TWI402015B - Integration of surface mount components of the packaging structure - Google Patents

Description

Integrated package structure of surface-adhesive components

The invention provides an integrated package structure for surface-adhesive components through vacuum thermocompression bonding technology, provides functions of bearing and structure protection, and ensures signal and energy transmission.

With the development of the semiconductor industry, future electronic products emphasize the characteristics of light and thin, high speed, high pin count, etc. The traditional package type based on lead frame will gradually become unsuitable, so there are also many challenges in the packaging process, such as packaging. The selection of materials, the high-density accumulation of the number of gold wires in the packaging process, and the gold wire migration caused by the mold filling and the warping deformation of the thin package are all encountered in the industry, and need to be invested in research. The scope.

Wire bonding or Flip-Chip is a common packaging technology in the conventional semiconductor chip package.

The wire bonding package directly adheres the wafer to the surface of the dielectric substrate, and electrically connects the contacts of the wafer to the pads of the dielectric substrate by a wire bonding process, and applies a mold filling technique (Molding) to form a ring. The epoxy resin material (Epoxy) is encapsulated to protect the wafer from chemical or mechanical external forces, and the ball grid array technology (Ball Grid Array) technology is used to provide electrical connection between the dielectric substrate and the external device.

As for the flip chip package, the tin-lead bump or the metal ball of the solder ball is applied to the surface of the wafer contact by a reflow process, and then the metal conductor on the wafer is matched and placed on the dielectric substrate. The bonding pad is electrically connected by a reflow process, and then an underfill dispensing process is performed to allow the sealing fluid to fill the gap between the wafer and the dielectric substrate, and then the dielectric substrate is provided by the ball placement array technology. Electrical connection of external devices.

In the process of filling the flip chip package, it takes a period of time for the sealant fluid to fill the gap between the dielectric substrate and the wafer due to the unilateral filling method. In addition, there are considerable differences in the thermal expansion coefficients of wafers, dielectric substrates, metal conductors, and filler materials.

The thermal expansion coefficient of the wafer is about 2.3/kWh (2.3 ppm/°C), and the thermal expansion coefficient of the FR-4 dielectric substrate is 18/kWh (18 ppm/°C). Thermal expansion of the solder bumps. The coefficient is 24/kWh (24 ppm/°C) and the expansion coefficient of the epoxy resin is 70/kWh (70 ppm/°C). In particular, the difference in thermal expansion coefficient between the wafer and the dielectric substrate is the greatest. When the temperature changes, an inconsistent thermal expansion effect occurs, causing deformation of the entire package, and shear stress occurs on the solder connection of the flip chip and the substrate. The solder has a melting point of about 180 to 400 degrees Celsius, and it is easy to reach its drop point and destructive to the overall package structure. In addition, in the conventional wire bonding package process, after the potting process, delamination sometimes occurs due to insufficient viscosity strength.

At present, in terms of circuit layout, the line carrier is a commonly used component, and the line carrier is mostly a circuit carrier such as a printed circuit board or a wafer carrier. A general line carrier is mainly composed of a plurality of patterned circuit layers and a plurality of dielectric layers alternately stacked, wherein the dielectric layer is disposed between any two adjacent patterned circuit layers, and the patterned circuit layers can be borrowed Electrically connected to each other by plated through holes or conductive vias through the dielectric layer.

Due to the advantages of fine wiring, tight assembly and good performance of the line carrier, the line carrier has been widely used in electronic packaging structures, especially the package of the ball placement technology. When the signal is transmitted on the line carrier, the noise can be improved by passive components (such as resistors, capacitors, inductors, etc.) to eliminate noise and stabilize the circuit. In addition, in the wiring of the antenna line, passive components can also be used. The setting is for the purpose of electrical impedance matching and frequency adjustment, but the passive component is disposed on the surface of the line carrier, so that the line carrier is increased in volume and cannot achieve the purpose of reducing the volume. In addition, with the diversification of the functionality of electronic products, the volume of the line carrier will be increased, and the same purpose cannot be achieved.

The main purpose of the package structure of the surface-adhesive component of the present invention is to modularize the chip antenna and the passive component package structure. By changing the value of the passive component value, the degree of freedom and performance of the frequency range can be adjusted, and the characteristic impedance of the antenna is improved. The system-side impedance is matched to meet the requirements of electrical characteristics, and the occupation of the printed circuit board area is reduced, thereby reducing the overall volume and increasing the utilization space of the printed circuit board.

The secondary objective of the present invention is to improve the bonding strength between the structural sealant and the dielectric substrate, to provide the function of bearing and structure protection, to avoid physical property damage and chemical corrosion, to ensure signal and energy transmission, and to develop a brand new Different semiconductor packaging processes can reduce production costs.

Another object of the present invention is to integrate different wafers or packaged stacked wafers or other electronic components into a package module (such as a radio frequency module or other integrated system chip) into a composite package. The function of carrying and structure protection ensures the transmission of signals and energy.

