TWI435404B - Support device and exposure device - Google Patents
Support device and exposure device Download PDFInfo
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- TWI435404B TWI435404B TW100115653A TW100115653A TWI435404B TW I435404 B TWI435404 B TW I435404B TW 100115653 A TW100115653 A TW 100115653A TW 100115653 A TW100115653 A TW 100115653A TW I435404 B TWI435404 B TW I435404B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本發明係關於一種例如在各種製造、檢查等中使用之可動載台的傾斜調整用之支持裝置及曝光裝置。The present invention relates to a support device for tilt adjustment of a movable stage used in various manufacturing, inspection, and the like, and an exposure apparatus.
在半導體製造步驟等中,為測定半導體矽晶圓的平面度或平行度及厚度之差異,有時會使用干涉儀。而且,為精度良好地測定成為測定對象之半導體矽晶圓的各尺寸,需要對測定對象之表面以特定的角度精度良好地照射干涉儀之檢查光。因而使用有可以使測定對象精度良好地傾斜之方式支持載台之裝置。專利文獻1揭示一種使用於該用途之先前技術之支持裝置。專利文獻1之支持裝置係藉由利用3個Z軸驅動部將載台之3點朝Z軸方向驅動僅任意之量,而進行載台之任意的角度調整。In the semiconductor manufacturing step or the like, an interferometer may be used to measure the difference in flatness, parallelism, and thickness of the semiconductor germanium wafer. In addition, in order to accurately measure the respective dimensions of the semiconductor wafer to be measured, it is necessary to illuminate the inspection light of the interferometer with a certain angle accuracy on the surface of the measurement target. Therefore, it is possible to use a device that supports the stage so that the measurement target can be tilted with high precision. Patent Document 1 discloses a prior art support device for use in this use. In the support device of Patent Document 1, an arbitrary angle adjustment of the stage is performed by driving the three points of the stage in the Z-axis direction by an arbitrary amount by the three Z-axis driving units.
[專利文獻1]日本特開2004-47825號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-47825
但,在朝Z軸方向驅動載台的3點之時,其中一個問題是如何在與Z軸方向交叉之方向(X軸方向或Y軸方向)上約束該載台。若該約束過強,則會導致載台之角度調整困難,另一方面若約束過弱,則會導致載台朝X軸方向或Y軸方向移動,而使載台之定位變得困難。However, when driving the three points of the stage in the Z-axis direction, one of the problems is how to constrain the stage in the direction (X-axis direction or Y-axis direction) crossing the Z-axis direction. If the constraint is too strong, the angle adjustment of the stage is difficult. On the other hand, if the constraint is too weak, the stage moves in the X-axis direction or the Y-axis direction, and positioning of the stage becomes difficult.
是以,目前已開發一種技術,其係在由在X軸方向或Y軸方向不易撓曲、在Z軸方向易於撓曲之板彈簧連結載台與支持該載台之基台,且利用Z軸驅動部使載台朝Z軸方向移動之時,板彈簧雖會約束載台之X軸方向或Y軸方向之移動,但容許載台在Z軸方向上移動者。然而,由於板彈簧連結於基台,因此若載台朝Z軸方向移動,則會有儘管微幅但仍相對於基台於X軸方向或Y軸方向移動、而導致無法獲得定位的再現性之問題。相對於此,雖亦有開發一種使用E字形狀之板彈簧,使載台在相對於Z軸方向移動之X軸方向或Y軸方向上之移動減少之技術,但在板彈簧之形狀變化較大之情形下,會有其性能出現誤差而導致載台的位置不安定之問題。Therefore, a technique has been developed in which a stage spring that is not easily deflected in the X-axis direction or the Y-axis direction and is easily deflected in the Z-axis direction is coupled to the stage and the base supporting the stage, and Z is utilized. When the shaft drive unit moves the stage in the Z-axis direction, the leaf spring restricts the movement of the stage in the X-axis direction or the Y-axis direction, but allows the stage to move in the Z-axis direction. However, since the leaf spring is coupled to the base, if the stage moves in the Z-axis direction, there is a slight reproducibility that cannot be obtained in the X-axis direction or the Y-axis direction with respect to the base. The problem. On the other hand, although a technique of using an E-shaped leaf spring to reduce the movement of the stage in the X-axis direction or the Y-axis direction with respect to the Z-axis direction has been developed, the shape of the leaf spring is changed. In the case of a large situation, there is a problem that the performance of the stage is unstable and the position of the stage is unstable.
是以,本發明係鑒於該先前技術之問題而完成者,其目的在於提供一種可再現性較高地進行載台的角度調整之支持裝置及曝光裝置。Therefore, the present invention has been made in view of the problems of the prior art, and an object thereof is to provide a support device and an exposure device that can adjust the angle of the stage with high reproducibility.
本發明之支持裝置係可移動地支持載台者,其特徵為包含:基台;可朝上下方向移動地安裝在前述基台上之移動構件;將前述移動構件朝前述上下方向驅動之驅動機構;在容許前述載台與前述移動構件之相對傾動之下連結兩者之關節機構;及連結前述載台與前述移動構件之彈簧構件;前述彈簧構件在前述上下方向上之彈簧剛性相較於與前述上下方向正交之方向之彈簧剛性為低。The support device of the present invention is a movably supporting stage, and comprises: a base; a moving member that is movably mounted on the base in a vertical direction; and a driving mechanism that drives the moving member in the up and down direction a joint mechanism that connects the both of the stage and the moving member while tilting; and a spring member that connects the stage and the moving member; and the spring member has a spring rigidity in the up-and-down direction as compared with The spring rigidity in the direction orthogonal to the vertical direction is low.
本發明之曝光裝置之特徵為包含:保持遮罩之遮罩保持部;驅動前述遮罩保持部之遮罩驅動機構;保持基板之基板保持部;驅動前述基板保持部之基板驅動機構;及介以前述遮罩而對前述基板照射圖案曝光用之光之照射機構;且前述基板驅動機構為能將前述基板保持部朝上下方向驅動,且可調整前述基板保持部之傾斜,而包含分別在前述基板保持部之對向之兩邊中之一邊至少配置1個、在另一邊至少配置2個之上下方向及傾動調整機構,前述各上下方向及傾動調整機構係藉由前述支持裝置而構成。An exposure apparatus according to the present invention includes: a mask holding portion that holds a mask; a mask driving mechanism that drives the mask holding portion; a substrate holding portion that holds the substrate; and a substrate driving mechanism that drives the substrate holding portion; An illumination mechanism for irradiating the substrate with light for pattern exposure by the mask; and the substrate driving mechanism is capable of driving the substrate holding portion in the vertical direction and adjusting the inclination of the substrate holding portion, and is included in the foregoing At least one of the opposite sides of the substrate holding portion is disposed, and at least two of the upper and lower directions and the tilt adjustment mechanism are disposed on the other side, and the vertical direction and the tilt adjustment mechanism are configured by the support device.
