TWI447835B - A ingot holding composition and a method of sandwiching the ingot - Google Patents

Description

Ingot holding composition and method for holding the ingot

The present invention relates to an ingot holding composition, and more particularly to an ingot holding composition for holding the ingot during processing of a nonmagnetic ingot and a method for clamping the ingot.

At present, when processing a crystal material such as a single crystal or a directional crystal, such as an ingot, for example, in the prior art, when the cutting process shown in FIG. 1 is performed, it is cut by a wire saw 40. An ingot 20 is placed on a stage 30. At this time, in order to enable accurate positioning during the precision cutting process, it is necessary to clamp and fix the position of the ingot 20 on the stage 30.

The clamping method for the ingot can generally be divided into two categories: one of which is a clamping method for the magnetic ingot, which uses the magnetic force of the electromagnet to attract the magnetic ingot to provide the clamping effect; The other type is a clamping method for a non-magnetic ingot. The prior art of the method has proposed a method of vacuum inducing to hold the ingot, but since the vacuum suction method requires first throwing one surface of the ingot Flat processing, in order to use the surface for vacuum suction to thereby hold the ingot, so it is not only necessary to add an additional leveling process to the ingot, resulting in complicated processing and time consumption, and for the brittle ingot In other words, the clamping force exerted by vacuum suction can also cause damage to the surface of the ingot and reduce the yield of output.

For the clamping method of non-magnetic ingots, the prior art also proposes a Referring to FIG. 2, a method of clamping the ingot by using the foam rubber as a holding material, the method firstly providing a plurality of spacers 50 between the ingot 20 and the stage 30, and using the spacers 50 A space is formed between the ingot 20 and the stage 30, and then the foam rubber 60 is injected into a space other than the spacer 50 for covering and clamping the bottom surface of the ingot 20, thereby avoiding the mechanical clamp. The surface damage of the ingot is caused by the holding, and since the surface of the ingot is usually not completely flat, the surface of the ingot can be properly covered by the foam rubber. In addition, the position of the ingot can be fixed on the one hand, and the absorption can be processed on the other hand. The vibration generated prevents the fragile ingot from being damaged.

However, the use of foam rubber as a gripping material to hold the ingot also has a number of disadvantages. First, the foam rubber must wait until its full gelation cure to provide sufficient strength after application, so it takes a considerable time to wait for the processing time. Increasing, and during the waiting period, the ingot must remain stationary and avoid collisions, making the processing more difficult. Secondly, if the foam is provided with sufficient strength for effective clamping, the subsequent difficulty in removing the foam is caused. Moreover, if the gap of the gap is insufficient, the effect of the foam buffer is reduced, and if the gap strength is too high, the difficulty of removing the spacer after the processing is completed is also caused.

Therefore, in view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide an ingot holding composition to replace the foam rubber as a holder for effectively clamping the ingot during processing of the non-magnetic ingot. Buffer vibration and properly maintain the balance between clamping strength and cushioning properties, while the crystal The ingot holding composition provides gripping efficiency quickly and in a timely manner and can be easily removed from the mating surface to facilitate reuse of the processing machine.

In order to achieve the above object, the present invention provides an ingot holding composition for holding an ingot and fixing the ingot to a stage, the ingot holding composition comprising: a cushioning material a first pressure sensitive adhesive material disposed on one surface of the buffer material layer for holding the ingot on the buffer material layer; and a second pressure sensitive adhesive material disposed on the buffer material layer One side is for attaching the buffer material layer to the stage.

In the above-mentioned ingot holding composition, the first pressure sensitive adhesive material and the second pressure sensitive adhesive material are each independently selected from the group consisting of polyurethane, polymerized siloxanes, and polymethyl methacrylate. A polymer such as a polymethylmethacrylate or a synthetic rubber.

