TWI438298B - Apparatus for supplying materials - Google Patents

Apparatus for supplying materials Download PDF

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Publication number
TWI438298B
TWI438298B TW101113257A TW101113257A TWI438298B TW I438298 B TWI438298 B TW I438298B TW 101113257 A TW101113257 A TW 101113257A TW 101113257 A TW101113257 A TW 101113257A TW I438298 B TWI438298 B TW I438298B
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Taiwan
Prior art keywords
source
heater
container
source material
evaporation chamber
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TW101113257A
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Chinese (zh)
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TW201243086A (en
Inventor
Seung Chul Jung
Whang Sin Cho
Ki Chul Song
Woo Jung Ahn
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Snu Precision Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process

Description

用於供應材料之設備Equipment for supplying materials 相關申請案的交叉參考Cross-reference to related applications

本發明主張在2011年4月13日向韓國智慧財產權局提出申請的韓國專利申請案第10-2011-0034341號的優先權和權益,該申請案的全部內容以引用的方式併入本文中。The present invention claims priority to and the benefit of the Korean Patent Application No. 10-2011-0034341, filed on Jan.

本發明涉及一種用於供應材料之設備,更特定言之,涉及一種可蒸發和供應將要以薄膜形式沉積在基板上的有機物質的用於供應材料之設備。The present invention relates to an apparatus for supplying a material, and more particularly to an apparatus for supplying a material which can evaporate and supply an organic substance to be deposited on a substrate in a film form.

有機發光裝置為下一代顯示裝置,下一代顯示裝置可在自身內發射光,與液晶顯示器(LCD)裝置的視角、對比度、回應速度、功率消耗等相比,下一代顯示裝置的視角、對比度、回應速度、功率消耗等都非常好。The organic light-emitting device is a next-generation display device, and the next-generation display device can emit light in itself, and the viewing angle, contrast, and contrast of the next-generation display device are compared with the viewing angle, contrast, response speed, power consumption, and the like of the liquid crystal display (LCD) device. Response speed, power consumption, etc. are very good.

有機發光裝置包括有機發光二極體,有機發光二極體以矩陣類型連接在掃描線和資料線之間並形成圖元。有機發光二極體包括陽極、陰極和形成在陽極和陰極之間並具有電洞傳輸層、有機發光層和電子傳輸層的有機薄膜層。當預定電 壓施加在陽極和陰極之間時,從陽極注入的電洞和從陰極注入的電子在發光層中重新組合,同時基於能差發射光。The organic light-emitting device includes an organic light-emitting diode, and the organic light-emitting diode is connected in a matrix type between the scan line and the data line to form a picture element. The organic light emitting diode includes an anode, a cathode, and an organic thin film layer formed between the anode and the cathode and having a hole transport layer, an organic light emitting layer, and an electron transport layer. When scheduled When a pressure is applied between the anode and the cathode, the holes injected from the anode and the electrons injected from the cathode are recombined in the light-emitting layer while emitting light based on the energy difference.

用在用於有機薄膜層的沉積製程中的有機物質不需要高蒸汽壓力,而是有機物質在高溫下容易分解和變性為無機物質。由於該等材料特性,因此由鎢材料製成的源容器填有有機物質,且源容器被加熱以蒸發有機物質,從而將常規的有機薄膜沉積在基板上。The organic substance used in the deposition process for the organic thin film layer does not require high vapor pressure, but the organic substance is easily decomposed and denatured into an inorganic substance at a high temperature. Due to these material characteristics, the source container made of a tungsten material is filled with an organic substance, and the source container is heated to evaporate the organic substance, thereby depositing a conventional organic thin film on the substrate.

有機發光二極體的常規製造已在與外界條件隔絕的真空條件下執行,且因而,當再次填充用於製造有機發光二極體的源材料時,必須不可避免地使設備暫停。另外,若使用大容量源容器增加了填充量而延長了暫停週期,則源材料可能變質和變性,並且每次更換源容器時還需要維護設備。Conventional manufacture of an organic light-emitting diode has been performed under vacuum conditions isolated from external conditions, and thus, when the source material for manufacturing the organic light-emitting diode is refilled, it is inevitable that the device is suspended. In addition, if a large-capacity source container is used to increase the filling amount and prolong the pause period, the source material may deteriorate and denature, and the equipment needs to be maintained each time the source container is replaced.

此外,在常規設備中,蒸發量依據源材料的消耗而改變,且因此,歸因於沉積在基板上的膜的厚度的改變,所製造的裝置並不可靠。Further, in the conventional apparatus, the amount of evaporation varies depending on the consumption of the source material, and therefore, the device manufactured is not reliable due to the change in the thickness of the film deposited on the substrate.

因此,構想出本發明來解決前述問題,且本發明的一態樣是提供用於供應材料之設備,在該設備中,源材料和用於將熱供應給源材料以蒸發源材料的加熱器提供在一個空間內,且根據源材料的蒸發量來調節源材料和加熱器之間的距 離,從而維持沉積在基板上的有機發光二極體的恒定厚度並製造可靠的有機發光二極體。Accordingly, the present invention has been conceived to solve the aforementioned problems, and an aspect of the present invention is to provide an apparatus for supplying a material in which a source material and a heater for supplying heat to the source material to evaporate the source material are provided Adjust the distance between the source material and the heater in one space and according to the evaporation of the source material Thereby, the constant thickness of the organic light-emitting diode deposited on the substrate is maintained and a reliable organic light-emitting diode is fabricated.

根據本發明的示範性實施例,提供用於供應材料之設備,該設備蒸發將要作為薄膜沉積在基板上的源材料,且該設備將經蒸發源材料供應到面向基板的噴射孔,該設備包括:源容器,將要沉積在基板上的源材料以固態或液態容納在源容器中;蒸發室,蒸發室包括用於將源容器安裝在其中的內部空間,且來自源容器的經蒸發源材料穿過蒸發室;第一加熱器,第一加熱器提供在位於蒸發室內的源容器上方,且第一加熱器將熱供應到源容器,以蒸發容納在源容器中的源材料;以及傳遞單元,傳遞單元使第一加熱器和源容器中的一者在與另一者接近或與另一者遠離的方向上往復運動。According to an exemplary embodiment of the present invention, there is provided an apparatus for supplying a material that evaporates a source material to be deposited as a thin film on a substrate, and the apparatus supplies the evaporation source material to an injection hole facing the substrate, the apparatus including a source container, the source material to be deposited on the substrate is contained in the source container in a solid or liquid state; an evaporation chamber including an inner space for mounting the source container therein, and the evaporated source material from the source container is worn a first heater, a first heater is provided above the source container located in the evaporation chamber, and the first heater supplies heat to the source container to evaporate the source material contained in the source container; and a transfer unit, The transfer unit reciprocates one of the first heater and the source container in a direction that is close to the other or away from the other.

設備可進一步包括擋板,擋板提供在位於蒸發室內的第一加熱器上方,且擋板攔截從該蒸發室的外側傳遞到內側的熱。The apparatus may further include a baffle provided above the first heater located within the evaporation chamber, and the baffle intercepts heat transferred from the outside to the inside of the evaporation chamber.