根據本發明,在連結前述載台與前述移動構件之彈簧構件中,由於前述上下方向上之彈簧剛性相較於與前述上下方向正交之方向之彈簧剛性為低,因此雖會限制與前述載台之與前述上下方向正交之方向的變位,但由於在前述上下方向上容許前述載台之變位,且前述彈簧構件會與前述移動構件一起移動,因此可抑制前述彈簧構件之形狀變化,無關前述移動構件之移動而可獲得安定之前述載台的位置精度。According to the invention, in the spring member that connects the stage and the moving member, since the spring rigidity in the vertical direction is lower than the spring rigidity in the direction orthogonal to the vertical direction, the load is limited. The displacement of the stage in the direction orthogonal to the vertical direction is, although the displacement of the stage is allowed in the vertical direction, and the spring member moves together with the moving member, the shape change of the spring member can be suppressed. The positional accuracy of the aforementioned stage can be obtained regardless of the movement of the moving member.
再者,若在前述移動構件上設置沿前述上下方向配置之導軌,且在前述基台上設置可相對於前述導軌相對移動之滑塊,則可精度良好地進行前述移動構件之移動。惟,亦可在前述移動構件上設置滑塊,在前述基台上設置導軌。Further, when the moving member is provided with a guide rail that is disposed in the vertical direction and a slider that is relatively movable with respect to the guide rail is provided on the base, the movement of the moving member can be accurately performed. However, a slider may be provided on the moving member, and a guide rail may be provided on the base.
再者,較佳的是,前述驅動機構包含:馬達、將前述馬達之旋轉運動轉換為軸線運動之轉換機構、及可藉由利用前述轉換機構所轉換之軸線運動而朝與前述上下方向交叉之水平方向移動之楔形構件;且前述移動構件可對應於前述楔形構件朝前述水平方向移動而朝前述上下方向移動。Furthermore, it is preferable that the driving mechanism includes a motor, a switching mechanism that converts a rotational motion of the motor into an axis motion, and a vertical movement that intersects with the axial direction by the axis motion converted by the conversion mechanism. a wedge member that moves in a horizontal direction; and the moving member is movable in the vertical direction corresponding to the wedge member moving in the horizontal direction.
以下,茲基於圖面就使用本發明之支持裝置之曝光單元進行詳細地說明。此處,將Z軸方向作為上下方向,將X軸方向與Y軸方向作為水平方向。Hereinafter, the exposure unit using the support device of the present invention will be described in detail based on the drawings. Here, the Z-axis direction is referred to as the vertical direction, and the X-axis direction and the Y-axis direction are referred to as the horizontal direction.
曝光單元具有:曝光第1層之第1接近曝光裝置本體、曝光第2層之第2接近曝光裝置本體、曝光第3層之第3接近曝光裝置本體、及曝光第4層之第4接近曝光裝置本體。此處,第1~第4接近曝光裝置本體由於只要是與後述之基板保持部的吸附面不同之構成即可,因此以下僅就第1接近曝光裝置本體2進行詳述,除此以外予以省略。The exposure unit includes: a first proximity exposure device body that exposes the first layer, a second proximity exposure device body that exposes the second layer, a third proximity exposure device body that exposes the third layer, and a fourth proximity exposure that exposes the fourth layer. Device body. Here, the first to fourth proximity exposure apparatus main bodies may be configured to be different from the adsorption surface of the substrate holding portion to be described later. Therefore, only the first proximity exposure apparatus main body 2 will be described in detail below, and other omitted. .
如圖1所示般,第1接近曝光裝置本體2具備:保持遮罩M之遮罩載台(遮罩保持部)10;保持玻璃基板(被曝光材)W之基板載台(基板保持部)20;作為圖案曝光用之照射機構的照明光學系統30;將基板載台20朝X軸、Y軸、Z軸方向移動,且進行基板載台20的傾動調整之基板載台移動機構(基板驅動機構)40;及支持遮罩載台10及基板載台移動機構40之裝置基台50。As shown in FIG. 1 , the first proximity exposure apparatus main body 2 includes a mask stage (mask holding unit) 10 that holds the mask M, and a substrate stage (substrate holder that holds the glass substrate (exposure material) W). 20; an illumination optical system 30 as an irradiation means for pattern exposure; a substrate stage moving mechanism (substrate) for moving the substrate stage 20 in the X-axis, Y-axis, and Z-axis directions and tilting the substrate stage 20 The drive mechanism 40; and the device base 50 supporting the mask stage 10 and the substrate stage moving mechanism 40.
另,玻璃製之基板W係與遮罩M對向配置,且在應曝光轉印描繪於該遮罩M上之遮罩圖案之表面(遮罩M之對向面側)塗佈有感光劑。又,遮罩M係由熔融石英構成,且形成為長方形狀。Further, the glass substrate W is disposed opposite to the mask M, and is coated with a sensitizer on the surface of the mask pattern (the opposite surface side of the mask M) to be exposed and transferred onto the mask M. . Further, the mask M is made of fused silica and formed in a rectangular shape.
首先,從照明光學系統30進行說明。照明光學系統30具備:紫外線照射用之光源即例如高壓水銀燈31;將自該高壓水銀燈31所照射之光集光之凹面鏡32;切換自如地配置於該凹面鏡32的焦點附近之兩種光學積分器33;用以改變光路的朝向之平面鏡35、36及球面鏡37;及配置於該平面鏡36與光學積分器33之間且開關控制照射光路之曝光控制用快門34。First, the illumination optical system 30 will be described. The illumination optical system 30 includes, for example, a high-pressure mercury lamp 31, which is a light source for ultraviolet irradiation, a concave mirror 32 that collects light irradiated from the high-pressure mercury lamp 31, and two types of optical integrators that are disposed in the vicinity of the focal point of the concave mirror 32. 33; a plane mirror 35, 36 and a spherical mirror 37 for changing the direction of the optical path; and an exposure control shutter 34 disposed between the plane mirror 36 and the optical integrator 33 and having a switch for controlling the illumination path.
且,在照明光學系統30中,若在曝光時打開控制曝光控制用快門34,則自高壓水銀燈31照射之光會經由圖1所示之光路L,而對被保持於遮罩載台10之遮罩M、進而對被保持於基板載台20之基板W的表面作為圖案曝光用之平行光而垂直地照射。藉此,使遮罩M之遮罩圖案曝光轉印於基板W上。Further, in the illumination optical system 30, when the exposure control shutter 34 is opened during exposure, the light irradiated from the high pressure mercury lamp 31 is held by the mask stage 10 via the optical path L shown in FIG. The mask M and the surface of the substrate W held by the substrate stage 20 are vertically irradiated as parallel light for pattern exposure. Thereby, the mask pattern of the mask M is exposed and transferred onto the substrate W.
