TWI428060B - Lighting devices and fabrication methods thereof - Google Patents

Description

Lighting device and manufacturing method thereof

The invention relates to a lighting device, in particular to a lighting diode lighting device capable of operating under a direct current power source and under an alternating current power source without an alternating current/direct current converter.

Due to its durability, long life, light weight, low power consumption and no harmful substances (such as mercury), the use of light-emitting diode (LED) lighting technology has become a very important development direction for the lighting industry and the semiconductor industry in the future. In general, the light-emitting diode system is widely used in white light illumination devices, indicator lights, vehicle signal lights, automotive headlights, flashlights, backlight modules for liquid crystal displays, light sources for projectors, outdoor display units, and the like.

The current LED light source cannot be directly operated under AC power, so an AC/DC converter is needed to convert the AC power into a DC power source for the LED source. However, the AC/DC converter increases the cost, size and weight of the product and consumes more power, which is detrimental to the portability of the product. Therefore, there is a need for a light-emitting diode illumination device that can operate under DC power and under AC power without the need for an AC/DC converter.

The invention provides a lighting device comprising a first voltage feeding point, a second voltage feeding point, a first micro light emitting unit, a second micro light emitting unit and a selecting unit. The first and second micro-light-emitting units respectively comprise two anti-parallel diode micro-grains. The selection unit is electrically connected to the first micro-light-emitting unit and the second micro-light-emitting unit, and the first micro-light-emitting unit and the second micro-light-emitting unit are connected in parallel at a first voltage or in series at a second voltage. The first micro-light-emitting unit and the second micro-light-emitting unit are electrically connected between the first voltage feeding point and the second voltage feeding point, and the second voltage is higher than the first voltage.

The present invention also provides another illumination device including a substrate, a first voltage feed point, a second voltage feed point, a first micro light emitting unit, a second micro light emitting unit, and a selection unit. The first micro-light-emitting unit and the second micro-light-emitting unit are formed on the substrate by a semiconductor process, and are electrically connected between the first voltage feeding point and the second voltage feeding point. The selection unit is electrically connected to the first micro-light-emitting unit and the second micro-light-emitting unit, and the first micro-light-emitting unit and the second micro-light-emitting unit are connected in parallel at a first voltage or in series at a second voltage. And the second voltage is higher than the first voltage.

The invention also provides a method for fabricating a lighting device, comprising: forming a first diode microcrystal and a second diode microcrystal on a substrate by a semiconductor process; providing a low voltage to make the first The diode microcrystals and the second diode microcrystals are connected in parallel; and a high voltage is provided to connect the first diode microcrystals and the second diode microcrystals in series, wherein the high voltage is greater than the low voltage .

The present invention also provides a method for fabricating another illumination device, comprising: forming a first diode microcrystal and a second diode microcrystal on a substrate by a semiconductor process; forming a first loop Between a diode microcrystal and a second diode microcrystal; forming a second loop between the first diode microcrystal and the second dipole microcrystal; and providing a selection unit And conducting a first loop or a second loop according to a first voltage or a second voltage, wherein the first voltage is not equal to the second voltage.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

Figure 1 is an embodiment of a lighting device of the present invention. As shown, the illumination device 100 includes a lighting module 30 and a selection unit 50. The illumination module 30 includes a plurality of diode micro-grains 34 formed on a substrate 20 and a conductive wire pattern 19A for connecting the diode micro-grains 34. The substrate 20 is an insulating substrate, an insulating material or a structure that can be used to electrically isolate each of the diode micro-grains 34.

The wire structure 19A includes a plurality of wires (not labeled) for connecting the diode microcrystals 34 into a string of micro-light-emitting units 21, and a plurality of wires (ie, 31a-31e) for connecting the diode micro-crystals 34 to the selection. The unit 50 and the complex voltage feed points (ie, 32a-32e) are used to receive the voltage provided by the power source 40 by the selection unit 50. For example, the wire structure 19A may be composed of a plurality of wires on the substrate 20 and/or a plurality of wires on a submount shown in FIG. 7, but is not limited thereto. Each of the micro-light-emitting units 21 includes at least two diode micro-grains 34 connected in parallel, but is not limited thereto. In some embodiments, each of the micro-lighting units 21 includes more diode micro-grains 34 connected in parallel, in series, or in series-parallel. In other words, the diode micro-crystals 34 on the substrate 20 can be connected into a plurality of micro-light-emitting units 21 in parallel or in series and in parallel.

For example, the power source 40 can be a direct current power source or an alternating current power source. The diode microcrystals are light-emitting elements that can adjust their operating power according to different operating voltages. For example, the diode micro-grain can be micro-light emitting diodes (micro-LEDs) or micro-laser diodes (micro LDs), but It is not limited to this. As shown, the voltage feed points 32a-32e are connected to the selection unit 50 by corresponding wires 31a-31e.

