TWI430328B - Method of making base of photovoltaic element - Google Patents
Method of making base of photovoltaic element Download PDFInfo
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- TWI430328B TWI430328B TW98145273A TW98145273A TWI430328B TW I430328 B TWI430328 B TW I430328B TW 98145273 A TW98145273 A TW 98145273A TW 98145273 A TW98145273 A TW 98145273A TW I430328 B TWI430328 B TW I430328B
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000002184 metal Substances 0.000 claims description 109
- 229910052751 metal Inorganic materials 0.000 claims description 109
- 238000007747 plating Methods 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 33
- 238000002347 injection Methods 0.000 claims description 23
- 239000007924 injection Substances 0.000 claims description 23
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000000994 depressogenic effect Effects 0.000 claims 2
- 238000004049 embossing Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000003466 welding Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 101100493706 Caenorhabditis elegans bath-38 gene Proteins 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Description
本發明係關於一種光電元件的領域,特別是光電元件的底座製作方法。The present invention relates to the field of a photovoltaic element, and more particularly to a method of fabricating a substrate for a photovoltaic element.
一般光電元件的構成係一光電晶片配置在一底座;其中底座的構成可以是一金屬盤體與複數導電引腳及一接地引導的組合。Generally, the photoelectric element is configured by a photovoltaic wafer disposed on a base; wherein the base is formed by a combination of a metal disk body and a plurality of conductive pins and a grounding guide.
請參閱第1圖,圖中顯示一光電元件的底座10係取一金屬盤體11,以及複數獨立的引腳12分別插置在該金屬盤體11上;接著在引腳12與金屬盤體11之間填入玻璃材料13,並藉由玻璃燒結的方式使得玻璃材料13、引腳12及金屬盤體11結合在一起。另外一接地引腳14可藉由點焊或雷射焊接方式與金屬盤體11結合。如此可製得單一且獨立的底座。Please refer to FIG. 1 , which shows a base 10 of a photoelectric component taken from a metal disk 11 and a plurality of independent pins 12 respectively inserted on the metal disk 11; then on the pin 12 and the metal disk The glass material 13 is filled between 11 and the glass material 13, the lead 12 and the metal disk 11 are bonded together by means of glass sintering. Another grounding pin 14 can be bonded to the metal disk 11 by spot welding or laser welding. This produces a single and independent base.
接著將每一顆底座10放入滾鍍槽作全鍍處理(未顯示),使得金屬盤體及各導電引腳及接地引腳的表面皆被鍍金。Then, each of the bases 10 is placed in a barrel plating bath for full plating (not shown), so that the surfaces of the metal disk body and the respective conductive pins and ground pins are gold plated.
請參閱第2圖,歸納習知底座的製作方法如下:備料步驟21,其主要是取獨立的金屬盤體及獨立的引腳;引腳組立步驟22,其主要是使金屬盤體與各引導結合,且在引腳與金屬盤體之間的間隙內填入玻璃材料;燒結步驟23,主要是將上述金屬盤體、引腳及玻璃材料的組合放置在高溫的爐內,使玻璃材料熔融及結合金屬盤體與各引腳;接地腳焊接組立步驟24,係取一接地引腳且藉點焊或雷射焊接方式與金屬盤體結合;全鍍步驟25,係將金屬盤體、各引腳及玻璃材料所構成之底座放入滾鍍槽作全鍍處理,使得各構件的表面且鍍上一層金。Please refer to FIG. 2, which summarizes the manufacturing method of the conventional base as follows: preparation step 21, which mainly takes an independent metal disk body and independent pins; the lead assembly step 22, which mainly makes the metal disk body and each guide Bonding, and filling the gap between the lead and the metal disk into the glass material; sintering step 23, mainly placing the combination of the metal disk, the lead and the glass material in a high temperature furnace to melt the glass material And combining the metal disk body and the respective pins; the grounding pin welding assembly step 24, taking a grounding pin and bonding with the metal disk body by spot welding or laser welding; the full plating step 25 is to take the metal disk body, each The base formed by the lead and the glass material is placed in a barrel plating bath for full plating, so that the surface of each member is plated with a layer of gold.
是以藉由以上方式可以獲得單一獨立狀且表面全鍍金的底座。In this way, a single independent and fully gold-plated base can be obtained.