遮罩載台10係如圖1~圖3所示般,具備:於中央部形成有矩形形狀之開口部11a之遮罩載台基台11;可朝X軸、Y軸、θ方向移動地裝設於遮罩載台基台11的開口部11a之遮罩保持框12;安裝於遮罩保持框12上,吸附保持遮罩M之夾盤部14;及使遮罩保持框12與夾盤部朝X軸、Y軸、θ方向移動,而調整被保持於該遮罩保持框12之遮罩M的位置之遮罩位置調整機構(遮罩驅動機構)16。As shown in FIGS. 1 to 3, the mask stage 10 includes a mask stage base 11 in which a rectangular opening 11a is formed in a central portion, and is movable in the X-axis, the Y-axis, and the θ direction. a mask holding frame 12 mounted on the opening 11a of the mask stage base 11; attached to the mask holding frame 12, sucking and holding the chuck portion 14 of the mask M; and holding the mask holding frame 12 and the clip The disk portion is moved in the X-axis, the Y-axis, and the θ direction, and the mask position adjusting mechanism (mask driving mechanism) 16 held at the position of the mask M of the mask holding frame 12 is adjusted.
遮罩載台基台11可藉由立設在裝置基台50上之支柱51及設置在支柱51的上端部之Z軸移動裝置52而可朝Z軸方向移動地被支持,且配置在基板載台20的上方。Z軸移動裝置52具有例如包含馬達及滾珠螺桿等之電動致動器或是空壓氣缸等,且藉由進行單純的上下動作,而使遮罩載台10升降至特定的位置。另,Z軸移動裝置52係使用在遮罩M的更換或工件夾盤21的清掃等之時。The mask stage base 11 can be supported by the support 51 that is erected on the apparatus base 50 and the Z-axis moving device 52 provided at the upper end of the support 51 in the Z-axis direction, and is disposed on the substrate. Above the stage 20. The Z-axis moving device 52 has, for example, an electric actuator including a motor and a ball screw, or a pneumatic cylinder, and the like, and the mask stage 10 is raised and lowered to a specific position by a simple vertical movement. Further, the Z-axis moving device 52 is used when the mask M is replaced or the workpiece chuck 21 is cleaned or the like.
遮罩位置調整機構16具有:安裝在沿遮罩保持框12的X軸方向之一邊之1台Y軸方向驅動裝置16y;及安裝在沿遮罩保持框12的Y軸方向之一邊之2台X軸方向驅動裝置16x。The mask position adjusting mechanism 16 has one Y-axis direction driving device 16y attached to one side of the mask holding frame 12 in the X-axis direction, and two units mounted on one side of the Y-axis direction of the mask holding frame 12. The X-axis direction drive device 16x.
且,在遮罩位置調整機構16中,藉由驅動1台Y軸方向驅動裝置16y而使遮罩保持框12朝Y軸方向移動,且藉由同等驅動2台X軸方向驅動裝置16x而使遮罩保持框12朝X軸方向移動。再者,藉由驅動2台X軸方向驅動裝置16x之任一者而使遮罩保持框12朝θ方向移動(環繞Z軸之旋轉)。Further, in the mask position adjusting mechanism 16, the mask holding frame 12 is moved in the Y-axis direction by driving one Y-axis direction driving device 16y, and the two X-axis direction driving devices 16x are driven in the same manner. The mask holding frame 12 is moved in the X-axis direction. Further, the mask holding frame 12 is moved in the θ direction (rotation around the Z axis) by driving either of the two X-axis direction driving devices 16x.
再者,在遮罩載台基台11的上面,如圖3所示般,設置有測定遮罩M與基板W之對向面間的間隙之間隙感測器17、與用以確認保持於夾盤部14之遮罩M的安裝位置之遮罩用對準照相機18。該等間隙感測器17及遮罩用對準照相機18可介以移動機構19而朝X軸、Y軸方向移動地被保持,且配置在遮罩保持框12內。Further, on the upper surface of the mask stage base 11, as shown in FIG. 3, a gap sensor 17 for measuring a gap between the opposing faces of the mask M and the substrate W is provided, and is provided for confirmation and retention. The mask for the mounting position of the mask M of the chuck portion 14 is aligned with the camera 18. The gap sensor 17 and the mask alignment camera 18 are held by the moving mechanism 19 so as to be movable in the X-axis and Y-axis directions, and are disposed in the mask holding frame 12.
另,在遮罩載台基台11的上面,如圖3所示般,在遮罩載台基台11的開口部11a之X軸方向的兩端部,設置因應必要而遮蔽遮罩M的兩端部之遮蔽孔徑38。該遮蔽孔徑38可藉由包含馬達、滾珠螺桿及線性滑軌等之遮蔽孔徑驅動機構39而朝X軸方向移動,以調整遮罩M之兩端部的遮蔽面積。另,遮蔽孔徑38不僅設在開口部11a之X軸方向的兩端部,亦可同樣設置在開口部11a之Y軸方向的兩端部。Further, on the upper surface of the mask stage base 11, as shown in FIG. 3, the both ends of the opening portion 11a of the mask stage base 11 in the X-axis direction are provided, and the mask M is shielded as necessary. The shielding aperture 38 at both ends. The shielding aperture 38 is movable in the X-axis direction by a shielding aperture driving mechanism 39 including a motor, a ball screw, and a linear slide to adjust the shielding area of both ends of the mask M. Further, the shielding hole 38 is provided not only at both end portions of the opening portion 11a in the X-axis direction but also at both end portions of the opening portion 11a in the Y-axis direction.
基板載台20係如圖1及圖2所示般,設置在基板載台移動機構40上,且具備在上面具有用以將基板W保持在基板載台20上之吸附面22之工件夾盤21。另,工件夾盤21係藉由真空吸附而保持基板W。The substrate stage 20 is provided on the substrate stage moving mechanism 40 as shown in FIGS. 1 and 2, and has a workpiece chuck having an adsorption surface 22 for holding the substrate W on the substrate stage 20 thereon. twenty one. Further, the workpiece chuck 21 holds the substrate W by vacuum suction.
基板載台移動機構40係如圖1及圖2所示般,具備:使基板載台20朝Y軸方向移動之Y軸進給機構41;使基板載台20朝X軸方向移動之X軸進給機構42;及進行基板載台20的傾動調整,且使基板載台20朝Z軸方向微動之Z-傾動調整機構(上下方向及傾動調整機構、支持裝置)43。As shown in FIGS. 1 and 2, the substrate stage moving mechanism 40 includes a Y-axis feed mechanism 41 that moves the substrate stage 20 in the Y-axis direction, and an X-axis that moves the substrate stage 20 in the X-axis direction. The feed mechanism 42 and the Z-tilt adjustment mechanism (the vertical direction and the tilt adjustment mechanism and the support device) 43 that adjust the tilting of the substrate stage 20 and slightly move the substrate stage 20 in the Z-axis direction.
