TWI392704B - The thermoplastic resin composition and molded article - Google Patents
The thermoplastic resin composition and molded article Download PDFInfo
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- TWI392704B TWI392704B TW094115992A TW94115992A TWI392704B TW I392704 B TWI392704 B TW I392704B TW 094115992 A TW094115992 A TW 094115992A TW 94115992 A TW94115992 A TW 94115992A TW I392704 B TWI392704 B TW I392704B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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Description
【0001】本發明係有關於具卓越之耐衝擊性、耐藥品性、成形品表面外觀、防靜電性乃至制電性的熱塑性樹脂組成物,及該熱塑性樹脂組成物所構成之成形品。[0001] The present invention relates to a thermoplastic resin composition having excellent impact resistance, chemical resistance, surface appearance of a molded article, antistatic property, and electrical conductivity, and a molded article comprising the thermoplastic resin composition.
【0002】ABS樹脂等苯乙烯系樹脂,因具備卓越的耐衝擊性、成形性、剛性等機械強度等,及成形品表面外觀,各被廣泛用於電氣、電子領域、OA、家電領域、車輛領域、衛生領域等,但有些用途無法充分發揮耐藥品性,各要求提升耐藥品性。[0002] A styrene-based resin such as ABS resin is widely used in electrical and electronic fields, OA, home appliances, and vehicles because of its excellent impact resistance, moldability, rigidity, and other mechanical strengths. In the field, the health field, etc., but some applications cannot fully exert the chemical resistance, and each requirement is to improve the chemical resistance.
另一方面,聚丙烯等烯系樹脂因具卓越的耐藥品性、耐熱性、流動性等,故同於前述苯乙烯系樹脂一樣,被廣泛用於電氣、電子領域、OA、家電領域、車輛領域、衛生領域等上,但耐衝擊性低、成形品上容易發生翹曲、毛邊等問題;此外,成形後的物性、尺寸也有時間變化上的問題。On the other hand, olefin-based resins such as polypropylene have excellent chemical resistance, heat resistance, fluidity, etc., and are widely used in electric and electronic fields, OA, home electric appliances, and vehicles, similar to the above-mentioned styrene-based resins. In the field, the sanitary field, and the like, the impact resistance is low, and warpage, burrs, and the like are likely to occur on the molded article. Further, the physical properties and dimensions after molding have time variations.
【0003】為了改良上述問題,雖考慮混合ABS樹脂與聚丙烯,但兩者相溶性不佳,光靠單純的溶融混合,只能獲得極為脆弱的材料;專利文獻1上有提到在調配聚苯乙烯樹脂與聚丙烯樹脂時,讓苯乙烯丁二烯共聚塊橡膠存在,但無調配ABS樹脂、AS樹脂與聚丙烯的相關記載例;專利文獻2上有提到調配聚烯系樹脂與聚苯乙烯系樹脂時,調配已添加氫的苯乙烯丁二烯共聚物,但無調配ABS樹脂、AS樹脂與聚烯的相關記載例;專利文獻3上有提到調配聚烯系樹脂與低分子量聚苯乙烯、及苯乙烯丁二烯共聚塊所構成之組成物,但無調配ABS樹脂、AS樹脂的相關記載例。In order to improve the above problems, although a mixture of ABS resin and polypropylene is considered, the compatibility between the two is poor, and only a very fragile material can be obtained by simple melt mixing; Patent Document 1 mentions that in the polymerization In the case of a styrene resin and a polypropylene resin, a styrene butadiene copolymer block rubber is present, but there is no relevant description of the ABS resin, the AS resin, and the polypropylene; and Patent Document 2 mentions the formulation of a polyolefin resin and a poly In the case of a styrene-based resin, a hydrogen-added styrene-butadiene copolymer is blended, but there is no description of the preparation of the ABS resin, the AS resin, and the polyolefin. Patent Document 3 mentions the blending of a polyolefin resin and a low molecular weight. A composition composed of a polystyrene and a styrene butadiene copolymer block, but there is no relevant description of the ABS resin or the AS resin.
再者,專利文獻4上有提到,將因環氧變性聚丙烯、與不飽和羧酸或酐而變性之苯乙烯系樹脂視為相溶化劑之用;專利文獻5上也有提到,用環氧基所變性之聚丙烯系樹脂、與不飽和羧酸或該酐所變性之苯乙烯丁二烯共聚塊,但耐衝擊性、成形品表面外觀則不充分;而且成形品容易帶電、而難以用於會引起靜電障礙之用途。Further, Patent Document 4 mentions that a styrene-based resin which is denatured by an epoxy-modified polypropylene or an unsaturated carboxylic acid or an anhydride is regarded as a compatibilizing agent; it is also mentioned in Patent Document 5, a polypropylene-based resin modified with an epoxy group, and a styrene butadiene copolymerized block which is denatured with an unsaturated carboxylic acid or the anhydride, but has insufficient impact resistance and a surface appearance of the molded article; and the molded article is easily charged. It is difficult to use for applications that cause static electricity.
【0004】此外,ABS樹脂等苯乙烯系樹脂及聚丙烯等聚烯系樹脂,皆具有容易帶靜電的性質,故難以用於會因靜電而發生障礙的液晶顯示裝置、電漿電視、半導體週邊構件、無塵室內等所用或操作之各種零組件、薄板、薄膜等上。In addition, styrene resins such as ABS resin and polyolefin resin such as polypropylene all have a property of being easily electrostatically charged, so that it is difficult to be used for a liquid crystal display device, a plasma TV, and a semiconductor periphery which may be hindered by static electricity. Various components, sheets, films, etc. used or operated in components, clean rooms, and the like.
為了改良相關缺點,專利文獻9上雖有提出在ABS樹脂等苯乙烯系樹脂上調配聚醯胺彈性體,但具有未能充分發現到制電性的問題;同樣的,專利文獻10及專利文獻11上也有公開含橡膠強化苯乙烯系樹脂及聚醯胺彈性體之組成物;此外,專利文獻6及專利文獻7上則有提出在聚烯系樹脂上調配特定防靜電劑,但不具持續性的制電性,因此會面臨到制電性不充分等問題;此外,持續發揮制電性的方法則有專利文獻8及12所提出之,在聚烯系樹脂上調配聚烯塊及具有聚醚等親水性嵌段聚合物之共聚塊,但具有未能充分發現到制電性的問題。In order to improve the related disadvantages, Patent Document 9 proposes to adjust a polyamine elastomer on a styrene resin such as ABS resin, but has a problem that power generation is not sufficiently found; similarly, Patent Document 10 and Patent Literature There is also a composition which discloses a rubber-reinforced styrene-based resin and a polyamide elastomer. Further, Patent Document 6 and Patent Document 7 propose to formulate a specific antistatic agent on a polyolefin resin, but it is not sustainable. In addition, problems such as insufficient power-generating property are encountered. In addition, the method of continuously exerting the power-generating property is proposed in Patent Documents 8 and 12, and the polyene-based resin is blended with a polyene block and has a poly-polymer. A copolymer block of a hydrophilic block polymer such as ether, but has a problem that power generation property is not sufficiently found.
【0005】【專利文獻1】特公昭52-17055號公報【專利文獻2】特開昭56-38338號公報【專利文獻3】特開昭56-104978號公報【專利文獻4】特開平1-174550號公報【專利文獻5】特開平4-266953號公報【專利文獻6】特開平4-258647號公報【專利文獻7】特開2000-313875號公報【專利文獻8】特開2001-278985號公報【專利文獻9】特開昭60-23435號公報【專利文獻10】特開平4-309547號公報【專利文獻11】特開平2-292353號公報【專利文獻12】特開2002-284880號公報[Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A-56-38338 (Patent Document 3) JP-A-56-104978 (Patent Document 4) Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document No. JP-A-2002-284880] [Patent Document No. JP-A-2002-284880]
【0006】本發明之目的在於,提供具卓越耐衝擊性、耐藥品性、成形品表面外觀、防靜電性乃至制電性的熱塑性樹脂組成物,及用上述熱塑性樹脂組成物所構成之成形品。An object of the present invention is to provide a thermoplastic resin composition having excellent impact resistance, chemical resistance, surface appearance, antistatic property, and electrical conductivity of a molded article, and a molded article comprising the thermoplastic resin composition. .
【0007】本發明人等為了達成上述目的經過專研之下發現到,透過在含有苯乙烯系樹脂及/或烯系樹脂之熱塑性樹脂組成物上,調配含有烯嵌段聚合物與親水性嵌段聚合物之共聚塊,而可獲得具卓越耐衝擊性、耐藥品性、成形品表面外觀、防靜電性之成形品,因而完成本發明;另外,也發現到調配具備特定防靜電性之化合物及/或特定嵌段結構之聚合物、或低分子量聚烯變質物,可提升耐衝擊性與防靜電性等特性,因而完成本發明。In order to achieve the above object, the inventors of the present invention have found that a polyolefin-containing polymer and a hydrophilic resin composition are blended on a thermoplastic resin composition containing a styrene resin and/or an olefin resin. The copolymer of the segment polymer can obtain a molded article having excellent impact resistance, chemical resistance, surface appearance of the molded article, and antistatic property, thereby completing the present invention; and also finding a compound having a specific antistatic property. And/or a polymer of a specific block structure or a low molecular weight polyene metamorphism can improve characteristics such as impact resistance and antistatic property, and thus the present invention has been completed.
【0008】換言之,據本發明的立場而言,其特徵在於提供含有以下(A)成份5~100質量%、及(B)成份95~0質量%(但該(A)成份及(B)成份合計為100質量%)。In other words, according to the standpoint of the present invention, it is characterized in that it contains 5 to 100% by mass of the following (A) component and 95 to 0% by mass of the component (B) (but the (A) component and (B) The total amount of the ingredients is 100% by mass).
再者,對於該(A)成份及(B)成份合計為100質量部而言,以下(C1)成份含有5~100質量部之熱塑性樹脂組成物(以下稱為「第一熱塑性樹脂組成物」)。In addition, the total amount of the component (A) and the component (B) is 100 parts by mass, and the following (C1) component contains a thermoplastic resin composition of 5 to 100 parts by mass (hereinafter referred to as "first thermoplastic resin composition") ).
(A)成份:在存在或不存在橡膠質聚合物之下,(共)聚合芳香族乙烯化合物、或可共聚合芳香族乙烯化合物及芳香族乙烯化合物之其他乙烯單體之苯乙烯樹脂;(B)成份:烯系樹脂;(C1)成份:含烯嵌段聚合物(c1-1)與親水性嵌段聚合物(c1-2)之嵌段共聚物。(A) component: a styrene resin which (co)polymerizes an aromatic vinyl compound or a copolymerizable aromatic vinyl compound and another vinyl monomer of an aromatic vinyl compound in the presence or absence of a rubbery polymer; B) Component: an olefinic resin; (C1) component: a block copolymer of an olefin-containing block polymer (c1-1) and a hydrophilic block polymer (c1-2).
【0009】此外,據本發明之最佳實施型態來看,在於提供對於前述(A)成份及(B)成份合計為100質量部而言,含有0.001~60質量部之至少從以下(C2-1)成份、(C2-2)成份、(C2-3)成份、(C2-4)成份群中所選擇之1種成份的上述第一熱塑性樹脂組成物。Further, according to a preferred embodiment of the present invention, it is provided that the total amount of the component (A) and the component (B) is 100 parts by mass, and at least 0.001 to 60 parts by mass are provided from below (C2). -1) The above first thermoplastic resin composition of one component selected from the group consisting of a component, (C2-2) component, (C2-3) component, and (C2-4) component group.
(C2-1)成份:聚醚聚醯胺及/或聚醚聚酯,(C2-2)成份:非離子系防靜電劑,(C2-3)成份:硼化合物(C2-4)成份:鋰鹽【0010】另外,據本發明之其他最佳實施型態來看,在於提供對於前述(A)成份及(B)成份合計為100質量部而言,含有1~200質量部之至少從以下(D)成份、(E)成份、(F)成份、(G)成份群中所選擇之1種成份的上述第一熱塑性樹脂組成物。(C2-1) Ingredients: Polyether Polyamide and/or Polyether Polyester, (C2-2) Ingredients: Nonionic Antistatic Agent, (C2-3) Ingredients: Boron Compound (C2-4) Ingredients: Lithium salt [0010] In addition, according to another preferred embodiment of the present invention, at least 100 parts by mass of the above-mentioned (A) component and (B) component are provided, and at least 1 to 200 mass parts are provided. The first thermoplastic resin composition of the component selected from the group consisting of (D) component, (E) component, (F) component, and (G) component group.
(D)成份:至少從含有芳香族乙烯化合物為主之嵌段聚合物(d-1)、及以共軛二烯化合物為主之嵌段聚合物(d-2)的嵌段共聚物(D-a)及該氫添加物(D-b)成份群中所選擇的1種成份。(D) Component: at least a block copolymer containing a block polymer (d-1) mainly composed of an aromatic vinyl compound and a block polymer (d-2) mainly composed of a conjugated diene compound ( D-a) and one component selected from the hydrogen additive (D-b) component group.
(E)成份:於存在上述(D)成份之下,(共)聚合芳香族乙烯化合物、或可共聚合芳香族乙烯化合物及芳香族乙烯化合物之其他乙烯單體的接枝聚合物,(F)成份:上述(D)成份所構成之嵌段聚合物(f-1)、及芳香族碳酸酯嵌段聚合物(f-2)所構成之芳香族聚碳酸酯共聚塊,(G)成份:因不飽和酸及/或不飽和酸酐而變性之低分子量聚烯。(E) component: a graft polymer of (co)polymerized aromatic vinyl compound or copolymerizable aromatic vinyl compound and other vinyl monomer of the aromatic vinyl compound in the presence of the above component (D), (F) Component: an aromatic polycarbonate copolymer composed of the block polymer (f-1) composed of the above component (D) and the aromatic carbonate block polymer (f-2), (G) component A low molecular weight polyolefin which is denatured by an unsaturated acid and/or an unsaturated acid anhydride.
上述第一熱塑性樹脂組成物上所言之「至少從上述(D)成份、(E)成份、(F)成份、(G)成份群中所選擇之1種成份」,也可併用「至少從上述(C2-1)成份、(C2-2)成份、(C2-3)成份、(C2-4)成份群中所選擇之1種成份」。The above-mentioned first thermoplastic resin composition may be used in combination with at least "the component selected from the above (D) component, (E) component, (F) component, and (G) component group". The above-mentioned (C2-1) component, (C2-2) component, (C2-3) component, and (C2-4) component selected from the group of ingredients".
【0011】另外,據本發明之其他最佳實施型態來看,上述第一熱塑性樹脂組成物含有前述(A)成份5~95質量%、及(B)成份95~5質量%(但該(A)成份及(B)成份合計為100質量%)。Further, according to another preferred embodiment of the present invention, the first thermoplastic resin composition contains the above-mentioned (A) component in an amount of 5 to 95% by mass, and (B) a component in an amount of 95 to 5% by mass (but this is (A) component and (B) component totaled 100% by mass).
【0012】另外,據本發明之其他立場來看,其特徵在於提供含有以下(B)成份70~97質量%、及(C1)成份30~3質量%(但該(B)成份及(C1)成份合計為100質量%),再者,對於該(B)成份及(C1)成份合計為100質量部而言,以下(C2-2)成份含有0.01~10質量部之熱塑性樹脂組成物(以下稱為「第二熱塑性樹脂組成物」)。[0012] Further, according to another aspect of the present invention, it is characterized in that it contains 70 to 97% by mass of the following (B) component and 30 to 3% by mass of the (C1) component (but the component (B) and (C1) In the case where the total amount of the component (B) and the component (C1) is 100 parts by mass, the following (C2-2) component contains 0.01 to 10 parts by mass of the thermoplastic resin composition ( Hereinafter, it is referred to as "second thermoplastic resin composition").
(B)成份:烯系樹脂,(C1)成份:含烯嵌段聚合物(c1-1)與親水性嵌段聚合物(c1-2)之嵌段共聚物,(C2-2)成份:非離子系防靜電劑。(B) Ingredients: olefinic resin, (C1) component: block copolymer of an olefin-containing block polymer (c1-1) and a hydrophilic block polymer (c1-2), (C2-2) component: Non-ionic antistatic agent.
在上述第二熱塑性樹脂組成物上,對於(B)成份為100質量部而言,也可含有0.001~60質量部之至少從上述(C2-1)成份、(C2-2)成份、(C2-3)成份群中所選擇之1種成份。In the second thermoplastic resin composition, the component (B) may have at least 100 parts by mass, and may contain at least the above (C2-1) component, (C2-2) component, (C2). -3) One component selected from the group of ingredients.
【0013】另外,據本發明之其他立場來看,其特徵在於提供含有以下(B)成份30~96質量%、以下(C1)成份3~90質量%、以下(D)成份1~40質量%(但該(B)成份、(C1)成份及(D)成份合計為100質量%),再者,對於該(B)成份、(C1)成份及(D)成份合計為100質量部而言,含有0.01~10質量部之以下(C2-2)成份之熱塑性樹脂組成物(以下稱為「第三熱塑性樹脂組成物」)。[0013] Further, according to another aspect of the present invention, it is characterized in that it contains 30 to 96% by mass of the following (B) component, 3 to 90% by mass of the following (C1) component, and 1 to 40 mass of the following (D) component. % (however, the (B) component, the (C1) component, and the (D) component are 100% by mass in total), and the (B) component, the (C1) component, and the (D) component are collectively 100 mass parts. In other words, a thermoplastic resin composition (hereinafter referred to as "third thermoplastic resin composition") containing 0.01 to 10 parts by mass of the following (C2-2) component.
(B)成份:烯系樹脂,(C1)成份:含烯嵌段聚合物(c1-1)與親水性嵌段聚合物(c1-2)之嵌段共聚物,(D)成份:至少從含有芳香族乙烯化合物為主之嵌段聚合物(d-1)、及以共軛二烯化合物為主之嵌段聚合物(d-2)的嵌段共聚物(D-a)及該氫添加物(D-b)成份群中所選擇的1種成份。(B) Ingredients: olefinic resin, (C1) component: block copolymer of an olefin-containing block polymer (c1-1) and a hydrophilic block polymer (c1-2), (D) component: at least a block copolymer (D-a) containing an aromatic vinyl compound-based block polymer (d-1) and a block polymer (d-2) mainly composed of a conjugated diene compound, and the hydrogen One of the components selected from the additive (D-b) component group.
(C2-2)成份:非離子系防靜電劑。(C2-2) Ingredients: Nonionic antistatic agent.
在上述第三熱塑性樹脂組成物上,對於(B)成份為100質量部而言,也可含有0.001~60質量部之至少從上述(C2-1)成份、(C2-3)成份、(C2-)成份群中所選擇之1種成份。In the third thermoplastic resin composition, at least 100 parts by mass of the component (B) may be contained in the range of 0.001 to 60 parts by mass from the above (C2-1) component, (C2-3) component, (C2) -) One of the ingredients selected in the group.
上述第二及第三熱塑性樹脂組成物,不僅可各自採用自身以作為成形材料,也可用作製造上述第一熱塑性樹脂組成物時的原料之用。The second and third thermoplastic resin compositions may be used not only as a molding material but also as a raw material for producing the first thermoplastic resin composition.
【0014】而且以本發明之其他立場來看,在於提供由上述第一乃至第三熱塑性樹脂組成物中至少一種所構成之成形品;此成形品也可是薄板或薄膜。Further, in view of the other aspect of the present invention, there is provided a molded article comprising at least one of the above first to third thermoplastic resin compositions; and the molded article may be a sheet or a film.
另外,以本發明之其他立場來看,在於提供由上述第一乃至第三熱塑性樹脂組成物中至少一種所構成之以薄板或薄膜為母材,且至少有一個表面上有積層多層成形品;據最佳實施型態而言,前述母材為烯系樹脂所構成之薄板或薄膜。Further, in another aspect of the present invention, a sheet or a film comprising at least one of the first to third thermoplastic resin compositions is provided as a base material, and at least one surface has a laminated multilayer molded article; According to a preferred embodiment, the base material is a thin plate or film composed of an olefinic resin.
【0015】本發明之熱塑性樹脂組成物,是依照前述(C1)成份之嵌段聚合物的要求,讓含有前述(A)成份之苯乙烯系樹脂及/或前述(B)成份之烯系樹脂的熱塑性樹脂組成物中,含有具備特定防靜電性化合物及/或特定嵌段結構之聚合物、或低分子量聚烯變質物,故可獲得卓越的耐衝擊性、耐藥品性、成形品表面外觀、防靜電性乃至制電性。[0015] The thermoplastic resin composition of the present invention is a styrene resin containing the styrene resin of the above (A) component and/or the component (B) according to the requirements of the block polymer of the above (C1) component. The thermoplastic resin composition contains a polymer having a specific antistatic compound and/or a specific block structure, or a low molecular weight polyene modified product, so that excellent impact resistance, chemical resistance, and surface appearance of the molded article can be obtained. , anti-static properties and even electrical properties.
【0016】以下將詳細說明本發明內容;再者,本明細書上所言之「(共)聚合」是指,單獨聚合及/或共聚之意;「(偏)丙烯」是指丙烯及/或甲基丙烯之意;「(偏)丙烯酸酯」是指,丙烯酸酯及/或甲基丙烯酸酯之意。[0016] The contents of the present invention will be described in detail below. Further, "(co)polymerization" as used in the present specification means the meaning of polymerization and/or copolymerization alone; "(partial) propylene" means propylene and/or Or "methacryl"; "(partial) acrylate" means acrylate and / or methacrylate.
〔1〕(A)成份與本發行相關之苯乙烯系樹脂(A)屬於,在存在或不存在橡膠質聚合物(a)之下,可(共)聚合含芳香族乙烯化合物、或可共聚合芳香族乙烯化合物及芳香族乙烯化合物之其他乙烯單體的乙烯單體(b)之聚合物,從耐衝擊面來看,在存在橡膠質聚合物(a)之下,最好至少含有1種接枝(共)聚合後的聚合物;橡膠質聚合物(a)的含量方面,將苯乙烯系樹脂(A)視為100質量%時,最好是3~80質量%、5~70質量%亦佳、但10~60質量%更佳。[1] (A) The styrene resin (A) related to this issue belongs to, in the presence or absence of the rubbery polymer (a), the (co)polymerizable aromatic vinyl compound may be co-polymerized or The polymer of the ethylene monomer (b) of the polymerized aromatic vinyl compound and the other ethylene monomer of the aromatic vinyl compound is preferably at least 1 in the presence of the rubbery polymer (a) from the viewpoint of the impact resistance. In the case of the content of the rubbery polymer (a), when the styrene resin (A) is regarded as 100% by mass, it is preferably 3 to 80% by mass or 5 to 70. The mass % is also good, but 10 to 60% by mass is better.
【0017】雖未特別限定橡膠質聚合物(a)但可列舉如下,聚丁二烯、苯乙烯丁二烯共聚物、丁腈共聚物、乙烯丙烯共聚物、乙烯丙烯非共軛二烯共聚物、乙烯丁烯-1共聚物、乙烯丁烯-1非共軛二烯共聚物、丙基橡膠、矽膠、矽丙基系IP橡膠等,這些都可單獨使用1種,也可使用2種以上。[0017] The rubbery polymer (a) is not particularly limited, and examples thereof include polybutadiene, styrene butadiene copolymer, nitrile copolymer, ethylene propylene copolymer, and ethylene propylene non-conjugated diene copolymerization. a product, an ethylene-butene-1 copolymer, an ethylene-butene-1 non-conjugated diene copolymer, a propyl rubber, a silicone rubber, a propyl-based IP rubber, etc., which may be used alone or in combination of two or more. the above.
其中以聚丁二烯、苯乙烯丁二烯共聚物、乙烯丙烯共聚物、乙烯丙烯非共軛二烯共聚物、丙基橡膠、矽膠最佳;在此所用之苯乙烯丁二烯共聚物,可用於一般嵌段聚合物以外之共聚物,尤其是以下(D)成份以外的共聚物,也就是無視聚合物。Among them, polybutadiene, styrene butadiene copolymer, ethylene propylene copolymer, ethylene propylene non-conjugated diene copolymer, propyl rubber, silicone rubber; styrene butadiene copolymer used herein, It can be used for copolymers other than general block polymers, especially copolymers other than the following (D) components, that is, ignoring polymers.
【0018】上述以乳化聚合獲得(a)成份時,雖無特別限定上述橡膠質聚合物的凝膠含率,但凝膠含率最好在98質量%以下,但以40~98質量%更佳;此範圍可獲得卓越耐衝擊性之成形體的熱塑性樹脂組成物。When the component (a) is obtained by emulsion polymerization, the gel content of the rubber polymer is not particularly limited, but the gel content is preferably 98% by mass or less, but 40 to 98% by mass. Preferably, this range provides a thermoplastic resin composition of a molded article excellent in impact resistance.
再者,可用以下公式求出上述凝膠含率;換言之,將1g橡膠質聚合物投入100ml甲苯內,在室溫下靜置48小時後,用100網眼的金屬網(將質量視為Wg)過濾後,以80℃真空乾燥不溶於甲苯的部分達6小時後秤重(質量W2 g),再從以下公式(1)中算出。Further, the above gel content can be obtained by the following formula; in other words, 1 g of the rubbery polymer is put into 100 ml of toluene, and after standing at room temperature for 48 hours, a 100 mesh metal mesh is used (quality is regarded as Wg). After filtration, the portion insoluble in toluene was vacuum-dried at 80 ° C for 6 hours, and weighed (mass W 2 g), and then calculated from the following formula (1).
【0019】凝膠含率(質量%)=〔{W2 (g)-W1 (g)}/1(g)〕×100………(1)在製造橡膠質聚合物時,則藉由適當設定分子量調節劑種類、量、聚合時間、聚合溫度、聚合轉化率等,以調整凝膠含率。[0019] Gel content (% by mass) = [{W 2 (g) - W 1 (g)} / 1 (g)] × 100 (1) When manufacturing a rubbery polymer, it is borrowed The gel content is adjusted by appropriately setting the type, amount, polymerization time, polymerization temperature, polymerization conversion ratio, and the like of the molecular weight modifier.
【0020】構成上述乙烯單體(g)的芳香族乙烯化合物則有,苯乙烯-α-甲基苯乙烯、羥基苯乙烯等,這些可單獨使用1種,也可組合2種以上予以使用;此外,其中則以苯乙烯、α-甲基苯乙烯最佳。[0020] The aromatic vinyl compound constituting the ethylene monomer (g) may be styrene-α-methylstyrene or hydroxystyrene, and these may be used alone or in combination of two or more. Further, among them, styrene and α-methylstyrene are preferred.
【0021】芳香族乙烯化合物及可共聚之其他乙烯單體則有,丙烯腈化合物、(偏)丙烯酸酯化合物、馬來酸酐縮亞胺化合物、及其他含有各種官能團不飽和化合物等;最適用的乙烯單體(b),是以芳香族乙烯化合物為必須單體成份,可視其需要將丙烯腈化合物、(偏)丙烯酸酯化合物、馬來酸酐縮亞胺化合物群中所選擇的1種或2種以上併用為單體成份,並可視其需要將至少1種其他含有各種官能團之不飽和化合物併用為單體成份;其他含有各種官能團之不飽和化合物則有,不飽和酸化合物、含環氧基不飽和化合物、含氫氧基不飽和化合物、含噁唑啉不飽和化合物、含酸酐基不飽和化合物、含置換或非置換氨基酸不飽和化合物等;上述其他含有各種官能團不飽和化合物,可單獨使用1種,也可組合2種以上再使用。[0021] The aromatic vinyl compound and other copolymerizable ethylene monomers include an acrylonitrile compound, a (partial) acrylate compound, a maleic anhydride imide compound, and other unsaturated compounds containing various functional groups; The ethylene monomer (b) is an aromatic vinyl compound as an essential monomer component, and one or two selected from the group consisting of an acrylonitrile compound, a (meta) acrylate compound, and a maleic anhydride imide compound group can be used as needed. The above combination is used as a monomer component, and at least one other unsaturated compound containing various functional groups may be used as a monomer component as needed; other unsaturated compounds containing various functional groups include unsaturated acid compounds and epoxy groups. An unsaturated compound, a hydrogen-containing unsaturated compound, an oxazoline-containing unsaturated compound, an acid anhydride-containing unsaturated compound, a substituted or non-substituted amino acid unsaturated compound, or the like; the above other unsaturated compound containing various functional groups, which can be used alone One type may be used in combination of two or more types.
【0022】在此所用之丙烯腈化合物則有丙烯腈、甲基丙烯腈等,這些皆單獨使用1種,也可組合2種以上再使用;使用丙烯腈化合物後,會賦予耐藥品性;使用丙烯腈化合物時,(b)成份的用量最好是1~60質量%,但5~50質量%最佳。[0022] The acrylonitrile compound used herein may be acrylonitrile or methacrylonitrile, and these may be used alone or in combination of two or more. When an acrylonitrile compound is used, chemical resistance is imparted; In the case of the acrylonitrile compound, the amount of the component (b) is preferably from 1 to 60% by mass, but preferably from 5 to 50% by mass.
