TWI404936B - Cantilever-type micro contact probe with hinge structure - Google Patents

Abstract

According to the present invention, allowable displacement can be increased from an excellent stress relaxation effect achieved by applying a hinge structure while adopting advantages of a dual beam cantilever-type probe that can reduce scrub. Since the hinge structure is a structure that does not receive a moment, an effect that is the same as eliminating a moment in a conventional prove can be achieved so that stress can be evenly applied and the allowable displacement of the probe can be increased.

Description

Cantilever microprobe with hinge structure

The invention relates to a microprobe for a probe card, in particular to a cantilever microprobe having a double beam structure.

With the development of technology, semiconductor wafers have been highly integrated. In general, semiconductor wafers fabricated through microfabrication are electrically tested prior to the packaging process to pick up defective products. For electrical testing, a probe card is used to connect the tester to the electrode pads of the semiconductor wafer.

Probes (also called contactors or probes) mounted on the probe card can be divided into cantilever type and vertical type. The probe should have a structure that absorbs the step difference between the electrode pads and at the same time removes the native oxide on the electrode pads.

In order to meet these requirements, a microprobe having a single beam shape as shown in Fig. 1 has been disclosed as a typical cantilever probe. As shown in FIG. 1, the conventional cantilever type micro-probe is composed of a connecting portion 101 connected to a probe card (not shown), an extending portion 103 extending laterally from the connecting portion 101, and a A contact portion 105 having a tip end 107 formed by projecting one end of the extension portion 103 to contact a pad of a semiconductor wafer.

As shown in FIG. 1 , since the connection portion 101 of the conventional cantilever micro-probe extends in the vertical direction, that is, in the vertical direction, and the extension portion 103 extends in the left-right direction, that is, in the horizontal direction, The cantilevered microprobe has a single beam.

Since the cantilever type micro probes are formed in a single beam shape, stress concentration is likely to occur and plastic deformation is likely to occur. In addition, since the length of the grip arm is too long, the conventional cantilever type microprobe cannot be used for a small electrode pad.

In order to overcome the disadvantages of a cantilever type microprobe having a single beam, a cantilever type microprobe having a double beam of Figs. 2 and 3 is disclosed.

As shown in Fig. 2, the conventional cantilever type micro-probe having a double beam has a connecting portion 111 connected to a probe card (not shown), and an extension portion extending laterally from the connecting portion 111. 113, and a contact portion 115 having a tip 117 formed by projecting one end of the extension portion 113 to contact the pad of the semiconductor wafer.

In the second embodiment, the extension portion 113 includes an upper beam 113a and a lower beam 113b which are arranged one above another, and the extension portion 113 has a long slit-shaped opening 113c formed between the upper and lower beams 113a and 113b. A pair of beam shapes.

According to the conventional cantilever type microprobe having a double beam according to Fig. 2, when the tip end 117 of the contact portion 115 is in contact with the electrode pad of the semiconductor wafer during the semiconductor wafer test, the load acts on the probe, and the first The length of the needle arm can be shortened compared to the conventional probe of the figure.

However, when the conventional cantilever type microprobe having the double beam of Fig. 2 is deformed by an external force, the probe may have a problem of stress concentration.

As shown in Fig. 3, the conventional cantilever type micro-probe having a bellows-shaped double beam is connected by a connecting portion 121 connected to a probe card (not shown), and is laterally extended by the connecting portion 121. The extending portion 123 and a contact portion 125 having a tip end 127 are formed by projecting one end portion of the extending portion 123 to contact the electrode pad of the semiconductor wafer.

In the third embodiment, the extending portion 123 includes an upper beam 123a and a lower beam 123b which are arranged one above another, and the extending portion 123 is formed by forming a long slit-shaped opening 123c between the upper and lower beams 123a and 123b. A pair of beam shapes.

In this case, the shape of the extension portion 123 has a corrugated tubular double beam which is bent in different directions while having at least one inflection point, unlike the straight double beam shape as shown in FIG. .

According to the conventional cantilever type microprobe having a double beam according to Fig. 3, when the tip end 127 of the contact portion 125 is in contact with the electrode pad of the semiconductor wafer during the semiconductor wafer test, the load acts on the probe, and the first The length of the needle arm can be shortened compared to the conventional probe of the figure. In particular, since the extension portion 123 has a bellows shape, the out of plane behaveier and stress concentration can be reduced.

However, when the conventional cantilever type microprobe having a bellows-shaped double beam shown in FIG. 3 is deformed by an external force, the probe requires more stress relaxation, and due to too many design variables and complicated shapes, Can't be easily designed.