In order to achieve the above object, the present invention provides a package structure for integrating a surface-adhesive component, comprising: a dielectric substrate; a first surface metal layer disposed on an upper surface of the dielectric substrate, the first surface metal layer being formed a predetermined circuit pattern and a plurality of pads; a second surface metal layer disposed on the lower surface of the dielectric substrate; and a plurality of plated through holes disposed inside the dielectric substrate for electrically connecting the first surface metal layer And a second surface metal layer; a plurality of passive components adhered to the surface of the first surface metal layer; and a sealing rubber plate covering the upper surface of the dielectric substrate, the sealing rubber plate sealing the first surface metal layer and the surface thereof adhered Passive components.

The invention further discloses a package structure for integrating a surface-adhesive component, comprising: a dielectric substrate; a first surface metal layer disposed on the upper surface of the dielectric substrate to form a predetermined circuit pattern and having a plurality of soldering a second surface metal layer is disposed on the lower surface of the dielectric substrate; a plurality of plated through holes are disposed in the dielectric substrate and electrically connected to the first surface metal layer and the second surface metal layer a plurality of passive components attached to the surface of the first surface metal layer; a wafer disposed on the surface of the first surface metal layer and having a plurality of wafer contacts; a plurality of metal wires lapped to the wafers a contact and is connected to the surface of the pad of the first surface metal layer; a sealing rubber plate covering the upper surface of the dielectric substrate for sealing the first surface metal layer, the plurality of passive components, and the plurality of metals Wiring and wafer; and a plurality of solder balls are disposed on the surface of the second surface metal layer.

The package structure may further be provided with a third surface metal layer above the package rubber plate, and penetrate the dielectric substrate and the interior of the package rubber plate through the plated through holes, so that the first surface metal layer, the second surface metal layer and the third surface metal layer Layer electrical connection.

The present invention further discloses a package structure for integrating a surface mount component, comprising a dielectric substrate, a first surface metal layer disposed on the upper surface of the dielectric substrate, and a second surface metal disposed on the lower surface of the dielectric substrate a layer, a plurality of plated through holes provided in the interior of the dielectric substrate, an electronic component adhered to the surface of the first surface metal layer, and an encapsulant plate covering the upper surface of the dielectric substrate, the first surface metal layer The device has a predetermined circuit pattern and a plurality of solder pads for electrically connecting the first and second surface metal layers, and the package rubber plate is used for sealing the first surface metal layer and the electronic components adhered to the surface.

The invention further discloses a package structure for integrating a surface-adhesive component, comprising a plurality of dielectric substrates; a plurality of surface metal layers disposed on the upper surface and the lower surface of the respective dielectric substrates; and a plurality of plated through holes, The inner surface of the dielectric substrate is connected to each other to electrically connect to each other; an electronic component is adhered to the surface metal layer; and a plurality of sealing rubber sheets are coated on the surface of the dielectric substrate for covering and sealing The surface metal layer and the electronic components to which the surface is adhered. The package rubber board can also be used as an adhesive layer between the multilayer dielectric substrates to achieve a multi-layer package structure.

The dielectric substrate adopts a composite material composed of a dielectric resin and glass fibers or a composite material composed of a dielectric resin and a ceramic plate or ceramic powder, and the lines of the first and second surface metal layers are exposed, developed and etched. Copper foil, electroplating, spray coating, printing, screen printing sintering or a combination thereof to form a circuit on the surface of a dielectric substrate, the above electronic component is more than one electronic component, active component, passive component, radio frequency module, integrated circuit chip A combination of a group, a wafer antenna or other surface-mounting component, the wafer, component, and module are adhered to the surface of the first surface metal layer by surface adhesion techniques.

In a preferred embodiment, the dielectric substrate has a dielectric constant of between 2 and 50. The passive component is formed by using any one of a resistor, a capacitor or an inductor, or a combination thereof. The package board is dielectric. The thermosetting composite material composed of the resin and the ceramic material is heated and pressurized by a vacuum press lamination process to soften and uniformly flow on the upper surface of the dielectric substrate.

The invention finally discloses a package structure for integrating a surface-adhesive component, wherein the antenna structure comprises: a dielectric substrate; a first surface metal layer disposed on the upper surface of the dielectric substrate and forming a predetermined circuit pattern; a second surface metal layer is disposed on the lower surface of the dielectric substrate; a plurality of passive components are adhered to the surface of the first surface metal layer; and a wafer is disposed on the upper surface of the dielectric substrate, and a surface metal layer is electrically connected; a sealing rubber plate covers the upper surface of the dielectric substrate for covering and sealing the first surface metal layer and a plurality of passive components and wafers adhered to the surface thereof; The surface metal layer is disposed on the upper surface of the encapsulant sheet; and a plurality of plated through holes.

a part of the plated through hole is disposed in the inner surface of the dielectric substrate to communicate with the first surface metal layer and the second surface metal layer, and another portion of the plated through hole is disposed in the inner surface of the dielectric substrate and the package rubber plate. The third surface metal layer is electrically connected to each other, and the plated through hole position of the third surface metal layer is electrically connected to an external device or a wire or other electrically conductive structure that increases the radiation effect of the antenna.