(偏)丙烯酸酯化合物則有,丙烯酸甲基、丙烯酸乙基、丙烯酸丁基、甲基丙烯酸、乙基丙烯酸、丁基丙烯酸等,這些都可單獨使用1種,也可組合2種以上再使用;使用(偏)丙烯酸酯化合物後,可提升表面硬度;使用(偏)丙烯酸酯化合物時(b)成份的用量最好是1~80質量%,但5~80質量%最佳。The (partial) acrylate compound may be a methyl acrylate, an ethyl acrylate, a butyl acrylate, a methacrylic acid, an ethacrylic acid or a butyl acrylate. These may be used alone or in combination of two or more. When the (partial) acrylate compound is used, the surface hardness can be improved; when the (partial) acrylate compound is used, the amount of the component (b) is preferably from 1 to 80% by mass, but from 5 to 80% by mass.
馬來酸酐縮亞胺化合物則有,馬來酸酐縮亞胺、N-苯基馬來酸酐縮亞胺、N-環己基馬來酸酐縮亞胺等,這些都可單獨使用1種,也可組合2種以上再使用;此外,為了引進馬來酸酐縮亞胺單位,也可和馬來酸酐共聚合後再作成亞胺;使用馬來酸酐縮亞胺後,為賦予耐熱性;使用馬來酸酐縮亞胺化合物後(b)成份的用量最好是1~60質量%,但5~50質量%更佳。The maleic anhydride imide compound may be, for example, maleic anhydride imide, N-phenyl maleic anhydride imide, N-cyclohexyl maleic anhydride imide, etc., which may be used alone or in combination. Two or more types may be used in combination; in addition, in order to introduce a maleic anhydride imide unit, it may be copolymerized with maleic anhydride to form an imine; and after using maleic anhydride, the heat resistance may be imparted; The amount of the component (b) after the acid anhydride imide compound is preferably from 1 to 60% by mass, more preferably from 5 to 50% by mass.
【0023】不飽和酸化合物則有,丙烯酸、甲基丙烯酸、Ethacrylic酸、馬來酸、富馬酸、衣康酸、巴豆酸、桂皮酸等,這些都可單獨使用1種,也可組合2種以上再使用。[0023] Unsaturated acid compounds include acrylic acid, methacrylic acid, Ethacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, cinnamic acid, etc., which may be used alone or in combination 2 More than one species to use.
含環氧基不飽和化合物則有,縮水甘油丙烯酸酯、縮水甘油甲基丙烯酸酯、烯縮水甘油醚等,這些都可單獨使用1種,也可組合2種以上再使用。Examples of the epoxy group-containing unsaturated compound include glycidyl acrylate, glycidyl methacrylate, and ene glycidyl ether. These may be used alone or in combination of two or more.
【0024】含氫氧基不飽和化合物則有,3-羥基-1丙烯、4-羥基-1丁烯、順-4羥基-2丁烯、反-4-羥基-2丁烯、3-羥基-2甲基-1丙烯、2-羥基乙基甲基丙烯酸酯、2-羥基乙基丙烯酸酯、N-(4-羥苯基)馬來酸酐縮亞胺等,這些都可單獨使用1種,也可組合2種以上再使用。[0024] Hydroxy-containing unsaturated compounds are, 3-hydroxy-1 propylene, 4-hydroxy-1 butene, cis-4 hydroxy-2-butene, trans-4-hydroxy-2butene, 3-hydroxyl -2 methyl-1 propylene, 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, N-(4-hydroxyphenyl) maleic anhydride imide, etc., each of which can be used alone It is also possible to combine two or more types and use them.
含噁唑啉不飽和化合物則有乙烯噁唑啉等,這些都可單獨使用1種,也可組合2種以上再使用。The oxazoline-containing unsaturated compound may be an oxazoline or the like, and these may be used alone or in combination of two or more.
含酸酐基不飽和化合物則有,馬來酸酐、衣康酸酐、檸康酸酐等,這些都可單獨使用1種,也可組合2種以上再使用。The acid anhydride-containing unsaturated compound may be used alone or in combination of two or more kinds, and may be used in combination with maleic anhydride, itaconic anhydride, and citraconic anhydride.
含置換或非置換氨基酸不飽和化合物則有,丙烯酸氨基乙基、丙烯丙基氨基乙基、甲基丙烯酸氨基丙基、甲基丙烯酸苯基氨基乙基、N-乙烯二乙基胺、N-乙醯乙烯胺丙烯胺、甲基丙烯酸胺、N-甲基丙烯胺、丙烯胺、N-甲基丙烯醯、p-氨基苯乙烯等,這些都可單獨使用1種,也可組合2種以上再使用。The unsaturated compound containing a substituted or non-substituted amino acid is, aminoethyl acrylate, propylene propylaminoethyl, aminopropyl methacrylate, phenylaminoethyl methacrylate, N-ethylene diethylamine, N- Ethylene vinylamine acrylamide, methacrylic acid amine, N-methyl acrylamide, acrylamine, N-methyl propylene hydride, p-amino styrene, etc., which may be used alone or in combination of two or more. reuse.
使用上述其他含有各種官能團不飽和化合物時,混合苯乙烯系樹脂與其他聚合物時,可以提升兩者的相溶性;用以達成相關效果的最佳單體則是,含環氧基不飽和化合物、含羧基不飽和化合物、含羥基不飽和化合物,其中則以羥基不飽和化合物最佳,但2-羥乙基(偏)丙烯酸酯更佳。When the above other unsaturated compounds containing various functional groups are used, the compatibility of the styrene resin with other polymers can be improved, and the optimum monomer for achieving the relevant effect is an epoxy group-containing unsaturated compound. A carboxyl group-containing unsaturated compound or a hydroxyl group-containing unsaturated compound, wherein a hydroxy unsaturated compound is preferred, but a 2-hydroxyethyl (meta) acrylate is more preferred.
上述其他含有各種官能團不飽和化合物的用量,為苯乙烯系樹脂所用之含有該官能團不飽和化合物的合計量,對於整個苯乙烯系樹脂而言,最好是0.1~20質量%,但0.1~10質量%更佳。The amount of the other functional group-containing unsaturated compound to be used is the total amount of the functional group-unsaturated compound used for the styrene-based resin, and is preferably 0.1 to 20% by mass, but 0.1 to 10%, based on the total amount of the styrene-based resin. The quality % is better.
【0025】乙烯系單體(b)中的芳香族乙烯化合物之外的單體用量,將整個乙烯單體(b)的合計視為100質量%後,最好在80質量%以下,60質量%亦佳,但40質量%更佳;構成乙烯系單體(b)的最佳單體組合則有,苯乙烯/丙烯腈、苯乙烯/甲基丙烯酸甲酯、苯乙烯/丙烯腈/甲基丙烯酸甲酯、苯乙烯/丙烯腈/環氧丙基甲基丙烯酸酯、苯乙烯/丙烯腈/2-羥乙基(偏)丙烯酸酯/丙烯腈/(偏)丙烯酸、苯乙烯/N-酚馬來酸酐縮亞胺、苯乙烯/甲基丙烯酸甲酯/環己烷馬來酸酐縮亞胺等,在存在橡膠質聚合物(a)下所聚合之單體的最佳組合則是,苯乙烯/丙烯腈=65/45~90/10(質量比)、苯乙烯/甲基丙烯酸甲酯=80/20~20/80(質量比)、苯乙烯/丙烯腈/甲基丙烯酸甲酯為苯乙烯量20~80質量%、丙烯腈及甲基丙烯酸甲酯合計為20~80質量%範圍內。The amount of the monomer other than the aromatic vinyl compound in the vinyl monomer (b) is preferably 100% by mass or less, and the total amount of the entire ethylene monomer (b) is 100% by mass or less. % is also good, but 40% by mass is better; the best monomer combination constituting the vinyl monomer (b) is styrene/acrylonitrile, styrene/methyl methacrylate, styrene/acrylonitrile/A Methyl acrylate, styrene/acrylonitrile/epoxypropyl methacrylate, styrene/acrylonitrile/2-hydroxyethyl (meta) acrylate/acrylonitrile/(partial) acrylic acid, styrene/N- The best combination of phenol maleic anhydride imide, styrene/methyl methacrylate/cyclohexane maleic anhydride, and the like, which are polymerized in the presence of the rubbery polymer (a), Styrene/acrylonitrile=65/45~90/10 (mass ratio), styrene/methyl methacrylate=80/20~20/80 (mass ratio), styrene/acrylonitrile/methyl methacrylate The amount of styrene is 20 to 80% by mass, and the total amount of acrylonitrile and methyl methacrylate is in the range of 20 to 80% by mass.
【0026】本發明(A)成份可用既知聚合法,例如乳化聚合、塊狀聚合、溶劑聚合、懸浮聚合及組合這些方法的聚合法予以製作;其中在存在橡膠質聚合物(a)之下,(共)聚合乙烯單體(b)所得之最佳聚合法則是乳化聚合及溶劑聚合;另一方面,在不存在橡膠質聚合物(a)之下,(共)聚合乙烯單體(b)所得之最佳聚合法則是塊狀聚合、溶劑聚合、懸浮聚合及乳化聚合。The component (A) of the present invention can be produced by a polymerization method known in the art, such as emulsion polymerization, bulk polymerization, solvent polymerization, suspension polymerization, and a combination thereof; wherein, in the presence of the rubbery polymer (a), The optimum polymerization method for (co)polymerizing ethylene monomer (b) is emulsion polymerization and solvent polymerization; on the other hand, (co)polymerization of ethylene monomer (b) in the absence of rubbery polymer (a) The optimum polymerization method obtained is a bulk polymerization, a solvent polymerization, a suspension polymerization, and an emulsion polymerization.
【0027】用乳化聚合予以製造時,可用開始聚合劑、聯鎖移動劑、乳化劑等,而且這些都可用既知物。[0027] When it is produced by emulsion polymerization, a starting polymerization agent, an interlocking mobile agent, an emulsifier, or the like can be used, and these can be used.
開始聚合劑則有Cumene hydroperoxide、p-mentan hydroperoxide、diisopropyl benzen hydroperoxide、tetra methyl butyl hydroperoxide、tert-butyl hydroperoxide、過硫酸鉀、偶氮二異丁腈等。The starting polymerization agent includes Cumene hydroperoxide, p-mentan hydroperoxide, diisopropyl benzen hydroperoxide, tetra methyl butyl hydroperoxide, tert-butyl hydroperoxide, potassium persulfate, azobisisobutyronitrile, and the like.
此外,開始聚合劑最好使用各種還原劑、含糖焦磷酸鐵處方、sulfoxret處方等氧化還原系。Further, it is preferred to use a redox system such as a various reducing agent, a sugar-containing pyrophosphate prescription, or a sulfoxret formulation to start the polymerization agent.
聯鎖移動劑則有,正辛硫醇、n-十二烷硫醇、t-十二烷硫醇、n-己硫醇、蔥品油烯等。Interlocking mobile agents include n-octyl mercaptan, n-dodecyl mercaptan, t-dodecyl mercaptan, n-hexyl mercaptan, and onion olefin.
乳化劑則可用十二烷基苯磺酸鈉等烷基苯磺酸鹽、月桂基硫酸鈉等脂肪族磺酸鹽、月桂酸鉀、丁氧基酸鉀、油酸鉀、棕櫚酸鉀等高級脂肪酸鹽、玫瑰酸鉀等玫瑰酸等。As the emulsifier, an alkylbenzenesulfonate such as sodium dodecylbenzenesulfonate or an aliphatic sulfonate such as sodium lauryl sulfate, potassium laurate, potassium butyrate, potassium oleate or potassium palmitate may be used. A fatty acid salt, rose acid such as potassium oleate, and the like.
【0028】再者,乳化聚合上的橡膠質聚合物(a)及乙烯系單體(b)的用法,在存在全量橡膠質聚合物(a)下,一次添加乙烯單體(b)後再聚合,或者也可分割或連續添加再聚合;另外,也可在聚合途中添加部分橡膠質聚合物(a)。[0028] Further, the use of the rubbery polymer (a) and the vinyl monomer (b) in the emulsion polymerization is carried out in the presence of the entire amount of the rubbery polymer (a), and then the ethylene monomer (b) is added at a time. The polymerization may be carried out, or the repolymerization may be carried out separately or continuously; in addition, a part of the rubbery polymer (a) may be added during the polymerization.
【0029】乳化聚合後所得之乳膠,都是透過凝固劑予以凝固,再經過水洗、乾燥以獲得本發明(A1)成份粉末;此時,也可適當混合乳化聚合所得之2種以上(A1)成份乳膠後再凝固。在此所用的凝固劑可用氯化鈣、硫酸鎂、氯化鎂等無機鹽、或硫酸、鹽酸、醋酸、檸檬酸、蘋果酸等。[0029] The latex obtained by the emulsion polymerization is solidified by a coagulant, washed with water, and dried to obtain the powder of the component (A1) of the present invention. In this case, two or more kinds of emulsion polymerization may be appropriately mixed (A1). The ingredients are then solidified after the latex. The coagulant used herein may be an inorganic salt such as calcium chloride, magnesium sulfate or magnesium chloride, or sulfuric acid, hydrochloric acid, acetic acid, citric acid, malic acid or the like.
【0030】藉由溶劑聚合製造(A)成份時可用之溶劑則是,一般自由基聚合所用之不活性聚合溶劑,例如乙苯、甲苯等芳香族碳化氫、丁酮、丙酮等酮類、乙腈、二甲基甲醯、N-甲基吡咯烷酮等。[0030] The solvent usable in the production of the component (A) by solvent polymerization is an inactive polymerization solvent generally used for radical polymerization, such as aromatic hydrocarbons such as ethylbenzene or toluene, ketones such as methyl ethyl ketone and acetone, and acetonitrile. , dimethylformamidine, N-methylpyrrolidone, and the like.
最佳的聚合溫度範圍是80~140℃,但85~120℃更佳。聚合時可使用開始聚合劑,不使用開始聚合劑者,也可使用熱聚合予以聚合;最佳的開始聚合劑可使用過氧化酮、過氧化二烷基、dizsil過氧化物、過氧化酯、氫過氧化物、偶氮二異丁腈、苯醯過氧化物等有機過氧化物等。The optimum polymerization temperature range is 80 to 140 ° C, but 85 to 120 ° C is better. The polymerization initiator may be used in the polymerization, and the polymerization may be carried out without using a starting polymerization agent. Thermal polymerization may also be used for the polymerization; the most preferred starting polymerization agent may be a ketone peroxide, a dialkyl peroxide, a dizsil peroxide, a peroxyester, An organic peroxide such as hydroperoxide, azobisisobutyronitrile or benzoquinone peroxide.
此外,使用聯鎖移動劑時,也可使用例如硫醇類、蔥品油烯、α-甲基苯乙烯二聚物等。Further, when an interlocking mobile agent is used, for example, a mercaptan, an onion olefin, an α-methylstyrene dimer or the like can be used.
用塊狀聚合、懸浮聚合予以製造時,可在溶劑聚合上使用前述之開始聚合劑、聯鎖移動劑等。When it is produced by bulk polymerization or suspension polymerization, the above-mentioned starting polymerization agent, interlocking mobile agent, etc. can be used for solvent polymerization.
殘留於藉由上述各聚合法所得之(A)成份中的單體量最好是10,000ppm以下,但5,000ppm以下更佳。The amount of the monomer remaining in the component (A) obtained by the above respective polymerization methods is preferably 10,000 ppm or less, more preferably 5,000 ppm or less.
【0031】另外,在存在橡膠質聚合體(a)下,聚合乙烯單體(b)所得之聚合物成份包含了,上述乙烯單體(b)在橡膠質聚合體(a)下接枝共聚合後的共聚物、及在橡膠質聚合物中未接枝的為接枝成份〔上述乙烯單體(b)的共聚物〕。Further, in the presence of the rubbery polymer (a), the polymer component obtained by polymerizing the ethylene monomer (b) comprises the grafting of the above ethylene monomer (b) under the rubbery polymer (a). The copolymer after polymerization and the grafting component (copolymer of the above ethylene monomer (b)) which is not grafted in the rubbery polymer.
上述(A)成份的接枝率最好是20~200質量%、30~150質量%亦佳,但40~120質量%更佳,可從以下公式(2)中求出接枝率。The graft ratio of the component (A) is preferably from 20 to 200% by mass, preferably from 30 to 150% by mass, more preferably from 40 to 120% by mass, and the graft ratio can be determined from the following formula (2).
【0032】接枝率(質量%)={(T-S)/S}×100………(2)上述公式(2)中的T是將1g(A)成份投入於20ml丙酮(但橡膠質聚合物(a)則用丙烯系橡膠時則為乙腈),用振動機振動2小時後,則用離心分離機(旋轉數:23,000rpm)離心分離60分鐘,分離出不溶解與可溶解部分後所得之不溶解部分的質量(g);S是含於1g(A)成份中的橡膠質聚合物的質量(g)。[0032] Graft ratio (% by mass) = {(T - S) / S} × 100 (2) T in the above formula (2) is to put 1 g of the component (A) into 20 ml of acetone (but rubber) When the polymer (a) was made of acryl-based rubber, it was acetonitrile), and after vibrating for 2 hours with a vibrating machine, it was centrifuged for 60 minutes using a centrifugal separator (rotation number: 23,000 rpm) to separate insoluble and soluble fractions. The mass (g) of the insoluble portion obtained afterwards; S is the mass (g) of the rubbery polymer contained in 1 g of the component (A).
【0033】此外,本發明之相關(A)成份丙酮(但橡膠質聚合物(a)則用丙烯系橡膠時則為乙腈)之可溶解部分的極限黏度「η」(使用甲基乙基甲酮以做為溶劑後,在30℃環境下作測量),最佳是0.2~1.2dl/g、0.2~1.0dl/g亦佳、但0.3~0.8dl/g更佳。In addition, the ultimate viscosity "η" of the soluble portion of the (A) component of the present invention (but the rubbery polymer (a) is acetonitrile in the case of a propylene-based rubber) (using methyl ethyl ketone) The ketone is used as a solvent and measured at 30 ° C), preferably 0.2 to 1.2 dl / g, preferably 0.2 to 1.0 dl / g, but more preferably 0.3 to 0.8 dl / g.
分散於本發明(A)成份中的接枝化橡膠質聚合物粒子的平均粒徑最好是500~30,000A、1,000~20,000A亦佳,但1,500~8,000A範圍更佳;可用電子顯微鏡的既知方法測量平均粒徑。The average particle diameter of the grafted rubber polymer particles dispersed in the component (A) of the present invention is preferably 500 to 30,000 A, preferably 1,000 to 20,000 A, but more preferably in the range of 1,500 to 8,000 A; The method is known to measure the average particle size.
【0034】構成本發明之第一熱塑性樹脂組成物的(A)成份用量,在本發明之(A)成份與(B)成份的合計100質量中為5~100質量%、5~98質量%與10~98質量%亦佳,但15~95質量%最佳;接下來更佳的是15~93質量%、特佳則是15~90質量%,未滿5質量%者則有耐衝擊性不佳、防靜電性下滑的傾向。The amount of the component (A) constituting the first thermoplastic resin composition of the present invention is 5 to 100% by mass and 5 to 98% by mass based on 100% by mass of the total of the components (A) and (B) of the present invention. It is also better with 10 to 98% by mass, but 15 to 95% by mass is the best; the next is preferably 15 to 93% by mass, and particularly preferably 15 to 90% by mass. If it is less than 5% by mass, it is impact resistant. Poor, antistatic tendency to decline.
【0035】[2](B)成份本發明之相關烯系樹脂(B),是將2~10碳數的烯類中至少1種視為構成單體單位之聚合物;此烯系樹脂最好是藉由X光衍射而以室溫表示結晶度,但20%以上結晶度更佳,而具有40℃以上的融點;此外,此烯系樹脂在常溫下需要得以作為成形用樹脂的充分分子量。[2] (B) Component The related olefinic resin (B) of the present invention is a polymer in which at least one of 2 to 10 carbon atoms is regarded as a monomer unit; the olefinic resin is the most It is preferable that the crystallinity is expressed by room temperature by X-ray diffraction, but the crystallinity of 20% or more is more preferable, and the melting point of 40 ° C or more is obtained. Further, the olefinic resin needs to be sufficient as a molding resin at normal temperature. Molecular weight.
舉例來說,以丙烯為主成份時,依據JIS K-6758所測量的熔融指數(melt flow rate)最好是0.01~500g/10分鐘,但相當於0.05~100g/10分鐘分子量更佳。For example, when propylene is used as a main component, the melt flow rate measured according to JIS K-6758 is preferably 0.01 to 500 g/10 min, but is equivalent to a molecular weight of 0.05 to 100 g/10 min.
【0036】上述烯系樹脂構成單體的烯類例則有,乙烯、丙烯、丁烯-1、戊烯-1、己烯-1、3-甲基丁烯-1、4-甲基戊烯-1、3-甲基己烯-1等α-烯,最好是乙烯、丙烯、丁烯-1、3-甲基丁烯-1、4-甲基戊烯-1;此外,其他還可將4-甲基-1、4-己二烯、5-甲基-1、4-己二烯、7-甲基-1、6-辛二烯、1-9-decadiene等非共軛二烯,視為部分聚合物成份予以使用。[0036] Examples of the olefin of the above olefin-based resin constituting monomer include ethylene, propylene, butene-1, pentene-1, hexene-1, 3-methylbutene-1, and 4-methylpentene. -1, a-olefin such as 3-methylhexene-1, preferably ethylene, propylene, butene-1, 3-methylbutene-1, 4-methylpentene-1; Non-conjugated 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 7-methyl-1,6-octadiene, 1-9-decadiene, etc. Diene is considered to be used as part of the polymer component.
本發明所用之烯系樹脂(B)中至少有一部份將聚合觸媒進行除觸媒,此外也可用環氧基、氨基、置換氨基、羧基、酸酐基、噁唑啉基、氫氧基等所變質之物質。At least a part of the olefinic resin (B) used in the present invention is a catalyst for removing a polymerization catalyst, and an epoxy group, an amino group, a substituted amino group, a carboxyl group, an acid anhydride group, an oxazoline group, a hydroxyl group or the like may also be used. Deteriorated substance.
【0037】構成本發明之第一熱塑性樹脂組成物的(B)成份用量,在本發明之(A)成份與(B)成份的合計100質量中為0~95質量%、2~95質量%與5~90質量%亦佳,但7~90質量%最佳;10~85質量%特佳,超過95質量%後耐衝擊性便會不佳、且防靜電性也出現下滑傾向。The amount of the component (B) constituting the first thermoplastic resin composition of the present invention is 0 to 95% by mass and 2 to 95% by mass based on 100% by mass of the total of the components (A) and (B) of the present invention. It is preferably 5 to 90% by mass, but 7 to 90% by mass is the best; 10 to 85% by mass is particularly good, and when it exceeds 95% by mass, the impact resistance is poor and the antistatic property tends to decline.
構成本發明之第二熱塑性樹脂組成物的(B)成份用量,在前述(B)成份與以下(C1)成份的合計100質量中為70~97質量%、75~96質量亦佳,但77~96質量%最佳;該用量方面,未滿70質量%時,耐藥品性會不佳,但超過97質量%後制電性及成形品表面外觀則不佳。The amount of the component (B) constituting the second thermoplastic resin composition of the present invention is 70 to 97% by mass, preferably 75 to 96% by mass in the total mass of the component (B) and the following (C1) component, but 77 is preferable. ~96 mass% is the best; in terms of the amount, when the amount is less than 70% by mass, the chemical resistance is not good, but when it exceeds 97% by mass, the electric properties and the surface appearance of the molded article are not good.
構成本發明之第三熱塑性樹脂組成物的(B)成份用量,在前述(B)成份與以下(C1)成份及(D)成份的合計100質量中為30~96質量%、35~91質量%與42~91質量%亦佳,但42~85質量%最佳;未滿30質量%時,耐藥品性會不佳,但超過96質量%後制電性及成形品表面外觀則不佳。The amount of the component (B) constituting the third thermoplastic resin composition of the present invention is 30 to 96% by mass, 35 to 91% by mass in the total of 100 masses of the above (B) component and the following (C1) component and (D) component. % and 42 to 91% by mass are also good, but 42 to 85% by mass is the best; when less than 30% by mass, the chemical resistance is not good, but after more than 96% by mass, the electrical properties and the surface appearance of the molded article are not good. .
【0038】本發明(C1)成份屬於含有烯嵌段聚合物(c1-1)與親水性嵌段聚合物(c1-2)之嵌段共聚物,並以兩嵌段具有重複交替結合構造的嵌段聚合物最佳;該嵌段聚合物可以是二嵌段,也可是三嵌段以上之多重嵌段;上述烯嵌段聚合物(c1-1)為前述烯類(共)聚合物;藉由該烯嵌段聚合物(c1-1)的凝膠滲透色譜(GPC)以換算聚苯乙烯的數平均分子量最好是800~20,000,1,000~10,000亦佳,1,200~6,000更佳。[0038] The component (C1) of the present invention belongs to a block copolymer comprising an olefin block polymer (c1-1) and a hydrophilic block polymer (c1-2), and has a repeating alternate bond structure in two blocks. The block polymer is optimal; the block polymer may be a diblock or a multiple block of a triblock or more; the above alkyl block polymer (c1-1) is the aforementioned alkene (co)polymer; The number average molecular weight of the polystyrene by gel permeation chromatography (GPC) of the olefin block polymer (c1-1) is preferably 800 to 20,000, preferably 1,000 to 10,000, more preferably 1,200 to 6,000.
【0039】上述嵌段(c1-1)會與上述嵌段(c1-2)作化學性的結合,但該結合屬於至少從酯結合、醯結合、醚結合、尿烷結合、亞氨基結合等中選擇一種的結合,透過這些結合而有重複交替結合的結構。[0039] The above block (c1-1) is chemically bonded to the above block (c1-2), but the bond belongs to at least ester bonding, hydrazine bonding, ether bonding, urethane bonding, imino bonding, and the like. One of the combinations is selected, and through these combinations there is a structure in which the alternating combination is repeated.
為此,上述嵌段(c1-1)分子兩末端,必須以會與上述嵌段(c1-2)的分子兩末端官能團作反應的官能團予以變質;這些官能團則有,羧基、氫氧基、氨基、酸酐基、噁唑啉基、環氧基等。For this reason, both ends of the above-mentioned block (c1-1) molecule must be deteriorated by a functional group which reacts with the terminal functional groups of the above-mentioned block (c1-2); these functional groups include a carboxyl group, a hydroxyl group, An amino group, an acid anhydride group, an oxazoline group, an epoxy group or the like.
賦予這些官能團的最佳方法就是,在透過熱減法所得之分子末端上,附加具有碳-碳雙重結合的(c1-1)成份、及具有上述官能團之碳-碳不飽和化合物方法。The best method for imparting these functional groups is to add a (c1-1) component having a carbon-carbon double bond and a carbon-carbon unsaturated compound having the above functional group at the end of the molecule obtained by the thermal subtraction method.
【0040】上述嵌段(c1-2)的親水性聚合物則有,聚醚(c1-2-a)、含聚醚之親水性聚合物(c1-2-b)及陰離子性聚合物(c1-2-c)。[0040] The hydrophilic polymer of the above block (c1-2) includes a polyether (c1-2-a), a polyether-containing hydrophilic polymer (c1-2-b), and an anionic polymer ( C1-2-c).
聚醚(c1-2-a)則有聚醚二醇、聚醚二胺及這些變性物。含聚醚之親水性聚合物(c1-2-b)則有,具有聚醚二醇段節的聚醚酯醯、具有聚醚二醇段節的聚醚醯亞氨基、具有聚醚二醇段節的聚醚酯、具有聚醚二醇段節的聚醚醯、及具有聚醚二醇或聚醚胺段節的聚醚尿烷。The polyether (c1-2-a) is a polyether diol, a polyether diamine and these denatured substances. The polyether-containing hydrophilic polymer (c1-2-b) has a polyether ester oxime having a polyether diol segment, a polyether fluorenylene having a polyether diol segment, and a polyether diol. A polyether ester of a segment, a polyether oxime having a polyether diol segment, and a polyether urethane having a polyether diol or a polyether amine segment.
陰離子性聚合物(c1-2-c)則有,具有磺醯基的二羧酸、及以聚醚(c1-2-a)為必須構成單位,且在一分子內最好有2~80個、但以3~60個磺醯基更佳的陰離子性聚合物。The anionic polymer (c1-2-c) has a dicarboxylic acid having a sulfonyl group and a polyether (c1-2-a) as an essential unit, and preferably has 2 to 80 in one molecule. More preferably an anionic polymer of 3 to 60 sulfonyl groups.
這些可以是直鎖狀,也可是分歧狀。These can be straight locks or divergent.
