TWI427376B - Display device and manufacturing method thereof - Google Patents

Description

Display and its making method

The present invention relates to an optical component and a method of fabricating the same, and more particularly to a display and a method of fabricating the same.

A liquid crystal on silicon (LCOS) panel is a display panel made of a germanium wafer, which is replaced by a metal-oxide-semiconductor transistor (MOS transistor). A thin film transistor (TFT) disposed on a glass substrate in a transmissive liquid crystal panel. The 矽-based liquid crystal panel is a reflective display panel whose pixel electrodes are made of an opaque metal material. In addition, since the metal pixel electrode can cover almost the entire pixel area, the germanium-based liquid crystal panel can be fully utilized compared with the transparent pixel electrode of the conventional transmissive liquid crystal panel covering only a relatively small portion of the pixel area. Light source to increase the brightness of the display.

The 矽-based liquid crystal panel is mainly composed of a ruthenium substrate and a patterned metal electrode layer, an alignment layer, a liquid crystal layer, an alignment film, an indium tin oxide layer and a glass substrate which are sequentially disposed on the ruthenium substrate. A plurality of optical film layers are formed, wherein the patterned metal electrode layer is used to form a pixel electrode, and the indium tin oxide layer is used to form a transparent electrode. The light from the light source sequentially passes through the glass substrate, the indium tin oxide layer, the alignment film, the liquid crystal layer and the alignment film, and is transmitted to the patterned metal electrode layer, and the patterned metal electrode layer reflects the light and causes the light to be sequentially ordered. Penetrating the alignment film, the liquid crystal layer, The alignment film, the indium tin oxide layer and the glass substrate are transmitted to the outside.

Generally, the assembly of the 矽-based liquid crystal panel is generally performed by bonding a ruthenium substrate and a glass substrate by using a sealant, and the sealant is directly disposed on a surface of the two alignment films opposite to each other and surrounding the liquid crystal layer. Since the material of the alignment film is mostly made of cerium oxide having a loose molecular structure, the thiol-based liquid crystal panel after being assembled is easily infiltrated into the liquid crystal layer via the alignment film. In this way, in addition to accelerating the aging of components in the liquid-based liquid crystal panel, the life of the fabricated component is shortened, and the display quality and reliability of the liquid-based liquid crystal panel are also affected.

The invention provides a method for manufacturing a display, which can solve the problem that the conventional moisture invades into the liquid crystal layer via the alignment layer to improve the process yield.

The invention provides a display with good display quality and better reliability.

The invention provides a method of manufacturing a display. First, an active device array substrate having an active surface is provided. Next, a first patterned photoresist layer is formed on the active surface. Then, a first alignment layer is obliquely evaporated on the active surface and the first patterned photoresist layer, wherein the active surface has at least one first unvaporized region located at an edge of the first patterned photoresist layer Next. A portion of the first patterned photoresist layer and the first alignment layer on the first patterned photoresist layer is removed to form a first alignment unit. A frame glue is directly formed on the active surface of the active device array substrate and surrounds the first alignment unit. A counter substrate having a light transmissive surface is provided. Finally, set up initiative The element array substrate and the opposite substrate.

The invention also provides a display comprising an active device array substrate, a pair of substrates, at least one first alignment unit, at least one second alignment unit, a liquid crystal layer and a sealant. The active device array substrate has an active surface. The opposite substrate is disposed above the active device array substrate and has a light transmissive surface, wherein the active surface and the light transmissive surface face each other. The first alignment unit is disposed on the active device array substrate and located on the active surface. The second alignment unit is disposed on the opposite substrate and is located on the light transmissive surface, wherein the first alignment unit is aligned with the second alignment unit. The liquid crystal layer is disposed between the first alignment unit and the second alignment unit. The sealant directly joins the active surface of the active device array substrate and the light transmissive surface of the opposite substrate, and surrounds the liquid crystal layer, the first alignment unit, and the periphery of the second alignment unit.