The effect of the invention is to modularize the chip antenna and the passive component package structure, improve the antenna characteristic impedance and the system end impedance matching, increase the utilization space of the printed circuit board, and improve the bonding strength between the structural sealant and the dielectric substrate, Provides bearing and structural protection.

In order to facilitate further understanding and understanding of the structure and features of the present invention, the preferred embodiments of the present invention will be described with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the present invention, the package structure (100) of the integrated surface mount component comprises: a dielectric substrate (10a) and a first surface metal layer (11a) a second surface metal layer (12a), a plurality of plated through holes (13a), a plurality of passive components (30), and a sealing rubber plate (20a).

The dielectric substrate (10a) is a composite material composed of a dielectric resin and glass fibers or a composite material composed of a dielectric resin and a ceramic plate or ceramic powder. The dielectric substrate (10a) has a dielectric constant of 2 Between 50.

The lines of the first and second surface metal layers (11a) (12a) are formed on the dielectric substrate (10a) by exposure, development and etching of copper foil, electroplating, spraying, printing, screen printing sintering or a combination thereof. The upper surface and the lower surface; the first surface metal layer (11a) is disposed on the upper surface of the dielectric substrate (10a) to form a predetermined circuit pattern and has a plurality of pads; the second surface metal layer (12a) It is disposed on the lower surface of the dielectric substrate (10a).

The plated through holes (13a) are connected to the first surface metal layer (11a) and the second surface metal layer (12a) through the dielectric substrate (10a) to allow the first surface metal layer (11a) and The second surface metal layer (12a) may be electrically connected to each other by a plated through via (13a) penetrating through the dielectric substrate (10a).

The passive component (30) is adhered to the surface of the first surface metal layer (11a) by surface adhesion technology for electrical connection in series or in parallel, and the passive component (30) is made of a resistor, a capacitor or an inductor. Or a combination of both, with the advantages of low cost acquisition and standardized specifications.

The encapsulating sheet (20a) covers the upper surface of the dielectric substrate (10a) to encapsulate the first surface metal layer (11a) and the passive component (30) adhered to the surface thereof, the encapsulating sheet ( 20a) is a thermosetting composite material composed of a dielectric resin and a ceramic material, and the encapsulating rubber sheet (20a) is heated and pressurized by a vacuum thermocompression bonding process to soften and uniformly flow on the dielectric substrate (10a). The upper surface, when the encapsulating rubber sheet (20a) continuously absorbs energy, generates a polymerization reaction, and uniformly bonds and cures the first surface metal layer (11a) and the passive component on the surface of the dielectric substrate (10a). 30), and by the vacuum thermocompression bonding process, uniform heating, uniform pressure, and stable flow can be achieved, and the thermal expansion effect of each material caused by the temperature difference can be reduced to cause warpage deformation of the entire package. By protecting the encapsulating sheet (20a), physical properties and chemical attack can be avoided, and signal and energy transmission can be ensured to function.

Referring to FIG. 3, in the antenna circuit wiring diagram of the conventional printed circuit board (200), by setting a plurality of passive components (30) to achieve the purpose of antenna electrical impedance matching and frequency adjustment, but limited The passive component (30) is disposed on the wiring area around the conventional antenna (40), and has the disadvantage of reducing the flexibility of the wiring of the circuit substrate (50) and not conforming to the tendency of the wireless communication device to be light, thin and short.

Referring to FIG. 4, in the antenna circuit wiring diagram of the package structure of the printed circuit board (300) incorporating the surface-adhesive component, by reducing the wiring area around the package antenna (41) of the integrated electronic component, Furthermore, the flexibility of the circuit board (51) wiring is increased, and the wireless communication device is light, thin and short.

Referring to FIG. 5 and FIG. 6 , a second preferred embodiment of the present invention, the package structure ( 400 ) of the integrated surface mount component includes: a dielectric substrate (10b) and a first surface metal layer (11b), a second surface metal layer (12b), a heat dissipation metal layer (16), a plurality of plated through holes (13b), a plurality of passive components (30), a wafer (60), and a plurality of metal wires ( 61), a package rubber plate (20b) and a plurality of solder balls (63).

The dielectric substrate (10b) is a composite material composed of a dielectric resin and glass fibers or a composite material composed of a dielectric resin and a ceramic plate or ceramic powder, and the dielectric constant of the dielectric substrate (10b) is between Between 2 and 50.