特佳的嵌段(c1-2)為聚酯(c1-2-a)。A particularly preferred block (c1-2) is a polyester (c1-2-a).
【0041】聚醚(c1-2-a)中的聚醚二醇是以一般化學式(I):H-(OA1 )n-O-E1 -O(A1 O)n ’ -H予以表示、及以一般化學式(II):H-(OA2 )m-O-E2 -O(A2 O)m ’ -H予以表示。[0041] The polyether diol in the polyether (c1-2-a) is given by the general chemical formula (I): H-(OA 1 )n-O-E 1 -O(A 1 O) n ' -H It is represented by the general chemical formula (II): H-(OA 2 )m-O-E 2 -O(A 2 O) m ' -H.
一般化學式(I)中的E1 是從含二價氫氧基化合物中扣除氫氧基後的殘基,A1 表示碳數2~4的亞烷基,n及n’是每一個前述二價含二價氫氧基化合物氫氧基的環氧化物附加數;n個(OA1 )與n’個(A1 O)可以相同也可不同;此外,這些由2種以上羥基亞烷基所構成時的結合形式,也可是嵌段或無視或組合物;n及n’通常是1~300,最佳是2~250,10~100特佳;此外,n及n,可以相同也可不同。In the general formula (I), E 1 is a residue obtained by subtracting a hydroxyl group from a divalent hydroxyl group-containing compound, A 1 represents an alkylene group having 2 to 4 carbon atoms, and n and n' are each of the foregoing two An additional number of epoxides containing a hydroxyl group of a divalent hydroxy compound; n (OA 1 ) and n' (A 1 O) may be the same or different; further, these may be composed of two or more hydroxyalkylene groups. The combination form at the time of constitution may also be a block or a disregard or a composition; n and n' are usually 1 to 300, preferably 2 to 250, and 10 to 100 is particularly preferable; and n and n may be the same. different.
【0042】上述含二價氫氧基化合物就是,一分子中有2個酒精性或苯酚性氫氧基,換言之就是二羥基,具體而言就是二價酒精(例如:碳數2~12脂肪族、脂環式或芳香族二價酒精)、碳數6~18的二價苯酚、含第3級氨基二醇等。[0042] The above divalent hydroxyl-containing compound is such that there are two alcoholic or phenolic hydroxyl groups in one molecule, in other words, a dihydroxy group, specifically a divalent alcohol (for example, a carbon number of 2 to 12 aliphatic groups). , alicyclic or aromatic divalent alcohol), divalent phenol having 6 to 18 carbon atoms, and amino acid diol having a third order.
脂肪族二價酒精則有,例如乙二醇、丙二醇等亞烷基二醇、1, 4-丁二醇、1, 6-己二醇、新戊二醇、1, 12-十二烷二醇等。Aliphatic divalent alcohols include, for example, alkylene glycols such as ethylene glycol and propylene glycol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,12-dodecane Alcohol, etc.
脂環式二價酒精則有,例如1, 2及1, 3-環戊烷、1, 2、1, 3-及1, 4-環己烷二醇、1, 4-環己烷二甲醇等;芳香族二價酒精則有,例如二甲苯二醇等。The alicyclic divalent alcohols are, for example, 1, 2 and 1, 3-cyclopentane, 1, 2, 1, 3- and 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol. Etc.; aromatic divalent alcohols, such as xylene glycol.
二價苯酚則有,對苯二酚、鄰苯二酚、間苯二酚、Uruciol等單環二價苯酚、雙酚A、雙酚F、雙酚S、4, 4’二羥基二苯基-2, 2-丁烷、二羥基聯苯、二羥基二苯基醚等雙酚、及二羥基萘、聯二苯等縮合多環二價苯酚等。Divalent phenols include hydroquinone, catechol, resorcinol, Uruciol, monocyclic divalent phenol, bisphenol A, bisphenol F, bisphenol S, 4, 4' dihydroxydiphenyl -2, bisphenol such as 2-butane, dihydroxybiphenyl or dihydroxydiphenyl ether; and condensed polycyclic divalent phenol such as dihydroxynaphthalene or biphenyl.
【0043】一般化學式(II)中的E2 表示從一般化學式(I)所記載之二價氫氧基化合物中扣除氫氧基後的殘基,A2 為至少為一部份,是以一般化學式(III):-CHR-CHR’-〔式中,R、R’,一般化學式(IV):是以-CH2 O(A3 O)x R”作表示的基,其他則為H;在一般化學式(IV)中,x表示1~10整數、R”表示H或碳數1~10的烷基、芳基、烷芳基、芳烷基或醯基,A3 表示碳數2~4的亞烷基〕所表示之置換亞烷基,剩餘也可以是碳數2~4亞烷基;m個(OA2 )與m’個(A2 O)可以相同也可不同;m與m,最好是1~300,2~250亦佳,但10~100更佳;此外,m與m’可以相同也可不同。[0043] E 2 in the general chemical formula (II) represents a residue obtained by subtracting a hydroxyl group from the divalent hydroxyl compound described in the general chemical formula (I), and A 2 is at least a part, in general Chemical formula (III): -CHR-CHR'- [wherein R, R', general formula (IV): a group represented by -CH 2 O(A 3 O) x R", and the others are H; In the general chemical formula (IV), x represents an integer of 1 to 10, R" represents H or an alkyl group, an aryl group, an alkylaryl group, an arylalkyl group or a fluorenyl group having 1 to 10 carbon atoms, and A 3 represents a carbon number of 2~. The substituted alkylene group represented by the alkylene group of 4 may be a carbon number of 2 to 4 alkylene groups; m (OA 2 ) and m' (A 2 O) may be the same or different; m and m, preferably 1~300, 2~250 is better, but 10~100 is better; in addition, m and m' can be the same or different.
【0044】可在含二價氫氧基化合物中附加環氧化物以作反應後,即可製造上述一般化學式(I)所示之聚醚二醇;環氧化物則有碳數2~4環氧化物,可使用例如環氧乙烷、環氧丙烷、1, 2環氧丁烷、1, 4-環氧丁烷、2, 3-環氧丁烷、及1, 3-環氧丁烷及併用2種以上的環氧化物;併用2種以上環氧化物時的結合形式,可以是無規及/或嵌段;最佳的環氧化物則是單獨的環氧乙烷、及環氧乙烷併用其他環氧化物之附加嵌段及/或無規;每一個前述含二價氫氧基化合物氫氧基的環氧化物附加數,最好是1~300,2~250亦佳,10~100更佳。[0044] The polyether diol represented by the above general formula (I) can be produced by adding an epoxide to the divalent hydroxy group-containing compound, and the epoxide has a carbon number of 2 to 4 rings. As the oxide, for example, ethylene oxide, propylene oxide, 1,2-butylene oxide, 1,4-butylene oxide, 2,3-butylene oxide, and 1, 3-butylene oxide can be used. And two or more kinds of epoxides are used in combination; and the combination form of two or more kinds of epoxides may be random and/or block; the best epoxide is ethylene oxide alone and epoxy The ethane is further combined with other epoxides and/or random; each of the foregoing epoxides containing a divalent hydroxy compound having a hydroxyl group is preferably 1 to 300, preferably 2 to 250. 10~100 is better.
【0045】上述一般化學式(II)所示之聚醚二醇的最佳製法,則有以下(a)(b)等方法。[0045] The preferred method for producing the polyether diol represented by the above general chemical formula (II) is as follows (a), (b) and the like.
【0046】(a)以前述含二價氫氧基化合物為出發物質的一般化學式(V):
聚合〔一般化學式(V)中的A4 表示碳數2~4的亞烷基,p為1~10的整數,R1 為H或碳數1~10的烷基、芳基、烷芳基、芳烷基或醯基〕所示之縮水甘油醚,或共聚碳數2~4的環氧化物。Polymerization [A 4 in the general chemical formula (V) represents an alkylene group having 2 to 4 carbon atoms, p is an integer of 1 to 10, and R 1 is H, an alkyl group having 1 to 10 carbon atoms, an aryl group or an alkylaryl group. A glycidyl ether represented by an aralkyl group or a fluorenyl group, or an epoxide having a carbon number of 2 to 4.
【0047】(b)以前述含二價氫氧基化合物為出發物質,在側鎖上具有氯甲基而經由聚醚的方法;具體而言就是附加共聚環氧氯丙烷、環氧氯丙烷與環氧化物,在側鎖上具有氯甲基而獲得聚醚後,在存在鹼的情況下反應該聚醚與碳數2~4聚環氧乙醇酸與R1 X(R1 為上述物質,X為Cl、Br或I)、或在存在鹼的情況下反應該聚醚與碳數2~4聚環氧乙醇酸一元醚。[0047] (b) a method of using a divalent hydroxy group-containing compound as a starting material and having a chloromethyl group on a side lock via a polyether; specifically, an additional copolymerization of epichlorohydrin, epichlorohydrin and An epoxide having a chloromethyl group on a side lock to obtain a polyether, and reacting the polyether with a carbon number of 2 to 4 polyepoxyglycolic acid and R 1 X in the presence of a base (R 1 is the above substance, X is Cl, Br or I), or the polyether is reacted with a carbon number of 2 to 4 polyepoxyglycolic acid monoether in the presence of a base.
【0048】在此所用的碳數2~4環氧化物,可用前述之所有物質。[0048] As the carbon number 2 to 4 epoxide used herein, all of the foregoing may be used.
本發明之(C1)成份,可用既知方法聚合上述烯嵌段聚合物(c1-1)與親水性嵌段聚合物(c1-2);例如以200~250℃減壓嵌段(c1-1)與嵌段(c1-2),以進行聚合反應後即可製造;另外,聚合反應時可使用既知之聚合觸媒。The (C1) component of the present invention can be polymerized by the known method to polymerize the above-mentioned ethylenic block polymer (c1-1) and the hydrophilic block polymer (c1-2); for example, a pressure-decomposing block at 200 to 250 ° C (c1-1) And the block (c1-2) can be produced by performing a polymerization reaction; in addition, a known polymerization catalyst can be used for the polymerization reaction.
【0049】聚合反應時雖可使用既知之聚合觸媒,但最好是從一元丁基錫氧化物等錫系觸媒、三氧化銻、二氧化銻等銻系觸媒、四丁基鈦酸酯等鈦系觸媒、鋯氫氧化物、氧化鋯、醋酸鋯等鋯系觸媒、IIB族有機酸鹽觸媒中選擇1種或2種以上的組合。[0049] Although a known polymerization catalyst can be used in the polymerization reaction, it is preferably a tin-based catalyst such as a monovalent butyl tin oxide, a ruthenium-based catalyst such as antimony trioxide or ruthenium dioxide, or tetrabutyl titanate. One type or a combination of two or more types selected from the group consisting of a zirconium catalyst such as a titanium catalyst, a zirconium hydroxide, a zirconium oxide, and a zirconium acetate, and a Group IIB organic acid salt catalyst.
【0050】本發明之目的在於,更佳提升防靜電性或制電性,因此(C1)成份中得以含有從鹼性金屬及鹼土類金屬群中所選擇之至少一種鹽(H);這些成份在聚合(C1)成份前,也可含於聚合(C1)成份時,更可含於聚合(C1)成份後;此外,製造本發明之樹脂組成物時的配方,也可包含組合這些的方法。[0050] The object of the present invention is to improve the antistatic property or the electrical conductivity, so that the (C1) component contains at least one salt (H) selected from the group consisting of alkaline metals and alkaline earth metal groups; Before the polymerization (C1) component, it may be contained in the polymerization (C1) component, and may be further contained in the polymerization (C1) component; in addition, the formulation in the production of the resin composition of the present invention may also include a combination of these methods. .
(H)成份鹽則有,鋰、鈉、鉀等鹼金屬及/或鎂、鈣等鹼土類金屬的有機酸、磺酸、無機酸鹽及鹵化物等。(H) Ingredient salts include organic acids such as lithium, sodium, potassium, and the like, and organic acids, sulfonic acids, inorganic acid salts, and halides of alkaline earth metals such as magnesium and calcium.
【0051】具體的最佳(H)成份例為,氯化鋰、氯化鈉、氯化鉀、溴化鋰、溴化鈉、溴化鉀等鹼金屬鹵化物;高氯化鋰、高氯化鈉、高氯化鉀等鹼金屬無機酸鹽;醋酸鉀、硬脂酸鋰等鹼金屬有機酸鹽、辛基磺酸、月桂基磺酸、十四烷基磺酸、硬脂醯磺酸二十四烷酸磺酸、2-乙基己基磺酸等烷基碳數為8~24烷基磺酸的鹼金屬鹽;苯基磺酸、萘基磺酸等芳香族磺酸鹼金屬鹽;辛基苯基磺酸、月桂基苯基磺酸、二丁基苯基磺酸、二壬基苯基磺酸等烷基碳數為6~18烷基苯磺酸鹼金屬鹽;二甲基萘基磺酸、二異丙基萘基磺酸、二丁基萘基磺酸等烷基碳數為2~18烷基萘基磺酸的鹼金屬鹽;三氟甲烷磺酸等氟化磺酸等鹼金屬鹽,這些都可單獨使用1種,或併用2種以上;上述(H)成份對本發明之(C1)成份最好是0.001~10質量%,0.01~5質量%與0.01~3質量%亦佳,但0.01~2質量%更佳。[0051] Specific preferred (H) components are, for example, lithium chloride, sodium chloride, potassium chloride, lithium bromide, sodium bromide, potassium bromide and other alkali metal halides; high lithium chloride, high sodium chloride Alkali metal mineral acid salt such as potassium chloride; alkali metal organic acid salt such as potassium acetate or lithium stearate; octyl sulfonic acid, lauryl sulfonic acid, tetradecyl sulfonic acid and stearic acid sulfonic acid An alkali metal salt of an alkyl group having 8 to 24 alkyl sulfonic acids such as tetraalkyl sulfonic acid or 2-ethylhexyl sulfonic acid; an alkali metal salt of an aromatic sulfonic acid such as phenyl sulfonic acid or naphthyl sulfonic acid; The alkyl carbon number of the alkylphenylsulfonic acid, lauryl benzene sulfonic acid, dibutyl phenyl sulfonic acid, dinonyl phenyl sulfonic acid, etc. is an alkali metal salt of 6-18 alkylbenzenesulfonate; dimethyl naphthalene An alkali metal salt having an alkyl carbon number of 2 to 18 alkylnaphthylsulfonic acid such as a sulfonic acid, a diisopropylnaphthylsulfonic acid or a dibutylnaphthylsulfonic acid; a fluorinated sulfonic acid such as trifluoromethanesulfonic acid The alkali metal salt may be used alone or in combination of two or more. The above (H) component is preferably 0.001 to 10% by mass, 0.01 to 5% by mass and 0.01 to 3 by mass of the (C1) component of the present invention. % is also good, but 0.01 to 2% by mass is better.
【0052】本發明(C1)成份的最佳嵌段(c1-1)/嵌段(c1-2)的比率(質量比)是10~90/10~90範圍,20~80/20~80亦佳,但30~70/30~70更佳。[0052] The ratio (mass ratio) of the optimum block (c1-1)/block (c1-2) of the component (C1) of the present invention is in the range of 10 to 90/10 to 90, and 20 to 80/20 to 80. Also good, but 30~70/30~70 is better.
可用例如特開2001-278985號公報、特開2003-48990號公報上所記載的方法以製造這種嵌段聚合物(C1),再者本發明之(C)成份也可取得三洋化成工業社製Perestart 300系列的300、303、230(商品名稱)等。The block polymer (C1) can be produced by the method described in JP-A-2001-278985, JP-A-2003-48990, and the component (C) of the present invention can also be obtained from Sanyo Chemical Industry Co., Ltd. 300, 303, 230 (trade name) of the Perestart 300 series.
【0053】構成本發明之第一熱塑性樹脂組成物的(C1)成份用量,在本發明之(A)成份與(B)成份的合計100質量中為0.5~100質量部、最佳是0.5~80質量部,1~60質量部亦佳,但2~50質量部最佳;該用量未滿0.5質量部時,便無法獲得防靜電效果,且不具充分的耐藥品效果,而且耐衝擊性也不佳;但超過100質量部時耐衝擊性也會不佳。The amount of the (C1) component constituting the first thermoplastic resin composition of the present invention is 0.5 to 100 parts by mass, preferably 0.50, in the total mass of the component (A) and the component (B) of the present invention. 80 mass parts, 1~60 mass parts are also good, but 2~50 mass parts are the best; when the dosage is less than 0.5 mass parts, anti-static effect can not be obtained, and it is not fully resistant to chemicals, and impact resistance is also Not good; but when it exceeds 100 parts, the impact resistance will be poor.
構成本發明之第二熱塑性樹脂組成物的(C1)成份用量,在前述(B)成份與以下(C1)成份的合計100質量中為3~30質量%、4~25質量%與4~23質量%亦佳,但5~23質量%最佳;該用量方面,未滿3質量%時制電性會不佳,但超過30質量%後耐藥品性及成形品表面外觀則不佳。The amount of the component (C1) constituting the second thermoplastic resin composition of the present invention is 3 to 30% by mass, 4 to 25% by mass, and 4 to 23 in the total mass of the component (B) and the following (C1) component. The mass % is also good, but 5 to 23% by mass is the best; in terms of the amount, the electrical conductivity is not good when the amount is less than 3% by mass, but the chemical resistance and the surface appearance of the molded article are not good after more than 30% by mass.
構成本發明之第三熱塑性樹脂組成物的(C1)成份用量,在前述(B)成份與以下(C1)成份及(D)成份的合計100質量中為3~30質量%、4~25質量%與4~23質量%亦佳,但5~23質量%最佳;未滿3質量%時制電性會不佳,但超過30質量%後耐藥品性及成形品表面外觀則不佳。The amount of the (C1) component constituting the third thermoplastic resin composition of the present invention is 3 to 30% by mass, 4 to 25 mass in the total of 100 masses of the above (B) component and the following (C1) component and (D) component. % and 4 to 23% by mass are also preferable, but 5 to 23% by mass is optimal; when the amount is less than 3% by mass, the power supply property is not good, but when it exceeds 30% by mass, the chemical resistance and the surface appearance of the molded article are not good.
【0054】[4](C2)成分為了提升本發明之第一熱塑性樹脂組成物的防靜電性或制電性,除了上述(A)成份、(B)成份、(C1)成份之外,還可含有從以下(C2-1)成份、(C2-2)成份、(C2-3)成份及(C2-4)成份群中所選擇之至少一種成份。[0054] [4] (C2) component In addition to the above (A) component, (B) component, and (C1) component, in order to improve the antistatic property or electrical conductivity of the first thermoplastic resin composition of the present invention It may contain at least one selected from the group consisting of the following (C2-1) component, (C2-2) component, (C2-3) component, and (C2-4) component group.
(C2-1)成份:聚醚聚醯胺及/或聚醚聚酯,(C2-2)成份:非離子系防靜電劑,(C2-3)成份:硼化合物(C2-4)成份:鋰鹽本發明之第二熱塑性樹脂組成物,除了上述(B)成份、(C1)成份之外,還可含有上述(C2-2)成份,並可依照需求從上述(C2-1)成份、(C2-3)成份及(C2-4)成份群中至少選擇一種成份。(C2-1) Ingredients: Polyether Polyamide and/or Polyether Polyester, (C2-2) Ingredients: Nonionic Antistatic Agent, (C2-3) Ingredients: Boron Compound (C2-4) Ingredients: Lithium salt The second thermoplastic resin composition of the present invention may contain the above (C2-2) component in addition to the above (B) component and (C1) component, and may be selected from the above (C2-1) component, Select at least one component from the (C2-3) component and (C2-4) component group.
本發明之第三熱塑性樹脂組成物,除了上述(B)成份、(C1)成份、(D)成份之外,還可含有上述(C2-2)成份,並可依照需求從上述(C2-1)成份、(C2-3)成份及(C2-4)成份群中至少選擇一種成份。The third thermoplastic resin composition of the present invention may contain the above (C2-2) component in addition to the above (B) component, (C1) component, and (D) component, and may be supplied from the above (C2-1). At least one component of the component, (C2-3) component, and (C2-4) component group.
【0055】[4-1](C2-1)成分本發明之(C2-1)成份為聚醚聚醯及/或聚醚聚酯。在此所用之聚醯則有,乙撐二胺、四甲撐二胺、己二胺、癸二胺、2, 3, 4或2, 4, 4-三甲基己二胺、1, 3或1, 4-二(氨甲基)環己烷、二(p-氨己基)甲烷、苯基二胺、m-二甲苯二胺、p-二甲苯二胺等脂肪族、脂環族或芳香族二胺等二胺成份與己二酸、辛二酸、癸二酸、環己烷二羧酸、對苯二甲酸、間苯二甲酸等,藉由脂肪族二羧酸、脂環族二羧酸或芳香族二羧酸的反應所生成之聚醯胺、己內醯胺、月桂酸內醯胺等內醯胺的開環聚合所得之聚醯胺、ω-氨基正己酸、ω-氨基庚酸、氨基十一烷酸、1, 2-氨基十二烷等氨基羧酸所生成之聚醯胺、及這些共聚合聚醯胺、與混合這些聚醯胺。[4-1] (C2-1) Component The component (C2-1) of the present invention is a polyether polyfluorene and/or a polyether polyester. The polyfluorene used herein includes ethylene diamine, tetramethyl diamine, hexamethylene diamine, decanediamine, 2, 3, 4 or 2, 4, 4-trimethylhexamethylenediamine, 1, 3 Or an aliphatic or alicyclic group such as 1, 4-bis(aminomethyl)cyclohexane, bis(p-aminohexyl)methane, phenyldiamine, m-xylenediamine or p-xylenediamine. a diamine component such as an aromatic diamine and adipic acid, suberic acid, sebacic acid, cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, etc., by an aliphatic dicarboxylic acid, an alicyclic group Polyamide, ω-amino-n-hexanoic acid, ω- obtained by ring-opening polymerization of indoleamine such as polydecylamine, caprolactam, lauric acid decylamine or the like formed by the reaction of a dicarboxylic acid or an aromatic dicarboxylic acid Polyamide produced by an aminocarboxylic acid such as aminoheptanoic acid, aminoundecanoic acid or 1,2-aminododecane, and these copolymerized polyamines, and these polyamines are mixed.
【0056】本發明之(C2-1)成份為聚醚聚醯雖含有聚醚,但這裡所用的聚醚成份,都可使用(C1)成份所述之前述(c1-2)成份。[0056] The (C2-1) component of the present invention is a polyether polyether containing a polyether, but the polyether component used herein may be the component (c1-2) described in the component (C1).
本發明之最佳聚醚聚醯的最佳聚合法則是加熱溶融聚合法,其最佳具體例如下:(i)聚合聚醯後,添加二羧酸氧化合物,讓聚醯成份的兩末端進行羧基化,添加聚(環氧化物)乙醇以進行聚合後,而獲得聚醚聚醯的方法。The optimal polymerization method of the preferred polyether polyfluorene of the present invention is a heated melt polymerization method, and the best specific examples thereof are as follows: (i) after polymerization polymerization, a dicarboxylic acid oxygen compound is added to carry out both ends of the polyfluorene component. A method of carboxylating and adding poly(epoxide) ethanol to carry out polymerization to obtain a polyether polyfluorene.
(ii)聚合聚醯時,為了實質上讓分子兩末端羧基化,而大量添加與聚合二羧酸氧化合物,再添加聚(環氧化物)乙醇以進行聚合後,而獲得聚醚聚醯的方法。(ii) When polymerizing polyfluorene, in order to substantially carboxylate both ends of the molecule, a large amount of a polycarboxylic acid compound is added and polymerized, and poly(epoxide) ethanol is further added to carry out polymerization to obtain a polyether polyfluorene. method.
(iii)整個定量添加聚醯生成成份、及大量二羧酸氧化合物,再添加聚(環氧化物)乙醇以進行聚合後,而獲得聚醚聚醯的方法。(iii) A method of obtaining polyether polyfluorene by quantitatively adding a polyfluorene-forming component and a large amount of a dicarboxylic acid oxygen compound, followed by addition of poly(epoxide) ethanol to carry out polymerization.
上述方法中,最佳的方法則是上述(i)。Among the above methods, the most preferable method is the above (i).
【0057】對上述聚醯成份的分子末端進行羧基化所用之二羧酸則有,已二酸、辛二酸、癸二酸、馬來酸、檸康酸、馬來酸酐、檸康酸酐、環己烷二羧酸、對苯二甲酸、間苯二甲酸等;本發明之上述聚醯的數平均分量最佳為500~20000,500~10000亦佳,但500~5000範圍最能達成本發明目的。[0057] The dicarboxylic acid used for the carboxylation of the molecular end of the above polyfluorene component is adipic acid, suberic acid, azelaic acid, maleic acid, citraconic acid, maleic anhydride, citraconic anhydride, Cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, etc.; the number average composition of the above polyfluorene of the present invention is preferably 500 to 20000, preferably 500 to 10,000, but the range of 500 to 5000 is the best. Purpose of the invention.
本發明之聚醚聚醯中的聚醯成份與聚醚成份的質量比率(聚醯/聚醚)最好在90/10~10/90範圍,80/20~20/80亦佳,但70/30~30/70更佳。The mass ratio (polyfluorene/polyether) of the polyfluorene component to the polyether component in the polyether polyfluorene of the present invention is preferably in the range of 90/10 to 10/90, and preferably 80/20 to 20/80, but 70 /30~30/70 is better.
雖未特別限定本發明之聚醚聚醯分子量,但還原黏度(ηs p /C)(蟻酸溶劑中為0.5g/100ml、以25℃環境作測量)最好在1~3dl/g範圍,但1.2~2.5dl/g更佳。Although the molecular weight of the polyether polyfluorene of the present invention is not particularly limited, the reducing viscosity (η s p /C) (0.5 g/100 ml in the formic acid solvent and measured in an environment of 25 ° C) is preferably in the range of 1 to 3 dl/g. But 1.2~2.5dl/g is better.
本發明之聚醚聚醯可單獨使用1種,亦可併用2種以上。The polyether polyfluorene of the present invention may be used singly or in combination of two or more.
【0058】本發明之(C2-1)成份中的聚酯屬於,(1)碳數4~20二羧酸及/或該酯形成衍生物、與(2)從二醇成份中所得之聚合物;在此所用之上述(1)如以下所示;在此所言之碳數是指,構成羧基碳及直接連結羧基碳的鎖或環的總碳數。The polyester in the component (C2-1) of the present invention belongs to (1) a carbon number 4 to 20 dicarboxylic acid and/or a derivative of the ester, and (2) a polymerization obtained from the diol component. The above (1) used herein is as follows; the carbon number as used herein means the total carbon number of a lock or ring constituting a carboxyl group carbon and a direct bond to a carboxyl group.