The selection unit 50 is coupled between the power source 40 and the illumination module 30 for controlling the power source 40 to supply current through the two of the wires 31a to 31e for supplying power to the one or more micro-light-emitting units 21. In other words, the selecting unit 50 selects at least two of the voltage feeding points 32a-32e, and couples the voltage provided by the power source 40 to the micro-lighting unit 21 by the selected voltage feeding point, so that the A portion of the string of micro-lighting units 21 forms at least one loop with the power source 40 to conduct the diode micro-grains 34 on the loop.

When the voltage feed points 32a and 32c are selected by the selection unit 50, a higher voltage (VDD) and a lower voltage (GND) provided by the power source 40 are coupled to the wires 31a and 31c. Connected into a string of N diode micro-grains 34. Therefore, the N diode micro-die 34 and the power source 40 form a loop by the wires 31a and 31c, that is, the wires 31a and 31c are respectively coupled to the first and second electrodes (not shown) of the power source 40. If the power source 40 is an AC power source, when the voltages on the first and second electrodes are negative (low level) and positive (high level), respectively, for example, in one positive half cycle of the power source 40, the lower column N The diode micro-grains 34 are biased (conducted) in the forward direction. Conversely, when the voltages on the first and second electrodes are positive (high level) and negative (low level), respectively, for example, in one negative half cycle of the power source 40, the upper column of N diodes The die 34 is biased (conducted) in the forward direction.

If the power source 40 is a DC power source, when the voltages on the first and second electrodes are negative (low level) and positive (high level), the following N diode micro-crystals 34 are forwarded. Bias (conducting). Conversely, when the voltages on the first and second electrodes are positive (high level) and negative (low level), respectively, the upper row of N diode micro-grains 34 are forward biased (conducted) ).

When voltage feed points 32a and 32d are selected by selection unit 50, one of the higher voltages (VDD) and a lower voltage (GND) provided by power supply 40 is coupled to the wires 31a and 31d. Connected into a string of N+1 diode micro-grains 34. Therefore, the N+1 diode micro-chips 34 and the power source 40 form a loop by the wires 31a and 31d, that is, the wires 31a and 31d are respectively coupled to the first and second electrodes of the power source 40. If the power source 40 is an AC power source, when the voltages on the first and second electrodes are negative and positive, respectively, for example, in one positive half cycle of the power source 40, the following column of N+1 diode microcrystals The 34 series is biased in the forward direction. Conversely, when the voltages on the first and second electrodes are positive and negative, respectively, for example, in one negative half cycle of the power source 40, the upper row of N+1 diode micro-grains 34 are forward-biased. Pressure.

When the voltage feeding points 32a and 32e are selected by the selecting unit 50, the voltage supplied from the power source 40 is coupled to the N+2 diode micro-grains 34 connected by the wires 31a and 31e. The N+2 diode micro-die 34 and the power source 40 are formed in a loop by the wires 31a and 31e.

For example, the equivalent withstand voltage of the N diode micro-die 34 connected in series may be Vn, and the equivalent withstand voltage of the N+1 diode micro-chips 34 connected in series may be Vn+ The equivalent withstand voltage of 1, N + 2 diode micro-grains 34 connected in series may be Vn + 2, and so on. If the voltage of the power source 40 is lower than the equivalent withstand voltage Vn+1 of the N+1 diode micro-chips 34, the selection unit 50 selects the voltage feeding points 32a and 32c so that the power source 40 provides The voltage is coupled to a series of N diode micro-grains 34 connected by wires 31a and 31c. Or, when the voltage of the power source 40 is higher than the equivalent withstand voltage Vn+1 of the series connection of the N+1 diode micro-chips 34, the selection unit 50 selects the voltage feeding points 32a and 32e, so that The voltage provided by the power source 40 is coupled to a series of N+2 diode micro-dies 34 connected by wires 31a and 31e. In other words, the selection unit 50 selects a voltage feed point to change the diode microcrystals biased by the power source 40 according to the relationship between the power source 40 and the equivalent withstand voltage of the diode microchips 34 connected in series. The number of particles is used to solve the variation caused by the equivalent withstand voltage of the semiconductor process.

Figure 2 is another embodiment of a lighting device. As shown, the illumination device 200 is similar to the illumination device 100 shown in FIG. 1 with the difference that the illumination module 30 is divided into two sub-lighting modules 39a and 39b, and the selection unit 50 is based on the power source 40. The magnitude of the voltage is selected from at least two of the voltage feed points 37a-37c such that the power supply 40 provides a voltage to the diode micro-dies 34 by the wires connected by the selected voltage feed-in points.

For example, the illumination module 30 includes N micro-light-emitting units 21, and the sub-lighting modules 39a and 39b each include N/2 micro-light-emitting units 21, and each of the micro-light-emitting units 21 includes two anti-parallel connections. The diode is microcrystalline, but is not limited thereto. In other embodiments, the secondary lighting modules 39a and 39b may also include different numbers of micro-lighting units 21.