設備可進一步包括:冷卻器,冷卻器安裝在蒸發室的下部中,以便鄰近於液體或固體源材料,且冷卻器冷卻容納在源容器中的源材料;以及第二加熱器,第二加熱器安裝在蒸發室的上部中並與液體或固體源材料隔開,且第二加熱器將熱供應到蒸發室,以便防止穿過蒸發室的經蒸發源材料相變為液態或固態。The apparatus may further include: a cooler installed in a lower portion of the evaporation chamber to be adjacent to the liquid or solid source material, and the cooler cooling the source material contained in the source container; and a second heater, the second heater Installed in the upper portion of the evaporation chamber and separated from the liquid or solid source material, and the second heater supplies heat to the evaporation chamber to prevent the vaporized source material passing through the evaporation chamber from becoming liquid or solid.

傳遞單元可包括:桿單元,桿單元穿透蒸發室的頂部, 桿單元耦合到第一加熱器,且桿單元和第一加熱器一起在蒸發室內上下往復運動;驅動源,驅動源供應用於使桿單元往復運動的驅動力;以及控制器,控制器連接到驅動源且控制桿單元的傳遞方向和速度。The transfer unit may include: a rod unit that penetrates the top of the evaporation chamber, The rod unit is coupled to the first heater, and the rod unit reciprocates up and down in the evaporation chamber together with the first heater; a driving source that supplies a driving force for reciprocating the rod unit; and a controller that is connected to the controller The drive source and the direction and speed of the joystick unit.

傳遞單元可包括:桿單元,桿單元穿透蒸發室的底部,桿單元耦合到源容器,且桿單元和源容器一起在蒸發室內上下往復運動;驅動源,驅動源供應用於使桿單元往復運動的驅動力;以及控制器,控制器連接到驅動源且控制桿單元的傳遞方向和速度。The transfer unit may include: a rod unit penetrating the bottom of the evaporation chamber, the rod unit being coupled to the source container, and the rod unit and the source container reciprocating up and down together in the evaporation chamber; the driving source and the driving source are supplied for reciprocating the rod unit The driving force of the motion; and the controller, the controller is connected to the driving source and the direction and speed of the control rod unit are transmitted.

根據本發明的示範性實施例,提供用於供應材料之設備,該設備蒸發將要作為薄膜沉積在基板上的源材料,且該設備將經蒸發源材料供應到面向基板的噴射孔,該設備包括:源容器,將要沉積在基板上的源材料以固態或液態容納在源容器的下部中,且經蒸發源材料在源容器的上部穿過源容器;第一加熱器,第一加熱器安裝在位於源容器內的固體或液體源材料上方,且第一加熱器將熱供應到固體或液體源材料,以蒸發源材料;以及傳遞單元,傳遞單元使第一加熱器和源材料中的一者在與另一者接近或與另一者遠離的方向上往復運動。According to an exemplary embodiment of the present invention, there is provided an apparatus for supplying a material that evaporates a source material to be deposited as a thin film on a substrate, and the apparatus supplies the evaporation source material to an injection hole facing the substrate, the apparatus including a source container, the source material to be deposited on the substrate is contained in a lower portion of the source container in a solid or liquid state, and the evaporation source material passes through the source container at an upper portion of the source container; the first heater, the first heater is installed at Located above the solid or liquid source material within the source container, and the first heater supplies heat to the solid or liquid source material to evaporate the source material; and a transfer unit that causes one of the first heater and the source material Reciprocating in a direction that is close to or away from the other.

設備可進一步包含擋板,擋板提供在位於源容器內的第一加熱器上方,且擋板攔截從該源容器的外側傳遞到內側的熱。The apparatus can further include a baffle provided above the first heater located within the source container, and the baffle intercepts heat transferred from the outside to the inside of the source container.

設備可進一步包括:冷卻器,冷卻器安裝在源容器的下部中,以便鄰近於液體或固體源材料,且冷卻器冷卻容納在源容器中的源材料;以及第二加熱器,第二加熱器安裝在源容器的上部中並與液體或固體源材料隔開,且第二加熱器將熱供應到源容器,以便防止穿過源容器的經蒸發源材料相變為液態或固態。The apparatus may further include: a cooler installed in a lower portion of the source container to be adjacent to the liquid or solid source material, and the cooler cooling the source material contained in the source container; and a second heater, the second heater Installed in the upper portion of the source vessel and separated from the liquid or solid source material, and the second heater supplies heat to the source vessel to prevent the vaporized source material passing through the source vessel from becoming liquid or solid.

傳遞單元可包括:桿單元,桿單元穿透源容器的頂部,桿單元耦合到第一加熱器,且桿單元和第一加熱器一起在源容器內上下往復運動;驅動源,驅動源供應用於使桿單元往復運動的驅動力;以及控制器,控制器連接到驅動源且控制桿單元的傳遞方向和速度。The transfer unit may include: a rod unit penetrating the top of the source container, the rod unit being coupled to the first heater, and the rod unit and the first heater reciprocating up and down in the source container; the driving source, the driving source supply a driving force for reciprocating the lever unit; and a controller that is connected to the driving source and that controls the direction and speed of the lever unit.

傳遞單元可包括:桿單元,桿單元穿透源容器的底部,桿單元接觸源材料,且桿單元和源材料一起在源容器內上下往復運動;驅動源,驅動源供應用於使桿單元往復運動的驅動力;以及控制器,控制器連接到驅動源且控制桿單元的傳遞方向和速度。The transfer unit may include: a rod unit penetrating the bottom of the source container, the rod unit contacting the source material, and the rod unit and the source material reciprocating up and down together in the source container; the driving source, the driving source is supplied for reciprocating the rod unit The driving force of the motion; and the controller, the controller is connected to the driving source and the direction and speed of the control rod unit are transmitted.

如上所述,在根據本發明的示範性實施例的用於供應材料之設備中,源材料和用於將熱供應到源材料以蒸發源材料的加熱器提供在一個空間內,且根據源材料的蒸發量來調節源材料和加熱器之間的距離,從而,維持沉積在基板上的有機發光二極體的恒定厚度而不管源材料的消耗如何,並製造出可靠的有機發光二極體。As described above, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, a source material and a heater for supplying heat to the source material to evaporate the source material are provided in one space, and according to the source material The amount of evaporation adjusts the distance between the source material and the heater, thereby maintaining a constant thickness of the organic light-emitting diode deposited on the substrate regardless of the consumption of the source material, and producing a reliable organic light-emitting diode.

而且,在根據本發明的示範性實施例的用於供應材料之設備中,在沒有媒介的情況下,熱直接從第一加熱器傳遞到源容器,以使得可藉由對第一加熱器的溫度控制快速實現源容器中的源材料的升溫反應;源材料可穩定地蒸發,以實現均勻沉積和大面積沉積;且可防止大量源材料變性。Moreover, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, in the absence of a medium, heat is directly transferred from the first heater to the source container so that the first heater can be used The temperature control quickly realizes the temperature rising reaction of the source material in the source container; the source material can be stably evaporated to achieve uniform deposition and large-area deposition; and a large amount of source material can be prevented from denaturation.

此外,在根據本發明的示範性實施例的用於供應材料之設備中,擋板用以完全攔截從蒸發室的外側傳遞到內側的熱,從而消除可影響蒸發源材料的量的外部因素。Further, in the apparatus for supplying a material according to an exemplary embodiment of the present invention, the baffle serves to completely intercept heat transferred from the outside to the inside of the evaporation chamber, thereby eliminating external factors that may affect the amount of the evaporation source material.

下文中將參看附圖說明根據本發明的用於供應材料之設備的示範性實施例。An exemplary embodiment of an apparatus for supplying materials according to the present invention will hereinafter be described with reference to the accompanying drawings.

