TWI436072B - Apparatus for classifying electronic components - Google Patents

Apparatus for classifying electronic components Download PDF

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TWI436072B
TWI436072B TW99143917A TW99143917A TWI436072B TW I436072 B TWI436072 B TW I436072B TW 99143917 A TW99143917 A TW 99143917A TW 99143917 A TW99143917 A TW 99143917A TW I436072 B TWI436072 B TW I436072B
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electronic component
light
adsorption nozzle
adsorption
container
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TW201144826A (en
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Atsushi Hiruma
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Nihon Garter Co Ltd
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Description

電子元件之分類裝置Electronic component classification device

本發明有關一種電子元件之分類裝置。The present invention relates to a sorting device for an electronic component.

一直以來,已經有一種測量發光元件等電子元件的特性,並根據其結果對電子元件進行分類的裝置(參照專利文獻1)。在這種裝置中,藉由吹送高壓氣體,載置在台上的電子元件被強勁地送入至送出管內,並通過送出管內後排出至容器內。There has been a device for measuring characteristics of electronic components such as light-emitting elements and classifying electronic components based on the results (see Patent Document 1). In such a device, by blowing high-pressure gas, the electronic components placed on the stage are strongly fed into the delivery pipe, and are discharged into the container through the delivery pipe.

[專利文獻1]日本特開2007-192576號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-192576

然而,電子元件有時採用陶瓷等脆性高的材料,如上述習知技術那樣,電子元件通過送出管內或被排出至容器內時,電子元件有破損之虞。However, the electronic component sometimes uses a material having high brittleness such as ceramics. As in the above-described conventional technique, when the electronic component is discharged into the container or discharged into the container, the electronic component is damaged.

本發明乃有鑒於上述實際情況而研創者,其主要目的在於,提供一種能夠抑制電子元件的破損的電子元件之分類裝置。The present invention has been made in view of the above circumstances, and its main object is to provide a sorting device for an electronic component capable of suppressing breakage of an electronic component.

為了解決上述課題,本發明的電子元件之分類裝置係具備有具有吸附噴嘴的頭部、氣體吸引部、定位部、以及氣體注入部,並在從複數個容器中選擇的容器中收納電子元件。前述氣體吸引部係吸引連接至前述吸附噴嘴的管內的氣體。前述定位部係使前述頭部移動,俾使被前述吸附噴嘴吸附的前述電子元件位於前述所選擇的容器的上方。當被前述吸附噴嘴吸附的前述電子元件位於前述所選擇的容器的上方時,前述氣體注入部係對連接至前述吸附噴嘴的管內注入氣體。In order to solve the above problems, the electronic component classification device of the present invention includes a head having an adsorption nozzle, a gas suction portion, a positioning portion, and a gas injection portion, and houses the electronic component in a container selected from a plurality of containers. The gas suction portion sucks the gas connected to the tube of the adsorption nozzle. The positioning unit moves the head to prevent the electronic component adsorbed by the adsorption nozzle from being positioned above the selected container. When the electronic component adsorbed by the adsorption nozzle is positioned above the selected container, the gas injection portion injects a gas into a tube connected to the adsorption nozzle.

根據本發明,由於電子元件從容器的上方落下,因此,與上述習知技術相比,能夠抑制電子元件所受到的衝擊。According to the present invention, since the electronic component is dropped from above the container, the impact of the electronic component can be suppressed as compared with the above-described conventional technique.

在本發明的一個態樣中,前述電子元件具有呈凸狀突出的凸狀部,前述凸狀部被插入至前述吸附噴嘴。如此,能良好地收納電子元件。In one aspect of the invention, the electronic component has a convex portion that protrudes in a convex shape, and the convex portion is inserted into the adsorption nozzle. In this way, the electronic component can be housed well.

也可以在前述吸附噴嘴形成:插入孔,係插入前述凸狀部;以及貫通孔,係連接前述插入孔與前述管且比前述插入孔還細。如此,吸附電子元件所需的吸引力會降低。The adsorption nozzle may be formed by inserting an insertion hole into the convex portion, and a through hole connecting the insertion hole and the tube and being thinner than the insertion hole. As such, the attractive force required to attract electronic components is reduced.

在本發明的一個態樣中,前述頭部具有通過感測器,係檢測前述電子元件通過前述吸附噴嘴的下方位置。如此,能檢測出被吸附噴嘴吸附的電子元件是否落入容器。In one aspect of the invention, the head portion has a sensor that detects a position of the electronic component passing through the suction nozzle. In this way, it is possible to detect whether or not the electronic component adsorbed by the adsorption nozzle falls into the container.

前述通過感測器亦可具有以夾著前述吸附噴嘴的下方位置的方式而配置的發光部以及受光部。如此,能檢測出電子元件是否通過發光部與受光部之間的範圍。The sensor may have a light-emitting portion and a light-receiving portion that are disposed to sandwich a position below the adsorption nozzle. In this way, it is possible to detect whether or not the electronic component passes between the light-emitting portion and the light-receiving portion.

此外,亦可為:復包含有使載置前述電子元件的構件載置台升降的升降機構,前述構件載置台通過前述發光部與前述受光部之間並上升,前述電子元件被前述吸附噴嘴吸附。如此,電子元件接近吸附噴嘴後被吸附。Moreover, the elevating mechanism for elevating and lowering the component mounting table on which the electronic component is placed may be further included, and the component mounting table may be raised between the light emitting section and the light receiving section, and the electronic component may be adsorbed by the adsorption nozzle. Thus, the electronic component is adsorbed after approaching the adsorption nozzle.

此外,亦可為:復包含有使前述吸附噴嘴升降的升降機構,前述吸附噴嘴通過前述發光部與前述受光部之間並下降,配置在前述頭部的下方的前述電子元件被前述吸附噴嘴吸附。如此,電子元件接近吸附噴嘴後被吸附。Further, the elevating mechanism that elevates and lowers the adsorption nozzle may be further included, and the adsorption nozzle is lowered between the light-emitting portion and the light-receiving portion, and the electronic component disposed below the head portion is adsorbed by the adsorption nozzle . Thus, the electronic component is adsorbed after approaching the adsorption nozzle.

在本發明的一態樣中,前述頭部具有複數個前述吸附噴嘴,前述定位部係使前述頭部移動,俾使被前述各個吸附噴嘴吸附的前述電子元件依序位於針對前述各個電子元件所選擇的容器的上方。如此,能縮短頭部的移動距離。In one aspect of the present invention, the head portion has a plurality of the adsorption nozzles, and the positioning portion moves the head portion to sequentially position the electronic components adsorbed by the adsorption nozzles for each of the electronic components. Above the selected container. In this way, the moving distance of the head can be shortened.

前述頭部也可以具有通過感測器,該通過感測器包含有以夾著前述各個吸附噴嘴的下方位置的方式而配置的發光部以及受光部。如此,能用一組發光部與受光部檢測出電子元件從各個吸附噴嘴落下。The head portion may have a passing sensor that includes a light emitting portion and a light receiving portion that are disposed to sandwich a position below the respective adsorption nozzles. In this way, it is possible to detect that the electronic component is dropped from each of the adsorption nozzles by the one light-emitting portion and the light-receiving portion.