When the power source 40 is AC 220V, the selection unit 50 selects the voltage feed points 37a and 37c so that the power source 40 supplies voltage by the voltage feed points 37a and 37c and the wires 38a and 38c. In other words, the wires 38a and 38c are respectively coupled to the first and second electrodes (not shown) of the power source 40, and the entire lighting module 30 and the power source 40 form a loop by the wires 38a and 38c. Therefore, when the voltages on the first and second electrodes are negative and positive, respectively, for example, during the positive half cycle of the power source 40, the lower series of diode micro-grains 34 are forward biased (conducted). Conversely, when the voltages on the first and second electrodes are positive and negative, respectively, such as the negative half cycle of the power source 40, the upper series of diode micro-dies 34 are forward biased (conducted).

In addition, the illumination device 200 can also be powered by a 220V power supply. For example, if the power source 40 is a DC power source, when the voltages on the first and second electrodes are negative and positive, respectively, the lower series of N diode micro-chips 34 are forward biased (ie, Turn on). Conversely, when the voltages on the first and second electrodes are positive and negative, respectively, the upper series of N diode micro-grains 34 are forward biased (ie, turned on).

When the power source 40 is AC 110V, the selection unit 50 selects three voltage feeding points 37a-37c, so that the power source 40 supplies voltage through the wires 38a-38c, and the secondary lighting modules 39a and 39b and the power source 40 borrow Two loops are formed by the wires 38a to 38c. For example, the secondary lighting module 39a and the power source 40 form a first loop by the wires 38a-38b, and the secondary lighting module 39b and the power source 40 form a second loop by the wires 38b-38c. In other words, the wires 38a and 38c are coupled to one of the first electrodes of the power source 40, and the wires 38b are coupled to one of the second electrodes of the power source 40. Therefore, when the voltages on the first and second electrodes are positive and negative, respectively, that is, the negative half cycle of the power source 40, the series of N/2 diode microcrystals located above the sub-lighting module 39a 34 and the string of N/2 diode micro-grains 34 located below in the sub-lighting module 39b are forward biased (conducted). Conversely, when the voltages on the first and second electrodes are negative and positive, respectively, that is, the positive half cycle of the power source 40, the string of N/2 diodes located below the sub-lighting module 39a The die 34 and the string of N/2 diode micro-dies 34 located above the secondary illumination module 39b are forward biased (conducted).

In view of this, the lighting device 200 can select an appropriate circuit according to the voltage of the power source 40, so that it can operate under AC 220V, AC 110V, DC 220V and DC 110V.

Figure 3 is an embodiment of a selection unit. As shown, the selection unit 50 includes an authentication unit 53 and an output unit 54. The identification unit 53 is coupled to the power source 40 for determining the voltage level of the power source 40 and generating a result signal SM. The output unit 54 is coupled to the power source 40 and the authentication unit 53 for selectively coupling the power source to the at least two voltage feed points according to the result signal SM.

For example, when the power source 40 is AC/DC 220V, the authentication unit 53 generates a result signal SM to the output unit 54, so that the output unit 54 outputs the voltage from the power source 40 to the voltage feed point 37a according to the wires 38a and 38c. 37c. In other words, the wires 38a and 38c are respectively coupled to the first and second electrodes of the power source 40, and the entire lighting module 30 and the power source 40 form a loop by the wires 38a and 38c.

When the power source 40 is AC/DC 110V, the authentication unit 53 generates a result signal SM to the output unit 54, so that the output unit 54 outputs the voltage from the power source 40 to the voltage feed points 37a to 37c according to the wires 38a to 38c. In other words, the wires 38a and 38c are coupled to the first electrode of the power source 40, and the wire 38b is coupled to the second electrode of the power source 40. Therefore, the secondary lighting module 39a and the power source 40 form a first loop by the wires 38a and 38b, and the secondary lighting module 39b and the power source 40 form a second loop by the wires 38b and 38c.

Figure 4 is another embodiment of a lighting device. As shown, the illumination device 300 is similar to the illumination device shown in FIG. 1 except that the illumination module 30 includes three sub-lighting modules 39c-39e, each including a string of micro-lighting units 21, and is selected. The unit 50 selects at least two of the voltage feeding points 33a to 33d according to a power setting signal SP, so that the power source 40 supplies a voltage to the diode microcrystals 34 through the wires connected to the selected voltage feeding points. . As shown, each of the micro-light-emitting units 21 includes at least two diode micro-grains 34 connected in anti-parallel, but is not limited thereto. In some embodiments, each of the micro-lighting units 21 also includes more than three diode micro-grains 34 connected in series, in parallel, or in series-parallel. In other words, the diode micro-crystals 34 on the substrate 20 can be connected into a plurality of micro-light-emitting units 21 connected in series, in parallel or in series-parallel.