Wherein, the first pressure sensitive adhesive material and the second pressure sensitive adhesive material independently select different or the same materials according to the characteristics of the ingot, thereby improving selectivity and applicability, and the adhesive of the pressure sensitive adhesive material The mechanical properties of the material proportional to the forward pressure, which in turn control the holding strength of the ingot during processing, and can easily peel the ingot holding composition from the surface of the ingot and the stage after processing to avoid Damage the ingot and the surface of the stage and enhance the convenience of the ingot processing program.

In the above-mentioned ingot holding composition, the material constituting the buffer material layer may be selected from expanded polystyrene (EPS), expanded polypropylene (EPP), expanded polyethylene (EPE), and foamed ethylene polymer. (EPO), ethylene-vinyl acetate copolymer (EVA), polymerized siloxanes, polyurethane or synthetic rubber.

In addition, in another embodiment, the ingot holding composition further includes: a first medium disposed between the buffer material layer and the first pressure sensitive adhesive material; and a second medium disposed on the Between the buffer material layer and the second pressure sensitive adhesive material; wherein the first medium and the second medium are independently selected from the group consisting of polystyrene, acrylonitrile-butadiene-styrene, polyethylene, and ethylene glycol modified - one of plastic materials such as polyethylene terephthalate, polythioester, polycarbonate, polyvinyl chloride, polyethylene terephthalate and acrylic.

In the above, the buffer material layer is used to provide a buffering external force to effectively absorb the vibration received during the processing of the ingot, and to prevent the brittle ingot from being damaged by vibration during processing.

The present invention also provides a method of holding an ingot by sandwiching a composition as described above to provide an ingot to a stage, and the ingot is held by the ingot The composition is clamped and fixed to the stage.

Furthermore, the above method can be processed when the ingot is fixed to the stage by the clamping of the ingot holding composition, and after the processing is completed, the single crystal and the oriented crystal are taken from the side.

In summary, the ingot holding composition of the present invention provides the clamping and buffering effect of the subsequent processing of the ingot by laminating the ingot and the stage, and at the same time, the ingot holding composition has a shift In addition to the advantages of convenience, and since the ingot is not used to hold the ingot, the waiting time for the curing of the bonding is reduced, and since the spacer is not required, the disadvantage of reducing the cushioning property due to insufficient strength of the spacer, and Solve the problem caused by excessive strength of the gap Remove difficult problems, simplifying and fasting the ingot processing program, and improving the reusability of the processing machine.

To fully clarify the objects, features, and advantages of the present invention, those of ordinary skill in the art of the invention can understand the invention and practice the invention. Schematic, a detailed description of the present invention, illustrated as follows:

Ingot holding composition

Please refer to Fig. 3, which is a schematic cross-sectional view of the ingot holding composition of the present invention. The ingot holding composition 1 is for holding an ingot to be fixed on a stage, and comprises a buffer material layer 11, a first pressure sensitive adhesive material 12, and a second pressure sensitive adhesive material 13. Wherein, the buffer material layer 11 can be approximately the same size as the ingot to be clamped, and the first pressure sensitive adhesive material 12 is disposed on one surface of the buffer material layer 11 and has a second sense on the other side. Pressing material 13. In other words, the opposite sides of the buffer material layer 11 are loaded with pressure sensitive adhesive to form the first pressure sensitive adhesive material 12 and the second pressure sensitive adhesive material 13, respectively.

Furthermore, the first pressure sensitive adhesive material and the second pressure sensitive adhesive material of the ingot holding composition of the present invention are each independently selected from the group consisting of a polyurethane type, a silicone resin type, a polymethyl methacrylate type, a synthetic rubber type, and the like. polymer. In other words, in the embodiment of the present invention, the first pressure sensitive adhesive material and the second pressure sensitive adhesive material may be composed of different materials, for example, the first pressure sensitive adhesive material is a polyurethane polymer, and the second pressure sensitive The rubber material is a silicone resin; in other possible embodiments, the first pressure sensitive rubber and the second pressure sensitive rubber may be the same material. The composition is, for example, composed of a polyurethane-based polymer. Furthermore, the adhesive strength of the pressure sensitive adhesive of the present invention is proportional to the forward pressure applied to the adhesive material, that is, the greater the applied forward pressure, the more the adhesive strength of the pressure sensitive adhesive material is. Large, and after the positive pressure is removed, the adhesive strength of the pressure sensitive adhesive is reduced.

