TWI609445B - Laminated substrate separating device and method for separating laminated substrates - Google Patents

Description

Multilayer substrate separation device and multi-layer substrate separation method

The present disclosure relates to a separation device and a separation method for a multi-layer substrate.

Since electronic devices are required to have characteristics such as being thin, flexible, impact resistant, high in safety, and convenient to carry, it is a future development trend to manufacture electronic devices using flexible substrates or thin substrates. The fabrication of electronic components on such substrates can be broadly divided into two ways: one is to directly fabricate the electronic components on a flexible or thin substrate, and the other is to indirectly transfer electronic components to a flexible or thin substrate. on.

If you want to directly make electronic components on a flexible or thin substrate, you need to attach the flexible or thin substrate to the hard-working carrier substrate to form a multi-layer substrate before you can apply traditional rollers and machinery. Arm transmission. The desired electronic components are then fabricated on a flexible or thin substrate. After the component is completed, the flexible or thin substrate and the electron elements formed on the flexible or thin substrate must be The piece is removed from the rigid carrier substrate. A flexible or thin substrate is often closely attached to the rigid carrier substrate through the adhesive layer to avoid substrate displacement during the fabrication of the electronic component. However, this also makes it difficult to completely separate the multi-layer substrate.

The present disclosure provides a method for separating a separation device of a multi-layer substrate from a multi-layer substrate to separate different substrates of the multi-layer substrate from each other.

The present disclosure provides a multi-layer substrate separating apparatus for separating a first substrate and a second substrate of a multi-layer substrate. The first substrate and the second substrate are misaligned with each other at at least one edge of the multi-layer substrate. The multi-layer substrate separating device comprises a base and a separating tool, wherein the base is used to place the multi-layer substrate, and the multi-layer substrate exposes the misalignment. The separating tool is movably disposed on the base along one axis, and presses the misalignment to create a gap between the first substrate and the second substrate, and is further embedded in the slit to separate the first substrate from the second substrate.

The present disclosure provides a method for separating a multi-layer substrate for separating a first substrate and a second substrate of a multi-layer substrate. The first substrate and the second substrate are offset from each other at at least one edge of the multi-layer substrate. The method for separating the multi-layer substrate comprises: placing the multi-layer substrate on the pedestal, and exposing the multiplexed substrate to the erroneous position; and separating the first substrate and the second substrate at the dislocation with the separation tool pressing the misalignment.

Based on the above, in the above embodiment of the present disclosure, the first substrate is pressed against the misalignment of the first substrate and the second substrate by the separating tool to allow the first base Here, the plate can be cracked relative to the second substrate due to the force deformation, so that the separation tool can be inserted into the gap, so that the first substrate and the second substrate are separated therefrom. This allows the thin multi-layer substrate to provide a force sufficient to cause separation in a simple manner without the need for additional functions and the complicated structural design of the multi-layer substrate.

The above described features and advantages of the present invention will be more apparent from the following description.

100, 400, 500A, 500B, 500C, 500D‧‧‧ multi-layer substrate separation device

110‧‧‧Base

120, 410, 420, 510, 520‧‧‧ wheels

122‧‧‧First opening

130‧‧‧Separation tools

132‧‧‧ third opening

140‧‧‧Fluid operation module

142‧‧‧vacuum unit

144‧‧‧Pneumatic unit

150‧‧‧bearing station

152‧‧‧Second opening

160‧‧‧Control Module

170‧‧‧Mobile unit

200, 200A, 200B, 200C‧‧‧Multilayer substrates

210, 210A, 210B, 210C, 210D‧‧‧ first substrate

220, 220A, 220B, 220C, 220D‧‧‧ second substrate

310‧‧‧Clamping fixture

320‧‧‧Electrostatic generator

330, 340‧‧‧Mobile fixtures

331, 332‧‧‧ rotating arm

530‧‧‧Clamping block

540‧‧‧Drive wheel set

541, 542‧‧‧ pulley

543‧‧‧Land

E1‧‧‧ sharp edges

F1, F2, F3‧‧‧ force

G1‧‧‧ gap

G2‧‧‧ gap

L‧‧‧ Misplaced

O‧‧‧Axis

S1‧‧‧ bottom

S2‧‧‧ pushing surface

S3‧‧ plane

S4‧‧‧ sloped surface

‧‧‧‧ angle

X‧‧‧ size

R‧‧‧ Radius

T‧‧‧thickness

Θ‧‧‧ angle

X-Y-Z‧‧‧ coordinates

S110~S180‧‧‧Steps

1 is a schematic view of a multi-layer substrate separating apparatus in accordance with an embodiment of the present disclosure.