此外,亦可為,具備有:主搬運部,係排列有複數個構件載置台;副搬運部,係排列有與前述複數個吸附噴嘴對應的複數個構件載置台的組;以及移載部,係將前述電子元件從前述主搬運部的構件載置台移載至前述副搬運部的構件載置台;並且,前述複數個吸附噴嘴一齊吸附被載置在前述副搬運部的前述複數個構件載置台的前述電子元件。於是,電子元件被移載在副搬運部的構件載置台,藉此複數個吸附噴嘴能一齊吸附複數個電子元件。Further, the main transport unit may be provided with a plurality of component mounting tables, and the auxiliary transporting unit may be a group in which a plurality of component mounting tables corresponding to the plurality of adsorption nozzles are arranged, and a transfer unit. The electronic component is transferred from the component mounting table of the main conveyance unit to the component mounting table of the sub-transporting unit, and the plurality of adsorption nozzles simultaneously adsorb the plurality of component mounting platforms placed on the sub-transporting unit The aforementioned electronic components. Then, the electronic component is transferred to the component mounting table of the sub-transporting unit, whereby the plurality of adsorption nozzles can simultaneously adsorb a plurality of electronic components.

本發明的電子元件之分類裝置係具備有特性測量部、容器選擇部、頭部、氣體吸引部、定位部、以及氣體注入部。前述特性測量部係測量電子元件的特性。前述容器選擇部係根據前述電子元件的特性的測量結果,從複數個容器中選擇收納前述電子元件的容器。前述頭部具有吸附噴嘴。前述氣體吸引部係吸引連接至前述吸附噴嘴的管內的氣體。前述定位部係使前述頭部移動,俾使被前述吸附噴嘴吸附的前述電子元件位於前述所選擇的容器的上方。當被前述吸附噴嘴吸附的前述電子元件位於前述所選擇的容器的上方時,前述氣體注入部係對連接至前述吸附噴嘴的管內注入氣體。The electronic component classification device of the present invention includes a characteristic measuring unit, a container selecting unit, a head, a gas suction unit, a positioning unit, and a gas injection unit. The aforementioned characteristic measuring unit measures the characteristics of the electronic component. The container selection unit selects a container for accommodating the electronic component from a plurality of containers based on a measurement result of characteristics of the electronic component. The aforementioned head has an adsorption nozzle. The gas suction portion sucks the gas connected to the tube of the adsorption nozzle. The positioning unit moves the head to prevent the electronic component adsorbed by the adsorption nozzle from being positioned above the selected container. When the electronic component adsorbed by the adsorption nozzle is positioned above the selected container, the gas injection portion injects a gas into a tube connected to the adsorption nozzle.

根據本發明,電子元件被定位在與測量結果對應的容器的上方,並從此處落下,因此,與上述習知技術相比,能夠抑制電子元件所受到的衝擊。According to the present invention, the electronic component is positioned above the container corresponding to the measurement result and falls therefrom, and therefore, the shock received by the electronic component can be suppressed as compared with the above-described conventional technique.

本發明的電子元件之分類裝置是一種在從複數個容器中所選擇的容器收納電子元件的電子元件之分類裝置,係具備有頭部,該頭部具有吸附前述電子元件的吸附噴嘴,用以將前述電子元件搬運至與前述所選擇的容器對應的位置。前述電子元件具有呈凸狀突出的凸狀部,前述凸狀部被插入至前述吸附噴嘴中。A sorting device for an electronic component according to the present invention is a sorting device for an electronic component that houses an electronic component in a container selected from a plurality of containers, and is provided with a head having an adsorption nozzle for adsorbing the electronic component, The electronic component is transported to a position corresponding to the selected container. The electronic component has a convex portion that protrudes in a convex shape, and the convex portion is inserted into the adsorption nozzle.

根據本發明,電子元件被吸附噴嘴良好地保持。According to the invention, the electronic component is well held by the adsorption nozzle.

本發明的電子元件之分類裝置是一種在從複數個容器中所選擇的容器中收納電子元件的電子元件之分類裝置,係具備有:頭部,係具有吸附前述電子元件的吸附噴嘴,用以將前述電子元件搬運至與前述所選擇的容器對應的位置;以及升降機構,係使載置前述電子元件的構件載置台升降。前述頭部具有通過感測器,該通過感測器包含有以夾著前述吸附噴嘴的下方位置的方式而配置的發光部與受光部,並且,前述構件載置台通過前述發光部與前述受光部之間並上升,前述電子元件被前述吸附噴嘴吸附。The classification device for an electronic component according to the present invention is a classification device for an electronic component that houses an electronic component in a container selected from a plurality of containers, and includes a head having an adsorption nozzle for adsorbing the electronic component. The electronic component is transported to a position corresponding to the selected container; and the elevating mechanism is configured to elevate and lower the component mounting table on which the electronic component is placed. The head portion includes a light-emitting portion and a light-receiving portion that are disposed to sandwich a position below the adsorption nozzle, and the member mounting table passes through the light-emitting portion and the light-receiving portion. The electronic component is adsorbed by the adsorption nozzle.

根據本發明,電子元件靠近吸附噴嘴後被吸附。According to the present invention, the electronic component is adsorbed after being brought close to the adsorption nozzle.

本發明的電子元件之分類裝置是一種在從複數個容器中所選擇的容器收納電子元件的電子元件之分類裝置,係具備有:頭部,係具有吸附前述電子元件的吸附噴嘴,用以將前述電子元件搬運至與前述所選擇的容器對應的位置;以及升降機構,係使前述吸附噴嘴升降。前述頭部係具有通過感測器,該通過感測器包含有以夾著前述吸附噴嘴的下方位置的方式而配置的發光部與受光部,並且,前述吸附噴嘴通過前述發光部與前述受光部之間並下降,配置在前述頭部的下方的前述電子元件被前述吸附噴嘴吸附。A sorting device for an electronic component according to the present invention is a sorting device for an electronic component that accommodates an electronic component in a container selected from a plurality of containers, and includes a head having an adsorption nozzle for adsorbing the electronic component to The electronic component is transported to a position corresponding to the selected container; and the elevating mechanism moves the adsorption nozzle up and down. The head unit includes a sensor that includes a light-emitting portion and a light-receiving portion that are disposed to sandwich a position below the adsorption nozzle, and the adsorption nozzle passes through the light-emitting portion and the light-receiving portion. Between and down, the aforementioned electronic component disposed under the head portion is adsorbed by the adsorption nozzle.

根據本發明,電子元件靠近吸附噴嘴後被吸附。According to the present invention, the electronic component is adsorbed after being brought close to the adsorption nozzle.

本發明的電子元件之分類裝置是一種在從複數個容器中所選擇的容器收納電子元件的電子元件之分類裝置,係具備有:頭部,係具有複數個吸附噴嘴;氣體吸引部,係吸引連接至前述各個吸附噴嘴的管內的氣體;定位部,係使前述頭部移動,俾使被前述各個吸附噴嘴吸附的前述電子元件依序位於針對前述各個電子元件所選擇的容器的上方;以及氣體注入部,係對連接至前述各個吸附噴嘴的管內注入氣體。The electronic component classification device of the present invention is an electronic component classification device that accommodates electronic components in a container selected from a plurality of containers, and includes a head having a plurality of adsorption nozzles and a gas suction portion that attracts a gas connected to the tubes of each of the adsorption nozzles; the positioning portion moves the head portion such that the electronic components adsorbed by the respective adsorption nozzles are sequentially positioned above the containers selected for the respective electronic components; The gas injection unit injects gas into the tubes connected to the respective adsorption nozzles.

根據本發明,將電子元件搬運至容器上方位置的頭部的移動距離被縮短。According to the present invention, the moving distance of the head for transporting the electronic component to the position above the container is shortened.

參照附圖說明本發明的電子元件之分類裝置的實施形態。An embodiment of the electronic component sorting apparatus of the present invention will be described with reference to the drawings.