It should be understood that the pressure sensitive adhesive of the present invention is not limited to the above materials, and other pressure sensitive adhesives commercially available from commercial sources may also be used.

By the ingot holding composition composed of the pressure sensitive adhesive material, the first pressure sensitive adhesive material can be attached to the ingot and the second pressure sensitive adhesive material is attached to the stage, thereby providing the effect of clamping. Effectively fix the position of the ingot on the stage.

The material of the buffer material layer of the present invention may be selected from foamed materials such as expanded polystyrene (EPS), expanded polypropylene (EPP), expanded polyethylene (EPE) or expanded ethylene polymer (EPO), and ethylene. - a flexible material such as a vinyl acetate copolymer (EVA), a silicone resin, a polyurethane or a synthetic rubber. However, it is not limited thereto, and those having ordinary knowledge in the art should understand that other foaming materials can also be used in the present invention. Or a flexible material to form the buffer material layer. .

By the above-mentioned buffer material layer, when it is interposed between the first pressure sensitive adhesive material and the second pressure sensitive adhesive material, the external force is provided to effectively absorb the vibration received during the processing of the ingot, and the brittleness is avoided. Injury of the ingot.

In addition, referring to FIG. 9, in the ingot holding composition 1 of the preferred embodiment, a first medium 14 is further included between the buffer material layer 11 and the first pressure sensitive adhesive material 12, and is buffered. A second medium 15 is further included between the material layer 11 and the second pressure sensitive adhesive material 13, and the medium is used to provide a more complete and rapid peeling effect when the ingot holding composition 1 is finally torn off.

Furthermore, the media may be independently selected from the group consisting of polystyrene (PS), acrylonitrile-butadiene-styrene (ABS), polyethylene (PE), and ethylene glycol modified-polyethylene terephthalate. Various plastic materials such as alcohol ester (PETG), polythioester (PTE), polycarbonate (PC), polyvinyl chloride (PVC), polyethylene terephthalate (PET), acrylic (PMMA), etc. One, but not limited to, all materials capable of attaching the whole surface pressure sensitive adhesive material, and when the ingot holding composition is removed, some of the pressure sensitive adhesive material does not fall off the stage, or even fall off The buffer material layer 11 can be used as the material of the above medium.

Hereinafter, the present invention will be more specifically described by way of examples, and the present invention is not limited to the following examples.

Figure 4 is a schematic view showing the state of use of the colloidal composition of the present invention. The ingot holding composition 1 is disposed between the non-magnetic ingot 120 and the stage 130, and the ingot holding composition 1 is attached to the surface of the ingot 120 and the stage 130, respectively. At this time, the first pressure sensitive adhesive 12 of the ingot holding composition 1 is attached to the ingot 120, and the second pressure sensitive adhesive 13 is attached to the stage 130, so that the ingot 120 is clamped and fixed on the carrier. On the stage 130, as shown in Fig. 4, the subsequent processing procedure is performed.

Method of holding an ingot

Referring again to Figures 5 through 8, it further describes a method of holding an ingot using the ingot holding composition of the present invention as a holder in a wire saw cutting process.

First, referring to Fig. 5, the ingot holding composition 1 of the present invention is provided above the stage 130, and the ingot holding composition 1 can sequentially comprise the second pressure sensitive adhesive material 13 and the foamed material. Buffer material layer 11 and first pressure sensitive adhesive material 12 The ingot holding composition 1 is bonded to the ingot holding composition 1, and the second pressure sensitive adhesive 13 of the ingot holding composition 1 is attached to the stage 130. More specifically, the ingot holding composition 1 can be configured by selecting an appropriate pressure-sensitive adhesive material and a cushioning material layer depending on characteristics such as the material, weight, or shape of the ingot to be attached.