【0059】碳數4~20二羧酸則有(a)琥珀酸、已二酸、壬二酸、癸二酸、α.ω-十二烷二羧酸、十二碳烯琥珀酸、十八烯羧酸等碳數4~20脂肪族二羧酸、(b)1, 4-環己烷二羧酸等碳數8~20脂環族二羧酸、(c)對苯二甲酸、間苯二甲酸、1, 4-萘二羧酸、2, 3-萘二羧酸、2, 6-萘二羧酸、2, 7-萘二羧酸等碳數8~12芳香族二羧酸、(d)5-鈉磺基間苯二甲酸、5-鉀磺基間苯二甲酸、5-四丁基鏻磺基間苯二甲酸等磺酸機結合於芳香環之碳數8~12置換芳香族二羧酸等;此外,碳數4~20的二羧酸酯形成衍生物則有,前述(a)~(d)的低階烷基酯;例如琥珀酸二甲基、己二酸二甲基、壬二酸二甲基、癸二酸二甲基、α.ω-十二烷二羧酸二甲基、十二碳烯琥珀酸二甲基、十八烯羧酸二甲基、1, 4-環己烷二羧酸二甲基、琥珀酸二乙基、己二酸二乙基、壬二酸二乙基、癸二酸二乙基、α.ω-十二烷二羧酸二乙基、十二碳烯琥珀酸二乙基、十八烯羧酸二乙基、1, 4-環己烷二羧酸二乙基、對苯二甲酸二甲基、對苯二甲酸二乙基、對苯二甲酸二(2-羥乙基)、間苯二甲酸二甲基、間苯二甲酸二乙基、間苯二甲酸二(2-羥乙基)、1, 4-萘二羧酸二甲基、1, 4-萘二羧酸二乙基、2, 6-萘二羧酸二甲基、2, 6-萘二羧酸二乙基、2, 7-萘二羧酸二甲基、2, 7-萘二羧酸二乙基、5-鈉磺基間苯二甲酸二甲基、5-鉀磺基間苯二甲酸二甲基、5-鈉磺基間苯二甲酸(2-羥乙基)、5-鉀磺基間苯二甲酸(2-羥乙基)等,這些都可單獨使用1種,也可併用2種以上;其中最佳的是對苯二甲酸、間苯二甲酸、2, 6-萘二羧酸、5-鈉磺基間苯二甲酸及這些酯形成衍生物。[0059] The carbon number 4-20 dicarboxylic acid is (a) succinic acid, adipic acid, sebacic acid, sebacic acid, α.ω-dodecanedicarboxylic acid, dodecene succinic acid, ten a carbon number of 4 to 20 aliphatic dicarboxylic acids such as octaenecarboxylic acid, (b) 1,4-cyclohexanedicarboxylic acid, and the like, 8 to 20 alicyclic dicarboxylic acids, (c) terephthalic acid, Carbon 8 to 12 aromatic dicarboxylic acid such as isophthalic acid, 1, 4-naphthalene dicarboxylic acid, 2, 3-naphthalene dicarboxylic acid, 2, 6-naphthalene dicarboxylic acid, 2, 7-naphthalene dicarboxylic acid A sulfonic acid machine such as acid, (d) 5-sodium sulfoisophthalic acid, 5-potassium sulfoisophthalic acid or 5-tetrabutylphosphonium isophthalic acid is bonded to the carbon number of the aromatic ring 8~ 12, replacing an aromatic dicarboxylic acid or the like; and a dicarboxylic acid ester-forming derivative having 4 to 20 carbon atoms; the lower alkyl ester of the above (a) to (d); for example, dimethyl succinate or Diacid dimethyl, sebacic acid dimethyl, sebacic acid dimethyl, α.ω-dodecanedicarboxylic acid dimethyl, dodecene succinate dimethyl, octadecene carboxylic acid Methyl, 1,4-cyclohexanedicarboxylic acid dimethyl, diethyl succinate, diethyl adipate, diethyl sebacate, diethyl sebacate, α.ω-twel Dicarboxylic acid diethyl, dodecene succinic acid diethyl, octadecene carboxylic acid diethyl, 1,4-cyclohexanedicarboxylic acid diethyl, dimethyl terephthalate, para-benzene Diethyl dicarboxylate, di(2-hydroxyethyl) terephthalate, dimethyl isophthalate, diethyl isophthalate, di(2-hydroxyethyl) isophthalate, 1, 4-naphthalene dicarboxylic acid dimethyl, 1,4-naphthalene dicarboxylic acid diethyl, 2,6-naphthalene dicarboxylic acid dimethyl, 2,6-naphthalene dicarboxylic acid diethyl, 2, 7- Dimethyl naphthalene dicarboxylate, diethyl 2,7-naphthalene dicarboxylate, dimethyl 5-sodium sulfoisophthalate, dimethyl 5-potassium sulfoisophthalate, 5-sodium sulfonate Isophthalic acid (2-hydroxyethyl), 5-potassium sulfoisophthalic acid (2-hydroxyethyl), etc., may be used alone or in combination of two or more; It is terephthalic acid, isophthalic acid, 2,6-naphthalene dicarboxylic acid, 5-sodium sulfoisophthalic acid and derivatives of these esters.
【0060】本發明之聚醚聚酯雖包含上述聚酯成份與聚醚成份,在此所用之聚醚成份可使用所有前述(c1-2)成份;本發明之最佳聚醚聚酯的最佳聚合法則是加熱溶融聚合法,其最佳具體例如下:(i)聚合聚酯後,添加二羧酸氧化合物,讓聚酯成份的兩末端進行羧基化,添加聚(環氧化物)乙醇以進行聚合後,而獲得聚醚聚酯的方法。[0060] The polyether polyester of the present invention contains the above polyester component and polyether component, and the polyether component used herein can use all of the above (c1-2) components; The preferred polymerization method is a heated melt polymerization method, and the best specific examples thereof are as follows: (i) after polymerizing the polyester, adding a dicarboxylic acid oxygen compound, carboxylating both ends of the polyester component, and adding poly(epoxide) ethanol A method of obtaining a polyether polyester after the polymerization is carried out.
(ii)聚合聚酯時,為了實質上讓分子兩末端羧基化,而大量添加與聚合二羧酸氧化合物,再添加聚(環氧化物)乙醇以進行聚合後,而獲得聚醚聚酯的方法。(ii) When polymerizing a polyester, in order to substantially carboxylate both ends of the molecule, a large amount of a polydicarboxylate compound is added and polymerized, and poly(epoxide) ethanol is further added to carry out polymerization to obtain a polyether polyester. method.
(iii)整個定量添加聚酯生成成份、及大量二羧酸氧化合物,再添加聚(環氧化物)乙醇以進行聚合後,而獲得聚醚聚酯的方法。(iii) A method of obtaining a polyether polyester by quantitatively adding a polyester-forming component and a large amount of a dicarboxylic acid oxygen compound, followed by addition of poly(epoxide) ethanol to carry out polymerization.
【0061】對上述聚酯成份的分子末端進行羧基化所用之二羧酸則有,已二酸、辛二酸、癸二酸、馬來酸、檸康酸、馬來酸酐、檸康酸酐、環己烷二羧酸、對苯二甲酸、間苯二甲酸等;本發明之上述聚酯的數平均分量最佳為300~20000,300~10000亦佳,但500~5000範圍最能達成本發明目的。[0061] The dicarboxylic acid used for the carboxylation of the molecular end of the above polyester component is adipic acid, suberic acid, sebacic acid, maleic acid, citraconic acid, maleic anhydride, citraconic anhydride, Cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, etc.; the number average composition of the above polyester of the present invention is preferably from 300 to 20,000, preferably from 300 to 10,000, but the range of 500 to 5,000 is the best. Purpose of the invention.
本發明之聚醚聚酯中的聚酯成份與聚醚成份的質量比率(聚酯/聚醚)最好在90/10~10/90範圍,80/20~20/80亦佳,但70/30~30/70更佳。The mass ratio of the polyester component to the polyether component (polyester/polyether) in the polyether polyester of the present invention is preferably in the range of 90/10 to 10/90, and preferably 80/20 to 20/80, but 70 /30~30/70 is better.
雖未特別限定本發明之聚醚聚酯分子量,但還原黏度(ηs p /C)(使用苯酚/四氯乙烷=40/60質量比混合溶劑,以濃度1.0g/dl、以35℃環境作測量)最好在0.3~2.5dl/g範圍,但0.5~2.5dl/g更佳。Although the molecular weight of the polyether polyester of the present invention is not particularly limited, the reducing viscosity (η s p /C) (using a phenol/tetrachloroethane = 40/60 mass ratio mixed solvent at a concentration of 1.0 g/dl at 35 ° C) The environment is preferably measured in the range of 0.3 to 2.5 dl/g, but preferably 0.5 to 2.5 dl/g.
本發明之聚醚聚酯可單獨使用1種,亦可併用2種以上。The polyether polyester of the present invention may be used alone or in combination of two or more.
【0062】本發明(C2-1)成份聚醚聚醯或聚醚聚酯,在聚合過程(聚合前、聚合初期、聚合中、聚合後),為了提升防靜電性而可添加前述(H)成份;在此所用之(H)成份量在本發明(C2-1)成份中的最佳範圍是0.001~20質量%,0.01~15質量%亦佳,但0.1~10質量%更佳。[0062] The polyether polyether or polyether polyester of the present invention (C2-1) may be added in the polymerization process (before polymerization, in the initial stage of polymerization, during polymerization, after polymerization), in order to improve the antistatic property (H) The component (H) component used herein has an optimum range of 0.001 to 20% by mass in the component (C2-1) of the present invention, preferably 0.01 to 15% by mass, more preferably 0.1 to 10% by mass.
【0063】本發明之第一熱塑性樹脂組成物的(C2-1)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳使用範圍是0.001~60質量部、0.5~50質量部、0.5~40質量部與1~35質量部亦佳,但1~30質量部最佳;該用量未滿0.001質量部時,防靜電性及成形品表面光澤會不佳,但超過60質量部時耐衝擊性也會不佳。The (C2-1) component of the first thermoplastic resin composition of the present invention is preferably used in an amount of 0.001 to 60 parts by mass for the total mass of 100 parts of the component (A) and the component (B). ~50 mass parts, 0.5~40 mass parts and 1~35 mass parts are also good, but 1~30 mass parts are the best; when the dosage is less than 0.001 parts, the antistatic property and the surface gloss of the molded products will be poor, but When it exceeds 60 parts by mass, the impact resistance will also be poor.
本發明之第二與第三熱塑性樹脂組成物的(2-1)成份用量,對於(B)成份的100質量部而言,最佳使用範圍是0.001~60質量部、0.5~50質量部、0.5~40質量部與1~35質量部亦佳,但1~30質量部最佳;該用量未滿0.001質量部時,防靜電性及成形品表面光澤會不佳,但超過60質量部時耐衝擊性也會不佳。The amount of the component (2-1) of the second and third thermoplastic resin compositions of the present invention is preferably in the range of 0.001 to 60 parts by mass and 0.5 to 50 parts by mass for the 100 parts by mass of the component (B). 0.5~40 mass parts and 1~35 mass parts are also good, but 1~30 mass parts are the best; when the dosage is less than 0.001 parts, the antistatic property and the surface gloss of the molded product will be poor, but when it exceeds 60 mass parts Impact resistance will also be poor.
本發明(C1)成份與(C2-1)成份的使用比率(C1)/(C2-1),最好在4~60/40~96質量比率範圍內,6~55/45~94亦佳,但8~48/52~92更佳,將(C1)成份與(C2-1)成份的合計視為100質量%後,(C1)成份的使用比率未滿4質量%、(C2-1)成份的使用比率在超過96質量%的領域裡,具有防靜電性下滑的傾向;(C1)成份的用量超過60質量%的領域、(C2-1)成份的用量在未滿40質量%裡,具有成形品表面光澤下滑的傾向。The ratio (C1)/(C2-1) of the component (C1) of the present invention to (C2-1) is preferably in the range of 4 to 60/40 to 96, and preferably 6 to 55/45 to 94. However, it is better to use 8 to 48/52 to 92, and the total ratio of (C1) component to (C2-1) component is regarded as 100% by mass, and the ratio of use of (C1) component is less than 4% by mass, (C2-1 The use ratio of the component in the field of more than 96% by mass has a tendency to decline in antistatic property; the amount of the component (C1) exceeds 60% by mass, and the amount of the component (C2-1) is less than 40% by mass. There is a tendency for the surface gloss of the molded article to decline.
【0064】[4-2](C2-2)成份本發明之(C2-2)成份為非離子系防靜電劑,分別有多價酒精酯、(C2-2-2)一般化學式(VI)所表示含氮化合物等,這些可單獨使用1種,也可組合2種以上。[4-2] (C2-2) component The (C2-2) component of the present invention is a nonionic antistatic agent, respectively having a polyvalent alcohol ester, (C2-2-2) general chemical formula (VI) The nitrogen-containing compound or the like may be used alone or in combination of two or more.
【0065】(C2-2-1)成份則有,甘油一硬脂酸酯、甘油一肉豆蔻酸酯、甘油一棕櫚酸酯、甘油一硬脂酸酯、甘油monobehenet、甘油monoolet、二甘油一月桂酸鹽、二甘油肉豆蔻酸酯、二甘油棕櫚酸酯、二甘油硬脂酸酯、二甘油monobehenet、二甘油monoolet、山梨糖醇酐月桂酸鹽、山梨糖醇酐肉豆蔻酸酯、山梨糖醇酐棕櫚酸酯、山梨糖醇酐硬脂酸酯、山梨糖醇酐monobehenet、山梨糖醇酐monoolet等,這些皆可單獨使用1種,也可組合2種以上;其中的最佳成份為,甘油一硬脂酸酯、二甘油硬脂酸酯、甘油monoolet、二甘油一月桂酸鹽、山梨糖醇酐硬脂酸酯及至少含有20質量%以上的(C2-2-1)成份。[0065] (C2-2-1) components include glyceryl monostearate, glyceryl monomyristate, glyceryl monopalmitate, glyceryl monostearate, glycerol monobehenet, glycerol monoolet, diglycerol Laurate, diglycerin myristate, diglyceryl palmitate, diglyceryl stearate, diglycerin monobehenet, diglycerin monoolet, sorbitan laurate, sorbitan myristate, sorbus The sugar alcoholic acid palmitate, the sorbitan stearate, the sorbitan monobehenet, the sorbitan monoolet, etc., may be used alone or in combination of two or more; the most preferred one is , glyceryl monostearate, diglyceryl stearate, glycerin monoolet, diglycerin monolaurate, sorbitan stearate, and at least 20% by mass of the (C2-2-1) component.
【0066】(C2-2-2)成份則有,月桂基二乙醇胺、肉豆蔻基二乙醇胺、棕櫚醯二乙醇胺、硬脂醯二乙醇胺、油基二乙醇胺、月桂基二異丙醇胺、肉豆蔻基二異丙醇胺、棕櫚醯二異丙醇胺、硬脂醯二異丙醇胺、油基二異丙醇胺、N, N-雙羥基乙基烷基(烷基碳數12~22)胺等胺、或月桂基二乙醇醯、肉豆蔻基二乙醇醯、棕櫚醯二乙醇醯、二十二烷二乙醇醯、油基二乙醇醯、月桂基二異丙醇醯、肉豆蔻基二異丙醇醯、棕櫚醯二異丙醇醯、硬脂醯二異丙醇醯、油基二異丙醇醯等醯類;這些皆可單獨使用1種,也可組合2種以上;其中的最佳成份為,上述胺化合物,更佳的有月桂基二乙醇胺、硬脂醯二乙醇胺,各至少含有20質量%以上之(C2-2-2)成份。[0066] (C2-2-2) components are, lauryl diethanolamine, myristyl diethanolamine, palmitoyl diethanolamine, stearin diethanolamine, oleyl diethanolamine, lauryl diisopropanolamine, meat Myristyl diisopropanolamine, palm quinone diisopropanolamine, stearin diisopropanolamine, oleyl diisopropanolamine, N, N-bishydroxyethylalkyl (alkyl carbon number 12~ 22) amines such as amines, or lauryl diethanol oxime, myristyl diethanol oxime, palm quinone diethanol oxime, behenyl diethanol oxime, oleyl diethanol oxime, lauryl diisopropanol oxime, nutmeg An anthraquinone such as bismuth isopropoxide, palm ruthenium diisopropylate, stearyl bismuth isopropoxide or oleyl diisopropoxide; these may be used alone or in combination of two or more; The most preferred component is the above-mentioned amine compound, more preferably lauryl diethanolamine or stearin diethanolamine, each containing at least 20% by mass of the (C2-2-2) component.
【0067】為了提升防靜電性能,可在上述化合物上調配既知之添加劑;以例示為例則有碳數12~18的高級酒精、潤滑劑、矽、硅酸鈣等;此外,也可用作成主膠料(master batch)以提升混合性。本發明之(C2-2)成份為非離子系防靜電劑可在市場上取得,例如花王公司製Electro Stripper EA、TS-3B、TS-6B、TS-5、TS-2B(商品名稱)等。[0067] In order to improve the antistatic property, the above-mentioned compounds may be formulated with known additives; for example, there are high-grade alcohols, lubricants, strontium, calcium silicate, etc. having a carbon number of 12 to 18; Master batch to improve mixing. The (C2-2) component of the present invention is available as a nonionic antistatic agent, such as Electro Stripper EA, TS-3B, TS-6B, TS-5, TS-2B (trade name) manufactured by Kao Corporation. .
【0068】本發明之第一熱塑性樹脂組成物的(C2-2)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳使用範圍是0.001~60質量部、0.5~50質量部、0.01~30質量部與0.05~20質量部亦佳,但0.5~10質量部更佳;該用量未滿0.001質量部時,制電性會不佳,但超過60質量部時耐藥品性及成形品表面外觀也會不佳。The (C2-2) component of the first thermoplastic resin composition of the present invention is preferably used in an amount of 0.001 to 60 parts by mass for a total of 100 parts by mass of the component (A) and the component (B). ~50 mass parts, 0.01~30 mass parts and 0.05~20 mass parts are also good, but 0.5~10 mass parts are better; when the dosage is less than 0.001 parts, the power supply performance will be poor, but when it exceeds 60 mass parts Chemical resistance and appearance of the molded article may also be poor.
本發明之第二熱塑性樹脂組成物的(C2-2)成份用量,對於(B)成份與(C1)成份的100質量部而言,最好是添加0.01~10質量部、0.05~8質量部亦佳,但0.1~5質量部最佳;未滿0.01質量部時制電性會不佳,但超過10質量部時耐藥品性及成形品表面外觀也會不佳。The amount of the (C2-2) component of the second thermoplastic resin composition of the present invention is preferably 0.01 to 10 parts by mass and 0.05 to 8 parts by mass for the 100 parts by mass of the component (B) and the component (C1). It is also good, but the best quality is 0.1~5; when the quality is less than 0.01, the power quality will be poor, but when it exceeds 10 parts, the chemical resistance and the surface appearance of the molded product will be poor.
本發明之第三熱塑性樹脂組成物的(C2-2)成份用量,對於(B)成份與(C1)成份及與(C)成份的100質量部而言,最好是添加0.01~10質量部、0.5~8質量部亦佳,但0.1~5質量部最佳;未滿0.01質量部時制電性會不佳,但超過10質量部時耐藥品性及成形品表面外觀也會不佳。The amount of the (C2-2) component of the third thermoplastic resin composition of the present invention is preferably 0.01 to 10 parts by mass for the (B) component and the (C1) component and the 100 mass portion of the component (C). 0.5~8 mass parts are also good, but 0.1~5 quality parts are the best; when the quality part is less than 0.01 mass parts, the power quality will be poor, but when it exceeds 10 mass parts, the chemical resistance and the surface appearance of the molded products will be poor.
【0069】[4-3](C2-3)成份本發明之相關(C2-3)成份為,硼化合物,換言之就是含硼元素之化合物;此硼化合物(C2-3)可以單獨使用1種,也可組合2種以上。[0069] [4-3] (C2-3) Component The related (C2-3) component of the present invention is a boron compound, in other words, a boron-containing compound; the boron compound (C2-3) can be used alone. Two or more types can also be combined.
最佳的硼化合物(C2-3)是有機硼高分子化合物;此有機硼高分子化合物最好包含以下一般化學式(VII)所示單位之化合物。The most preferred boron compound (C2-3) is an organoboron polymer compound; and the organoboron polymer compound preferably contains a compound of the following general formula (VII).
【0070】包含上述一般化學式(VII)所示單位之化合物,則如同以下一般化學式(VIII)所示,以半極性有機硼高分子化合物、擁有羥基之合計碳數5~82第3級胺的1種或2種以上、1個硼原子對1個鹼性氮原子的比率反應生成物----高分子電荷移動型結合體為最佳。[0070] A compound comprising the unit of the above general chemical formula (VII) is as shown in the following general formula (VIII), and a semipolar organoboron polymer compound having a total of hydroxyl groups of 5 to 82 and a third amine One or two or more kinds of one boron atom to one basic nitrogen atom are required to react with each other - a polymer charge-transfer type combination is preferable.
【化9】
〔式中q為0或1,q=1時,T為-(T1
)s
-(T2
)t
-(T3
)u
-(但T1
及T3
彼此為相同或不同,且擁有1個末端醚殘基,且合計碳數在100以下之含氧碳化氫基,T2
為,
【0071】上述一般化學式(VIII)上的R6 、R7 、R8 則有,碳氫化合物基、烷氧基、苯氧基、苄甲硅烷氧基、烷撐乙二醇基等;這些也可具有羥基等官能團或置換團。[0071] R 6 , R 7 and R 8 in the above general chemical formula (VIII) include a hydrocarbon group, an alkoxy group, a phenoxy group, a benziloxy group, an alkylene glycol group and the like; It may also have a functional group such as a hydroxyl group or a replacement group.
【0072】上述電荷移動型結合體,則有以下化學式(IX)~(XVI)所示之結合體;再者,在以下各化學式裡,末端碳原子及氧原子上,通常各結合氫原子或羥基。[0072] The charge-transfer-type combination has the combination of the following chemical formulas (IX) to (XVI); further, in the following chemical formulas, the terminal carbon atom and the oxygen atom are usually each bonded to a hydrogen atom or Hydroxyl.
【0073】可藉由專利第2573986號公報是所記載之方法等,以製造上述高分子電荷移動型結合體。[0073] The above-described polymer charge-transfer type conjugate can be produced by the method described in Japanese Patent No. 2573986.
再者,硼化合物(C2-3)可使用市售品,例如Boron International公司製「Hybolon 400N」等。Further, as the boron compound (C2-3), a commercially available product such as "Hybolon 400N" manufactured by Boron International Co., Ltd., or the like can be used.
【0074】製造熱塑性樹脂組成物時,可單獨調配本發明之相關硼化合物(C2-3),也可調配上述(A)(B)(C1)成份等聚合物所構成之混合物(組成物);以後者為例則有Boron International公司製「Hybolon 400N-8LDPE」(將聚乙烯作成基體之主膠料)等。[0074] When the thermoplastic resin composition is produced, the related boron compound (C2-3) of the present invention may be separately formulated, and a mixture (composition) composed of a polymer such as the above (A) (B) (C1) component may be blended. In the latter case, "Hybolon 400N-8LDPE" manufactured by Boron International Co., Ltd. (a main compound in which polyethylene is used as a matrix) is used.
【0075】本發明之第一熱塑性樹脂組成物的(C2-3)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳是0.001~60質量部、其次分別是0.001~50質量部、0.01~30質量部、0.05~20質量部、0.05~10質量部亦佳,但0.1~5質量部最佳;該含量未滿0.001質量部時,防靜電性會不佳,但超過60質量部時表面外觀也會不佳。The (C2-3) component of the first thermoplastic resin composition of the present invention is preferably 0.001 to 60 parts by mass for the total of 100 parts by mass of the component (A) and the component (B), and secondly, 0.001~50 mass, 0.01~30 mass, 0.05~20 mass, 0.05~10 mass, but 0.1~5 mass is the best; when the content is less than 0.001 mass, antistatic will be poor However, the appearance of the surface will be poor when it exceeds 60 mass parts.
本發明之第二與第三熱塑性樹脂組成物的(2-3)成份含量,對於(B)成份的100質量部而言,最佳是0.001~60質量部、其次分別是0.001~50質量部、0.01~30質量部、0.05~20質量部與0.05~10質量部亦佳,但0.1~5質量部最佳;該含量未滿0.001質量部時防靜電性會不佳,但超過60質量部時表面外觀也會不佳。The content of the (2-3) component of the second and third thermoplastic resin compositions of the present invention is preferably 0.001 to 60 parts by mass for the 100 parts by mass of the component (B), and is 0.001 to 50 parts by mass, respectively. 0.01~30 mass part, 0.05~20 mass part and 0.05~10 mass part are also good, but 0.1~5 mass part is the best; when the content is less than 0.001 part, the antistatic property will be poor, but more than 60 mass part The appearance of the surface will also be poor.
再者,(C1)成份與(C2-3)成份的含有比率方面,將這些合計視為100質量%時,最好是38~99.8質量%、0.2~62質量%,其次分別是67~99.7質量%、0.3~33質量%亦佳,但75~99.2質量%/0.8~25質量%最佳;可藉由上述範圍,而擁有最佳的防靜電性。In addition, when the total ratio of the (C1) component to the (C2-3) component is 100% by mass, it is preferably 38 to 99.8 mass% and 0.2 to 62 mass%, and the next is 67 to 99.7. The mass %, 0.3 to 33% by mass is also preferable, but 75 to 99.2% by mass / 0.8 to 25% by mass is optimal; and the above range is available to have the best antistatic property.
【0076】[4-4](C2-4)成分本發明(C-2)成份鋰鹽則有例如,鋰有機鹽酸、無機鹽酸、鹵化物等,最佳則是至少從高氯酸鋰、三氟甲烷磺酸鋰、雙(三氟甲烷磺醯)亞氨基鋰、及三(三氟甲烷磺醯)甲烷鋰中選擇一種之化合物;更加則是至少從三氟甲烷磺酸鋰、雙(三氟甲烷磺醯)亞氨基鋰、及三(三氟甲烷磺醯)甲烷鋰中選擇一種之化合物;至少從雙(三氟甲烷磺醯)亞氨基鋰、及三(三氟甲烷磺醯)甲烷鋰中選擇一種之化合物亦佳,但三(三氟甲烷磺醯)甲烷鋰更佳。[4-4] (C2-4) component The lithium salt of the component (C-2) of the present invention is, for example, lithium organic hydrochloric acid, inorganic hydrochloric acid, a halide or the like, and most preferably at least lithium perchlorate, a compound selected from lithium trifluoromethanesulfonate, lithium bis(trifluoromethanesulfonate)imide, and lithium tris(trifluoromethanesulfonate)methane; more preferably at least lithium trifluoromethanesulfonate, double ( a compound selected from lithium trifluoromethanesulfonate) lithium imino and lithium tris(trifluoromethanesulfonate) methane; at least from lithium bis(trifluoromethanesulfonate), and tris(trifluoromethanesulfonate) It is also preferable to select one of the lithium methane compounds, but tris(trifluoromethanesulfonate) methane lithium is more preferable.
【0077】將本發明之上述(C2-4)成份調配成本發明之組成物,而得以提升制電性的同時,也發現到制電性的持續性,但調配(C2-4)成份時也可直接調配(C2-4)成份,但調配以溶劑(含水)等所溶解的(C2-4)成份,也可事先以高濃度分散其他聚合物以作為主膠料使用。[0077] The above (C2-4) component of the present invention is formulated into a composition of the invention, and the electrical conductivity is improved, and the continuity of the electrical properties is also found, but when the component (C2-4) is formulated The component (C2-4) can be directly formulated, but the component (C2-4) dissolved in a solvent (aqueous) or the like can be blended, and other polymers can be dispersed in a high concentration in advance to be used as a main compound.
【0078】最適合用來溶解(C2-4)成份的溶劑則是水或以下化學式(XVII)所示之化合物。The solvent most suitable for dissolving the component (C2-4) is water or a compound represented by the following chemical formula (XVII).
〔一般化學式(XVII)中X表示碳數2~8所構成之亞烷基、含芳香族基之二價碳氫基、二價脂環式碳氫基,R表示各自獨立之碳數1~9的直鎖或分歧烷基,A表示各自獨自之碳數2~4亞烷基,n表示各自獨自之1~7的整數。〕[In general formula (XVII), X represents an alkylene group having 2 to 8 carbon atoms, a divalent hydrocarbon group containing an aromatic group, and a divalent alicyclic hydrocarbon group, and R represents an independent carbon number of 1~ 9 is a straight-locked or divalent alkyl group, A represents a carbon number of 2 to 4 alkyl groups, and n represents an integer of 1 to 7 each. 〕
【0079】上述一般化學式(XVII)所表示之最佳化合物為,R在末端未具有羥基之烷基;最佳為雙〔2-(2丁氧基乙氧基)乙基〕己二酸酯(已二酸二丁氧基乙氧基乙基)、或雙(2-丁氧基乙基)Phthalet。The most preferred compound represented by the above general formula (XVII) is an alkyl group in which R has no hydroxyl group at the terminal; most preferably bis[2-(2-butoxyethoxy)ethyl] adipate (dibutoxyethoxyethyl hexanoate) or bis(2-butoxyethyl) Phthalet.
溶解本發明(C2-4)成份時的濃度,最好是0.1~80質量%、但1~60質量%更佳。The concentration at which the component (C2-4) of the present invention is dissolved is preferably from 0.1 to 80% by mass, more preferably from 1 to 60% by mass.
【0080】事先將本發明之(C2-4)成份分散於其他聚合物以作成主膠料時,則在既知聚合物上調配(C2-4)成份及視其需要之上述溶劑,以便藉由溶融混練予以製造。[0080] When the (C2-4) component of the present invention is previously dispersed in another polymer to form a main compound, the (C2-4) component and the solvent as needed are formulated on the known polymer so as to Molten and kneaded to manufacture.
在此所用之最佳既知聚合物為具有醚結合者,這些則是聚環氧化物及/或含有聚環氧化物之聚合物;具體而言就是可使用聚乙烯氧化物、聚丙烯氧化物、聚氧戊環、及聚醯、聚酯與前述聚環氧化物所構成之嵌段共聚物、及用本發明成份(C1)視為親水性聚合嵌段(C1-2),將使用聚醚者視為具有醚結合的聚合物予以使用;換言之,本發明之(C2-4)成份也可添加於上述(C1)成份,但也可添加於其他任何本發明之成份。The best known polymers used herein are those having an ether bond, these being polyepoxides and/or polyepoxide-containing polymers; in particular, polyethylene oxides, polypropylene oxides, A polyoxyethylene pentoxide, a poly(fluorene), a block copolymer composed of the polyester and the above polyepoxide, and a hydrophilic polymeric block (C1-2) using the component (C1) of the present invention, a polyether to be used It is considered to be used as a polymer having an ether bond; in other words, the component (C2-4) of the present invention may be added to the above (C1) component, but may be added to any other component of the present invention.
