TWI410753B - 薄膜圖案層製造方法 - Google Patents

薄膜圖案層製造方法 Download PDF

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TWI410753B
TWI410753B TW096124614A TW96124614A TWI410753B TW I410753 B TWI410753 B TW I410753B TW 096124614 A TW096124614 A TW 096124614A TW 96124614 A TW96124614 A TW 96124614A TW I410753 B TWI410753 B TW I410753B
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ink
substrate
film pattern
pattern layer
thin film
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Chien Hung Chen
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Hon Hai Prec Ind Co Ltd
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
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Description

薄膜圖案層製造方法
本發明涉及一種薄膜圖案層製造方法。
目前製造薄膜圖案層之方法主要包括：光微影法及噴墨法。
光微影法：藉由於預備塗敷所需薄膜之基板結構上，塗敷光阻材料，將具有預定圖案之光罩設於光阻材料上，進行曝光及顯影，或加上蝕刻製程，而形成具有預設圖案之薄膜圖案層。該光微影法需要複雜之製程，並且，材料之使用效率較低而造成製造成本高。
噴墨法，此處以製備彩色濾光片為例說明。用噴墨法製造彩色濾光片主要包括以下步驟：如圖1(a)所示，提供一基板42與設置於基板42上之複數行列分佈之分隔牆44，該複數分隔牆44之側面44a限定複數收容空間46，提供一紫外光線48，該紫外光線48垂直於所述基板42的表面照射。如圖1(b)、(c)所示，使用一噴墨裝置50，該噴墨裝置50具有噴墨孔52，該噴墨頭52將形成薄膜材料之墨水54R、54G、54B噴入該複數收容空間46內，墨水54R、54G、54B被固化後於該基板42上形成預定之薄膜圖案層，其中，墨水54R、54G、54B分別為紅、綠、藍色墨水。使用噴墨法製造彩色濾光片能夠一次形成薄膜圖案層。由於製程大量簡化，材料使用經濟，因此成本大幅降低。
Proceedings of the 2005 IEEE(第258至260頁)於 2005年11月公開了標題為“The Fluid Property Dependency on Ink Jetting Characteristics”之論文中提到工業噴墨製程如噴墨法製造彩色濾光片之製程中，噴墨墨水需具有適應於噴墨製程之粘性(viscosity)(surface tension)。因此，可選擇粘性與表面張力較強之噴墨墨水來增強墨水與基板以及墨水與分隔牆之間之潤濕性；當然也可以採用圖1(a)中所示之對基板及分隔牆照射紫外線的方法。在圖1所示的製程中，紫外光線48可以使空氣中之新增臭氧或原有之臭氧分離出活性氧，使表面上附著之較不親水性之污染物質分解去除，而使基板42表面與墨水54R、54G、54B之間之潤濕性提升；另，當基板42或分隔牆44為有機系材料時，紫外光線48還可以破壞該有機材料表面之不飽和鍵，而使親水性之官能性加入，使其與墨水54R、54G、54B之間之潤濕性更強。
在傳統的製程中，由於該紫外光線48垂直於所述分隔牆44之頂部表面44b照射，使得分隔牆44之頂部表面44b與墨水54R、54G、54B潤濕性能較強，而分隔牆44之側面44a與墨水54R、54G、54B之潤濕性能相對較弱。當某一收容空間42內之墨水噴出量過大而使液面高出分隔牆44之頂部表面44b時，比如54R、54G之液面高出分隔牆44之頂部表面44b，可能會由於墨水54R、54G與分隔牆44之間之潤濕性過強而使墨水54R沿著分隔牆44頂部表面44b向與墨水54R相鄰之墨水54G方向流動而與墨水54G發生混色，影響所述薄膜圖案層之品質。
有鑒於此，有必要提供一種可提高薄膜圖案層品質之薄膜圖案層製造方法。
一種薄膜圖案層製造方法，包括以下步驟：提供一基板，其表面具有與該基板一體成型之複數分隔牆，所述分隔牆之材料為樹脂光阻材料，且所述樹脂光阻材料經波長小於320奈米之紫外光照射後其潤濕性增強，該複數分隔牆間形成複數收容空間；提供一光罩與一紫外光源，其中，所述光罩設置於所述紫外光源與所述分隔牆之間，所述光罩包括複數用於遮擋分隔牆之頂部表面之遮光部與複數可透過光線至收容空間之透光部；所述紫外光源發出紫外光線對所述複數分隔牆之側面及基板表面進行照射；填充墨水至該複數收容空間內；及固化墨水以形成薄膜圖案層。
所述之薄膜圖案層製造方法中，在紫外光源與分隔牆之間設置光罩，使分隔牆頂部表面免於紫外光照射，從而可以使分隔牆頂部表面與墨水之間具有較弱潤濕性能，減少了當某一收容空間內之墨水溢出至分隔牆頂部表面時向與之相鄰之收容空間流動之趨勢，從而減少相鄰收容空間內墨水之混色，提高薄膜圖案層之品質。
下面將結合附圖對本發明實施例作進一步之詳細說明。
本發明第一實施例提供一種薄膜圖案層製造方法，該方法包括以下步驟：
1)提供一基板，其表面具有複數分隔牆，該複數分隔牆間形成複數收容空間。
2)提供一光罩與一紫外光源，其中，所述光罩設置於所述紫外光源與所述分隔牆之間，所述光罩包括複數用於遮擋分隔牆之頂部表面之遮光部與複數可透過光線至收容空間之透光部。
3)所述紫外光源發出紫外光線透過所述透光部對複數分隔牆之側面及基板表面進行照射。
4)填充墨水至該複數收容空間內。
5)固化墨水以形成薄膜圖案層。
