TWI434864B - 化合物及含有該化合物的光阻組成物 - Google Patents

化合物及含有該化合物的光阻組成物 Download PDF

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Publication number
TWI434864B
TWI434864B TW099144297A TW99144297A TWI434864B TW I434864 B TWI434864 B TW I434864B TW 099144297 A TW099144297 A TW 099144297A TW 99144297 A TW99144297 A TW 99144297A TW I434864 B TWI434864 B TW I434864B
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TW
Taiwan
Prior art keywords
group
formula
compound
independently
hydrogen atom
Prior art date
Application number
TW099144297A
Other languages
English (en)
Chinese (zh)
Other versions
TW201129593A (en
Inventor
Joon-Hee Han
Seung-Duk Cho
Jung-Hoon Oh
Seung-Jae Lee
Original Assignee
Korea Kumho Petrochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Kumho Petrochem Co Ltd filed Critical Korea Kumho Petrochem Co Ltd
Publication of TW201129593A publication Critical patent/TW201129593A/zh
Application granted granted Critical
Publication of TWI434864B publication Critical patent/TWI434864B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/612—Esters of carboxylic acids having a carboxyl group bound to an acyclic carbon atom and having a six-membered aromatic ring in the acid moiety
    • C07C69/616—Esters of carboxylic acids having a carboxyl group bound to an acyclic carbon atom and having a six-membered aromatic ring in the acid moiety polycyclic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
TW099144297A 2010-02-17 2010-12-16 化合物及含有該化合物的光阻組成物 TWI434864B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100014255A KR101167039B1 (ko) 2010-02-17 2010-02-17 페놀 치환기를 포함하는 화합물, 이의 제조방법 및 이를 포함하는 레지스트 조성물

Publications (2)

Publication Number Publication Date
TW201129593A TW201129593A (en) 2011-09-01
TWI434864B true TWI434864B (zh) 2014-04-21

Family

ID=44463120

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099144297A TWI434864B (zh) 2010-02-17 2010-12-16 化合物及含有該化合物的光阻組成物

Country Status (5)

Country Link
JP (1) JP5330419B2 (ja)
KR (1) KR101167039B1 (ja)
CN (1) CN102161622B (ja)
SG (1) SG173948A1 (ja)
TW (1) TWI434864B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105209974B (zh) * 2013-05-13 2020-05-29 日产化学工业株式会社 含有使用双酚醛的酚醛清漆树脂的抗蚀剂下层膜形成用组合物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3591547B2 (ja) * 1995-09-18 2004-11-24 信越化学工業株式会社 ビスフェノールカルボン酸第三級エステル誘導体及び化学増幅ポジ型レジスト材料
KR0164963B1 (ko) * 1995-10-14 1999-01-15 김흥기 3성분계 화학증폭형 포토레지스트 조성물
US7604920B2 (en) * 2007-08-07 2009-10-20 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition, method of forming resist pattern, polymeric compound, and compound
JP2009067724A (ja) * 2007-09-13 2009-04-02 Idemitsu Kosan Co Ltd 環状化合物、フォトレジスト基材及びフォトレジスト組成物

Also Published As

Publication number Publication date
JP5330419B2 (ja) 2013-10-30
CN102161622B (zh) 2014-11-26
SG173948A1 (en) 2011-09-29
KR20110094699A (ko) 2011-08-24
CN102161622A (zh) 2011-08-24
KR101167039B1 (ko) 2012-07-27
TW201129593A (en) 2011-09-01
JP2011168578A (ja) 2011-09-01

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