When the power setting signal SP represents a first state, the selecting unit 50 selects the voltage feeding points 33d and 33a, and couples the wires 36d and 36a to the first and second electrodes of the power source 40, respectively. Therefore, the power source 40 and the string of micro-lighting units 21 in the sub-lighting module 39c form a loop. When the voltages on the first and second electrodes are negative and positive, respectively, the diodes 34 in the upper sub-module 39c are biased (conducted) in the forward direction. Conversely, when the voltages on the first and second electrodes are positive and negative, respectively, the lower series of micro-die 34 in the sub-lighting module 39c is biased (conducted) in the forward direction.

When the power setting signal SP represents a second state, the selecting unit 50 selects the voltage feeding points 33d, 33a and 33b, and couples the wire 36d to the first electrode of the power source 40, and the wires 36a and 36b are coupled to The second power source of the power source 40. Therefore, the power supply 40 and the string of micro-lighting units 21 in the sub-lighting module 39c form a first loop, and the power source 40 and the string of micro-lighting units 21 in the sub-lighting module 39d form a second loop. When the voltages on the first and second electrodes are negative and positive, respectively, the string of diodes 34 located above the secondary illumination modules 39c and 39d are forward biased (conducted). Conversely, when the voltages on the first and second electrodes are positive and negative, respectively, the lower series of diodes 34 in the sub-lighting modules 39c and 39d are forward biased (conducted).

When the power setting signal SP represents a third state, the selecting unit 50 selects the voltage feeding points 33a to 33d, and couples the wire 36d to the first electrode of the power source 40, and the wires 36a to 36c are coupled to the power source 40. The second power source. Therefore, the power supply 40 and the string of micro-lighting units 21 in the sub-lighting module 39c form a first loop, and the string of micro-lighting units 21 in the power source 40 and the sub-lighting module 39d form a second loop, the power source 40 and the sub-lighting mode. The string of micro-lighting units 21 in group 39e will form a third loop. When the voltages on the first and second electrodes are negative and positive, respectively, the plurality of diode micro-grains 34 located above the secondary illumination modules 39c-39e are forward biased (conducted). Conversely, when the voltages on the first and second electrodes are positive and negative, respectively, the lower-order diode micro-grains 34 in the sub-lighting modules 39c-39e are forward biased (conducted).

It can be seen that the illumination device 300 can selectively bias one or more strings of the micro-light-emitting units 21 according to a power setting signal SP to adjust the luminous power thereof.

Figure 5 is another embodiment of a lighting device. As shown, the lighting device 400 includes a lighting module 30, a power source 40, and a selection unit 50. The power source 40 can be a direct current power source or an alternating current power source. The illumination module 30 includes a plurality of diode microcrystals 34_1~34_8 formed on a substrate 20, and a conductor structure 19B for connecting the diode microcrystals 34_1~34_8. The substrate 20 is an insulating substrate, an insulating material or a structure that can be used to electrically isolate each of the diode micro-grains 34_1~34_8.

The wire structure 19B includes a plurality of wires 45 for connecting the diode microcrystals 34_1~34_8 into two strings (columns) and coupled to the selection unit 50, and the plurality of voltage feeding points 46a to 46j for selecting cells by 50 receives the voltage provided by the power source 40. For example, the wire structure 19B is composed of a plurality of wires on the substrate 20 and/or a plurality of wires on a substrate 22, but is not limited thereto. In some embodiments, the diode microcrystals 34_1~34_8 are light emitting diode microcrystals or laser diode microcrystals, but are not limited thereto.

The selecting unit 50 selectively supplies the voltage supplied from the power source 40 to the voltage feeding points 46a to 46j by judging that the power source 40 is a DC power source or an AC power source. The selecting unit 50 includes a discriminating unit 53", a plurality of blocking units 44, an inductor L0, a capacitor C0, and alternating current and direct current electrodes AC1, AC2, DC1 and DC2. As shown, the voltage is fed to the point 46a by the wire 45, 46c, 46e, 46g, and 46i are coupled to the DC electrode DC1, the voltage feeding points 46b, 46d, 46f, 46h, and 46j are coupled to the DC electrode DC2, and the voltage feeding points 46e and 46j are coupled to the AC electrode AC1. The voltage feed points 46a and 46f are coupled to the AC electrode AC2.

The identification unit 53 is configured to determine that the power source 40 is a DC power source or an AC power source, and generates a determination result SC for controlling the blocking unit 44. The inductor L0 is coupled between the power source 40 and the DC electrode DC1 to isolate the AC signal. The capacitor C0 is coupled between the power source 40 and the AC electrode AC1 for isolating the DC signal. The blocking unit 44 is coupled between the wire structure 19B and the AC and DC electrodes AC1, AC2, DC1 and DC2 for powering The isolated AC, DC electrodes AC1, AC2, DC1 and DC2 and the voltage feed points 46a to 46j of the conductor structure 19B.

