TWI447188B - 低沾污研磨組成物 - Google Patents

低沾污研磨組成物 Download PDF

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Publication number
TWI447188B
TWI447188B TW098102432A TW98102432A TWI447188B TW I447188 B TWI447188 B TW I447188B TW 098102432 A TW098102432 A TW 098102432A TW 98102432 A TW98102432 A TW 98102432A TW I447188 B TWI447188 B TW I447188B
Authority
TW
Taiwan
Prior art keywords
acid
weight
composition
water
copper
Prior art date
Application number
TW098102432A
Other languages
English (en)
Chinese (zh)
Other versions
TW200938603A (en
Inventor
泰瑞斯Ｍ 湯瑪士
王紅雨
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW200938603A publication Critical patent/TW200938603A/zh
Application granted granted Critical
Publication of TWI447188B publication Critical patent/TWI447188B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW098102432A 2008-02-22 2009-01-22 低沾污研磨組成物 TWI447188B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/071,000 US9633865B2 (en) 2008-02-22 2008-02-22 Low-stain polishing composition

Publications (2)

Publication Number Publication Date
TW200938603A TW200938603A (en) 2009-09-16
TWI447188B true TWI447188B (zh) 2014-08-01

Family

ID=40521509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098102432A TWI447188B (zh) 2008-02-22 2009-01-22 低沾污研磨組成物

Country Status (6)

Country Link
US (1) US9633865B2 (https=)
EP (1) EP2093790B1 (https=)
JP (1) JP5479755B2 (https=)
KR (1) KR101560647B1 (https=)
CN (1) CN101525522B (https=)
TW (1) TWI447188B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2767805A1 (en) * 2009-07-06 2011-01-13 Prestone Products Corporation Methods and composition for cleaning a heat transfer system having an aluminum component
US20140030897A1 (en) * 2011-02-03 2014-01-30 Sumco Corporation Polishing composition and polishing method using the same
US8435896B2 (en) * 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
US8440097B2 (en) * 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
WO2014013977A1 (ja) * 2012-07-17 2014-01-23 株式会社 フジミインコーポレーテッド 合金材料研磨用組成物及びそれを用いた合金材料の製造方法
WO2017130749A1 (ja) * 2016-01-28 2017-08-03 株式会社フジミインコーポレーテッド 研磨用組成物
CN107350978A (zh) * 2017-07-26 2017-11-17 天津市职业大学 一种绿色固定磨料抛光片及其制备方法
CN114481286A (zh) * 2021-12-28 2022-05-13 广东省科学院化工研究所 一种用于电解抛光的固体颗粒物
CN114561187B (zh) * 2022-03-07 2022-10-21 山东麦丰新材料科技股份有限公司 一种环保型乳化精磨液及其制备方法
CN116948648A (zh) * 2023-06-30 2023-10-27 浙江奥首材料科技有限公司 一种半导体芯片二氧化硅蚀刻液、制备方法及其应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040229461A1 (en) * 2003-05-12 2004-11-18 Michael Darsillo Chemical mechanical polishing compositions for copper and associated materials and method of using same
US20060111024A1 (en) * 2004-11-24 2006-05-25 Hongyu Wang Cellulose-containing polishing compositions and methods relating thereto
US20060160475A1 (en) * 2001-08-14 2006-07-20 Ying Ma Chemical mechanical polishing compositions for metal and associated materials and method of using same
WO2007114583A1 (en) * 2006-03-31 2007-10-11 Techno Semichem Co., Ltd. Chemical mechanical polishing composition for copper comprising zeolite
US20080032606A1 (en) * 2006-06-09 2008-02-07 Yuling Liu Method for controlling the dishing problem associated with chemical-mechanical planarization (cmp) during manufacture of copper multilayer interconnection structures in ultra large-scale integrated circuits (ulsi)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030119692A1 (en) * 2001-12-07 2003-06-26 So Joseph K. Copper polishing cleaning solution
GB0216815D0 (en) 2002-07-19 2002-08-28 Aoti Operating Co Inc Detection method and apparatus
JP4464111B2 (ja) * 2003-11-13 2010-05-19 旭硝子株式会社 銅配線研磨用組成物、半導体集積回路表面の研磨方法および半導体集積回路用銅配線の作製方法
US7390744B2 (en) * 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060160475A1 (en) * 2001-08-14 2006-07-20 Ying Ma Chemical mechanical polishing compositions for metal and associated materials and method of using same
US20040229461A1 (en) * 2003-05-12 2004-11-18 Michael Darsillo Chemical mechanical polishing compositions for copper and associated materials and method of using same
US20060111024A1 (en) * 2004-11-24 2006-05-25 Hongyu Wang Cellulose-containing polishing compositions and methods relating thereto
WO2007114583A1 (en) * 2006-03-31 2007-10-11 Techno Semichem Co., Ltd. Chemical mechanical polishing composition for copper comprising zeolite
US20080032606A1 (en) * 2006-06-09 2008-02-07 Yuling Liu Method for controlling the dishing problem associated with chemical-mechanical planarization (cmp) during manufacture of copper multilayer interconnection structures in ultra large-scale integrated circuits (ulsi)

Also Published As

Publication number Publication date
US9633865B2 (en) 2017-04-25
JP5479755B2 (ja) 2014-04-23
CN101525522A (zh) 2009-09-09
KR101560647B1 (ko) 2015-10-16
EP2093790B1 (en) 2020-06-24
US20090215265A1 (en) 2009-08-27
EP2093790A2 (en) 2009-08-26
TW200938603A (en) 2009-09-16
KR20090091055A (ko) 2009-08-26
CN101525522B (zh) 2012-08-29
EP2093790A3 (en) 2009-12-23
JP2009200495A (ja) 2009-09-03

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