將上述本發明之(C2-4)成份作成主膠料時,主膠料中的(C2-4)成份量最好在0.5~80質量%範圍,1~6質量%亦佳,但3~40質量%更佳。When the (C2-4) component of the present invention is used as the main compound, the amount of the (C2-4) component in the main rubber is preferably in the range of 0.5 to 80% by mass, and preferably 1 to 6% by mass, but 3~ 40% by mass is better.
【0081】上述本發明之(C2-4)成份溶液,可從三光化學工業公司製SANKONORL 0862-20R、0862-13T、0862-10T、AQ-50T(商品名稱);主膠料則可從三光化學工業公司製SANKONORL TBX-25(商品名稱)中購得。[0081] The above-mentioned (C2-4) component solution of the present invention can be made from SankonoRL 0862-20R, 0862-13T, 0862-10T, AQ-50T (trade name) manufactured by Sanko Chemical Industry Co., Ltd.; It is purchased from SANKONORL TBX-25 (trade name) manufactured by Chemical Industry Co., Ltd.
【0082】本發明之第一熱塑性樹脂組成物的(C2-4)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳是0.001~60質量部、其次分別是0.005~50質量部、0.01~40質量部、0.05~25質量部、0.05~15質量部亦佳,但0.1~10質量部最佳;未滿0.001質量部時便無法提升制電性,但超過60質量部時制電性的持續性及耐衝擊細會不佳。The (C2-4) component of the first thermoplastic resin composition of the present invention is preferably 0.001 to 60 parts by mass for the total mass of the components (A) and (B), and secondly, 0.005~50 mass part, 0.01~40 mass part, 0.05~25 mass part, 0.05~15 mass part is also good, but 0.1~10 mass part is the best; when it is less than 0.001 mass part, it can't improve the electric power, but it exceeds At 60 mass parts, the continuity of the electrical properties and the impact resistance are not good.
本發明之第二與第三熱塑性樹脂組成物的(2-4)成份含量,對於(B)成份的100質量部而言,最佳是0.001~60質量部、其次分別是0.005~50質量部、0.01~40質量部、0.05~25質量部與0.05~15質量部亦佳,但0.1~10質量部最佳;未滿0.001質量部時便無法提升制電性,但超過60質量部時制電性的持續性及耐衝擊細會不佳。The content of the (2-4) component of the second and third thermoplastic resin compositions of the present invention is preferably 0.001 to 60 parts by mass for the 100 parts by mass of the component (B), and is 0.005 to 50 parts by mass, respectively. , 0.01~40 mass parts, 0.05~25 mass parts and 0.05~15 mass parts are also good, but 0.1~10 mass parts are the best; when less than 0.001 mass parts, the power can not be improved, but more than 60 mass parts Sexual persistence and impact resistance are not good.
【0083】為了提升耐衝擊性、耐藥品性、成形品表面外觀、防靜電性或制電性,本發明之第一及第二熱塑性樹脂組成物,可在上述(A)成份、(B)成份、(C)成份中,含有至少從以下(D)成份、(E)成份、(F)成份、(G)成份群中所選擇之一種成份。[0083] In order to improve impact resistance, chemical resistance, surface appearance of the molded article, antistatic property or electrical conductivity, the first and second thermoplastic resin compositions of the present invention may be in the above (A) component, (B) The component (C) contains at least one component selected from the group consisting of (D), (E), (F), and (G).
為了提升耐衝擊性、耐藥品性、成形品表面外觀、防靜電性或制電性,本發明之第三熱塑性樹脂組成物,含有視為必須成份之以下(D)成份,且可視其需要含有至少從以下(E)成份、(F)成份、(G)成份群中所選擇之一種成份。In order to improve impact resistance, chemical resistance, surface appearance of the molded article, antistatic property or electrical conductivity, the third thermoplastic resin composition of the present invention contains the following (D) component which is regarded as an essential component, and may be contained as needed. At least one component selected from the group consisting of (E), (F), and (G).
(D)成份:至少含有以芳香族乙烯化合物為主之嵌段聚合物(d-1)、及以共軛二烯化合物為主之嵌段聚合物(d-2)的嵌段共聚物(D-a)及該氫添加物(D-b)成份群中所選擇的1種成份。(D) Component: a block copolymer containing at least an aromatic vinyl compound-based block polymer (d-1) and a conjugated diene compound-based block polymer (d-2) ( D-a) and one component selected from the hydrogen additive (D-b) component group.
(E)成份:於存在上述(D)成份之下,(共)聚合芳香族乙烯化合物、或可共聚合芳香族乙烯化合物及芳香族乙烯化合物之其他乙烯單體的接枝聚合物,(F)成份:上述(D)成份所構成之嵌段聚合物(f-1)、及芳香族碳酸酯嵌段聚合物(f-2)所構成之芳香族聚碳酸酯共聚塊,(G)成份:因不飽和酸及/或不飽和酸酐而變性之低分子量聚烯。(E) component: a graft polymer of (co)polymerized aromatic vinyl compound or copolymerizable aromatic vinyl compound and other vinyl monomer of the aromatic vinyl compound in the presence of the above component (D), (F) Component: an aromatic polycarbonate copolymer composed of the block polymer (f-1) composed of the above component (D) and the aromatic carbonate block polymer (f-2), (G) component A low molecular weight polyolefin which is denatured by an unsaturated acid and/or an unsaturated acid anhydride.
此外,上述(D)成份、(E)成份、(F)成份、(G)成份可併用,至少從上述(C2-1)成份、(C2-2)成份、(C2-3)成份、(C2-4)成份群中選擇一種成份。Further, the above (D) component, (E) component, (F) component, and (G) component may be used in combination, at least from the above (C2-1) component, (C2-2) component, (C2-3) component, ( C2-4) Select one component from the group of ingredients.
【0084】[5](D)成份本發明之(D)成份屬於含有以芳香族乙烯化合物為主之嵌段聚合物(d-1)、及以共軛二烯化合物為主之嵌段聚合物(d-2)的嵌段共聚物(D-a)及/或該氫添加物(D-b),該氫添加物(D-b)至少有一部份上述嵌段聚合物(d-2)之共軛二烯化合物的碳-碳雙重結合有添加氫。[5] (D) component The component (D) of the present invention belongs to a block polymer (d-1) mainly composed of an aromatic vinyl compound, and a block polymerization mainly composed of a conjugated diene compound. a block copolymer (D-a) of the material (d-2) and/or the hydrogen additive (D-b), the hydrogen additive (D-b) having at least a part of the above block polymer (d- 2) The carbon-carbon double bond of the conjugated diene compound is added with hydrogen.
【0085】在此所用之芳香族乙烯化合物雖可使用前述所有物質,但以苯乙烯最佳,α-甲基苯乙烯亦佳,但苯乙烯最佳。Although all of the above-mentioned substances can be used for the aromatic vinyl compound used herein, styrene is preferred, and α-methylstyrene is also preferred, but styrene is most preferred.
此外,共軛二烯化合物則有,丁二烯、異戊二烯、己二烯、2, 3-二甲基、1, 3-丁二烯、1, 3-戊二烯等,其中最佳的是丁二烯、異戊二烯;這些都可單獨使用1種,或組合2種以上;再者,嵌段(d-2)則用2種以上的共軛二烯化合物,這些也可以無規狀、塊狀、錐形塊狀的任何一種型態所結合的嵌段;此外,嵌段(d-2)也可在1~10個範圍內含有芳香族乙烯化合物漸增的錐形塊,來自於嵌段(d-2)共軛二烯化合物的乙烯結合含量不同的嵌段聚合物等,也可適當的進行共聚合。Further, the conjugated diene compound is butadiene, isoprene, hexadiene, 2,3-dimethyl, 1,3-butadiene, 1,3-pentadiene, etc. It is preferably butadiene or isoprene; these may be used alone or in combination of two or more; in addition, block (d-2) may be used in two or more kinds of conjugated diene compounds. a block which can be combined in any of a random form, a block shape, or a tapered block shape; in addition, the block (d-2) can also contain an increasing number of aromatic vinyl compounds in a range of 1 to 10 The block may be a copolymer polymer having a different ethylene-binding content from the block (d-2) conjugated diene compound, or may be appropriately copolymerized.
【0086】本發明(D)成份之最佳結構則為,以下化學式(XIII)~(XX)所示之聚合物或氫添加物。The optimum structure of the component (D) of the present invention is a polymer or a hydrogen additive represented by the following chemical formulas (XIII) to (XX).
(A-B)Y ………(XVIII) (A-B)Y -X………(XIX) A-(B-A)Z ………(XX)(結構式(XVIII)~(XX)中,A屬於以芳香族乙烯化合物為主體的嵌段聚合物,實質上可以是芳香族乙烯化合物所構成之嵌段聚合物,也可含有部分共軛二烯化合物;最佳的芳香族乙烯化合物為含有90質量%以上,但99質量%以上更佳的嵌段聚合物;B為共軛二烯化合物之單獨聚合物、或芳香族乙烯化合物等其他單體與共軛二烯化合物之間的共聚物,X為偶合劑之殘基,Y為1~5的整數,Z為1~5的整數。)(A-B) Y .........(XVIII) (A-B) Y -X.........(XIX) A-(B-A) Z .........(XX)(Structure formula (XVIII)~(XX) Among them, A belongs to a block polymer mainly composed of an aromatic vinyl compound, and may be substantially a block polymer composed of an aromatic vinyl compound, or may contain a partial conjugated diene compound; an optimum aromatic vinyl compound It is a block polymer containing 90% by mass or more, but more preferably 99% by mass or more; B is a single polymer of a conjugated diene compound, or another monomer such as an aromatic vinyl compound and a conjugated diene compound; Copolymer, X is the residue of the coupling agent, Y is an integer from 1 to 5, and Z is an integer from 1 to 5.)
【0087】本發明之(D)成份上的芳香族乙烯化合物與共軛二烯化合物的最佳使用比率為,芳香族乙烯化合物/共軛二烯化合物=10~70/30~90質量%,15~65/35~85質量%亦佳,但20~60/40~80質量%更佳。[0087] The optimum use ratio of the aromatic vinyl compound to the conjugated diene compound in the component (D) of the present invention is that the aromatic vinyl compound/conjugated diene compound = 10 to 70/30 to 90% by mass. 15~65/35~85% by mass is also good, but 20~60/40~80% by mass is better.
【0088】芳香族乙烯化合物與共軛二烯化合物所構成之嵌段共聚物,已在例如特公昭47-28915號公報、特公昭47-3252號公報、特公昭48-2423號公報、特公昭48-20038號公報的陰離子聚合技術領域上公開;此外,關於具有錐形塊的嵌段聚合物的製法,則公開於持公昭60-81217號公報。[0088] The block copolymer of the aromatic vinyl compound and the conjugated diene compound is disclosed in, for example, Japanese Patent Publication No. Sho 47-28915, Japanese Patent Publication No. Sho 47-3252, Japanese Patent Publication No. Sho 48-2423, and Japanese Patent Publication No. 48-20038 discloses an anionic polymerization technique; and a method for producing a block polymer having a tapered block is disclosed in Japanese Patent Publication No. Sho 60-81217.
【0089】來自於本發明(D)成份之共軛二烯化合物的乙烯結合量(1, 2-及3, 4結合)含量的最佳範圍是5~80%,本發明(D)成份的最佳數平均分子量為10,000~1,000,000,20,000~500,000亦佳,但20,000~200,000更佳;其中上述化學式(XVIII)~(XX)所示之A部的最佳數平均分子量為3,000~150,000,B部的最佳數平均分子量為5,000~200,000。[0089] The conjugated diene compound derived from the component (D) of the present invention has an ethylene binding amount (1, 2- and 3, 4 bond) content in an optimum range of 5 to 80%, and the component (D) of the present invention The optimum number average molecular weight is 10,000 to 1,000,000, preferably 20,000 to 500,000, but more preferably 20,000 to 200,000; wherein the optimum number average molecular weight of the A portion represented by the above chemical formulas (XVIII) to (XX) is 3,000 to 150,000, B. The optimum number average molecular weight of the part is 5,000 to 200,000.
【0090】可用N, N, N’, N’-四甲基乙二胺、三甲胺、三乙胺、重氮環辛烷(2, 2, 2)等胺類、氧染環戊烷、二甘醇二甲醚、二甘醇二丁醚等醚類、硫醚類、磷化氫類、磷酸醯類、烷基苯磺酸鹽、鉀或鈉的烷氧基金屬等,以調整共軛二烯化合物的乙烯結合量。[0090] N, N, N', N'-tetramethylethylenediamine, trimethylamine, triethylamine, diazocyclooctane (2, 2, 2) and other amines, oxygen dyed cyclopentane, Ethers such as diglyme or diethylene glycol dibutyl ether, thioethers, phosphines, phosphonium phosphates, alkylbenzenesulfonates, potassium or sodium alkoxides, etc. The amount of ethylene bound of the conjugated diene compound.
雖然本發明(D)成份上最好含有以上述方法獲得聚合物後,再用偶合劑讓聚合物分子鎖透過偶合劑殘基予以延長或分歧的聚合物,但這裡所用的偶合劑則有,已二酸二乙基、二乙烯基苯、甲基二氯硅烷、四氯化硅、丁基三氯硅、四氯錫、丁基三氯錫、二甲基二氯硅、四氯鍺、1, 2-二溴乙烷、1, 4-氯甲基苯、雙(三氯甲硅烷基)乙烷、環氧化亞麻仁油、甲苯二異氰酸酯、1, 2, 4-苯三異氰酸酯等。Although the component (D) of the present invention preferably contains a polymer obtained by the above method, and then a coupling agent is used to cause the polymer molecule to lock through the coupler residue to extend or diverge, the coupling agent used herein has Diethyl adipic acid, divinylbenzene, methyldichlorosilane, silicon tetrachloride, butyltrichlorosilane, tetrachlorotin, butyl trichlorotin, dimethyldichlorosilane, tetrachloroguanidine, 1,2-dibromoethane, 1, 4-chloromethylbenzene, bis(trichlorosilyl)ethane, epoxidized linseed oil, toluene diisocyanate, 1,2,4-benzene triisocyanate, and the like.
【0091】從耐衝擊點來看,上述嵌段聚合物內最好在嵌段(d-2)上,具有1~10個範圍讓芳香族乙烯化合物漸增的錐形塊聚合物、及/或經過偶合處理的徑向塊型。[0091] From the viewpoint of impact resistance, it is preferable that the block polymer has a tapered block polymer having a range of 1 to 10 in which the aromatic vinyl compound is gradually increased on the block (d-2), and/ Or a radial block that has been subjected to coupling processing.
【0092】此外,(D)成份也可使用部分或完全添加氫的上述嵌段共聚物之共軛二烯部分的碳-碳雙重結合;(D)成份的最佳添氫率為10~100%,50~100%更佳;從所得之組成物的耐氣候(光)性面來看,最好使用90%以上添氫物;此外,從低溫衝擊面來看,最好使用50%以上添氫率,未滿9%者。[0092] Further, the (D) component may also be a carbon-carbon double bond of the conjugated diene moiety of the above block copolymer partially or completely added with hydrogen; the optimum hydrogen addition rate of the component (D) is 10 to 100. %, 50~100% is better; from the weather-resistant (light) side of the obtained composition, it is better to use more than 90% of hydrogen-added materials; in addition, from the low-temperature impact surface, it is better to use more than 50% The rate of hydrogen addition is less than 9%.
【0093】可用既知的方法執行以上述方法所得之芳香族乙烯化合物單位為主的嵌段聚合物、及以共軛二烯化合物為主的嵌段聚合物所構成之聚合物添氫反應,此外也可用既知方法,藉由調整添氫率,以獲得標的聚合物;具體方法則有公開於特公昭42-8704號公報、特公昭43-6636號公報、特公昭63-4841號公報、特公昭63-5401號公報、特公平2-133406號公報、特公平1-297413上的方法。[0093] The polymer hydrogen-added reaction of the block polymer mainly composed of the aromatic vinyl compound unit obtained by the above method and the block polymer mainly composed of the conjugated diene compound can be carried out by a known method. It is also possible to obtain a target polymer by adjusting the hydrogen addition rate by a known method. The specific method is disclosed in Japanese Patent Publication No. Sho 42-8704, Japanese Patent Publication No. Sho 43-6636, Japanese Patent Publication No. Sho. No. 63-4841, and The method of the Japanese Patent Publication No. 63-5401, Japanese Patent Publication No. Hei 2-133406, and Japanese Patent Publication No. Hei1-297413.
【0094】本發明之第一熱塑性樹脂組成物的(D)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳範圍是1~200質量部、5~170質量部、10~170質量部亦佳,但15~150質量部更佳;在此範圍下予以使用後,可獲得卓越的耐衝擊性、耐藥品性之成形品。[0094] The (D) component of the first thermoplastic resin composition of the present invention has an optimum range of 1 to 200 mass parts and 5 to 170 masses for a total of 100 parts of the (A) component and the (B) component. The quality of the 10 to 170 parts is also good, but the quality of 15 to 150 is better. When it is used in this range, it can obtain excellent impact resistance and chemical resistance.
本發明之第二熱塑性樹脂組成物的(D)成份用量,對於(B)成份的100質量部而言,最佳範圍是1~200質量部、5~170質量部與10~170質量部亦佳,但15~150質量部最佳;在此範圍下予以使用後,可獲得卓越的耐衝擊性、耐藥品性之成形品。The amount of the component (D) of the second thermoplastic resin composition of the present invention is preferably in the range of 1 to 200 parts by mass, 5 to 170 parts by mass, and 10 to 170 parts by mass for the 100 parts by mass of the component (B). Good, but the best quality is 15~150. After using it in this range, it can obtain excellent impact resistance and chemical resistance.
本發明之第三熱塑性樹脂組成物的(D)成份用量,對於(B)成份與(C1)成份及與(D)成份的100質量部而言,最好是1~40質量%、5~40質量%與5~35質量%亦佳,但10~35質量部最佳;未滿1質量%時制電性的提升效果會不佳,但超過40質量%時耐藥品性及成形品表面外觀也會不佳。The amount of the component (D) of the third thermoplastic resin composition of the present invention is preferably from 1 to 40% by mass, based on 100 parts by mass of the component (B) and (C1) and (D). 40% by mass and 5 to 35% by mass are also good, but 10 to 35 parts are the best; when less than 1% by mass, the effect of improving the electrical conductivity is not good, but when it exceeds 40% by mass, the chemical resistance and the surface appearance of the molded article It will also be bad.
【0095】[6](E)成份本發明之(E)成份是在存在上述(D)成份下,(共)聚合芳香族乙烯化合物、或可共聚芳香族乙烯化合物及芳香族乙烯化合物之其他乙烯單體而成的接枝共聚物,在此所用之香族乙烯化合物、或可共聚芳香族乙烯化合物及芳香族乙烯化合物之其他乙烯單體,可以使用(A)成份之乙烯單體(b)所述之所有物質,最佳的單體組合則是,苯乙烯/丙烯腈、苯乙烯/丙烯腈/甲基丙烯酸甲酯。[6] (E) Component The component (E) of the present invention is a (co)polymerized aromatic vinyl compound, or a copolymerizable aromatic vinyl compound and an aromatic vinyl compound in the presence of the above component (D). A graft copolymer of an ethylene monomer, an aromatic vinyl compound used herein, or a copolymerizable aromatic vinyl compound and another ethylene monomer of an aromatic vinyl compound, an ethylene monomer of the component (A) can be used (b) The best monomer combination for all of the materials described is styrene/acrylonitrile, styrene/acrylonitrile/methyl methacrylate.
【0096】在此所用之(D)成份雖皆可使用前述物質,但最好能添氫共軛二烯化合物單位的碳-碳雙重結合,添氫90%以上共軛二烯化合物單位的碳-碳雙重結合亦佳,但添氫95%以上更佳。[0096] Although the above-mentioned materials can be used for the component (D) used herein, it is preferable to add a carbon-carbon double bond of a hydrogen conjugated diene compound unit, and add hydrogen of 90% or more of a conjugated diene compound unit of carbon. - Carbon double bonding is also good, but more than 95% hydrogen is added.
【0097】本發明之(E)成份,在存在(D)成份之下,可藉由接枝聚合上述單體成份而獲得,但(E)成份中的(D)成份量的範圍是10~60質量%,接枝率最好在20~80質量%。[0097] The component (E) of the present invention can be obtained by graft polymerization of the above monomer component in the presence of the component (D), but the amount of the component (D) in the component (E) is in the range of 10~ 60% by mass, the graft ratio is preferably from 20 to 80% by mass.
這種聚合物可用(A)成份之前述溶液聚合、塊狀聚合、懸浮聚合及組合聚合方法予以製造;所得之接枝聚合物上,通常都含有在(D)成份上接枝共聚上述單體成份之共聚物、及未在橡膠質聚合物上接枝的未接枝成份〔單體成份的(共)聚物〕。The polymer may be produced by the above solution polymerization, bulk polymerization, suspension polymerization and combined polymerization of the component (A); the graft polymer obtained generally comprises graft copolymerizing the monomer on the component (D). a copolymer of a component, and a ungrafted component (a (co)polymer of a monomer component) which is not grafted on a rubbery polymer.
【0098】本發明之第一熱塑性樹脂組成物的(E)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳範圍是1~200質量部、5~170質量部、10~170質量部亦佳,但15~150質量部更佳;在此範圍下予以使用後,可獲得卓越的耐衝擊性之成形品。[0098] The (E) component of the first thermoplastic resin composition of the present invention has an optimum range of 1 to 200 mass parts and 5 to 170 masses for a total of 100 parts of the (A) component and the (B) component. Department, 10~170 quality parts are also good, but 15~150 quality parts are better; after being used in this range, excellent impact resistance molded articles can be obtained.
【0099】[7](F)成份本發明之(F)成份屬於,(D)成份所構成之嵌段聚合物(f-1)、芳香族碳酸酯嵌段聚合物(f-2)所構成之芳香族聚碳酸酯嵌段共聚物;(D)成份之分子末端最好具有和芳香族聚碳酸酯呈反應的官能團,這些官能團則有氫氧基、羧基、環氧基、異氰酸酯基等,其中最佳的是氫氧基、羧基,但以氫氧基更佳;這些官能團,最好附加於芳香族乙烯化合物嵌段(d-1)分子末端上;相關官能團則有存在於(D)成份兩末端及一端,但以耐衝擊面來看,一端者較佳;再者,官能團不需具有所有分子,每1分子最好平均在0.5個以上,但0.7~2個範圍更佳。[0099] [7] (F) component The component (F) of the present invention belongs to the block polymer (f-1) composed of the component (D), and the aromatic carbonate block polymer (f-2) The aromatic polycarbonate block copolymer is composed; the molecular terminal of the component (D) preferably has a functional group reactive with the aromatic polycarbonate, and the functional group has a hydroxyl group, a carboxyl group, an epoxy group, an isocyanate group, or the like. Among them, the most preferred ones are hydroxyl groups and carboxyl groups, but more preferably hydroxyl groups; these functional groups are preferably attached to the terminal of the aromatic vinyl compound block (d-1); the relevant functional groups are present in (D). The two ends and one end of the component, but one end is better in terms of impact resistance; further, the functional group does not need to have all molecules, and the average of each molecule is preferably 0.5 or more, but 0.7 to 2 ranges are better.
【0100】將官能團引進分子末端的方法,則可使用既知的方法;例如在存在有機鹼金屬化合物之下,聚合芳香族乙烯化合物與共軛二烯化合物以獲得之聚合物的活性點上,反應含有前述官能團之化合物的方法;以及將環氧乙烷、環氧丙烷附加於嵌段共聚物的末端後,添加酒精類、羧酸類、水等活性氫化合物,以停止陰離子聚合,並將氫氧基引進末端的方法;以及低溫吹入二氧化碳,以停止陰離子聚合,並將羧酸基引進末端的方法。[0100] A method of introducing a functional group into a molecular terminal may be carried out by a known method; for example, by reacting an aromatic vinyl compound with a conjugated diene compound to obtain an active point of a polymer in the presence of an organic alkali metal compound, a method of containing a compound having the aforementioned functional group; and adding ethylene oxide or propylene oxide to the end of the block copolymer, adding an active hydrogen compound such as an alcohol, a carboxylic acid or water to stop anionic polymerization and oxyhydrogen a method of introducing a terminal at the base; and a method of blowing carbon dioxide at a low temperature to stop anionic polymerization and introducing a carboxylic acid group to the terminal.
上述分子末端上的官能團所具備的(D)成份,可用既知方法在共軛二烯化合物單位的碳-碳雙重結合上添加氫,也可用前述既知方法針對(D)成份添加氫。The (D) component of the functional group at the terminal of the above molecule may be hydrogen-added to the carbon-carbon double bond of the conjugated diene compound unit by a known method, or hydrogen may be added to the component (D) by the aforementioned known method.
【0101】嵌段聚合物(f-2)屬於芳香族聚碳酸酯,可使用藉由各種羥基芳基化合物與光氣(Phosgene)之間的界面聚縮合予以獲得;也可藉由二羥基芳基化合物與二苯基碳酸酯等碳酸酯化合物之間的酯交換(溶融聚縮合)予以獲得等,透過既知的聚合法予以獲得的物質。[0101] The block polymer (f-2) is an aromatic polycarbonate which can be obtained by interfacial polycondensation between various hydroxyaryl compounds and phosgene (Phosgene); The product obtained by a known polymerization method is obtained by transesterification (melt polycondensation) between a base compound and a carbonate compound such as diphenyl carbonate.
芳香族聚碳酸酯的原料二羥基芳基化合物則有,雙苯酚A、對苯二酚、2, 2-雙(4-羥苯基)戊烷、2, 4-二羥基二苯甲烷、雙(2-羥苯基)甲烷、雙(4-羥苯基)甲烷等,其中以雙苯酚A最佳。The raw material dihydroxy aryl compound of aromatic polycarbonate is bisphenol A, hydroquinone, 2,2-bis(4-hydroxyphenyl)pentane, 2,4-dihydroxydiphenylmethane, double (2-Hydroxyphenyl)methane, bis(4-hydroxyphenyl)methane, etc., among which bisphenol A is most preferred.
本發明所用之芳香族聚碳酸酯的最佳黏度平均分子量為8,000~50,000,12,000~30,000亦佳,15,000~26,000更佳;此外,也可適當併用不同的黏度平均分子量。The aromatic polycarbonate used in the present invention has an optimum viscosity average molecular weight of 8,000 to 50,000, preferably 12,000 to 30,000, more preferably 15,000 to 26,000. Further, different viscosity average molecular weights may be suitably used in combination.
【0102】再者,芳香族聚碳酸酯的黏度平均分子量,是以氯化甲叉為溶劑,可將在20℃、濃度0.7g/100ml(氯化甲叉)條件下所測量的比黏度(ηs p )插入於以下化學式(3)以作計算。[0102] Furthermore, the viscosity average molecular weight of the aromatic polycarbonate is a specific viscosity measured at 20 ° C and a concentration of 0.7 g / 100 ml (methylene chloride) under the condition of methyl chloride. η s p ) is inserted in the following chemical formula (3) for calculation.
黏度平均分子量=〔(ηs p ×8130)1 . 2 0 5 ………(3)在此的〔η〕=〔(ηs p ×1.12+1)1 / 2 -1〕/0.56C(C表示濃度)【0103】本發明之(F)成份雖可用,將官能團引進上述末端的(D)成份官能基變性嵌段(f-1)、及上述芳香族碳酸酯嵌段聚合物(f-2)所構成之(i)嵌段(f-1)與嵌段(f-2)的溶融混練方法、(ii)存在嵌段(f-1)的情況下,聚合嵌段(f-2)的方法、(iii)在聚合嵌段(f-2)的最終階段添加嵌段(f-1)以進行反應等方法予以製造,但工業上的最佳方法則是上述(i)。Viscosity average molecular weight = [(η s p × 8130) 1 . 2 0 5 ......... (3) In this [[eta]] = [(η s p × 1.12 + 1 ) 1/2 -1 ] /0.56C(C Indicative concentration) [0103] The (F) component of the present invention, although useful, introduces a functional group into the terminal (D) component functional group denatured block (f-1), and the above aromatic carbonate block polymer (f- 2) The method of melt-kneading the (i) block (f-1) and the block (f-2), and (ii) the case where the block (f-1) is present, the polymer block (f-2) The method (iii) is carried out by adding a block (f-1) at the final stage of the polymerization block (f-2) to carry out a reaction, etc., but the industrially preferred method is the above (i).
此外,(F)成份上的(D)成份/(f-2)成份的最佳質量比範圍是95/5~5/95,80/20~20/80亦佳,但70/30~30/70更佳。In addition, the optimum mass ratio range of (D) component/(f-2) component of (F) component is 95/5~5/95, 80/20~20/80 is also good, but 70/30~30 /70 is better.
【0104】本發明之(D)成份與(f-2)成份,都不需變成嵌段共聚物,只要至少10質量%以上呈嵌段共聚物,即達成本發明目的。The component (D) and the component (f-2) of the present invention do not need to be a block copolymer, and as long as at least 10% by mass or more is a block copolymer, the object of the present invention is attained.