圖1為根據本發明的第一示範性實施例的用於供應材料之設備的示意圖,且圖2為展示第一加熱器移動以接近圖1的用於供應材料之設備中的源容器的視圖。1 is a schematic view of an apparatus for supplying materials according to a first exemplary embodiment of the present invention, and FIG. 2 is a view showing a first heater moving to approach a source container in the apparatus for supplying materials of FIG. 1. .

參看圖1和圖2,此示範性實施例中的用於供應材料之設備為能蒸發和供應將要以薄膜形式沉積在基板上的有機物質的設備,該設備包括源容器110、蒸發室120、第一加熱器130、傳遞單元140、擋板150、冷卻器160和第二加熱器170。Referring to FIGS. 1 and 2, the apparatus for supplying materials in this exemplary embodiment is an apparatus capable of evaporating and supplying an organic substance to be deposited on a substrate in a film form, the apparatus including a source container 110, an evaporation chamber 120, The first heater 130, the transfer unit 140, the baffle 150, the cooler 160, and the second heater 170.

本發明提供用於製造有機發光裝置(OLED)的設備, 舉例而言,在該設備中,用於示範性實施例中的源材料可為有機物質。The present invention provides an apparatus for manufacturing an organic light emitting device (OLED), For example, in the apparatus, the source material used in the exemplary embodiment may be an organic substance.

圖1中所示的注射器10是與通道一起在內部形成,通道與連接管20連通,且注射器10具有噴射孔11,在注射器的末端處穿過噴射孔11噴射經蒸發源材料1。此時,注射器10線性地形成,以使得噴射孔11經對準以面向基板。此外,噴射孔11可以噴嘴的形式製成分離部分並耦合到注射器10的末端,或噴射孔11可以通孔的形式在注射器10的末端處一體模制而成。The syringe 10 shown in Fig. 1 is formed internally with a passage, the passage is in communication with the connecting tube 20, and the syringe 10 has an injection hole 11 through which the evaporation source material 1 is sprayed at the end of the syringe. At this time, the syringe 10 is linearly formed such that the ejection holes 11 are aligned to face the substrate. Further, the injection hole 11 may be formed as a separation portion in the form of a nozzle and coupled to the end of the syringe 10, or the injection hole 11 may be integrally molded at the end of the syringe 10 in the form of a through hole.

連接管20連接蒸發室120和注射器10,以使得經由稍後描述的第一加熱器130蒸發的源材料1可流向注射器10。連接管20可拆卸地連接到注射器10和蒸發室120。The connection tube 20 connects the evaporation chamber 120 and the syringe 10 so that the source material 1 evaporated via the first heater 130 described later can flow to the syringe 10. The connecting tube 20 is detachably coupled to the syringe 10 and the evaporation chamber 120.

將要沉積在基板10上的源材料1以固態或液態容納在源容器110中,源容器110的形狀像一側開啟的氣缸。舉例而言,源容器110由鎢材料製成,且源容器110設置在蒸發室120之下。源容器110在內部填有有機物質以作為將要沉積在基板上的源材料1。The source material 1 to be deposited on the substrate 10 is housed in the source container 110 in a solid or liquid state, and the source container 110 is shaped like a cylinder that is opened on one side. For example, the source container 110 is made of a tungsten material, and the source container 110 is disposed below the evaporation chamber 120. The source container 110 is internally filled with an organic substance as the source material 1 to be deposited on the substrate.

蒸發室120具有內部空間,源容器110安裝在內部空間內。在蒸發室120的內部空間之下,源容器110被設置成與蒸發室120連通。在蒸發室120的內部空間上方,形成經蒸發源材料1穿過的空間。The evaporation chamber 120 has an internal space in which the source container 110 is installed. Below the internal space of the evaporation chamber 120, the source container 110 is disposed in communication with the evaporation chamber 120. Above the internal space of the evaporation chamber 120, a space through which the evaporation source material 1 passes is formed.

以固態或液態容納在源容器110中的源材料1經第一加熱器130加熱,且經加熱源材料1在蒸發室120的內部空間中被向上氣化和蒸發。經蒸發源材料1穿過蒸發室120且經由噴射孔11噴向基板。The source material 1 housed in the source container 110 in a solid or liquid state is heated by the first heater 130, and is heated and vaporized upward in the inner space of the evaporation chamber 120 via the heat source material 1. The evaporation source material 1 passes through the evaporation chamber 120 and is sprayed toward the substrate via the ejection holes 11.

源容器110可拆卸地耦合到蒸發室120。當將要沉積在基板10上的源材料1(亦即,有機物質)填充在源容器110中時,暫停沉積製程,且源容器110與蒸發室120分離。此後,若源材料1完全填充在源容器110中,則源容器110再次設置在蒸發室120的內部空間中,且重新開始沉積製程。Source container 110 is detachably coupled to evaporation chamber 120. When the source material 1 (i.e., organic matter) to be deposited on the substrate 10 is filled in the source container 110, the deposition process is suspended, and the source container 110 is separated from the evaporation chamber 120. Thereafter, if the source material 1 is completely filled in the source container 110, the source container 110 is again disposed in the internal space of the evaporation chamber 120, and the deposition process is restarted.

向源容器110供應熱以便蒸發容納在源容器110中的源材料1的第一加熱器130安裝在蒸發室120內的源容器110上方。The first heater 130 that supplies heat to the source container 110 to evaporate the source material 1 contained in the source container 110 is installed above the source container 110 in the evaporation chamber 120.

只要第一加熱器130可供應蒸發源材料1的熱能,則第一加熱器130便可具有各種形狀。舉例而言,可使用磁心加熱器、燈加熱器等等。在此示範性實施例中,磁心加熱器用作第一加熱器130。此時,電阻性熱絲可包括Ta、W、Mo或以上物質的合金。The first heater 130 can have various shapes as long as the first heater 130 can supply the heat energy of the evaporation source material 1. For example, a magnetic core heater, a lamp heater, or the like can be used. In this exemplary embodiment, a core heater is used as the first heater 130. At this time, the resistive hot wire may include Ta, W, Mo or an alloy of the above substances.

然而,在此示範性實施例中,第一加熱器130安裝在與源容器110容納源材料1的空間相同的空間中,以使得來自第一加熱器130的熱可在無媒介的情況下直接傳遞到源容器110 1。因此,可藉由對第一加熱器130的溫度控制快速實現源容器110中的源材料1的升溫反應。However, in this exemplary embodiment, the first heater 130 is installed in the same space as the source container 110 accommodating the source material 1 so that the heat from the first heater 130 can be directly in the absence of a medium Passed to source container 110 1 . Therefore, the temperature rise reaction of the source material 1 in the source container 110 can be quickly achieved by temperature control of the first heater 130.

傳遞單元140在相互靠近或相互遠離的方向上使第一加熱器130和源容器110中的一者往復運動。在此示範性實施例中,使第一加熱器130往復運動。經由傳遞單元140,調節源容器110與第一加熱器130之間的距離,且因此有可能控制源容器110中蒸發的源材料1的量。The transfer unit 140 reciprocates one of the first heater 130 and the source container 110 in a direction approaching or away from each other. In this exemplary embodiment, the first heater 130 is reciprocated. The distance between the source container 110 and the first heater 130 is adjusted via the transfer unit 140, and thus it is possible to control the amount of the source material 1 evaporated in the source container 110.