FIG. 2 illustrates the connection relationship of related components of the multi-layer substrate separating apparatus.

FIG. 3 illustrates a separation process of a multi-layer substrate.

Fig. 4 is a partially enlarged side elevational view of the multi-layer substrate separating apparatus of Fig. 1.

FIG. 5 and FIG. 6 respectively show partial schematic views of the multi-layer substrate during the separation process.

FIG. 7 is a schematic view showing the relationship between the size of the multi-layer substrate separating device and the multi-layer substrate of FIG. 1. FIG.

8 and 9 are schematic views respectively showing a multi-layer substrate and a separation tool according to two embodiments of the present disclosure.

FIG. 10 and FIG. 11 are schematic diagrams showing the placement of a multi-layer substrate on a carrier according to different embodiments.

12 and 13 respectively illustrate schematic views of separating a multi-layer substrate according to different embodiments.

FIG. 14 is a schematic diagram of a multi-layer substrate separating apparatus according to another embodiment of the present disclosure.

15 to 18 illustrate the manner in which the second substrate after separation is maintained, according to various embodiments.

1 is a schematic view of a multi-layer substrate separating apparatus in accordance with an embodiment of the present disclosure. FIG. 2 illustrates the connection relationship of related components of the multi-layer substrate separating apparatus. FIG. 3 illustrates a separation process of a multi-layer substrate. Fig. 4 is a partially enlarged side elevational view of the multi-layer substrate separating apparatus of Fig. 1. Referring to FIG. 1 , FIG. 2 and FIG. 4 , in the embodiment, the multi-layer substrate separating apparatus 100 includes a base 110 , a roller 120 and a separating tool 130 , wherein the base 110 is provided with a carrying platform 150 The multi-layer substrate 200 is placed on the carrier 150. The roller 120 and the separating tool 130 are respectively movably disposed on the base 110 along the Y-axis, and are capable of moving back and forth with respect to the base 110 in the direction of the double arrow shown in the figure, wherein the roller 120 is rotatable relative to the X-axis.

Since the above-mentioned multi-layer substrate is not easily separated, the present disclosure can completely separate the multi-layer substrate 200 in a simple manner but effectively by the multi-layer substrate separating apparatus 100. It should be noted that the multi-layer substrate 200 of the present embodiment is formed by attaching the first substrate 210 and the second substrate 220 to each other, wherein the first substrate 210 is a hard or thick-bearing carrier substrate, and The two substrates 220 are thin substrates having flexibility (for example, ultra-thin glass having an average thickness of less than 200 μm). It should be noted that the first substrate 210 and the second substrate 220 of the present embodiment have a misaligned state at least one edge of the multi-layer substrate 200, that is, as shown in FIG. 4 . It is shown that the first substrate 210 and the second substrate 220 at the misalignment L are not aligned with each other.

On the other hand, the multi-layer substrate separating apparatus 100 further includes a control module 160, a plurality of moving units 170, a vacuum unit 142 and a pneumatic unit 144, wherein the moving unit 170, the vacuum unit 142 and the air pressure unit 144 are electrically connected to the control module, respectively. Group 160. As shown in FIG. 2, the separating tool 130 and the roller 120 are respectively assembled on the base 110 by the moving unit 170, and are controlled to move relative to the base 110 by the control module 160.

Further, the roller 120 has a hollow structure and a plurality of first openings 122 on its surface, thereby being connected to the vacuum unit 142 to provide an adsorption force. Similarly, the surface of the carrier 150 also has a plurality of second openings 152 that are also in communication with the vacuum unit 142 to be fixed to the carrier 150 by vacuum adsorption when the multilayer substrate 200 is placed on the carrier 150. on.