Next, when the ingot 120 to be cut is placed on the ingot holding composition 1, as shown in Fig. 6, a jig (not shown) can be used to adjust and fix the position of the ingot 120 so that the The ingot 120 can be accurately positioned during cutting to obtain a precisely cut workpiece after cutting, and at this time, pressure is applied to the pressure sensitive adhesive material of the ingot holding composition 1 by the weight of the ingot 120 itself. In order to make the pressure sensitive adhesive material adhesive, the position of the ingot 120 on the stage 130 can be simply fixed without being deviated.

When the ingot 120 is cut from the top to the bottom by the wire saw 100, as shown in FIG. 7, at this time, the positive force is transmitted to the first pressure sensitive adhesive material because the ingot 120 is in a depressed state. 12 and the second pressure sensitive adhesive material 13, so that the pressure sensitive adhesive material has a pressure-sensitive adhesive property of the pressure sensitive adhesive material, so that the pressure sensitive adhesive material can hold the ingot 120 more stably. At the same time, the vibration generated during the processing and cutting is absorbed by the foaming material after being transferred to the buffer material layer 11, thereby avoiding the damage caused by the vibration to the fragile ingot 120 and providing Stability and cushioning during clamping.

Finally, after the cutting process is completed, a plurality of single crystals 121 can be obtained. Referring to FIG. 8, the wire saw has been removed, so the positive downward pressure applied by the wire saw has been eliminated. The first pressure sensitive adhesive material 12 and the second pressure sensitive adhesive material 13 are not in a pressurized state, and the first pressure sensitive adhesive material 12 is The adhesive strength is reduced, which is advantageous for picking up the single crystal 121 on the first pressure sensitive adhesive material 12. At this time, the workpiece is taken from the side of the single crystal 121 to further eliminate the adhesive force of the first pressure sensitive adhesive material 12. To easily separate the single crystal 121 and the first pressure sensitive adhesive 12; and after the single crystal 121 is completely removed from the first pressure sensitive adhesive 12, the weight of the single crystal 121 is applied to the ingot holding composition. The forward pressure on 1 has also been eliminated, so that between the first pressure sensitive adhesive material 12 and the cushioning material layer 11, between the cushioning material layer 11 and the second pressure sensitive adhesive material 13, and the second pressure sensitive adhesive material and the stage The adhesion between the 130s is also reduced at the same time, so that the layers can be easily and completely separated from each other or the second pressure sensitive adhesive 13 can be separated from the stage 130 without leaving a sticky residue, shortening the time before the next processing. The cleaning time required to achieve the convenience of removal and the efficiency of processing.

Measurement and comparison of the efficacy of ingot holding compositions

The clamping and removal effects of the embodiments of the present invention and the comparative examples of the prior art are measured and compared to further highlight the effects provided by the present invention, and the measurement results are as shown in Tables 1 and 2 below. Show:

The styrofoam of the above comparative example and the ingot holding composition of each embodiment are arranged between the ingot and the stage, and then each of the ingots is cut, and then the cut small ingots are removed, and finally removed. The styrofoam or ingot on the stage holds the composition.

The ingots held by the comparative examples and the respective examples are all ingots of polycrystalline germanium material, and 25 small ingots are formed after the ingot is cut. Furthermore, in the second embodiment and the third embodiment, the thickness of the first medium 14 and the second medium 15 are both 0.25 mm.

definition:

[adhesion]

According to the American Tape Association (PSTC) steel adhesion test.

[residual gel rate]

When the small ingot and the stage are separated, the residual amount of the glue on the small ingot or the residual amount of the glue on the stage, respectively.

