TWI430328B - Method of making base of photovoltaic element - Google Patents

Description

Method for manufacturing base of photoelectric element

The present invention relates to the field of a photovoltaic element, and more particularly to a method of fabricating a substrate for a photovoltaic element.

Generally, the photoelectric element is configured by a photovoltaic wafer disposed on a base; wherein the base is formed by a combination of a metal disk body and a plurality of conductive pins and a grounding guide.

Please refer to FIG. 1 , which shows a base 10 of a photoelectric component taken from a metal disk 11 and a plurality of independent pins 12 respectively inserted on the metal disk 11; then on the pin 12 and the metal disk The glass material 13 is filled between 11 and the glass material 13, the lead 12 and the metal disk 11 are bonded together by means of glass sintering. Another grounding pin 14 can be bonded to the metal disk 11 by spot welding or laser welding. This produces a single and independent base.

Then, each of the bases 10 is placed in a barrel plating bath for full plating (not shown), so that the surfaces of the metal disk body and the respective conductive pins and ground pins are gold plated.

Please refer to FIG. 2, which summarizes the manufacturing method of the conventional base as follows: preparation step 21, which mainly takes an independent metal disk body and independent pins; the lead assembly step 22, which mainly makes the metal disk body and each guide Bonding, and filling the gap between the lead and the metal disk into the glass material; sintering step 23, mainly placing the combination of the metal disk, the lead and the glass material in a high temperature furnace to melt the glass material And combining the metal disk body and the respective pins; the grounding pin welding assembly step 24, taking a grounding pin and bonding with the metal disk body by spot welding or laser welding; the full plating step 25 is to take the metal disk body, each The base formed by the lead and the glass material is placed in a barrel plating bath for full plating, so that the surface of each member is plated with a layer of gold.

In this way, a single independent and fully gold-plated base can be obtained.

However, there are several inconveniences and disadvantages in this way: one is that the glass sintering needs high temperature and long time heating, which leads to a long process time; the second is the grounding pin to weld the metal disk body by welding, due to the metal The size of the disc body and the pin is small, because the area that can be clamped by the fixture is small, and the position of the point is small, so the welding table is inconvenient; the third is that the surface of the entire base is gold-plated, but a large proportion thereof The area is not required to be gold-plated, thus causing an increase in cost; the fourth is that the outer diameter of each pin is very thin, so it is easy to cause deformation during the barrel plating process; the fifth is that the production method is one by one. The base is so time-consuming to make.

SUMMARY OF THE INVENTION The object of the present invention is to provide a method for fabricating a base of a photovoltaic element, which mainly adopts a continuous combination type, which improves the inconvenience and time consuming lack of one-by-one fabrication of the conventional base, and the lack of additional soldering of the grounding pin.

Another object of the present invention is to provide a method for fabricating a base of a photovoltaic element, which is capable of limiting plating, thereby improving the high cost of the conventional base to be fully plated, and at the same time solving the lack of deformation of the lead during the plating process. .

In addition, the present invention replaces the glass sintering method by the injection molding method, and the production time can be shortened and the production efficiency can be improved.

According to the above object and effect, the method for fabricating a base according to the present invention comprises a substrate holder forming step of forming a stent substrate by a metal material, and the stent substrate comprises a plurality of pins on a strip; The plating step is to plate the plating area of each of the bracket substrates, wherein the plating area is at least an end of the lead; the lead and the metal disc body assembly step guide the plated substrate to enter the injection mold. And arranging the metal disk body in the injection mold, and then assembling at one end of each of the pins; and inserting the mold into the plastic material step, after the mold is closed, the molten plastic material is injected into the injection mold, and the plastic material flows in. In the metal disk body, each of the pins is combined with the metal disk body; and the cutting tape step is performed by taking out a combination of the metal disk body and the holder substrate by an injection mold, and cutting and removing the material strip. The metal disk body is combined with a plurality of pins and forms a separate component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments will be described, and the objects and effects disclosed above with respect to the present invention will be described in detail with reference to the drawings.

