載平台17的封裝體裝載面17a為相同高度位置亦可。Moreover, in this case, as described above, the package mounting surface 14a of the loading plate 14 at the package mounting position 18a and the package mounting surface 17a of the loading platform 17 at the package screening position 18b may be at the same height position.
此外，此時，如上述，使裝載板14位於不和裝載平台17碰撞之裝載平台17的下方亦可。Further, at this time, as described above, the loading plate 14 may be positioned below the loading platform 17 that does not collide with the loading platform 17.
首先，使裝載平台17移動至封裝體篩選位置18b，並以封裝體移載機構19對封裝體5進行篩選‧移載至托盤31(31a‧31b)。First, the loading platform 17 is moved to the package screening position 18b, and the package 5 is screened by the package transfer mechanism 19 and transferred to the tray 31 (31a‧31b).
此時，於封裝體裝載位置18a，將裝載板14往上移動至裝載平台17之高度，並以第二封裝體裝扣機構16裝扣裝載於裝載板14之封裝體裝載面14a之封裝體5的所需個數，且將裝載板14往下移動至所需位置。At this time, at the package loading position 18a, the loading plate 14 is moved up to the height of the loading platform 17, and the package body mounted on the package loading surface 14a of the loading plate 14 is attached by the second package fastening mechanism 16. The required number of 5s and the loading plate 14 are moved down to the desired position.
接著，使裝載平台17自封裝體篩選位置18b移動至封裝體裝載位置18a，再將裝扣於第二封裝體裝扣機構16之封裝體5的所需個數移載至裝載平台17之封裝體裝載面17a的所需位置。Next, the loading platform 17 is moved from the package screening position 18b to the package loading position 18a, and the required number of packages 5 mounted to the second package locking mechanism 16 is transferred to the package of the loading platform 17. The desired position of the body loading surface 17a.
接著，使裝載平台17移動至封裝體篩選位置18b，並以封裝體移載機構19對裝載平台17(17a)之已檢查封裝體5的所需個數進行篩選‧移載至托盤31(31a‧31b)。Next, the loading platform 17 is moved to the package screening position 18b, and the required number of the inspected packages 5 of the loading platform 17 (17a) is screened by the package transfer mechanism 19, and transferred to the tray 31 (31a). ‧31b).
將上述封裝體5自裝載板14移載至裝載平台17的動作，可反覆進行。The operation of transferring the package 5 from the loading plate 14 to the loading platform 17 can be repeated.
因此，於本實施例，可獲得與上述實施例相同之作用效果。Therefore, in the present embodiment, the same operational effects as those of the above embodiment can be obtained.
亦即，根據本發明，切斷已成形基板1形成製品(封裝體5)時，可獲得高品質‧高可靠性之製品。That is, according to the present invention, when the formed substrate 1 is cut into a product (package 5), a product of high quality and high reliability can be obtained.
又，根據本發明，切斷已成形基板形成製品(封裝體5)時，可提升製品之生產率。Moreover, according to the present invention, when the formed substrate-formed product (package 5) is cut, the productivity of the product can be improved.
又，本發明為獲得高品質‧高可靠性之製品及提升製品5之生產率，能提供基板之切斷方法及其裝置，其可檢查製品(封裝體5)之基板面5a、與模組面5b表背兩面(第一面與第二面)。Further, the present invention provides a method for cutting a substrate and a device thereof for obtaining a high-quality ‧ high-reliability product and a productivity of the reinforced product 5, which can inspect the substrate surface 5a of the product (package 5) and the module surface 5b on both sides of the back (first side and second side).
此外，如上述，以第二封裝體裝扣機構16自裝載板14之封裝體裝載面14a裝扣封裝體5時，使裝載板14位於(停止於)裝載平台17之下方的狀態下，以第二封裝體裝扣機構16自封裝體裝載面14a裝扣封裝體5亦可。Further, as described above, when the package body 5 is attached from the package loading surface 14a of the loading plate 14 by the second package mounting mechanism 16, the loading plate 14 is placed (stopped) below the loading platform 17, The second package mounting mechanism 16 may also be used to attach the package 5 from the package loading surface 14a.
本發明並不限定於上述實施例，在不脫離本發明之主旨的範圍內，可依照需要，任意且適當地變更‧選擇來採用。The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately changed and selected as needed within the scope of the gist of the present invention.