Y軸進給機構41具備:沿Y軸方向設置在裝置基台50的上面之一對線性滑軌44;藉由線性滑軌44而可朝Y軸方向移動地被支持之Y軸平台45;及使Y軸平台45朝Y軸方向移動之Y軸進給驅動裝置46。且,藉由使Y軸進給驅動裝置46的馬達46c驅動,且使滾珠螺桿軸46b旋轉,而與滾珠螺桿螺帽46a一起使Y軸平台45沿線性滑軌44的導軌44a移動,且使基板載台20朝Y軸方向移動。The Y-axis feed mechanism 41 includes: a pair of linear slide rails 44 disposed on the upper surface of the apparatus base 50 in the Y-axis direction; and a Y-axis platform 45 supported by the linear slide rails 44 to be movable in the Y-axis direction; And the Y-axis feed drive unit 46 that moves the Y-axis stage 45 in the Y-axis direction. Further, by driving the motor 46c of the Y-axis feed driving device 46 and rotating the ball screw shaft 46b, the Y-axis table 45 is moved along the guide rail 44a of the linear slide rail 44 together with the ball screw nut 46a, and The substrate stage 20 moves in the Y-axis direction.
又,X軸進給機構42具備:沿X軸方向設置在Y軸平台45的上面之一對線性滑軌47;可藉由線性滑軌47而朝X軸方向移動地被支持之X軸平台48;及使X軸平台48朝X軸方向移動之X軸進給驅動裝置49。且,藉由使X軸進給驅動裝置49的馬達49c驅動,且使滾珠螺桿軸49b旋轉,而與未圖示之滾珠螺桿螺帽一起使X軸平台48沿線性滑軌47的導軌47a移動,且使基板載台20朝X軸方向移動。Further, the X-axis feed mechanism 42 includes one pair of linear slide rails 47 disposed on the upper surface of the Y-axis stage 45 in the X-axis direction, and an X-axis platform supported by the linear slide rails 47 to be moved in the X-axis direction. 48; and an X-axis feed drive unit 49 that moves the X-axis stage 48 in the X-axis direction. Further, by driving the motor 49c of the X-axis feed driving device 49 and rotating the ball screw shaft 49b, the X-axis table 48 is moved along the guide rail 47a of the linear slide 47 together with a ball screw nut (not shown). And the substrate stage 20 is moved in the X-axis direction.
茲就Z-傾動調整機構43進行說明。圖4係為Z-傾動調整機構43之立體圖;圖5係為Z-傾動調整機構43之側視圖;圖6(a)係與Z-傾動調整機構43一起顯示之基板載台20的俯視圖。Z-傾動調整機構43係如圖6(a)所示般,藉由在基板載台20之對向之兩邊中之一邊設置一個,於另一邊設置兩個,合計設置在3個部位,藉由任意調整3點之Z軸方向的位置,可進行基板載台20之傾斜調整。The Z-tilt adjustment mechanism 43 will be described. 4 is a perspective view of the Z-tilt adjustment mechanism 43; FIG. 5 is a side view of the Z-tilt adjustment mechanism 43; and FIG. 6(a) is a plan view of the substrate stage 20 displayed together with the Z-tilt adjustment mechanism 43. As shown in FIG. 6( a ), the Z-tilt adjustment mechanism 43 is provided on one of the opposite sides of the substrate stage 20 and two on the other side, and is provided in three places in total. The tilt adjustment of the substrate stage 20 can be performed by arbitrarily adjusting the position of the Z-axis direction of three points.
在圖5所示之Z-傾動調整機構43中,在X軸平台(基台)48的上面固定有外殼431。在外殼431的端部安裝有馬達432,馬達432的旋轉軸432a與相對於旋轉軸432a串聯配置之滾珠螺桿軸433在外殼431內藉由聯軸節434予以連結。滾珠螺桿軸433係相對於外殼431藉由軸承435被旋轉自如地支持,其相反端側係介以未圖示之螺桿而螺合在固定於楔形構件436之螺帽437。由滾珠螺桿機構433、螺帽437及未圖示之滾珠構成滾珠螺桿機構、亦即轉換機構。In the Z-tilt adjustment mechanism 43 shown in FIG. 5, a casing 431 is fixed to the upper surface of the X-axis stage (base) 48. A motor 432 is attached to an end portion of the outer casing 431, and a rotating shaft 432a of the motor 432 and a ball screw shaft 433 disposed in series with respect to the rotating shaft 432a are coupled to each other by a coupling 434 in the outer casing 431. The ball screw shaft 433 is rotatably supported by the bearing 435 with respect to the outer casing 431, and the opposite end side is screwed to the nut 437 fixed to the wedge member 436 via a screw (not shown). The ball screw mechanism 433, the nut 437, and the balls (not shown) constitute a ball screw mechanism, that is, a switching mechanism.
又,在X軸平台48的上面,與Z軸方向正交之方向,以朝滾珠螺桿軸433的軸線方向延伸之方式設置有一對(僅圖示單方)導軌438。再者,使安裝在側面為直角三角形狀的楔形構件436之兩側下部之滑塊436a扣合在導軌438上。因而,楔形構件436可沿導軌438而相對於X軸平台48朝Y軸方向移動地配置。Further, a pair of (only one illustrated) guide rails 438 are provided on the upper surface of the X-axis stage 48 so as to extend in the direction orthogonal to the Z-axis direction so as to extend in the axial direction of the ball screw shaft 433. Further, the slider 436a attached to the lower side of both sides of the wedge member 436 having a right-angled triangular shape on the side surface is fastened to the guide rail 438. Thus, the wedge member 436 is movably disposed along the guide rail 438 with respect to the X-axis stage 48 in the Y-axis direction.
導軌436b係以相對於Z軸方向與滾珠螺桿軸433的軸線方向而傾斜之方式(以朝相對於X軸平台以角度β傾斜之β方向延伸之方式)安裝在楔形構件436的上部。再者,安裝在移動構件439的下部之滑塊439a可扣合在導軌436b上,因而,移動構件439可沿導軌436b而相對於楔形構件436朝β方向相對移動地配置。The guide rail 436b is attached to the upper portion of the wedge member 436 so as to be inclined with respect to the axial direction of the ball screw shaft 433 with respect to the Z-axis direction (to extend in the β direction inclined at an angle β with respect to the X-axis stage). Further, the slider 439a attached to the lower portion of the moving member 439 can be engaged with the guide rail 436b, and thus, the moving member 439 can be disposed to move relatively in the β direction with respect to the wedge member 436 along the guide rail 436b.