第1圖是本發明的一實施形態中的電子元件之分類裝置1的俯視圖。電子元件之分類裝置1係具備有沿著第1圖的箭頭R方向間歇地旋轉之作為主搬運部的第一間歇旋轉盤2。此外,電子元件之分類裝置1係在第一間歇旋轉盤2的周圍由上游依序具備有構件供給機3、位置調整機36、發光特性測量部12、位置調整機37、作為副搬運部的第二間歇旋轉盤4、以及定位部5。Fig. 1 is a plan view of a sorting device 1 for an electronic component according to an embodiment of the present invention. The electronic component sorting device 1 includes a first intermittent rotating disk 2 as a main transporting portion that intermittently rotates in the direction of the arrow R in the first drawing. In addition, the electronic component sorting device 1 is provided with the component feeder 3, the position adjusting machine 36, the light-emitting characteristic measuring unit 12, the position adjusting machine 37, and the sub-transporting unit in the vicinity of the first intermittent rotating disk 2 in this order. The second intermittent rotating disk 4 and the positioning portion 5.

第一間歇旋轉盤2係具備有:圓板部21,係以能夠旋轉的方式配置;以及複數個構件載置台22,係在圓板部21的外緣部以預定的角度間隔排列。第一間歇旋轉盤2係以構件載置台22的排列角度單位間歇地旋轉。因此,構件載置台22停止的位置係固定。在各個構件載置台22載置發光元件L。The first intermittent rotary disk 2 includes a disk portion 21 that is rotatably disposed, and a plurality of component mounting bases 22 that are arranged at predetermined angular intervals on the outer edge portion of the disk portion 21. The first intermittent rotary disk 2 is intermittently rotated in units of the arrangement angle of the component mounting table 22. Therefore, the position at which the component mounting table 22 is stopped is fixed. The light-emitting elements L are placed on the respective component mounting tables 22.

構件供給機3係具備有朝著第一間歇旋轉盤2延伸的整列搬運部32。整列搬運部32係將發光元件L排成一列並朝著第一間歇旋轉盤2搬運。到達整列搬運部32的前端部的發光元件L係被構件移載機34載置在構件載置台22。The component feeder 3 is provided with an entire transport unit 32 that extends toward the first intermittent rotary disk 2. The entire row transport unit 32 arranges the light-emitting elements L in a row and transports them toward the first intermittent rotary disk 2. The light-emitting element L that has reached the front end portion of the entire transport unit 32 is placed on the member mounting table 22 by the component transfer machine 34.

發光特性測量部12係具備有積分球12a,測量被載置在構件載置台22的發光元件L的亮度等發光特性。位置調整機36、37係調整被載置在構件載置台22的發光元件L的位置。The light-emitting characteristic measuring unit 12 includes an integrating sphere 12a, and measures light-emitting characteristics such as brightness of the light-emitting element L placed on the member mounting table 22. The position adjusting machines 36 and 37 adjust the position of the light-emitting element L placed on the member mounting table 22.

第二間歇旋轉盤4係具備有:圓板部41,係以能夠旋轉的方式配置;以及複數個構件搬運部42,係在圓板部41的外緣部以預定的角度間隔排列。載置在第一間歇旋轉盤2的構件載置台22的發光元件L係被構件移載機39載置在第二間歇旋轉盤4的構件搬運部42。將在後面對第二間歇旋轉盤4進行詳細的闡述。The second intermittent rotary disk 4 includes a disk portion 41 that is rotatably disposed, and a plurality of component conveying portions 42 that are arranged at an outer peripheral edge of the disk portion 41 at a predetermined angular interval. The light-emitting element L placed on the component mounting table 22 of the first intermittent rotating disk 2 is placed on the component conveying portion 42 of the second intermittent rotating disk 4 by the component transfer machine 39. The second intermittent rotary disk 4 will be described in detail later.

定位部5係將載置在第二間歇旋轉盤4的構件搬運部42上的發光元件L搬運至在第二間歇旋轉盤4的旁邊以二維排列的有底圓筒狀的複數個容器B的上方,並收納在從複數個容器B中決定的一個容器B。收納發光元件L的容器B係根據在發光特性測量部12中所測量的發光特性來決定。The positioning unit 5 transports the light-emitting elements L placed on the member transport unit 42 of the second intermittent rotary disk 4 to a plurality of bottomed cylindrical containers B arranged two-dimensionally alongside the second intermittent rotary disk 4. Above, and stored in a container B determined from a plurality of containers B. The container B accommodating the light-emitting element L is determined based on the light-emitting characteristics measured by the light-emitting characteristic measuring unit 12.

如第14A圖至第14C圖所示,發光元件L係具備有:矩形板狀的基板部Ls;半球狀的透鏡部Lp,係從基板部Ls向上方呈凸狀突出;以及一對端子Lt,係設置在基板部Ls的下表面。基板部Ls以陶瓷等絕緣材料作為主材。透鏡部Lp係由矽等透明樹脂材料所構成。As shown in FIGS. 14A to 14C, the light-emitting element L includes a rectangular plate-shaped substrate portion Ls, a hemispherical lens portion Lp protruding upward from the substrate portion Ls, and a pair of terminals Lt. The system is provided on the lower surface of the substrate portion Ls. The substrate portion Ls is made of an insulating material such as ceramic as a main material. The lens portion Lp is made of a transparent resin material such as tantalum.

第2圖是定位部5的側視圖。如第1圖及第2圖所示,定位部5係具備有:驅動部54,係包含有複數個馬達;上腕部52,係從驅動部54朝著一個方向延伸;前腕部53,係以能夠旋轉的方式被上腕部52的前端支承;頭部51,係被前腕部53的前端支承且能夠保持發光元件L;操作棒55係從驅動部54延伸且被安裝在前腕部53;以及吸引管59,係被安裝在頭部51。將在後面對頭部51進行詳細的闡述。FIG. 2 is a side view of the positioning portion 5. As shown in FIGS. 1 and 2, the positioning unit 5 includes a driving unit 54 including a plurality of motors, and an upper arm portion 52 extending in one direction from the driving portion 54. The front arm portion 53 is configured to The rotatable manner is supported by the front end of the upper arm portion 52; the head portion 51 is supported by the front end of the front wrist portion 53 and can hold the light emitting element L; the operating rod 55 extends from the driving portion 54 and is mounted on the front wrist portion 53; The tube 59 is attached to the head 51. The head 51 will be explained in detail later.

藉由驅動部54使上腕部52及前腕部53沿著水平方向旋轉。具體而言,上腕部52係以驅動部54的位置為中心,藉由驅動部54所包含的第一馬達進行旋轉。前腕部53係以上腕部52的前端為中心,藉由驅動部54所包含的第二馬達,經由操作棒55進行旋轉。如此。頭部51能夠在構件搬運部42及複數個容器B的上方沿著水平方向移動。構件搬運部42的上方位置與各個容器B的上方位置係能夠與驅動部54所包含的兩個馬達的旋轉角的坐標對應。The upper arm portion 52 and the front arm portion 53 are rotated in the horizontal direction by the driving portion 54. Specifically, the upper arm portion 52 is rotated by the first motor included in the driving portion 54 around the position of the driving portion 54. The front arm portion 53 is centered on the distal end of the wrist portion 52, and is rotated by the operating rod 55 by the second motor included in the driving portion 54. in this way. The head portion 51 is movable in the horizontal direction above the member conveying portion 42 and the plurality of containers B. The upper position of the member conveying portion 42 and the upper position of each of the containers B can correspond to the coordinates of the rotation angles of the two motors included in the driving unit 54.