(關於第一檢查位置與第二檢查位置在相同位置時)(When the first inspection position and the second inspection position are at the same position)
在上述實施例，於上述第一檢查部(位置)20與第二檢查部(位置)21，雖分別已例示檢查各個封裝體5(5a‧5b)之構成，但第一檢查位置20與第二檢查位置21，於封裝體檢查單元C，從上方觀看時位於相同位置亦可。In the above-described embodiment, the first inspection unit (position) 20 and the second inspection unit (position) 21 are respectively exemplified to check the configuration of each package 5 (5a‧5b), but the first inspection position 20 and the The second inspection position 21 may be located at the same position when viewed from above in the package inspection unit C.
將該第一檢查位置20與第二檢查位置21設於相同位置之實施例，例如可構成為將裝載板(第二檢查板)14設於反轉卡止板(第一檢查板)12之下方位置且可上下移動自如，且可於反轉卡止板12與裝載板14間分別掃描第一檢查機構(下攝影機)與第二檢查機構(上攝影機)。In the embodiment in which the first inspection position 20 and the second inspection position 21 are provided at the same position, for example, the loading plate (second inspection plate) 14 may be provided in the reverse locking plate (first inspection plate) 12 . The lower position is movable up and down, and the first inspection mechanism (lower camera) and the second inspection mechanism (upper camera) can be scanned between the reverse locking plate 12 and the loading plate 14, respectively.
亦即，首先，以第一檢查機構(下攝影機)掃描卡止於已反轉之反轉卡止板(第一檢查板)12之封裝體裝載面12a之各個封裝體5(1c)的基板面5a以進行檢查。That is, first, the substrate of each package 5 (1c) that is locked to the package loading surface 12a of the inverted reverse latching plate (first inspection plate) 12 is scanned by the first inspection mechanism (lower camera). Face 5a is for inspection.
接著，使設置於反轉卡止板12下方位置之裝載板(第二檢查板)14往上移動承接各個封裝體5(1c)，並移載至封裝體裝載面14a，且使裝載板14往下移動返回所需位置，藉此，以第二檢查機構(上攝影機)掃描裝載於封裝體裝載面14a之各個封裝體5(1c)的模組面5a以進行檢查。Next, the loading plate (second inspection plate) 14 provided at a position below the reverse locking plate 12 is moved upward to receive the respective packages 5 (1c), transferred to the package loading surface 14a, and the loading plate 14 is placed. The lower portion is moved back to the desired position, whereby the module surface 5a of each of the packages 5 (1c) mounted on the package loading surface 14a is scanned by the second inspection mechanism (upper camera) for inspection.
接著，以第二封裝體裝扣機構16將第二已檢查封裝體5移載至裝載平台17之封裝體裝載面17a。Next, the second inspected package 5 is transferred to the package loading surface 17a of the loading platform 17 by the second package fastening mechanism 16.
因此，藉由在相同位置實施第一檢查與第二檢查，可獲得與上述實施例相同之作用效果。Therefore, by performing the first inspection and the second inspection at the same position, the same operational effects as those of the above embodiment can be obtained.
此外，此時，使第一檢查機構(下攝影機)與第二檢查機構(上攝影機)為一體移動之構成亦可。Further, at this time, the first inspection mechanism (lower camera) and the second inspection mechanism (upper camera) may be configured to move integrally.
(關於封裝體之檢查面的順序)(The order of the inspection faces of the package)
於上述各實施例，封裝體之基板面與模組面可按照此順序或相反順序進行檢查。In the above embodiments, the substrate surface and the module surface of the package may be inspected in this order or in reverse order.
亦即，在上述各實施例雖已例示下述構成，亦即，首先，以封裝體5之基板面5a為第一面進行檢查，接著，以封裝體5之模組面5b為第二面進行檢查，但採用以封裝體5之模組面5b為第一面進行檢查，接著，以封裝體5之基板面5a為第二面進行檢查的構成亦可。That is, in the above embodiments, the following configuration is exemplified, that is, first, the substrate surface 5a of the package 5 is used as the first surface, and then the module surface 5b of the package 5 is used as the second surface. The inspection is performed, but the inspection is performed by using the module surface 5b of the package 5 as the first surface, and then the substrate surface 5a of the package 5 may be inspected as the second surface.