For example, when the power source 40 is a DC power source, the obtained judgment result SC controls the blocking unit 44 to electrically isolate the AC electrodes AC1 and AC2 from the voltage feeding points 46a, 46e, 46f and 46j, and simultaneously feeds the voltage. The in points 46b~46e and 46g~46j are respectively coupled to the DC electrodes DC1 and DC2. A higher voltage (eg, VDD) of the power supply 40 is coupled to the voltage feed points 46g, 46c, 46i, and 46e by the inductor L0 and the DC electrode DC1, and a lower voltage (eg, GND) of the power supply 40 is The DC electrode DC2 is coupled to the voltage feed points 46b, 46h, 46d and 46j. Therefore, the diode micro-crystals 34_2, 34_4, 34_6, and 34_8 are individually biased (conducted) by the power source 40. In other words, the power source 40 and the diode micro-dies 34_2, 34_4, 34_6, and 34_8 form four loops by the DC electrodes DC1 and DC2 and the wire structure 19B (i.e., the wires on the illumination module 30).

Conversely, when the power source 40 is an AC power source, the obtained judgment result SC controls the blocking unit 44 to electrically isolate the DC electrodes DC1 and DC2 from the voltage feeding points 46a to 46j while feeding the voltage to the point 46e and 46j is coupled to the AC electrode AC1 and couples the voltage feed points 46a and 46f to the AC electrode AC2. During the positive half cycle of the power supply 40, the power supply 40 biases the diode micro-crystals 34_1~34_4 forwardly (conducting) by the capacitor C0 and the AC electrodes AC1 and AC2, and the diode micro-crystal 34_5~ 34_8 reverse bias (cutoff). During the negative half cycle of the power supply 40, the power supply 40 reverse biases (turns off) the diode micro-dies 34_1~34_4 by the capacitor C0 and the AC electrodes AC1 and AC2, and the diode micro-crystal 34_5~ 34_8 forward bias (conduction). Therefore, the two series of diode micro-crystals 34_1~34_4 and 34_5~34_8 are alternately biased forward by the power source 40. In other words, the power source 40 and the diode microcrystals 34_1~34_8 form two loops through the AC electrodes AC1 and AC2 and the conductor structure 19B (ie, the wires on the illumination module 30).

In operation, the lighting device 400 determines that the power source 40 is a DC power source or an AC power source, and according to the determination result, the power source 40 is coupled to the corresponding DC electrodes DC1 and DC2 or the AC electrodes AC1 and AC2 to select different voltage feeding points. Different types of power supplies are used. Therefore, the lighting device 400 can be powered by a DC power source or an AC power source without requiring AC-DC power conversion.

Figure 6 is an embodiment of a lighting device. As shown, the illumination device 500 is similar to the illumination device 400 shown in FIG. 5, with the difference that the blocking unit 44 is omitted, and the AC electrodes AC1 and AC2 and the DC electrodes DC1 and DC2 are not fixed but movable. Style.

The illumination device 500 can be formed according to the following steps. First, as shown in FIG. 7, a plurality of diode microcrystals 34_1~34_8 are formed on a substrate 20 by a general semiconductor process, wherein the diode microcrystals 34_1~34_8 are on the substrate 20. The wires are connected in two strings. For example, the diode microcrystals 34_1~34_4 are connected in a first string, and the diode microcrystals 34_5~34_8 are connected in a second string. Next, as shown in FIG. 8, a bottom plate 22 is provided with a plurality of wires 45 thereon, and the substrate 20 having the diode microcrystals 34_1 34 34_8 is disposed above the bottom plate 22. As shown in FIG. 9, the wires 45 on the bottom plate 22 and the diode microcrystals 34_1 to 34_8 are electrically connected by a flip-chip bonding technique. Finally, the DC and AC electrodes DC1, DC2, AC1 and AC2 are movably disposed above the bottom plate 22 to complete the illumination device 500 shown in FIG.

As shown in FIG. 10, the DC electrodes DC1 and DC2, which are the positive and negative electrodes of the DC power source, are moved to be disposed on the bottom plate 22 to be electrically connected to the wires 45 such that one of the DC power sources has a higher voltage (for example, VDD) is supplied to voltage feed points 46g, 46c, 46i and 46e, and a lower voltage (e.g., GND) of the DC power source is supplied to voltage feed points 46b, 46h, 46d and 46j. Therefore, the DC power source and the diode micro-dies 34_2, 34_4, 34_6 and 34_8 form four loops, that is, each of the diode micro-dies 34_2, 34_4, 34_6 and 34_8 are individually biased by the DC power source.

Or, as shown in FIG. 11, the DC electrodes DC1 and DC2, which are the negative electrode and the positive electrode of the DC power source, are moved to be disposed on the bottom plate 22 to be electrically connected to the wires 45, so that one of the DC power sources is A higher voltage (e.g., VDD) is supplied to voltage feed points 46f, 46b, 46h, and 46d, and a lower voltage (e.g., GND) of the DC power supply is supplied to voltage feed points 46a, 46g, 46c, and 46i. . Therefore, the DC power source and the diode micro-dies 34_1, 34_3, 34_5 and 34_7 form four loops, that is, each of the diode micro-dies 34_1, 34_3, 34_5 and 34_7 are individually biased by a DC power source.

