JPH095389A - Conveying contact structure of electronic device - Google Patents

Abstract

PURPOSE: To provide a structure of a conveying/measuring jig which is optimal for carrying in or out an LD(laser diode) as electronic device to be measured to a specified position or measuring it with a handier to measure electric characteristics thereof using an electronic measuring device. CONSTITUTION: A jig body 14 is provided with a housing section 13 to house a plurality of LDs 1 of a chip carrier package type as devices to be measured and a guide pin 4 for positioning. A contact plate 3 is provided with a contact pin 2 and a positioning bush 9 pressed therein. The contact pin 2 is also pressed in and welded on a printed wire board 8 fixed on the contact plate 3 by a mounting screw 5. A contact pad 6 is provided to keep the contact pin in with a contact pin 7 of a measuring section on the side of a measuring head part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LD (LASER DIODE = hereinafter referred to as LD) which is an electronic device to be measured in a handler including an XY stage of an electronic measuring instrument for measuring electrical characteristics of the electronic device. ) Is carried in and out of a predetermined position, and the structure of the jig used for measurement.

[0002]

2. Description of the Related Art An electronic device to be measured is a long wavelength LD and a chip carrier package (CHIP C
In the case of measuring the temperature characteristic of the (ARRIER PACKAGE) type, the handler 21 including the XY stage 19 and the like in the electronic measuring system as shown in FIG. Carrying in and out of each stage is performed to the measuring unit 24 including the unit 25. Further, when the measurement of the temperature characteristic is completed, it is necessary to shift to the next measuring operation, for example, the measuring stage for measuring the temperature aging characteristic.

In this case, a jig suitable for loading, unloading, and measuring the chip carrier package type long-wavelength LD1, which is an electronic device to be measured, to each stage is required. However, when the electronic device to be measured is LD1, it is necessary to measure and determine the characteristics by receiving the emitted light from LD1 using an optical sensor. Therefore, in the structure of the jig, there is a constraint that an opening for receiving the light emitted from the LD1 by an optical sensor must be provided in addition to the function for carrying.

In the prior art, as shown in FIG.
The structures were as shown in (B), (C), (D) and (E). The cross-sectional view shown in FIG. 4- (A) is a conceptual diagram for explaining the structure of a jig according to the conventional technique. That is,
The LD 1 which is the device to be measured is placed in the jig body 14. Then, there is a device pressing plate 29 having a contact window 27 and a holding screw 28, and a predetermined portion of the LD 1 is pressed and fixed by the pressing screw 28. Further, a probing needle 26 for measurement is inserted from above the contact window 27 and set so as to properly contact the electrode on the LD1.

Therefore, in the structure of the jig according to the prior art described above, (1) the space for setting the probing needle 26 necessary for contacting the electrode of the LD1 at the time of measurement is the contact window provided on the device pressing plate 29. It is limited to the size range of 27. Moreover, in order to properly hit the surface of the LD1 which is only about 2 mm square with the probing needle 26, and to do so without damaging the bonded wire, it is a difficult work as using a microscope. It was

(2) Moreover, each time the type of the device LD1 to be measured changes, the probing needle 26 must be repositioned and the set must be changed each time. That is, it is not only difficult to set the probing needle 26 for making contact with the electrode of the LD1 which is the electronic device to be measured by the measurement head unit 25, but when the product type is changed, the difficult probing needle 26 is used. There is a problem that the setting work of the needle 26 needs to be repeated each time.

[0007]

SUMMARY OF THE INVENTION The problem to be solved by the present invention is to carry in a predetermined position of a handler in the process of measuring the electrical characteristics of an LD, which is an electronic device to be measured, using an electronic measuring instrument. It is to obtain a jig for carrying and measuring, which is more suitable for carrying out and measuring.