此時，例如，將已成形基板1以其樹脂成形體3側作為上面，輸送至切斷平台33並安裝，使用形成於樹脂成形體5之基板面(緣部)之對準標記進行對準，並在切斷線4切斷，接著，如上述，可依序且連續檢查封裝體5之模組面5b與基板面5a。At this time, for example, the formed substrate 1 is conveyed to the cutting table 33 with the resin molded body 3 side as the upper surface, and is mounted, and aligned using the alignment marks formed on the substrate surface (edge portion) of the resin molded body 5. Then, the cutting line 4 is cut, and then, as described above, the module surface 5b of the package 5 and the substrate surface 5a can be sequentially and continuously inspected.
(關於僅進行封裝體之任一面的檢查)(About checking only one side of the package)
又，於封裝體檢查單元C，僅檢查封裝體5之任一單面(僅任一單面)時，可省略以第二檢查部21進行之檢查。Further, in the package inspection unit C, when only one of the single faces (only one of the faces) of the package 5 is inspected, the inspection by the second inspection unit 21 can be omitted.
僅檢查封裝體5之任一面(5a或5b)之構成的實施例，例如構成為首先，可以第一檢查機構(下攝影機)15檢查已反轉之反轉卡止板12之封裝體裝載面12a之封裝體5(1c)之第一面(基板面5a或模組面5b)，接著，將封裝體5(1c)卡止於封裝體裝載面12a的狀態下，承接封裝體5(1c)，並移載至裝載平台17之封裝體裝載面17a。An embodiment in which only one of the faces (5a or 5b) of the package 5 is inspected is configured, for example, first, the first inspection mechanism (lower camera) 15 can inspect the package loading surface of the inverted reverse locking plate 12 The first surface (substrate surface 5a or the module surface 5b) of the package 5 (1c) of 12a, and then the package 5 (1c) is locked to the package mounting surface 12a, and the package 5 (1c) is received. And transferred to the package loading surface 17a of the loading platform 17.
此時，例如可使裝載平台17往上移動，又，亦可使反轉卡止板12往下移動。At this time, for example, the loading platform 17 can be moved upward, and the reverse locking plate 12 can be moved downward.
亦即，由於如上述構成，可將封裝體5(1c)成批自反轉卡止板12(12a)移載至裝載平台17(17a)，因此，可提升製品(封裝體)之生產率。That is, with the above configuration, the package 5 (1c) can be transferred from the inversion locking plate 12 (12a) to the loading platform 17 (17a) in batches, so that the productivity of the product (package) can be improved.
因此，可有效率地僅檢查封裝體5之任一面，可提升製品(封裝體)之生產率。Therefore, it is possible to efficiently inspect only one side of the package 5, and the productivity of the article (package) can be improved.
又，於僅檢查封裝體5之任一面之構成的實施例，可使用第二封裝體裝扣機構16。Further, in the embodiment in which only the configuration of either one of the packages 5 is inspected, the second package attaching mechanism 16 can be used.
例如，以第一檢查機構13進行第一檢查後，首先，使反轉卡止板12進一步反轉，而使封裝體裝載面12a作為上面，接著，以第二封裝體裝扣機構16將裝載於封裝體裝載面12a之封裝體5移載至裝載平台17之封裝體裝載面17a。For example, after the first inspection by the first inspection mechanism 13, first, the reverse locking plate 12 is further reversed to have the package loading surface 12a as the upper surface, and then the second package locking mechanism 16 is loaded. The package 5 on the package loading surface 12a is transferred to the package loading surface 17a of the loading platform 17.
此時，例如，可使裝載平台17往上移動，或使反轉卡止板12往下移動。At this time, for example, the loading platform 17 can be moved upward or the reverse locking plate 12 can be moved downward.
又，可將裝載平台17之封裝體裝載面17a、與反轉卡止板12之封裝體裝載面12a設定於相同高度(水平面上)。Moreover, the package mounting surface 17a of the loading platform 17 and the package mounting surface 12a of the reverse locking plate 12 can be set at the same height (horizontal surface).
因此，可有效率地僅檢查封裝體5之任一面，可提升製品(封裝體)之生產率。Therefore, it is possible to efficiently inspect only one side of the package 5, and the productivity of the article (package) can be improved.
又，於僅檢查封裝體5之任一面之構成的實施例，使用第二封裝體裝扣機構16、與裝載板(第二檢查板)14亦可。Further, in the embodiment in which only one of the surfaces of the package 5 is inspected, the second package attaching mechanism 16 and the loading plate (second inspection plate) 14 may be used.