Based on the above, the display of the embodiment of the present invention is formed by oblique evaporation and using a photoresist remover to remove the patterned photoresist layer and the portion of the alignment layer on the patterned photoresist layer via the edge. An alignment unit is formed on the active device array substrate and the opposite substrate. Therefore, when the active device array substrate and the opposite substrate are bonded, the sealant can surround the liquid crystal layer and the alignment unit, that is, the sealant is located on the active device array substrate and the opposite substrate, and surrounds the liquid crystal layer and the alignment unit. In addition to avoiding the problem that the water vapor invades into the liquid crystal layer through the alignment layer, the process yield can also be improved. Therefore, the display of the embodiment of the present invention has better display quality.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a cross-sectional view of a display according to an embodiment of the present invention. Referring to FIG. 1 , the display 100 of the embodiment includes an active device array substrate 200 , a pair of substrates 300 , at least one first alignment unit 400 (only one is schematically shown in FIG. 1 ), and at least one second alignment. The unit 500 (only one is schematically shown in FIG. 1), a liquid crystal layer 600, and a sealant 700, wherein the display 100 is, for example, a reflective type liquid crystal panel.

The active device array substrate 200 includes a germanium substrate 210 and a pixel electrode 220. The germanium substrate 210 has an active surface 212 and a plurality of active elements 214, and the pixel electrodes 220 are disposed on the germanium substrate 210 and on the active surface 212. In the present embodiment, the active elements 214 are arranged in an array on the active surface 212 of the germanium substrate 210, and the active elements 214 are, for example, transistors or other suitable active elements, and the material of the pixel electrodes 220 is, for example, aluminum. In addition, the first alignment unit 400 is disposed on the active device array substrate 200 and located on the active surface 212 of the germanium substrate 210, wherein the material of the first alignment unit 400 is, for example, hafnium oxide. Specifically, the first alignment unit 400 is disposed on the germanium substrate 210 and covers the pixel electrode 220.

The opposite substrate 300 is disposed above the active device array substrate 200, and the opposite substrate 300 includes a transparent substrate 310 and a transparent electrode 320. The opposite substrate 300 has a transparent surface 312, and the transparent electrode 320 is disposed. On the transparent substrate 310, and located on the light transmissive surface 312. In this embodiment, the active surface 212 of the germanium substrate 210 and the opposite substrate 300 are transparent to light. The surface 312 faces each other, and the transparent substrate 310 is, for example, a fused silica substrate, a glass substrate or a transparent substrate of other materials, and the material of the transparent electrode 320 is, for example, indium tin oxide. , ITO), indium zinc oxide or other light-transmissive conductive material. In addition, the second alignment unit 500 is disposed on the opposite substrate 300 and located on the transparent surface 312 of the transparent substrate 310 , wherein the first alignment unit 400 is aligned with the second alignment unit 500 , and the material of the second alignment unit 400 is, for example, It is cerium oxide. Specifically, the second alignment unit 500 is disposed on the transparent substrate 310 and covers the transparent electrode 320 .

The liquid crystal layer 600 is disposed between the first alignment unit 400 and the second alignment unit 500, wherein the first alignment unit 400 located between the liquid crystal layer 600 and the active device array substrate 200 can vertically align the liquid crystal layer 600 and be located in the liquid crystal layer. The second alignment unit 500 between the 600 and the opposite substrate 300 may vertically align the liquid crystal layer 600.

In the present embodiment, the sealant 700 is disposed on the active device array substrate 200 and the opposite substrate 300 and directly bonded to the active device array substrate 200 and the opposite substrate 300. In addition, the sealant 700 surrounds the liquid crystal layer 600, the first alignment unit 400, and the second alignment unit 500, wherein the sealant 700 covers the peripheral surface of the first alignment unit 400, the peripheral surface of the second alignment unit 500, and is extended and disposed. The first alignment unit 400 is on the second alignment unit 500. Therefore, the external moisture cannot penetrate into the display 100, that is, the sealant 700 can effectively block the external moisture from entering the display 100 to solve the problem that the conventional moisture invades into the liquid crystal layer via the alignment layer. Therefore, the display 100 of the present embodiment has better display quality.

2A to 2J are schematic cross-sectional views showing a method of fabricating a display according to an embodiment of the present invention. For convenience of explanation, the active element 214 is omitted from FIGS. 2A to 2C and 2G to 2J. Referring to FIG. 2A , in the first embodiment, an active device array substrate 200 (ie, a substrate) is provided. The active device array substrate 200 includes an active surface 212 (ie, an upper surface). The germanium substrate 210 and a pixel electrode 220 are disposed on the germanium substrate 210 and on the active surface 212.