然而此種方式存在幾個不便及不佳的缺點:其一為玻璃燒結需要高溫及長時間受熱,導致需要較長的製程時間;其二為接地引腳以焊接方式結金屬盤體,由於金屬盤體與引腳的尺寸很小,因可受治具夾持的面積小,加上點位置很小,故焊表不方便;其三為整個底座的表面均鍍金,然而其中有很大比例的面積是不需要做鍍金處理,因此造成成本的提高;其四為各引腳的外徑很細,所以容易在滾鍍過程中造成變形;其五為該製作方法是一顆一顆的製作底座,所以製作費時。However, there are several inconveniences and disadvantages in this way: one is that the glass sintering needs high temperature and long time heating, which leads to a long process time; the second is the grounding pin to weld the metal disk body by welding, due to the metal The size of the disc body and the pin is small, because the area that can be clamped by the fixture is small, and the position of the point is small, so the welding table is inconvenient; the third is that the surface of the entire base is gold-plated, but a large proportion thereof The area is not required to be gold-plated, thus causing an increase in cost; the fourth is that the outer diameter of each pin is very thin, so it is easy to cause deformation during the barrel plating process; the fifth is that the production method is one by one. The base is so time-consuming to make.
本發明的目的係在提供一種光電元件的底座製作方法,其主要是採用連續性的組合型式,改善習用底座需逐一製作的不便與費時的缺失,以及接地引腳需要另外焊接的缺失。SUMMARY OF THE INVENTION The object of the present invention is to provide a method for fabricating a base of a photovoltaic element, which mainly adopts a continuous combination type, which improves the inconvenience and time consuming lack of one-by-one fabrication of the conventional base, and the lack of additional soldering of the grounding pin.
本發明的又一目的係在提供一種光電元件的底座製作方法,其能夠進行限鍍,藉此可以改善習用底座需全鍍而造成高成本的缺失,同時解決引腳在電鍍過程易變形的缺失。Another object of the present invention is to provide a method for fabricating a base of a photovoltaic element, which is capable of limiting plating, thereby improving the high cost of the conventional base to be fully plated, and at the same time solving the lack of deformation of the lead during the plating process. .
此外本發明以射出模製方式取代玻璃燒結方式,可要縮短製作時間,提高生產效率。In addition, the present invention replaces the glass sintering method by the injection molding method, and the production time can be shortened and the production efficiency can be improved.
根據上述的目的與功效,本發明所揭露的底座製作方法包含基材支架製成步驟,係金屬材料製作支架基材,且該支架基材包含一料條上具有多支引腳;引腳限鍍步驟,係對各支架基材的電鍍區域進行電鍍,其中該電鍍區域至少為該引腳的端部;引腳與金屬盤體組立步驟,係引導電鍍後的該支架基材進入射出模具,以及將金屬盤體配置在該射出模具內,進而組設在各該引腳一端;合模注入塑膠材料步驟,係射出模具合模後,將熔融的塑膠材料注入射出模具,且該塑膠材料流入該金屬盤體內,使各該引腳與該金屬盤體結合;以及裁切料帶步驟,係由射出模具取出該金屬盤體與該支架基材的組合,並進行裁切除去該料條,使該金屬盤體與複數引腳結合且形成獨立的元件。According to the above object and effect, the method for fabricating a base according to the present invention comprises a substrate holder forming step of forming a stent substrate by a metal material, and the stent substrate comprises a plurality of pins on a strip; The plating step is to plate the plating area of each of the bracket substrates, wherein the plating area is at least an end of the lead; the lead and the metal disc body assembly step guide the plated substrate to enter the injection mold. And arranging the metal disk body in the injection mold, and then assembling at one end of each of the pins; and inserting the mold into the plastic material step, after the mold is closed, the molten plastic material is injected into the injection mold, and the plastic material flows in. In the metal disk body, each of the pins is combined with the metal disk body; and the cutting tape step is performed by taking out a combination of the metal disk body and the holder substrate by an injection mold, and cutting and removing the material strip. The metal disk body is combined with a plurality of pins and forms a separate component.