Referring to FIG. 3, there is shown a manner of making a stent substrate 30 by taking a metal material (continuous metal strip or sheet metal sheet) 31 and forming a strip 32 by stamping. With multiple pins 34. The above-mentioned pin 34 can define a plating region 36 from the free end; the plating region 36 is smaller than one-half of the length of the pin 34; for example, if the length of the pin 34 is 15 mm, the plating region 36 does not exceed 7.5 mm; Generally speaking, according to the different lengths of the lead 34 and the implementation of the electroplating process, the length of the plating region 36 mostly falls between 1 mm and 5 mm.

Figure 4 shows that the stent substrate 30 can be opposed to a plating bath 38 and the plating region 36 of each lead 34 into the plating solution. Thereby, a layer of metal is adhered to the surface of the plating region 36; the metal attached to the plating region 36 is preferably gold. In addition, prior to the plating of the plating region 36, the surface of the lead 34 may be first plated with a layer of nickel. The plating thickness of gold is preferably 0.05 um to 0.762 um.

Referring to FIG. 5 and FIG. 6, the plated substrate 30 which has been plated by the plating zone 36 is juxtaposed and placed in the position-injection mold 50 (see FIG. 6), and the metal disk 40 is disposed on each pin. One end of 34. One of the pins is used for grounding and is renamed here to ground pin 35.

Please refer to FIG. 6 again. Further, the stent substrate 30 can enter the injection mold 50 continuously; and the pins 34 and the grounding lead of the stent substrate 30 are clamped by a suitable fixture 52. The leg 35 and the metal disk 40 are supported. Thus, one end of the pin 34 and the ground pin 35 can be embedded in the metal disk 40, and the metal disk 40 and each of the pins 34 and the ground pin 35 form a stable fixed state.

Referring to FIG. 7, after the injection mold 50 is clamped, the molten plastic material 54 can be injected into the injection mold 50, and the plastic material 54 can flow into the metal disk 40, so that the pins 34 are combined with the metal disk 40. And one end of the grounding pin 35 can be pressed by the punch 56 on the inner surface of the mold 50 to be combined with the metal disk 40 by the formation of the riveting.

Then, the combination of the metal disk 40 and the holder base material 30 is taken out, and the strip 32 is cut and removed, so that the combination of the metal disk 40 and the lead 34 and the ground pin 35 can form an independent component.

According to the manufacturing method described above, the present invention can be summarized as follows. As shown in FIG. 8, the scaffold substrate punching step 61 is performed by punching to obtain a plate-like or strip-shaped strip and a plurality of pins. The combination of the pin limit plating step 62 is a combination of the above-mentioned plate-shaped or strip-shaped strips and a plurality of pins, and is plated for the plating area set by the pins.

Lead 63 is assembled with the metal disk body, and the plated substrate is sent to the mold, and the metal disk is placed at a predetermined position of the mold, so that one end of the pin is inserted into the metal disk; In step 64 of the material, the molten plastic material is injected into the mold and filled between the lead and the metal disk, thereby bonding the lead to the metal disk; and the cutting tape is step 65, which is to support the substrate and the metal. The combination of the disc bodies is removed and the strip of the stent substrate is removed; thus a granular, separate base can be obtained. The metal body of each base is provided with a plurality of pins for the electrodes and a ground pin, and each pin is only partially plated.

From the above description, the design of the present invention has the following effects:

1. Since the lead and the strip are formed into a plate shape or a strip shape, it is advantageous to combine with the metal disc body in a continuous structure, thereby improving the manufacturing efficiency and improving the inconvenience and time-consuming lack of one-by-one fabrication of the conventional base;

2. Since the grounding pin of the present invention is directly formed on the tape and is combined with the metal disk body with each pin, it is easier to manufacture than the conventional welding method;

3. The purpose of the gold plating of the lead is to serve as the electrode for wire bonding. However, the required area of the electrode is small, and it may be only a part or even an end of the pin; the plate-shaped or strip-shaped stent substrate disclosed in the present invention The pin can be plated according to actual design requirements, and the conventional structure needs to be fully plated, so the invention can reduce the cost; in addition, when the metal plate body is plated and combined, the pin of the invention is not easy to be stressed. Deformation, and when fully plated, the conventional pin is easily deformed by the movement of the base, so the product yield of the present invention can be improved;

4. The invention combines the plastic material with the molding method to bond the metal disk body to the lead, the molding time is short and the high-temperature stove is not needed, and the conventional structure combines the metal disk body and the pin by the glass sintering method, and the processing time It is long and needs to be completed in a high temperature environment, so the invention can shorten the process time and is convenient to manufacture.