FIG. 5 and FIG. 6 respectively show partial schematic views of the multi-layer substrate during the separation process. Referring to the flowchart of FIG. 3 and FIG. 4 to FIG. 6 , firstly, in step S110 of the embodiment, the multi-layer substrate 200 is first placed on the susceptor 110 , wherein the first substrate 210 is located on the loading platform 150 . The surface is adsorbed and fixed on the stage 150 by the vacuum unit 142. The second substrate 220 is substantially superposed on the first substrate 210, and at the foregoing offset L, the first substrate 210 is exposed from the second substrate 220, that is, as in the case of the misalignment L in FIG. After the layer substrate 200 is placed on the stage 150, the portion of the first substrate 210 at the offset L is substantially not obscured by the second substrate 220. In other words, when the user's multi-layer substrate 200 is placed on the pedestal At the time of 110, the misalignment L of the multi-layer substrate 200 is directed toward the separation tool 130.

Next, in step S120, the separation tool 130 and the roller 120 are respectively moved to the misalignment L; and in step S130, the separation tool 130 is pressed against the multi-layer substrate 200 in the negative Z-axis direction, which is noted here. The separating tool 130 is pressed against the first substrate 210, that is, the portion of the first substrate 210 exposing the second substrate 220 at the aforementioned misalignment, as shown in FIG. Accordingly, after the first substrate 210 is pressed, it is deformed toward the negative Z-axis direction, and the pressure is greater than the adhesion between the first substrate 210 and the second substrate 220, and is sufficient for the first substrate 210 and the second substrate 210 The substrate 220 forms a crevice or gap G1 at the misalignment L.

It should be noted that the loading platform 150 of the present embodiment has a plane S3 and an inclined surface S4, wherein a majority of the multi-layer substrate 200 is placed on the plane S3 and is adsorbed and fixed on the plane S3 by the second opening 152. on. Here, the plane S3 is substantially parallel to the X-Y plane. The inclined surface S4 is adjacent to the plane S3 but at an angle to the plane S3. As shown in FIGS. 4 to 6, the offset portion L of the multi-layer substrate 200 is actually located above the inclined surface S4 so as to be opposite to the inclined surface S4. There is a gap G2 between them. According to this, when the first substrate 210 is deformed in the negative Z-axis direction by the urging force of the separating tool 130, the gap G2 provides a space for the first substrate 210 to deform, so that the first substrate 210 exposes the second substrate. The portion of 220 (i.e., the pressed portion) is deformed toward the inclined surface S4.

In the present embodiment, the separating tool 130 is, for example, a member having a blade tip shape having a bottom surface S1, a pushing surface S2, and a sharp edge E1, wherein the sharp edge E1 is substantially adjacent between the bottom surface S1 and the pushing surface S2. In the above step S130, The separating tool 130 is pressed against the first substrate 210 by its bottom surface S1, and after the gap G1 is generated, in step S140, the sharp edge E1 of the separating tool 130 is moved along the Y axis to be embedded in the slit G1. The second substrate 220 is substantially abutted on the pushing surface S2. Thus, the gap G1 can form a starting position for subsequent substrate separation.

In addition, the separating tool 130 further has a plurality of third openings 132 (shown in FIG. 1) on the pushing surface S2, which are connected to the aforementioned air pressure unit 144 (shown in FIG. 2), in this embodiment. The air pressure unit 144 is controlled by the control module 160 to provide a compressed air flow from the third opening 132 out of the separation tool 130. Therefore, after the separation tool 130 is inserted into the gap G1 with the sharp edge E1 in the foregoing step S140, the second substrate 220 originally contacting the thrust surface S2 can be further pushed by the compressed air flow in step S150. To the surface of the roller 120. Furthermore, as described above, the roller 120 is coupled to the vacuum unit 142 to provide an adsorption force via the first opening 122. Accordingly, in step S160, the vacuum unit 142 can be used at the first opening 122. The gas flows to provide an adsorption effect to the second substrate 220. In this way, the second substrate 220 can be smoothly moved from the pushing surface S2 of the separating tool 130 to the surface of the roller 120 via steps S150 and S160, and then adsorbed and fixed on the roller 120.

In addition, the air pressure unit 144 and the vacuum unit 142 of the embodiment form a fluid operation module 140. Since both of them are adsorbed or thrust by the adjustment of the fluid (gas), the air pressure can be simultaneously driven by a single module. The unit 144 and the vacuum unit 142 are designed to achieve a fluid adjustment effect in the same piping design, for example, when a compressed air flow is generated at the separation tool 130, it can generate vacuum adsorption at the roller 120. In order to achieve the desired adsorption or push effect.