The first and second surface metal layer (11b) (12b) lines are formed on the dielectric substrate (10b) by exposure, development and etching of copper foil, electroplating, spraying, printing, screen printing sintering or a combination thereof. The upper surface metal layer (11b) is formed by disposing a plurality of metal sheets on the upper surface of the dielectric substrate (10b) to form a predetermined line pattern and a plurality of pads; the second surface metal layer (12b) is disposed on the lower surface of the dielectric substrate (10b).

The plated through holes (13b) are connected to the first surface metal layer (11b) and the second surface metal layer (12b) through the dielectric substrate (10b) to allow the first surface metal layer (11b) and The second surface metal layer (12b) may be electrically connected to each other by a plated through via (13b) penetrating through the dielectric substrate (10b).

The passive component (30) is adhered to the surface of the first surface metal layer (11b) by surface adhesion technology for electrical connection in series or in parallel. The passive component (30) is made of a resistor, a capacitor or an inductor or The combination of the two has the advantages of low cost acquisition and standardized specifications.

The wafer (60) is disposed on the upper surface of the first surface metal layer (11b) and has a plurality of wafer contacts (62). In one embodiment, the wafer (60) is formed by silver paste or surface adhesion technology. It is adhered to the upper surface of the first surface metal layer (11b).

The metal wiring (61) is made of a gold wire or an aluminum wire, and the metal wire (61) is connected to the surface of the pad of the wafer contact (62) and the first surface metal layer (11b) by wire bonding. The process solders the wafer contacts (62) to the first surface metal layer (11b) pads of the dielectric substrate (10b) to electrically connect each other.

The encapsulating sheet (20b) covers the upper surface of the dielectric substrate (10b) for covering and sealing the first surface metal layer (11b) and a plurality of passive components (30) and metal wiring adhered on the surface thereof. (61) and a wafer (60), the encapsulant sheet (20b) is a thermosetting composite material composed of a dielectric resin and a ceramic material; the encapsulant sheet (20b) is heated and pressurized by a vacuum thermocompression bonding process. Softening and uniformly flowing on the upper surface of the dielectric substrate (10b), and when the encapsulating rubber sheet (20b) continuously absorbs energy, a polymerization reaction occurs, and the dielectric substrate (10b) can be uniformly bonded and cured. The first surface metal layer (11b) of the surface, the passive component (30), the wafer (60) and the metal wiring (61), and by the vacuum thermocompression bonding process, uniform heating, uniform pressure, stable flow, and reduced temperature difference can be achieved. The phenomenon of thermal expansion of each material causes warpage of the entire package. By protecting the encapsulating sheet (20b), physical properties and chemical attack can be avoided, and signal and energy transmission can be ensured to function.

The solder ball (63) is disposed on the lower surface of the second surface metal layer (12b), and the solder ball array (63) is soldered to the surface of the solder pad of the second surface metal layer (12b) by a ball placement array technique. As an interface between the dielectric substrate (10b) and the external device.

The package structure (400) for integrating the surface-adhesive component further includes a heat dissipation metal layer (16) disposed over the package rubber plate (20b), and a portion of the plated through hole (13b) penetrates the dielectric substrate (10b) and The first surface metal layer (11b) and the second surface metal layer (12b) are electrically connected to the heat dissipation metal layer (16), wherein the heat dissipation metal layer (16) is used to transfer the wafer. (60) The heat generated during operation is transferred to the heat dissipation metal layer (16) to help the wafer (60) to dissipate heat rapidly.

Referring to FIG. 7 and FIG. 8 , a third preferred embodiment of the present invention, the integrated surface mount component package structure (500) includes: a dielectric substrate (10c), a first surface a metal layer (11c), a second surface metal layer (12c), a plurality of plated through holes (13c), an electronic component (35), and an encapsulating plate (20).

The dielectric substrate (10c) is a composite material composed of a dielectric resin and a glass fiber or a composite material of a dielectric resin and a ceramic plate or a ceramic powder. The dielectric substrate (10c) has a dielectric constant of 2 Between 50.

The lines of the first and second surface metal layers (11c) (12c) are formed on the dielectric substrate (10c) by exposure, development and etching of copper foil, electroplating, spraying, printing, screen printing sintering or a combination thereof. The first surface metal layer (11c) is disposed on the upper surface of the dielectric substrate (10c); the second surface metal layer (12c) is disposed on the lower surface of the dielectric substrate (10c).

The plated through holes (13c) are connected to the first surface metal layer (11c) and the second surface metal layer (12c) through the dielectric substrate (10c) to allow the first surface metal layer (11c) and The second surface metal layer (12c) may be electrically connected to each other by a plated through hole (13c) penetrating through the dielectric substrate (10c).

The electronic component (35) is electrically connected to the surface of the first surface metal layer (11c) by surface adhesion technology. In an embodiment, the electronic component (35) may be a plurality of electronic components, A combination of active and passive components, RF modules, integrated circuit chipsets, wafer antennas, or other surface-adhesive components.