以下茲舉出較佳實施例,並配合圖式詳細說明上述關於本發明所揭露的目的與功效。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments will be described, and the objects and effects disclosed above with respect to the present invention will be described in detail with reference to the drawings.
請參閱第3圖,圖中顯示製作一支架基材30的方式,其係取一金屬材料(連續狀的金屬帶材或片狀的金屬板材)31,藉由沖壓方式形成一料條32上具多支引腳34。上述的引腳34從自由端起可以定義一電鍍區域36;該電鍍區域36小於引腳34長度的二分之一;舉例而言,引腳34的長度若為15mm,則電鍍區域36不超過7.5mm;一般而言,依據不同形式的引腳34長度及方便電鍍加工的執行,電鍍區域36的長度多半落在1mm~5mm之間。Referring to FIG. 3, there is shown a manner of making a stent substrate 30 by taking a metal material (continuous metal strip or sheet metal sheet) 31 and forming a strip 32 by stamping. With multiple pins 34. The above-mentioned pin 34 can define a plating region 36 from the free end; the plating region 36 is smaller than one-half of the length of the pin 34; for example, if the length of the pin 34 is 15 mm, the plating region 36 does not exceed 7.5 mm; Generally speaking, according to the different lengths of the lead 34 and the implementation of the electroplating process, the length of the plating region 36 mostly falls between 1 mm and 5 mm.
第4圖顯示支架基材30可以相對一電鍍槽38且使各引腳34的電鍍區域36進入電鍍液內。藉此使電鍍區域36表面附著一層金屬;附著於電鍍區域36的金屬以金為佳。此外針對電鍍區域36進行限鍍之前,引腳34表面可以先行鍍上一層鎳。且金的電鍍厚度為0.05um~0.762um為較佳範圍。Figure 4 shows that the stent substrate 30 can be opposed to a plating bath 38 and the plating region 36 of each lead 34 into the plating solution. Thereby, a layer of metal is adhered to the surface of the plating region 36; the metal attached to the plating region 36 is preferably gold. In addition, prior to the plating of the plating region 36, the surface of the lead 34 may be first plated with a layer of nickel. The plating thickness of gold is preferably 0.05 um to 0.762 um.
請參閱第5圖及第6圖,取電鍍區36已電鍍的支架基材30併置且擺放在位一射出模具50(見第6圖)內,並且將金屬盤體40配置在各引腳34的一端。其中有一引腳作為接地用,在此重新命名為接地引腳35。Referring to FIG. 5 and FIG. 6, the plated substrate 30 which has been plated by the plating zone 36 is juxtaposed and placed in the position-injection mold 50 (see FIG. 6), and the metal disk 40 is disposed on each pin. One end of 34. One of the pins is used for grounding and is renamed here to ground pin 35.
請再參閱第6圖,更進一步而言,支架基材30係可以連續性的進入射出模具50內;再由適當的夾治具52夾持該支架基材30的各引腳34、接地引腳35及支撐該金屬盤體40,如此引腳34及接地引腳35的一端可以嵌入金屬盤體40,且金屬盤體40與各引腳34與接地引腳35形成穩固定位狀態。Please refer to FIG. 6 again. Further, the stent substrate 30 can enter the injection mold 50 continuously; and the pins 34 and the grounding lead of the stent substrate 30 are clamped by a suitable fixture 52. The leg 35 and the metal disk 40 are supported. Thus, one end of the pin 34 and the ground pin 35 can be embedded in the metal disk 40, and the metal disk 40 and each of the pins 34 and the ground pin 35 form a stable fixed state.
請參閱第7圖,射出模具50合模後,可將熔融的塑膠材料54注入射出模具50內,且塑膠材料54可流入該金屬盤體40內,使各引腳34與金屬盤體40結合;且接地引腳35的一端可受到模具50內面的沖頭56作用而以鉚接的形成與金屬盤體40結合。Referring to FIG. 7, after the injection mold 50 is clamped, the molten plastic material 54 can be injected into the injection mold 50, and the plastic material 54 can flow into the metal disk 40, so that the pins 34 are combined with the metal disk 40. And one end of the grounding pin 35 can be pressed by the punch 56 on the inner surface of the mold 50 to be combined with the metal disk 40 by the formation of the riveting.
