TWI396655B - Substrate-separating fixture and method for separating substrates - Google Patents

Description

Substrate separation jig and method for separating same

The present invention relates to a substrate separation jig and a method for separating the same, and more particularly to a substrate separation jig having a cutting device and a method for separating the substrate by using the substrate separation jig.

According to the technical principle, the conventional touch panel is mainly divided into two categories, namely, a resistive touch panel and a capacitive touch panel. Regardless of the touch panel, the main structure includes two layers of substrates, and the upper substrate is a touch sensing substrate, which is usually made of glass, and can be used to sense the touch of an object; the lower substrate is a screen display substrate, usually Made of glass, it can be used to display the control screen.

In order to maintain the accuracy of the touch panel, the upper substrate and the lower substrate must be closely attached, and no displacement can be generated during use. Therefore, it is necessary to use a colloid having a high adhesive force and a low peeling force to close the upper and lower substrates. Paste. In addition, since the lower substrate is a screen display substrate, it is necessary to use a colloid having a high transmittance to fully display the picture and color displayed on the underlying substrate. Therefore, the most commonly used colloids include optical adhesive (OCA) and ultraviolet light curing resin (ie, UV adhesive), both of which have high adhesion, low peeling force, and high light transmittance.

However, in the process of bonding the upper and lower substrates, the bonding failure often occurs due to various factors. Common factors include bubbles between the substrates, dust or dirt between the substrates, and inaccurate positioning between the substrates. The relative displacement caused. Since the colloid between the upper and lower substrates has a very high hardness after hardening, if the substrate is forcibly separated by external force, it usually only causes cracking and damage of the substrate. Therefore, for substrates that fail to bond, there is usually only a fate that is discarded.

In view of this, researchers have provided a method of separating a substrate, and it is desirable to separate the substrate from which the bonding has failed, and the substrate can be recovered for reuse. Please refer to FIG. 1A, FIG. 1B and FIG. 1C for a schematic exploded view of a conventional substrate separation method. In the first A diagram, a wire A1 surrounds the bonding layer A4 between the two substrates A2 and A3, and pulls both ends of the wire A1 in the direction of the arrow; and then sequentially as shown in the first B and the first C As shown, the wire A1 can be gradually cut to the center of the adhesive layer A4 by pulling the wire A1, and finally the two substrates A2, A3 can be completely separated. However, although this method has the opportunity to achieve the separation of the substrates A2 and A3, it must be applied with great force to achieve it, but excessive force will cause damage to the substrates A2 and A3, so this method still There is room for improvement.

In view of the above, it is necessary to provide a substrate separation jig and a method of separating the same, which can completely separate the substrate that has failed to bond, and recover the substrate and reuse it, thereby reducing the production cost.

Therefore, in view of the aforementioned problems and deficiencies, the inventors have accumulated years of experience, and exerted imagination and creativity. After continuous trial and modification, there has been a substrate separation jig of the present invention and a method for separating the same.

The main object of the present invention is to provide a substrate separation jig, which can completely separate a substrate that fails to bond by a cutting device to recover the substrate and reuse it, thereby reducing production cost.

Another object of the present invention is to provide a substrate separation jig capable of heating an adhesive layer between the two substrates by a heating module to increase the cutting efficiency of the cutting device.

Still another object of the present invention is to provide a method of separating a substrate, by which the cutting device reciprocates in a reciprocating manner between the two layers of substrates, thereby increasing cutting efficiency and improving the integrity of the substrate.

Accordingly, the present invention provides a substrate separation jig that includes at least one substrate carrier that can be used to fix at least two layers of substrates that are to be bonded to each other, and the substrate carrier can be horizontally along its X-axis direction. Moving; and a cutting device for cutting the adhesive layer between the two substrates, the cutting device comprising: at least two wire fixing modules respectively disposed on two sides of the substrate carrier and along the substrate The Y-axis direction of the carrier reciprocates; a cutting line is respectively fixed at opposite sides of the two wire fixing modules and parallel to the Y-axis of the substrate carrier, the cutting wire can be fixed with two wires Reciprocating movement of the Y-axis by the module, and further cutting the adhesive layer between the two-layer substrate; and at least one holding wire, the two ends of which are respectively fixed on opposite sides of the two wire fixing modules and with the substrate The Y axis of the carrier is parallel, the height of the top wire is higher than the cutting line at the Z axis, and the top wire can be inserted into the cut portion of the bonding layer between the two substrates and the substrate above is pushed up. The two substrates to prevent separation of the two substrates bonded to revert to the state.