這種嵌段共聚物混合物,可用例如特開2001-220506號公報上所記載的方法予以製造;再者,本發明之(F)成份可從KURARAY公司製TM聚合物系列的TM-S4L77、TM-H4L77(商品名稱)等取得。Such a block copolymer mixture can be produced by a method described in, for example, JP-A-2001-220506. Further, the component (F) of the present invention can be obtained from KURARAY's TM polymer series TM-S4L77, TM. -H4L77 (product name), etc.
【0105】本發明之第一熱塑性樹脂組成物的(F)成份,對於(A)成份與(B)成份的合計100質量部而言,最佳範圍是1~200質量部、5~170質量部、10~170質量部亦佳,但15~150質量部更佳;在此範圍下予以使用後,可獲得卓越的耐衝擊性之成形品。[0105] The (F) component of the first thermoplastic resin composition of the present invention has an optimum range of 1 to 200 mass parts and 5 to 170 masses for a total of 100 parts of the (A) component and the (B) component. Department, 10~170 quality parts are also good, but 15~150 quality parts are better; after being used in this range, excellent impact resistance molded articles can be obtained.
【0106】[8](G)成份本發明之(G)成份屬於,以不飽和酸及/或不飽和酸酐而變性之低分子量聚烯;在此所用的低分子量聚烯則為本發明之(B)成份中的低分子量體,其中最佳的是低分子量聚丙烯、或低分子量聚乙烯。[0106] [8] (G) component The component (G) of the present invention belongs to a low molecular weight polyene which is denatured with an unsaturated acid and/or an unsaturated acid anhydride; the low molecular weight polyene used herein is the present invention. (B) A low molecular weight body in the composition, of which the most preferred is a low molecular weight polypropylene, or a low molecular weight polyethylene.
【0107】上述低分子量聚烯的重量平均分子量最佳為1,000~100,000,5,000~60,000亦佳,但8,000~50,000更佳;該低分子量聚烯可用聚合法或高分子量聚烯的熱減法予以獲得;由於容易進行不飽和酸及/或不飽和酸酐變性,因此最好使用熱減法;藉由熱減法之低分子量聚烯,是讓高分子量聚烯處於不活性氣體中,在300℃乃至450℃條件下,熱減0.5小時~10小時方法(例如:特開平3-62804號公報式的記載方法)便可獲得。[0107] The weight average molecular weight of the above low molecular weight polyene is preferably from 1,000 to 100,000, preferably from 5,000 to 60,000, but more preferably from 8,000 to 50,000; the low molecular weight polyene can be obtained by thermal reduction of a polymerization method or a high molecular weight polyolefin. Because of the ease of denaturation of unsaturated acids and/or unsaturated anhydrides, it is preferred to use a thermal subtraction method; the low molecular weight polyene by thermal subtraction is such that the high molecular weight polyene is in an inert gas at 300 ° C or even 450 ° C. Under the conditions, a method of heat reduction of 0.5 hours to 10 hours (for example, the method described in JP-A-3-62804) can be obtained.
【0108】在此所用的不飽和酸則有,例如丙烯酸、甲基丙烯酸、巴豆酸、桂皮酸、衣康酸、馬來酸等,這些都可單獨使用1種,也可組合2種以上;此外,不飽和酸酐則有,馬來酸酐、衣康酸酐、一氯衣康酸酐、一氯馬來酸酐、檸康酸酐等,這些都可單獨使用1種,也可組合2種以上;其中最佳的是馬來酸酐。[0108] The unsaturated acid used herein may be, for example, acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, itaconic acid, maleic acid, etc., and these may be used alone or in combination of two or more; Further, as the unsaturated acid anhydride, maleic anhydride, itaconic anhydride, monochloroicic anhydride, monochloromaleic anhydride, citraconic anhydride, etc. may be used alone or in combination of two or more; The best is maleic anhydride.
【0109】本發明之(G)成份,將低分子量聚烯質量視為100%後,最好是以0.5~25質量%,1~20質量%,但3~15質量%更佳的不飽和酸及/或不飽和酸酐所變性者,例如視其需要在低分子量聚烯上存在不飽和酸及/或不飽和酸酐有機過氧化物,以便藉由溶液法或溶融法的變性予以獲得;此外,符合本發明(G)成份之材料,可向三洋化成工業公司製UMEX 1001、1003、1010、100TS、110TS、2000、CA60(商品名稱)等予以購得。[0109] The component (G) of the present invention, after considering the quality of the low molecular weight polyolefin as 100%, is preferably 0.5 to 25% by mass, 1 to 20% by mass, but more preferably 3 to 15% by mass. If the acid and/or the unsaturated acid anhydride are denatured, for example, an unsaturated acid and/or an unsaturated acid anhydride organic peroxide is present on the low molecular weight polyene as needed, so as to be obtained by denaturation by a solution method or a melting method; The material which is in accordance with the component (G) of the present invention can be obtained from UMEX 1001, 1003, 1010, 100TS, 110TS, 2000, CA60 (trade name) manufactured by Sanyo Chemical Industries Co., Ltd., and the like.
【0110】本發明之第一熱塑性樹脂組成物的(G)成份,對於(A)成份與(B)成份的合計100質量部而言,可用於最佳範圍1~200質量部、1~50質量部與1~45質量部亦佳,但2~40質量部更佳;未滿1質量部時,防靜電性會不佳,超過50質量部後,耐衝擊性與防靜電性會不佳。(01) The (G) component of the first thermoplastic resin composition of the present invention can be used in an optimum range of 1 to 200 mass parts, 1 to 50 for a total of 100 parts by mass of the (A) component and the (B) component. The quality department is better than the 1~45 quality part, but the 2~40 quality part is better. When the quality part is less than 1 part, the antistatic property will be poor. After exceeding 50 parts, the impact resistance and antistatic property will be poor. .
【0111】本發明之(D)(E)(F)及(G)成份,是提升本發明熱塑性樹脂組成物成份之間的相溶性、及其他各種特性的有效成份,可從各成份中至少選擇1種或2種以上的搭配下予以使用;此外,也可使用從(D)(E)(F)及(G)成份中所選擇之1種或2種以上的組合;併用2種以上(D)(E)(F)及(G)之任一成份時,這些成份的合計量,對於(A)成份與(B)成份5~100質量部更佳。[0111] The components (D)(E)(F) and (G) of the present invention are effective components for improving the compatibility between the components of the thermoplastic resin composition of the present invention and various other characteristics, and may be at least from each component. One or a combination of two or more types may be used, and one or a combination of two or more selected from the group consisting of (D) (E) (F) and (G) may be used. (D) In the case of any of (E) (F) and (G), the total amount of these components is preferably 5 to 100 parts by mass of the component (A) and the component (B).
本發明之熱塑性樹脂組成物若以烯系聚合物為主體時,調配上述(D)成份後,便會提高與組成物成份間的相溶性,進而提升整體的耐衝擊性、耐藥品性、成形品的表面外觀、防靜電性乃至制電性;併用上述(D)成份與上述(G)成份時,會更佳提升上述各特性。When the thermoplastic resin composition of the present invention is mainly composed of an ethylenic polymer, the compatibility of the component (D) is improved, and the compatibility with the composition is improved, thereby improving the overall impact resistance, chemical resistance, and formation. The surface appearance, antistatic property and even electrical conductivity of the product; when the above (D) component and the above (G) component are used together, the above characteristics are better improved.
在此,以烯系聚合物為主體時是指,本發明之熱塑性樹脂組成物符合以下公式時:公式:{(B)+(C1)}/{(A)+(B)+(C1)}≧0.4(公式中的(A)(B)(C1)各表示(A)成份、(B)成份、(C1)成份含量(質量標準))此外,本發明之熱塑性樹脂組成物若以苯乙烯系聚合物為主體時,調配上述(E)成份及/或(F)成份後,會提高防靜電性乃至制電性。Here, the term "olefinic polymer as a main component" means that the thermoplastic resin composition of the present invention conforms to the following formula: Formula: {(B) + (C1)} / {(A) + (B) + (C1) }≧0.4 ((A)(B)(C1) in the formula each represents (A) component, (B) component, (C1) component content (quality standard). Further, the thermoplastic resin composition of the present invention is benzene. When the ethylene-based polymer is mainly used, when the component (E) and/or the component (F) are blended, the antistatic property and the electrical properties are improved.
在此,以苯乙烯系聚合物為主體時是指,本發明之熱塑性樹脂組成物符合以下公式時:公式:{(B)+(C1)}/{(A)+(B)+(C1)}<0.4(公式中的(A)(B)(C1)各表示(A)成份、(B)成份、(C1)成份含量(質量標準))【0112】本發明之熱塑性樹脂組成物,可藉由各種壓出機、班伯里混練機、捏和機、連續捏和等方式,以溶融與混練各成份等方法以混練與調製;最佳的製法是用壓出機,特佳方法則是多軸壓出機、或組合壓出機、班伯里混練機、連續捏和等方法。Here, the term "styrene-based polymer as a main component" means that the thermoplastic resin composition of the present invention conforms to the following formula: Formula: {(B) + (C1)} / {(A) + (B) + (C1 )}<0.4 ((A)(B)(C1) in the formula each represents (A) component, (B) component, (C1) component content (quality standard) [0112] The thermoplastic resin composition of the present invention, It can be mixed and tempered by various methods such as melting and kneading various components by means of various extruders, Banbury mixers, kneaders, continuous kneading, etc. The best method is to use an extruder, a special method. It is a multi-axis extruder, or a combination extruder, a Banbury mixer, continuous kneading and the like.
再者,混練各成份時,也可一次混練這些成份,或多段或分割調配混練。In addition, when mixing the ingredients, you can mix these ingredients at the same time, or mix them in multiple stages or splits.
【0113】本發明之熱塑性樹脂組成物,可調配既知的無機或有機填充材;在此所用的無機填充材是指,玻璃纖維、玻璃片、玻璃纖維的MildFiber、玻璃珠、中空玻璃、碳纖維、碳纖維的MildFiber、滑石粉、碳酸鈣、碳酸鈣鬚、硅灰石、雲母、高嶺土、蒙脫石、鋰蒙脫石、氧化鋅鬚、鈦酸鉀鬚、硼酸鋁鬚、氧化鋁板、矽板、有機處理過後的蒙脫石、芳香族聚醯胺、聚酯纖維,這些都可單獨使用1種,也可組合2種以上。[0113] The thermoplastic resin composition of the present invention may be formulated with a known inorganic or organic filler; the inorganic filler used herein means glass fiber, glass flake, glass fiber MildFiber, glass beads, hollow glass, carbon fiber, Carbon fiber MildFiber, talc, calcium carbonate, calcium carbonate whisker, wollastonite, mica, kaolin, montmorillonite, hectorite, zinc oxide whisker, potassium titanate whisker, aluminum borate whisker, alumina plate, seesaw, The montmorillonite, the aromatic polyamine, and the polyester fiber after the organic treatment may be used alone or in combination of two or more.
此外,為了提升上述填充材的分散性,也可使用已既知的偶合劑、表面處理劑、會聚劑等處理過的物質,既知的偶合劑則有硅烷系偶合劑、鈦酸酯系偶合劑、鋁系偶合劑等。Further, in order to enhance the dispersibility of the filler, a known compound such as a coupling agent, a surface treatment agent, or a polymerization agent may be used, and a known coupling agent may be a silane coupling agent or a titanate coupling agent. Aluminum coupling agent, etc.
對於本發明之熱塑性樹脂組成物100質量部而言,上述無機或有機填充材的使用範圍一般都在1~200質量部,但1~100質量部最佳。In the mass portion of the thermoplastic resin composition of the present invention, the inorganic or organic filler is generally used in an amount of from 1 to 200 parts by mass, but preferably from 1 to 100 parts by mass.
【0114】本發明之熱塑性樹脂組成物上可調配既知的耐氣候(光)劑、防靜電劑、防氧化劑、潤滑劑、可塑劑、著色劑、染料、結晶核劑、抗菌劑、防霉劑、發泡劑、難燃劑(磷系難燃劑、氮系難燃劑、鹵系難燃劑、矽系難燃劑)、難燃助劑(氧化銻化合物、PREF等、氯化聚乙烯)等。[0114] The thermoplastic resin composition of the present invention can be formulated with known weathering (light) agents, antistatic agents, antioxidants, lubricants, plasticizers, colorants, dyes, crystal nucleating agents, antibacterial agents, and antifungal agents. , foaming agent, flame retardant (phosphorus flame retardant, nitrogen flame retardant, halogen flame retardant, barium flame retardant), flame retardant aid (yttria compound, PREF, etc., chlorinated polyethylene )Wait.
【0115】再者,本發明之熱塑性樹脂組成物為其他既知之聚合物,也得以適當調配聚醯樹脂、聚酯樹脂、PMMA、甲基丙烯酸甲基、馬來酸酐縮亞胺化合物共聚物、聚苯撐醚、聚環氧甲叉、聚苯撐亞硫酸根、環氧樹脂、苯酚樹脂、EVA、EVOH、EBE、LCP、熱塑性聚氨酯、芳香族聚碳酸酯、尿素樹脂、苯氧基樹脂等。Further, the thermoplastic resin composition of the present invention is another known polymer, and is also suitably blended with a polyfluorene resin, a polyester resin, a PMMA, a methyl methacrylate, a maleic anhydride imide compound copolymer, Polyphenylene ether, polyepoxymethane, polyphenylene sulfite, epoxy resin, phenol resin, EVA, EVOH, EBE, LCP, thermoplastic polyurethane, aromatic polycarbonate, urea resin, phenoxy resin, etc. .
【0116】調製之本發明熱塑性樹脂組成物,可藉由射出成形、加壓成形、薄板成形、薄膜成形、真空成形、異形壓出成形、發泡成形等既知成形法,以獲得成形品;此外,也可將本發明之熱塑性樹脂組成物視為表層,以多層壓出成形獲得將聚烯系樹脂、苯乙烯系樹脂視為內層或中間層的成形品,此外也可藉由真空成形多層薄板以獲得目的成形品;這些成形法所得之成形品如下所示。The thermoplastic resin composition of the present invention prepared by the present invention can be obtained by a molding method such as injection molding, press molding, sheet molding, film molding, vacuum molding, profile extrusion molding, or foam molding to obtain a molded article; The thermoplastic resin composition of the present invention may be regarded as a surface layer, and a molded article in which a polyolefin resin or a styrene resin is regarded as an inner layer or an intermediate layer may be obtained by multi-lamination molding, or a multilayer formed by vacuum forming may be used. A thin plate is obtained to obtain a molded article of interest; the molded article obtained by these molding methods is as follows.
【0117】各種齒輪、各種箱盒、感測器、LEP燈、連接器、插座、電阻器、繼電器盒、晶圓盒、IC托盤、液晶托盤、開關、線圈繞線管、電容器、可變電容器盒、光拾波器零組件、震盪子、各種端子板、變壓器、插頭、印刷電路板、調頻器、擴音器、麥克風、耳機、小型馬達、磁頭座、功率模組、機殼、半導體、液晶FDD載物架、FDD底盤、馬達毛刷支架、拋物線形天線、電腦相關零件等所代表之電氣、電子零件;VTR零件、電視零件、電熨斗、吹風機、電鍋零件、微波爐零件、音響零件、音響雷射光碟(註冊商標)、小型光碟音聲器材零件、照明零件、冰箱零件等所代表之家庭.OA電氣產品零件;OA相關零件、電話相關零件、傳真機相關零件、影印機相關零件、洗滌用具相關零件;馬桶、桶蓋、機殼、廚房周圍零件、洗臉台相關零件、浴室相關零件等衛生相關零件;窗框、家具、地板材、牆壁材等住宅、住設相關零件;顯微鏡、雙眼望遠鏡、相機、鐘錶等所代表之光學器材、精密器材相關零件;交流發電機終端、交流發電機連接器、IC調節器、排氣閥各種閥類、燃料相關、排氣系統、吸氣系統各種閥類;進氣噴嘴通氣管、進氣連座、燃料幫浦、引擎冷卻水接頭、化油器主體、化油器隔片、排氣感測器、冷卻水感測器、油溫感測器、剎車墊感測器、節流定位感測器曲柄軸定位感測器、空氣流動計、空調用恆溫頭、暖氣溫風控制閥、散熱器馬達用毛刷支架、水幫浦葉輪、渦輪管、雨刷馬達相關零件、配電盤、啟動開關、啟動繼電器、變速箱專用雨刷電氣配線、車窗噴嘴、空調面板開關電路板、燃料相關電磁閥專用線圈繞線管、保險絲用連接器、喇叭終端、墊裝零件絕緣板、步進馬達滾輪、燈座、燈管顯示器、燈殼、剎車活塞、螺線型繞線管、引擎油過濾器、點火裝置盒;電腦、列表機、顯示器、CRT顯示器、筆記型電腦、行動電話、PHS、DVD播放機、PD播放機、軟碟機等記憶裝置機殼、底殼、繼電器、開關、外殼構件、變壓器構件、線圈繞線管等電氣、電子器材零件;保險桿、檔泥板等車用外裝構件、其他各種用途。[0117] Various gears, various boxes, sensors, LEP lamps, connectors, sockets, resistors, relay boxes, wafer cassettes, IC trays, liquid crystal trays, switches, coil bobbins, capacitors, variable capacitors Box, optical pickup components, oscillators, various terminal boards, transformers, plugs, printed circuit boards, frequency modulators, amplifiers, microphones, earphones, small motors, magnetic head holders, power modules, housings, semiconductors, Electrical and electronic parts represented by liquid crystal FDD carriers, FDD chassis, motor brush holders, parabolic antennas, computer-related parts, etc.; VTR parts, TV parts, electric irons, hair dryers, electric cooker parts, microwave oven parts, audio parts , audio laser disc (registered trademark), small disc audio equipment parts, lighting parts, refrigerator parts, etc. represented by the family. OA electrical product parts; OA related parts, telephone related parts, fax machine related parts, photocopying machine related parts, washing utensils related parts; toilet, lid, casing, kitchen parts, washstand related parts, bathroom related parts, etc. Related parts; window frames, furniture, flooring, wall materials, etc., housing related parts; optical equipment, precision equipment related parts represented by microscopes, binoculars, cameras, clocks, etc.; alternator terminals, alternators Connector, IC regulator, exhaust valve, various valves, fuel related, exhaust system, suction system, various valves; intake nozzle snorkel, intake seat, fuel pump, engine cooling water connector, carburetor Main body, carburetor spacer, exhaust sensor, cooling water sensor, oil temperature sensor, brake pad sensor, throttle positioning sensor crankshaft positioning sensor, air flow meter, air conditioner Thermostatic head, heating and temperature control valve, brush holder for radiator motor, water pump impeller, turbine tube, wiper motor related parts, switchboard, start switch, start relay Wiper, transmission window wiper wiring, window nozzle, air conditioning panel switch circuit board, fuel-related solenoid valve coil coil, fuse connector, speaker terminal, padded component insulation board, stepper motor wheel, lamp holder , lamp display, lamp housing, brake piston, spiral bobbin, engine oil filter, ignition box; computer, list machine, display, CRT display, notebook, mobile phone, PHS, DVD player, PD Electrical and electronic equipment parts such as memory devices such as players and floppy disk drives, chassis, relays, switches, housing components, transformer components, and coil bobbins; exterior components for bumpers, fenders, etc. Various uses.
【0118】將本發明之熱塑性樹脂組成物加工成薄板、薄膜時的厚度,最好在10μm~100mm範圍。The thickness of the thermoplastic resin composition of the present invention when processed into a sheet or a film is preferably in the range of 10 μm to 100 mm.
上述薄板、薄膜可以是單層薄板、薄膜,也可以是母材至少有一面上有積層之多層成形品,也可以是積層黏著劑等薄板、薄膜;再者,前述薄板、薄膜上也可形成出既知氣體防護膜。The thin plate or the film may be a single-layer thin plate or a film, or may be a multilayer molded article in which at least one side of the base material is laminated, or may be a thin plate or a film such as a build-up adhesive; in addition, the thin plate or the film may be formed. Know the gas protective film.
【0119】用本發明之熱塑性樹脂組成物製作多層薄板、薄膜時,本發明之熱塑性樹脂組成物可將母材的2層薄板、薄膜或母材視為中間層的3層薄板、薄膜等,在此所用的母材可用既知聚合物所構成之薄板、薄膜,其中最好使用本發明之(A)成份或(B)成份所構成之薄板、薄膜,尤其是烯系樹脂所構成之薄板、薄膜最佳;再者,為了提升剛性與耐熱性,也可使用前述無機、有機填充材的調配物。When a multilayer thin plate or a film is produced from the thermoplastic resin composition of the present invention, the thermoplastic resin composition of the present invention can be used as a three-layered sheet, a film, or the like of an intermediate layer. The base material used herein may be a sheet or a film composed of a known polymer. Among them, a sheet made of the component (A) or the component (B) of the present invention, a film, particularly a sheet made of an olefin resin, is preferably used. The film is optimal; furthermore, in order to improve rigidity and heat resistance, the above-mentioned inorganic or organic filler formulation can also be used.
為了穩定的發現制電性,上述多層薄板之本發明熱塑性樹脂組成物的厚度最好是10μm以上,50μm以上亦佳,但80μm以上的厚度更佳;要獲得這種多層薄板、薄膜,最佳的方法就是透過T Die進行共同壓出,及用吹塑進行共同壓出:用這種方法所得之薄板、薄膜,可視其需要以真空成形等獲得托盤等成形品。In order to stably find the electrical conductivity, the thickness of the thermoplastic resin composition of the present invention of the above-mentioned multilayered sheet is preferably 10 μm or more, more preferably 50 μm or more, but more preferably 80 μm or more; and it is preferable to obtain such a multilayer sheet and film. The method is to perform co-extrusion by T Die and co-extrusion by blow molding: a thin plate or a film obtained by this method can be obtained by vacuum forming or the like as a molded article.
圖1表示本發明之多層成形品例,係屬本發明之熱塑性樹脂組成物所構成之防靜電層12,被配置於基層11單面的2層型成形品1的概略剖面圖;此外,圖2表示本發明之多層成形品的其他例,係屬本發明之熱塑性樹脂組成物所構成之防靜電層12a及12b,被配置於基層11雙面的3層型成形品2的概略剖面圖;再者,防靜電層12a及12b的厚度可以互相相同,也可互為不同;此外,防靜電層12a及12b的組成可以互相相同,也可互為不同。1 is a schematic cross-sectional view showing an example of a multilayer molded article of the present invention, which is an antistatic layer 12 composed of a thermoplastic resin composition of the present invention, and a two-layer molded article 1 disposed on one surface of a base layer 11; 2 is a schematic cross-sectional view showing another example of the multilayer molded article of the present invention, which is an antistatic layer 12a and 12b composed of the thermoplastic resin composition of the present invention, and a three-layer molded article 2 disposed on both sides of the base layer 11; Furthermore, the thickness of the antistatic layers 12a and 12b may be the same or different from each other; in addition, the compositions of the antistatic layers 12a and 12b may be identical to each other or may be different from each other.
【0120】為了提升黏著劑之間的黏著性或底漆層之間的黏著性,製造黏著薄板、薄膜時,可用既知的各種處理方法,例如:電暈放電處理、火焰處理、氧化處理、電漿處理、UV處理、Ionbombard處理、溶劑處理等方式,來處理本發明之熱塑性樹脂組成物所構成的母材薄板、母材薄膜表面;此外,可視其需要進行組合處理。[0120] In order to improve the adhesion between the adhesives or the adhesion between the primer layers, when manufacturing the adhesive sheets and films, various known treatment methods such as corona discharge treatment, flame treatment, oxidation treatment, and electricity can be used. The surface of the base material sheet and the base material film composed of the thermoplastic resin composition of the present invention are treated by a slurry treatment, a UV treatment, an Ionbombard treatment, a solvent treatment or the like; and a combination treatment may be carried out as needed.
再者,為了提升母材薄板、薄膜與黏著劑之間的黏著力,可直接在母材薄板、薄膜上,或在上述表面處理面上形成底漆層;具體而言,讓聚乙烯亞胺、聚氨酯或丙烯樹脂等樹脂,形成出極薄的0.1μm~10μm厚度層;通常,可塗佈溶劑(包含水)溶液,再藉由乾燥予以形成。Furthermore, in order to improve the adhesion between the base metal sheet and the film and the adhesive, a primer layer may be formed directly on the base material sheet, the film, or on the surface treatment surface; specifically, the polyethyleneimine is allowed. A resin such as polyurethane or acryl resin forms an extremely thin layer having a thickness of 0.1 μm to 10 μm; usually, a solvent (including water) solution can be applied and formed by drying.
【0121】黏著劑可分為,用篩網法、凹版法、網眼法、Bar塗工法等塗工乳膠型、有機溶劑型、壓出層壓法、乾層壓法及共同壓出法等所形成之熱溶融型等,任何一種皆可使用;此外,雖無特別規定黏著劑的厚度,但通常是在1~10μm範圍。[0121] Adhesives can be classified into a latex type, an organic solvent type, an extrusion lamination method, a dry lamination method, a co-extrusion method, etc. by a screen method, a gravure method, a mesh method, a Bar coating method, and the like. Any of the formed hot melt types and the like can be used; in addition, although the thickness of the adhesive is not particularly specified, it is usually in the range of 1 to 10 μm.
【0122】所得之成形品可用於繼電器盒、晶圓盒、Retucule case、Acth case等盒類、液晶托盤、晶片托盤、記憶體托盤、CCD托盤、IC托盤等托盤類、IC載體等載體類、偏振光膠膜保護薄板、偏振光薄膜裁斷時的保護薄膜、液晶顯示裝置、電漿顯示器等保護薄膜、半導體相關保護薄膜、無塵室內保護薄膜等薄膜類,自動販賣機內部構件等領域。[0122] The obtained molded article can be used for a carrier such as a relay box, a wafer cassette, a Retucule case, an Acth case, a liquid crystal tray, a wafer tray, a memory tray, a CCD tray, an IC tray, or the like, and an IC carrier. The polarizing film protects the thin plate, the protective film when the polarizing film is cut, the protective film such as a liquid crystal display device or a plasma display, a semiconductor-related protective film, a film such as a dust-free indoor protective film, and the internal components of a vending machine.
【0123】以下將列舉實施例,以更詳細說明本發明,但只要不超過本發明主旨,本發明即不受限於相關實施例;再者,實施例中的部及%,乃屬無法不可捨棄之質料標準;另外,實施例、比較例中的各種測量,皆依據以下方法。The present invention will be described in more detail below by way of examples, but the present invention is not limited to the embodiments as long as it does not exceed the gist of the present invention; further, the parts and % in the examples are not indispensable. The discarded material standards; in addition, the various measurements in the examples and comparative examples are based on the following methods.
【0124】[1]評估方法(1)橡膠質聚合物凝膠含率;依據前述方法(2)橡膠質聚合物乳膠平均粒徑;以散光法測量用於形成(A)成份之橡膠質聚合物乳膠平均粒徑;測量儀器則用大塚電子公司製LPA-3100型,而用累計70次的累計法;再者,用電子顯微鏡已確認出,(A)成份中的分散接枝化橡膠質聚合物粒徑幾乎同於乳膠粒徑。[0124] [1] Evaluation method (1) rubbery polymer gel content; according to the above method (2) rubbery polymer latex average particle diameter; astigmatism method for forming (A) component rubbery polymerization The average particle size of the latex was measured by the LPA-3100 type manufactured by Otsuka Electronics Co., Ltd., and the cumulative method of 70 times was used. Furthermore, it was confirmed by electron microscopy that the dispersed grafted rubbery substance in the component (A) The particle size of the polymer is almost the same as the particle size of the latex.
(3)(A)成份的接枝率;依據前述方法(4)(A)成份的丙酮可溶解部分的極限黏度[η];依據前述方法【0125】(5)(D)成份(聚合物結合苯乙烯量、乙烯量、數平均分子量及添氫率);(5-1)結合苯乙烯量以添氫前的聚合物進行測量;依據紅外法從檢量線中求出吸收的699cm- 1 的苯基。(3) The grafting ratio of the component (A); the ultimate viscosity [η] of the acetone-soluble portion of the component (4) according to the above method (4); according to the above method [0125] (5) (D) component (polymer) Binding styrene amount, ethylene amount, number average molecular weight and hydrogen addition rate); (5-1) The amount of bound styrene is measured by the polymer before hydrogen addition; the absorption of 699 cm is determined from the calibration line according to the infrared method - 1 phenyl.
(5-2)數平均分子量以添氫前的聚合物進行測量;從凝膠滲透色譜(GPC)法中求出。(5-2) The number average molecular weight is measured by a polymer before hydrogen addition; and it is determined by a gel permeation chromatography (GPC) method.