例如，首先，以第一檢查機構(下攝影機)15檢查已反轉之反轉卡止板12之封裝體裝載面12a之封裝體5(1c)之第一面(基板面5a或模組面5b)，接著，將封裝體5(1c)卡止於封裝體裝載面12a的狀態下，承接封裝體5(1c)，並移載至裝載板14之封裝體裝載面14a，接著，以第二封裝體裝扣機構16將裝載板14之封裝體裝載面14a上之封裝體5(1c)移載至裝載平台17之封裝體裝載面17a。For example, first, the first surface (substrate surface 5a or the module surface) of the package 5 (1c) of the package loading surface 12a of the reversed locking plate 12 that has been reversed is inspected by the first inspection mechanism (lower camera) 15. 5b) Next, in a state in which the package 5 (1c) is locked to the package mounting surface 12a, the package 5 (1c) is received and transferred to the package loading surface 14a of the loading plate 14, and then, The second package fastening mechanism 16 transfers the package 5 (1c) on the package loading surface 14a of the loading plate 14 to the package loading surface 17a of the loading platform 17.
因此，可有效率地僅檢查封裝體5之任一面，可提升製品(封裝體)之生產率。Therefore, it is possible to efficiently inspect only one side of the package 5, and the productivity of the article (package) can be improved.
(關於其他基板切斷單元之構成)(Regarding the structure of other substrate cutting unit)
又，於本發明之基板之切斷裝置9之基板切斷單元B，雖使用刀片(旋轉切斷刀)作為基板之切斷手段，但於本發明之基板之切斷裝置9，使用具有雷射光、線鋸、帶鋸、高壓切斷水等作為切斷手段之基板切斷單元亦可。Further, in the substrate cutting unit B of the substrate cutting device 9 of the present invention, a blade (rotary cutting blade) is used as the cutting means for the substrate, but the cutting device 9 of the substrate of the present invention has a thunder. A substrate cutting unit that serves as a cutting means such as a light beam, a wire saw, a band saw, and a high-pressure cutting water may be used.
1．．．已成形基板1. . . Formed substrate
1a．．．基板面1a. . . Substrate surface
1b．．．模組面1b. . . Modular surface
2．．．基板2. . . Substrate
3．．．樹脂成形體3. . . Resin molded body
4．．．切斷線4. . . Cutting line
5．．．封裝體5. . . Package
5a．．．基板面5a. . . Substrate surface
5b．．．模組面5b. . . Modular surface
5(1c)．．．封裝體集合體5(1c). . . Package assembly
6．．．基板部6. . . Substrate part
7．．．樹脂部7. . . Resin department
8．．．球形電極8. . . Spherical electrode
9．．．基板之切斷裝置9. . . Substrate cutting device
9a．．．裝置前面9a. . . Front of the device
9b．．．裝置背面9b. . . Back of device
10．．．連結具10. . . Linkage
11．．．第一封裝體裝扣機構(第一傳送機構)11. . . First package body fastening mechanism (first conveying mechanism)
12．．．反轉卡止板(第一檢查板)12. . . Reverse the stop plate (first check plate)
12a．．．封裝體裝載面(反轉卡止板)12a. . . Package loading surface (reverse locking plate)
12b．．．旋轉軸(反轉卡止板)12b. . . Rotary shaft (reverse lock plate)
13．．．第一檢查機構(下攝影機)13. . . First inspection agency (lower camera)
14．．．裝載板(第二檢查板)14. . . Loading plate (second inspection board)
14a．．．封裝體裝載面(裝載板)14a. . . Package loading surface (loading plate)
15．．．第二檢查機構(上攝影機)15. . . Second inspection agency (upper camera)
16．．．第二封裝體裝扣機構(第二傳送機構)16. . . Second package body fastening mechanism (second transfer mechanism)
17．．．裝載平台17. . . Loading platform
17a．．．封裝體裝載面(裝載平台)17a. . . Package loading surface (loading platform)
18．．．裝載平台之移動手段18. . . Loading platform
18a．．．封裝體裝載位置18a. . . Package loading position
18b．．．封裝體篩選位置18b. . . Package screening location
19．．．封裝體之移載機構19. . . Package transfer mechanism