Referring to FIG. 9, another embodiment of the present invention includes a metal disk body positioning and positioning step 71 for arranging a metal disk body at a predetermined position of the injection mold; and a holder substrate introduction step 72 for The plated stent substrate is guided into the injection mold.

After the foregoing two steps are satisfied, the lead and metal disk assembly step 63, the mold injection plastic material step 64, and the cutting tape step 65 can be sequentially performed as in the previous embodiment to obtain a granular independent. Base. The metal body of each base is provided with a plurality of pins for the electrodes and a ground pin, and each pin is only partially plated.

In the two manufacturing methods described above, the grounding pin 35 is pressed by the punch 56 provided in the injection mold 50 to rive the metal disk 40; however, the punching operation may be performed by a suitable punch outside the injection mold 50. . It should be noted that the end face of the grounding pin 35 is trapped at the end surface of the metal disk 40 and is less than 0.05 mm to 0.1 mm.

Referring to FIGS. 10-12, in order to improve the riveting effect of the ground pin 35 and the metal disk 40, the side of the ground pin 35 may form a recess 352 for clamping the metal disk 20; The difference between the 12 figures is that the end faces of the punches 80a to 80c are different in structure, so that the punches 80a to 80c act on the end faces of the ground pins 35, and different structural forms are formed.

Other structures that can be used to improve the riveting effect of the ground pin 35 and the metal disk 40 are as shown in FIG. 13, which form a convex portion 354 at the outer edge of the ground pin 35 and carry the metal disk 40; the punch 80a is stamped on The end surface of the ground pin 35 is recessed toward the end surface of the metal disk 40, and the metal disk 40 is riveted with the convex portion 354.

Fig. 14 shows another structure in which the borrowing head 80a punches the grounding pin 35 to improve the riveting effect of the grounding pin 35 and the metal disk 40. It forms a recess 356 at the outer edge of the ground pin 35, unlike the one in FIG.

Referring to FIG. 15, another structure for improving the riveting effect of the grounding pin 35 and the metal disk 40 is to position a portion of the plastic material 54 on the outer bottom surface of the metal disk 40 when the plastic material is injected. In this way, a space can be reserved on the injection mold opposite to the bottom of the metal disk 40, and the plastic material 54 filled in the space forms an extension portion 542 which can be used for the metal disk 40 and the lead 34 and the grounding lead. The combination of the feet 35 provides a fixed effect.

Referring to Figures 16 through 19, the surface of the ground pin 35 has a first engagement formation 358, and the first engagement formation 358 is capable of forming a secure bond with the plastic material 54. The first engagement formation 358 is concave, flanged, perforated, and embossed, respectively, in the order of the drawings.

Referring to Figures 20 through 23, the metal disk 40 of the Figure has a second engagement formation 402, and the second engagement formation 402 is capable of forming a secure bond with the plastic material 54. The first engagement structure 358 is hollow, flanged, chamfered, and bridged, respectively, in the order of the drawings.

The above embodiments are merely illustrative of the techniques of the present invention and their effects, and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above embodiments without violating the technical principles and spirit of this creation. Therefore, the scope of protection of this creation should be as listed in the patent application scope mentioned later.

10. . . Base

11. . . Metal plate

12. . . Pin

13. . . Glass material

14. . . Ground pin

twenty one. . . Preparation step

twenty two. . . Pin assembly step

twenty three. . . Sintering step

twenty four. . . Ground pin soldering assembly step

25. . . Full plating step

30. . . Bracket substrate

31. . . metallic material

32. . . Strip

34. . . Pin

35. . . Ground pin

352. . . Hollow

354. . . Convex

356. . . Concave

358. . . First meshing structure

36. . . Plating area

38. . . Plating tank

40. . . Metal plate

402. . . Second meshing structure

50. . . Injection mold

52. . . Fixture

54. . . Plastic material

542. . . Extension

56. . . shower

61. . . Bracket substrate stamping step

62. . . Pin limit plating step

63. . . Pin and metal disk assembly steps

64. . . Step of injection molding plastic material

65. . . Cutting strip step

71. . . Metal plate positioning positioning step

72. . . Bracket substrate introduction step

80a~80c. . . shower

Figure 1 is a schematic view of the fabrication of a conventional base.