(5-3)乙烯結合量以添氫前的聚合物進行測量;依據紅外法(Morelo法)予以求出。(5-3) The ethylene binding amount was measured by the polymer before hydrogen addition; it was determined by the infrared method (Morelo method).
(5-4)添氫率;以添氫前的聚合物進行測量;將四氯化乙烯用作溶劑,再從以15%濃度所測得之100MHz的1 H-NMR光譜之不飽和雙重結合物所減少的光譜中予以算出。(5-4) hydrogen addition rate; measured by polymer before hydrogen addition; tetrachloroethylene as solvent, and unsaturated double combination of 1 H-NMR spectrum of 100 MHz measured at 15% concentration It is calculated from the spectrum of the decrease in the object.
【0126】(6)耐衝擊性(6-1)耐衝擊性-1;依據ISO試驗法179,測量內置切口(notch)之查拜式衝擊強度(KJ/m2 )。[0126] (6) Impact resistance (6-1) Impact resistance-1; Chaw impact strength (KJ/m 2 ) of a built-in notch was measured according to ISO Test Method 179.
(6-2)耐衝擊性-2;將厚度2.4mm平板置於口徑38mm的托盤上,再以打擊棒徑16mm、速度2.4m/sec測量沖壓平板時的破壞能源(kgf. cm)。(6-2) Impact resistance-2; A 2.4 mm thick flat plate was placed on a tray having a diameter of 38 mm, and the energy (kgf. cm) at the time of punching the flat plate was measured at a striking diameter of 16 mm and a speed of 2.4 m/sec.
(6-3)耐衝擊性-3;求出用1/2吋口徑、前端R1/2吋的打擊棒,以2.0m/sec速度沖壓厚度1.6mm平板時的破壞能源(kgf. cm)。(6-3) Impact resistance-3; The energy (kgf. cm) at the time of punching a 1.6 mm flat plate at a speed of 2.0 m/sec with a 1/2 inch diameter and a front end R1/2 打击 bar was obtained.
【0127】(7)耐藥品性(7-1)耐藥品性A在厚度3.2mm×寬幅12.7mm×長度127mm試片上附加1%歪斜後,塗佈以下藥品,再基於以下評估標準,目視評估以23℃環境放置48小時後的成形品表面狀態。[0127] (7) Chemical resistance (7-1) Chemical resistance A After adding 1% skew to a test piece having a thickness of 3.2 mm × a width of 12.7 mm × a length of 127 mm, the following drugs were applied, and then based on the following evaluation criteria, visual inspection The surface state of the molded article after being placed in an environment of 23 ° C for 48 hours was evaluated.
○:無變化×:發生皸裂或斷裂(7-1-1)耐藥品性A1;酒精(7-1-2)耐藥品性A2;剎車油(7-2)耐藥品性B;對試片(長度127mm×寬12.7mm×厚度1mm)附加1%歪斜後,在該表面上塗佈乙醇(EtOH)或甲基乙基甲酮(MEK),再基於以下評估標準,目視評估以23℃環境放置72小時後的試片表面狀態。○: no change ×: cleft or broken (7-1-1) chemical resistance A1; alcohol (7-1-2) chemical resistance A2; brake oil (7-2) chemical resistance B; test piece (length 127 mm × width 12.7 mm × thickness 1 mm) After adding 1% skew, ethanol (EtOH) or methyl ethyl ketone (MEK) was applied to the surface, and the environment was evaluated visually at 23 ° C based on the following evaluation criteria. The surface condition of the test piece after 72 hours of standing.
○:無變化×:發生皸裂或斷裂(7-3)耐藥品性C;用厚度1mm薄板,在試片上附加1%歪斜後,塗佈以下藥品,再基於以下評估標準,目視評估以23℃環境放置72小時後的薄板表面狀態。○: no change ×: cleft or broken (7-3) chemical resistance C; after adding 1% skew to the test piece with a thickness of 1 mm, the following drugs were applied, and visually evaluated at 23 ° C based on the following evaluation criteria. The surface condition of the sheet after 72 hours of environmental placement.
○:無變化×:發生皸裂或斷裂(7-3-1)耐藥品性C1;甲醇(7-3-2)耐藥品性C2;甲基乙基甲酮【0128】(8)防靜電性(8-1)防靜電性-1;成形直徑100mm、厚度2mm圓板,以23℃×相對濕度50%環境下調節7天狀態後,再用橫河Huret Packard公司製4329A型超絕緣電阻計,而以施加電壓500V測量表面固有阻抗。○: no change ×: cleft or broken (7-3-1) chemical resistance C1; methanol (7-3-2) chemical resistance C2; methyl ethyl ketone [0128] (8) antistatic property (8-1) Antistatic property-1; a circular plate having a diameter of 100 mm and a thickness of 2 mm, adjusted for 7 days in an environment of 23 ° C × 50% relative humidity, and then a 4329A type super insulation resistance meter manufactured by Yokogawa Huret Packard Co., Ltd. The surface intrinsic impedance was measured at an applied voltage of 500V.
(8-2)防靜電性-2;成形直徑100mm、厚度2mm圓板,以23℃×相對濕度30%環境下調節1天狀態後,再用Agilent-Technologies公司製High Resistant Meter 4339B型,而以施加電壓500V測量表面固有阻抗。(8-2) Antistatic property-2; a circular plate having a diameter of 100 mm and a thickness of 2 mm was adjusted in an environment of 23 ° C × 30% relative humidity for 1 day, and then a High Resistant Meter 4339B type manufactured by Agilent-Technologies Co., Ltd., and The surface intrinsic impedance was measured at an applied voltage of 500V.
(8-3)防靜電性-3;成形直徑100mm、厚度2mm圓板,以23℃×相對濕度50%環境下調節1天狀態後,再用Agilent-Technologies公司製High Resistant Meter 4339B型,而以施加電壓500V測量表面固有阻抗。(8-3) Antistatic property-3; a circular plate having a diameter of 100 mm and a thickness of 2 mm was adjusted in an environment of 23 ° C × 50% relative humidity for one day, and then Agilent-Technologies Co., Ltd. High Resistant Meter 4339B was used. The surface intrinsic impedance was measured at an applied voltage of 500V.
【0129】(9)制電性(9-1)制電性-1;用厚度1mm薄板,以三菱化學公司製High Rester UP MCP-HT 450,用施加電壓500V測量以23℃、50%RH條件下放置24小時後的表面固有阻抗。[0129] (9) Power-supply property (9-1) Power-supply-1; using a thin plate of 1 mm thickness, High Rester UP MCP-HT 450 manufactured by Mitsubishi Chemical Corporation, measured at an applied voltage of 500 V at 23 ° C, 50% RH The surface intrinsic impedance after 24 hours of standing under conditions.
(9-2)制電性-2;用厚度1mm薄板,以三菱化學公司製High Rester UP MCP-HT 450,用施加電壓100V測量以23℃、50%RH條件下放置24小時後的表面固有阻抗。(9-2) Power-generating -2; Surface intrinsic after being placed at 23 ° C, 50% RH for 24 hours with an applied voltage of 100 V using a thin plate of 1 mm thickness and High Rester UP MCP-HT 450 manufactured by Mitsubishi Chemical Corporation impedance.
(10)制電性的持續性;將厚度1mm薄板浸漬於蒸餾水中達10天後,放置於23℃×50%RH恆溫恆濕槽;以上述(9-2)方法測量表面固有阻抗的時間變化,再求出平衡狀態的表面固有阻抗(NO2表面固有阻抗)。依照以下內容評估來自於NO1表面固有阻抗與NO2表面固有阻抗的持續性。(10) Persistence of electrical conductivity; immersing a thin plate of 1 mm thickness in distilled water for 10 days, placing it in a constant temperature and humidity chamber at 23 ° C × 50% RH; measuring the time of surface intrinsic impedance by the above method (9-2) Change, and then find the surface intrinsic impedance (NO2 surface intrinsic resistance) of the equilibrium state. The persistence of the intrinsic impedance from the surface of NO1 and the intrinsic impedance of the surface of NO2 was evaluated in accordance with the following.
○;NO2表面固有阻抗與NO1表面固有阻抗相較之下,具有同等或低持續性。○; The intrinsic impedance of the surface of NO2 is equivalent or low in persistence compared with the intrinsic impedance of the surface of NO1.
×;NO2表面固有阻抗的持續性劣於NO1表面固有阻抗。×; The persistence of the intrinsic impedance of the surface of NO2 is inferior to the inherent impedance of the surface of NO1.
【0130】(11)成形品的表面外觀(11-1)表面外觀-1;基於以下評估標準,目視評估厚度3.2mm平板成形品。(11) Surface appearance of the molded article (11-1) Surface appearance-1; The 3.2 mm-thick flat molded article was visually evaluated based on the following evaluation criteria.
◎;幾乎無毛邊,成形品表面狀態平滑。◎; almost no burrs, the surface condition of the molded article is smooth.
○;有若干毛邊,成形品表面狀態平滑、無問題。○; There are a number of burrs, and the surface condition of the molded article is smooth and has no problem.
×;毛邊大及/或成形品表面狀態平滑性不佳,有問題。×; The raw edges are large and/or the surface state of the molded article is not smooth, and there is a problem.
(11-2)表面外觀-2;(光澤)成形平板,用村上色彩技術研究所公司製光澤劑GM-26D,測量60度光澤。(11-2) Surface appearance - 2; (gloss) formed flat plate, and 60 degree gloss was measured using the gloss agent GM-26D manufactured by Murakami Color Technology Research Co., Ltd.
(11-3)表面外觀-3;基於以下評估標準,目視評估多層薄板及托盤。(11-3) Surface Appearance-3; Multilayer sheets and trays were visually evaluated based on the following evaluation criteria.
○;表面平滑、形狀穩定。○; the surface is smooth and the shape is stable.
×;表面有凹凸,形狀不穩定。×; The surface has irregularities and the shape is unstable.
【0131】[2]熱塑性樹脂組成物的成份(1)(A)成份(1-1)製造例1;ABS樹脂(A1)在氮氣氣流中,在具備攪拌機的內容積7L玻璃製燒瓶內添加75份離子交換水、0.5份玫瑰酸鉀、0.1份tert-十二烷硫醇、40份聚丁二烯乳膠(平均粒徑:3500A、凝膠含率:85%)(固體)、15份苯乙烯、5份丙烯腈,邊攪拌邊昇溫;內部溫度達到45℃時,再添加將0.2份焦磷酸鈉、0.01份硫酸亞鐵7水合物、0.2份葡萄糖溶於20份離子交換水的溶液後,添加0.07份異丙苯氫過氧化物即開始聚合;聚合1小時後,花3小時連續添加50份離子交換水、0.7份玫瑰酸鉀、30份苯乙烯、10份丙烯腈、0.05份tert-十二烷硫醇及0.01份異丙苯氫過氧化物,再持續聚合1小時後,添加0.2份2, 2’-甲叉-雙(4-乙基-6-tert-丁基苯酚)完成聚合;以硫酸水溶液凝固反應生成物的乳膠,經過水洗後乾燥,即可獲得苯乙烯系樹脂A1;此A1的接枝率68%、丙酮可溶解部分的極限黏度[η]為0.45dl/g。[0131] [2] Component of thermoplastic resin composition (1) (A) Component (1-1) Production Example 1; ABS resin (A1) was added to a 7 L glass flask containing an internal volume of a stirrer in a nitrogen gas stream 75 parts of ion-exchanged water, 0.5 parts of potassium oleate, 0.1 part of tert-dodecyl mercaptan, 40 parts of polybutadiene latex (average particle size: 3500 A, gel content: 85%) (solid), 15 parts Styrene, 5 parts of acrylonitrile, while stirring, while the internal temperature reached 45 ° C, a solution of 0.2 parts of sodium pyrophosphate, 0.01 parts of ferrous sulfate 7 hydrate, 0.2 parts of glucose dissolved in 20 parts of ion-exchanged water was added. Thereafter, 0.07 parts of cumene hydroperoxide was added to start polymerization; after 1 hour of polymerization, 50 parts of ion-exchanged water, 0.7 parts of potassium oleate, 30 parts of styrene, 10 parts of acrylonitrile, and 0.05 parts were continuously added for 3 hours. Tert-dodecyl mercaptan and 0.01 parts of cumene hydroperoxide, after further polymerization for 1 hour, add 0.2 part of 2,2'-methylene-bis(4-ethyl-6-tert-butylphenol) The polymerization is completed; the latex of the reaction product is solidified with an aqueous solution of sulfuric acid, and after washing with water, it is dried to obtain a styrene resin A1. This graft ratio A1 68% acetone soluble fraction limit viscosity [[eta]] of 0.45dl / g.
【0132】(1-2)製造例2;AS樹脂(A2)連結2座具備內容積為30公升之螺帶翼,且內置套管的聚合反應器,經過換氮後,在第1座聚合反應器上連續添加75份苯乙烯、25份丙烯腈、20份甲苯;接下來,連續供應將0.12份tert-十二烷硫醇視為分子量調節劑、5份甲苯溶液、及將0.1份1, 1’-.偶氮(環己烷-1-Carbonytril)視為開始聚合劑、及5份甲苯;將第1座聚合溫度控制為110℃,以2小時的平均滯留時間進行聚合;聚合轉化率為57%後從所得之聚合物溶劑中,藉由設置於第1座聚合反應器外的幫浦,連續同量取出苯乙烯、丙烯腈、甲苯、分子量調節劑、及開始聚合劑供應量後,再供應給第2座的聚合反應器;此第2座聚合反應器的聚合溫度為130℃、聚合轉化率為75%;接下來,從第2座聚合反應器中取的出聚合物溶液,則用2軸3段內置通風孔的壓出機,以去除未反應單體及溶劑後,則獲得極限黏度〔η〕為0.48的苯乙烯系樹脂A2。(1-2) Production Example 2; the AS resin (A2) is connected to two polymerization reactors having a spiral belt having an internal volume of 30 liters and a built-in sleeve, and after the nitrogen exchange, the first polymerization is carried out. 75 parts of styrene, 25 parts of acrylonitrile, and 20 parts of toluene were continuously added to the reactor; next, 0.12 parts of tert-dodecanethiol was regarded as a molecular weight modifier, 5 parts of a toluene solution, and 0.1 part of 1 was continuously supplied. , 1'-. azo (cyclohexane-1-Carbonytril) is regarded as starting polymerization agent, and 5 parts of toluene; the first polymerization temperature is controlled to 110 ° C, polymerization is carried out with an average residence time of 2 hours; polymerization conversion After the rate was 57%, from the obtained polymer solvent, the styrene, acrylonitrile, toluene, molecular weight regulator, and the start of the polymerization agent were continuously discharged in the same amount by the pump disposed outside the first polymerization reactor. Thereafter, it is supplied to the polymerization reactor of the second block; the polymerization temperature of the second polymerization reactor is 130 ° C, and the polymerization conversion rate is 75%; next, the polymer is taken from the second polymerization reactor. For the solution, use a 2-axis 3-stage internal venting extruder to remove unreacted monomer and solvent. , Is obtained as the limit viscosity [η] of a styrenic resin A2 0.48.
【0133】(1-3)製造例3;含氫氧基不飽和化合物共聚AS樹脂(A3)在製造例1上不使用聚丁二烯,而是將玫瑰酸鉀變成十二烷基苯磺酸鉀;此外,第1段的單體成份則改為苯乙烯/丙烯腈/2-羥乙基甲基丙烯酸酯=22.5/7.5/3.5份;再者,除了將連續添加成份改為,苯乙烯/丙烯腈/2-羥乙基甲基丙烯酸酯=44.7/14.9/6.9份之外,所有皆以製造例1的方法進行聚合;用硫酸鎂水溶液凝固反應生成物的乳膠,經過水洗後乾燥,即可獲得苯乙烯系樹脂A3;該極限黏度[η]為0.44。(1-3) Production Example 3; Hydroxy-Unsaturated Compound Copolymerized AS Resin (A3) Instead of using polybutadiene in Production Example 1, potassium rosinate was changed to dodecylbenzenesulfonate. Potassium acid; in addition, the monomer content of the first paragraph is changed to styrene / acrylonitrile / 2 - hydroxyethyl methacrylate = 22.5 / 7.5 / 3.5 parts; in addition, in addition to the continuous addition of ingredients, benzene Ethylene/acrylonitrile/2-hydroxyethyl methacrylate = 44.7/14.9/6.9 parts, all of which were polymerized by the method of Production Example 1; the latex of the reaction product was solidified with an aqueous solution of magnesium sulfate, washed with water and dried. The styrene resin A3 was obtained; the ultimate viscosity [η] was 0.44.
【0134】(1-4)製造例4;含羧基不飽和化合物共聚AS樹脂(A4)在製造例3的第1段單體成份,改為苯乙烯/丙烯腈/甲基丙烯酸=23.7/7.9/1.7份;再者,除了將連續添加成份改為,苯乙烯/丙烯腈/甲基丙烯酸酯=47.5/15.8/3.4份之外,所有皆以製造例1的方法進行聚合;可獲得極限黏度[η]為0.46的苯乙烯系樹脂A4。(1-4) Production Example 4; carboxyl group-containing unsaturated compound copolymerized AS resin (A4) in the first stage monomer component of Production Example 3, changed to styrene/acrylonitrile/methacrylic acid=23.7/7.9 /1.7 parts; further, except that the continuously added components were changed to styrene/acrylonitrile/methacrylate = 47.5/15.8/3.4 parts, all were polymerized by the method of Production Example 1; the ultimate viscosity was obtained. [η] is a styrene resin A4 of 0.46.
【0135】(1-5)製造例5;含環氧基不飽和化合物共聚AS樹脂(A5)在製造例3的第1段單體成份,改為苯乙烯/丙烯腈/環氧丙基甲基丙烯酸酯=23.7/7.9/1.7份;再者,除了將連續添加成份改為,苯乙烯/丙烯腈/環氧丙基甲基丙烯酸酯=47.5/15.8/3.4份之外,所有皆以製造例1的方法進行聚合;可獲得極限黏度[η]為0.42的苯乙烯系樹脂A5。(1-5) Production Example 5; Epoxy-containing unsaturated compound copolymerized AS resin (A5) In the first stage monomer component of Production Example 3, changed to styrene/acrylonitrile/epoxypropyl group Acrylate = 23.7 / 7.9 / 1.7 parts; in addition, except that the continuous addition of ingredients was changed to styrene / acrylonitrile / epoxy propyl methacrylate = 47.5 / 15.8 / 3.4 parts, all manufactured The method of Example 1 was carried out; a styrene resin A5 having an ultimate viscosity [η] of 0.42 was obtained.
【0136】(2)(B)成份;(2-1)B1;聚丙烯樹脂使用日本Pochem公司製Homo型聚丙烯“Novatec BC6C(商品名稱)”。[0136] (2) (B) component; (2-1) B1; polypropylene resin "Novatec BC6C (trade name)" manufactured by Pochem Co., Ltd., Japan.
(2-2)B2;聚丙烯樹脂使用日本Pochem公司製Homo型聚丙烯“Novatec MA1(商品名稱)”。(2-2) B2; Polypropylene resin "Novatec MA1 (trade name)" manufactured by Pochem Co., Ltd., Japan was used.
(2-3)B3;聚丙烯樹脂使用日本Pochem公司製Homo型聚丙烯“Novatec FY6C(商品名稱)”。(2-3) B3; Polypropylene resin "Novatec FY6C (trade name)" manufactured by Pochem Co., Ltd., Japan was used.
【0137】(3)(C1)成份C1-1;使用三洋化成工業公司製聚丙烯聚醚嵌段共聚物“Pelestart 303(商品名稱)”。(3) (C1) Component C1-1; Polyether polyether block copolymer "Pelestart 303 (trade name)" manufactured by Sanyo Chemical Industries, Ltd. was used.
C1-2;使用三洋化成工業公司製聚丙烯聚醚嵌段共聚物“Pelestart 230(商品名稱)”。C1-2; Polyether polyether block copolymer "Pelestart 230 (trade name)" manufactured by Sanyo Chemical Industries Co., Ltd. was used.
【0138】(4)(C2-1)成份C2-1-1;使用三洋化成工業公司製聚醚聚醯“Pelestart M-140(商品名稱)”。[0138] (4) (C2-1) Component C2-1-1; a polyether polyether "Pelestart M-140 (trade name)" manufactured by Sanyo Chemical Industries Co., Ltd. was used.
C2-1-2;使用竹本油脂公司製聚醚聚酯“TEP-004(商品名稱)”。C2-1-2; a polyether polyester "TEP-004 (trade name)" manufactured by Takemoto Oil Co., Ltd. was used.
【0139】(5)(C2-2)成份本發明之(C2-2)成份則用花王公司製之以下非離子系防靜電劑。C2-2-1;Electro Stripper TS-5(商品名稱)甘油酯系防靜電劑,C2-2-2;Electro Stripper EA(商品名稱)二乙醇胺系防靜電劑,C2-2-3;Electro Stripper TS-3B(商品名稱)甘油酯系/二乙醇胺系複合式防靜電劑。(5) (C2-2) Component The (C2-2) component of the present invention is the following nonionic antistatic agent manufactured by Kao Corporation. C2-2-1; Electro Stripper TS-5 (trade name) glyceride antistatic agent, C2-2-2; Electro Stripper EA (trade name) diethanolamine antistatic agent, C2-2-3; Electro Stripper TS-3B (trade name) glyceride/diethanolamine composite antistatic agent.
【0140】(6)(C2-3)成份本發明之(C2-3)成份則用Boron International公司製“Hybolon MB400N-8LDPE(商品名稱)”;本商品屬於該公司製“Hybolon 400N(商品名稱)”(高分子電荷移動型結合體)的聚乙烯主膠料,有效成份(C2-3)為7%。[6140] (6) (C2-3) Ingredients The (C2-3) component of the present invention is "Hybolon MB400N-8LDPE (trade name)" manufactured by Boron International Co., Ltd.; this product belongs to "Hybolon 400N" (trade name) manufactured by the company. The main component of the polyethylene (polymer charge mobile type combination), the active ingredient (C2-3) is 7%.
【0141】(7)(C2-4)成份本發明之(C2-4)成份如下。(7) (C2-4) Component The component (C2-4) of the present invention is as follows.
C2-4-1;使用三光化成工業公司製SANKONORL 0862-10T(商品名稱),鋰氯化合物含量10%。C2-4-1; SANKONORL 0862-10T (trade name) manufactured by Sanko Kasei Kogyo Co., Ltd., having a lithium chloride compound content of 10%.
C2-4-2;使用三光化成工業公司製SANKONORL AQ-50T(商品名稱),鋰氯化合物含量50%。C2-4-2; SANKONORL AQ-50T (trade name) manufactured by Sanko Kasei Kogyo Co., Ltd., having a lithium chloride content of 50%.
C2-4-3;溴化鋰。C2-4-3; lithium bromide.
【0142】(8)(D)成份(8-1)製造例6;添加部分氫的苯乙烯-丁二烯-苯乙烯嵌段共聚物讓攪拌機及內置套管的高壓釜乾燥後,置換氮氣,再投入含30份苯乙烯之環己烷溶液;接下來,添加n-丁基鋰,在70℃環境下聚合1小時後,添加含40份丁二烯的環己烷溶液後聚合1小時;採樣所得之部分嵌段共聚物後,對100份嵌段共聚物,添加0.3份2, 6-二-tert-對特丁基鄰苯二酚後,加熱以去除溶劑;苯乙烯含量為60%、聚丁二烯部分的1, 2-乙烯結合量為35%、數平均分子量為74,000;剩餘的嵌段共聚溶液中,則添加在環己烷中反應Titanium Dichloride與三乙基鋁溶液後,在50℃、50kgf/cm2 氫壓下,執行40分鐘的氫化反應;對100份嵌段共聚物添加0.3份2, 6-二-tert-對特丁基鄰苯二酚後,去除溶劑即獲得69%添氫率的聚合物D1。(8) (D) component (8-1) Production Example 6; styrene-butadiene-styrene block copolymer to which a part of hydrogen was added, and the autoclave of the mixer and the built-in sleeve was dried, and the nitrogen was replaced. Then, a solution of 30 parts of styrene in cyclohexane was further charged; next, n-butyllithium was added, and after polymerization at 70 ° C for 1 hour, a solution of 40 parts of butadiene in cyclohexane was added and polymerization was carried out for 1 hour. After sampling the obtained partial block copolymer, after adding 0.3 part of 2,6-di-tert-p-tert-butyl catechol to 100 parts of the block copolymer, heating to remove the solvent; the styrene content is 60 %, the polybutadiene moiety has a 1,2-ethylene binding amount of 35% and a number average molecular weight of 74,000; and the remaining block copolymerization solution is added to the cyclohexane to react the Titanium Dichloride and the triethylaluminum solution. , performing hydrogenation reaction at 50 ° C, 50 kgf / cm 2 hydrogen pressure for 40 minutes; adding 0.3 parts of 2,6-di-tert-p-tert-butyl catechol to 100 parts of the block copolymer, removing the solvent That is, a polymer D1 having a hydrogen addition rate of 69% was obtained.
【0143】(8-2)製造例7;完全添加氫的苯乙烯-丁二烯-苯乙烯嵌段共聚物讓攪拌機及內置套管的高壓釜乾燥後,置換氮氣,再投入20份環己烷與20份丁二烯溶液;接下來,添加0.025份n-丁基鋰,在50℃環境下執行恆溫聚合,當轉換率達100%時,則添加0.75份氧染環戊烷、65份丁二烯,從50℃昇溫到80℃以進行昇溫聚合;當轉換率達100%時,則添加15份苯乙烯後,再度實施聚合反映,添氫前即獲得A-B1-B2三嵌段共聚物;同於製造例6一樣採樣分析的結果為,苯乙烯塊15%(A塊)、1, 2-乙烯含量35%的丁二烯塊(B1塊)、1, 2-乙烯含量10%的丁二烯塊(B2塊)所構成之數平均分子量200,000聚合物。(8-2) Production Example 7; styrene-butadiene-styrene block copolymer in which hydrogen was completely added. After the autoclave of the mixer and the built-in sleeve was dried, the nitrogen gas was replaced, and 20 parts of the ring was further charged. Alkane and 20 parts of butadiene solution; next, 0.025 parts of n-butyllithium was added, and constant temperature polymerization was carried out at 50 ° C. When the conversion rate reached 100%, 0.75 parts of oxygen-stained cyclopentane and 65 parts were added. Butadiene is heated from 50 ° C to 80 ° C for temperature polymerization; when the conversion rate reaches 100%, after adding 15 parts of styrene, the polymerization reaction is carried out again, and the A-B1-B2 triblock is obtained before hydrogen is added. Copolymer; the same sampling and analysis results as in Production Example 6 were: styrene block 15% (block A), 1, 2-ethylene content of 35% butadiene block (B1 block), 1, 2-ethylene content 10 The number of butadiene blocks (B2 blocks) constitutes a number average molecular weight of 200,000 polymers.
在其他容器裡,將1份Titanium Dichloride分散於環己烷後,在室溫下與0.5份三乙基鋁做反應;在上述聚合溶液中添加所得之均一溶液後,在50℃、50kgf/cm2 氫壓下,執行2小時的氫化反應,即獲得添氫率幾乎為100%的添氫聚合物D2。In another container, after dispersing 1 part of Titanium Dichloride in cyclohexane, reacting with 0.5 part of triethylaluminum at room temperature; adding the obtained uniform solution to the above polymerization solution, 50 ° C, 50 kgf / cm Under the hydrogen pressure, a hydrogenation reaction was carried out for 2 hours, that is, a hydrogen-added polymer D2 having a hydrogen addition rate of almost 100% was obtained.
【0144】(8-3)製造例8;苯乙烯-丁二烯-苯乙烯嵌段共聚物讓攪拌機及內置套管的高壓釜乾燥後,置換氮氣,在氮氣流中轉化0.08份環己烷與氧染環戊烷後則昇溫,當內部溫度達到70℃時,添加含0.052份n-丁基鋰之環己烷後,再添加15.5份苯乙烯後聚合60分鐘(第1段);接下來,添加3份苯乙烯、20份丁二烯混合物後聚合60分鐘(第2段);此外,添加3份苯乙烯、20份丁二烯混合物後聚合60分鐘(第3段);再度添加3份苯乙烯、20份丁二烯混合物後聚合60分鐘(第4段)後,聚合3個錐形塊;接下來,添加15.5份苯乙烯以聚合60分鐘(第5段);聚合轉化率為100%。(8-3) Production Example 8; styrene-butadiene-styrene block copolymer After the autoclave of the mixer and the built-in sleeve was dried, the nitrogen gas was replaced, and 0.08 parts of cyclohexane was converted in a nitrogen stream. After oxygenating with cyclopentane, the temperature is raised. When the internal temperature reaches 70 ° C, cyclohexane containing 0.052 parts of n-butyllithium is added, and then 15.5 parts of styrene is added, followed by polymerization for 60 minutes (paragraph 1); After adding 3 parts of styrene and 20 parts of butadiene mixture, polymerization was carried out for 60 minutes (paragraph 2); in addition, 3 parts of styrene and 20 parts of butadiene mixture were added and polymerized for 60 minutes (paragraph 3); After 3 parts of styrene and 20 parts of butadiene mixture were polymerized for 60 minutes (paragraph 4), 3 cones were polymerized; next, 15.5 parts of styrene was added for polymerization for 60 minutes (paragraph 5); polymerization conversion rate It is 100%.