20．．．第一檢查部(第一檢查位置)20. . . First inspection department (first inspection position)
21．．．第二檢查部(第二檢查位置)twenty one. . . Second inspection unit (second inspection position)
22．．．反轉卡止板之往返移動手段twenty two. . . Reverse rotation means of reverse locking plate
31．．．托盤31. . . tray
31a．．．良品托盤31a. . . Good tray
31b．．．不良品托盤31b. . . Defective tray
32．．．基板之排列機構32. . . Substrate arrangement mechanism
33．．．切斷用之平台(切斷平台)33. . . Cutting platform (cutting platform)
34．．．切斷平台之移動機構34. . . Cutting the moving mechanism of the platform
34a．．．基板裝載位置34a. . . Substrate loading position
34b‧‧‧基板切斷位置34b‧‧‧Sheet cutting position
35‧‧‧對準機構35‧‧‧Alignment mechanism
36‧‧‧基板之切斷機構36‧‧‧The cutting mechanism of the substrate
37‧‧‧封裝體之洗淨機構37‧‧‧Package cleaning mechanism
38‧‧‧基板之裝填部38‧‧‧Substrate loading department
A‧‧‧基板之裝填單元A‧‧‧Substrate loading unit
B‧‧‧基板之切斷單元B‧‧‧Cutting unit for the substrate
C‧‧‧封裝體之檢查單元C‧‧‧ Inspection unit for package
D‧‧‧封裝體之收容單元D‧‧‧ containment unit
圖1係概略表示本發明之基板切斷裝置的概略俯視圖。Fig. 1 is a schematic plan view showing a substrate cutting device of the present invention.
圖2係放大圖1所示之基板切斷裝置之主要部分(封裝體檢查單元)並概略表示的放大概略俯視圖。FIG. 2 is an enlarged schematic plan view showing an enlarged main portion (package inspection unit) of the substrate cutting device shown in FIG. 1 .
圖3係放大圖2所示之基板切斷裝置之主要部分(封裝體檢查單元)並概略表示的放大概略前視圖。Fig. 3 is an enlarged schematic front view showing an enlarged main portion (package inspection unit) of the substrate cutting device shown in Fig. 2;
圖4(1)、圖4(2)係放大圖3所示之封裝體檢查單元之主要部分並概略表示的放大概略前視圖，圖4(3)係放大圖4(2)所示之封裝體檢查單元之主要部分並概略表示的放大概略側視圖。4(1) and 4(2) are enlarged schematic front views showing a main part of the package inspection unit shown in Fig. 3, and Fig. 4(3) is an enlarged view of the package shown in Fig. 4 (2). An enlarged schematic side view of a main part of the body inspection unit and schematically shown.
圖5(1)、圖5(2)係放大圖3所示之封裝體檢查單元之主要部分並概略表示的放大概略前視圖，圖5(3)係放大圖5(2)所示之封裝體檢查單元之主要部分並概略表示的放大概略側視圖。5(1) and 5(2) are enlarged schematic front views showing a main part of the package inspection unit shown in Fig. 3, and Fig. 5(3) is an enlarged view of the package shown in Fig. 5 (2). An enlarged schematic side view of a main part of the body inspection unit and schematically shown.
圖6(1)係放大圖3所示之封裝體檢查單元之主要部分並概略表示的放大概略前視圖，圖6(2)係放大圖6(1)所示之封裝體檢查單元之主要部分並概略表示的放大概略側視圖。Fig. 6 (1) is an enlarged schematic front view showing an enlarged main portion of the package inspection unit shown in Fig. 3, and Fig. 6 (2) is an enlarged view of a main part of the package inspection unit shown in Fig. 6 (1). An enlarged schematic side view of the schematic view.
圖7(1)、圖7(2)、圖7(3)係放大圖3所示之封裝體檢查單元之主要部分並概略表示的放大概略前視圖。7(1), 7(2), and 7(3) are enlarged schematic front views showing an enlarged main portion of the package inspection unit shown in Fig. 3.
圖8(1)係概略表示本發明所使用之已成形基板的概略立體圖，圖8(2)係概略表示切斷圖8(1)所示之已成形基板所形成之封裝體的概略立體圖。Fig. 8 (1) schematically shows a schematic perspective view of a molded substrate used in the present invention, and Fig. 8 (2) schematically shows a schematic perspective view of a package formed by cutting the molded substrate shown in Fig. 8 (1).