下面將結合附圖對上述方法進行詳細說明：請參閱圖2(a)，在步驟1)中，提供一表面設置有呈行列排佈之複數分隔牆104之基板102，各分隔牆104分別具有複數側面104a與一頂部表面104b，該複數分隔牆104之複數側面104a限定複數收容空間107，該複數收容空間107通常成陣列式排列。一般地，該頂部表面104b與基板102表面平行，所述側面104a與基板102所成角度θ大於90度。可以理解，該複數收容空間107還可以馬賽克方式或不規則方式排列等，並不限於本實施例。
在步驟2)中，提供一曝光光源60與一光罩200，該光罩200設置於該曝光光源60與該基板102之間。一般地，所述曝光光源60為紫外光源，本實施例曝光光源60發出紫外光線109。所述光罩200包括一透光部200b及透光部 200b表面之複數遮光部200a，所述複數遮光部200a所形成之圖案與複數分隔牆104在基板102表面所形成之圖案相對應。所述遮光部200a用於遮擋曝光光源60發出之射向分隔牆104頂部表面104b部分之光線，所述透光部200b之作用為透過所曝光光源60發出之射向組成收容空間107之基板102及分隔牆104側面104a部分之光線。於圖2(a)中，所述光罩200與分隔牆104隔開一段距離，可以理解，所述光罩200還可以相接觸設置，並不限於本實施例。
在步驟3)中，所述曝光光源60以垂直於所述基板102表面之方向發出紫外光線109，由於光罩200之遮光部200a之遮擋，所述紫外光線109僅射向基板102表面以及分隔牆104之側面104b。可以理解，所述曝光光源60之曝光光線亦可以與基板102表面成其他角度，並不限於本實施例之與基板102表面之垂直關係。
如圖2(b)與(c)所示，在步驟4)中，利用一噴墨裝置300將所需薄膜材料之墨水108填充至收容空間107內以形成墨水層110，其中，該噴墨裝置300包括至少一個噴墨頭302與設置於該噴墨頭302之至少一個噴墨孔304，墨水108藉由該噴墨孔304噴出。
在步驟5)中，利用一固化裝置(圖未示)對該複數墨水層110加以固化，以形成薄膜圖案層。該固化裝置可為一加熱裝置或一紫外線曝光裝置或一抽真空裝置或上述裝置之其中任意兩種或三種之組合。本實施例之墨水層110以間隔排列之紅色墨水層110R、綠色墨水層110G與藍色墨 水層110B為例進行說明。
需要說明，步驟3)中對基板102表面及分隔牆104側面104a照射紫外光線109之目的為增強基板102表面及分隔牆104側面104a與墨水108之間之潤濕性，以使墨水108更好地附著於其上。另外，所述分隔牆104的材料可以為包含有對紫外光敏感材料，當紫外光照射於其上時，所述紫外光敏感材料與墨水108之潤濕性能增強，從而使分隔牆104側面104a與墨水108之潤濕性能更強。
本實施例中，所述曝光光源60優選為低壓直管式紫外光源。另，所述曝光光源60之波長優選小於320奈米，與此波長範圍相適應，所述光罩200之材料一般採用鉻、樹脂材料等，所述分隔牆104之材料可以為樹脂光阻材料等，可使分隔牆104之側面104a經過紫外光線照射後，呈現較好之與墨水108之潤濕性。
相對於先前技術，本方法在曝光光源60與分隔牆108採用了光罩200，使分隔牆104之側面104a受到照射，而分隔牆104之頂部表面104b由於光罩200之遮光部200a之遮擋而未受到照射，從而使側面104a與墨水108之潤濕性更強，墨水108在分隔牆104側面104a之附著更牢固，同時也避免由於頂部表面104b潤濕性增強而發生之相鄰墨水層混色。
該基板102之材料可以選自玻璃、石英玻璃、矽晶圓(wafer)、金屬以及塑膠等，本實施例中，該基板102係一玻璃基板。該噴墨裝置300可以為熱泡式噴墨裝置或壓 電式噴墨裝置等。
請參閱圖3，為根據第一實施例之製造方法形成之薄膜圖案層100，該薄膜圖案層100每一列之墨水層110為同種顏色，每一行中之墨水層110按不同顏色間隔排列，如按照紅色墨水層110R、綠色墨水層110G與藍色墨水層110B之排列順序間隔排列。當然，所述墨水層110還可以為其他排列方式，並不限於本實施例。
請參閱圖4，係本發明第二實施例基板與分隔牆結構。如圖4所示，分隔牆206設置於基板102表面且分隔牆206之側面208與基板102所成角度θ1為90度。
請參閱圖5，係本發明第三實施例之基板與分隔牆結構。如圖5所示，基板202及分隔牆204之結構與圖4中之基板102及分隔牆206之結構基本相同，不同之處在於該基板202與分隔牆204為一體結構，該基板202與分隔牆204之材料選自玻璃、石英玻璃、金屬與塑膠。
綜上所述，本發明確已符合發明專利之要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100‧‧‧薄膜圖案層
102,202‧‧‧基板
104,204,206‧‧‧分隔牆
104a‧‧‧側面
104b‧‧‧頂部表面
107‧‧‧收容空間
108‧‧‧墨水
109‧‧‧紫外光線
110‧‧‧墨水層
110B‧‧‧藍色墨水層
110G‧‧‧綠色墨水層
110R‧‧‧紅色墨水層
200‧‧‧光罩
200a‧‧‧遮光部
200b‧‧‧透光部
300‧‧‧噴墨裝置
302‧‧‧噴墨頭
304‧‧‧噴墨孔
60‧‧‧曝光光源
圖1係先前技術之一種薄膜圖案層製造方法之流程示意圖。
圖2(a)至圖2(c)係本發明第一實施例提供之一種薄膜圖 案層製造方法之示意圖。
圖3係根據圖2所示之薄膜圖案層製造方法所製造之薄膜圖案層之截面示意圖。
圖4係本發明第二實施例提供之基板與分隔牆結構之截面示意圖。
圖5係本發明第三實施例提供之基板與分隔牆結構之截面示意圖。
102‧‧‧基板
104‧‧‧分隔牆
104a‧‧‧側面
104b‧‧‧頂部表面
107‧‧‧收容空間
108‧‧‧墨水
109‧‧‧紫外光線
110‧‧‧墨水層
110B‧‧‧藍色墨水層
110G‧‧‧綠色墨水層
110R‧‧‧紅色墨水層
200‧‧‧光罩
200a‧‧‧遮光部
200b‧‧‧透光部
300‧‧‧噴墨裝置
302‧‧‧噴墨頭
304‧‧‧噴墨孔
60‧‧‧曝光光源

