TWI419378B - Led package method and apparatus thereof - Google Patents

Description

Light-emitting diode package method and fixture thereof

The invention relates to a light-emitting diode, in particular to a light-emitting diode packaging method and a fixture thereof.

In the general LED packaging process, the LED component of the carrier is dispensed by the glue injection device of the packaging machine, and a light-emitting diode is formed after the package is completed; however, before dispensing, if The parts of the glue injection device have been replaced. For example, when the syringe or the needle is replaced due to clogging, the glue must be pre-discharged after the parts are replaced, so as to compress the seal and discharge the air bubbles, thereby avoiding the inclusion of air bubbles in the seal. The light-emitting diode element is a defective product. Or, when the packaging machine has a long standby time due to the replacement of the carrier disk, the sealing glue located at the opening of the needle is hardened, no longer the viscosity of the original sealing glue, and the glue injection device is also in the packaging process. The light-emitting diode components that are initially packaged have a situation in which the amount of spitting is uneven, so that the light source generated by several LED components that have just begun to be packaged is biased in the CIE (Commission International de l'Eclairage) chromaticity diagram. The blue light area becomes a defective product.

The other packaging process mainly compensates the glue injection pressure or time of the glue injection device before dispensing the first column or the first LED component on each carrier tray, and then the other illuminations. The pressure or time when the polar component is dispensed is restored to the reference value. For example, the reference value of the injection pressure is 200 kPa, and if the injection pressure compensation is set to 2%, the first column or the first dispensing time is used. After pressure compensation is 204kpa. However, in this packaging process, the pressure compensation is directly performed. At the time before and after the pressure is changed, the target value may not be reached at one time due to the pressure control, and the pressure compensation may be excessive or too small, so that the glue may also occur. In the case of uneven amount, and when the glue machine detects that the compensation value is insufficient, it is necessary to interrupt the packaging operation and re-estimate the compensation value. In addition to producing defective products, the production efficiency is also lowered, and the compensation value is set. It is not possible to apply different adhesive sealants, so the compensation value must be re-estimated whenever the sealant is replaced, which also reduces the production efficiency.

Accordingly, it is an object of the present invention to provide a light emitting diode package method which can improve the problem of unevenness in the amount of glue discharged at the beginning of packaging.

Therefore, the LED package method of the present invention firstly places a jig on a workbench, the jig includes a receiving portion extending along a first direction of the workbench, and then placing at least one carrier disk a working platform, the carrier has a plurality of LED elements arranged in a multi-column arrangement, and each of the adjacent two columns of LED elements has a second direction perpendicular to the first direction along the table In addition, the receiving portion has a distance along the second direction along a column of the light emitting diode elements closest to the fixture, and the ratio of the distance to the spacing is not more than 3.5, and then the plural is along the first The pre-discharging of the aligned plastic needles is at least enough to encapsulate the sealing amount of one of the LED components, and the adhesive is adhered to the receiving portion. Finally, the plastic needles are moved to the carrier to respectively The light-emitting diode component is sprinkled for packaging.

By limiting the ratio of the distance to the spacing to be no more than 3.5, and the pre-stimulation of the plastic needles is at least enough to encapsulate the sealing amount of one of the light-emitting diode elements in the receiving portion of the fixture, and then the light-emitting two The collective components are packaged. Thus, several light-emitting diode components that have just been packaged can avoid the incompleteness of the glue and cause the package to be incomplete. In addition to improving the package yield, the CIE concentration of the light-emitting diode can be increased.

Another object of the present invention is to provide a jig suitable for the above-described light emitting diode packaging method.

Accordingly, the jig of the present invention comprises an elongated shunt frame having a shape of a narrow upper and a lower width along a short direction and including a receiving portion extending in a long direction.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Referring to FIGS. 1 to 3, a preferred embodiment of the LED package method of the present invention comprises steps 11-14.

Step 11 is to locate and load the loading tray: a jig 2 is placed on the work table 31 of the packaging machine 3, wherein the jig 2 includes a shunt frame 21, and a collection for the shunt frame 21 is provided. a disk 22 having a receiving portion 211 extending in a first direction along the table 31, the cross-section of the shunt frame 21 along a second direction perpendicular to the first direction of the table 31 In the present embodiment, the cross section of the shunt frame 21 along the second direction is a triangle having an upper point and a lower width, and the two oblique sides are concave arcs. The collecting tray 22 is configured to collect the sealing compound 6 from the receiving portion 211 and has two discharging holes 221 for discharging the sealing compound 6.