5(1c)．．．封裝體集合體5(1c). . . Package assembly
9．．．基板之切斷裝置9. . . Substrate cutting device
11．．．第一封裝體裝扣機構(第一傳送機構)11. . . First package body fastening mechanism (first conveying mechanism)
12．．．反轉卡止板(第一檢查板)12. . . Reverse the stop plate (first check plate)
12a．．．封裝體裝載面(反轉卡止板)12a. . . Package loading surface (reverse locking plate)
12b．．．旋轉軸(反轉卡止板)12b. . . Rotary shaft (reverse lock plate)
13．．．第一檢查機構(下攝影機)13. . . First inspection agency (lower camera)
14．．．裝載板(第二檢查板)14. . . Loading plate (second inspection board)
14a．．．封裝體裝載面(裝載板)14a. . . Package loading surface (loading plate)
15．．．第二檢查機構(上攝影機)15. . . Second inspection agency (upper camera)
16．．．第二封裝體裝扣機構(第二傳送機構)16. . . Second package body fastening mechanism (second transfer mechanism)
17．．．裝載平台17. . . Loading platform
17a．．．封裝體裝載面(裝載平台)17a. . . Package loading surface (loading platform)
18．．．裝載平台之移動手段18. . . Loading platform
18a．．．封裝體裝載位置18a. . . Package loading position
18b．．．封裝體篩選位置18b. . . Package screening location
19．．．封裝體之移載機構19. . . Package transfer mechanism
20．．．第一檢查部(第一檢查位置)20. . . First inspection department (first inspection position)
21．．．第二檢查部(第二檢查位置)twenty one. . . Second inspection unit (second inspection position)
22．．．反轉卡止板之往返移動手段twenty two. . . Reverse rotation means of reverse locking plate
C．．．封裝體之檢查單元C. . . Package inspection unit
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2007307391A JP5192790B2 (en) | 2007-11-28 | 2007-11-28 | Substrate cutting method and apparatus |
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| TW200939334A TW200939334A (en) | 2009-09-16 |
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| KR (1) | KR101504790B1 (en) |
| CN (1) | CN101878523B (en) |
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| JP5544585B2 (en) * | 2010-07-13 | 2014-07-09 | アピックヤマダ株式会社 | Resin molding device and workpiece thickness measuring device |
| CN102881610A (en) * | 2012-10-08 | 2013-01-16 | 如皋市易达电子有限责任公司 | Quick quality inspection combination tooling for surface mount diodes |
| JP6218511B2 (en) * | 2013-09-02 | 2017-10-25 | Ｔｏｗａ株式会社 | Cutting apparatus and cutting method |
| JP6235391B2 (en) * | 2014-03-27 | 2017-11-22 | Ｔｏｗａ株式会社 | Inspection jig, cutting device, and cutting method |
| JP6218686B2 (en) * | 2014-07-17 | 2017-10-25 | Ｔｏｗａ株式会社 | Substrate cutting apparatus and substrate cutting method |
| JP6482454B2 (en) * | 2015-12-18 | 2019-03-13 | Ｔｏｗａ株式会社 | Electronic component manufacturing method and electronic component manufacturing apparatus |
| JP2023102048A (en) * | 2022-01-11 | 2023-07-24 | Ｔｏｗａ株式会社 | Processing apparatus and method for manufacturing processed product |
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| JPH1019789A (en) * | 1996-06-28 | 1998-01-23 | Hitachi Ltd | Fabrication of semiconductor device |
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| JPH0590365A (en) * | 1991-09-27 | 1993-04-09 | Hitachi Ltd | Testing apparatus |
| JP3190897B2 (en) * | 1998-10-28 | 2001-07-23 | 大分日本電気株式会社 | Defect inspection device and defect inspection method |
| JP4025490B2 (en) * | 2000-07-14 | 2007-12-19 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
| JP4137471B2 (en) * | 2002-03-04 | 2008-08-20 | 東京エレクトロン株式会社 | Dicing method, integrated circuit chip inspection method, and substrate holding apparatus |
| JP4796271B2 (en) * | 2003-07-10 | 2011-10-19 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
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| JPH1019789A (en) * | 1996-06-28 | 1998-01-23 | Hitachi Ltd | Fabrication of semiconductor device |
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| KR101504790B1 (en) | 2015-03-20 |
| JP2009130342A (en) | 2009-06-11 |
| TW200939334A (en) | 2009-09-16 |
| KR20100099117A (en) | 2010-09-10 |
| CN101878523B (en) | 2012-07-25 |
| CN101878523A (en) | 2010-11-03 |
| JP5192790B2 (en) | 2013-05-08 |
| MY169601A (en) | 2019-04-22 |
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