The above information disclosed in this background is only intended to enhance the understanding of the background of the invention, and thus the information also includes information that is not described in the prior art, but is known to those of ordinary skill in the art.

In view of the above problems, an object of the present invention is to provide a double beam cantilever type microprobe having a hinge structure which is free from a moment to prevent stress concentration due to deformation.

In order to achieve the above object, a cantilever type microprobe according to the present invention includes: a connecting portion connected to a probe card; and an extending portion extending laterally by the connecting portion. And having a double beam; a contact portion protruding from one end of the extending portion to form a tip to contact the electrode pad of the semiconductor wafer; and a hinge portion disposed between the extending portion and the contact portion, and not Torque is transmitted from the contact to the extension.

The hinge portion may include a convex portion and a concave portion corresponding to the shape, and when the micro-probe is deformed by an external force, the convex portion serves as a center of rotation and the concave portion guides the convex portion.

The hinge portion can form a gap between the convex portion and the concave portion, and when the external force acts on the microprobe, the convex portion and the concave portion are kept separated from each other.

The hinge portion may further include a protrusion formed by the extension portion to surround the protrusion portion.

The extension portion includes a first beam and a second beam arranged up and down, and an opening is formed between the first and second beams.

At least one of the first and second beams may have a bellows shape that is curved and at the same time has at least one inflection point.

The hinge portion may be formed between the second beam of the extension and the contact portion.

The hinge portion can form a hinge structure by forming a corresponding convex portion and a concave portion and forming a gap between the concave portion and the convex portion. When no external force acts on the microprobe, the The hinge portion can maintain the second beam and the contact portion of the extension portion separated from each other.

The hinge portion may further include a protrusion formed by the recess extending to surround the protrusion.

The protrusion may be formed on one of the second beam and the contact portion of the extension portion, and the recess portion is formed on the other one.

In the extending portion, a broken line connecting the end portion of the first beam connecting portion and the end portion of the contact portion and a broken line connecting the end portion of the second beam connecting portion and the end portion of the contact portion may be set to each other intersect.

The connecting portion and the extending portion may be made of a metal material selected from the group consisting of nickel, a nickel alloy, and phosphor bronze, and the contact portion is selected from the group consisting of cobalt, cobalt alloy, niobium, tantalum alloy, and the like. Made of a metal material of a group of alloys.

The cantilevered microprobe extending laterally and having a fixed first end and a non-fixed second end can include a hinge structure that does not apply an external load to the second end of the microprobe The generated torque is transmitted to the first end.

The present invention provides a double beam cantilever microprobe having a hinge structure that is free from moments to prevent stress concentration due to deformation of the microprobe.

The pivot structure transmits force without transmitting torque, so that the formation of the hinge structure is free from moments, so that the effect of eliminating torque by only conventional probes can be produced. As a result, the stress concentration due to the moment can be completely prevented.

These structures have the advantage of effectively preventing stress concentration, and also the advantages of the conventional double beam, which is the double beam cantilever type microprobe shortening the effect of the needle arm, and can be formed by forming a curved portion in the double beam to form a corrugation Tube shape to achieve the effect of preventing the behavior of the plane.

In order to provide a better understanding and understanding of the technical features and the efficacies of the present invention, the preferred embodiments and related drawings are provided for the purpose of assistance, and the detailed descriptions are followed by a description. .

Hereinafter, the double-beam cantilever type micro-probe having a hinge structure according to a preferred embodiment of the present invention will be described with reference to the related drawings. For ease of understanding, the same elements in the following embodiments are denoted by the same reference numerals.

Please refer to FIG. 4 and FIG. 5, which are diagrams showing a double beam cantilever type microprobe having a hinge structure according to a first embodiment and a modification of the first embodiment, and FIGS. 6 and 7 show the present invention. The bellows type double beam cantilever type microprobe having a hinge structure according to the second embodiment and the second embodiment, and Figs. 8 and 9 show the cantilever type microprobe according to the third and fourth embodiments of the present invention.

As shown in FIG. 4, the cantilever type microprobe according to the first embodiment of the present invention includes a connecting portion 11 connected to a probe card (not shown), and an extending portion 13 by which the connecting portion 11 is Laterally extending; a contact portion 15 having a tip end 17 formed by projecting one end of the extension portion 13 and contacting the pad of the semiconductor wafer.