舉例而言,若經蒸發源材料1的量較小,則在靠近源材料1的方向上傳遞第一加熱器130,且向源容器110供應更多的熱,從而增加源容器110中蒸發的源材料1的量。另一方面,若經蒸發源材料1的量較多,則在遠離源材料1的方向上傳遞第一加熱器130,且向源容器110供應更少熱,從而減少源容器110中蒸發的源材料1的量。For example, if the amount of the evaporation source material 1 is small, the first heater 130 is transferred in a direction close to the source material 1, and more heat is supplied to the source container 110, thereby increasing evaporation in the source container 110. The amount of source material 1. On the other hand, if the amount of the evaporation source material 1 is large, the first heater 130 is transferred in a direction away from the source material 1, and less heat is supplied to the source container 110, thereby reducing the source of evaporation in the source container 110. The amount of material 1.

根據源容器110中剩餘的源材料1的量,有可能調節源容器110與第一加熱器130之間的距離。若消耗掉源材料1,且因此源容器110中剩餘的源材料1的體積減小了,則只需向源容器110供應較少的熱以保持均勻的蒸發量。在此種情況下,在遠離源材料1的方向上傳遞第一加熱器130。另一方面,若源容器110重新填有新源材料1,且源容器110中剩餘的源材料1的體積增加,則需向源容器110供應更多的熱以保持均勻的蒸發量。在此種情況下,在靠近源材料1的方向上傳遞第一加熱器130。Depending on the amount of source material 1 remaining in the source container 110, it is possible to adjust the distance between the source container 110 and the first heater 130. If the source material 1 is consumed, and thus the volume of the source material 1 remaining in the source container 110 is reduced, then only a small amount of heat is supplied to the source container 110 to maintain a uniform amount of evaporation. In this case, the first heater 130 is transferred in a direction away from the source material 1. On the other hand, if the source container 110 is refilled with the new source material 1 and the volume of the source material 1 remaining in the source container 110 is increased, more heat needs to be supplied to the source container 110 to maintain a uniform evaporation amount. In this case, the first heater 130 is transferred in a direction close to the source material 1.

在此示範性實施例中,傳遞單元140包括桿單元141、驅動源142及控制器143。In this exemplary embodiment, the transfer unit 140 includes a lever unit 141, a drive source 142, and a controller 143.

桿單元141穿透蒸發室120的頂部,且耦合到第一加熱器130,以使得桿單元141可連同第一加熱器130一起在蒸發室120內上下往復運動。此時,在蒸發室120中的桿單元141周圍提供波紋管144,且因此防止經蒸發源材料1附著到桿單元141上。The rod unit 141 penetrates the top of the evaporation chamber 120 and is coupled to the first heater 130 such that the rod unit 141 can reciprocate up and down within the evaporation chamber 120 together with the first heater 130. At this time, the bellows 144 is provided around the rod unit 141 in the evaporation chamber 120, and thus the attachment of the evaporation source material 1 to the rod unit 141 is prevented.

當桿單元141經安裝以穿透蒸發室120的頂部時,有可能減小設備的整體尺寸。亦即,蒸發且穿過源材料1的區域與安裝桿單元141的區域部分重疊,以使得可相應減小用於固定桿單元141的全衝程而額外所需的空間。When the rod unit 141 is installed to penetrate the top of the evaporation chamber 120, it is possible to reduce the overall size of the apparatus. That is, the region that evaporates and passes through the source material 1 partially overlaps the region of the mounting bar unit 141, so that the additional space required for fixing the full stroke of the lever unit 141 can be correspondingly reduced.

驅動源142提供用於使桿單元141往復運動的驅動力。只要驅動源142可做線性往復運動,驅動源142便可配置為各種形式。舉例而言,可使用所屬領域的技術人員眾所周知的氣動缸、線性馬達、回轉馬達與滾珠螺桿的組合及相似配置,且因此將省略對以上裝置的詳細描述。The drive source 142 provides a driving force for reciprocating the lever unit 141. As long as the drive source 142 can perform linear reciprocating motion, the drive source 142 can be configured in various forms. For example, a pneumatic cylinder, a linear motor, a combination of a swing motor and a ball screw, and the like, which are well known to those skilled in the art, can be used, and thus a detailed description of the above apparatus will be omitted.

控制器143連接到驅動源142且控制桿單元141的傳遞方向和速度。The controller 143 is connected to the drive source 142 and controls the direction and speed of transmission of the lever unit 141.

擋板150將攔截從蒸發室120外側傳遞到內側的熱,擋板150安裝在蒸發室120的內部空間中的第一加熱器130上方。The baffle 150 will intercept heat transferred from the outside of the evaporation chamber 120 to the inside, and the baffle 150 is installed above the first heater 130 in the internal space of the evaporation chamber 120.

從容納在注射器10或連接管20中的經蒸發源材料1發射的熱可經由連通過程傳遞到蒸發室120的內部空間。在此 種情況下,可視預料之外的外部因素改變蒸發源材料1的量,對量的控制是基於第一加熱器130與源材料1之間的距離或第一加熱器130的溫度。蒸發源材料1的量的改變直接影響有機發光二極體的厚度,並且導致有缺陷的產品。Heat emitted from the evaporation source material 1 accommodated in the syringe 10 or the connecting tube 20 may be transferred to the internal space of the evaporation chamber 120 via a communication process. here In this case, the amount of the evaporation source material 1 is changed by an unexpected external factor, and the amount is controlled based on the distance between the first heater 130 and the source material 1 or the temperature of the first heater 130. The change in the amount of the evaporation source material 1 directly affects the thickness of the organic light-emitting diode and results in a defective product.

因此,擋板150用於完全攔截從蒸發室120外側傳遞到內側的熱,從而消除可影響蒸發源材料1的量的外部因素。Therefore, the baffle 150 serves to completely intercept the heat transferred from the outside to the inside of the evaporation chamber 120, thereby eliminating external factors that can affect the amount of the evaporation source material 1.

擋板150的形狀像平板且與蒸發室120的內壁以預定距離間隔開。經蒸發源材料1可穿過擋板150與蒸發室120的內壁之間的空間移動。The baffle 150 is shaped like a flat plate and spaced apart from the inner wall of the evaporation chamber 120 by a predetermined distance. The evaporation source material 1 can move through the space between the baffle 150 and the inner wall of the evaporation chamber 120.

冷卻器160冷卻容納在源容器110中的源材料1,以防止容納在源容器110中的源材料1由於來自第一加熱器130的熱而變性。冷卻器160安裝在源容器110的外側以便鄰近於液體或固體源材料1,且可配置為在蒸發室120下方環繞蒸發室120的外壁。The cooler 160 cools the source material 1 housed in the source container 110 to prevent the source material 1 contained in the source container 110 from being denatured due to heat from the first heater 130. The cooler 160 is mounted outside the source container 110 so as to be adjacent to the liquid or solid source material 1 and may be configured to surround the outer wall of the evaporation chamber 120 below the evaporation chamber 120.

冷卻器160可以是能夠冷卻填有源材料1的源容器110的內側的各種形式。在此示範性實施例中,使用冷卻套為例。藉由用流動著冷卻劑的冷卻通道環繞蒸發室120的外壁來配置冷卻器160。The cooler 160 may be in various forms capable of cooling the inside of the source container 110 in which the active material 1 is filled. In this exemplary embodiment, a cooling jacket is used as an example. The cooler 160 is disposed by surrounding the outer wall of the evaporation chamber 120 with a cooling passage through which a coolant flows.