再者,聚合中將內部溫度控制在70℃;完成聚合後,在聚合溶液中添加2, 6-二-tert-對特丁基鄰苯二酚後,加熱去除溶劑,即獲得聚苯乙烯在聚丁二烯嵌段部上漸增且擁有3個錐形塊的嵌段共聚物D3;該數平均分子量為128,000,苯乙烯含量為40%。Furthermore, the internal temperature is controlled at 70 ° C during the polymerization; after the completion of the polymerization, 2,6-di-tert-p-tert-butyl catechol is added to the polymerization solution, and the solvent is removed by heating to obtain polystyrene. The block copolymer D3 having an increasing number of polybutadiene blocks and having three tapered blocks; the number average molecular weight of 128,000 and the styrene content of 40%.
【0145】(8-4)製造例9;苯乙烯-丁二烯徑向對苯嵌段共聚物讓攪拌機及內置套管的高壓釜乾燥後,置換氮氣,在氮氣流中投入2.75份環己烷與氧染環戊烷;再添加25份苯乙烯,昇溫到60℃後,則添加含0.175份n-丁基鋰之環己烷後聚合反應60分鐘(第1段);接下來,添加3份苯乙烯、20份丁二烯混合物後聚合反應60分鐘(第2段);此外,添加3份苯乙烯、20份丁二烯混合物後聚合反應60分鐘(第3段);再度添加29份丁二烯後一直聚合到轉化率達100%為止;添加0.1份偶合劑四氯化硅後,即完成偶合反應;完成聚合後,在聚合溶液中添加2, 6-二-tert-對特丁基鄰苯二酚後,加熱去除溶劑後,即獲得具有錐形塊的偶合型苯乙烯-丁二烯嵌段共聚物D4;該苯乙烯含量為31%、數平均分子量為200,000。(8-4) Production Example 9; styrene-butadiene radial para-phenylene block copolymer, after drying the autoclave of a stirrer and a built-in sleeve, replacing nitrogen gas, and injecting 2.75 parts of a ring into a nitrogen stream The alkane and oxygen are dyed with cyclopentane; after adding 25 parts of styrene, the temperature is raised to 60 ° C, then 0.175 parts of n-butyl lithium cyclohexane is added and the polymerization reaction is carried out for 60 minutes (the first stage); 3 parts of styrene and 20 parts of butadiene mixture were polymerized for 60 minutes (second stage); in addition, 3 parts of styrene and 20 parts of butadiene mixture were added and polymerization was carried out for 60 minutes (paragraph 3); After the butadiene is polymerized until the conversion rate reaches 100%; after adding 0.1 part of the coupling agent silicon tetrachloride, the coupling reaction is completed; after the polymerization is completed, the 2,6-di-tert-pair is added to the polymerization solution. After the butyl catechol, after heating to remove the solvent, a coupled styrene-butadiene block copolymer D4 having a tapered block was obtained; the styrene content was 31%, and the number average molecular weight was 200,000.
【0146】(8-5)苯乙烯-丁二烯-苯乙烯嵌段共聚物D5;使用JSR公司製「TR2500」(商品名稱)。(8-5) A styrene-butadiene-styrene block copolymer D5; "TR2500" (trade name) manufactured by JSR Corporation.
(8-6)苯乙烯-丁二烯嵌段共聚物之添氫物D6;使用JSR公司製「DYNARON4600P」(商品名稱)。(8-6) The hydrogen-adding material D6 of the styrene-butadiene block copolymer; "DYNARON 4600P" (trade name) manufactured by JSR Corporation.
【0147】(9)(E)成份;製造例10;接枝聚合物將具備螺帶型攪拌翼、且內容積為10公升的不銹鋼製高壓釜進行氮氣置換後,在氮氣流中事先將甲苯視為溶劑後,投入30份均勻之前述聚合物D2溶液(固體)、52.5份苯乙烯、17.5份丙烯腈、120份甲苯、0.1份tert-十二烷硫醇,再邊攪拌邊昇溫;當內部溫度到達50℃時,則添加0.5份苯醯過氧化物、0.1份過氧化二異丙苯後再昇溫到80℃後,在80℃環境下邊控制恆定邊執行聚合反應;開始反應後第6小時起需花1小時昇溫到120℃,再進行2小時反應後即結束;轉化率為97%。[9147] (9) (E) component; Production Example 10; Graft polymer A stainless steel autoclave having a spiral-type stirring blade and an internal volume of 10 liters was subjected to nitrogen replacement, and then toluene was previously introduced in a nitrogen stream. After considering the solvent, 30 parts of the above-mentioned polymer D2 solution (solid), 52.5 parts of styrene, 17.5 parts of acrylonitrile, 120 parts of toluene, 0.1 part of tert-dodecyl mercaptan were charged, and the temperature was raised while stirring; When the internal temperature reached 50 ° C, 0.5 parts of phenylhydrazine peroxide and 0.1 part of dicumyl peroxide were added, and then the temperature was raised to 80 ° C, and then the polymerization was carried out while controlling at a constant temperature of 80 ° C; It takes about 1 hour to raise the temperature to 120 ° C from the hour, and then ends after 2 hours of reaction; the conversion rate is 97%.
冷卻到100℃後,添加0.2份2, 2-甲撐二-4-甲基-6-tert-丁基苯酚後,從高壓釜中取出反應混合物,再藉由水蒸氣蒸餾餾除未反應物與溶劑的同時,將聚合物作成球體狀即獲得接枝聚合物E;該接枝率為5%,丙酮可溶解部分的極限黏度[η]為0.45dl/g。After cooling to 100 ° C, after adding 0.2 part of 2,2-methylenedi-4-methyl-6-tert-butylphenol, the reaction mixture was taken out from the autoclave, and the unreacted product was distilled off by steam distillation. Simultaneously with the solvent, the polymer was formed into a spherical shape to obtain a graft polymer E; the graft ratio was 5%, and the ultimate viscosity [η] of the acetone-soluble portion was 0.45 dl/g.
【0148】(10)(F)成份;使用KURARAY公司製TM聚合物;TM-S4L77(SEPS-芳香族聚探酸酯嵌段共聚物商品名稱)。[0148] (10) (F) component; TM polymer manufactured by KURARAY Co., Ltd.; TM-S4L77 (SEPS-aromatic polyphthalate block copolymer trade name).
【0149】(11)(G)成份;本發明之(G)成份,使用以下三洋化成工業公司製馬來酸酐變性聚烯。[0149] (11) (G) component; (G) component of the present invention, the following maleic anhydride-modified polyene manufactured by Sanyo Chemical Industries Co., Ltd. was used.
G1;YUMEX 1001(馬來酸酐附加量5%品商品名稱)G2;YUMEX 1010(馬來酸酐附加量10%品商品名稱)【0150】(12)其他成份(H)(12-1)H1;芳香族聚碳酸酯三菱Engineer Plastic公司製“Novalex 7022PJ(商品名稱)”(黏度平均分子量2,200)。G1; YUMEX 1001 (maleic anhydride additional 5% product name) G2; YUMEX 1010 (maleic anhydride additional amount 10% product name) [0150] (12) other ingredients (H) (12-1) H1; "Novalex 7022PJ (trade name)" (viscosity average molecular weight 2,200) manufactured by Mitsubishi Engineering Plastic Co., Ltd., an aromatic polycarbonate.
(12-2)H2;聚對苯二甲酸丁二醇酯Poly Plastic公司製“(PBT)XD477(商品名稱)”(固有黏度1.2dl/g)。(12-2) H2; "PBT XD477 (trade name)" (intrinsic viscosity: 1.2 dl/g) manufactured by Poly Plastics, Polybutylene terephthalate.
以表1-1所記載之配方比率,藉由Henshell攪拌器予以混合後,再用二軸壓出機(汽缸設定溫度240℃)進行溶融混練後作成顆粒狀;將所得之顆粒充分乾燥後,則用射出成形(汽缸設定溫度230℃)製作評估用試片;用此試片以前述評估方法,評估耐衝擊性、耐藥品性、成形品表面外觀及防靜電性;其評估結果如表1-2所示。The formulation ratios shown in Table 1-1 were mixed by a Henshell mixer, and then subjected to melt-kneading using a two-axis extruder (cylinder set temperature: 240 ° C) to form pellets; after the obtained pellets were sufficiently dried, Then, an evaluation test piece was prepared by injection molding (cylinder set temperature: 230 ° C); the test piece was used to evaluate impact resistance, chemical resistance, surface appearance and antistatic property of the molded article by the above evaluation method; -2 is shown.
從表1-2所示之評估結果中,得以明確出以下事項。From the evaluation results shown in Table 1-2, the following items were clarified.
本發明實施例I-1~I-23成形品,皆具有卓越的耐衝擊性、耐藥品性、成形品表面外觀及防靜電性;再者,實施例I-22及I-23的耐藥品性-A1及A2皆有標示○印,但比實施例I-1~I-21略微遜色。The molded articles of Examples I-1 to I-23 of the present invention all have excellent impact resistance, chemical resistance, surface appearance and antistatic property of the molded article; further, the chemical resistance of Examples I-22 and I-23 Both sex-A1 and A2 are marked with ○ printed, but slightly inferior to Examples I-1 to I-21.
另一方面,比較例I-1屬於本發明(A)成份的用量,脫離發明範圍較少,且(B)成份的用量,脫離發明範圍較多的例子,故耐衝擊性、成形品表面外觀較差;比較例I-2屬於本發明(C1)成份的用量,脫離發明範圍較少的例子,故耐衝擊性、成形品表面外觀及防靜電性較差;比較例I-3則是本發明(C1)成份的用量,脫離發明範圍較多的例子,故耐衝擊性、成形品表面外觀較差。On the other hand, Comparative Example I-1 belongs to the amount of the component (A) of the present invention, which is less than the scope of the invention, and the amount of the component (B) is out of the scope of the invention, so that the impact resistance and the surface appearance of the molded article are exhibited. Poor; Comparative Example I-2 is an amount of the component (C1) of the present invention, which is inferior to the scope of the invention, so that impact resistance, surface appearance and antistatic property of the molded article are poor; Comparative Example I-3 is the present invention ( The amount of the component of the component C1 is out of the range of the invention, so that the impact resistance and the surface appearance of the molded article are inferior.
用實施例I-19組成物製造兩表層(各厚度為100μm)、中心層則用B1成份(厚度800μm)製造出三層薄板;再者,真空成形本薄板以製造托盤。Two skin layers (each having a thickness of 100 μm) were produced using the composition of Example I-19, and a three-layered sheet was produced using the B1 component (thickness: 800 μm) in the center layer. Further, the sheet was vacuum-formed to manufacture a tray.
用實施例I-22組成物與B1成份,製造出同於上述之三層薄板及真空成形托盤。Using the composition of Example I-22 and the component B1, a three-layered sheet and a vacuum forming tray as described above were produced.
用實施例I-22組成物與ABS(A1成份/A2成份=40/60%所構成之組成物),將實施例I-22製造成兩表層(各厚度為100μm)、中心層則用ABS成份(厚度800μm)製造出三層薄板;再以同於前述方式,以真空成形方式製造托盤。Using the composition of Example I-22 and ABS (A1 component / A2 component = 40/60% composition), Example I-22 was fabricated into two skin layers (each thickness was 100 μm), and the center layer was ABS. A three-layer sheet was produced by the composition (thickness: 800 μm); and the tray was produced by vacuum forming in the same manner as described above.
以表2-1及2-2所記載之配方比率,藉由Henshell攪拌器予以混合後,再用二軸壓出機(汽缸設定溫度200℃)進行溶融混練後作成顆粒狀;將所得之顆粒充分乾燥後,則用射出成形(汽缸設定溫度200℃)製作評估用試片。According to the formula ratios shown in Tables 2-1 and 2-2, the mixture was mixed by a Henshell mixer, and then subjected to melt-kneading using a two-axis extruder (cylinder set temperature: 200 ° C) to form pellets; the obtained pellets were obtained. After sufficiently drying, a test piece for evaluation was produced by injection molding (cylinder set temperature: 200 ° C).
用此試片以前述評估方法,評估耐衝擊性、耐藥品性及防靜電性;其評估結果如表2-1所示。Using this test piece, the impact resistance, chemical resistance, and antistatic property were evaluated by the aforementioned evaluation methods; the evaluation results are shown in Table 2-1.
從表2-1及2-2所示之評估結果中,得以明確出以下事項。 本發明實施例II-1~II-15成形品,皆具有卓越的耐衝擊性、耐藥品性及防靜電性。From the evaluation results shown in Tables 2-1 and 2-2, the following items were clarified. The molded articles of Examples II-1 to II-15 of the present invention all have excellent impact resistance, chemical resistance and antistatic property.
另一方面,比較例II-1屬於本發明(A)成份的用量,脫離發明範圍較少,且(B)成份的用量,脫離發明範圍較多的例子,故耐衝擊性及防靜電性較差;比較例II-2屬於本發明(C1)成份的用量,脫離發明範圍較少的例子,故耐衝擊性及防靜電性較差;比較例II-3則是本發明(C1)成份的用量,脫離發明範圍較多的例子,故耐衝擊性較差。On the other hand, Comparative Example II-1 belongs to the amount of the component (A) of the present invention, which is less than the scope of the invention, and the amount of the component (B) is out of the scope of the invention, so that the impact resistance and the antistatic property are poor. Comparative Example II-2 is an amount of the component (C1) of the present invention, which is inferior to the range of the invention, so that the impact resistance and the antistatic property are poor; Comparative Example II-3 is the amount of the component (C1) of the present invention. It is out of the scope of the invention, and the impact resistance is poor.
以表3-1及3-2所記載之配方比率,藉由Henshell攪拌器混合所有成份後,再用二軸壓出機(汽缸設定溫度220℃)進行溶融混練後作成顆粒狀;將所得之顆粒充分乾燥後,則用射出成形(汽缸設定溫度220℃)製作評估用試片。According to the formula ratios shown in Tables 3-1 and 3-2, all the components were mixed by a Henshell mixer, and then melted and kneaded by a two-axis extruder (cylinder set temperature: 220 ° C) to obtain pellets; After the pellets were sufficiently dried, a test piece for evaluation was produced by injection molding (cylinder set temperature: 220 ° C).
用此試片以前述評估方法,評估耐衝擊性、耐藥品性、成形品表面外觀及防靜電性;其評估結果如表3-1及3-2所示。Using this test piece, the impact resistance, the chemical resistance, the surface appearance of the molded article, and the antistatic property were evaluated by the aforementioned evaluation methods; the evaluation results are shown in Tables 3-1 and 3-2.
從表3-1及3-2所示之評估結果中,得以明確出以下事項。 本發明實施例III-1~III-18成形品,皆具有卓越的耐衝擊性、耐藥品性;實施例III-1~III-17成形品,皆具有卓越的耐衝擊性、成形品表面光澤。From the evaluation results shown in Tables 3-1 and 3-2, the following items were clarified. The molded articles of Examples III-1 to III-18 of the present invention all have excellent impact resistance and chemical resistance; and the molded articles of Examples III-1 to III-17 have excellent impact resistance and surface gloss of the molded article. .
比較例III-1屬於本發明(A)成份的用量,脫離發明範圍較少的例子,且(B)成份的用量,脫離發明範圍較多的例子,故耐衝擊性及防靜電性較差;比較例III-2屬於本發明(C1)成份的用量,脫離發明範圍較少的例子,故耐衝擊性及防靜電性較差。Comparative Example III-1 is an example of the amount of the component (A) of the present invention, which is out of the scope of the invention, and the amount of the component (B) is out of the scope of the invention, so that the impact resistance and the antistatic property are poor; The use of the component (C1) of the present invention in Example III-2 is out of the range of the invention, and the impact resistance and the antistatic property are inferior.
用Henshell攪拌器混合表4所記載之成份規定量後,再用二軸壓出機(汽缸設定溫度220℃)進行溶融混練後,即可獲得顆粒狀的熱塑性樹脂組成物;再者,上述(C2-3)成份包含了相當於(B)成份的聚乙烯,因此該聚乙烯量則以B4而記載於表4。After mixing the predetermined amount of the components described in Table 4 with a Henshell mixer, and then performing a melt-kneading using a two-axis extruder (cylinder set temperature: 220 ° C), a pelletized thermoplastic resin composition can be obtained; Since the component of C2-3) contains polyethylene equivalent to the component (B), the amount of the polyethylene is described in Table 4 as B4.
接下來,以溫度210℃共同壓出用以形成基層的上述成份B3、及在基層雙表面上形成防靜電層的上述熱塑性樹脂組成物,即獲得基層厚度800μm、防靜電層厚度各100μm、厚度1mm的多層薄板;針對此多層薄板,評估表面固有阻抗(防靜電性)、耐藥品性及表面外觀性。Next, the above-mentioned component B3 for forming a base layer and the above-mentioned thermoplastic resin composition for forming an antistatic layer on both surfaces of the base layer are pressed together at a temperature of 210 ° C, thereby obtaining a base layer thickness of 800 μm, an antistatic layer thickness of 100 μm each, and a thickness. 1 mm multi-layer sheet; for this multi-layer sheet, the intrinsic resistance (antistatic property), chemical resistance, and surface appearance of the surface were evaluated.
此外,真空成形上述多層薄板,以製造出托盤;針對此托盤評估表面外觀性的評估結果如表4所示。Further, the above-mentioned multilayer sheet was vacuum-formed to produce a tray; the evaluation results of evaluating the surface appearance of the tray are shown in Table 4.
除了用表4所記載之成份規定量之外,也同於實施例IV-1一樣,製造熱塑性樹脂組成物、薄板及托盤,以評估表面固有阻抗及表面外觀性;其評估結果如表4所示。Thermoplastic resin compositions, sheets, and trays were prepared in the same manner as in Example IV-1 except for the amounts specified in Table 4 to evaluate the surface specific resistance and surface appearance. The evaluation results are shown in Table 4. Show.
從表4可明確出以下事項。The following items can be clarified from Table 4.
本發明實施例IV-1~IV-14的低表面固有阻抗、卓越的制電 性、耐藥品性及表面外觀性。Low surface intrinsic impedance and excellent power generation of Embodiments IV-1 to IV-14 of the present invention Sex, chemical resistance and surface appearance.
從實施例IV-1及實施例IV-14的對比中,即可明確出併用(C1)成份及(C2-3)成份所帶來的防靜電效果;換言之,實施例IV-1上的(C1)成份及(C2-3)成份的用量各為26%、1.19%,該合計為27.1%;另一方面,實施例IV-14上的(C1)成份及(C2-3)成份的用量各為27.19%、0%,該合計為27.19%;換言之,在實施例IV-1及實施例IV-14上,即使帶來防靜電性的(C1)成份及(C2-3)成份的合計量相同,併用(C1)成份及(C2-3)成份的實施例IV-1,其表面固有阻抗也有10倍以上之低、且具有卓越的防靜電性。From the comparison of Example IV-1 and Example IV-14, the antistatic effect by the combination of the (C1) component and the (C2-3) component can be clarified; in other words, in the embodiment IV-1 ( The amount of the component (C2-3) and the component (C2-3) are each 26% and 1.19%, respectively, and the total amount is 27.1%; on the other hand, the amount of the component (C1) and the component (C2-3) in the embodiment IV-14 are used. Each of 27.19% and 0%, the total is 27.19%; in other words, in Example IV-1 and Example IV-14, even if the antistatic property (C1) component and (C2-3) component are combined In Example IV-1 having the same amount and using the (C1) component and the (C2-3) component, the surface specific resistance was also 10 times or less and excellent in antistatic property.
以表5-1及5-2所記載之配方比率,藉由Henshell攪拌器混合後,再用二軸壓出機(汽缸設定溫度220℃)進行溶融混練後作成顆粒狀;將所得之顆粒充分乾燥後,則用射出成形(汽缸設定溫度210℃)獲得成形品表面外觀評估用試片。According to the formula ratios shown in Tables 5-1 and 5-2, the mixture was mixed by a Henshell mixer, and then melted and kneaded by a two-axis extruder (cylinder set temperature: 220 ° C) to form pellets; After drying, a test piece for evaluating the surface appearance of a molded article was obtained by injection molding (cylinder set temperature: 210 ° C).
核心層使用的是上述聚合物B3厚度800μm薄板,表層與底層則用厚度各為100μm的上述樹脂組成物,共同壓出(溫度220℃)以做出積層的三層薄板後,而獲得厚度1mm薄板;裁斷此薄板,以作為制電性評估用試片及耐藥品性評估用試片。The core layer was a sheet of the above polymer B3 having a thickness of 800 μm, and the surface layer and the bottom layer were each formed by using the above-mentioned resin composition having a thickness of 100 μm, and co-extrusion (temperature: 220 ° C) to make a laminated three-layer sheet, and a thickness of 1 mm was obtained. Thin sheet; the sheet is cut for use as a test piece for electric property evaluation and a test piece for evaluation of chemical resistance.
以前述評估方法,評估制電性、耐藥品性及成形品表面外觀。此外,以200℃溫度預熱實施例V-1、V-4、V-5、V-7~V-9、V-11、V-21及V-22所得之上述薄板後進行真空成形,即獲得托盤成形品;接下來,以同於前述制電性測定方法,測量托盤成形品邊角附近的表面固有阻抗。The electroforming property, the chemical resistance, and the surface appearance of the molded article were evaluated by the aforementioned evaluation methods. Further, the above-mentioned thin sheets obtained in Examples V-1, V-4, V-5, V-7 to V-9, V-11, V-21 and V-22 were preheated at a temperature of 200 ° C, and then vacuum formed. That is, a tray molded article was obtained; next, the surface specific impedance in the vicinity of the corner of the tray molded article was measured in the same manner as the above-described power measuring method.
其評估結果如表5-1及表5-2所示。The evaluation results are shown in Table 5-1 and Table 5-2.
實施例V-1~V-4、比較例V-1~V-3屬於將本發明成份(B)、(C1)及(C2-2)視為所需成份的第二熱塑性樹脂組成物之相關實施例及比較例;實施例V-5~V-8、比較例V-4~V-5屬於將本發明成份(B)、(C1)、(C2-2)及(D)視為所需成份的第三熱塑性樹脂組成物之相關實施例及比較例;再者,實施例V-9~V-23屬於將本發明成份(A)、(B)、(C1)、(C2-2)及(D)視為所需成份的第一熱塑性樹脂組成物之相關實施例。Examples V-1 to V-4 and Comparative Examples V-1 to V-3 belong to a second thermoplastic resin composition in which the components (B), (C1) and (C2-2) of the present invention are regarded as desired components. Related Examples and Comparative Examples; Examples V-5 to V-8 and Comparative Examples V-4 to V-5 belong to the components (B), (C1), (C2-2) and (D) of the present invention. Related Examples and Comparative Examples of Third Thermoplastic Resin Composition of Desirable Ingredients; Further, Examples V-9 to V-23 belong to the components (A), (B), (C1), (C2-) of the present invention. 2) and (D) related examples of the first thermoplastic resin composition regarded as the desired component.
從表5-1及5-2結果中可明確出以下事項。The following items can be clearly identified from the results in Tables 5-1 and 5-2.
本發明實施例V-1~V-23成形品,具有卓越的制電性、耐藥品性及成形品表面外觀性。In the examples of the present invention, the molded articles of V-1 to V-23 have excellent electric properties, chemical resistance, and surface appearance of the molded article.
比較例V-1屬於本發明(B)成份的用量脫離發明範圍較多的例子,且(C1)成份的用量脫離發明範圍較少的例子,故制電性及成形品表面外觀較差;比較例V-2則是本發明(B)成份的用量,脫離發明範圍較少的例子,(C1)成份用量脫離發明範圍較多的例子,故耐藥品性及成形品表面外觀較差;比較例V-3屬於本發明(C2-1)成份的用量,脫離發明範圍較少的例子,故制電性較差;比較例V-4屬於本發明(C2-2)成份的用量脫離發明範圍較多的例子,故耐藥品性及成形品表面外觀較差;比較例V-4則是本發明(D)成份用量,脫離發明範圍較多的例子,故耐藥品性及成形品表面外觀較差。Comparative Example V-1 is an example in which the amount of the component (B) of the present invention is out of the scope of the invention, and the amount of the component (C1) is out of the range of the invention, so that the electrical conductivity and the surface appearance of the molded article are poor; V-2 is an example of the amount of the component (B) of the present invention, which is out of the scope of the invention, and the amount of the component (C1) is out of the scope of the invention, so that the chemical resistance and the surface appearance of the molded article are poor; Comparative Example V- 3 The amount of the component (C2-1) of the present invention is out of the scope of the invention, so that the electroforming property is inferior; the comparative example V-4 is an example in which the amount of the component (C2-2) of the present invention is out of the scope of the invention. Therefore, the chemical resistance and the surface appearance of the molded article were inferior; the comparative example V-4 was an example in which the amount of the component (D) of the present invention was out of the scope of the invention, so that the chemical resistance and the surface appearance of the molded article were inferior.
以表6所記載之配方比率,藉由Henshell攪拌器混合後,再用二軸壓出機(汽缸設定溫度220℃)進行溶融混練後作成顆粒狀;將所得之顆粒充分乾燥後,則用射出成形(汽缸設定溫度210℃)獲得耐衝擊性評估用試片。The mixture ratio shown in Table 6 was mixed by a Henshell mixer, and then subjected to melt-kneading using a two-axis extruder (cylinder set temperature: 220 ° C) to form pellets; after the obtained pellets were sufficiently dried, they were sprayed. Forming (cylinder setting temperature: 210 ° C) A test piece for evaluation of impact resistance was obtained.
核心層使用的是使用上述聚合物A1厚度800μm薄板,表層與底層則用厚度各為100μm的上述熱塑性樹脂組成物,共同壓出(溫度220℃)以做出積層的三層薄板後,而獲得厚度1mm薄板;裁斷此薄板,以作為制電性評估用試片制電持續性評估用試片、及耐藥品性評估用試片;各種評估結果如表6所示。The core layer was obtained by using the above-mentioned polymer A1 sheet having a thickness of 800 μm, and the surface layer and the bottom layer were each formed by using the above-mentioned thermoplastic resin composition having a thickness of 100 μm, and co-extrusion (temperature: 220 ° C) to obtain a laminated three-layer sheet. A sheet having a thickness of 1 mm; the sheet was cut for use as a test piece for evaluation of electrical continuity of test pieces for electric power evaluation, and a test piece for evaluation of chemical resistance; Table 6 shows various evaluation results.
從表56所記載之結果中可明確出以下事項。From the results described in Table 56, the following matters were clarified.
本發明實施例VI-1~VI-15成形品,具有卓越的制電性、制 電持續性、耐藥品性及耐衝擊性,尤其是實施例VI-1~VI-14成形品,具有卓越的制電性。The molded articles of the embodiments VI-1 to VI-15 of the present invention have excellent electric properties and system Electrical durability, chemical resistance, and impact resistance, especially in the molded articles of Examples VI-1 to VI-14, have excellent electrical properties.
另一方面,比較例V-1屬於本發明(C1)成份的用量脫離發明範圍較多的例子,故制電性及成形品表面外觀較差。On the other hand, Comparative Example V-1 is an example in which the amount of the component (C1) of the present invention is out of the range of the invention, so that the electrical conductivity and the surface appearance of the molded article are inferior.
本發明之熱塑性樹脂組成物,具有傳統產品所沒有的卓越耐衝擊性、耐藥品性、成形品表面外觀及防靜電乃至制電性,可適用於要求高度性能的車輛、電氣、電子、OA、家電、衛生保健領域等各種零組件。The thermoplastic resin composition of the invention has excellent impact resistance, chemical resistance, surface appearance of the molded article, antistatic property and electric property, and can be applied to vehicles, electrical, electronic, OA, which require high performance. Various components such as home appliances and health care.
1‧‧‧2層型成形品1‧‧‧2 layer molded products
11‧‧‧基層11‧‧‧ grassroots
12、12a及12b‧‧‧帶電防止層12, 12a and 12b‧‧‧charged prevention layer
2‧‧‧3層型成形品2‧‧‧3 layer molded products
圖1…本發明的多層成形品例、2層構造成形品概略斷面圖Fig. 1 is a schematic cross-sectional view showing a multilayer molded article and a two-layer structure molded article of the present invention;
圖2…本發明的多層成形品例、3層構造成形品概略斷面圖Fig. 2 is a schematic cross-sectional view showing a multilayer molded article and a three-layer structure molded article of the present invention;
1...2層型成形品1. . . 2-layer molded product
11...基層11. . . Grassroots
12...帶電防止層12. . . Charge prevention layer
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