移動構件439具有支持上面439b、與朝Z軸方向延伸之臂439c。在支持上面439b可分解地設置有內周為圓錐形狀之下座439d。又、在從支持上面439b朝上方延伸之支持臂439c的側面安裝有朝Z軸方向延伸之一對(僅單面圖示)導軌439e。在導軌439e上分別扣合有固定在外殼431上之滑塊431a。因而,移動構件439亦可沿導軌439e而對於外殼431相對移動地配置。藉由該支持構成,可尤其使臂439c之支持剛性得以提高,且可確保後述之彈簧構件450的安裝位置之X軸方向及Y軸方向之位置精度。The moving member 439 has an arm 439c that supports the upper surface 439b and extends in the Z-axis direction. The support upper surface 439b is decomposably provided with a seat 439d having a conical inner circumference. Further, a pair of guide rails 439e extending in the Z-axis direction (only one side view) are attached to the side surface of the support arm 439c extending upward from the support upper surface 439b. A slider 431a fixed to the outer casing 431 is respectively fastened to the guide rail 439e. Thus, the moving member 439 can also be disposed relative to the outer casing 431 along the guide rail 439e. According to this support structure, the support rigidity of the arm 439c can be improved, and the positional accuracy in the X-axis direction and the Y-axis direction of the mounting position of the spring member 450 to be described later can be ensured.
以對向於移動構件439的支持上面439b之方式設置有傾動支持部440作為關節機構。在傾動支持部440的下面,對向於下座439d,可分解地設置有內周為圓錐形狀之上座440a。在下座439d與上座440a之間配置有球體441而形成作為關節機構之球面座,因而,移動構件439與傾動支持部440雖在與Z軸方向正交之方向上相互受到約束,但可相對傾斜。A tilting support portion 440 is provided as a joint mechanism in such a manner as to support the upper surface 439b of the moving member 439. On the lower surface of the tilting support portion 440, the upper seat 439d is detachably provided with a conical outer seat 440a. The spherical body 441 is disposed between the lower seat 439d and the upper seat 440a to form a spherical seat as a joint mechanism. Therefore, the moving member 439 and the tilting support portion 440 are mutually restrained in a direction orthogonal to the Z-axis direction, but are relatively tiltable. .
在傾動支持部440的上方配置有安裝在基板載台20的下面之基板支持部442,在傾動支持部440的上平面與基板支持部442的下平面之間配置有多數個滾珠443。因而,傾動支持部440與基板支持部442可朝與Z軸方向正交之方向在某範圍內相對移動,但若完全不約束基板支持部442,則無法定位基板載台20。是以,在本實施形態中,設置有位置約束用之彈簧構件450。A substrate supporting portion 442 attached to the lower surface of the substrate stage 20 is disposed above the tilting support portion 440, and a plurality of balls 443 are disposed between the upper surface of the tilting support portion 440 and the lower surface of the substrate supporting portion 442. Therefore, the tilt support portion 440 and the substrate supporting portion 442 can relatively move in a certain range in a direction orthogonal to the Z-axis direction. However, if the substrate supporting portion 442 is not restrained at all, the substrate stage 20 cannot be positioned. Therefore, in the present embodiment, the spring member 450 for positional restraint is provided.
更具體而言,彈簧構件450係如圖4所示般,以例如SUP3、SUP6、SUP7、SUP9、SUP10、SUP12等之較薄的矩形板狀彈簧鋼片為素材,且具有自一邊朝向中央延伸之平行的一對狹縫450a。較佳的是,在狹縫450a的末端形成應力緩和用之圓孔450d(參照圖6(c)),若將狹縫450a的寬度設為「t」,則圓孔450d的直徑D設定為t≦D≦2t為佳。由狹縫450a相夾之中央部450b的緣部係由螺栓B1固定在朝Z軸方向延伸至基板支持部442的下面位置、且移動構件439的臂439c之上面。另一方面,狹縫450a的兩側即周邊部450c的緣部係由螺栓B2固定在基板支持部442的下面(參照圖5)。另,與安裝有中央部450b及周邊部450c之緣部相反側之緣部未被約束而為自由。又,如圖6(c)所示般,中央部450b之長度形成為較周邊部450c的長度更短,且在自中央部450b的邊緣部突出之周邊部450c的部分形成有傾斜面450e。相對於狹縫450a的延伸方向之該傾斜面450e的傾斜角θ可為0°≦θ<90°,若考量周邊部450c的剛性,則較佳的是0°≦θ≦60°。再者,若考量彈簧構件450的輕質化與周邊部450c的剛性兩者,則更佳的是設定為30°≦θ≦60°。More specifically, the spring member 450 is made of a thin rectangular plate-shaped spring steel sheet such as SUP3, SUP6, SUP7, SUP9, SUP10, SUP12, etc. as shown in FIG. 4, and has a side extending from one side toward the center. A pair of parallel slits 450a. Preferably, a circular hole 450d for stress relaxation is formed at the end of the slit 450a (see FIG. 6(c)), and when the width of the slit 450a is "t", the diameter D of the circular hole 450d is set to t≦D≦2t is preferred. The edge portion of the central portion 450b sandwiched by the slit 450a is fixed by the bolt B1 to the lower surface of the substrate supporting portion 442 in the Z-axis direction and above the arm 439c of the moving member 439. On the other hand, the edge of the peripheral portion 450c on both sides of the slit 450a is fixed to the lower surface of the substrate supporting portion 442 by a bolt B2 (see FIG. 5). Further, the edge portion on the side opposite to the edge portion to which the central portion 450b and the peripheral portion 450c are attached is not restrained and is free. Further, as shown in FIG. 6(c), the length of the central portion 450b is formed to be shorter than the length of the peripheral portion 450c, and an inclined surface 450e is formed in a portion of the peripheral portion 450c that protrudes from the edge portion of the central portion 450b. The inclination angle θ of the inclined surface 450e with respect to the extending direction of the slit 450a may be 0° ≦ θ < 90°, and when considering the rigidity of the peripheral portion 450c, it is preferably 0° ≦ θ ≦ 60°. Further, in consideration of both the weight reduction of the spring member 450 and the rigidity of the peripheral portion 450c, it is more preferable to set it to 30° ≦ θ ≦ 60°.
接著,茲就Z-傾動調整機構43的動作進行說明。若自未圖示之控制裝置對馬達432傳送驅動信號,則旋轉軸432a旋轉,而使該旋轉運動介以聯軸節434傳達至滾珠螺桿軸433。如此,在與經固定之螺帽437之間會使旋轉產生相對轉動,藉此軸線方向力會傳達至螺帽437,而螺帽437會與楔形構件436一起朝滾珠螺桿軸433的軸線方向移動。Next, the operation of the Z-tilt adjustment mechanism 43 will be described. When a control signal is transmitted from the control device (not shown) to the motor 432, the rotation shaft 432a is rotated, and the rotation motion is transmitted to the ball screw shaft 433 via the coupling 434. Thus, the rotation is caused to rotate relative to the fixed nut 437, whereby the axial force is transmitted to the nut 437, and the nut 437 moves with the wedge member 436 toward the axis of the ball screw shaft 433. .