第二加熱器170安裝在蒸發室120的上部以與液體或固體源材料1隔開,第二加熱器170向蒸發室120供應熱以防止穿過蒸發室120的經蒸發源材料1相變到液態或固態。The second heater 170 is installed at an upper portion of the evaporation chamber 120 to be separated from the liquid or solid source material 1, and the second heater 170 supplies heat to the evaporation chamber 120 to prevent the evaporation source material 1 passing through the evaporation chamber 120 from being phase-changed to Liquid or solid.

舉例而言,第二加熱器170可使用磁心加熱器、燈加熱器等等,且以此方式形成使得蒸發室120的上部外壁由電阻性熱絲環繞。此時使用的電阻性熱絲可包含Ta、W、Mo或以上物質的合金。For example, the second heater 170 may use a core heater, a lamp heater, or the like, and is formed in such a manner that an upper outer wall of the evaporation chamber 120 is surrounded by a resistive hot wire. The resistive hot wire used at this time may contain Ta, W, Mo or an alloy of the above.

如上所述,在根據本發明的示範性實施例的用於供應材料之設備中,源材料及用於向源材料供應熱以蒸發源材料的加熱器提供在一個空間中,且根據源材料的蒸發量來調節源材料與加熱器之間的距離,從而保持沉積在基板上的有機發光二極體的恒定厚度而不管源材料的消耗如何,並製造出可靠有機發光二極體。As described above, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, a source material and a heater for supplying heat to the source material to evaporate the source material are provided in one space, and according to the source material The amount of evaporation adjusts the distance between the source material and the heater, thereby maintaining a constant thickness of the organic light-emitting diode deposited on the substrate regardless of the consumption of the source material, and producing a reliable organic light-emitting diode.

此外,在根據本發明的示範性實施例的用於供應材料之設備中,熱在無媒介的情況下直接從第一加熱器傳遞到源容器,以使得可藉由對第一加熱器的溫度控制快速實現源容器中的源材料的升溫反應;源材料可被穩定蒸發以實現均勻沉積和大面積沉積;且可防止大量源材料變性。Further, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, heat is directly transferred from the first heater to the source container without a medium so that the temperature of the first heater can be utilized Controls the rapid temperature reaction of the source material in the source vessel; the source material can be stably evaporated to achieve uniform deposition and large area deposition; and a large amount of source material can be prevented from denaturation.

進一步地,在根據本發明的示範性實施例的用於供應材料之設備中,擋板用於完全攔截從蒸發室外側傳遞到內側的熱,從而減小可影響蒸發源材料的量的外部因素。Further, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, a baffle is used to completely intercept heat transferred from the outside of the evaporation chamber to the inside, thereby reducing external factors that may affect the amount of evaporation source material. .

此外,在根據本發明的示範性實施例的用於供應材料之設備中,使第一加熱器而不是容納源材料的較重源容器往復運動,以避免過度負荷的傳遞運動,且使具有恒定質量的第一加熱器而不是質量視源材料的消耗而改變的源容器往復 運動,以容易地控制傳遞運動。Further, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, a first heater is reciprocated rather than a heavier source container accommodating a source material to avoid an excessive load transfer motion and to have a constant The quality of the first heater instead of the quality of the source material changes the source of the container reciprocating Exercise to easily control the transfer movement.

此外,在根據本發明的示範性實施例的用於供應材料之設備中,桿單元經安裝成穿透蒸發室的頂部,以使得蒸發且穿過源材料的區域可與安裝桿單元的區域部分重疊,從而相應地減小用於固定全衝程而額外所需的空間且減小設備的整體尺寸。Further, in an apparatus for supplying a material according to an exemplary embodiment of the present invention, a rod unit is installed to penetrate a top portion of an evaporation chamber such that an area that evaporates and passes through the source material may be associated with a region portion of the mounting rod unit Overlap, thereby correspondingly reducing the additional space required to secure the full stroke and reducing the overall size of the device.

圖3是根據本發明的第二示範性實施例的用於供應材料之設備的示意圖。3 is a schematic diagram of an apparatus for supplying materials in accordance with a second exemplary embodiment of the present invention.

參看圖3,根據本示範性實施例的用於供應材料之設備200的特徵在於,與其中使第一加熱器130往復運動的第一示範性實施例的設備不同,設備200使源容器110往復運動。在圖3中,元件具有與由圖1和圖2中所示的相同元件符號的元件的配置和功能相同的配置與功能,且因此將省略對該等元件的詳細描述。Referring to FIG. 3, the apparatus 200 for supplying materials according to the present exemplary embodiment is characterized in that, unlike the apparatus of the first exemplary embodiment in which the first heater 130 reciprocates, the apparatus 200 reciprocates the source container 110 motion. In FIG. 3, elements have the same configurations and functions as those of the elements of the same element symbols shown in FIGS. 1 and 2, and thus detailed descriptions of the elements will be omitted.

此示範性實施例中的傳遞單元240使源容器110往復運動,以在相互靠近或相互遠離的方向上往復地傳遞第一加熱器130及源容器110。經由傳遞單元240調節源容器110與第一加熱器130之間的距離而引起的影響與第一示範性實施例的影響相同,且因此將省略對此影響的詳細描述。The transfer unit 240 in this exemplary embodiment reciprocates the source container 110 to reciprocally transfer the first heater 130 and the source container 110 in directions toward or away from each other. The influence caused by adjusting the distance between the source container 110 and the first heater 130 via the transfer unit 240 is the same as that of the first exemplary embodiment, and thus a detailed description of this influence will be omitted.

在此示範性實施例中,傳遞單元240包括桿單元241、驅動源242及控制器243。In this exemplary embodiment, the transfer unit 240 includes a lever unit 241, a drive source 242, and a controller 243.

桿單元241穿透蒸發室120的底部,且耦合到源容器110,以使得桿單元241可連同源容器110一起在蒸發室120內上下往復運動。The rod unit 241 penetrates the bottom of the evaporation chamber 120 and is coupled to the source container 110 such that the rod unit 241 can reciprocate up and down within the evaporation chamber 120 along with the source container 110.

驅動源242供應用於使桿單元241往復運動的驅動力,且控制器243連接到驅動源242且控制桿單元241的傳遞方向和速度。The driving source 242 supplies a driving force for reciprocating the lever unit 241, and the controller 243 is connected to the driving source 242 and controls the transmission direction and speed of the lever unit 241.

圖4是根據本發明的第三示範性實施例的用於供應材料之設備的示意圖。4 is a schematic diagram of an apparatus for supplying materials in accordance with a third exemplary embodiment of the present invention.

參看圖4,根據本示範性實施例的用於供應材料之設備300的特徵在於,源容器和蒸發室不是單獨提供,且源容器不僅容納源材料,還使經蒸發源材料從中穿過。此外,根據此示範性實施例的用於供應材料之設備300包括源容器310、第一加熱器330、傳遞單元340、擋板350、冷卻器360及第二加熱器370。Referring to FIG. 4, the apparatus 300 for supplying materials according to the present exemplary embodiment is characterized in that the source container and the evaporation chamber are not separately provided, and the source container not only accommodates the source material but also passes the evaporation source material therethrough. Further, the apparatus 300 for supplying materials according to this exemplary embodiment includes a source container 310, a first heater 330, a transfer unit 340, a shutter 350, a cooler 360, and a second heater 370.

源容器310容納將在源容器310下部中以固態或液態沉積在基板上的源材料1,且在源容器310上部中使經蒸發源材料1從中穿過。源容器310的下部填有有機物質以作為將沉積在基板上的源材料1。The source container 310 accommodates the source material 1 to be deposited on the substrate in a solid or liquid state in the lower portion of the source container 310, and passes the evaporation source material 1 therethrough in the upper portion of the source container 310. The lower portion of the source container 310 is filled with an organic substance as the source material 1 to be deposited on the substrate.