第3圖是第二間歇旋轉盤4的俯視圖。第二間歇旋轉盤4的各個構件搬運部42具有沿著旋轉方向排列的複數個構件載置台47a、47b。在本實施形態中,構件搬運部42具有兩個構件載置台47a、47b。在第二間歇旋轉盤4的間歇旋轉中,構件搬運部42所包含的兩個構件載置台47a、47b之間的角度的旋轉(與箭頭R1對應)、以及分別屬於相鄰的構件搬運部42的構件載置台47a、47b之間的角度的旋轉(與箭頭R2對應)交替地進行。因此,與第一間歇旋轉盤2的構件載置台22相面對,構件載置台47a、47b停止的位置係固定。構件移載機39將被載置在第一間歇旋轉盤2的構件載置台22的發光元件L載置在與其相面對的構件載置台47a、47b上。Fig. 3 is a plan view of the second intermittent rotary disk 4. Each member conveying portion 42 of the second intermittent rotating disk 4 has a plurality of member mounting tables 47a and 47b arranged in the rotation direction. In the present embodiment, the member conveying portion 42 has two member placing tables 47a and 47b. In the intermittent rotation of the second intermittent rotary disk 4, the rotation of the angle between the two member mounting tables 47a and 47b included in the member conveying portion 42 (corresponding to the arrow R1) and the adjacent member conveying portion 42 are respectively included. The rotation of the angle between the component mounting tables 47a, 47b (corresponding to the arrow R2) is alternately performed. Therefore, the position where the component mounting tables 47a and 47b are stopped is fixed to face the component mounting table 22 of the first intermittent rotating disk 2. The component transfer machine 39 mounts the light-emitting elements L placed on the component mounting table 22 of the first intermittent rotary disk 2 on the component mounting bases 47a and 47b facing each other.

第4A圖及第4B圖是構件搬運部42的正視圖及側視圖。構件搬運部42係具備有:固定部43,係固定在前述圓板部41;可動部44,係相對於固定部43能夠上下滑動;足部45,係設置在可動部44的下部;牽引彈簧46,係架設在固定部43與可動部44之間;以及台部47,係設置在可動部44的上部。這些構件係由不銹鋼等金屬所構成。4A and 4B are a front view and a side view of the member conveying portion 42. The member conveying portion 42 includes a fixing portion 43 that is fixed to the disc portion 41, and a movable portion 44 that is slidable up and down with respect to the fixing portion 43. The foot portion 45 is provided at a lower portion of the movable portion 44. 46 is bridged between the fixed portion 43 and the movable portion 44; and the base portion 47 is provided at an upper portion of the movable portion 44. These members are made of a metal such as stainless steel.

在固定部43及可動部44分別設置有沿著側方延伸的突起部43a、44a,牽引彈簧46被架設在這些突起部43a、44a。The fixing portion 43 and the movable portion 44 are respectively provided with projections 43a and 44a extending along the side, and the traction springs 46 are placed on the projections 43a and 44a.

在台部47形成朝著上方延伸的兩個構件載置台47a、47b。如第3圖所示,在台部47安裝吸引管49。吸引管49經由形成在台部47的通孔而與構件載置台47a、47b的頂部相連。未圖示的吸引器係對吸引管49進行吸引,藉此在構件載置台47a、47b的頂部產生負壓,而使發光元件L被吸附。The table portion 47 is formed with two member mounting tables 47a and 47b that extend upward. As shown in Fig. 3, a suction pipe 49 is attached to the table portion 47. The suction pipe 49 is connected to the tops of the component mounting tables 47a, 47b via through holes formed in the land portion 47. The suction device (not shown) suctions the suction pipe 49, whereby a negative pressure is generated at the top of the component mounting tables 47a and 47b, and the light-emitting element L is attracted.

在足部45的下端部形成有中心軸朝著前後方向的扁平圓柱狀的從動輪(follower)45a。從動輪45a係與後述的升降機構6的控制桿67接觸,將從控制桿67承受的力量向可動部44傳遞。牽引彈簧46係將可動部44向下方牽引。當可動部44從從動輪45a承受力量時,係抵抗牽引彈簧46的牽引力而朝著上方滑動。A flat cylindrical follower 45a whose central axis is oriented in the front-rear direction is formed at the lower end portion of the foot portion 45. The driven wheel 45a comes into contact with the control lever 67 of the elevating mechanism 6 to be described later, and transmits the force received from the control lever 67 to the movable portion 44. The traction spring 46 pulls the movable portion 44 downward. When the movable portion 44 receives the force from the driven wheel 45a, it is slid upward against the traction force of the traction spring 46.

第5圖是升降機構6的側視圖。升降機構6係配置在前述第二間歇旋轉盤4的旁邊,用來使構件搬運部42的構件載置台47a、47b升降。升降機構6係具備有:壁部61;氣缸62,係被壁部61的上端部支承;軸部63,係從氣缸62朝著下方延伸;前端部64,係設置在軸部63的前端;固定部65,係固定在壁部61;支承部68,係配置在氣缸62與構件搬運部42之間;控制桿67,係以能夠旋轉的方式被支承部68的上端部支承;以及牽引彈簧66,係架設在固定部65與控制桿67之間。Fig. 5 is a side view of the elevating mechanism 6. The elevating mechanism 6 is disposed beside the second intermittent rotating disk 4, and is used to raise and lower the component mounting tables 47a and 47b of the component conveying portion 42. The elevating mechanism 6 includes a wall portion 61, an air cylinder 62 supported by an upper end portion of the wall portion 61, a shaft portion 63 extending downward from the air cylinder 62, and a front end portion 64 provided at a front end of the shaft portion 63. The fixing portion 65 is fixed to the wall portion 61; the support portion 68 is disposed between the cylinder 62 and the member conveying portion 42; the control lever 67 is rotatably supported by the upper end portion of the support portion 68; and the traction spring 66 is erected between the fixing portion 65 and the control rod 67.

氣缸62係使軸部63沿著上下方向進退。軸部63的前端部64係以能夠旋轉的方式被安裝在設置在控制桿67的一個端部的力點部67b。設置在控制桿67的另一個端部的作用部67c係與設置在構件搬運部42的下端的從動輪45a的下表面接觸。牽引彈簧66係架設在固定部65的突起部65a與控制桿67的力點部67b一側的突起部67d,並朝著上方牽引控制桿67的力點部67b一側。The cylinder 62 moves the shaft portion 63 forward and backward in the vertical direction. The front end portion 64 of the shaft portion 63 is rotatably attached to the force point portion 67b provided at one end portion of the control lever 67. The acting portion 67c provided at the other end of the lever 67 is in contact with the lower surface of the driven wheel 45a provided at the lower end of the member carrying portion 42. The traction spring 66 is stretched over the protrusion portion 67a of the fixing portion 65 and the protrusion portion 67d on the side of the force point portion 67b of the control lever 67, and pulls the force point portion 67b side of the control lever 67 upward.

當氣缸62朝著下方推壓軸部63時,控制桿67的作用部67c一側係抵抗牽引彈簧66的牽引力而朝上方推起。此時,由於控制桿67的作用部67c推起構件搬運部42的從動輪45a,因此使構件載置台47a、47b上升。在構件搬運部42位於頭部51下方的期間,氣缸62係使軸部63往復一次。在軸部63被朝下方推壓時,構件載置台47a、47b上升至頭部51的位置,然後,在軸部63返回上方時,下降至初始位置。When the cylinder 62 pushes the shaft portion 63 downward, the action portion 67c side of the control lever 67 is pushed upward against the traction force of the traction spring 66. At this time, since the acting portion 67c of the control lever 67 pushes up the driven wheel 45a of the member conveying portion 42, the member mounting tables 47a and 47b are raised. While the member conveying portion 42 is located below the head portion 51, the cylinder 62 reciprocates the shaft portion 63 once. When the shaft portion 63 is pressed downward, the member mounting tables 47a and 47b rise to the position of the head portion 51, and then return to the initial position when the shaft portion 63 returns upward.