The encapsulating sheet (20c) covers the upper surface of the dielectric substrate (10c) for encapsulating the first surface metal layer (11c) and the surface of the electronic component (35) adhered thereto. (20c) is a thermosetting composite material composed of a dielectric resin and a ceramic material; and in one embodiment, the encapsulating rubber sheet (20c) is heated and pressurized by a vacuum thermocompression process to soften and uniformly Flowing on the upper surface of the dielectric substrate (10), when the encapsulating rubber sheet (20c) continuously absorbs energy, a polymerization reaction occurs, and the first surface metal which encapsulates the upper surface of the dielectric substrate (10c) can be uniformly bonded and cured. Layer (11c), electronic component (35), and by the vacuum thermocompression bonding process, the phenomenon of uniform heating, uniform pressure, and stable flow can be achieved, and the thermal expansion effect of each material caused by the temperature difference is reduced to cause warpage deformation of the whole package, and By the protection of the encapsulating sheet (20c), the destruction of physical properties and the erosion of chemical properties can be avoided, and the transmission of signals and energy can be ensured to function.

Please refer to FIG. 9 , which is a fourth preferred embodiment of the present invention. As shown in the figure, the package structure ( 600 ) of the integrated surface-adhesive component of the present invention comprises: a plurality of dielectric substrates (10), plural a surface metal layer (15), a plurality of plated through holes (13), an electronic component (35), and a plurality of package rubber plates (20).

The dielectric substrate (10) is a composite material composed of a dielectric resin or a glass fiber or a composite material of a dielectric resin and a ceramic plate or ceramic powder. The dielectric substrate (10) has a dielectric constant of 2 Between 50.

The surface metal layer (15) is formed by exposing, developing and etching copper foil, electroplating, spraying, printing, screen printing sintering or a combination thereof to the surface of the dielectric substrate (10); the surface metal layer ( 15) is disposed on the upper surface and the lower surface of the dielectric substrate (10).

The plated through holes (13) penetrate through the dielectric substrate (10) and the inside of the encapsulating plate (20), so that the surface metal layer (15) can pass through the plated through holes (13) penetrating the dielectric substrate (10). ) Electrically connected to each other.

The electronic component (35) is electrically connected to the surface of the surface metal layer (15) by surface adhesion technology. In an embodiment, the electronic component (35) can be a plurality of electronic components, active and passive. A combination of components, RF modules, integrated circuit chipsets, wafer antennas, or other surface-adhesive components.

The encapsulating sheet (20) covers the surface of the dielectric substrate (10) for covering and sealing the electronic component (35) of the surface metal layer (15) adhered to the surface thereof, the encapsulating sheet (20) A thermosetting composite material composed of a dielectric resin and a ceramic material; and in one embodiment, the encapsulating rubber sheet (20) is heated and pressurized by a vacuum thermocompression process to soften and uniformly flow to the dielectric. The upper surface of the substrate (10) generates a polymerization reaction when the encapsulating sheet (20) continuously absorbs energy, and uniformly bonds and cures the surface metal layer (15) and the electronic component of the dielectric substrate (10). 35), and by the vacuum thermocompression bonding process, the phenomenon that the heat is uniform, the pressure is uniform, the flow is stable, the thermal expansion effect of each material caused by the temperature difference is reduced, and the warpage deformation of the whole package is generated, and the rubber sheet is encapsulated (20) The protection can avoid the destruction of physical properties and the erosion of chemical properties, ensuring the transmission of signals and energy to make it function.

In addition, the encapsulating sheet (20) can also be used as an adhesive layer between the multilayer dielectric substrates (10) to achieve a multi-layer package structure.

Referring to FIG. 10, a fifth preferred embodiment of the present invention, the antenna package structure (700) of the integrated surface mount component includes: a dielectric substrate (10d) and a first surface metal layer ( 11d), a second surface metal layer (12d), a plurality of plated through holes (13d), a plurality of passive components (30), a wafer (60), a package rubber plate (20d), and a third surface metal layer (14d).

The dielectric substrate (10d) is a composite material composed of a dielectric resin and glass fibers or a composite material of a dielectric resin and a ceramic plate or ceramic powder. The dielectric substrate (10d) has a dielectric constant of 2 Between 50.

The first surface metal layer (11d) circuit is formed on the upper surface of the dielectric substrate (10d) by exposure, development and etching of copper foil, electroplating, spraying, printing, screen printing sintering or a combination thereof; In a preferred embodiment, the first surface metal layer (11d) is a one-side convoluted line pattern and is set to a specific line pattern at a central position.

The second surface metal layer (12d) line is also formed on the lower surface of the dielectric substrate (10d) by exposure, development and etching of copper foil, electroplating, spraying, printing, screen printing, or a combination thereof.

