TWI448375B - 光奈米壓印光刻用硬化性組成物及使用它之圖案形成方法 - Google Patents

光奈米壓印光刻用硬化性組成物及使用它之圖案形成方法 Download PDF

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Publication number
TWI448375B
TWI448375B TW096135646A TW96135646A TWI448375B TW I448375 B TWI448375 B TW I448375B TW 096135646 A TW096135646 A TW 096135646A TW 96135646 A TW96135646 A TW 96135646A TW I448375 B TWI448375 B TW I448375B
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Taiwan
Prior art keywords
carbon atoms
mass
polymerizable unsaturated
group
unsaturated monomer
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TW096135646A
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English (en)
Chinese (zh)
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TW200833498A (en
Inventor
Takashi Takayanagi
Yasumasa Kawabe
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Fujifilm Corp
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Publication of TW200833498A publication Critical patent/TW200833498A/zh
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Publication of TWI448375B publication Critical patent/TWI448375B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C08F16/32—Monomers containing two or more unsaturated aliphatic radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F36/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
    • C08F36/02—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
    • C08F36/20—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds unconjugated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/02—Polyalkylene oxides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polymerisation Methods In General (AREA)
TW096135646A 2006-09-27 2007-09-26 光奈米壓印光刻用硬化性組成物及使用它之圖案形成方法 TWI448375B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006263332 2006-09-27

Publications (2)

Publication Number Publication Date
TW200833498A TW200833498A (en) 2008-08-16
TWI448375B true TWI448375B (zh) 2014-08-11

Family

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TW096135646A TWI448375B (zh) 2006-09-27 2007-09-26 光奈米壓印光刻用硬化性組成物及使用它之圖案形成方法

Country Status (3)

Country Link
KR (1) KR101463849B1 (ko)
CN (1) CN101154042B (ko)
TW (1) TWI448375B (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306903B2 (ja) * 2008-07-02 2013-10-02 富士フイルム株式会社 インプリント用硬化性組成物、これを用いた硬化物およびその製造方法、並びに、液晶表示装置用部材
KR101634804B1 (ko) * 2008-07-10 2016-06-29 후지필름 가부시키가이샤 나노 임프린트용 경화성 조성물 및 경화물
KR101363783B1 (ko) * 2008-11-14 2014-02-17 엘지디스플레이 주식회사 임프린팅용 감광성 수지 조성물 및 기판 상에 유기막을 형성하는 방법
CN101923282B (zh) 2009-06-09 2012-01-25 清华大学 纳米压印抗蚀剂及采用该纳米压印抗蚀剂的纳米压印方法
TWI391418B (zh) * 2009-06-19 2013-04-01 Hon Hai Prec Ind Co Ltd 奈米壓印抗蝕劑及採用該奈米壓印抗蝕劑的奈米壓印方法
US9744698B2 (en) 2010-12-22 2017-08-29 The Japan Steel Works, Ltd. Method for manufacturing microscopic structural body
WO2012099164A1 (ja) * 2011-01-19 2012-07-26 日産化学工業株式会社 ウレタン化合物を含む高耐擦傷性インプリント材料
KR101334920B1 (ko) * 2011-04-13 2013-11-29 한국기계연구원 마이크로웨이브를 이용한 패턴형성방법
JP6108765B2 (ja) * 2011-12-19 2017-04-05 キヤノン株式会社 光硬化性組成物およびパターン形成方法
EP2858093A4 (en) * 2012-05-25 2015-12-02 Soken Kagaku Kk PHOTOCURABLE RESIN COMPOSITION FOR PRINTING, METHOD FOR MANUFACTURING SAME, AND STRUCTURE
JP5932501B2 (ja) * 2012-06-06 2016-06-08 キヤノン株式会社 硬化性組成物、及びこれを用いるパターン形成方法
JP5899145B2 (ja) 2012-06-18 2016-04-06 富士フイルム株式会社 インプリント用下層膜形成組成物およびパターン形成方法
CN104737272A (zh) * 2012-10-22 2015-06-24 综研化学株式会社 压印用光固化性树脂组合物、压印用模具的制造方法以及压印用模具
WO2014171302A1 (ja) * 2013-04-18 2014-10-23 日産化学工業株式会社 インプリント材料
CN104133261A (zh) * 2014-08-13 2014-11-05 郑州恒昊玻璃技术有限公司 一种光栅及其制备方法
AT516558B1 (de) * 2014-12-10 2018-02-15 Joanneum Res Forschungsgmbh Prägelack, Verfahren zum Prägen sowie mit dem Prägelack beschichtete Substratoberfläche
KR20160095879A (ko) * 2015-02-04 2016-08-12 동우 화인켐 주식회사 감광성 수지 조성물, 이로 형성되는 광경화 패턴 및 이를 포함하는 화상 표시 장치
KR102560728B1 (ko) * 2018-11-14 2023-07-27 주식회사 엘지화학 임프린팅용 조성물 및 이를 이용한 광학 기재의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110997A (ja) * 2004-09-16 2006-04-27 Asahi Glass Co Ltd 転写体の製造方法、光硬化性組成物、および微細構造体の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3413667B2 (ja) * 1993-08-27 2003-06-03 大日本インキ化学工業株式会社 紫外線硬化性組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110997A (ja) * 2004-09-16 2006-04-27 Asahi Glass Co Ltd 転写体の製造方法、光硬化性組成物、および微細構造体の製造方法

Also Published As

Publication number Publication date
KR101463849B1 (ko) 2014-12-04
TW200833498A (en) 2008-08-16
KR20080028786A (ko) 2008-04-01
CN101154042B (zh) 2012-07-04
CN101154042A (zh) 2008-04-02

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