It should be noted that, in FIGS. 4 to 6 of the present embodiment, F1, F2 and F3 respectively represent three kinds of forces (including suction or thrust) generated on the multi-layer substrate 200 due to gas flow, wherein F2 represents separation. The compressed airflow on the tool 130 pushes the second substrate 220 toward the top thrust of the roller 120; F1 represents the adsorption force generated by the vacuum unit 144 in the first opening 122 by the gas flow; and F3 represents the vacuum unit 144 on the carrying platform. The adsorption force (corresponding to the adsorption force to the first substrate 210) generated on the cladding substrate 200 at 150.

Next, in step S170, after the second substrate 220 at the slit G1 has been adsorbed and fixed to the roller 120, the roller 120 is continuously rotated to enable the second substrate 220 to be wound on the roller 120, and the second substrate is made. 220 is gradually separated from the first substrate 210. It should be noted that, when step S170 is performed, the foregoing steps S150 and S160 are still in progress until step S180, when the second substrate 220 is completely separated from the first substrate 210, the steps S140 to S150 are ended, and The first substrate 210 and the second substrate 220 are removed from the susceptor 110 and the roller 120, respectively, to accomplish the ultimate goal of the present disclosure.

FIG. 7 is a schematic view showing the relationship between the size of the multi-layer substrate separating device and the multi-layer substrate of FIG. 1. FIG. Referring to FIG. 7 , in the embodiment, the angle between the relevant member and the multi-layer substrate 200 can be obtained, and the angle of the separation tool 130 at the sharp edge E1 is required (ie, the bottom surface S1 and the top surface). The angle between S2 is α). The definition is as follows: the separation tool 130 is embedded along the Y-axis with a gap G. The distance from the axis O is projected to the multi-layer substrate 200 by a distance x, the radius of the roller 120 is r, the thickness of the second substrate 220 is t, and θ is the separation of the roller 120. The tool 130 is embedded in the angle of the slit G1, then: θ = tan ^-1 [x / (r + t)], and α ≦ 2θ. The user can then derive the form of the desired separation tool 130 from this calculation. For example, when the size of the slit G to be inserted into the slit G along the Y-axis is x=20 mm, the radius r of the roller 120 is 125 mm, and the thickness of the second substrate 220 is t=0.1 mm, the equation can be known as θ= 9.1°. Therefore, the angle α required by the separating tool 130 at the sharp edge E1 is less than or equal to 18.2°.

In addition, FIG. 8 and FIG. 9 respectively illustrate schematic views of a multi-layer substrate and a separation tool according to two embodiments of the present disclosure. Referring to FIG. 8 , the first substrate 210A and the second substrate 220A of the multi-layer substrate 200A are both polygonal (as shown in the example of the quadrilateral in FIG. 8 ), and there are misalignment situations at three edges, so in this embodiment. The separating tool 130 is configured to perform the above-mentioned separating action from the three misalignments shown, wherein it is preferable that the moving direction of the separating tool 130 (such as the arrow) is directed to one corner of the polygon. That is, the adhesion of the multi-layer substrate 200A is the weakest, and thus the multi-layer substrate 200A is smoothly separated by the above steps.

The multi-layer substrate shown in FIG. 9 is formed by attaching a first substrate and a second substrate in a circular shape. As shown in the figure, the first substrate 210B and the second substrate 220B of the multi-layer substrate 200B are both illustrated. In the case of a circular profile, most of the circumferences are misaligned, so in the present embodiment, the direction of movement of the separation tool 130 toward the multi-layer substrate 200B (such as an arrow) can be circular. The lines of the second substrate 220B are orthogonal to each other (as indicated by a broken line in the figure), so that the effect of separating the multi-layer substrate 200B in the above manner can be achieved, and it is preferable that the moving direction of the separating tool 130 is substantially correct. The center of the circular second substrate 220B is described.