The plated through holes (13d) partially penetrate the inside of the dielectric substrate (10d), and are connected to the first surface metal layer (11d) and the second surface metal layer (12d) to allow the first surface metal layer (11d) And the second surface metal layer (12d) may be electrically connected to each other through a plated through hole (13d) penetrating through the dielectric substrate (10d), and another portion of the plated through holes (13d) penetrates through the dielectric substrate ( 10d) and inside the encapsulating sheet (20d), connected to the first, second and third surface metal layers (11d) (12d) (14d), the first and second and third surface metal layers (11d) (12d) (14d) can be electrically connected to each other by a plated through hole (13d) penetrating through the dielectric substrate (10d) and the encapsulating plate (20d). In the preferred embodiment, the plated through hole (13d) penetrates the inside of the dielectric substrate (10d) at a central position, and the plated through hole (13d) penetrates the dielectric substrate (10d) at a side position. ) and the inside of the encapsulation board (20d).

The passive component (30) is adhered to the surface of the first surface metal layer (11d) by a surface adhesion technique for electrical connection in series or in parallel. The passive component (30) is made of a resistor, a capacitor or an inductor or The combination of the two has the advantages of low cost acquisition and standardized specifications.

The wafer (60) is electrically connected to the first surface metal layer (11d) on the upper surface of the dielectric substrate (10d); in a preferred embodiment, the wafer (60) is made of silver paste or surface adhesion technology. It is adhered to the central position of the dielectric substrate (10d).

The encapsulating sheet (20d) covers the upper surface of the dielectric substrate (10d) for covering and sealing the first surface metal layer (11d) and a plurality of passive components (30) and wafers on the surface thereof ( 60) The encapsulant sheet (20d) is a thermosetting composite material composed of a dielectric resin and a ceramic material, and is heated and pressurized by a vacuum thermocompression process to soften and uniformly flow on the dielectric substrate (10d). The upper surface, when the encapsulating rubber sheet (20d) continuously absorbs energy, generates a polymerization reaction, and uniformly bonds and cures the first surface metal layer (11d) and the passive component of the upper surface of the dielectric substrate (10d). 30) and the wafer (60), and by the vacuum thermocompression bonding process, the phenomenon that the heat is uniform, the pressure is uniform, and the flow is stable, and the thermal expansion effect of each material caused by the temperature difference is reduced to cause warpage deformation of the whole package. By the protection of the encapsulating sheet (20d), the destruction of physical properties and the erosion of chemical properties can be avoided, and the transmission of signals and energy can be ensured to function.

The third surface metal layer (14d) is disposed on the upper surface of the encapsulating board (20d) as an interface electrically connected to the external device. In a preferred embodiment, the third surface metal layer (14d) The surface of the encapsulating rubber sheet (20d) is formed by exposure, development and etching of copper foil, electroplating, spraying, printing, screen printing sintering or a combination thereof to form a predetermined line pattern, and the plated through hole (13d) is formed. The position is electrically connected to the external device. In a preferred embodiment, the plated through hole (13d) is electrically connected to a wire (not shown) to increase the radiation effect of the antenna.

In summary, the package structure of the integrated surface-adhesive component of the present invention is modularized by the wafer, the antenna line and the passive component package structure, and the degree of freedom and performance of the frequency range can be adjusted by changing the value of the passive component to improve the antenna. The characteristic impedance is matched with the impedance of the system end, and the area occupied by the printed circuit board is reduced, so as to reduce the overall volume, increase the utilization space of the printed circuit board, and improve the bonding strength between the structural sealant and the dielectric substrate, and provide bearing and structure protection. Function to avoid physical damage and chemical attack. In addition, different wafers or packaged laminated wafers or other electronic components are integrated into the same package to form a composite package to ensure signal and energy. transfer.

The above-mentioned embodiments are only intended to facilitate the description of the present invention and are not intended to be limiting, and various modifications and modifications may be made without departing from the spirit of the invention. .

(10) (10a) (10b) (10c) (10d) ‧ ‧ dielectric substrate

(11) (11a) (11b) (11c) (11d) ‧ ‧ first surface metal layer

(12) (12a) (12b) (12c) (12d) ‧ ‧ second surface metal layer

(13) (13a) (13b) (13c) (13d) ‧ ‧ plated through holes

(14d) ‧‧‧ third surface metal layer

(15) ‧‧‧Surface metal layer

(16) ‧‧‧thermal metal layer

(30)‧‧‧ Passive components

(35)‧‧‧Electronic components

(20)(20a)(20b)(20c)(20d)‧‧‧Package board

(40) ‧‧‧General antenna

(41)‧‧‧Encapsulated antennas incorporating electronic components

(50) (51) ‧‧‧ circuit board

(60) ‧‧‧ wafer

(61)‧‧‧Metal wiring

(62) ‧‧‧Wit contacts

(63)‧‧‧ solder balls

(100) (400) (500) (600) (700) ‧ ‧ package structure

(200) (300)‧‧‧ Printed circuit boards

Figure 1 is a schematic view showing the combination of the first preferred embodiment of the present invention;