The extension 13 of the cantilever microprobe of this embodiment has a double beam. In other words, the extending portion 13 includes a first beam 13a and a second beam 13b arranged up and down, and a long slit-shaped opening 13c is formed between the first and second beams 13a and 13b. The opening 13c may be formed only inside the extension portion 13, or may extend to the connection portion 11 or the contact portion 15 as designed.

In addition, the double beam cantilever micro-probe of the present embodiment is between the extension portion 13 and the contact portion 15, and more specifically, as shown in a partially enlarged view of FIG. 4, the second beam 13b of the extension portion 13 is attached. There is a hinge portion between the contact portion 15.

The hinge portion includes a convex portion 16a and a concave portion 16b corresponding in shape. When an external force acts on the probe, the second beam 13b of the extending portion 13 and the contact portion 15 contact each other to form a hinge structure. When no external force acts on the probe, the gap 14 is formed between the second beam 13b of the extension 13 and the contact portion 15 to keep them separated.

The convex portion 16a serves as a center of rotation, and the concave portion 16b guides the convex portion 16a as a center of rotation. In the fourth embodiment, the convex portion 16a is formed on the second beam 13b of the extending portion 13, and the concave portion 16b is formed on the contact portion 15, but is not limited thereto. According to a variant, the recess can be formed on the second beam of the extension, and the protrusion can be formed on the contact.

In the case of the above configuration, the cantilever type microprobe of the present embodiment is connected to the contact portion 15 when the tip end 17 of the contact portion 15 comes into contact with the pad of the semiconductor wafer during the semiconductor wafer test to cause a load to act on the probe portion. The first beam 13a will be deformed first. When the displacement is larger than the gap 14 due to the deformation of the first beam 13a, the extension portion 13 and the contact portion 15, that is, the second beam 13b and the contact portion 15 of the extension portion 13 come into contact with each other to deform the second beam 13b.

In this case, when the convex portion 16a comes into contact with the concave portion 16b, the urging force is transmitted from the contact portion 15 to the second beam 13b of the extending portion 13. However, since the gap 14 between the second beam 13b of the extension portion 13 and the contact portion 15 is not directly connected, the second beam 13b and the contact portion 15 of the extension portion 13 are only when the displacement is larger than the gap 14. Real contact with each other allows the force to be transmitted.

As shown in the prior art, when a force is applied during the test of the semiconductor wafer, the structure in which the extension portion and the contact portion directly contact each other is subjected to a moment, so that the stress is concentrated at the meeting of the first beam and the second beam.

However, as shown in this embodiment, the hinge structure is formed between the extending portion 13 and the contact portion 15, so that no torque is transmitted even if a force is applied, whereby stress concentration can be greatly reduced.

As shown in Fig. 5 and the first embodiment, the cantilever type microprobe according to the modification of the first embodiment of the present invention is connected to a connecting portion 21 of a probe card (not shown), and the connection is made by the connection. The portion 21 is formed by a laterally extending extension portion 23 and a contact portion 25 having a tip end 27 formed by projecting one end portion of the extension portion 23 and contacting the pad of the semiconductor wafer.

In addition, the extension portion 23 of the cantilever type microprobe of the present modification includes a first beam 23a and a second beam 23b arranged up and down, and has a long slit formed between the first and second beams 23a and 23b. The double beam shape of the opening 23c.

In addition, as shown in a partially enlarged view of FIG. 5, the double beam cantilever type microprobe of the present modification has a hinge structure which is between the extension portion 23 and the contact portion 25, more specifically, A gap 24, a convex portion 26a and a concave portion 26b are included between the second beam 23b of the extending portion 23 and the contact portion 25.

According to the first embodiment, the recessed portion 16b has a shape close to a semicircle, and thus surrounds the convex portion 16a which is nearly half, but according to the present modification, the first beam 23a is formed with a protruding portion 26c at the junction with the contact portion 25, so that The recessed portion 26b extends. Therefore, compared with the depressed portion 16b of the first embodiment, the modified example of the present invention can form the depressed portion 26b surrounding the more than half of the convex portion 26a, so that the hinge structure can be formed more stably.

In order to operate the hinge normally, it is preferable to separate the projection 26c from the second beam 23b by a predetermined distance to prevent the end of the projection 26c from being disturbed by the second beam 23b when the probe is deformed.

In the fifth embodiment, the convex portion 26a is formed on the second beam 23b of the extending portion 23, and the concave portion 26b is formed on the contact portion 25, but is not limited thereto. The recessed portion 26b may be formed on the second beam 23b of the extending portion 23, and the convex portion 26a may be formed on the contact portion 25.