接著取出金屬盤體40與支架基材30的組合,並進行裁切除去料條32,便可以使金屬盤體40與引腳34、接地引腳35的組合形成獨立的元件。Then, the combination of the metal disk 40 and the holder base material 30 is taken out, and the strip 32 is cut and removed, so that the combination of the metal disk 40 and the lead 34 and the ground pin 35 can form an independent component.
根據以上所描述的製作方法,本發明可歸納包含以下步驟如第8圖所示:支架基材沖製步驟61,係利用沖製方式獲得板狀或帶狀的料帶與多支引腳的組合;引腳限鍍步驟62,係將上述板狀或帶狀的料帶與多支引腳的組合,針對引腳所設定的電鍍區域進行電鍍。According to the manufacturing method described above, the present invention can be summarized as follows. As shown in FIG. 8, the scaffold substrate punching step 61 is performed by punching to obtain a plate-like or strip-shaped strip and a plurality of pins. The combination of the pin limit plating step 62 is a combination of the above-mentioned plate-shaped or strip-shaped strips and a plurality of pins, and is plated for the plating area set by the pins.
引腳與金屬盤體組立步驟63,係將限鍍後的支架基材送入射出模具內,且金屬盤體配置在模具入的預定位置,使得引腳一端插入金屬盤體;合模注入塑膠材料步驟64,係將熔融的塑膠材料注入模具內並填入引腳與金屬盤體之間,藉此使引腳與金屬盤體結合;裁切料帶步驟65,係將支架基材與金屬盤體的組合取出,並裁除支架基材的料帶;如此可以獲得顆粒狀的獨立底座。每一底座的金屬盤體皆配置有多支可供作電極的引腳及一接地引腳,且各引腳僅局部電鍍。Lead 63 is assembled with the metal disk body, and the plated substrate is sent to the mold, and the metal disk is placed at a predetermined position of the mold, so that one end of the pin is inserted into the metal disk; In step 64 of the material, the molten plastic material is injected into the mold and filled between the lead and the metal disk, thereby bonding the lead to the metal disk; and the cutting tape is step 65, which is to support the substrate and the metal. The combination of the disc bodies is removed and the strip of the stent substrate is removed; thus a granular, separate base can be obtained. The metal body of each base is provided with a plurality of pins for the electrodes and a ground pin, and each pin is only partially plated.
由以上的說明,本發明的設計具有以下功效:From the above description, the design of the present invention has the following effects:
1.因為引腳與料帶形成板狀或帶狀,所以有助於以連續性的結構與金屬盤體結合,提高製作效率並且改善習用底座需逐一製作的不便與費時的缺失;1. Since the lead and the strip are formed into a plate shape or a strip shape, it is advantageous to combine with the metal disc body in a continuous structure, thereby improving the manufacturing efficiency and improving the inconvenience and time-consuming lack of one-by-one fabrication of the conventional base;
2.因為本發明的接地引腳直接形成在料帶上,且與各引腳一同結合金屬盤體,故製作上比習知的焊接方式更簡便;2. Since the grounding pin of the present invention is directly formed on the tape and is combined with the metal disk body with each pin, it is easier to manufacture than the conventional welding method;
3.引腳鍍金的目的在於可作為打線的電極,然而電極所需的面積小,可以僅是引腳的局部甚至是端部即可;本發明所揭露的板狀或帶狀的支架基材可使引腳依據實際設計需求來進行限鍍,而習知結構則需進行全鍍,因此本發明可以降低成本;此外限鍍及結合金屬盤體時,本發明的引腳不易因受力而變形,而全鍍時,習知的引腳容易因底座的移動而產生變形,故本發明的產品良率可以提高;3. The purpose of the gold plating of the lead is to serve as the electrode for wire bonding. However, the required area of the electrode is small, and it may be only a part or even an end of the pin; the plate-shaped or strip-shaped stent substrate disclosed in the present invention The pin can be plated according to actual design requirements, and the conventional structure needs to be fully plated, so the invention can reduce the cost; in addition, when the metal plate body is plated and combined, the pin of the invention is not easy to be stressed. Deformation, and when fully plated, the conventional pin is easily deformed by the movement of the base, so the product yield of the present invention can be improved;
4.本發明以模射方式搭配塑膠材料使金屬盤體結合引腳,其成型時間短且不需要使用高溫爐具,而習用的結構以玻璃燒結方式使金屬盤體與引腳結合,製程時間長且需在高溫環境才能完成,因此本發明可以縮短製程時間且方便製作。4. The invention combines the plastic material with the molding method to bond the metal disk body to the lead, the molding time is short and the high-temperature stove is not needed, and the conventional structure combines the metal disk body and the pin by the glass sintering method, and the processing time It is long and needs to be completed in a high temperature environment, so the invention can shorten the process time and is convenient to manufacture.