As shown in FIG. 12, the AC electrodes AC1 and AC2 are moved to be disposed on the bottom plate 22 to be electrically connected to the wires 45, so the series of diodes between the AC power source and the voltage feed points 46a and 46e. The microcrystals 34_1~34_4 form a first loop and form a second loop with the series of diode microcrystals 34_5~34_8 between the voltage feed points 46f and 46j. During one positive half cycle of the AC power source, the diodes 34_1~34_4 in the first loop are forward biased (conducted), and in one negative half cycle of the AC power source, the diodes in the second loop 34_5~34_8 will be forward biased (conducted). It can be seen that the illumination device 500 can select voltage feed points 46a, 46e, 46f and 46j for coupling to an AC power source.

In this embodiment, the illumination device 500 selects different sets of voltage feed points by the AC electrodes AC1 and AC2 and the DC electrodes DC1 and DC2, so that the illumination device 500 can be replaced by AC-DC conversion. AC power or DC power. In addition, since the diode microcrystals are individually biased by the DC power source, the DC power source can be a low voltage power source.

Figure 13 is another embodiment of a lighting device. As shown, the illumination device 600 includes a plurality of diode micro-crystals 34_1~34_8 formed on a substrate (not shown), and a bottom plate 24 having a wire structure 19C (ie, a wire 47) thereon. An electrode module 70 and a second electrode module 80 (shown in FIG. 17), wherein the first and second electrode modules 70 and 80 are movably disposed on the bottom plate 24. The diode micro-grains 34_1~34_8 are electrically connected to the corresponding wires 47 on the substrate by flip chip bonding. The first electrode module 70 includes a plurality of alternating current electrodes 72 and a plurality of insulating portions 74. Each of the insulating portions 74 is disposed between the two alternating current electrodes 72 for electrically isolating the two adjacent alternating current electrodes 72. When the AC electrode 72 in the first electrode module 70 is electrically connected to the wire 47 on the bottom plate 24, the diode micro-crystals 34_1~34_8 are connected into a string of micro-light-emitting units 21 as shown in FIG. It is shown that each of the micro-light-emitting units 21 includes two diode micro-crystals connected in parallel.

Figure 14 is an equivalent circuit diagram of one of the illumination devices shown in Figure 13. As shown in FIG. 14, when the first electrode module 70 is electrically coupled to an AC power source, the series of diode micro-crystals 34_1~34_4 between the AC power source and the voltage feeding points 47a and 47e form a first The first loop and the series of diode micro-grains 34_5~34_8 between the voltage feed points 47a and 47e form a second loop. In other words, the voltage feed points 47a and 47e are selected to be coupled to the AC power source such that the diode micro-dies 34_1~34_8 form two loops with the AC power source. The diode microcrystals 34_1~34_4 in the first loop are connected in the first half cycle (ie, the positive half cycle) of the alternating current power source, and the diode microcrystals 34_5~ in the second loop. The 34_8 is lined up in the second half cycle of the AC power supply (ie, the negative half cycle).

In some embodiments, each of the diode micro-grains 34_1~34_8 can be replaced by two diode micro-grains as shown in FIG. For example, the diode micro-grain 34_1 can be replaced by the diode micro-grains 34_1A and 34_1B, and the diode micro-grain 34_2 can be replaced by the diode micro-grains 34_2A and 34_2B. analogy. When the AC electrode 72 of the first electrode module 70 is electrically connected to the wire 47 on the bottom plate 24, the diode micro-crystals 34_1A~34_8A and 34_1B~34_8B are connected into a string of micro-light-emitting units 21, as shown in FIG. As shown therein, each of the micro-light-emitting units 21 includes two strings of parallel diode microcrystals. For example, a series of diode microcrystals 34_1A and 34_1B are connected in parallel with another series of diode microcrystals 34_5A and 34_5B, and a series of diode microcrystals 34_2A and 34_2B are connected to another string of diodes. The bulk microcrystals 34_6A are connected in parallel with 34_6B, and so on.

The AC power source and the diode micro-crystals 34_1A~34_4A and 34_1B~34_4B connected in series between the voltage feeding points 47a and 47e form a first loop, and the AC power source is connected in series between the voltage feeding points 47a and 47e. The diode microcrystals 34_5A~34_8A and 34_5B~34_8B form a second loop. When one of the AC power supplies is in the first half cycle (ie, positive half cycle), 34_1A~34_4A and 34_1B~34_4B in the first loop are forward biased to be turned on, and when one of the AC power supplies is in the second half cycle ( That is, negative half cycle), 34_5A~34_8A and 34_5B~34_8B in the second loop are forward biased and turned on.