由第一加熱器330加熱容納在源容器310的下部中的固體或液體源材料1,且朝向源容器310的上部氣化並蒸發經加熱源材料1。經蒸發源材料1穿過源容器310且隨後經由 噴射孔11朝向基板噴射。The solid or liquid source material 1 contained in the lower portion of the source container 310 is heated by the first heater 330, and is vaporized toward the upper portion of the source container 310 and evaporated by the heat source material 1. The evaporation source material 1 passes through the source container 310 and is subsequently passed via The ejection holes 11 are ejected toward the substrate.

向源容器310供應熱以便蒸發容納在源容器310中的源材料1的第一加熱器330安裝在源容器310內的源材料1上方。第一加熱器330的材料及功能與第一示範性實施例的第一加熱器130的材料及功能相同,且因此將省略對第一加熱器330的材料及功能的詳細描述。The first heater 330 that supplies heat to the source container 310 to evaporate the source material 1 contained in the source container 310 is installed above the source material 1 in the source container 310. The material and function of the first heater 330 are the same as those of the first heater 130 of the first exemplary embodiment, and thus a detailed description of the materials and functions of the first heater 330 will be omitted.

傳遞單元340在靠近源材料1或遠離源材料1的方向上使第一加熱器330往復運動。經由傳遞單元340調節第一加熱器330與源材料1之間的距離而引起的影響與第一示範性實施例的影響相同,且因此將省略對此影響的詳細描述。The transfer unit 340 reciprocates the first heater 330 in a direction close to the source material 1 or away from the source material 1. The influence caused by adjusting the distance between the first heater 330 and the source material 1 via the transfer unit 340 is the same as that of the first exemplary embodiment, and thus a detailed description of this influence will be omitted.

在此示範性實施例中,傳遞單元340包括桿單元341、驅動源342及控制器343。In this exemplary embodiment, the transfer unit 340 includes a lever unit 341, a drive source 342, and a controller 343.

桿單元341穿透源容器310的頂部,且耦合到第一加熱器330,因此桿單元341可連同第一加熱器330一起在源容器310內上下往復運動。此時,在源容器310內側的桿單元341周圍提供波紋管344,且因此防止經蒸發源材料1附著到桿單元341上。The rod unit 341 penetrates the top of the source container 310 and is coupled to the first heater 330, so the rod unit 341 can reciprocate up and down within the source container 310 along with the first heater 330. At this time, the bellows 344 is provided around the rod unit 341 inside the source container 310, and thus the attachment of the evaporation source material 1 to the rod unit 341 is prevented.

驅動源342供應用於使桿單元341往復運動的驅動力,且控制器343連接到驅動源342且控制桿單元341的傳遞方向和速度。The driving source 342 supplies a driving force for reciprocating the lever unit 341, and the controller 343 is connected to the driving source 342 and controls the transmission direction and speed of the lever unit 341.

擋板350將攔截從源容器310外側傳遞到內側的熱,擋 板350安裝在源容器310的內部空間中的第一加熱器330上方。擋板350的功能和形狀與第一示範性實施例的擋板150的功能和形狀相同,且因此將省略對擋板350的功能和形狀的詳細描述。The baffle 350 will intercept the heat transferred from the outside of the source container 310 to the inside. The plate 350 is mounted above the first heater 330 in the internal space of the source container 310. The function and shape of the baffle 350 are the same as those of the baffle 150 of the first exemplary embodiment, and thus a detailed description of the function and shape of the baffle 350 will be omitted.

冷卻器360冷卻容納在源容器310中的源材料1,以防止容納在源容器110中的源材料1由於來自第一加熱器330的熱而變性。冷卻器360經安裝成環繞源容器310的下部中的源容器310的外壁,以便鄰近於液體或固體源材料1。The cooler 360 cools the source material 1 contained in the source container 310 to prevent the source material 1 accommodated in the source container 110 from being denatured due to heat from the first heater 330. The cooler 360 is mounted to surround the outer wall of the source container 310 in the lower portion of the source container 310 so as to be adjacent to the liquid or solid source material 1.

冷卻器360的功能和形狀與第一示範性實施例的冷卻器160的功能和形狀相同,且因此將省略對冷卻器360的功能和形狀的詳細描述。The function and shape of the cooler 360 are the same as those of the cooler 160 of the first exemplary embodiment, and thus a detailed description of the function and shape of the cooler 360 will be omitted.

第二加熱器370向源容器310供應熱,以防止穿過源容器310的經蒸發源材料1相變到液態或固態,第二加熱器370安裝在源容器310的上部中,且與液體或固體源材料1隔開。The second heater 370 supplies heat to the source container 310 to prevent phase change of the evaporated source material 1 through the source container 310 to a liquid or solid state, and the second heater 370 is installed in the upper portion of the source container 310, and is liquid or The solid source material 1 is separated.

第二加熱器370的功能和形狀與第一示範性實施例的第二加熱器170的功能和形狀相同,且因此將省略對第二加熱器370的功能和形狀的詳細描述。The function and shape of the second heater 370 are the same as those of the second heater 170 of the first exemplary embodiment, and thus a detailed description of the function and shape of the second heater 370 will be omitted.

圖5是根據本發明的第四示範性實施例的用於供應材料之設備的示意圖。Figure 5 is a schematic illustration of an apparatus for supplying materials in accordance with a fourth exemplary embodiment of the present invention.

參看圖5,根據此示範性實施例的用於供應材料之設備400的特徵在於,往復地傳遞源材料1,此情形與其中往復 地傳遞第一加熱器330的第三示範性實施例形成對比。在圖5中,元件具有與由圖4中所示的相同元件符號的元件的配置和功能相同的配置與功能,且因此將省略對該等元件的詳細描述。Referring to FIG. 5, an apparatus 400 for supplying materials according to this exemplary embodiment is characterized in that a source material 1 is reciprocally transferred, in which case A third exemplary embodiment of transferring the first heater 330 is contrasted. In FIG. 5, elements have the same configurations and functions as those of the elements of the same element symbols shown in FIG. 4, and thus detailed descriptions of the elements will be omitted.

此示範性實施例中的傳遞單元440使源材料1往復運動,以在相互靠近1或相互遠離的方向上往復地傳遞第一加熱器330及源材料1。經由傳遞單元440調節第一加熱器330與源材料1之間的距離而引起的影響與第一示範性實施例的影響相同,且因此將省略對此影響的詳細描述。The transfer unit 440 in this exemplary embodiment reciprocates the source material 1 to reciprocally transfer the first heater 330 and the source material 1 in a direction close to each other or away from each other. The influence caused by adjusting the distance between the first heater 330 and the source material 1 via the transfer unit 440 is the same as that of the first exemplary embodiment, and thus a detailed description of this influence will be omitted.

在此示範性實施例中,傳遞單元440包括桿單元441、驅動源442及控制器443。In this exemplary embodiment, the transfer unit 440 includes a lever unit 441, a drive source 442, and a controller 443.

桿單元441穿透源容器310的底部且接觸源材料1。桿單元441連同源材料1一起在源容器310內被上下往復地傳遞。The rod unit 441 penetrates the bottom of the source container 310 and contacts the source material 1. The rod unit 441 is transferred up and down in the source container 310 together with the source material 1 .