Figure 2 is a block diagram of the manufacturing steps of the conventional base.

Figure 3 is a schematic view showing the fabrication of the stent substrate of the present invention.

Fig. 4 is a schematic view showing the limitation of plating of the stent substrate of the present invention.

Fig. 5 is an external view showing the arrangement of the metal disk of the present invention on each of the leads.

Figure 6 is a schematic view showing the metal disk of the present invention and the respective pins in the injection mold.

Figure 7 is a schematic view of the present invention in which the mold is clamped and injected into a plastic material.

Figure 8 is a block diagram showing the manufacturing steps of the first embodiment of the present invention.

Figure 9 is a block diagram showing the manufacturing steps of the second embodiment of the present invention.

Figure 10 is a schematic view of the invention for stamping a ground pin.

Figure 11 is a schematic view 2 of the present invention for stamping a ground pin.

Figure 12 is a schematic view of the third embodiment of the present invention for stamping a ground pin.

Figure 13 is a schematic view of the fourth embodiment of the present invention for stamping a ground pin.

Figure 14 is a schematic view 5 of the present invention for stamping a ground pin.

Figure 15 is a schematic view showing the structure of the grounding pin with the extension portion combined with the metal disk body.

Figure 16 is a schematic view showing the structure of the grounding pin of the present invention combined with a plastic material.

Figure 17 is a schematic view showing the structure of the grounding pin of the present invention combined with a plastic material.

Figure 18 is a schematic structural view 3 of the grounding pin of the present invention combined with a plastic material.

Figure 19 is a schematic view showing the structure of the grounding pin of the present invention combined with a plastic material.

Figure 20 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.

Figure 21 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.

Figure 22 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.

Figure 23 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.

61. . . Bracket substrate stamping step

62. . . Pin limit plating step

63. . . Pin and metal disk assembly steps

64. . . Step of injection molding plastic material

65. . . Cutting strip step

Claims (30)