Furthermore, the present invention further provides a method for separating a substrate, comprising the steps of: (1) fixing at least two layers of the substrate to be separated to each other on a substrate carrier; (2) the substrate carrier The X-axis direction moves horizontally, and the two wire fixing modules drive a cutting line and at least one holding line to reciprocate along the Y-axis direction of the substrate carrier; (3) when the cutting line contacts the two-layer substrate When the bonding layer is between, the cutting line starts to cut the bonding layer between the two substrates by reciprocating movement thereof; (4) after the cutting line cuts the bonding layer between the two substrates, the The top wire is inserted into the cut portion of the bonding layer between the two substrates and the upper substrate is lifted up to keep the separated portions of the two substrates separated; and (5) the cutting line is applied to the two substrates The entire subsequent layer is cut, and the top line lifts the upper substrate to completely separate the two substrates.

A method for separating a jig and a substrate thereof according to a first preferred embodiment, a second preferred embodiment and a third preferred embodiment of the present invention, respectively, for the system architecture and technical principle of the present invention Detailed introduction.

Referring to FIG. 2, a schematic perspective view of a substrate separation jig according to the first preferred embodiment of the present invention includes a substrate carrier 100 and a cutting device 110.

The substrate holder 100 can be used to fix the two layers of the substrates 120, 121 to be separated from each other and to be horizontally movable along the X-axis direction thereof. The substrate carrier 100 is provided with a plurality of vacuum adsorption holes 101 for adsorbing the two substrates 120, 121 which are bonded to each other and fixing them to a specific position of the substrate carrier 100.

The cutting device 110 can cut the bonding layer 122 between the two layers of substrates 120 and 121. The cutting device 110 includes two wire fixing modules 111a and 111b, a cutting line 112 and a plurality of topping lines 113.

The two wire fixing modules 111a and 111b are respectively disposed on both sides of the substrate carrier 100 and are reciprocally movable along the Y-axis direction of the substrate carrier 100.

The two ends of the cutting line 112 are respectively fixed on opposite sides of the two wire fixing modules 111a, 111b and parallel to the Y axis of the substrate carrier 100, and the cutting line 112 can follow the two wire fixing modules 111a, 111b. The Y-axis reciprocating movement is performed, and the subsequent layer 122 between the two-layer substrates 120 and 121 can be cut. Among them, the cutting line 112 must have a certain rigidity and is not easy to be broken, so as to increase the use efficiency and life of the cutting device 110.

The two ends of the plurality of top holding wires 113 are respectively fixed to opposite sides of the two wire fixing modules 111a and 111b and are parallel to the Y axis of the substrate carrier 100, and the plurality of top holding wires 113 are high at the height of the Z axis. On the cutting line 112. A plurality of top holding wires 113 can be inserted into the cut portion of the bonding layer 122 between the two substrates 120, 121 and the upper substrate 120 is lifted up, thereby separating the two substrates 120, 121 to block the two layers. The substrates 120 and 121 are returned to the bonded state.

Referring to FIG. 3, a first step of a method for separating a substrate according to a first preferred embodiment of the present invention, wherein the substrate separation tool is used to separate a substrate, which comprises the following steps: The separated two layers of the mutually adhered substrate are fixed on the substrate carrier (step 201); the substrate carrier moves horizontally along the X-axis direction thereof, and the two wire fixing modules drive the cutting line and the plurality of top holding lines Reciprocating movement of the substrate carrier in the Y-axis direction (step 202); when the cutting line contacts the bonding layer between the two substrates, the cutting line starts to reciprocate between the two substrates by reciprocating movement thereof Cutting (step 203); after the cutting line cuts the adhesive layer between the two substrates, the plurality of topping lines are sequentially inserted into the cut portion of the bonding layer between the two substrates and above The substrate is lifted up to maintain the two-layer substrate in a separated state (step 204); the cutting line is cut over the entire adhesive layer between the two substrates, and the plurality of top wires lift the upper substrate to make the two layers Complete substrate Leave (step 205). In the above method, when the two-layer substrate 120, 121 is fixed on the substrate carrier 100, the bonding layer 122 between the two substrates 120, 121 is parallel to the XY plane of the substrate carrier 100. Cutting can be performed using the cutting line 112.