請閱第9圖,本發明的另一實施方法包含一金屬盤體擺置定位步驟71用以將一金屬盤體配置在一射出模具的預設位置;以及一支架基材導入步驟72用以將已電鍍的支架基材引導進入該射出模具。Referring to FIG. 9, another embodiment of the present invention includes a metal disk body positioning and positioning step 71 for arranging a metal disk body at a predetermined position of the injection mold; and a holder substrate introduction step 72 for The plated stent substrate is guided into the injection mold.
當前述的二個步驟滿足後,即可如前一實施例依序進行引腳與金屬盤體組立步驟63、合模注入塑膠材料步驟64及裁切料帶步驟65,以獲得顆粒狀的獨立底座。每一底座的金屬盤體皆配置有多支可供作電極的引腳及一接地引腳,且各引腳僅局部電鍍。After the foregoing two steps are satisfied, the lead and metal disk assembly step 63, the mold injection plastic material step 64, and the cutting tape step 65 can be sequentially performed as in the previous embodiment to obtain a granular independent. Base. The metal body of each base is provided with a plurality of pins for the electrodes and a ground pin, and each pin is only partially plated.
前述的二個製作方法中,接地引腳35係受該射出模具50所具備之沖頭56的沖壓而鉚接金屬盤體40;然而沖壓工作也可以在射出模具50外以適當的沖頭進行沖壓。值得注意的是,接地引腳35的端面低陷於金屬盤體40端面,且低於0.05mm~0.1mm即可。In the two manufacturing methods described above, the grounding pin 35 is pressed by the punch 56 provided in the injection mold 50 to rive the metal disk 40; however, the punching operation may be performed by a suitable punch outside the injection mold 50. . It should be noted that the end face of the grounding pin 35 is trapped at the end surface of the metal disk 40 and is less than 0.05 mm to 0.1 mm.
請參閱第10~12圖,為了提高接地引腳35與金屬盤體40的鉚合效果,接地引腳35的側邊可以形成凹空352且用以夾合金屬盤體20;至於第10~12圖的不同在於沖頭80a~80c的端面結構不同,致使沖頭80a~80c作用於接地引腳35端面後,會形成不同的結構形式。Referring to FIGS. 10-12, in order to improve the riveting effect of the ground pin 35 and the metal disk 40, the side of the ground pin 35 may form a recess 352 for clamping the metal disk 20; The difference between the 12 figures is that the end faces of the punches 80a to 80c are different in structure, so that the punches 80a to 80c act on the end faces of the ground pins 35, and different structural forms are formed.
其他可用以提高接地引腳35與金屬盤體40鉚合效果的結構如第13圖,其在接地引腳35的外緣形成凸部354且承載金屬盤體40;俟沖頭80a沖壓作用於接地引腳35的端面,則接地引腳35的端面凹陷低於金屬盤體40端面,且搭配凸部354鉚合金屬盤體40。Other structures that can be used to improve the riveting effect of the ground pin 35 and the metal disk 40 are as shown in FIG. 13, which form a convex portion 354 at the outer edge of the ground pin 35 and carry the metal disk 40; the punch 80a is stamped on The end surface of the ground pin 35 is recessed toward the end surface of the metal disk 40, and the metal disk 40 is riveted with the convex portion 354.
第14圖顯示另一藉沖頭80a沖壓接地引腳35來提高接地引腳35與金屬盤體40鉚合效果的結構。其與第13圖的不同在接地引腳35的外緣形成一凹部356。Fig. 14 shows another structure in which the borrowing head 80a punches the grounding pin 35 to improve the riveting effect of the grounding pin 35 and the metal disk 40. It forms a recess 356 at the outer edge of the ground pin 35, unlike the one in FIG.