As described above, according to the modification of the first embodiment of the present invention, since the hinge structure is provided between the extending portion 23 and the contact portion 25, the moment is not transmitted even when the force is applied, so that the stress concentration can be greatly reduced.

As shown in FIG. 6, the cantilever type micro-probe according to the second embodiment of the present invention has a connecting portion 31 connected to a probe card (not shown), and an extension extending laterally from the connecting portion 31. A portion 33, and a contact portion 35 having a tip end 37 formed by projecting one end portion of the extending portion 33 and contacting the pad of the semiconductor wafer, as described in the first embodiment of the present invention.

In addition, as shown in FIG. 6, the extension portion 33 of the cantilever type microprobe of the present embodiment includes a first beam 33a and a second beam 33b arranged up and down, and has a double beam structure, wherein the first A long slit-shaped opening 33c is formed between the second beams 33a and 33b.

In addition, as shown in a partially enlarged view of FIG. 6, the double beam cantilever type microprobe of the present modification has a hinge structure which is between the extension portion 33 and the contact portion 35, and more specifically, is The second beam 33b of the extending portion 33 and the contact portion 35 include a gap 34, a convex portion 36a and a concave portion 36b.

In the sixth embodiment, the convex portion 36a is formed on the second beam 33b of the extending portion 33, and the concave portion 36b is formed on the contact portion 35, but is not limited thereto. The recessed portion 36b may be formed on the second beam 33b of the extending portion 33, and the convex portion 36a may be formed on the contact portion 35.

According to the cantilever type microprobe of the embodiment, the extension portion has a corrugated tubular double beam structure which is bent in different directions while having at least one inflection point, unlike the first embodiment and its modification. Close to the straight double beam shape.

In Fig. 6, the extension portion 33 is composed of a first beam 33a and a second beam 33b which respectively form different shapes, but when forming the bellows-shaped extension portion of the second embodiment of the present invention, the first beam and the first beam The second beam can form the same shape.

In other words, when the extension portion is formed by the first and second beams forming the same shape, the position of the inflection point at which the curve direction of the first and second beams changes and the tangent slope of the inflection point may be the same of. In addition, when the extension portion is formed by the first and second beams forming different shapes, the position of the inflection point where the curve direction of the first and second beams is changed and the tangent slope of the inflection point are changed at least One or both of them.

In addition, at least one of the first and second beams may be formed into a bellows instead of forming the first and second beams into a bellows.

As shown in Fig. 6, if the double beam microprobe has a bellows shape, the length of the needle arm can be shortened while preventing the plane behavior. Adjacent probes may interfere with each other when the out-of-plane behavior occurs, so the possibility of planar behavior should be eliminated in design.

When the in-plane bending stiffness is less than the out-of-plane bending stiffness, planar behavior occurs, and the out-of-plane behavior is often caused by process errors that cannot be avoided in the probe manufacturing process. However, since the probe having the bellows-shaped double beam shape of the second embodiment has a characteristic of being able to reduce the in-plane rigidity without being affected by the out-of-plane rigidity, the out-of-plane behavior can be prevented.

The corrugated tubular double beam probe of the second embodiment can alleviate the stress, shorten the needle arm, and at the same time prevent the out-of-plane behavior. Further, as described above, according to the present embodiment, when the hinge structure is formed between the extending portion 33 and the contact portion 35, the torque is not transmitted even if the force is applied, so that the stress concentration can be greatly reduced.

Further, the cantilever type microprobe of the present embodiment can be produced by the electrodeposition method, so that a complicated bellows shape can be easily produced.

As shown in FIG. 7, the cantilever type microprobe according to the modification of the second embodiment of the present invention is connected to a connecting portion 41 of a probe card (not shown), and is laterally connected by the connecting portion 41. An extended extension portion 43 and a contact portion 45 having a tip end 47 formed by projecting one end portion of the extension portion 43 and contacting the pad of the semiconductor wafer, as in the second embodiment of the present invention Shower.

In addition, the extension portion 43 of the cantilever type microprobe of the present modification has a bellows shape, as shown in FIG. 7, including a first beam 43a and a second beam 43b arranged up and down, and has a double beam structure, wherein A long slit-shaped opening 43c is formed between the first and second beams 43a and 43b.

In addition, as shown in a partially enlarged view of FIG. 7, the double beam cantilever type microprobe of the present modification has a hinge structure which is between the extending portion 43 and the contact portion 45, and more specifically, is The gap between the second beam 43b of the extending portion 43 and the contact portion 45 includes a gap 44, a convex portion 46a and a recess portion 46b.