[size pass rate]

After the ingot is opened, 25 small crystal ingots are formed, wherein the number of small ingots falling within ±0.4 mm is X, and the dimensional pass rate is determined to be X/25×100%.

[adhesion]

It is divided into the adhesion effect of the first pressure sensitive adhesive material and the ingot and the second pressure sensitive adhesive material and the stage.

[Easy to remove workpiece rate]

After the ingot is opened, the number of the glue on the small ingot is not required to be scraped by alcohol and knife saw (wire saw), and the easy-to-extract workpiece rate is set to X/25×100%.

[Workpiece notch]

Severe corners: 15/25 small crystal ingots with >10mm notch; moderate corners: 10/25 small ingots with 5~10mm corners; light corners: 5/25 small ingots There is a missing corner of <5mm.

Comparison of efficacy:

The comparative example is the use of styrofoam to form a material for buffering and fixing the ingot, which has the disadvantage of waiting for the curing time, and requires a large amount of carrier preparation; after the completion of the held ingot, due to the styrofoam The adhesion is quite high, so it is necessary to first separate the small ingot and the stage by using a wire saw. At this time, there are a large amount of residual glue on the small ingot and the stage, and the residual glue must be scraped off by another knife. Complete the process.

Example 1 is an ingot holding composition without a medium, which also has the characteristics of buffering and fixing the ingot, and the ingot holding composition does not need to wait for the foaming rubber to be solidified compared with the comparative example. Time, thus shortening the process time; while separating the small ingots and the stage, 8 small ingots can be removed by applying only the lateral force, and the remaining 17 small ingots (68%) are added. After the alcohol is used to assist the peeling of the ingot to hold the composition, it can be easily removed without using a knife saw to scrape off the first pressure sensitive adhesive material, so that manpower and man-hour can be saved when the ingot holding composition is removed.

In addition, in the case of further removing the ingot holding composition, the effect of the complete peeling is achieved without the effect of residual glue, so in the second embodiment and the third embodiment, the first pressure sensitive adhesive and the cushioning material are used. A first medium (PET) is disposed between the layers, and a second medium (PET) is disposed between the second pressure sensitive adhesive material and the buffer material layer, thereby forming a flexible composite buffer material (PET/EVA/PET) to make the first The pressure sensitive adhesive material and the first medium can be sufficiently peeled off, and the second medium and the second pressure sensitive adhesive material can be sufficiently peeled off, and the peeling effect exhibited by the medium is set by observing the residual glue rate and the easy removal of the workpiece rate. Performance and the same reason are verified.

Further, in Example 2, the adhesion of the second pressure sensitive adhesive material was reduced to 1.5 kg, and the residual glue ratio between the second pressure sensitive adhesive material and the stage in Example 2 was found from Table 1. %) is still insufficient; therefore, in order to further strengthen the peeling ability of the ingot holding composition, the adhesion of the second pressure sensitive adhesive material is reduced to 0.8 kg in Example 3, although the adhesion is decreased, but the crystal The positive pressure exerted on the pressure sensitive adhesive by the weight of the ingot still makes the pressure sensitive adhesive material have a considerable adhesive force, so the adhesive force of the second pressure sensitive adhesive material does not change the ingot holding composition for the ingot. The fixing ability is such that the ingot holding composition in the embodiment 3 allows the second pressure sensitive adhesive to be completely peeled off from the stage, so the ingot holding composition of the third embodiment is the present invention. The preferred embodiment.

In addition, in other embodiments, the ingot to which the ingot holding composition of the present invention is attached may be subjected to other kinds of processing procedures, and the processing procedure of the wire saw cutting disclosed herein is merely an example, but The application of the invention is not limited to this.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

1‧‧‧Ingot holding composition

11‧‧‧ cushioning material layer

12‧‧‧First pressure sensitive adhesive

13‧‧‧Second pressure sensitive adhesive

14‧‧‧First medium

15‧‧‧Second medium

100‧‧‧ wire saw

120‧‧‧Ingots

121‧‧‧ single crystal

130‧‧‧stage

20‧‧‧Ingots

30‧‧‧stage

40‧‧‧ wire saw

50‧‧‧Interval

60‧‧‧foam glue

Figure 1 is a schematic view of a conventional technique for cutting an ingot using a wire saw.