驅動源442供應用於使桿單元441往復運動的驅動力,且控制器443連接到驅動源442且控制桿單元441的傳遞方向和速度。The driving source 442 supplies a driving force for reciprocating the lever unit 441, and the controller 443 is connected to the driving source 442 and controls the transmission direction and speed of the lever unit 441.

儘管已展示和描述了本發明的一些示範性實施例,但是所屬領域的技術人員應瞭解,可在該等實施例中進行改變,而不脫離本發明的原理及精神,在所附申請專利範圍及所附申請專利範圍的等效物中界定了本發明的範圍。Although a few exemplary embodiments of the invention have been shown and described, it will be understood by those skilled in the art The scope of the invention is defined by the equivalents of the appended claims.

1‧‧‧源材料1‧‧‧ source material

10‧‧‧注射器10‧‧‧Syringe

11‧‧‧噴射孔11‧‧‧Spray hole

20‧‧‧連接管20‧‧‧Connecting tube

100‧‧‧設備100‧‧‧ Equipment

110‧‧‧源容器110‧‧‧ source container

120‧‧‧蒸發室120‧‧ ‧Evaporation room

130‧‧‧第一加熱器130‧‧‧First heater

140‧‧‧傳遞單元140‧‧‧Transfer unit

141‧‧‧桿單元141‧‧‧ rod unit

142‧‧‧驅動源142‧‧‧ drive source

143‧‧‧控制器143‧‧‧ Controller

144‧‧‧波紋管144‧‧‧ bellows

150‧‧‧擋板150‧‧ ‧ baffle

160‧‧‧冷卻器160‧‧‧cooler

170‧‧‧第二加熱器170‧‧‧second heater

200‧‧‧設備200‧‧‧ equipment

240‧‧‧傳遞單元240‧‧‧transfer unit

241‧‧‧桿單元241‧‧‧ rod unit

242‧‧‧驅動源242‧‧‧ drive source

243‧‧‧控制器243‧‧‧ Controller

300‧‧‧設備300‧‧‧ Equipment

310‧‧‧源容器310‧‧‧ source container

330‧‧‧第一加熱器330‧‧‧First heater

340‧‧‧傳遞單元340‧‧‧Transfer unit

341‧‧‧桿單元341‧‧‧ rod unit

342‧‧‧驅動源342‧‧‧ drive source

343‧‧‧控制器343‧‧‧ Controller

344‧‧‧波紋管344‧‧‧ Bellows

350‧‧‧擋板350‧‧ ‧ baffle

360‧‧‧冷卻器360‧‧‧cooler

370‧‧‧第二加熱器370‧‧‧second heater

400‧‧‧設備400‧‧‧ equipment

440‧‧‧傳遞單元440‧‧‧transfer unit

441‧‧‧桿單元441‧‧‧ rod unit

442‧‧‧驅動源442‧‧‧ drive source

443‧‧‧控制器443‧‧‧ Controller

根據結合附圖進行的對示範性實施例的以下描述,本發明的以上和/或其它態樣將變得顯而易見且更容易理解,附圖中:圖1為根據本發明的第一示範性實施例的用於供應材料之設備的示意圖;圖2為展示第一加熱器移動以接近圖1的用於供應材料之設備中的源容器的視圖。The above and/or other aspects of the present invention will become more apparent from the following description of the exemplary embodiments of the invention in the <RTIgt; A schematic of an apparatus for supplying materials, and FIG. 2 is a view showing the first heater moving to approach the source container of the apparatus for supplying materials of FIG. 1.

圖3為根據本發明的第二示範性實施例的用於供應材料之設備的示意圖;圖4為根據本發明的第三示範性實施例的用於供應材料之設備的示意圖;以及圖5為根據本發明的第四示範性實施例的用於供應材料之設備的示意圖。3 is a schematic view of an apparatus for supplying materials according to a second exemplary embodiment of the present invention; FIG. 4 is a schematic view of an apparatus for supplying materials according to a third exemplary embodiment of the present invention; and FIG. A schematic diagram of an apparatus for supplying materials according to a fourth exemplary embodiment of the present invention.

1‧‧‧源材料1‧‧‧ source material

10‧‧‧注射器10‧‧‧Syringe

11‧‧‧噴射孔11‧‧‧Spray hole

20‧‧‧連接管20‧‧‧Connecting tube

100‧‧‧設備100‧‧‧ Equipment

110‧‧‧源容器110‧‧‧ source container

120‧‧‧蒸發室120‧‧ ‧Evaporation room

130‧‧‧第一加熱器130‧‧‧First heater

140‧‧‧傳遞單元140‧‧‧Transfer unit

141‧‧‧桿單元141‧‧‧ rod unit

142‧‧‧驅動源142‧‧‧ drive source

143‧‧‧控制器143‧‧‧ Controller

144‧‧‧波紋管144‧‧‧ bellows

150‧‧‧擋板150‧‧ ‧ baffle

160‧‧‧冷卻器160‧‧‧cooler

170‧‧‧第二加熱器170‧‧‧second heater

Claims (10)