Next, please refer to the fourth embodiment A, the fourth B, the fourth C, and the fourth D, which are schematic views of the decomposition operation of the method for separating the substrate according to the first preferred embodiment of the present invention. In the fourth embodiment, the two substrates 120 and 121 to be separated are fixed on the substrate carrier 100 by a plurality of vacuum adsorption holes 101. The substrate carrier 100 carries the two substrates 120 and 121 along the X. The axial direction moves horizontally, and the two wire fixing modules 111a and 111b drive the cutting line 112 and the plurality of top holding lines 113 to reciprocate the Y-axis. After the substrate carrier 100 is moved along the X-axis direction for a distance, the cutting line 112 is in contact with the bonding layer 122 between the two substrates 120, 121, as shown in FIG. 4B. 112 begins cutting the adhesive layer 122. Next, as shown in FIG. 4C, when the cutting line 112 is cut a distance from the bonding layer 122, one of the top holding lines 113 starts to be inserted into the cut portion of the bonding layer 122, since the height of the top wire 113 is higher than the Z axis. The line 112 is cut so that the top line 113 can lift the upper substrate 120 by a small height so that the separated portions of the two substrates 120, 121 remain separated. Finally, as shown in FIG. 4D, the cutting line 112 has been cut over the entire bonding layer 122 between the two substrates 120, 121, and a plurality of topping lines 113 are inserted between the two substrates 120, 121 and The upper substrate 120 is lifted up to completely separate the two substrates 120 and 121. So far, all the substrate separation steps have been completed.

Referring to FIG. 5, a schematic perspective view of a substrate separation jig according to the second preferred embodiment of the present invention is shown. The difference between the second preferred embodiment and the first preferred embodiment is that the second preferred embodiment further includes a heating module 330 disposed at a specific position above the substrate carrier 300 for the two-layer substrate 320. The bonding layer 322 between 321 is heated. Subsequent to the layer 322, the colloid can be partially softened after being heated and the temperature is raised, thereby increasing the cutting efficiency of the cutting device 310. In a second preferred embodiment of the present invention, the heating module 330 is a heat gun that continuously delivers hot air at a high temperature against the target (ie, the layer 322). Since the steps of the method of separating the substrate of the second preferred embodiment are the same as those of the first preferred embodiment, they are not described again.

Next, a schematic perspective view of a substrate separation jig according to the third preferred embodiment of the present invention is shown. The difference between the third preferred embodiment and the second preferred embodiment is that the third preferred embodiment further includes a temperature sensing module 440 and a control module 450. The temperature sensing module 440 is disposed at a specific position above the substrate carrier 400 and can be used to sense the temperature of the bonding layer 422 between the two substrates 420 and 421 . The control module 450 is connected to the substrate carrier 400 and the temperature sensing module 440, and can receive the temperature measured by the temperature sensing module 440, and controls the moving speed of the substrate carrier 400 according to the temperature.

Referring to FIG. 7 , a step diagram of a method for separating a substrate according to a third preferred embodiment of the present invention includes the steps of: fixing two substrates to be separated to each other to be fixed on a substrate. a seat (step 501); the substrate carrier moves horizontally along the X-axis direction thereof, and the two wire fixing modules drive the cutting line and the plurality of top wires to reciprocate along the Y-axis direction, and the heating module continues to The bonding layer between the two substrates is heated (step 502); when the cutting line contacts the bonding layer between the two substrates, the cutting line starts to reciprocally move the bonding layer between the two substrates. Cutting, and the temperature sensing module starts sensing the temperature of the bonding layer between the two substrates, and transmits the sensed temperature to the control module, and the control module controls the movement of the substrate carrier according to the temperature. Speed (step 503); after the cutting line cuts a distance between the two layers of the substrate, the plurality of top lines are sequentially inserted into the cut portion of the bonding layer between the two substrates and the substrate above Jack up The two-layer substrate is kept in a separated state, at which time the temperature sensing module and the control module continue to perform their operations to control the moving speed of the substrate carrier (step 504); the cutting line is the entire bonding layer between the two substrates. The cutting is completed, and a plurality of top wires lift the upper substrate to completely separate the two substrates (step 505). In this method, if the control module 450 determines that the temperature of the adhesive layer 422 has not reached a certain value, the control substrate carrier 400 is moved at a minimum speed, and after the cutting line 412 completes the reciprocating movement, only the subsequent layer 422 cuts the distance of the double wire diameter to prevent the damage of the substrate 420, 421 caused by the bonding layer 422 being cut too fast at a low temperature. If the temperature of the layer 422 exceeds a certain value, the control module 450 accelerates the movement of the substrate carrier 400 according to a preset rule, which can reduce the cutting time and increase the working efficiency.