若楔形構件436朝滾珠螺桿軸433的軸線方向移動,則移動構件439亦會在相同方向承受力,但移動構件439由於僅容許朝Z軸方向之移動,因此藉由一面相對於楔形構件436朝β方向相對移動,一面在導軌439e上使滑塊431a相對滑動,可相對於外殼431朝Z軸方向(上下)移動。藉此,介以球面座、傾動支持部440及基板支持部442,可使基板載台20朝Z軸方向移動。If the wedge member 436 moves toward the axial direction of the ball screw shaft 433, the moving member 439 also receives the force in the same direction, but the moving member 439 is only allowed to move in the Z-axis direction, so that the one side is opposed to the wedge member 436 When the β direction is relatively moved, the slider 431a is relatively slid on the guide rail 439e, and is movable in the Z-axis direction (up and down) with respect to the casing 431. Thereby, the substrate stage 20 can be moved in the Z-axis direction via the spherical seat, the tilting support portion 440, and the substrate supporting portion 442.
此處,在3個Z-傾動調整機構43的Z軸方向驅動量不同之情形下,基板載台20雖會相對於X軸平台48而傾斜,但該傾斜會藉由球面座作用、使傾動支持部440相對於移動構件439傾斜而被容許。又,在基板載台20相對於X軸平台48朝X軸方向或是Y軸方向微幅移動之情形下,滾珠443會容許此情形。Here, when the driving amounts of the three Z-tilt adjustment mechanisms 43 in the Z-axis direction are different, the substrate stage 20 is inclined with respect to the X-axis stage 48, but the inclination is caused by the spherical seat to tilt The support portion 440 is allowed to tilt with respect to the moving member 439. Further, in the case where the substrate stage 20 is slightly moved in the X-axis direction or the Y-axis direction with respect to the X-axis stage 48, the balls 443 allow this.
另一方面,彈簧構件450發揮功能,以抑制基板載台20相對於X軸平台48朝X軸方向或是Y軸方向無限制地移動。亦即,在狹縫450a的內方端側連結之中央部450b與周邊部450c分別為單側固定狀,藉由彼此易於朝反方向撓曲為V字狀,而容許基板支持部442相對於移動構件439傾斜。另一方面,在X軸方向及Y軸方向(彈簧構件450之面方向)上,由於彈簧構件450剛性較高且不易變形,因此可抑制基板支持部442相對於移動構件439進行移動。藉此,即使基板載台20相對於X軸平台48朝Z軸方向移動,亦可確保X軸方向或是Y軸方向的定位精度。特別是為確保X軸方向的定位精度,較佳的是,以獲得中央部450b的剛性之方式,將中央部450b的寬度a設為彈簧構件450的寬度L的1/2以下(a<L/2)(參照圖6(b))。On the other hand, the spring member 450 functions to suppress the substrate stage 20 from moving unrestricted in the X-axis direction or the Y-axis direction with respect to the X-axis stage 48. In other words, the central portion 450b and the peripheral portion 450c connected to the inner end side of the slit 450a are respectively fixed in a single direction, and are easily bent in a V-shape in the opposite direction, thereby allowing the substrate supporting portion 442 to be opposed to The moving member 439 is inclined. On the other hand, in the X-axis direction and the Y-axis direction (the surface direction of the spring member 450), since the spring member 450 is high in rigidity and is not easily deformed, the substrate supporting portion 442 can be prevented from moving relative to the moving member 439. Thereby, even if the substrate stage 20 moves in the Z-axis direction with respect to the X-axis stage 48, the positioning accuracy in the X-axis direction or the Y-axis direction can be ensured. In particular, in order to secure the positioning accuracy in the X-axis direction, it is preferable to set the width a of the central portion 450b to 1/2 or less of the width L of the spring member 450 so as to obtain the rigidity of the central portion 450b (a<L). /2) (Refer to Figure 6(b)).
又,如圖6(c)所示般,若將周邊部450c的長度設為X1,則藉由使中央部450b的長度X設定為X≦X1/2,可進一步提高中央部450b的剛性。再者,在圖6(a)中,設置在基板載台20之對向之兩邊中之一邊之Z-傾動調整機構43A之彈簧構件450的彈簧剛性,較佳設定為較設置於另一邊之2個Z-傾動調整機構43B之彈簧構件450的彈簧剛性為大,更佳設定為Z-傾動調整機構43B之彈簧構件450的彈簧剛性之2倍。藉此,可消除剛性偏差,且可提高定位精度。Further, as shown in FIG. 6(c), when the length of the peripheral portion 450c is X1, the rigidity of the central portion 450b can be further increased by setting the length X of the central portion 450b to X≦X1/2. Further, in Fig. 6(a), the spring rigidity of the spring member 450 of the Z-tilt adjustment mechanism 43A provided on one of the opposite sides of the substrate stage 20 is preferably set to be larger than the other side. The spring member 450 of the two Z-tilt adjustment mechanisms 43B has a large spring rigidity, and is preferably set to twice the spring rigidity of the spring member 450 of the Z-tilt adjustment mechanism 43B. Thereby, the rigidity deviation can be eliminated and the positioning accuracy can be improved.
再者,為能藉由彈簧構件450的剛性而充分承受支持基板載台20,若將基板載台20的寬度設為L',則彈簧構件450的寬度L較佳設定為0.1≦L/L'≦0.5。Further, in order to sufficiently support the substrate stage 20 by the rigidity of the spring member 450, if the width of the substrate stage 20 is L', the width L of the spring member 450 is preferably set to 0.1 ≦L/L. '≦0.5.
再者,根據本實施形態,由於彈簧構件450係安裝在移動構件439之臂439c的上面、與基板支持部442的下面,且係朝Z軸方向整體移動,因此相較於與外殼431連結之情形,可抑制彈簧構件450的形狀變化,因而可無關移動構件439之移動,而獲得安定之基板載台20的位置精度。基於以上微調整基板載台20之Z軸、傾動方向的位置,可使遮罩M與基板W保持特定的間隔且平行地對向。According to the present embodiment, since the spring member 450 is attached to the upper surface of the arm 439c of the moving member 439 and the lower surface of the substrate supporting portion 442, and is moved integrally in the Z-axis direction, it is connected to the outer casing 431. In other words, the shape change of the spring member 450 can be suppressed, and thus the positional accuracy of the stabilized substrate stage 20 can be obtained irrespective of the movement of the moving member 439. Based on the above-described fine adjustment of the position of the Z-axis and the tilting direction of the substrate stage 20, the mask M and the substrate W can be aligned at a predetermined interval and in parallel.