一種用於供應材料之設備,該設備蒸發將要作為一薄膜沉積在一基板上的一源材料,且該設備將該經蒸發源材料供應給面向該基板的一噴射孔,該設備包含:一源容器,將要沉積在一基板上的一源材料以固態或液態容納在該源容器中;一蒸發室,該蒸發室包含用於將該源容器安裝在其中的一內部空間,且來自該源容器的該經蒸發源材料穿過該蒸發室;一第一加熱器,該第一加熱器提供在位於該蒸發室內的該源容器上方,且該第一加熱器將熱供應到該源容器,以蒸發容納在該源容器中的該源材料;以及一傳遞單元,該傳遞單元使該第一加熱器和該源容器中的一者在與另一者接近或與另一者遠離的方向上往復運動。An apparatus for supplying a material, the apparatus evaporating a source material to be deposited as a thin film on a substrate, and the apparatus supplies the evaporated source material to an ejection hole facing the substrate, the apparatus comprising: a source a container in which a source material to be deposited on a substrate is contained in a solid or liquid state; an evaporation chamber containing an internal space for mounting the source container therein, and from the source container The evaporated source material passes through the evaporation chamber; a first heater, the first heater is provided above the source container located in the evaporation chamber, and the first heater supplies heat to the source container to Evaporating the source material contained in the source container; and a transfer unit that reciprocates one of the first heater and the source container in a direction approaching or away from the other motion. 如請求項1所述之設備,該設備進一步包含一擋板,該擋板提供在位於該蒸發室內的該第一加熱器上方,且該擋板攔截從該蒸發室的一外側傳遞到一內側的熱。The apparatus of claim 1, the apparatus further comprising a baffle provided above the first heater located in the evaporation chamber, and the baffle intercepting is transmitted from an outer side of the evaporation chamber to an inner side hot. 如請求項1所述之設備,該設備進一步包含:一冷卻器,該冷卻器安裝在該蒸發室的一下部中,以便鄰近於一液體或固體源材料,且該冷卻器冷卻容納在該源容 器中的一源材料;以及一第二加熱器,該第二加熱器安裝在該蒸發室的一上部中並與該液體或固體源材料隔開,且該第二加熱器將熱供應到該蒸發室,以便防止穿過該蒸發室的該經蒸發源材料相變為液態或固態。The apparatus of claim 1, the apparatus further comprising: a cooler installed in a lower portion of the evaporation chamber so as to be adjacent to a liquid or solid source material, and the cooler is cooled to be housed in the source Capacity a source material in the device; and a second heater installed in an upper portion of the evaporation chamber and spaced apart from the liquid or solid source material, and the second heater supplies heat to the The evaporation chamber is configured to prevent the vaporized source material passing through the evaporation chamber from becoming liquid or solid. 如請求項1所述之設備,其中該傳遞單元包含:一桿單元,該桿單元穿透該蒸發室的一頂部,該桿單元耦合到該第一加熱器,且該桿單元和該第一加熱器一起在該蒸發室內上下往復運動;一驅動源,該驅動源供應用於使該桿單元往復運動的一驅動力;以及一控制器,該控制器連接到該驅動源且控制該桿單元的一傳遞方向和速度。The apparatus of claim 1, wherein the transfer unit comprises: a rod unit penetrating a top of the evaporation chamber, the rod unit being coupled to the first heater, and the rod unit and the first The heater reciprocates up and down in the evaporation chamber together; a driving source that supplies a driving force for reciprocating the rod unit; and a controller that is connected to the driving source and controls the rod unit One pass direction and speed. 如請求項1所述之設備,其中該傳遞單元包含:一桿單元,該桿單元穿透該蒸發室的一底部,該桿單元耦合到該源容器,且該桿單元和該源容器一起在該蒸發室內上下往復運動;一驅動源,該驅動源供應用於使該桿單元往復運動的一驅動力;以及 一控制器,該控制器連接到該驅動源且控制該桿單元的一傳遞方向和速度。The apparatus of claim 1, wherein the transfer unit comprises: a rod unit penetrating a bottom of the evaporation chamber, the rod unit being coupled to the source container, and the rod unit being together with the source container The evaporation chamber reciprocates up and down; a driving source that supplies a driving force for reciprocating the rod unit; A controller coupled to the drive source and controlling a direction and speed of transmission of the lever unit. 一種用於供應材料之設備,該設備蒸發將要作為一薄膜沉積在一基板上的一源材料,且該設備將該經蒸發源材料供應給面向該基板的一噴射孔,該設備包含:一源容器,將要沉積在基板上的該源材料以固態或液態容納在該源容器的一下部中,且該經蒸發源材料在該源容器的一上部中穿過該源容器;一第一加熱器,該第一加熱器安裝在位於該源容器內的該固體或液體源材料上方,且該第一加熱器將熱供應到該固體或液體源材料,以蒸發該源材料;以及一轉移單元,該轉移單元使該第一加熱器和該源材料中的一者在與另一者接近或與另一者遠離的方向上往復運動。An apparatus for supplying a material, the apparatus evaporating a source material to be deposited as a thin film on a substrate, and the apparatus supplies the evaporated source material to an ejection hole facing the substrate, the apparatus comprising: a source a container, the source material to be deposited on the substrate is contained in a lower portion of the source container in a solid or liquid state, and the evaporated source material passes through the source container in an upper portion of the source container; a first heater The first heater is mounted above the solid or liquid source material located within the source container, and the first heater supplies heat to the solid or liquid source material to evaporate the source material; and a transfer unit, The transfer unit reciprocates one of the first heater and the source material in a direction that is close to or away from the other. 如請求項6所述之設備,該設備進一步包含一擋板,該擋板提供在位於該源容器內的該第一加熱器上方,且該擋板攔截從該源容器的外側傳遞到內側的熱。The apparatus of claim 6, the apparatus further comprising a baffle provided above the first heater located within the source container, and the baffle intercepting is transferred from the outside to the inside of the source container heat. 如請求項6所述之設備,該設備進一步包含:一冷卻器,該冷卻器安裝在該源容器的一下部中,以便鄰近於一液體或固體源材料,且該冷卻器冷卻容納在該源容器中的一源材料;以及 一第二加熱器,該第二加熱器安裝在該源容器的一上部中並與該液體或固體源材料隔開,且該第二加熱器將熱供應到該源容器,以便防止穿過該源容器的該經蒸發源材料相變為液態或固態。The apparatus of claim 6, the apparatus further comprising: a cooler installed in a lower portion of the source container to be adjacent to a liquid or solid source material, and the cooler is cooled to be housed in the source a source material in the container; a second heater mounted in an upper portion of the source container and spaced apart from the liquid or solid source material, and the second heater supplies heat to the source container to prevent passage of the second heater The evaporated source material of the source container is changed to a liquid or solid state. 如請求項6所述之設備,其中該傳遞單元包含:一桿單元,該桿單元穿透該源容器的一頂部,該桿單元耦合到該第一加熱器,且該桿單元和該第一加熱器一起在該源容器內上下往復運動;一驅動源,該驅動源供應用於使該桿單元往復運動的一驅動力;以及一控制器,該控制器連接到該驅動源且控制該桿單元的一傳遞方向和速度。The device of claim 6, wherein the transfer unit comprises: a rod unit penetrating a top of the source container, the rod unit being coupled to the first heater, and the rod unit and the first The heater reciprocates up and down in the source container together; a driving source that supplies a driving force for reciprocating the rod unit; and a controller that is connected to the driving source and controls the rod A direction and speed of the unit. 如請求項6所述之設備,其中該傳遞單元包含:一桿單元,該桿單元穿透該源容器的一底部,該桿單元接觸該源材料,且該桿單元和該源材料一起在該源容器內上下往復運動;一驅動源,該驅動源供應用於使該桿單元往復運動的一驅動力;以及一控制器,該控制器連接到該驅動源且控制該桿單元的一傳遞方向和速度。The apparatus of claim 6, wherein the transfer unit comprises: a rod unit penetrating a bottom of the source container, the rod unit contacting the source material, and the rod unit and the source material are together a source container reciprocating up and down; a driving source that supplies a driving force for reciprocating the rod unit; and a controller connected to the driving source and controlling a direction of transmission of the rod unit And speed.
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CN1226448C (en) * 2002-07-19 2005-11-09 Lg电子株式会社 Vapour-deposition source for organic electroluminescent film vapour-deposition
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JP2004095419A (en) * 2002-08-30 2004-03-25 Kiko Kenji Kagi Kofun Yugenkoshi Vacuum film-forming device equipped with alignment mechanism
JP4494126B2 (en) * 2003-08-15 2010-06-30 株式会社半導体エネルギー研究所 Film forming apparatus and manufacturing apparatus
JP4726570B2 (en) * 2005-08-05 2011-07-20 日立造船株式会社 Evaporator for vacuum deposition
JP4001296B2 (en) * 2005-08-25 2007-10-31 トッキ株式会社 Method and apparatus for vacuum deposition of organic materials
JP5268249B2 (en) * 2005-12-14 2013-08-21 キヤノン株式会社 Manufacturing method of organic light emitting device
PL1862564T3 (en) * 2006-06-03 2009-02-27 Applied Mat Gmbh & Co Kg Apparatus for the evaporation of materials by means of an evaporator tube
JP2008019477A (en) * 2006-07-13 2008-01-31 Canon Inc Vacuum vapor deposition apparatus
JP2008174816A (en) * 2007-01-22 2008-07-31 Sony Corp Vapor deposition system, vapor deposition method, organic light emitting device and display
KR100926437B1 (en) * 2008-11-17 2009-11-13 에스엔유 프리시젼 주식회사 Deposition material supply apparatus and Equipment for treating substrate having the same
JP2011256427A (en) * 2010-06-09 2011-12-22 Hitachi Zosen Corp Method for evaporating/sublimating evaporation material in vacuum deposition apparatus and crucible device for vacuum deposition
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