Next, referring to FIG. 2A, a first patterned photoresist layer 230 is formed on a first photoresist arrangement region 212a of the active surface 212 of the germanium substrate 210. Specifically, a first photoresist layer (not shown) is formed on the active surface 212 of the germanium substrate 210 to cover the active surface 212. Next, the first patterned photoresist layer 230 is formed by an exposure process and a development process.

Next, referring to FIG. 2B , a first alignment layer 410 is obliquely evaporated on the active surface 212 and the first patterned photoresist layer 230 . In the embodiment, a first evaporation source 800a is provided on the active device array substrate 200. Next, the first alignment layer 410 is obliquely vapor-deposited on the active surface 212 and the first patterned photoresist layer 230 in a first evaporation direction d1, wherein the first evaporation direction d1 is inclined with respect to the active surface 212. In this embodiment, the first evaporation direction d1 has an angle a1 with the active surface 212, and the angle a1 is between 25 degrees and 35 degrees. The active surface 212 has at least one first vapor-free region 212b that is located along an edge of the first patterned photoresist layer 230, and the first alignment layer 410 does not cover the first vapor-free region 212b. In particular, in the present embodiment, while the oblique vapor deposition is performed, the first alignment layer 410 is matched. The material of the first alignment layer 410 is, for example, cerium oxide.

Next, referring to FIG. 2C, a portion of the first patterned photoresist layer 230 and the first alignment layer 410 on the first patterned photoresist layer 230 is removed by using a first photoresist removal agent (not shown). The at least one first alignment unit 400 (three shown in FIG. 2C) is formed, and the first photoresist arrangement region 212a is exposed. Specifically, in this embodiment, the active device array substrate 200 and the first patterned photoresist layer 230 and the first alignment layer 410 are immersed in the first photoresist removal agent by a lift off method. The first photoresist layer 230 and the first alignment layer 410 thereon are removed by the first photoresist removing agent to form the first alignment unit 400. The first photoresist remover described herein is, for example, acetone. So far, the first alignment unit 400 has been formed on the active device array substrate 200, that is, the fabrication of an alignment substrate has been completed.

Due to the method of fabricating the alignment substrate of the present embodiment, the first alignment unit 400 can be selectively formed on the active device array substrate 200, and the first alignment layer 410 can be aligned while the first alignment layer 410 is vapor-deposited. Therefore, the process steps can be simplified to improve the efficiency of the process for fabricating the alignment substrate.

Next, referring to FIG. 2D, a one-way substrate 300 (ie, another substrate) is provided. The opposite substrate 300 includes a transparent substrate 310 and a transparent electrode 320. The transparent substrate 310 has a transparent surface 312 (ie, the other upper surface). The transparent electrode 320 is disposed on the transparent substrate 310 and located at Light transmissive surface 312.

Next, referring to FIG. 2D, a second patterned photoresist layer 330 is formed on a second photoresist arrangement region 312a of the light transmissive surface 312. Specifically A second photoresist layer (not shown) is formed on the transparent surface 312 of the transparent substrate 310 to cover the transparent surface 312. Next, a second patterned photoresist layer 330 is formed on the second photoresist arrangement region 312a of the light transmissive surface 312 by an exposure process and a development process.

Next, referring to FIG. 2E , a second alignment layer 510 is obliquely evaporated on the transparent surface 312 and the second patterned photoresist layer 330 . As with the foregoing FIG. 2B, the light transmissive surface 312 has at least one second vapor-free region 312b located beside one edge of the second patterned photoresist layer 330, and the second alignment layer 510 does not cover the second vapor-free layer. Zone 312b. In the present embodiment, a second evaporation source 800b is provided on the opposite substrate 300. Next, the second alignment layer 510 is obliquely vapor-deposited on the transparent surface 312 and the second patterned photoresist layer 330 in a second evaporation direction d2, wherein the second evaporation direction d2 is inclined with respect to the transparent surface 312. In this embodiment, the second evaporation direction d2 has an angle a2 with the light transmissive surface 312, and the angle a2 is between 25 degrees and 35 degrees. In particular, in the present embodiment, while the oblique vapor deposition is performed, the second alignment layer 510 is shaped and aligned, and the material of the second alignment layer 510 is, for example, hafnium oxide.

