TWI413283B - Led pakage and method for manufacturing the same - Google Patents

Abstract

This invention relates to a method for manufacturing an LED package. The method includes following steps: providing a base board; mounting an LED chip on the base board; providing some package mucus with phosphor and magnetism grains in it; covering the LED chip with the package mucus in a mutative magnetic field; solidifying the package mucus, then the LED packages is formed. The invention also relates to an LED package manufactured by the method.

Description

Light-emitting diode package structure and manufacturing method thereof

The present invention relates to a semiconductor structure, and more particularly to a light emitting diode package structure and a method of fabricating the same.

Dispensing is one of the commonly used methods in semiconductor manufacturing. When the glued liquid is doped with solid particles, during the dispensing process, the solid particles are easily deposited, resulting in uneven distribution of the solid particles, affecting the process effect. In the case of a light-emitting diode packaging process, it is often necessary to uniformly dope some phosphor powder particles in the encapsulant, but in the process of dispensing, the phosphor powder particles which have been uniformly doped are easily deposited on the bottom, causing the phosphor powder. The particle distribution is uneven, which affects the light output.

In view of the above, it is necessary to provide a light emitting diode package structure and a method of manufacturing the same that prevent deposition of phosphor powder particles.

A light emitting diode package structure comprising a substrate, a light emitting diode chip and a package. The light emitting diode chip is disposed on the substrate. The package covers the substrate and covers the LED chip. The package contains phosphor particles. The package further contains magnetic particles.

A method of manufacturing a light emitting diode package structure, comprising the steps of: Providing a substrate; disposing a light emitting diode chip on the substrate; providing a potting glue mixed with phosphor particles and magnetic particles; covering the sealing glue in an applied magnetic field with a change in a magnetic field direction On the light-emitting diode wafer; curing the package glue to form a package, and obtaining the light-emitting diode package structure.

In the manufacturing method of the light emitting diode package structure, an applied magnetic field is applied by changing a magnetic field direction by doping magnetic particles in the sealing glue and covering the sealing liquid onto the light emitting diode wafer. Thereby, the phosphor powder particles in the encapsulating glue can be prevented from being precipitated, so that the phosphor powder particles can be uniformly distributed in the cured package. The light-emitting diode package structure disclosed in the embodiment has magnetic particles in the package, so that in the manufacturing process, the phosphor powder particles can be prevented from being precipitated by using an external magnetic field, thereby enabling the phosphor powder particles to be made. It can be evenly distributed in the cured package to improve the light-emitting effect of the entire LED package structure.

10‧‧‧Light emitting diode package structure

11‧‧‧Substrate

12‧‧‧Light Emitter Wafer

13‧‧‧Package

20‧‧‧Packing glue

21‧‧‧Flame powder particles

22‧‧‧Magnetic particles

FIG. 1 is a schematic diagram of a package structure provided by an embodiment of the present invention.

2 is a flow chart of a method provided by an embodiment of the present invention.

3 is a schematic diagram of a package glue used in the method provided by the embodiment of the present invention.

The invention will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , a light emitting diode package structure 10 according to an embodiment of the present invention includes a substrate 11 , a light emitting diode chip 12 , and a package 13 .

The substrate 11 is used to support the LED package structure 10 . The material of the substrate 11 may be sapphire or tantalum or the like.

The light-emitting diode wafer 12 of the light-emitting diode wafer 12 can be fixed on the substrate 11 by an adhesive. The LED wafer 12 can also be electrically connected to the substrate 11 by flip-chip or eutectic.

The package body 13 contains phosphor powder particles 21 and magnetic particles 22. The package body 13 covers the substrate 11 and covers the LED chip 12 . The package body 13 is used to protect the LED chip 12 from dust, moisture, and the like. The material of the package body 13 may be silicone, epoxy or a combination thereof. The phosphor particles 21 are stimulated to produce a desired color light. The phosphor powder particles 21 may be one of a garnet structure compound, a sulfide, a phosphide, a nitride, an oxynitride, a citrate, an arsenide, a selenide or a telluride. The magnetic particles 22 are iron, cobalt, nickel or alloy particles thereof, and may have a diameter ranging from several micrometers to several nanometers. Preferably, the magnetic particles 22 have a particle diameter of less than 100 nanometers.

Referring to FIG. 2, an embodiment of the present invention provides a method for fabricating a light emitting diode package structure 10. The method for manufacturing the LED package structure 10 includes the following steps: providing a substrate 11 for supporting The light emitting diode package structure 10. The material of the substrate 11 may be sapphire or tantalum or the like.