A carrying tray 4 is disposed on the working table 31. The carrying tray 4 has a plurality of LED elements 5 arranged in a multi-column arrangement, wherein each of the LED elements 5 has a top surface 51. The height difference H between the surface 51 and the receiving portion 211 is not more than ±3 mm. In the present embodiment, the height difference H is 3 mm. Each of the adjacent two columns of light emitting diode elements 5 has a pitch X along the second direction, which in the present embodiment is 5.2 mm. When the jig 2 and the carrier 4 are both positioned on the table 31, the receiving portion 211 and the column of LED elements 5 closest to the jig 2 have a distance Y along the second direction. The ratio of Y to the pitch X is not more than 3.5. In the present embodiment, the distance Y is 18.2 mm. It should be noted that, in this step, the carrier tray 4 may be first placed on the work table 31, and the fixture 2 is placed on the work table 31, and then the receiving portion 211 is adjusted to be closest to the fixture. A distance Y of a column of light emitting diode elements 5 along the second direction.

Step 12 is to seal the pre-discharge: after the fixture 2 and the carrier tray 4 are positioned, the plurality of plastic needles 32 arranged along the first direction are pre-suppressed enough to encapsulate the seal of the three light-emitting diode elements 5. The amount of the sealant 6 is adhered to the receiving portion 211 as shown in FIG. Since the receiving portion 211 and the sealant 6 are in line contact, the contact area of the sealant 6 and the receiving portion 211 is small, so the sealant 6 discharged by the glue pins 32 is then followed by the shunt by the receiving portion 211. The rack 21 flows toward the collecting tray 22 and is collected. After the sealing material 6 is accumulated to a certain amount, it can be discharged from the discharging holes 221 for recycling. When the jig 2 is used for a period of time, if the shunt frame 21 affects the fluency of the sealant 6 flowing down from the receiving portion 211 due to the solidified sealant 6, the new jig can be directly replaced or treated. Use 2 after cleaning and reuse. In addition, the amount of the sealant of each of the plastic pins 32 may be different depending on the viscosity or packaging conditions of the sealant 6, for example, the amount of sealant for pre-suppressing one of the light-emitting diode elements 5 or Squeeze enough to encapsulate the six LED components 5 can be sealed.

Step 13 is a component package: with reference to FIG. 4, after the glue pins 32 are pre-sprayed to encapsulate the sealing amount of the three LED components 5, the last pre-discharge seal is adhered by the receiving portion 211. The glue 6, the plastic needles 32 are moved up, so that the plastic needles 32 are respectively separated from the last pre-disindation sealant 6, and then moved to the carrier tray 4, respectively, to the light-emitting diode elements 5 The glue is encapsulated, and after the package is completed, each of the light-emitting diode elements 5 forms a light-emitting diode (not shown). When the plastic needles 32 are packaged, the moving path of the plastic needles 32 may be advanced by a path indicated by a thin broken line in FIG. 2 or by a path indicated by a thick broken line. In the present embodiment, the plastic needles 32 are The moving path is the path indicated by the thick dotted line in Figure 2. It should be noted that the needles 32 are moved up after the pre-discharging is completed to ensure that the glue pins 32 are detached from the last pre-disindation sealant 6 to prevent the glue pins 32 from being completely detached from the sealant 6. The condition is moved to the carrier tray 4, and the sealant 6 is adhered to other components to cause contamination. Therefore, if the adhesive 6 has low viscosity and can be quickly detached from the plastic needles 32, After the pre-suppression glue 6 is removed, the glue needle 32 can be moved to the carrier tray 4 to be encapsulated without being moved up. In addition, since the height difference H between the top surface 51 and the receiving portion 211 is not more than 3 mm, the time for the plastic needles 32 to move to the light emitting diode elements 5 for packaging can be shortened to avoid being located therein. The viscosity of the sealant 6 of the glue needle 32 is increased too much or solidified.

Step 14 is to unload the carrier tray: after the plastic pins 32 have completed the glue-bonding of all the LED components 5 in the carrier tray 4, the carrier tray 4 is taken out. It should be noted that when the LED component on the other carrier is to be packaged, since the fixture 2 has been prepared and can be reused, the above steps 12 to 15 can be repeated. In addition, when the plurality of carrier trays 4 are placed on the table 31 at a time, the glue pins 32 can be sequentially removed after all the LED components 5 in the carrier trays 4 are completed. The carrier disk 4 is loaded, and then the carrier disk of the LED component to be packaged is loaded, and steps 12-15 above are repeated.