A method for fabricating a base of a photovoltaic element, comprising the steps of: forming a substrate holder, forming a support substrate by using a metal material, and the support substrate comprises a plurality of support pins on a strip; and a lead plating step The plating area of the lead of the bracket substrate is electroplated, wherein the plating area is less than one-half of the length of the lead; the lead and the metal disc assembly step guide the electroplated support substrate to enter Ejecting the mold, and arranging the metal disc body in the injection mold, and then assembling at one end of each of the pins; and inserting the mold into the plastic material step, after the mold is closed, the molten plastic material is injected into the injection mold, and the mold is injected into the mold. Plastic material flows into the metal disk body, so that each pin is combined with the metal disk body; the cutting tape step is performed by taking out the combination of the metal disk body and the bracket substrate by the injection mold, and cutting and removing the material The strip combines the metal disk with a plurality of pins and forms a separate component. The method for fabricating a base of a photovoltaic element according to claim 1, wherein in the step of assembling the lead and the metal disk, the pin is further clamped by the clamp to support the metal disk, so that each One end of the pin is embedded in the metal disk body and forms a stable fixed state. The method for fabricating a base of a photovoltaic element according to claim 1, wherein the support substrate is formed by sheet metal or continuous metal strip. The method for fabricating a base of a photovoltaic element according to claim 1, wherein the plating area of each of the pins is 1 mm to 5 mm. The method for fabricating a substrate for a photovoltaic element according to claim 1 or 4, wherein the metal plated in the plating region of each of the pins is gold. The method for fabricating a base of a photovoltaic element according to claim 5, wherein the plating thickness of the gold is 0.05 um to 0.762 um. The method for fabricating a substrate for a photovoltaic element according to claim 5, further comprising plating gold on each of the leads and plating the gold on the plating region. The method for fabricating a base of a photovoltaic element according to claim 1, further comprising punching one of the pins with a punch so that the end portion thereof is depressed at an end surface of the metal disk. The method for fabricating a base of a photovoltaic element according to claim 8, wherein the pin is used for grounding. The method of fabricating a base of a photovoltaic element according to the invention of claim 8, wherein the punch is a part of the mold, and the pin is punched during mold clamping. The method for fabricating a base of a photovoltaic element according to claim 8, wherein the pin is stamped by the punch and formed into a riveted shape with the metal disk. The method of fabricating a substrate for a photovoltaic element according to claim 1, wherein the surface of the pin has a first engagement structure, and the first engagement structure is capable of forming a firm bond with the plastic material. The method of fabricating a base of a photovoltaic element according to claim 12, wherein the first engaging structure is a hollow, a flange, a perforation or an embossing. The method for fabricating a base of a photovoltaic element according to claim 1, wherein the metal disk body has a second meshing structure, and the second meshing structure forms a firm bond with the plastic material. The method of fabricating a base of a photovoltaic element according to claim 14, wherein the second engagement structure is a hollow, flange, chamfer or bridge configuration. The method for manufacturing a base of a photovoltaic element according to claim 1, wherein the molten plastic material is injected into the mold after the mold clamping, and the plastic material is partially located on the outer bottom surface of the metal disk. A method for manufacturing a base of a photoelectric component, comprising the steps of: positioning a metal disk body to position a metal disk body at a predetermined position of the injection mold; and introducing a plate substrate to the plated substrate Leading into the injection mold, wherein the support substrate has a plurality of pins on a strip, and a plating area is defined on each of the pins, and plating is performed on the plating area, wherein the plating area is smaller than the length of the lead One-half; The step of forming a pin and a metal disk body is to set a metal disk body at one end of each of the pins, and further clamping the pins and supporting the metal disk body with the clamping tool, so that one end of each pin is embedded The metal disk body is formed in a stable fixed position state. After the mold is injected into the plastic material, after the mold is closed, the molten plastic material is injected into the injection mold, and the plastic material flows into the metal disk body, so that the pins are combined with the metal disk; The metal disc body and the bracket base material are taken out by the injection mold, and the strip is cut and removed, and the metal disc body is combined with the plurality of pins to form a separate element. The method for fabricating a base of a photovoltaic element according to claim 17, wherein the support substrate is formed by sheet metal or continuous metal strip. The method for fabricating a substrate for a photovoltaic element according to claim 17, wherein the plating area of each of the pins is 1 mm to 5 mm. The method for fabricating a substrate for a photovoltaic element according to claim 17 or claim 19, wherein the metal plated in the plating region of each of the pins is gold. The method for fabricating a base of a photovoltaic element according to claim 20, wherein the plating thickness of the gold is 0.05 um to 0.762 um. The method for fabricating a substrate for a photovoltaic element according to claim 20, further comprising plating gold on the lead to plate the nickel. The method for fabricating a base of a photovoltaic element according to claim 17, further comprising stamping one of the pins with a punch so that the end portion thereof is depressed at an end surface of the metal disk. The method of fabricating a substrate for a photovoltaic element according to claim 23, wherein the pin is used for grounding. The method of fabricating a substrate for a photovoltaic element according to claim 23, wherein the punch is a part of the mold, and the pin is punched during mold clamping. The method for fabricating a substrate for a photovoltaic element according to claim 23, wherein the pin is stamped by the punch and formed into a riveted shape with the metal disk. The method of fabricating a substrate for a photovoltaic element according to claim 17, wherein the surface of the pin has a first engagement structure, and the first engagement structure is capable of forming a firm bond with the plastic material. The method of fabricating a base of a photovoltaic element according to claim 27, wherein the first engaging structure is a hollow, a flange, a perforation or an embossing. The method of fabricating a base of a photovoltaic element according to claim 17, wherein the metal disk body has a second engagement structure, and the second engagement structure forms a firm bond with the plastic material. The method of fabricating a base of a photovoltaic element according to claim 29, wherein the second engagement structure is a hollow, a flange, a chamfer or a bridge structure.