After the above detailed description of the system structure and technical features of the present invention, the following advantages can be summarized:

1. The present invention can completely separate the bonded substrate by a substrate separation tool and a method for separating the substrate, thereby recovering the substrate and reusing it, thereby reducing the production cost.

2. The present invention heats the adhesive layer between the two substrates by a heating module to increase the cutting efficiency of the cutting device.

3. According to the invention, the cutting device reciprocates the adhesive layer between the two layers of substrates to increase the cutting efficiency and improve the integrity of the substrate.

The embodiments described above are merely illustrative of the technical spirit and characteristics of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. Equivalent variations or modifications in accordance with the spirit of the invention are still intended to be included within the scope of the invention.

A1. . . Wire

A2, A3, 120, 121, 320, 321, 420, 421. . . Substrate

A4, 122, 322, 422. . . Next layer

1,3,4. . . Separation fixture

100,300,400. . . Substrate carrier

101,301,401. . . Vacuum adsorption hole

110,310,410. . . Cutting device

111a, 111b, 311a, 311b, 411a, 411b. . . Wire fixing module

112,312,412. . . Cutting line

113,313,413. . . Top line

330,430. . . Heating module

440. . . Temperature sensing module

450. . . Control module

201~205. . . Step number of a method for separating a substrate according to the first preferred embodiment

501~505. . . Step number of a method for separating a substrate according to a third preferred embodiment

1. . . Separation fixture

100. . . Substrate carrier

101. . . Vacuum adsorption hole

110. . . Cutting device

111a, 111b. . . Wire fixing module

112. . . Cutting line

113. . . Top line

120,121. . . Substrate

122. . . Next layer

Claims (7)

A substrate separation jig comprising: at least one substrate carrier, which can be used to fix at least two layers of substrates that are to be bonded to each other, and the substrate carrier can be horizontally moved along the X-axis direction thereof; and a cutting The device can cut the adhesive layer between the two layers of substrates, the cutting device comprises at least two wire fixing modules respectively disposed on two sides of the substrate carrier and along the Y axis of the substrate carrier The direction is reciprocating; a cutting line is respectively fixed on opposite sides of the two wire fixing modules and parallel to the Y axis of the substrate carrier, and the cutting line can be carried out along with the two wire fixing modules. Reciprocating movement of the shaft, and further cutting the adhesive layer between the two substrates; and at least one holding wire, the two ends of which are respectively fixed on opposite sides of the two wire fixing modules and Y axis of the substrate carrier Parallel, the top line is higher than the cutting line at the height of the Z-axis, and the top line can be inserted into the cut portion of the bonding layer between the two substrates and the upper substrate is jacked up, thereby dividing the two-layer substrate To prevent the two substrates bonded to revert to the state. The substrate separation tool of claim 1, wherein the substrate carrier is provided with a plurality of vacuum adsorption holes, which can be used to adsorb the two substrates that have been bonded to each other and are fixed on the substrate. The specific location of the seat. The substrate separation tool of claim 1, further comprising a heating module disposed at a specific position above the substrate carrier to heat the bonding layer between the two substrates To increase the cutting efficiency of the cutting device. The substrate separation tool of claim 1, further comprising a temperature sensing module disposed at a specific position above the substrate carrier for sensing between the two substrates Then the temperature of the layer. The substrate separation tool of claim 4, further comprising a control module connected to the substrate carrier and the temperature sensing module, which can receive the temperature sensing module The temperature is obtained, and the moving speed of the substrate carrier is controlled according to the temperature. A method for separating a substrate by using a substrate separation jig to separate the substrate, comprising at least the following steps: (1) fixing at least two substrates to be separated to each other on a substrate carrier; (2) The substrate carrier moves horizontally along the X-axis direction thereof, and the two wire fixing modules drive a cutting line and at least one holding wire to reciprocate along the Y-axis direction of the substrate carrier; (3) when the cutting line When contacting the adhesive layer between the two layers of substrates, the cutting line begins to cut the adhesive layer between the two substrates by reciprocating movement thereof; (4) the cutting line cuts the adhesive layer between the two substrates After a distance, the top wire begins to be inserted into the cut portion of the bonding layer between the two substrates and the upper substrate is lifted up, so that the separated portions of the two substrates remain separated; and (5) the cutting line The entire adhesive layer between the two substrates is cut, and the top wire lifts the upper substrate to completely separate the two substrates. The method of separating a substrate according to claim 6, wherein the adhesive layer between the two substrates is parallel to the X-Y plane of the substrate carrier.