Next, referring to FIG. 2F, a portion of the second patterned photoresist layer 330 and the second alignment layer 510 on the second patterned photoresist layer 330 is removed by using a second photoresist remover (not shown). The at least one second alignment unit 500 (three shown in FIG. 2F) is formed, and the second photoresist arrangement region 312a is exposed. So far, as in the foregoing FIG. 2C, the second alignment unit 500 has been formed on the opposite substrate 300, that is, the fabrication of another alignment substrate has been completed.

Next, referring to FIG. 2G, at least one sealant 700 is directly formed on the active surface 212 of the active device array substrate 200, and the sealant 700 is wrapped around. The periphery of the first alignment unit 400, wherein the sealant 700 covers the peripheral surface of the first alignment unit 400 and extends over the first alignment unit 400. The sealant 700 and the first alignment unit 400 constitute at least one liquid crystal accommodating recess 612 for filling the liquid crystal. It must be noted here that the present invention does not limit the position at which the sealant 700 is formed. In this embodiment, the sealant 700 is formed on the active device array substrate 200. However, in other embodiments not shown, the sealant 700 may be directly formed on the transparent surface 312 of the opposite substrate 300, and Surrounds the circumference of the second alignment unit 500. Therefore, the sealant 700 described in FIG. 2G is for illustrative purposes only and is not limited thereto.

Next, referring to FIG. 2H, a drop injection process is performed to fill a liquid crystal material 610 in the liquid crystal receiving recess 612. Then, referring to 2I, the active device array substrate 200 and the opposite substrate 300 are combined to fill the liquid crystal material 610 between the active device array substrate 200 and the opposite substrate 300. Therefore, the active surface 212 and the light transmissive surface 312 face each other, and the first alignment unit 400 is aligned with the second alignment unit 500.

After the active device array substrate 200 and the opposite substrate 300 are assembled, please refer to FIG. 2I and FIG. 2J simultaneously, and perform a cutting process along the first photoresist arrangement region 212a and the second photoresist arrangement region 312a to form a plurality of The display 100 (only one of which is schematically shown in FIG. 2J) is shown. So far, the production of the display 100 is completed.

It is to be noted that, in this embodiment, the liquid crystal material 610 is first filled in the liquid crystal receiving recess 612, and then the active device array substrate 200 and the opposite substrate 300 are assembled and cut, but in other embodiments, Alternatively, the active device array substrate 200 and the opposite substrate may be filled in before the liquid crystal is filled in. 300 combinations. Referring to FIG. 3A to FIG. 3C, after the active device array substrate 200 and the opposite substrate 300 are assembled, the sealant 700, the first alignment unit 400, and the second alignment unit 500 constitute at least one liquid crystal accommodating space 614 (in FIG. 3A Take a plurality of liquid crystal accommodating spaces 614 as an example). The liquid crystal material 610 is injected into the liquid crystal accommodating space 614 through a liquid crystal injection port 616 which has been reserved when the sealant 700 is formed. Finally, a cutting process is performed to form a plurality of displays 100'.

In summary, since the alignment substrate of the embodiment of the present invention is formed by forming a patterned photoresist layer and then oblique vapor deposition to form an alignment unit, the alignment unit can be selectively formed on the substrate. And the alignment layer is aligned while the alignment layer is vapor-deposited, which simplifies the process steps. In addition, the display of the embodiment of the present invention is formed by using a photoresist remover to form an alignment unit on the active device array substrate and the opposite substrate. Therefore, when the active device array substrate and the opposite substrate are assembled, the sealant can surround the liquid crystal. The layer and the surrounding of the alignment unit. In this way, in addition to avoiding the problem that the conventional moisture invades into the liquid crystal layer through the alignment layer, the process yield can be improved. Therefore, the display of the embodiment of the present invention has better display quality.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 100’‧‧ display

200‧‧‧Active component array substrate

210‧‧‧矽 substrate

212‧‧‧Active surface

212a‧‧‧First photoresist configuration area

212b‧‧‧First unvaporized zone

214‧‧‧Active components

220‧‧‧ pixel electrodes

230‧‧‧First patterned photoresist layer

300‧‧‧ opposite substrate

310‧‧‧Transparent substrate

312‧‧‧Light surface

312a‧‧‧second photoresist arrangement area

312b‧‧‧Second-free evaporation zone

320‧‧‧Lighting electrode

330‧‧‧Second patterned photoresist layer

400‧‧‧First alignment unit

410‧‧‧First alignment layer

500‧‧‧Second aligning unit

510‧‧‧Second alignment layer

600‧‧‧Liquid layer

610‧‧‧Liquid crystal materials

612‧‧‧LCD receiving groove

614‧‧‧LCD accommodation space

616‧‧‧LCD injection port

700‧‧‧Box glue

800a‧‧‧First evaporation source

800b‧‧‧second evaporation source

A1, a2‧‧‧ angle

D1‧‧‧First evaporation direction

D2‧‧‧second evaporation direction

1 is a cross-sectional view of a display according to an embodiment of the present invention.