That is, in the structure of the jig for loading, unloading and measuring each stage of the handler, the chip carrier package type L which is the device to be measured is used.
Even if the type of D changes, it is not necessary to adjust the position of the probing needle each time in order to make contact with the electrode of the LD as in the prior art, and it is difficult to set because it requires microscope work. Therefore, it is necessary to break away from the structure that requires a lot of time.

[0009]

According to the present invention, as a jig structure, (1) the jig main body is positioned with an accommodating portion for accommodating a plurality of chip carrier package type LDs which are electronic devices to be measured. Guide pins are provided (2) Contact pins and positioning bushes are press-fitted into a contact plate formed of an insulating material (3), and a printed wiring board fixed to the contact plate with a mounting screw is also contacted. A pin was press-fitted and soldered, and a contact pad for contacting the contact pin of the measuring unit on the measuring head side was provided.

The guide pin provided on the jig body is passed through the bush portion of the contact plate to align the contact pin with the contact point on the electrode of the LD. Further, a lock nut was provided as a means for fixing the contact plate when contact between the contact pin and a predetermined position on the electrode of the LD was completed.

[0011]

According to the present invention, a contact pad is provided on the printed wiring board above the contact plate so that the contact pin can be contacted by the contact pin on the side of the measuring head, and the contact pin pressed into the contact plate from below the contact plate is L, which is the measurement target that is scheduled in advance
Since it is now possible to easily project and set the electrodes so that they can be applied to the electrode arrangements of multiple types of D, it is possible to perform position adjustment that is difficult and takes a long time to obtain contacts using a microscope. It became possible to omit doing each time.

[0012]

EXAMPLE FIG. 1- (A) is a conceptual diagram showing the structure of a contact plate which is the core of the present invention. Figure 1- (B)
FIG. 3 is a front view showing an embodiment of the present invention. 1- (C) is also a plan view, (D) is a cross-sectional view, and FIG. 2 is a cross-sectional view of the contact plate 3. Figure 3-
(A) is a plan view of a jig for CAN package type LD1 in another embodiment of the present invention, and (B) is a front view thereof.

(1) FIG. 1- (A) is a structural conceptual diagram of the contact plate 3 which constitutes the core of the jig for conveyance and measurement according to the present invention. As shown in the figure, the contact plate 3 is formed of an insulating material, and the tip of the contact pin 2 using a pogo pin or the like, which is the contact portion, projects downward. Also, the socket 1 for the contact pin 2
2 is press-fitted into the contact plate 3 to penetrate it,
Further, the upper end of the socket 12 portion of the contact pin 2 was soldered to the printed wiring board 8 attached to the upper portion of the contact plate 3 with the attaching screw 5 to form the contact pad 6.

(2) The contact pin 2 is arranged so as to fit a predetermined contact point of the electrode of the LD 1 to be measured. In the illustrated example of FIG. 1- (A), the arrangement is applicable to the case where two contact pins 2 are used and the case where three contact pins 2 are used. Then, when the jig of the present invention, in which the LD1 which is the electronic device to be measured is arranged, is carried into the stage having the measuring head section 25 by the handler 21, the measuring section contact pin 7 contacts the contact pad 6 for measurement. Is done. Further, as shown in FIG. 1- (B), the contact pad 6 does not need to be changed each time the product type is changed, even if the product type of the LD 1 is different, the contact pad 6 is kept in the same position.

(3) According to the configuration of the present invention, as shown in the sectional view of the contact plate 3 of FIG. 2, the contact pin 2 is brought into contact with a predetermined position on the electrode of the LD 1 to be measured. Contact plate 3 for positioning
Further, since the structure is such that a hole is formed at a predetermined position of the printed wiring board 8 and the contact pin is press-fitted, penetrated and held and fixed, it can be easily and accurately performed. Figure 1-
As shown in (B), by inserting the guide pins 4 into the positioning bushes 9 provided at both ends of the contact plate 3, the LD 1 which is the electronic device to be measured and is arranged in the housing portion 13 of the jig body 14 is provided. Positioning of the electrode surface and the entire contact plate 3 is easily possible.