再者,在第1接近曝光裝置本體2上,如圖1及圖2所示般,設置檢測基板載台20的位置之位置測定裝置即雷射測長裝置60。該雷射測長裝置60係測定在基板載台移動機構40驅動時產生之基板載台20的移動距離者。Further, on the first proximity exposure device main body 2, as shown in FIGS. 1 and 2, a laser length measuring device 60 which is a position measuring device for detecting the position of the substrate stage 20 is provided. The laser length measuring device 60 measures the moving distance of the substrate stage 20 generated when the substrate stage moving mechanism 40 is driven.
雷射測長裝置60具備:固定在支架71上,以沿基板載台20的X軸方向側面之方式配設之X軸用鏡64;固定在支架71上,以沿基板載台20的Y軸方向側面之方式配設之Y軸用鏡65;配設在裝置基台50的X軸方向端部,將雷射光(計測光)照射於X軸用鏡64,並接受由X軸用鏡64所反射之雷射光,而計測基板載台20的位置之X軸測長器(測長器)61及偏擺測定器(測長器)62;及配設在裝置基台50的Y軸方向端部,將雷射光照射於Y軸用鏡65,並接受由Y軸用鏡65所反射之雷射光而計測基板載台20的位置之1台Y軸測長器(測長器)63。The laser length measuring device 60 includes an X-axis mirror 64 that is fixed to the bracket 71 so as to be disposed along the side surface of the substrate stage 20 in the X-axis direction, and is fixed to the bracket 71 so as to be along the Y of the substrate stage 20. A Y-axis mirror 65 disposed on the side in the axial direction; disposed at an end portion of the apparatus base 50 in the X-axis direction, irradiates laser light (measured light) to the X-axis mirror 64, and receives a mirror for the X-axis 64-reflected laser light, X-axis length measuring device (length measuring device) 61 and yaw measuring device (length measuring device) 62 for measuring the position of the substrate stage 20; and Y-axis disposed on the device base 50 A Y-axis length measuring device (elongation measuring device) 63 that irradiates the laser light to the Y-axis mirror 65 and receives the laser light reflected by the Y-axis mirror 65 to measure the position of the substrate stage 20 at the direction end portion. .
且,在雷射測長裝置60中,將自X軸測長器61、偏擺測定器62及Y軸測長器63對X軸用鏡64及Y軸用鏡65照射之雷射光,利用X軸用鏡64及Y軸用鏡65予以反射,而高精度地計測基板載台20之X軸、Y軸方向的位置。又,X軸方向之位置資料係藉由X軸測長器61予以測定,θ方向之位置係藉由偏擺測定器62予以測定。另,基板載台20之位置由於係加上利用雷射測長裝置60所測定之X軸方向位置、Y軸方向位置及θ方向之位置,並加以適宜修正而算出,因此基板載台移動機構40可基於其結果而調整基板W之位置。In the laser length measuring device 60, the X-axis length measuring device 61, the yaw measuring device 62, and the Y-axis length measuring device 63 are used to irradiate the X-axis mirror 64 and the Y-axis mirror 65 with laser light. The X-axis mirror 64 and the Y-axis mirror 65 reflect the position of the substrate stage 20 in the X-axis and Y-axis directions with high precision. Further, the positional data in the X-axis direction is measured by the X-axis length measuring device 61, and the position in the θ direction is measured by the yaw measuring device 62. Further, since the position of the substrate stage 20 is calculated by the position in the X-axis direction, the position in the Y-axis direction, and the position in the θ direction measured by the laser length measuring device 60, and is calculated by appropriate correction, the substrate stage moving mechanism is added. 40 can adjust the position of the substrate W based on the result.
以上,雖參照實施形態說明了本發明,但本發明不應理解為限定於上述實施形態,當然亦可進行適宜變更、改良。The present invention has been described above with reference to the embodiments, but the invention should not be construed as being limited to the embodiments described above.
在上述實施形態中,驅動機構具有:馬達432、由將馬達432的旋轉運動轉換為軸線運動之滾珠螺桿機構所構成之轉換機構、及可藉由利用轉換機構所轉換之軸線運動而朝Y軸方向移動之楔形構件436,但本發明之驅動機構並不限定於此。例如圖7所示之第1變形例般,驅動機構亦可為由固定在驅動構件500上之可動件501與固定件502構成之線性馬達,藉此,對應於固定在進行軸線運動之驅動構件500上之楔形構件436朝Y軸方向移動,可使移動構件439朝上下方向移動。In the above embodiment, the drive mechanism includes a motor 432, a switching mechanism constituted by a ball screw mechanism that converts rotational motion of the motor 432 into an axis motion, and a Y-axis that can be moved by an axis that is converted by the conversion mechanism. The wedge member 436 is moved in the direction, but the driving mechanism of the present invention is not limited thereto. For example, as in the first modification shown in FIG. 7, the drive mechanism may be a linear motor constituted by the movable member 501 and the fixing member 502 fixed to the driving member 500, thereby corresponding to the driving member fixed to the axial movement. The wedge member 436 on the 500 moves in the Y-axis direction, and the moving member 439 can be moved in the up and down direction.
又,本發明之彈簧構件如圖8所示之第2變形例般,亦可藉由重疊複數片彈簧構件450而構成。Further, the spring member of the present invention may be configured by stacking a plurality of spring members 450 as in the second modification shown in FIG.
再者,本發明之上下方向及傾動調整機構只要以朝上下方向驅動基板保持部並調整基板保持部的傾斜之方式構成即可,且為在基板保持部之對向之兩邊中之一邊至少具有1個、在另一邊至少具有2個之構成即可。In addition, the up-down direction and the tilt adjustment mechanism of the present invention may be configured to drive the substrate holding portion in the vertical direction and adjust the inclination of the substrate holding portion, and have at least one of the opposite sides of the substrate holding portion. One may have at least two on the other side.