As shown in FIG. 17, the second electrode module 80 includes a plurality of first DC electrodes 82, a plurality of insulating portions 84, and a second DC electrode 86, wherein each of the insulating portions 84 is disposed on the two first DCs. The electrodes 82 are electrically isolated from the two adjacent first DC electrodes 82. When the first DC electrode 82 and the second DC electrode 86 of the second electrode module 80 are electrically coupled to the wires 47 on the bottom plate 24, the cathodes of all the diode microcrystals 34_1~34_8 are respectively coupled. The first DC electrode 82 is connected to the corresponding first DC electrode 82, and the anodes of all the diode microcrystals 34_1~34_8 are coupled to the second DC electrode 86. In this case, the cathode and anode of the diode micro-crystals 34_1~34_8 are coupled to the first DC electrode 82 and the second DC electrode 86 as voltage feeding points, respectively.

As shown in FIG. 18, when the second electrode module 80 is electrically connected to the DC power source, a higher voltage of the DC power source is coupled to the diode microcrystals by the second DC electrode 86. The anode of 34_1~34_8, and a lower voltage (such as GND) in the DC power source is coupled to the cathode of the diode microcrystals 34_1~34_8 by the first DC electrode 82. Therefore, the diode micro-crystals 34_1~34_8 are individually biased (conducted) by the DC power source. In other words, the DC power source and the diode microcrystals 34_1~34_8 are formed in eight loops by the first and second DC electrodes 82 and 86 and the conductor structure 19C (ie, the conductor 47).

In some embodiments, each of the diode micro-grains 34_1~34_8 can be replaced by two diode micro-grains. As shown in FIG. 19, for example, the diode microcrystals 34_1 can be replaced by the diode microcrystals 34_1A and 34_1B, and the diode microcrystals 34_2 can be diode microcrystals. 34_2A and 34_2B are replaced, and so on. In this case, the cathodes of the diode microcrystals 34_1A~34_8A and 34_1B~34_8B are respectively coupled as a voltage feeding point to the first DC electrode 82, and the diode microcrystals 34_1A~34_8A and 34_1B The anode of ~34_8B is coupled to the second DC electrode 86 as a voltage feed point.

When the second electrode module 80 is electrically connected to the DC power source, a higher voltage of the DC power source is coupled to the anode of the diode micro-crystals 34_1B~34_8B by the second DC electrode 86, and the DC A lower voltage (eg, GND) in the power supply is coupled to the cathode of the diode micro-dies 34_1A-34_8A by the first DC electrode 82. In other words, the DC power source and the diode microcrystals 34_1A~34_8A and 34_1B~34_8B are formed in eight loops by the first and second DC electrodes 82 and 86 and the conductor structure 19C (ie, the conductor 47). For example, the DC power supply forms a first loop with a series of diode micro-grains 34_1A~34_1B, and forms a second loop with another series of diode micro-grains 34_2A~34_2B, and so on. Therefore, every two diode micro-crystals, such as 34_1A~34_1B, 34_2A~34_2B, are individually biased (conducted) by the DC power supply. In some embodiments, each of the diode micro-grains 34_1~34_8 may be replaced by three or more diode micro-grains, which are not described herein.

Therefore, the illumination device 600 can select different sets of voltage feed points by moving the electrode module, so that the illumination device 600 can be powered by a DC power source or an AC power source without requiring AC-DC conversion.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application attached.

19A~19C. . . Wire structure

20. . . Substrate

twenty one. . . Micro-lighting unit

22, 24. . . Bottom plate

30. . . Lighting module

39a~39e. . . Secondary lighting module

40. . . power supply

44. . . Blocking unit

50. . . Selection unit

53, 53"...Identification unit

54. . . Output unit

70. . . First electrode module

72, AC1, AC2. . . AC electrode

74, 84. . . Insulation

80. . . Second electrode module

82. . . First direct current electrode

86. . . Second DC electrode

100~600. . . Lighting device

DC1, DC2. . . DC electrode

SC. . . critical result

SP. . . Power setting signal

L0. . . inductance

C0. . . capacitance

SM. . . Result signal

31a~31e, 36a~36d, 38a~38c, 45,47. . . wire

32a~32e, 33a~33d, 37a~37c, 46a~46j, 47a~47e. . . Voltage feed point

34, 34_1~34_8, 34_1A~34_8A, 34_1B~34_8B. . . Dipolar microcrystal

Figure 1 is an embodiment of a lighting device of the present invention.

Figure 2 is another embodiment of a lighting device.

Figure 3 is an embodiment of a selection unit.

Figure 4 is another embodiment of a lighting device.

Figure 5 is another embodiment of a lighting device.

Figure 6 is an embodiment of a lighting device.

Figure 7 is a schematic view showing one of the substrates having a plurality of diode microcrystals.

Figure 8 is a schematic view showing one of the base plates having a plurality of conductors.