FIG. 10 and FIG. 11 are schematic diagrams showing the placement of a multi-layer substrate on a carrier according to different embodiments. Referring first to FIG. 10, the base 110 further includes a clamping fixture 310 assembled on the carrier 150, thereby allowing the multi-layer substrate 200 placed on the carrier 150 to be clamped and fixed thereon. The device 310 is substantially pressed against the first substrate 210. Referring to FIG. 11 , in the embodiment, the multi-layer substrate 200 is fixed on the carrying platform 150 by the electrostatic generator 320 , that is, the electrostatic generator 320 is formed to form a specific electrostatic polarity to the carrying platform 150. The purpose of adsorbing the multi-layer substrate 200. Accordingly, the present disclosure does not limit the manner in which the multi-layer substrate 200 is fixed to the stage 150. In another embodiment, the multi-layer substrate 200 can also be fixed to the carrier 150 by a transient connection, that is, between the multi-layer substrate 200 and the pedestal 110 in the subsequent process. Forming a van der Waals force, a covalent bonding force, or a chemical bonding force to achieve a bonding effect, and when the second substrate 220 is removed from the first substrate 210 Thereafter, the first substrate 210 is further removed from the susceptor 110 by releasing the bonding force.

12 and 13 respectively illustrate schematic views of separating a multi-layer substrate according to different embodiments. Referring to FIG. 12, the susceptor 110 of the present embodiment further includes a moving jig 330 including rotating arms 331 and 332, wherein the rotating arm 331 is pivotally connected to the bracket 112 of the base 110, and the rotating arm 332 is disposed on the rotating arm. The 331 extends from one end thereof toward the direction away from the bracket 112 to allow the rotating arms 331, 332 to rotate relative to the base 110 (along the X axis). In addition, the mobile jig 330 is also coupled to a vacuum unit 142 (shown in FIG. 2) to provide vacuum adsorption to the second substrate 220. Accordingly, the second substrate 220 It can be adsorbed on the rotating arms 331, 332. After the separation tool 130 is moved along the Y axis and inserted into the slit G1 (as described above), the second substrate 200 can be separated from the first substrate 210 by rotating the rotating arms 331, 332. Referring to FIG. 13, which differs from FIG. 12, the moving jig 340 is moved along the Z-axis in a manner parallel to the X-Y plane, unlike the rotation of the separation jig 330 described above. It should be noted that the mobile jig can be partially constructed as shown in FIG. 12 or as a separate structure of the device as shown in FIG. 13 , and is only held by the user during the separation process, and is not The manner in which the second substrate can be separated in the manner described in the present disclosure can be applied to the embodiments of the present disclosure.

In another embodiment, the separation tool 130 of the foregoing FIGS. 12 and 13 can also be coupled to the air pressure unit 144 (shown in FIG. 2) to allow the compressed airflow generated along the wedge surface to push the second substrate 220. It is beneficial to its separation process.

FIG. 14 is a schematic diagram of a multi-layer substrate separating apparatus according to another embodiment of the present disclosure. Referring to FIG. 14, the multi-layer substrate separating apparatus 400 is adapted to have a roll-to-roll structure, and is applicable to the first substrate 210C and the second substrate 220C which are flexible in the multi-layer substrate 200C. In this embodiment, the multi-layer substrate separating apparatus 400 includes a susceptor 110, a separating tool 130, and a plurality of rollers 120, 410 and 420, wherein the pedestal 110, the separating tool 130 and the roller 120 are as described above, and will not be described herein. . The roller 420 is for releasing the multi-layer substrate 200C which is still in a roll shape and is not separated, and the roller 410 is used for winding the first substrate 210C after the second substrate 220C is separated from the first substrate 210C.

15 to 18 are respectively shown after maintaining separation according to different embodiments. The manner of the two substrates is to prevent the second substrate after separation from being lifted from the roller 120. Referring to FIG. 15, the multi-layer substrate separating apparatus 500A further includes a roller 510 disposed beside the roller 120 to clamp and support the second substrate 220D that has been separated from the first substrate 210D to make the second substrate 220D compact. The ground is adsorbed on the surface of the roller 120.

Referring to FIG. 16, different from FIG. 15, the roller 520 of the multi-layer substrate separating device 500B is movably disposed beside the roller 120, so that the roller 520 can be rotated relative to the roller (in addition to the X-axis). 120 for a revolution.

Referring to FIG. 17, the multi-layer substrate separating device 500C of the present embodiment replaces the aforementioned rollers 510, 520 with a clamping block 530, and the clamping block 530 does not rotate along the X-axis, but is centered on the roller 120. Make a revolution. Moreover, the clamping block 530 can also support or clamp the separated second substrate 220D to the surface of the roller 120 with its larger contact surface, that is, the second substrate 220D is movably clamped at Between the contact surface and the roller 120, wherein the surface contour of the contact surface and the surface contour of the roller 120 are complementary to each other.