Figure 2 is a side cross-sectional view showing a first preferred embodiment of the present invention;

Figure 3 is a schematic diagram showing the wiring of an antenna circuit of a conventional printed circuit board;

Figure 4 is a schematic diagram of the wiring of the antenna circuit of the present invention;

5 is a schematic cross-sectional view showing a second preferred embodiment of the present invention; FIG. 6 is a side cross-sectional view showing a second preferred embodiment of the present invention; and FIG. 7 is a schematic view showing a combination of the third preferred embodiment of the present invention. 8 is a side cross-sectional view showing a third preferred embodiment of the present invention; FIG. 9 is a cross-sectional view showing a multi-layer structure of a fourth preferred embodiment of the present invention; and FIG. 10 is a fifth preferred embodiment of the present invention. A schematic diagram of the combination of the examples.

(10c). . . Dielectric substrate

(11c). . . First surface metal layer

(12c). . . Second surface metal layer

(13c). . . Plated through hole

(20c). . . Package rubber sheet

(35). . . Electronic component

(500). . . Package structure

Claims (23)

A package structure for integrating a surface-adhesive component comprises: a dielectric substrate; a first surface metal layer disposed on an upper surface of the dielectric substrate to form a predetermined circuit pattern; and a second surface metal layer disposed The lower surface of the dielectric substrate; a plurality of plated through holes disposed in the dielectric substrate to communicate with the first surface metal layer and the second surface metal layer to electrically connect each other; an electronic component is attached to the first a surface metal layer; a sealing rubber plate is a thermosetting composite material composed of a dielectric resin and a ceramic material, and is heated and pressurized by a vacuum thermocompression bonding process to soften and uniformly flow on the dielectric substrate. An upper surface, an electronic component for covering and sealing the first surface metal layer and the surface thereof; and a heat dissipating metal layer on the surface of the encapsulant board, and the through-hole is penetrated through the dielectric substrate and the inside of the encapsulant board The first metal layer and the second metal layer are connected to transmit heat generated during operation of the electronic component to rapidly dissipate the electronic component. The package structure of the surface-mounting component is integrated as described in claim 1, wherein the dielectric substrate is a composite material composed of a dielectric resin and a glass fiber or a composite of a dielectric resin and a ceramic plate or ceramic powder. Any of the materials of the substrate having a dielectric constant between 2 and 50. The package structure of the surface-adhesive component is integrated as described in claim 1, wherein the circuit of the first and second surface metal layers is exposed Any of the methods of light, development and etching of copper foil, electroplating, spray coating, printing, screen printing sintering, or combinations thereof, is constructed on the surface of the dielectric substrate. The package structure of the surface-mount component is integrated as described in claim 1, wherein the electronic component is an electronic component, an active component, a passive component, a radio frequency module, an integrated circuit chipset, a chip antenna, and other surface-adhesive type. Any of the elements or a combination thereof. The package structure of the surface-mount component is integrated as described in claim 4, wherein the passive component is formed by any one of a resistor, a capacitor, an inductor, or a combination thereof, and is adhered to the first by surface adhesion technology. On the surface metal layer. A package structure for integrating a surface-adhesive component, comprising: a dielectric substrate; a first surface metal layer disposed on an upper surface of the dielectric substrate to form a predetermined circuit pattern, and having at least one pad; a second surface metal layer is disposed on the lower surface of the dielectric substrate; a plurality of plated through holes are disposed in the dielectric substrate to communicate the first surface metal layer and the second surface metal layer to electrically connect each other a plurality of passive components are adhered to the first surface metal layer; a wafer is disposed on the first surface metal layer and has a plurality of wafer contacts; and the plurality of metal wires are lapped to the wafers Pointing and connecting with the pad of the first surface metal layer; a package rubber plate, which is composed of a dielectric resin and a ceramic material a thermosetting composite material which is heated and pressurized by a vacuum thermocompression bonding process to soften and uniformly flow on the upper surface of the dielectric substrate for covering and sealing the first surface metal layer and the passive components adhered to the surface thereof, a metal wiring and a wafer; a heat dissipating metal layer is disposed on the surface of the encapsulating plate, and the plated through hole penetrates the dielectric substrate and the inside of the encapsulant plate is connected to the first metal layer and the second metal layer for transmitting the passive The heat generated by the component and the wafer during operation causes the passive component and the wafer to rapidly dissipate heat; and the plurality of solder balls are disposed on the surface of the second surface metal layer. The package structure for integrating a surface-adhesive component according to claim 6, wherein the dielectric substrate is a composite material composed of a dielectric resin and a glass fiber or a composite of a dielectric resin and a ceramic plate or ceramic powder. Any of the materials of the substrate having a dielectric constant between 2 and 50. The package structure for integrating a surface mount component according to claim 6, wherein the first and second surface metal layer lines are exposed, developed and etched by copper foil, electroplated, sprayed, printed, screen printed or Either way, the circuit is constructed on the surface of the dielectric substrate. The package structure