According to the second embodiment, the recessed portion 36b has a shape close to a semicircle, and thus surrounds the convex portion 36a which is nearly half, but according to the present modification, the first beam 43a is formed with a protruding portion 46c at the junction with the contact portion 45, so that The recess 46b extends. Therefore, compared with the recessed portion 36b of the second embodiment, the present modification can form the recessed portion 46b that surrounds more than half of the convex portion 46a, so that the hinge structure can be formed more stably.

In order to operate the hinge normally, it is preferable to separate the projection 46c from the second beam 43b by a predetermined distance to prevent the end of the projection 46c from being disturbed by the second beam 23b when the probe is deformed.

In the seventh embodiment, the convex portion 46a is formed on the second beam 43b of the extending portion 43, and the concave portion 46b is formed on the contact portion 45, but is not limited thereto. A recess 46b may be formed on the second beam 43b of the extension, and the protrusion may be formed on the contact.

As described above, in the present modification, since the hinge structure is provided between the extending portion 43 and the contact portion 45, the moment is not transmitted even when the force is applied, so that the stress concentration can be greatly reduced.

Referring to Figures 8 and 9, there are shown cantilevered microprobes of the third and fourth embodiments of the present invention. Figures 8 and 9 illustrate the angles a1 and a2 set between the first beam and the second beam of the double beam cantilever microprobe. Fig. 8 shows a probe having a bellows type extension, and Fig. 9 shows a probe having a straight extension. Although the hinge structure is not illustrated in FIGS. 8 and 9, the microprobes of these embodiments have the same structure as the hinge portion shown in FIGS. 4 to 7.

According to the cantilever type microprobes of the embodiments, when the tip of the contact portion contacts the pad of the semiconductor wafer during the semiconductor wafer test to cause a load to act on the probe, the needle can be shortened compared with the conventional probe. Arm length.

In the double beam cantilever microprobe, rotation relative to the curved probe tip can be produced by setting the length of the needle arm of the second beam to be greater than the length of the needle arm of the first beam. As a result, the needle arm can be shortened.

As shown and illustrated in Figures 8 and 9, an angle of inclination a1 or a2 may be provided between the first and second beams to set the length of the arm of the second beam to be greater than the length of the arm of the first beam. . Alternatively, it may be set such that the length of the second beam is greater than the length of the first beam or the first beam may be convex upward and the second beam may be convex downward to set the second The length of the beam arm of the beam is greater than the length of the needle arm of the first beam.

Referring to FIGS. 8 and 9 , the inclination angles a1 and a2 are angles formed by the broken lines in the extension portion, wherein the end portion connecting the first beam connection portion and the end portion of the contact portion are connected to the second beam. The dotted lines of the end portions of the portions and the ends of the contact portions are set to intersect each other.

In the above cantilever type microprobe, the case where the hinge structure between the extending portions 13, 23, 33 and 43 and the contact portions 15, 25, 35 and 45 is before and after the contact, before the contact, only the first beam 13a , 23a, 33a, and 43a are loaded, but after contact, the first beams 13a, 23a, 33a, and 43a together with the second beams 13b, 23b, 33b, and 43b are loaded, so the probe rigidity may be before and after the contact. Different. Therefore, the size of the gaps 14, 24, 34, and 44 of the hinge structure is utilized as a design variable to make the probe of the embodiment of the present invention variable in rigidity.

Further, in the cantilever type microprobe according to the embodiment of the present invention, the connecting portions 11, 21, 31 and 41 and the extending portions 13, 23, 33 and 43 may be made of a metal material selected from the group consisting of nickel, nickel alloy, and phosphor bronze. It is made, and the contact portions 15, 25, 35, and 45 may be made of a metal material selected from the group consisting of cobalt, cobalt alloy, tantalum, niobium alloy, and alloys thereof.

In addition, the cantilever type microprobes of these embodiments can be fabricated by electrodeposition, so that a complicated bellows shape or a hinge structure can be easily fabricated.