Referring to FIG. 18, the multi-layer substrate separating apparatus 500D further includes a transmission wheel set 540 including a pair of pulleys 541, 542 and a belt 543 surrounding the same. After the second substrate 220D is separated from the first substrate 210D, the second substrate 220D can be clamped and supported by the belt 543 in addition to being vacuum-adsorbed on the roller 120, wherein the spacing between the pulleys 541 and 542 can be And to adjust appropriately to allow the belt 543 to provide an appropriate supporting force on the second substrate 220D.

In the above embodiment of the present disclosure, the first substrate of the multi-layer substrate The second substrate is misaligned at the edge, thereby causing the separating device to be pressed by the separating tool against the first substrate at the dislocation, causing the first substrate to be deformed relative to the second substrate, and further the first substrate and the second substrate A gap is formed between them. According to this, the separating tool can be embedded in the slit with its sharp edge, so that the second substrate is pushed up by the separating tool; at the same time, the adsorption effect on the second substrate is generated on the surface of the roller by the vacuum unit, and by The air pressure unit exerts an effect of pushing the second substrate on the surface of the separating tool, thereby allowing the second substrate to be fixed to the roller. Accordingly, when the roller continues to rotate, the second substrate is wound on the roller, and also represents that the second substrate is gradually separated from the first substrate. In this way, the effect of separating the multi-layer substrate can be finally completed. This achieves the effect of separating the multi-layer substrate in a simple but effective manner by the associated mechanism of the separation device corresponding to the multi-layer substrate.

The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

100‧‧‧Multilayer substrate separation device

110‧‧‧Base

120‧‧‧Roller

122‧‧‧First opening

130‧‧‧Separation tools

132‧‧‧ third opening

150‧‧‧bearing station

152‧‧‧Second opening

200‧‧‧Multilayer substrate

O‧‧‧Axis

X-Y-Z‧‧‧ coordinates

Claims (25)