Fig. 2 is a schematic view showing the state of use of a conventional technique for holding an ingot by using a foamed rubber.

Figure 3 is a schematic cross-sectional view of the ingot holding composition of the present invention.

Fig. 4 is a view showing the state of use of the ingot holding composition of the present invention.

5-8 are schematic views showing the flow of holding an ingot by sandwiching a composition in an embodiment of the present invention.

Figure 9 is a schematic cross-sectional view showing the ingot holding composition of the preferred embodiment of the present invention.

1‧‧‧Ingot holding composition

11‧‧‧ cushioning material layer

12‧‧‧First pressure sensitive adhesive

13‧‧‧Second pressure sensitive adhesive

Claims (10)

An ingot holding composition for holding an ingot and fixing the crystal on a stage, the ingot holding composition comprising: a buffer material layer; a first pressure sensitive material, Provided on one surface of the buffer material layer for holding the ingot on the buffer material layer; and a second pressure sensitive adhesive material disposed on the other side of the buffer material layer for layering the buffer material layer Attached to the stage. The ingot-clamping composition of claim 1, wherein the first pressure-sensitive adhesive material and the second pressure-sensitive adhesive material are each independently selected from the group consisting of polyurethane, silicone resin, and polymethacrylic acid. A polymer such as a methyl ester or a synthetic rubber. The ingot holding composition according to claim 1 or 2, wherein the material constituting the buffer material layer is selected from the group consisting of expanded polystyrene, expanded polypropylene, expanded polyethylene, and foamed ethylene polymer. , ethylene-vinyl acetate copolymer, enamel resin, polyurethane or synthetic rubber. The ingot holding composition according to claim 1, further comprising: a first medium disposed between the buffer material layer and the first pressure sensitive adhesive material; and a second medium disposed on the second medium The buffer material layer and the second pressure sensitive adhesive material; wherein the first medium and the second medium are independently selected from the group consisting of polystyrene, acrylonitrile-butadiene-styrene, polyethylene, and ethylene glycol. - polyethylene terephthalate, polythioester, polycarbonate, polyvinyl chloride, polyparaphenyl One of plastic materials such as ethylene glycol dicarboxylate and acrylic. The ingot-clamping composition of claim 4, wherein the first pressure sensitive adhesive material and the second pressure sensitive adhesive material are each independently selected from the group consisting of polyurethane, silicone resin, and polymethacrylic acid. A polymer such as a methyl ester or a synthetic rubber. The ingot-clamping composition of claim 4, wherein the material constituting the buffer material layer is selected from the group consisting of expanded polystyrene, expanded polypropylene, expanded polyethylene, and foamed ethylene polymer. , ethylene-vinyl acetate copolymer, enamel resin, polyurethane or synthetic rubber. A method of holding an ingot by sandwiching a composition of an ingot according to claim 1 or 4 to provide an ingot to a stage, the ingot being held by the ingot The holder is held by the holding of the composition. The method of claim 7, wherein the ingot is processed while being fixed to the stage by the clamping of the ingot holding composition, and after the processing is completed, the single crystal is from the side. Pick up. The method of claim 7, wherein the first pressure sensitive adhesive material and the second pressure sensitive adhesive material are each independently selected from the group consisting of polyurethane, silicone resin, polymethyl methacrylate or synthetic. A polymer such as rubber. The method of claim 7, wherein the material constituting the buffer material layer is selected from the group consisting of expanded polystyrene, expanded polypropylene, expanded polyethylene, expanded ethylene polymer, and ethylene. Vinyl acetate copolymer, epoxy resin, polyurethane or synthetic rubber.