Figure 9 is a schematic view showing the combination of the substrate and the bottom plate in Figures 7 and 8.

Fig. 10 is a view showing a state in which the lighting device of Fig. 6 is powered by a DC power source.

Figure 11 is another schematic diagram showing the illumination device of Figure 6 powered by a DC power source.

Fig. 12 is a view showing a state in which the lighting device of Fig. 6 is powered by an alternating current source.

Figure 13 is an embodiment of an illumination device having one of the movable AC electrodes.

Figure 14 is an equivalent circuit diagram of one of the illumination devices shown in Figure 13.

Figure 15 is another schematic view of the substrate shown in Figure 7.

Figure 16 is another embodiment of the illumination device of Figure 13.

Figure 17 shows an embodiment of a lighting device having one of the movable DC electrodes.

Figure 18 is an equivalent circuit diagram of one of the illumination devices of Figure 17.

Figure 19 is another embodiment of a lighting device having a movable DC electrode.

19A. . . Wire structure

20. . . Substrate

twenty one. . . Micro-lighting unit

30. . . Lighting module

31a~31e. . . wire

32a~32e. . . Voltage feed point

34. . . Dipolar microcrystal

40. . . power supply

50. . . Selection unit

100. . . Lighting device

Claims (20)

A lighting device comprising: a first voltage feeding point; a second voltage feeding point; a first micro light emitting unit and a second micro light emitting unit, respectively comprising two antiparallel diode crystals And a selection unit electrically connected to the first micro-light-emitting unit and the second micro-light-emitting unit, and connecting the first micro-light-emitting unit and the second micro-light-emitting unit in parallel at a first voltage or The second micro-light-emitting unit and the second micro-light-emitting unit are electrically connected between the first voltage feeding point and the second voltage feeding point, and the second voltage is Above the first voltage. The lighting device of claim 1, wherein the first voltage is about 110 volts. The lighting device of claim 1, wherein the first voltage is about 220 volts. The lighting device of claim 1, wherein the second voltage is about twice the first voltage. The lighting device of claim 1, wherein the first voltage feeding point and the second voltage feeding point are connected to an alternating current power source or a direct current power source. The illuminating device of claim 1, wherein the two antiparallel diode microcrystals emit light in a time-sharing manner. The illuminating device of claim 1, further comprising: a substrate, wherein the two anti-parallel diode micro-grains are formed on the substrate. The illuminating device of claim 1, further comprising: a substrate, wherein the diode micro-grain is formed on the substrate; and a bottom plate is disposed under the substrate. The illuminating device of claim 1, further comprising: a bottom plate having a plurality of wires, wherein the diode micro-grain is bonded to the bottom plate. An illumination device comprising: a substrate; a first voltage feed point; a second voltage feed point; a first micro light emitting unit and a second micro light emitting unit formed on the substrate by a semiconductor process And electrically connected between the first voltage feed point and the second voltage feed point; a selection unit electrically connected to the first micro light emitting unit and the second micro light emitting unit, and The first micro-light-emitting unit and the second micro-light-emitting unit are connected in parallel at a first voltage or in series at a second voltage, and the second voltage is higher than the first voltage. The lighting device of claim 10, further comprising: a bottom plate disposed below the substrate. The illuminating device of claim 10, further comprising: a bottom plate, wherein the first micro illuminating unit and the second micro illuminating unit are flip-chip bonded to the bottom plate. The illuminating device of claim 10, further comprising: a third voltage feeding point; and a third micro illuminating unit electrically connected to the third voltage feeding point and the second voltage feeding Between the in points. The lighting device of claim 10, wherein the second voltage is about twice the first voltage. A method of fabricating a illuminating device, comprising: forming a first diode micro-grain and a second diode micro-grain on a substrate by a semiconductor process; providing a low voltage to make the first diode The bulk microcrystals and the second diode microcrystals are connected in parallel; and a high voltage is provided to connect the first diode microcrystals and the second diode microcrystals in series; wherein the high voltage Greater than the low voltage. The method for fabricating the illumination device of claim 15, further comprising: providing a selection unit to select the series or parallel connection of the first diode microcrystal and the second diode microcrystal. The method for fabricating a lighting device according to claim 15, further comprising: providing a DC power source or an AC power source to the first diode microcrystal and the second diode microcrystal. The method for manufacturing a lighting device according to claim 15, further comprising: providing a bottom plate under the substrate. A method for fabricating a lighting device includes: forming a first diode micro-grain and a second diode micro-grain on a substrate by a semiconductor process; forming a first loop in the first diode Between the body microcrystal and the second diode microcrystal; forming a second loop between the first diode microcrystal and the second dipole microcrystal; and providing a selection unit And conducting the first loop or the second loop according to a first voltage or a second voltage; wherein the first voltage is not equal to the second voltage. The method of fabricating a lighting device according to claim 19, wherein the first voltage is lower than the second voltage.