According to the present invention, the glue pins 32 pre-spray the sealing amount of the three light-emitting diode elements 5 on the jig 2 receiving portion 211, and limit the ratio of the distance Y to the distance X to be no more than 3.5. The glue pins 32 can be packaged for the light-emitting diode elements 5 immediately, so as to avoid the hardening of the sealant due to the long waiting time, the insufficient compensation value of the glue injection device, and the replacement of different sticks. In order to solve the problem, it is necessary to re-estimate the compensation value. In other words, the present invention mainly utilizes the action of immediately after the pre-discharge of the sealant is moved to the carrier tray 4 to perform the glue-packing operation, and the glue pins 32 at this time. The amount of glue is the most stable and uniform, improving the unevenness of the glue at the beginning of the package, thereby improving the yield of the package process and increasing the CIE concentration of each packaged LED. In addition, since the cross section of the shunt frame 21 of the jig 2 in the second direction is a triangle having an upper narrow width and a lower width, when the sealant 6 pre-discharged by the plastic needle 32 is attached to the receiving portion 211, The speed at which the sealant 6 flows downward is accelerated to shorten the time of separation from the glue pins 32.

It should be noted that the cross section of the shunt frame 21 of the jig 2 along the second direction may also be a triangular or arc-shaped shape having two oblique sides, as shown in FIGS. 5 and 6. Thus, the shunt The frame 21 can still shunt the sealant 6 adhered to the receiving portion 211.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

11~14. . . Steps of the LED package method

2. . . Fixture

twenty one. . . Splitter

211. . . Undertaking department

twenty two. . . Collection tray

221. . . Rubber hole

3. . . Packaging machine

31. . . Workbench

32. . . Plastic needle

4. . . Carrier disk

5. . . Light-emitting diode component

51. . . Top surface

6. . . Plastic closures

X. . . spacing

Y. . . distance

H. . . Height difference

1 is a flow chart showing a preferred embodiment of a method for packaging a light emitting diode of the present invention;

2 is a top view showing the positional relationship between a jig and a carrier;

Figure 3 is a cross-sectional view showing a state in which a plastic needle is pre-suppressed at a receiving portion of the jig;

Figure 4 is a cross-sectional view showing the case where the glue is dispensed for the light-emitting diode component on the carrier:

Figure 5 is a cross-sectional view showing that the cross section of one of the jigs in the vertical direction is a triangle having a top, a lower width; and

Figure 6 is a cross-sectional view showing the cross section of the shunt frame in a vertical direction in a circular arc shape.

11~14. . . Steps for the LED package method

Claims (14)

A method for packaging a light emitting diode, comprising the steps of: (a) placing a jig on a workbench, the jig comprising a receiving portion extending along a first direction of the workbench, placing at least one carrying tray In the workbench, the carrier has a plurality of LED elements arranged in a multi-column arrangement, and each of the adjacent two columns of LED components has a second axis perpendicular to the first direction along the table. a spacing of the direction, in addition, the receiving portion and the column of the light emitting diode elements closest to the fixture have a distance along the second direction, and the ratio of the distance to the spacing is not more than 3.5; (b) the plural along the first Each of the pre-dissipating pins of the one direction is at least enough to encapsulate the sealing amount of one of the LED components, and the gluing is adhered to the receiving portion; and (c) the pins are moved to the carrier The light emitting diode elements are separately encapsulated. The LED package method of claim 1, wherein each of the LED components has a top surface, and the height difference between the top surface and the receiving portion is no more than ±3 mm. The method according to claim 2, further comprising a step (b-1) after the step (b), in the step (b-1), the pins are Move to separate the glue pins from the sealants. The LED package method according to claim 3, further comprising a step (d) after the step (c), in the step (d), when the glue is in the carrier tray After all the LED components are finished, the carrier is removed. According to the LED package method of claim 3, in the step (a), a plurality of carrier disks are placed on the table, and further, a step after the step (c) is further included ( d), in step (d), after the glue is completely dispensed for all of the light-emitting diode elements in the carrier trays, the carrier trays are removed. The method of encapsulating a light-emitting diode according to the fourth aspect of the invention, wherein each of the needles of the step (b) is pre-filled to encapsulate the sealing amount of the three light-emitting diode elements. The light-emitting diode package method according to claim 1, wherein the fixture comprises a shunt frame having the receiving portion, and the cross-section of the shunt frame in a second direction is narrower and wider. shape. The light-emitting diode package method according to claim 7, wherein the cross-section of the shunt frame is a triangle having a top and a bottom width. The light emitting diode packaging method of claim 8, wherein the fixture further comprises a collecting tray provided for the shunt frame for collecting the sealant from the receiving portion. The LED package method of claim 9, wherein the collection tray has at least one glue discharge hole for discharging the sealant. A jig suitable for the method of claim 1, comprising: an elongated shunt frame having a shape of a narrow width and a width along a short direction and including a longitudinal extension unit. The jig according to claim 11, wherein the cross section of the shunt frame is a triangle having a top and a bottom width. The jig of claim 12, wherein the jig further comprises a collecting tray provided for the shunt frame for collecting the sealant from the receiving portion. The jig according to claim 13, wherein the collecting tray has at least one rubber discharging hole for discharging the sealing glue.