第6A圖及第6B圖是頭部51的剖面圖。頭部51係具備有:複數個吸附噴嘴58,係分別安裝在吸引管59的前端;平板部512,係支承吸附噴嘴58;心形的蓋部513,係配置在平板部512的上表面側,且覆蓋吸附噴嘴58的上方;框部515、透光部516,係配置在平板部512的下表面側,且包圍吸附噴嘴58的下方;以及通過感測器514a、514b,係在平板部512的下表面側以夾著框部515、透光部516等構件的方式配置。在本實施形態中,頭部51具有 兩個吸附噴嘴58。6A and 6B are cross-sectional views of the head 51. The head portion 51 is provided with a plurality of adsorption nozzles 58 attached to the distal end of the suction tube 59, a flat plate portion 512 for supporting the adsorption nozzles 58, and a heart-shaped lid portion 513 disposed on the upper surface side of the flat plate portion 512. And covering the upper portion of the adsorption nozzle 58; the frame portion 515 and the light transmitting portion 516 are disposed on the lower surface side of the flat plate portion 512 and surround the lower portion of the adsorption nozzle 58; and are connected to the flat plate portion by the sensors 514a, 514b. The lower surface side of the 512 is disposed so as to sandwich members such as the frame portion 515 and the light transmitting portion 516. In this embodiment, the head 51 has Two adsorption nozzles 58.

吸附噴嘴58形成為具有凸緣的圓筒狀,並且從上方被插入至形成在平板部512的貫通孔。如第7圖所示,吸附噴嘴58具有圓筒狀的筒狀部581以及口徑比筒狀部581大的凸緣部583。在吸附噴嘴58形成有在軸方向連續的插入孔58a、貫通孔58b及插入孔58c。發光元件L之呈凸狀突出的透鏡部Lp係插入至形成在筒狀部581的前端部的插入孔58a。吸引管59的前端部係插入至形成在凸緣部583的插入孔58c。插入孔58a、58c係藉由口徑比它們小的貫通孔58b相連。The adsorption nozzle 58 is formed in a cylindrical shape having a flange, and is inserted into a through hole formed in the flat plate portion 512 from above. As shown in FIG. 7, the adsorption nozzle 58 has a cylindrical tubular portion 581 and a flange portion 583 having a larger diameter than the cylindrical portion 581. The adsorption nozzle 58 is formed with an insertion hole 58a, a through hole 58b, and an insertion hole 58c which are continuous in the axial direction. The lens portion Lp that protrudes in a convex shape of the light-emitting element L is inserted into the insertion hole 58a formed at the front end portion of the tubular portion 581. The front end portion of the suction tube 59 is inserted into the insertion hole 58c formed in the flange portion 583. The insertion holes 58a, 58c are connected by a through hole 58b having a smaller diameter than them.

蓋部513以包圍兩個吸附噴嘴58的方式配置,吸引管59從形成於蓋部513的頂部的孔延伸出來。在蓋部513的內側空間,作為緩衝構件的壓縮彈簧517以被捲繞在吸引管59的前端部的方式配置。當上方的衝擊作用在吸附噴嘴58時,隨著吸附噴嘴58的上升,壓縮彈簧517被壓縮,於是衝擊就被吸收。The lid portion 513 is disposed to surround the two adsorption nozzles 58, and the suction tube 59 extends from a hole formed in the top of the lid portion 513. In the inner space of the lid portion 513, a compression spring 517 as a cushioning member is disposed so as to be wound around the front end portion of the suction tube 59. When the upper impact acts on the adsorption nozzle 58, as the adsorption nozzle 58 rises, the compression spring 517 is compressed, and the impact is absorbed.

框部515係沿著水平方向包圍各個吸附噴嘴58的下方空間,藉此形成朝著下方開放的凹部515a、515b。構件載置台47a、47b分別從下方側插入至凹部515a、515b。透光部516係配置在通過感測器514a、514b之間。The frame portion 515 surrounds the space below each of the adsorption nozzles 58 in the horizontal direction, thereby forming concave portions 515a, 515b that open downward. The member mounting tables 47a and 47b are respectively inserted into the concave portions 515a and 515b from the lower side. The light transmitting portion 516 is disposed between the passing sensors 514a, 514b.

通過感測器514a、514b是光斷續器(photo interrupter),其中一個通過感測器是發光部,另一個通過感測器是受光部。從通過感測器514a、514b中的一個通過感測器發出的光穿透透光部516,並通過吸附噴嘴58的下方,最後到達另一個通過感測器。藉此能檢測出被吸附噴嘴58吸附的發光元件L的落下。The pass sensors 514a, 514b are photo interrupters, one of which passes through the sensor is a light emitting portion and the other through which the sensor is a light receiving portion. Light emitted from one of the sensors 514a, 514b through the sensor penetrates the light transmitting portion 516, passes through the lower side of the adsorption nozzle 58, and finally reaches the other passing sensor. Thereby, the falling of the light-emitting element L adsorbed by the adsorption nozzle 58 can be detected.

構件載置台47a、47b係藉由上述升降機構6的動作而上升,並被分別插入至頭部51的凹部515a、515b。被插入至凹部515a、515b的構件載置台47a、47b係從通過感測器514a、514b之間通過,然後到達吸附噴嘴58的下端。此時,載置在構件載置台47a、47b的發光元件L一齊被吸附噴嘴58吸附。The member mounting tables 47a and 47b are raised by the operation of the elevating mechanism 6, and are inserted into the concave portions 515a and 515b of the head portion 51, respectively. The member mounting tables 47a, 47b inserted into the concave portions 515a, 515b pass between the passing sensors 514a, 514b and then reach the lower end of the adsorption nozzle 58. At this time, the light-emitting elements L placed on the member mounting bases 47a and 47b are collectively adsorbed by the adsorption nozzles 58.

此外,頭部51並非限定於上述態樣,也可以是第13A圖及第13B圖所示的態樣。在此態樣中,吸附噴嘴58係藉由未圖示的升降機構的動作而升降。吸附噴嘴58係從通過感測器514a、514b之間通過然後下降,到達位於凹部515a、515b下方的構件載置台47a、47b的上端。此時,載置在構件載置台47a、47b的發光元件L被吸附噴嘴58一齊吸附。Further, the head portion 51 is not limited to the above-described aspect, and may be the one shown in FIGS. 13A and 13B. In this aspect, the adsorption nozzle 58 is moved up and down by the operation of the elevating mechanism (not shown). The adsorption nozzles 58 pass through between the passing sensors 514a, 514b and then descend to reach the upper ends of the member mounting tables 47a, 47b located below the recesses 515a, 515b. At this time, the light-emitting elements L placed on the member mounting bases 47a and 47b are adsorbed by the adsorption nozzles 58 in unison.

第8圖是有關吸附的構造的概略圖。安裝在吸附噴嘴58的吸引管59係在中途分成兩管,在其中一管設置用來吸引管內氣體的氣體吸引部71,在另一管設置用來向管內注入氣體的氣體注入部74。此外,在吸引管59的中途設置用來檢測出管內氣壓的氣壓感測器77。氣體吸引部71係具有:吸引器72,係吸引氣體;以及電磁閥73,係配置在到達該吸引器72的管路處。電磁閥73係調整氣體的吸引量。另一方面,氣體注入部74係具有:排出部75,係排出氣體;以及電磁閥76,係配置在到達排出部的管路。電磁閥76係調整氣體的注入量。Fig. 8 is a schematic view showing the structure of adsorption. The suction pipe 59 attached to the adsorption nozzle 58 is divided into two pipes in the middle, one of which is provided with a gas suction portion 71 for sucking the gas in the pipe, and the other pipe is provided with a gas injection portion 74 for injecting gas into the pipe. Further, a barometric pressure sensor 77 for detecting the air pressure in the pipe is provided in the middle of the suction pipe 59. The gas suction portion 71 has a suction device 72 that is a suction gas, and a solenoid valve 73 that is disposed at a line that reaches the suction device 72. The solenoid valve 73 adjusts the amount of suction of the gas. On the other hand, the gas injection unit 74 includes a discharge unit 75 that discharges gas, and a solenoid valve 76 that is disposed in a line that reaches the discharge unit. The solenoid valve 76 adjusts the amount of gas injected.