The light-emitting diode wafer 12 is disposed on the substrate 11. Specifically, the light-emitting diode wafer 12 can be fixed to the substrate 11 by an adhesive. The LED wafer 12 can also be electrically connected to the substrate 11 by flip-chip or eutectic.

An encapsulant 20 incorporating the phosphor particles 21 and the magnetic particles 22 is provided. Referring to FIG. 3, the encapsulating glue 20 may be made of silicone, epoxy or a combination thereof. The phosphor particles 21 are stimulated to generate light of a desired color. The phosphor powder particles 21 may be one of a garnet structure compound, a sulfide, a phosphide, a nitride, an oxynitride, a citrate, an arsenide, a selenide or a telluride. The magnetic particles 22 are iron, cobalt, nickel or alloy particles thereof, and may have a diameter ranging from several micrometers to several nanometers. Preferably, the magnetic particles 22 have a particle diameter of less than 100 nanometers.

The encapsulant 20 is overlaid onto the LED wafer 12 in an applied magnetic field that changes in the direction of the magnetic field. The applied magnetic field may be generated by a magnet or an electromagnetic coil, and the direction of the applied magnetic field changes, so that the magnetic particles 22 in the applied magnetic field move, and the encapsulating glue 20 is agitated to avoid the inclusion in the encapsulant 20 The phosphor particles 21 are precipitated such that the phosphor particles 21 are uniformly distributed in the encapsulant 20. The direction of the applied magnetic field may be changed in a clockwise or counterclockwise direction, or an alternating magnetic field may be formed, so that the direction of the magnetic field is constantly changing. Preferably, the direction of the applied magnetic field is alternately rotated counterclockwise, so that The encapsulating glue 20 is better stirred such that the phosphor particles 21 are evenly distributed in the encapsulating glue 20.

Curing the encapsulation glue 20 to form the package body 13 to obtain the light emitting diode package junction Structure 10.

In the method for fabricating a light-emitting diode package structure disclosed in the present embodiment, by incorporating magnetic particles 22 in the encapsulant 20 and applying the encapsulant 20 to the LED wafer 12, a The applied magnetic field is changed in the direction of the magnetic field, so that the phosphor particles 21 in the encapsulating glue 20 can be prevented from being precipitated, so that the phosphor particles 21 can be uniformly distributed in the cured package 13. The light-emitting diode package structure 10 disclosed in the embodiment has magnetic particles 22 in the package body 13, so that the precipitation of the phosphor powder particles 21 can be prevented by using an external magnetic field during the manufacturing process thereof, thereby enabling the light-emitting diode package structure 10 to be made. The phosphor particles 21 can be uniformly distributed in the cured package 13 to improve the light-emitting effect of the entire LED package structure 10.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

Claims (10)

A light emitting diode package structure includes a substrate, a light emitting diode chip and a package. The light emitting diode chip is disposed on the substrate, and the package covers the substrate to cover the light emitting a diode chip, the package comprising phosphor particles, wherein: the package further comprises magnetic particles, the package glue is used before the package is cured, and the magnetic particles are used to agitate the package glue Liquid to prevent precipitation of the phosphor particles in the encapsulating glue. The light emitting diode package structure according to claim 1, wherein the magnetic particles have a diameter of less than 100 nm. The light emitting diode package structure of claim 1, wherein the package material is silicone, epoxy or a combination thereof. A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a substrate; disposing a light emitting diode chip on the substrate; providing a sealing glue doped with phosphor particles and magnetic particles; In the applied magnetic field in which the direction of the magnetic field changes, the magnetic particles in the applied magnetic field move in the direction of the magnetic field to agitate the encapsulating glue to prevent precipitation of the phosphor particles in the encapsulating glue. Covering the packaged glue onto the light-emitting diode wafer; curing the package glue to form a package, and obtaining the light-emitting diode package structure. The method for manufacturing a light emitting diode package structure according to claim 4, wherein the magnetic particles have a diameter of less than 100 nm. The method of manufacturing a light emitting diode package structure according to claim 4, wherein the external magnetic field is generated by a magnet or an electromagnetic coil. The method of manufacturing a light emitting diode package structure according to claim 4, wherein the direction in which the applied magnetic field changes is clockwise or counterclockwise. The method for manufacturing a light emitting diode package structure according to claim 4, wherein the direction of change of the applied magnetic field is alternately rotated counterclockwise. The method of manufacturing a light emitting diode package structure according to claim 4, wherein the magnetic particles are iron, cobalt, nickel or alloy particles thereof. The method for manufacturing a light emitting diode package structure according to claim 4, wherein the phosphor powder particles are a garnet structure compound, a sulfide, a phosphide, a nitride, an oxynitride, and a tannic acid. One of a salt, an arsenide, a selenide or a telluride.