TWI423319B - - Google Patents

Info

Publication number
TWI423319B
TWI423319B TW97132552A TW97132552A TWI423319B TW I423319 B TWI423319 B TW I423319B TW 97132552 A TW97132552 A TW 97132552A TW 97132552 A TW97132552 A TW 97132552A TW I423319 B TWI423319 B TW I423319B
Authority
TW
Taiwan
Application number
TW97132552A
Other languages
Chinese (zh)
Other versions
TW201009913A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW97132552A priority Critical patent/TW201009913A/zh
Priority to JP2009182264A priority patent/JP2010056549A/ja
Publication of TW201009913A publication Critical patent/TW201009913A/zh
Application granted granted Critical
Publication of TWI423319B publication Critical patent/TWI423319B/zh

Links

TW97132552A 2008-08-26 2008-08-26 A LED fragmentation cutting method and product thereof TW201009913A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW97132552A TW201009913A (en) 2008-08-26 2008-08-26 A LED fragmentation cutting method and product thereof
JP2009182264A JP2010056549A (ja) 2008-08-26 2009-08-05 Ｌｅｄのカッティング方法とその製品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97132552A TW201009913A (en) 2008-08-26 2008-08-26 A LED fragmentation cutting method and product thereof

Publications (2)

Publication Number Publication Date
TW201009913A TW201009913A (en) 2010-03-01
TWI423319B true TWI423319B (ja) 2014-01-11

Family

ID=42072078

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97132552A TW201009913A (en) 2008-08-26 2008-08-26 A LED fragmentation cutting method and product thereof

Country Status (2)

Country Link
JP (1) JP2010056549A (ja)
TW (1) TW201009913A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109300818A (zh) * 2018-10-26 2019-02-01 张婷 一种磊晶基板的加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354841A (ja) * 1998-06-04 1999-12-24 Rohm Co Ltd 半導体発光素子の製法
TW480742B (en) * 2000-10-27 2002-03-21 United Epitaxy Co Ltd Method for cutting III-group nitride semiconductor light-emitting element

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3795298B2 (ja) * 2000-03-31 2006-07-12 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体発光素子の製造方法
JP2002246337A (ja) * 2001-02-20 2002-08-30 Nichia Chem Ind Ltd 窒化物半導体チップの製造方法
JP4008692B2 (ja) * 2001-11-02 2007-11-14 Ｔｈｋ株式会社 スクライブ装置
JP2007242856A (ja) * 2006-03-08 2007-09-20 Rohm Co Ltd チップ型半導体発光素子
JP5308618B2 (ja) * 2006-04-26 2013-10-09 日亜化学工業株式会社 半導体発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354841A (ja) * 1998-06-04 1999-12-24 Rohm Co Ltd 半導体発光素子の製法
TW480742B (en) * 2000-10-27 2002-03-21 United Epitaxy Co Ltd Method for cutting III-group nitride semiconductor light-emitting element

Also Published As

Publication number Publication date
JP2010056549A (ja) 2010-03-11
TW201009913A (en) 2010-03-01

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