第9圖是電子元件之分類裝置1的方塊圖。主控制部10係與特性測量部12、通過感測器514a、514b、氣壓感測器77、定位部5、升降機構6及電磁閥73、76連接。此外,主控制部10係功能性地包含有容器選擇部14。除此之外,主控制部10係控制上述第1圖所示的第一間歇旋轉盤2、第二間歇旋轉盤4、構件供給機3、構件移載機34、39及位置調整機36、37等。Fig. 9 is a block diagram of the sorting device 1 for electronic components. The main control unit 10 is connected to the characteristic measuring unit 12, the sensors 514a and 514b, the air pressure sensor 77, the positioning unit 5, the elevating mechanism 6, and the electromagnetic valves 73 and 76. Further, the main control unit 10 functionally includes a container selecting unit 14. In addition, the main control unit 10 controls the first intermittent rotating disk 2, the second intermittent rotating disk 4, the component feeder 3, the component transfer machines 34 and 39, and the position adjusting machine 36 shown in Fig. 1 described above. 37 and so on.

主控制部10係作為包含有CPU(中央處理器)以及屬於其工作區域的RAM(Random Access Memory;隨機存取記憶體)等的電腦或者PLC(可程式邏輯控制器)而構成。此外,主控制部10係包含有記憶CPU動作所需的程式及資料的記憶裝置。The main control unit 10 is configured as a computer or a PLC (programmable logic controller) including a CPU (Central Processing Unit) and a RAM (Random Access Memory) belonging to the work area. Further, the main control unit 10 includes a memory device that stores programs and data necessary for the CPU to operate.

特性測量部12係對載置在上述第1圖所示的第一間歇旋轉盤2的構件載置台22的發光元件L通電,使用積分球12a接收發光元件L放射的光,並向主控制部10輸出表示發光元件L的發光特性的信號。The characteristic measuring unit 12 energizes the light-emitting element L of the component mounting table 22 placed on the first intermittent rotating disk 2 shown in the above-described first embodiment, and receives the light emitted from the light-emitting element L using the integrating sphere 12a, and supplies the light to the main control unit. 10 outputs a signal indicating the light-emitting characteristics of the light-emitting element L.

容器選擇部14係根據從特性測量部12獲得的發光特性,從複數個容器B中決定收納發光元件L的容器B。具體而言,容器選擇部14係判斷發光元件L的發光特性相當於預先確定的複數個等級中的哪一個等級。等級數量與容器B的數量相同,例如為128。容器選擇部14係參照被保存在主控制部10的記憶裝置的列表(table),根據所判斷的等級來決定收納發光元件L的容器B。如第11圖所示,在列表中,發光特性的“等級”與各個容器B的“容器位置”賦予對應。The container selecting unit 14 determines the container B that houses the light-emitting element L from the plurality of containers B based on the light-emitting characteristics obtained from the characteristic measuring unit 12. Specifically, the container selecting unit 14 determines which of the plurality of predetermined levels is to be determined by the light-emitting characteristics of the light-emitting element L. The number of levels is the same as the number of containers B, for example 128. The container selection unit 14 refers to a list of memory devices stored in the main control unit 10, and determines the container B in which the light-emitting elements L are housed based on the determined level. As shown in Fig. 11, in the list, the "level" of the light-emitting characteristics is assigned to the "container position" of each container B.

第10圖是表示主控制部10所實施的關於定位部5搬運發光元件L的處理的流程圖。首先,主控制部10驅動上述第5圖所示的升降機構6,使載置發光元件L的構件載置台47a、47b上升(S1)。該處理係在間歇旋轉的第二間歇旋轉盤4停止的期間進行。上升的構件載置台47a、47b係插入至上述第6A圖及第6B圖所示的頭部51的凹部515a、515b。此時,主控制部10係同時打開分別與兩個吸附噴嘴58對應的兩個氣體吸引部71的電磁閥73(S2)。如此,發光元件L係被兩個吸附噴嘴58一齊吸附。根據上述第7圖所示的氣壓感測器77的檢測信號來判斷發光元件L是否被吸附。FIG. 10 is a flowchart showing a process performed by the main control unit 10 regarding the conveyance of the light-emitting element L by the positioning unit 5. First, the main control unit 10 drives the elevating mechanism 6 shown in Fig. 5 to raise the member mounting tables 47a and 47b on which the light-emitting elements L are placed (S1). This processing is performed while the intermittently rotating second intermittent rotating disk 4 is stopped. The raised member mounting tables 47a and 47b are inserted into the concave portions 515a and 515b of the head portion 51 shown in Figs. 6A and 6B. At this time, the main control unit 10 simultaneously opens the electromagnetic valves 73 of the two gas suction portions 71 corresponding to the two adsorption nozzles 58 (S2). Thus, the light-emitting element L is adsorbed by the two adsorption nozzles 58 in unison. Whether or not the light-emitting element L is adsorbed is determined based on the detection signal of the air pressure sensor 77 shown in Fig. 7 described above.

接著,主控制部10係驅動定位部5,將被第一吸附噴嘴58吸附的發光元件L搬運至針對該發光元件L而決定的容器B的上方(S3)。主控制部10係依據包含於定位部5的驅動部54的兩個馬達的旋轉角的坐標來特定收納發光元件L的容器B的位置。當將第一吸附噴嘴58定位在容器B的上方時,主控制部10係關閉與第一吸附噴嘴58對應的第一氣體吸引部71的電磁閥73(S4)。此外,主控制部10係打開與第一吸附噴嘴58對應的第一氣體注入部74的電磁閥73(S5)。S4與S5的順序也可以調換。如此,由於與第一吸附噴嘴58相連的吸引管59的氣壓變成大氣壓以上,因此,被第一吸附噴嘴58吸附的發光元件L係落下,而被收納在容器B。在本實施形態中,由於發光元件L的落下接近自由落體,因此,能夠抑制發光元件L的破損。然後,當主控制部10確認被第一吸附噴嘴58吸附的發光元件L已經落下時(S6:YES),關閉與第一吸附噴嘴58對應的第一氣體注入部74的電磁閥73(S7)。根據上述第6A圖及第6B圖所示的通過感測器514a、514b的檢測信號來判斷發光元件L是否已經落下。Next, the main control unit 10 drives the positioning unit 5 to transport the light-emitting element L adsorbed by the first adsorption nozzle 58 to the upper side of the container B determined for the light-emitting element L (S3). The main control unit 10 specifies the position of the container B accommodating the light-emitting element L in accordance with the coordinates of the rotation angles of the two motors included in the drive unit 54 of the positioning unit 5. When the first adsorption nozzle 58 is positioned above the container B, the main control portion 10 closes the solenoid valve 73 of the first gas suction portion 71 corresponding to the first adsorption nozzle 58 (S4). Further, the main control unit 10 opens the electromagnetic valve 73 of the first gas injection unit 74 corresponding to the first adsorption nozzle 58 (S5). The order of S4 and S5 can also be reversed. In this way, since the air pressure of the suction pipe 59 connected to the first adsorption nozzle 58 becomes equal to or higher than atmospheric pressure, the light-emitting element L adsorbed by the first adsorption nozzle 58 is dropped and stored in the container B. In the present embodiment, since the falling of the light-emitting element L is close to the free fall, damage of the light-emitting element L can be suppressed. Then, when the main control unit 10 confirms that the light-emitting element L adsorbed by the first adsorption nozzle 58 has fallen (S6: YES), the solenoid valve 73 of the first gas injection portion 74 corresponding to the first adsorption nozzle 58 is closed (S7). . Whether or not the light-emitting element L has fallen is determined based on the detection signals of the sensors 514a, 514b shown in Figs. 6A and 6B.