Further, although the convex portion and the concave portion of the hinge structure in FIGS. 4 to 7 are formed in a circular shape, a polygonal shape such as an elliptical shape, a triangular shape, or a quadrangular shape may be formed as long as it can serve as a hinge.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

11, 21, 31, 41‧‧‧ Connections
13, 23, 33, 43‧ ‧ extensions
13a, 23a, 33a, 43a‧‧ ‧ upper beam
13b, 23b, 33b, 43b‧‧‧ Lower beam
13c, 23c, 33c, 43c‧‧
14, 24, 34, 44‧ ‧ gap
15, 25, 35, 45‧ ‧ contact
16a, 26a, 36a, 46a‧‧ ‧ convex
16b, 26b, 36b, 46b‧‧‧ recessed
26c, 46c‧‧‧ protruding parts
17, 27, 37, 47‧ ‧ cutting edge

Figure 1 is a schematic view of a single cantilever microprobe of the prior art;
Figure 2 is a schematic view of a cantilevered microprobe having a double beam according to a conventional technique;
Figure 3 is a schematic view of a cantilevered microprobe having a corrugated tubular double beam of the prior art;
4 is a schematic view of a double beam cantilever type microprobe having a hinge structure according to a first embodiment of the present invention;
Figure 5 is a schematic view showing a double-beam cantilever type micro-probe having a hinge structure according to a modification of the first embodiment of the present invention;
Figure 6 is a schematic view showing a corrugated tubular double-beam cantilever type micro-probe having a hinge structure according to a second embodiment of the present invention;
Figure 7 is a schematic view showing a corrugated tubular double-beam cantilever type micro-probe having a hinge structure according to a modification of the second embodiment of the present invention;
Fig. 8 is a view showing a cantilever type microprobe according to a third embodiment of the present invention; and Fig. 9 is a view showing a cantilever type microprobe according to a fourth embodiment of the present invention.

11‧‧‧Connecting Department

13‧‧‧Extension

13a‧‧‧上梁

13b‧‧‧Lower beam

13c‧‧‧ openings

14‧‧‧ gap

15‧‧‧Contacts

16a‧‧‧ convex

16b‧‧‧Depression

17‧‧‧ tip

Claims (13)

A cantilever type microprobe for conducting an electrical test of a semiconductor wafer, comprising:
a connecting portion connected to a probe card;
An extension portion extending laterally from the connecting portion and having a double beam shape;
a contact portion protruding from one end of the extending portion to form a tip to contact the pad of the semiconductor wafer; and a hinge portion disposed between the extending portion and the contact portion without receiving a moment by the contact The part is transferred to the extension. The cantilever type microprobe according to claim 1, wherein the hinge portion includes a convex portion and a concave portion corresponding to a shape, and when the microprobe is deformed by an external force, the convex portion becomes a rotation center and the convex portion The recess guides the projection. The cantilever type microprobe according to claim 2, wherein the hinge portion forms a gap between the convex portion and the concave portion, and when there is no external force acting on the microprobe, the convex portion and the concave portion are formed. The departments are kept separate from each other. The cantilever type microprobe according to claim 2, wherein the hinge portion further comprises a protrusion formed by extending the extension portion to surround the protrusion portion. The cantilever type microprobe of claim 1, wherein the extending portion comprises a first beam and a second beam arranged up and down, and an opening is formed between the first and second beams. A cantilever type microprobe according to claim 5, wherein at least one of the first and second beams has a bellows shape which is curved and at the same time has at least one inflection point. A cantilever type microprobe according to claim 5 or 6, wherein the hinge portion is formed between the second beam of the extension and the contact portion. The cantilever type microprobe according to claim 7, wherein the hinge portion is formed by having a convex portion and a concave portion corresponding to the shape and forming a gap between the concave portion and the convex portion. In the pivot structure, when no external force acts on the microprobe, the hinge portion keeps the second beam and the contact portion of the extension portion separated from each other. The cantilever type microprobe of claim 8 , wherein the hinge portion further comprises a protrusion formed by the recess extending to surround the protrusion. The cantilever type microprobe of claim 8, wherein the convex portion is formed on one of the second beam and the contact portion of the extending portion, and the depressed portion is formed on the other one. The cantilever type microprobe according to claim 5 or 6, wherein in the extending portion, a line connecting the end of the first beam connecting portion and the end portion of the contact portion and connecting the second beam is connected The dotted ends of the ends of the portions and the ends of the contact portions are set to intersect each other. The cantilever type microprobe according to claim 1, wherein the connecting portion and the extending portion are made of a metal material selected from the group consisting of nickel, a nickel alloy, and phosphor bronze, and the contact is The moiety is made of a metal material selected from the group consisting of cobalt, cobalt alloys, niobium, tantalum alloys, and alloys thereof. A cantilever type microprobe extending laterally and having a fixed first end and a non-fixed second end, comprising a hinge structure, the hinge structure does not apply an external load to the second end of the microprobe The moment generated is transmitted to the first end.