(4) Further, FIG. 1- (D) is a sectional view from the side of the jig for conveyance and measurement of the present invention. With the structure of the present invention, the light rays emitted from the front and the rear of the LD 1 can be received by the IL sensor 15 and the back light sensor 16 without any obstacle, so that the temperature characteristics can be accurately measured. became.

(5) In the jig for conveyance and measurement of the present invention, the arrangement of the contact pads 6 provided on the printed wiring board 8 remains unchanged even if the type of the LD1 to be measured is changed. By making use of the feature that “is good”, it can be applied to the characteristic measurement of the CAN package type LD 18. That is, the structure of the contact plate 3 of the present invention is made possible by adopting the structure shown in FIGS. 3 (A) and 3 (B). That is, the LD socket 17 that fits the terminal of the CAN package type LD 18 was provided, and the LD socket 17 was electrically connected to the contact pad 6 on the printed wiring board 8 mounted on the jig body 14 by the mounting screw 5. The contact pad 6 and the measuring portion contact pin 7 are aligned with each other by the positioning bush 9 and the guide pin 4.

[0018]

Since the present invention is configured as described above, it has the following effects. (1) In the handler of an electronic measuring instrument for measuring the electrical characteristics of an LD, which is an electronic device, the jig used for loading, unloading, and measuring the LD at a predetermined position has the structure of the present invention. Therefore, for example, even if the type of the chip carrier package type LD that is the electronic device to be measured changes, the alignment of the contact pad for contacting the electrode of the LD and the contact pin on the measurement side and the adjustment work accompanying it You no longer need to make that change each time. (2) In addition, since the jig for transporting and measuring according to the present invention has the structure, it is possible to avoid the difficulty of using a microscope for aligning the LD and the contact pin, and the contact pad and the contact focus on the measuring unit side. It's gone at all.

[Brief description of drawings]

FIG. 1 is a conceptual view showing a structure of a contact plate which is a core of an embodiment of the present invention, and a front view, a plan view and a sectional view showing an entire jig of the present invention.

FIG. 2 is a sectional view of the contact plate 3 of the present invention.

FIG. 3 shows a plan view and a front view of a jig for CAN package type LD which is another embodiment of the present invention.

FIG. 4 is a conceptual view, a front view, a plan view, and a side sectional view showing a structure of a jig according to a conventional technique.

FIG. 5 is a conceptual diagram showing a handler composed of an XY stage and the like used in an electronic measuring instrument.

[Explanation of symbols]

 1 LD 2 contact pin 3 contact plate 4 guide pin 5 mounting screw 6 contact pad 7 measuring part contact pin 8 printed wiring board 9 bush 11 lock nut 12 socket 13 storage part 14 jig body 15 IL sensor 16 back light sensor 17 LD socket 18 CAN package type LD 19 XY stage 21 Handler 22 Stocker part 23 Preheat part 24 Measuring part 25 Measuring head part 26 Probing needle 27 Contact window 28 Holding screw 29 Device holding plate

Claims (1)

[Claims] 1. A storage section (13) for storing a plurality of chip carrier package type LDs (1) or CAN package type LDs (18), which are electronic devices to be measured, and a positioning guide pin (4). The jig body (14) provided and the contact pin (2) formed of an insulating material
By inserting the guide plate (4) provided in the jig body (14) through the contact plate (3) in which the and the bush (9) for positioning are press-fitted, and the bush (9) portion of the contact plate (3). ,
Align the contact pin (2) with the contact point on the electrode of the LD (1), and contact the contact pin (2) with the LD.
The lock nut (1) for fixing the contact plate (3) when the contact with the predetermined position on the electrode (1) is completed.
1) and the contact pin (2) are press-fitted and soldered to provide a contact pad (6) for contacting the contact pin (7) of the measuring portion, and the contact pad (3) is fixed on the contact plate (3). A transport contact structure for an electronic device, comprising: a printed wiring board (8).