請參閱第15圖,又一提高接地引腳35與金屬盤體40鉚合效果的結構,係在合模注入塑膠材料時,使塑膠材料54一部分位在該金屬盤體40外部底面。此種方式可在射出模具上預留出一個空間相對金屬盤體40的底部,而填入該空間的塑膠材料54形成一延伸部542,其可對金屬盤體40與引腳34、接地引腳35的結合提供固定效果。Referring to FIG. 15, another structure for improving the riveting effect of the grounding pin 35 and the metal disk 40 is to position a portion of the plastic material 54 on the outer bottom surface of the metal disk 40 when the plastic material is injected. In this way, a space can be reserved on the injection mold opposite to the bottom of the metal disk 40, and the plastic material 54 filled in the space forms an extension portion 542 which can be used for the metal disk 40 and the lead 34 and the grounding lead. The combination of the feet 35 provides a fixed effect.
請參閱第16圖至第19圖,圖中的接地引腳35表面具有第一嚙合構造358,且第一嚙合構造358與塑膠材料54能夠形成牢固結合。該第一嚙合構造358依圖序分別為凹空、凸緣、穿孔及壓花。Referring to Figures 16 through 19, the surface of the ground pin 35 has a first engagement formation 358, and the first engagement formation 358 is capable of forming a secure bond with the plastic material 54. The first engagement formation 358 is concave, flanged, perforated, and embossed, respectively, in the order of the drawings.
請參閱第20圖至第23圖,圖中的金屬盤體40具有第二嚙合構造402,且第二嚙合構造402與塑膠材料54能夠形成牢固結合。該第一嚙合構造358依圖序分別為凹空、凸緣、倒角及橋接。Referring to Figures 20 through 23, the metal disk 40 of the Figure has a second engagement formation 402, and the second engagement formation 402 is capable of forming a secure bond with the plastic material 54. The first engagement structure 358 is hollow, flanged, chamfered, and bridged, respectively, in the order of the drawings.
上述實施例僅為例示性說明本創作之技術及其功效,而非用於限制本創作。任何熟於此項技術人士均可在不違背本創作之技術原理及精神的情況下,對上述實施例進行修改及變化,因此本創作之權利保護範圍應如後所述之申請專利範圍所列The above embodiments are merely illustrative of the techniques of the present invention and their effects, and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above embodiments without violating the technical principles and spirit of this creation. Therefore, the scope of protection of this creation should be as listed in the patent application scope mentioned later.
10...底座10. . . Base
11...金屬盤體11. . . Metal plate
12...引腳12. . . Pin
13...玻璃材料13. . . Glass material
14...接地引腳14. . . Ground pin
21...備料步驟twenty one. . . Preparation step
22...引腳組立步驟twenty two. . . Pin assembly step
23...燒結步驟twenty three. . . Sintering step
24...接地引腳焊接組立步驟twenty four. . . Ground pin soldering assembly step
25...全鍍步驟25. . . Full plating step
30...支架基材30. . . Bracket substrate
31...金屬材料31. . . metallic material
32...料帶32. . . Strip
34...引腳34. . . Pin
35...接地引腳35. . . Ground pin
352...凹空352. . . Hollow
354...凸部354. . . Convex
356...凹部356. . . Concave
358...第一嚙合構造358. . . First meshing structure
36...電鍍區域36. . . Plating area
38...電鍍槽38. . . Plating tank
40...金屬盤體40. . . Metal plate
402...第二嚙合構造402. . . Second meshing structure
50...射出模具50. . . Injection mold
52...夾治具52. . . Fixture
54...塑膠材料54. . . Plastic material
542...延伸部542. . . Extension
56...沖頭56. . . shower
61...支架基材沖製步驟61. . . Bracket substrate stamping step
62...引腳限鍍步驟62. . . Pin limit plating step
63...引腳與金屬盤體組立步驟63. . . Pin and metal disk assembly steps
64...合模注入塑膠材料步驟64. . . Step of injection molding plastic material
65...裁切料帶步驟65. . . Cutting strip step
71...金屬盤體擺置定位步驟71. . . Metal plate positioning positioning step
72...支架基材導入步驟72. . . Bracket substrate introduction step
80a~80c...沖頭80a~80c. . . shower
第1圖係習知底座的製作示意圖。Figure 1 is a schematic view of the fabrication of a conventional base.