A multi-layer substrate separating device for separating a first substrate and a second substrate of a multi-layer substrate, wherein the first substrate and the second substrate are misaligned with each other at at least one edge of the multi-layer substrate, The multi-layer substrate separating device includes: a pedestal for placing the multi-layer substrate, wherein the multi-layer substrate exposes the misalignment; a separating tool is movably disposed on the pedestal along an axis to resist the Dislocating to create a gap between the first substrate and the second substrate, and further embedding in the slit to separate the first substrate from the second substrate, the separation tool having a bottom surface and a pushing surface, a connection between the bottom surface and the pushing surface is a sharp edge; and a roller movably disposed on the base along the shaft, the roller having a plurality of first openings, wherein the sharp edge is used to embed the gap The bottom substrate is pressed against the first substrate, and the second substrate is pushed toward the roller by the pushing surface, and the portion of the second substrate separated from the first substrate is adsorbed to the first openings. And wound on the roller. The multi-layer substrate separating apparatus of claim 1, further comprising: a support member disposed adjacent to the roller, the portion of the second substrate separated from the first substrate being wound around the roller and movable The ground is clamped between the support member and the roller. The multi-layer substrate separating apparatus of claim 2, wherein the supporting member is another roller. The multi-layer substrate separating device of claim 3, wherein the other roller can revolve with respect to the roller. The multi-layer substrate separating device of claim 2, wherein the supporting member is a clamping block rotatably disposed adjacent to the roller, the clamping block having a contact surface, A second substrate is movably clamped between the contact surface and the roller, and a surface contour of the contact surface and a surface contour of the roller are complementary to each other. The multi-layer substrate separating device of claim 2, wherein the supporting member is a transmission wheel set. The multi-layer substrate separating device of claim 1, further comprising: a moving jig movably disposed above the pedestal to move closer to or away from the pedestal, the second substrate from the first A portion of the substrate that is separated is attached to the moving jig such that a portion of the second substrate that is not separated from the first substrate is separated from the first substrate as the moving jig is away from the base. The multi-layer substrate separating apparatus according to claim 1, wherein the separating tool is embedded in the slit along the axis, and the distance from the axis of the roller to the multi-layer substrate is x, and the radius of the roller is r. The thickness of the second substrate is t, and the angle of the separation tool at the sharp point is α, then: θ = tan ^-1 [x / (r + t)], and α ≦ 2θ. The multi-layer substrate separating apparatus according to claim 1, wherein the first substrate or the second substrate is an ultra-thin glass having flexibility. The multi-layer substrate separating apparatus according to claim 1, wherein the multi-layer substrate separating apparatus is provided with a roll-to-roll structure. The multi-layer substrate separating apparatus according to claim 1, further comprising: a control module; and a plurality of moving modules electrically connected to the control module, wherein the roller and the separating tool are respectively disposed corresponding to The moving modules are controlled by the control module to move along the axis. The multi-layer substrate separating device of claim 1, further comprising: a control module; and a vacuum unit connecting the first openings and electrically connected to the control module, the control module The vacuum unit is driven to provide an adsorption force to the second substrate via the first openings. The multi-layer substrate separating device of claim 12, wherein the base further comprises a plurality of second openings communicating with the vacuum unit to provide adsorption force to the first substrate via the second openings . The multi-layer substrate separating device of claim 1, wherein the separating tool further comprises a plurality of third openings located on the pushing surface, and the multi-layer substrate separating device further comprises: a control module; And a pressure unit connected to the third opening and electrically connected to the control module to be controlled by the control module to pass the second substrate to the roller . The multi-layer substrate separating apparatus of claim 1, wherein a surface contour of the pushing surface conforms to a surface contour of the roller. The multi-layer substrate separating apparatus according to claim 1, wherein the base has a plane and an inclined surface adjacent to each other, the multi-layer substrate is placed on the plane, and the misalignment is located above the inclined surface. And a gap exists therebetween to offset the first substrate toward the inclined surface when the separation tool is pressed. A method for separating a multi-layer substrate for separating a first substrate and a second substrate of a multi-layer substrate, wherein the first substrate and the second substrate are offset from each other at at least one edge of the multi-layer substrate, the complex The method for separating a layer substrate comprises: placing the multi-layer substrate on a pedestal, wherein the multi-layer substrate exposes the dislocation; pressing the dislocation position in a first direction with a separating tool on the first substrate Forming a gap with the second substrate, and inserting the slit in a second direction by the separating tool to separate the first substrate from the second substrate, wherein the first direction is different from the second direction. The method for separating a multi-layer substrate according to claim 17, further comprising: providing a roller, the roller having a plurality of first openings; moving the roller to the misalignment, separating the separated portion of the second substrate via the second substrate The first openings are vacuum-adsorbed onto the roller; and the roller is rotated to wind the second substrate to completely separate the second substrate from the first substrate. The method for separating a multi-layer substrate according to claim 17, further comprising: providing a moving jig, and moving the moving jig to the second substrate on the base; the second substrate has been A portion of the first substrate separated is attached to the moving jig; and the moving jig is moved away from the base such that the second substrate is completely separated from the first substrate. The method for separating a multi-layer substrate according to claim 17, wherein the susceptor further comprises a plurality of second openings, and the method for separating the multi-layer substrates further comprises: vacuum absorbing the via holes through the second openings A multi-layer substrate is on the pedestal. The method for separating a multi-layer substrate according to claim 17, wherein the separating tool has a bottom surface and a pushing surface, and the bottom surface and the pushing surface are connected to each other as a sharp edge, the multi-layer substrate The separation method further includes: Pressing the first substrate with the bottom surface to form the gap between the first substrate and the second substrate; inserting the slit with the sharp edge; and the second substrate by the pushing surface Push to the wheel. The method of separating a multi-layer substrate according to claim 21, wherein the separating tool further comprises a plurality of third openings on the pushing surface, and the method for separating the multi-layer substrate further comprises: The three openings provide a pressurized fluid to the push surface such that the separated portion of the second substrate is pushed by the pressurized fluid and moved to the roller. The method of separating a substrate according to claim 17, wherein the moving direction of the separating tool and the moving direction of the roller are opposite to each other. The method of separating a multi-layer substrate according to claim 17, wherein when the multi-layer substrate is a polygon, the separation tool moves in a direction to the misalignment, and the direction is opposite to a corner of the polygon. The method for separating a multi-layer substrate according to claim 17, wherein when the multi-layer substrate is a circle, the separation tool moves in a direction to the misalignment, and the direction is orthogonal to the circle Everything is line.