2A to 2J are schematic cross-sectional views showing a method of fabricating a display according to an embodiment of the present invention.

3A-3C are cross-sectional views showing a partial manufacturing method of a display according to another embodiment of the present invention.

100‧‧‧ display

200‧‧‧Active component array substrate

210‧‧‧矽 substrate

212‧‧‧Active surface

214‧‧‧Active components

220‧‧‧ pixel electrodes

300‧‧‧ opposite substrate

310‧‧‧Transparent substrate

312‧‧‧Light surface

320‧‧‧Lighting electrode

400‧‧‧First alignment unit

500‧‧‧Second aligning unit

600‧‧‧Liquid layer

700‧‧‧Box glue

Claims (9)

A method for manufacturing a display, comprising: providing an active device array substrate, wherein the active device array substrate has an active surface; forming a first patterned photoresist layer on the active surface; and the active surface and the first pattern Etching a first alignment layer obliquely on the photoresist layer, wherein the active surface has at least one first unvaporized region located beside an edge of the first patterned photoresist layer; Forming a photoresist layer and a portion of the first alignment layer on the first patterned photoresist layer to form a first alignment unit; directly forming a sealant on the active surface of the active device array substrate and Surrounding the circumference of the first alignment unit, wherein the sealant covers a peripheral surface of the first alignment unit and extends on the first alignment unit; providing a pair of substrates, wherein the opposite substrate has a light transmissive surface And assembling the active device array substrate and the opposite substrate. The method for manufacturing the display of claim 1, further comprising: forming a second patterned photoresist layer on the light transmissive surface; and obliquely on the transparent surface and the second patterned photoresist layer Depositing a second alignment layer, wherein the light transmissive surface has at least one second unvaporized region located beside an edge of the second patterned photoresist layer; and removing the second patterned photoresist The layer and the second alignment layer are located at the The second portion of the photoresist layer is patterned to form a second alignment unit. The method for manufacturing the display of claim 2, further comprising: directly forming a sealant on the light transmissive surface of the opposite substrate and surrounding the second alignment unit. The manufacturing method of the display device of claim 3, further comprising: connecting the active device array substrate and the opposite substrate by the sealant, and the first alignment unit is aligned with the second alignment unit. The method of manufacturing the display of claim 1, wherein the step of oblique vapor deposition comprises: providing a first evaporation source on the active device array substrate; and obliquely in a first evaporation direction The first alignment layer is evaporated, wherein the first evaporation direction is inclined with respect to the active surface. The method of manufacturing the display of claim 5, wherein the angle between the first evaporation direction and the active surface is between 25 degrees and 35 degrees. A display comprising: an active device array substrate having an active surface; a pair of substrates disposed above the active device array substrate and having a light transmissive surface, wherein the active surface and the light transmissive surface face each other At least one first alignment unit is disposed on the active device array substrate and located on the active surface; at least one second alignment unit is disposed on the opposite substrate and located at The light transmissive surface, wherein the first alignment unit is aligned with the second alignment unit; a liquid crystal layer disposed between the first alignment unit and the second alignment unit; and a sealant directly bonding the active device array The active surface of the substrate and the light transmissive surface of the opposite substrate surround the liquid crystal layer, the first alignment unit, and the second alignment unit, wherein the sealant covers a first portion of the first alignment unit a surrounding surface, a second surrounding surface of the second alignment unit, and extending on the first alignment unit and the second alignment unit. The display device of claim 7, wherein the active device array substrate comprises a germanium substrate and a pixel electrode, and the pixel electrode is disposed on the germanium substrate and located on the active surface. The display device of claim 7, wherein the opposite substrate comprises a transparent substrate and a transparent electrode, and the transparent electrode is disposed on the transparent substrate and located on the transparent surface.