第2圖係習知底座的製作步驟方塊圖。Figure 2 is a block diagram of the manufacturing steps of the conventional base.
第3圖係本發明支架基材製作示意圖。Figure 3 is a schematic view showing the fabrication of the stent substrate of the present invention.
第4圖係本發明支架基材限鍍示意圖。Fig. 4 is a schematic view showing the limitation of plating of the stent substrate of the present invention.
第5圖係本發明金屬盤體配置在各引腳上的外觀圖。Fig. 5 is an external view showing the arrangement of the metal disk of the present invention on each of the leads.
第6圖係本發明金屬盤體與各引腳位於射出模具內的示意圖。Figure 6 is a schematic view showing the metal disk of the present invention and the respective pins in the injection mold.
第7圖係本發明合模且注入塑膠材料的示意圖。Figure 7 is a schematic view of the present invention in which the mold is clamped and injected into a plastic material.
第8圖係本發明實施例一的製作步驟方塊圖。Figure 8 is a block diagram showing the manufacturing steps of the first embodiment of the present invention.
第9圖係本發明實施例二的製作步驟方塊圖。Figure 9 is a block diagram showing the manufacturing steps of the second embodiment of the present invention.
第10圖係本發明對接地引腳進行沖壓的示意圖一。Figure 10 is a schematic view of the invention for stamping a ground pin.
第11圖係本發明對接地引腳進行沖壓的示意圖二。Figure 11 is a schematic view 2 of the present invention for stamping a ground pin.
第12圖係本發明對接地引腳進行沖壓的示意圖三。Figure 12 is a schematic view of the third embodiment of the present invention for stamping a ground pin.
第13圖係本發明對接地引腳進行沖壓的示意圖四。Figure 13 is a schematic view of the fourth embodiment of the present invention for stamping a ground pin.
第14圖係本發明對接地引腳進行沖壓的示意圖五。Figure 14 is a schematic view 5 of the present invention for stamping a ground pin.
第15圖係本發明對接地引腳搭配延伸部結合金屬盤體的結構示意圖。Figure 15 is a schematic view showing the structure of the grounding pin with the extension portion combined with the metal disk body.
第16圖係本發明接地引腳與塑膠材料結合的結構示意圖一。Figure 16 is a schematic view showing the structure of the grounding pin of the present invention combined with a plastic material.
第17圖係本發明接地引腳與塑膠材料結合的結構示意圖二。Figure 17 is a schematic view showing the structure of the grounding pin of the present invention combined with a plastic material.
第18圖係本發明接地引腳與塑膠材料結合的結構示意圖三。Figure 18 is a schematic structural view 3 of the grounding pin of the present invention combined with a plastic material.
第19圖係本發明接地引腳與塑膠材料結合的結構示意圖四。Figure 19 is a schematic view showing the structure of the grounding pin of the present invention combined with a plastic material.
第20圖係本發明金屬盤體與塑膠材料結合的結構示意圖一。Figure 20 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.
第21圖係本發明金屬盤體與塑膠材料結合的結構示意圖二。Figure 21 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.
第22圖係本發明金屬盤體與塑膠材料結合的結構示意圖三。Figure 22 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.
第23圖係本發明金屬盤體與塑膠材料結合的結構示意圖四。Figure 23 is a schematic view showing the structure of the metal disk of the present invention combined with a plastic material.
61...支架基材沖製步驟61. . . Bracket substrate stamping step
62...引腳限鍍步驟62. . . Pin limit plating step
63...引腳與金屬盤體組立步驟63. . . Pin and metal disk assembly steps
64...合模注入塑膠材料步驟64. . . Step of injection molding plastic material
65...裁切料帶步驟65. . . Cutting strip step
Claims (30)
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TW98145273A TWI430328B (en) | 2009-12-28 | 2009-12-28 | Method of making base of photovoltaic element |
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TW98145273A TWI430328B (en) | 2009-12-28 | 2009-12-28 | Method of making base of photovoltaic element |
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TWI430328B true TWI430328B (en) | 2014-03-11 |
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