然後,主控制部10係驅動定位部5,將被第二吸附噴嘴58吸附的發光元件L搬運至針對該發光元件L而決定的容器B的上方(S8)。如第12圖所示,定位部5的頭部51不從在上述S3中第一吸附噴嘴58被定位的容器B的位置返回初始位置(亦即,第二間歇旋轉盤4的上方),而直接移動至應收納被第二吸附噴嘴58吸附的發光元件L的容器B的位置。因此,在本實施形態中,能夠縮短頭部51的移動距離。當將第二吸附噴嘴58定位在容器B的上方時,與第一吸附噴嘴58的情況同樣,主控制部10係使被第二吸附噴嘴58吸附的發光元件L落下。亦即,主控制部10係關閉與第二吸附噴嘴58對應的第二氣體吸引部71的電磁閥73(S9)。並且,主控制部10係打開與第二吸附噴嘴58對應的第二氣體注入部74的電磁閥73(S10)。然後,當主控制部10確認被第二吸附噴嘴58吸附的發光元件L已經落下時(S11:YES),關閉與第二吸附噴嘴58對應的第二氣體注入部74的電磁閥73(S12)。Then, the main control unit 10 drives the positioning unit 5 to transport the light-emitting element L adsorbed by the second adsorption nozzle 58 to the upper side of the container B determined for the light-emitting element L (S8). As shown in Fig. 12, the head portion 51 of the positioning portion 5 is not returned to the initial position (i.e., above the second intermittent rotary disk 4) from the position of the container B in which the first adsorption nozzle 58 is positioned in the above S3, and It moves directly to the position of the container B which accommodates the light-emitting element L adsorbed by the 2nd adsorption nozzle 58. Therefore, in the present embodiment, the moving distance of the head portion 51 can be shortened. When the second adsorption nozzle 58 is positioned above the container B, the main control unit 10 drops the light-emitting element L adsorbed by the second adsorption nozzle 58 as in the case of the first adsorption nozzle 58. That is, the main control unit 10 closes the electromagnetic valve 73 of the second gas suction portion 71 corresponding to the second adsorption nozzle 58 (S9). Further, the main control unit 10 opens the electromagnetic valve 73 of the second gas injection unit 74 corresponding to the second adsorption nozzle 58 (S10). Then, when the main control unit 10 confirms that the light-emitting element L adsorbed by the second adsorption nozzle 58 has fallen (S11: YES), the solenoid valve 73 of the second gas injection portion 74 corresponding to the second adsorption nozzle 58 is closed (S12). .

以上,對本發明的實施形態進行了說明,但是,本發明並非限定於上述實施形態,對於所屬領域中具有通常知識者而言,當然能夠進行各種變形。Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can of course be made by those skilled in the art.

在上述實施形態中,列舉具有兩個吸附噴嘴58的頭部51為例,但是,並非限定於此,吸附噴嘴58也可以是三個以上。In the above embodiment, the head portion 51 having the two adsorption nozzles 58 is exemplified. However, the present invention is not limited thereto, and the number of the adsorption nozzles 58 may be three or more.

上述實施形態適合用來抑制使用陶瓷等脆性高的材料的發光元件L發生破損,但是,測量及分類的對象並非限定於此。The above embodiment is suitable for suppressing breakage of the light-emitting element L using a material having high brittleness such as ceramics. However, the object of measurement and classification is not limited thereto.

上述實施形態中,作為測量及分類的對象係以發光元件L為例,但是,並非限定於此,也可以是電晶體與電容器等其他電子元件。In the above-described embodiment, the light-emitting element L is used as an example of measurement and classification. However, the light-emitting element L is not limited thereto, and may be another electronic component such as a transistor or a capacitor.

1...電子元件之分類裝置1. . . Electronic component classification device

2...第一間歇旋轉盤(主搬運部)2. . . First intermittent rotating disc (main conveying section)

3...構件供給機3. . . Component feeder

4...第二間歇旋轉盤(副搬運部)4. . . Second intermittent rotating disc (sub-transporting unit)

5...定位部5. . . Positioning department

6...升降機構6. . . Lifting mechanism

10...主控制部10. . . Main control department

12...特性測量部12. . . Characteristic measurement department

12a...積分球12a. . . Integrating sphere

14...容器選擇部14. . . Container selection department

21...圓板部twenty one. . . Round plate

22...構件載置台twenty two. . . Component mounting table

32...整列搬運部32. . . Whole row of transport

34...構件移載機34. . . Component transfer machine

36、37...位置調整機36, 37. . . Position adjustment machine

39...構件移載機39. . . Component transfer machine

41...圓板部41. . . Round plate

42...構件搬運部42. . . Component handling department

43...固定部43. . . Fixed part

43a...突起部43a. . . Protrusion

44...可動部44. . . Movable part

44a...突起部44a. . . Protrusion

45...足部45. . . Foot

45a...從動輪45a. . . driven wheel

46...牽引彈簧46. . . Traction spring

47...台部47. . . Taiwan Department

47a、47b...構件載置台47a, 47b. . . Component mounting table

49...吸引管49. . . Suction tube

51...頭部51. . . head

52...上腕部52. . . Upper wrist

53...前腕部53. . . Front wrist

54...驅動部54. . . Drive department

55...操作棒55. . . Operating rod

58...吸附噴嘴58. . . Adsorption nozzle

58a...插入孔58a. . . Insertion hole

58b...貫通孔58b. . . Through hole

58c...插入孔58c. . . Insertion hole

59...吸引管59. . . Suction tube

61...壁部61. . . Wall

62...氣缸62. . . cylinder

63...軸部63. . . Shaft

64...前端部64. . . Front end

65...固定部65. . . Fixed part

65a...突起部65a. . . Protrusion

66...牽引彈簧66. . . Traction spring

67...控制桿67. . . Controller

67b...力點部67b. . . Force point

67c...作用部67c. . . Action department

67d...突起部67d. . . Protrusion

68...支承部68. . . Support

71...氣體吸引部71. . . Gas suction

72...吸引器72. . . Attractor

73...電磁閥73. . . The electromagnetic valve

74...氣體注入部74. . . Gas injection unit

75...排出部75. . . Discharge department

76...電磁閥76. . . The electromagnetic valve

77...氣壓感測器77. . . Air pressure sensor

512...平板部512. . . Flat section

513...蓋部513. . . Cover

514a、514b...通過感測器514a, 514b. . . Through the sensor

515...框部515. . . Frame

515a、515b...凹部515a, 515b. . . Concave

516...透光部516. . . Translucent part

517...壓縮彈簧517. . . compressed spring

581...筒狀部581. . . Cylindrical part

583...凸緣部583. . . Flange

B...容器B. . . container

L...發光元件(電子元件)L. . . Light-emitting element (electronic component)

Lp...透鏡部(凸狀部)Lp. . . Lens portion (convex portion)

Ls...基板部Ls. . . Substrate part

Lt...端子Lt. . . Terminal

第1圖是本發明的一實施形態中的電子元件之分類裝置的俯視圖。Fig. 1 is a plan view showing a sorting device for an electronic component according to an embodiment of the present invention.

第2圖是該實施形態中的定位部的側視圖。Fig. 2 is a side view of the positioning portion in the embodiment.

第3圖是該實施形態中的第二間歇旋轉盤的俯視圖。Fig. 3 is a plan view of the second intermittent rotating disk in the embodiment.

第4A圖是該實施形態中的構件搬運部的正視圖。Fig. 4A is a front view of the component conveying portion in the embodiment.

第4B圖是該實施形態中的構件搬運部的側視圖。Fig. 4B is a side view of the component conveying portion in the embodiment.