10...遮罩載台10. . . Mask stage
11...遮罩載台基台11. . . Mask stage abutment
11a...開口部11a. . . Opening
12...遮罩保持框12. . . Mask holding frame
14...夾盤部14. . . Chuck section
16...遮罩位置調整機構(遮罩驅動機構)16. . . Mask position adjustment mechanism (mask drive mechanism)
16x...X軸方向驅動裝置16x. . . X-axis direction drive
16y...Y軸方向驅動裝置16y. . . Y-axis direction drive
17...間隙感測器17. . . Gap sensor
18...遮罩用對準照相機18. . . Aligning camera with mask
19...移動機構19. . . Mobile agency
20...基板載台20. . . Substrate stage
21...工件夾盤twenty one. . . Workpiece chuck
22...吸附面twenty two. . . Adsorption surface
30...照明光學系統30. . . Lighting optical system
31...高壓水銀燈31. . . High pressure mercury lamp
32...凹面鏡32. . . concave mirror
33...光學積分器33. . . Optical integrator
34...曝光控制用快門34. . . Exposure control shutter
35...平面鏡35. . . Plane mirror
36...平面鏡36. . . Plane mirror
37...球面鏡37. . . Spherical mirror
38...遮蔽孔徑38. . . Shadow aperture
39...遮蔽孔徑驅動機構39. . . Shielding aperture drive mechanism
40...基板載台移動機構(基板驅動機構)40. . . Substrate stage moving mechanism (substrate driving mechanism)
41...Y軸進給機構41. . . Y-axis feed mechanism
42...X軸進給機構42. . . X-axis feed mechanism
43...Z-傾動調整機構(上下方向及傾動調整機構、支持裝置)43. . . Z-tilt adjustment mechanism (up and down direction and tilt adjustment mechanism, support device)
44...線性滑軌44. . . Linear slide
44a...導軌44a. . . guide
45...Y軸平台45. . . Y-axis platform
46...驅動裝置46. . . Drive unit
46a...螺帽46a. . . Nut
46b...滾珠螺桿軸46b. . . Ball screw shaft
46c...馬達46c. . . motor
47...線性滑軌47. . . Linear slide
47a...導軌47a. . . guide
48...X軸平台48. . . X-axis platform
49...驅動裝置49. . . Drive unit
49b...滾珠螺桿軸49b. . . Ball screw shaft
49c...馬達49c. . . motor
50...裝置基台50. . . Device abutment
51...支柱51. . . pillar
52...Z軸移動裝置52. . . Z-axis mobile device
60...雷射測長裝置60. . . Laser length measuring device
61...X軸測長器61. . . X-axis length measuring device
62...偏擺測定器62. . . Yaw tester
63...Y軸測長器63. . . Y-axis length measuring device
64...X軸用鏡64. . . X-axis mirror
65...Y軸用鏡65. . . Y-axis mirror
71...支架71. . . support
431...外殼431. . . shell
431a...滑塊431a. . . Slider
432...馬達432. . . motor
432a...旋轉軸432a. . . Rotary axis
433...滾珠螺桿軸433. . . Ball screw shaft
434...聯軸節434. . . Coupling
435...軸承435. . . Bearing
436...楔形構件436. . . Wedge member
436a...滑塊436a. . . Slider
436b...導軌436b. . . guide
437...螺帽437. . . Nut
438...導軌438. . . guide
439...移動構件439. . . Moving member
439a...滑塊439a. . . Slider
439b...支持上面439b. . . Support above
439c...臂439c. . . arm
439d...下座439d. . . Lower seat
439e...導軌439e. . . guide
440...傾動支持部440. . . Tilting support
440a...上座440a. . . Sitting
441...球體441. . . Sphere
442...基板支持部442. . . Substrate support
443...滾珠443. . . Ball
450...彈簧構件450. . . Spring member
450a...狹縫450a. . . Slit
450b...中央部450b. . . Central department
450c...周邊部450c. . . Peripheral part
L...光路L. . . Light path
M...遮罩M. . . Mask
W...基板W. . . Substrate
圖1係用以說明適用於曝光單元之接近曝光裝置本體之一部分分解立體圖;1 is a partially exploded perspective view showing a body of a proximity exposure device suitable for an exposure unit;
圖2係圖1所示之接近曝光裝置本體之前視圖;Figure 2 is a front view of the body of the proximity exposure device shown in Figure 1;
圖3係圖1所示之遮罩保持部之放大立體圖;Figure 3 is an enlarged perspective view of the mask holding portion shown in Figure 1;
圖4係Z-傾動調整機構43之立體圖;Figure 4 is a perspective view of the Z-tilt adjustment mechanism 43;
圖5係Z-傾動調整機構43之側視圖;Figure 5 is a side view of the Z-tilt adjustment mechanism 43;
圖6(a)係與Z-傾動調整機構43一起顯示之基板載台20的俯視圖;(b)係為Z-傾動調整機構43之放大俯視圖;(c)係為彈簧構件450之部分放大圖;6(a) is a plan view of the substrate stage 20 displayed together with the Z-tilt adjustment mechanism 43; (b) is an enlarged plan view of the Z-tilt adjustment mechanism 43; (c) is a partial enlarged view of the spring member 450 ;
圖7(a)係為本發明第1變形例之Z-傾動調整機構43之側視圖;(b)係自(a)之箭頭VII觀察之驅動機構之圖;及Figure 7 (a) is a side view of the Z-tilt adjustment mechanism 43 according to the first modification of the present invention; (b) is a view of the drive mechanism observed from the arrow VII of (a);
圖8係為本發明第2變形例之彈簧構件450周邊之放大側視圖。Fig. 8 is an enlarged side elevational view showing the vicinity of a spring member 450 according to a second modification of the present invention.
20...基板載台20. . . Substrate stage
43...Z-傾動調整機構43. . . Z-tilt adjustment mechanism
48...X軸平台48. . . X-axis platform
431...外殼431. . . shell
431a...滑塊431a. . . Slider
432...馬達432. . . motor
432a...旋轉軸432a. . . Rotary axis
433...滾珠螺桿軸433. . . Ball screw shaft
434...聯軸節434. . . Coupling
435...軸承435. . . Bearing
436...楔形構件436. . . Wedge member
436a...滑塊436a. . . Slider
436b...導軌436b. . . guide
437...螺帽437. . . Nut
438...導軌438. . . guide
439...移動構件439. . . Moving member
439a...滑塊439a. . . Slider
439b...支持上面439b. . . Support above
439c...臂439c. . . arm
439d...下座439d. . . Lower seat
439e...導軌439e. . . guide
440...傾動支持部440. . . Tilting support
440a...上座440a. . . Sitting
441...球體441. . . Sphere
442...基板支持部442. . . Substrate support
443...滾珠443. . . Ball
450...彈簧構件450. . . Spring member
B1...螺栓B1. . . bolt
B2...螺栓B2. . . bolt
β...傾斜角度β. . . slope
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JP5594404B1 (en) * | 2013-07-02 | 2014-09-24 | 日本精工株式会社 | Table device, transfer device, semiconductor manufacturing device, and flat panel display manufacturing device |
JP6442831B2 (en) * | 2014-02-17 | 2018-12-26 | 日本精工株式会社 | Table device and transfer device |
JP2021067925A (en) * | 2019-10-21 | 2021-04-30 | キヤノン株式会社 | Support device, projection optic system, exposure device, method of adjusting support device, and method of producing article |
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JP2601834B2 (en) * | 1987-08-26 | 1997-04-16 | 株式会社東芝 | Table equipment |
JPH0359494A (en) * | 1989-07-28 | 1991-03-14 | Nec Corp | Fine adjustment z-stage device |
JPH0329236U (en) * | 1989-07-31 | 1991-03-22 | ||
JP3301387B2 (en) * | 1998-07-09 | 2002-07-15 | ウシオ電機株式会社 | Mask and work gap control method and proximity exposure apparatus in proximity exposure |
JP2001230305A (en) | 2000-02-18 | 2001-08-24 | Canon Inc | Supporting apparatus |
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