Claims (8)

  1. 一種薄膜圖案層製造方法，包括以下步驟：提供一基板，其表面具有與該基板一體成型之複數分隔牆，所述分隔牆之材料為樹脂光阻材料，且所述樹脂光阻材料經波長小於320奈米之紫外光照射後其潤濕性增強，該複數分隔牆間形成複數收容空間；提供一光罩與一紫外光源，其中，所述光罩設置於所述紫外光源與所述分隔牆之間，所述光罩包括複數用於遮擋分隔牆之頂部表面之遮光部與複數可透過光線至收容空間之透光部；紫外光源發出紫外光線透過所述透光部對複數分隔牆之側面及基板表面進行照射；填充墨水至該複數收容空間內；及固化墨水以形成薄膜圖案層。
  2. 如申請專利範圍第1項所述之薄膜圖案層製造方法，其中，所述光罩之材料為鉻。
  3. 如申請專利範圍第1項所述之薄膜圖案層製造方法，其中，所述紫外光線之方向垂直於所述基板表面。
  4. 如申請專利範圍第1項所述之薄膜圖案層製造方法，其中，所述之基板材料選自玻璃、石英玻璃、金屬與塑膠。
  5. 如申請專利範圍第1項所述之薄膜圖案層製造方法，其中，所述之填充墨水之步驟係利用一噴墨裝置將墨水填充至收容空間內，該噴墨裝置包括至少一個噴墨頭與設置於噴墨頭上之至少一個噴墨孔。
  6. 如申請專利範圍第5項所述之薄膜圖案層製造方法，其中 ，所述之噴墨裝置係熱泡式噴墨裝置或壓電式噴墨裝置。
  7. 如申請專利範圍第1項所述之薄膜圖案層之製造方法，其中，所述之固化步驟係利用一加熱裝置或一抽真空裝置、或一曝光裝置、或上述裝置之其中兩種或三種之任意組合固化墨水。
  8. 如申請專利範圍第7項所述之薄膜圖案層之製造方法，其中，所述之曝光裝置係一紫外線曝光裝置。
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EP1072927A2 (en) * 1999-07-29 2001-01-31 Canon Kabushiki Kaisha Colour filter for a liquid crystal panel and process for producing it
US7604928B2 (en) * 2005-12-22 2009-10-20 Canon Kabushiki Kaisha Patterning method and methods for producing electro-optic device, color filter, illuminant, and thin-film transistor

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