第5圖是該實施形態中的升降機構的側視圖。Fig. 5 is a side view of the elevating mechanism in the embodiment.

第6A圖是該實施形態中的頭部的剖面圖。Fig. 6A is a cross-sectional view of the head in the embodiment.

第6B圖是該實施形態中的頭部的剖面圖。Fig. 6B is a cross-sectional view of the head in the embodiment.

第7圖是該實施形態中的吸附噴嘴的剖面圖。Fig. 7 is a cross-sectional view showing the adsorption nozzle in the embodiment.

第8圖是該實施形態中的與吸附相關的構造的概略圖。Fig. 8 is a schematic view showing a structure related to adsorption in the embodiment.

第9圖是該實施形態中的電子元件之分類裝置的方塊圖。Fig. 9 is a block diagram showing the apparatus for classifying electronic components in the embodiment.

第10圖是該實施形態中的主控制部所執行的處理的流程圖。Fig. 10 is a flow chart showing the processing executed by the main control unit in the embodiment.

第11圖是該實施形態中的主控制部所保持的列表的例子。Fig. 11 is an example of a list held by the main control unit in the embodiment.

第12圖是該實施形態中的頭部的移動的概略俯視圖。Fig. 12 is a schematic plan view showing the movement of the head in the embodiment.

第13A圖是其他實施形態中的頭部的剖面圖。Fig. 13A is a cross-sectional view of the head in another embodiment.

第13B圖是其他實施形態中的頭部的剖面圖。Fig. 13B is a cross-sectional view of the head in another embodiment.

第14A圖是發光元件的側視圖。Fig. 14A is a side view of the light emitting element.

第14B圖是發光元件的俯視圖。Fig. 14B is a plan view of the light emitting element.

第14C圖是發光元件的背面圖。Fig. 14C is a rear view of the light-emitting element.

58...吸附噴嘴58. . . Adsorption nozzle

59...吸引管59. . . Suction tube

71...氣體吸引部71. . . Gas suction

72...吸引器72. . . Attractor

73...電磁閥73. . . The electromagnetic valve

74...氣體注入部74. . . Gas injection unit

75...排出部75. . . Discharge department

76...電磁閥76. . . The electromagnetic valve

77...氣壓感測器77. . . Air pressure sensor

L...發光元件(電子元件)L. . . Light-emitting element (electronic component)

Claims (8)

一種電子元件之分類裝置,係具備有:特性測量部,係測量電子元件的特性;容器選擇部,係根據前述電子元件的特性的測量結果,從複數個容器中選擇收納前述電子元件的容器;頭部,係具有複數個吸附噴嘴;氣體吸引部,係吸引連接至前述吸附噴嘴的管內的氣體;定位部,係使前述頭部移動,俾使被前述吸附噴嘴吸附的前述電子元件位於前述被選擇的容器的上方;以及氣體注入部,係當前述吸附噴嘴吸附的前述電子元件位於前述被選擇的容器的上方時,對連接至前述吸附噴嘴的管內注入氣體;其中前述頭部係具有通過感測器,用以檢測前述電子元件通過前述吸附噴嘴的下方位置,並且該通過感測器係包含有以夾著前述各個吸附噴嘴的下方位置的方式配置的發光部與受光部。 A classification device for an electronic component includes: a characteristic measuring unit that measures characteristics of an electronic component; and a container selecting unit that selects a container that houses the electronic component from a plurality of containers based on a measurement result of characteristics of the electronic component; a head having a plurality of adsorption nozzles; a gas suction portion for attracting a gas connected to the tube of the adsorption nozzle; and a positioning portion for moving the head portion so that the electronic component adsorbed by the adsorption nozzle is located in the foregoing Above the selected container; and a gas injection portion for injecting gas into the tube connected to the adsorption nozzle when the electronic component adsorbed by the adsorption nozzle is positioned above the selected container; wherein the head portion has The sensor detects that the electronic component passes through a position below the adsorption nozzle, and the passing sensor includes a light-emitting portion and a light-receiving portion that are disposed to sandwich a position below the respective adsorption nozzles. 如申請專利範圍第1項所述之分類裝置,其中,前述電子元件係具有呈凸狀突出的凸狀部,前述凸狀部係插入至前述吸附噴嘴。 The classification device according to claim 1, wherein the electronic component has a convex portion that protrudes in a convex shape, and the convex portion is inserted into the adsorption nozzle. 如申請專利範圍第2項所述之電子元件之分類裝置,其中,在前述吸附噴嘴形成有:插入孔,係用以插入前述凸狀部;以及 貫通孔,係連接前述插入孔與前述管,且比前述插入孔細。 The apparatus for classifying an electronic component according to claim 2, wherein the adsorption nozzle is formed with an insertion hole for inserting the convex portion; The through hole connects the insertion hole and the tube and is thinner than the insertion hole. 如申請專利範圍第1項所述之電子元件之分類裝置,其中,前述通過感測器係具有以夾著前述吸附噴嘴的下方位置的方式配置的發光部與受光部。 The electronic component classification device according to the first aspect of the invention, wherein the sensor device has a light-emitting portion and a light-receiving portion that are disposed to sandwich a position below the adsorption nozzle. 如申請專利範圍第4項所述之電子元件之分類裝置,其中,復具有升降機構,係使載置前述電子元件的構件載置台升降;前述構件載置台係通過前述發光部與前述受光部之間而上升,而使前述電子元件被吸附在前述吸附噴嘴。 The apparatus for classifying an electronic component according to claim 4, further comprising: a lifting mechanism that elevates and lowers a component mounting table on which the electronic component is placed; and the member mounting table passes through the light emitting section and the light receiving section The electron element is attracted to the adsorption nozzle. 如申請專利範圍第4項所述之電子元件之分類裝置,其中,復具有使前述吸附噴嘴升降的升降機構;前述吸附噴嘴係通過前述發光部與前述受光部之間而下降,而使配置在前述頭部的下方的前述電子元件被吸附在前述吸附噴嘴。 The apparatus for classifying an electronic component according to claim 4, further comprising: an elevating mechanism that elevates and lowers the adsorption nozzle; wherein the adsorption nozzle is lowered between the light-emitting portion and the light-receiving portion, and is disposed in The aforementioned electronic component below the head is adsorbed to the adsorption nozzle. 如申請專利範圍第1項所述之電子元件之分類裝置,其中,前述定位部係使前述頭部移動,俾使被前述各個吸附噴嘴吸附的前述電子元件依序位於針對前述各個電子元件所選擇的容器的上方。 The apparatus for classifying an electronic component according to claim 1, wherein the positioning unit moves the head portion such that the electronic components adsorbed by the adsorption nozzles are sequentially positioned for each of the electronic components. Above the container. 如申請專利範圍第7項所述之電子元件之分類裝置,其中,復具備有:主搬運部,係排列有複數個構件載置台;副搬運部,係排列有與前述複數個吸附噴嘴對應的 複數個構件載置台的組;以及移載部,係將前述電子元件從前述主搬運部的構件載置台移載至前述副搬運部的構件載置台;前述複數個吸附噴嘴一齊吸附載置在前述副搬運部的前述複數個構件載置台的前述電子元件。 The apparatus for classifying electronic components according to claim 7, wherein the main transporting unit is provided with a plurality of component mounting platforms, and the auxiliary transporting section is arranged to correspond to the plurality of adsorption nozzles. a plurality of component mounting stages; and a transfer unit that transfers the electronic component from the component mounting table of the main transporting unit to the component mounting table of the sub transporting section; the plurality of adsorption nozzles are adsorbed and placed in the same manner The electronic component of the plurality of component mounting stages of the sub-transporting unit.
TW99143917A 2010-06-04 2010-12-15 Apparatus for classifying electronic components TWI436072B (en)

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