of the surface-mounting component is integrated as described in claim 6, wherein the passive component is formed by any one of a resistor, a capacitor, an inductor, or a combination thereof, and is adhered to the first by a surface adhesion technique. On the surface metal layer. The package structure of the surface-mount component is integrated as described in claim 6 wherein the wafer is adhered to the first by surface adhesion technology. On the surface metal layer. A package structure for integrating a surface-adhesive component comprises: a plurality of dielectric substrates; a plurality of surface metal layers disposed on an upper surface and a lower surface of each of the dielectric substrates; and a plurality of plated through holes disposed in the dielectric The inside of the substrate communicates with each surface metal layer to electrically connect with each other; an electronic component is adhered to the surface metal layer; and a plurality of package rubber plates are made of a thermosetting composite material composed of a dielectric resin and a ceramic material, and are vacuumed The thermocompression bonding process heats and presses to soften and uniformly flow on the surface of the dielectric substrate to cover and seal the surface metal layer and the electronic components adhered on the surface thereof; and a heat dissipating metal layer located in the encapsulant The plate surface is connected to the plurality of metal layers through the plated through-hole through the dielectric substrate and the inside of the package rubber plate for transmitting heat generated during operation of the electronic component, so that the electronic component can quickly dissipate heat. The package structure for integrating a surface-adhesive component according to claim 11, wherein the dielectric substrate is a composite material composed of a dielectric resin and a glass fiber or a composite of a dielectric resin and a ceramic plate or ceramic powder. Any of the materials of the substrate having a dielectric constant between 2 and 50. The package structure of the surface-mounting component is integrated as described in claim 11, wherein the surface of the surface metal layer is exposed, developed, and Either way of etching copper foil, plating, spraying, printing, screen printing sintering, or a combination thereof, the circuitry is constructed on the surface of the dielectric substrate. The package structure of the surface-mount component is integrated as described in claim 11, wherein the electronic component is an electronic component, an active component, a passive component, a radio frequency module, an integrated circuit chipset, a wafer antenna, and other surface-adhesive type. Any of the elements or a combination thereof. The package structure of the surface-mount component is integrated as described in claim 14, wherein the passive component is formed by any one of a resistor, a capacitor, an inductor, or a combination thereof, and is adhered to the first by a surface adhesion technique. On the surface metal layer. The package structure of the surface-mounting component is integrated as described in claim 11, wherein the package rubber is an adhesive layer between the plurality of dielectric substrates, and the multi-layer package structure is obtained. A package structure for integrating a surface-adhesive component, comprising: a dielectric substrate; a first surface metal layer disposed on an upper surface of the dielectric substrate to form a predetermined circuit pattern; and a second surface metal layer a lower surface of the dielectric substrate; a plurality of passive components are adhered to the first surface metal layer; a wafer is disposed on the upper surface of the dielectric substrate and electrically connected to the first surface metal layer; The rubber sheet is a thermosetting composite material composed of a dielectric resin and a ceramic material, and is heated and pressurized by a vacuum thermocompression bonding process. Softening and uniformly flowing on the upper surface of the dielectric substrate for covering and sealing the first surface metal layer and the surface of the plurality of passive components and the wafer; a third surface metal layer is disposed on the package adhesive a surface of the upper surface of the plate; and a plurality of plated through holes, wherein a part of the plated through holes is disposed in the interior of the dielectric substrate to communicate with the first surface metal layer and the second surface metal layer, and another portion of the plated through holes is disposed on the dielectric substrate The first, second and third surface metal layers are connected inside the encapsulant to electrically connect to each other. The package structure for integrating a surface-adhesive component according to claim 17, wherein the dielectric substrate is a composite material composed of a dielectric resin and a glass fiber or a composite of a dielectric resin and a ceramic plate or ceramic powder. Any of the materials of the substrate having a dielectric constant between 2 and 50. The package structure for integrating a surface mount component according to claim 17, wherein the first and second surface metal layer lines are exposed, developed and etched by copper foil, electroplated, sprayed, printed, screen printed sintered or Either way, the circuit is constructed on the surface of the dielectric substrate. The package structure of the surface-mounting component is integrated as described in claim 17, wherein the passive component is formed by any one of a resistor, a capacitor, an inductor, or a combination thereof, and is adhered to the first by a surface adhesion technique. On the surface metal layer. The package structure of the surface-mounting component is integrated as described in claim 17, wherein the wafer is adhered to the surface by surface adhesion technology. On a surface metal layer. The package structure for integrating a surface mount component according to claim 17, wherein the plated through hole of the third surface metal layer is further electrically connected to an external device. The package structure for integrating a surface mount component according to claim 17, wherein the plated through hole of the third surface metal layer is further electrically connected to a wire to increase the antenna radiation effect.