TWI392420B - A method for manufacturing a substrate for component mounting and a substrate for component mounting - Google Patents

Description

Manufacturing method of component mounting substrate and substrate for component mounting

The present invention relates to a method of manufacturing a component mounting substrate and a component mounting substrate in which a wiring board is connected to a housing via a connecting portion. This application is related to the Japanese application filed below, and claims the priority of the Japanese application from the following.

Japanese Patent Application Patent Application No. 2008-011162 Application Date January 22, 2008

Electronic devices such as mobile information terminals and digital cameras are required to be compact, high-performance, and thin. In order to meet the demand for these electronic devices, various printed wiring boards (hereinafter simply referred to as wiring boards) for high-density component mounting are commercialized. The wiring board may, for example, be a glass epoxy substrate (FR4) composed of a composite material of glass fibers and epoxy resin, or a hard wiring board in which a wiring pattern is formed by a conductor foil; or A resin film such as an imide film or a liquid crystal polymer, and a flexible wiring board having a wiring pattern formed of a conductor foil. Further, for example, there is a soft-hard composite wiring board in which a signal connector inside an electronic device is omitted, and a hard portion in which various components such as a module or an IC are mounted can be passed through a flexible portion without a connector. Made by scratching. The so-called soft and hard composite wiring board refers to a multilayer printed wiring board having a flexible portion and a hard portion, and its structure is diverse. For example, a glass epoxy resin substrate (FR4) comprising a composite material of a glass fiber and an epoxy resin in which a wiring pattern is formed by a conductor foil is used as a hard portion, and a wiring pattern is formed by a conductor foil. A resin film such as a polyimide film or a liquid crystal polymer is partially formed as a flexible portion, and the resin substrate and the resin film are partially exposed to each other to form a three-dimensional wiring structure.

Fig. 3 is a schematic view showing a workpiece (multilayer wiring board) in the prior manufacturing process. The small substrate 53 is connected to the first housing 5 via the first connecting portion 4 to be the sub-substrate 52. The sub-substrate 52 is connected to the second housing 15 via the second connecting portion 14 and integrally constitutes the mother substrate 51.

In the manufacturing process, the mother substrate 51 including the small substrate 53 and the sub-substrate 52 is integrally formed, and the sub-substrate 53 is cut and separated from the mother substrate 51 in the middle of the manufacturing process. In order to ensure the positioning accuracy of the high-density component of the component, the small substrate 53 is connected to the sub-substrate 52 on the housing 5 via the connecting portion 4, and the component is mounted on the component structure of the small substrate 53. On the surface. The above-described small substrate 53, sub-substrate 52, and mother substrate 51 are all one type of wiring board. In the present specification, in order to clearly distinguish the component mounting substrate (sub-substrate) from the wiring board (the mother substrate and the small-sized substrate), the small-sized substrate in which the component is directly mounted is connected via the connecting portion (first connecting portion) The state is shown as a substrate for component mounting.

With the miniaturization and high performance of the components, the components are required to be assembled in a clean environment when the components are assembled. In particular, when mounting a precision optical component such as a lens of a digital camera or a CCD, it is necessary to pay careful attention to maintain a clean environment. In the manufacturing process, when the component is known to be mounted, dust is generated from the side surface of the component mounting substrate. The dust generating material from the side surface of the above-described component mounting substrate is mainly composed of resin powder containing fibers such as glass. When the dust-emitting substance from the side surface of the component mounting substrate adheres to, for example, the surface of the precision optical component or the wiring board on which the precision optical component is to be mounted, a dot defect defect of the image and a lens may occur. There is a problem such as poor adhesion of foreign matter and poor offset of the reference angle, which is a major problem in manufacturing quality.

In the manufacturing process of the component mounting substrate, the connecting portion (the first connecting portion and the second connecting portion) is retained by a tool (processing device) such as a die or a router, and is applied along the wiring board. The outer shape is formed by the outer shape of the through groove (cutting process). By the outer shape processing, the wiring board, the connecting portion, and the frame body are exposed to the cut side surface (cut surface). For example, the side surface (cut surface) of the hard wiring board (hard portion) is a state in which the resin powder containing glass or the like is easily scattered due to the fibers of the glass or the like which are used to form the base material. Further, the dust generating material is scattered from the side surface of the hard wiring board (hard portion) due to vibration or the like in the manufacturing process, and adheres to the surface of the component or the component by electrostatic action or the like. Between the mounting surface and the wiring board on which the component is to be constructed. On the other hand, for example, the side surface (cut surface) of the flexible wiring board (flexible portion) is thinner than the hard wiring board (hard portion), so that the outer shape of the flexible portion is processed. The amount of dust generated is less than that caused by the shape of the hard part.

In the prior art, a manufacturing method is disclosed in which the rigid wiring board is connected to the component mounting substrate via the connecting portion, and the connecting portion is retained, and a shape of the through groove is formed along the outer shape of the hard wiring board. After the processing, a photosensitive resin such as a photoresist for insulation protection of a wiring pattern is applied to the side surface formed by the outer shape processing, and then exposed and developed, and the substrate for component mounting is coated with a photosensitive resin. The side surface is prevented from dusting from the side surface after cutting of the component mounting substrate (Patent Documents 1 and 2).

[Patent Document 1] Japanese Patent Laid-Open Publication No. 11-145580

[Patent Document 2] Japanese Patent Laid-Open Publication No. Hei 9-148719

However, the inventors newly discovered the following problems. The component mounting substrate in which the soft and hard composite wiring board is connected to the housing via the connection portion is formed on the side surface of the component mounting substrate by the same manufacturing method as in the above-described Patent Documents 1 and 2. After applying a photoresist (photosensitive resin) for insulating protection of a commercially available wiring pattern, exposure and development processing are performed, and the side surface of the cut is coated with the photosensitive resin, not only the hard portion The side surface (cut surface) of the joint portion and the frame body, and the side surface (cut surface) of the flexible portion are also coated with the photosensitive resin, and the side surface (cut surface) of the flexible portion is exposed. In the development process, the flexible portion is hardened and the problem of flexibility required as a flexible portion is impaired.

In view of the above, an object of the present invention is to provide a method for manufacturing a component mounting substrate and a component mounting substrate, which are a method for manufacturing a component mounting substrate and a component assembly in which a soft and hard composite wiring board is connected via a connecting portion. With the substrate, it is possible to prevent dust generated from the side surface of the hard portion while maintaining the flexibility necessary for the flexible portion.

On the other hand, in the aspect of the present invention, it is an object of the present invention to provide a method for manufacturing a component mounting substrate and a substrate for component mounting which can solve the above problems. This object is achieved by a combination of features recited in separate items in the scope of the patent application. Further, the subsidiary item defines a more advantageous specific example of the present invention.

A method of manufacturing a component mounting substrate according to a first aspect of the present invention is a method of manufacturing a soft and hard composite wiring board comprising a hard portion and a flexible portion, and is connected to the frame via a connecting portion. In the method of forming a substrate for a component, the connecting portion is retained, and a through groove is formed along an outer shape of the soft and hard composite wiring board, and then a side surface of the hard portion and a side surface of the frame are covered with a photosensitive resin. Then, the photosensitive resin is removed from the side surface of the flexible portion by exposure and development.

According to this aspect of the invention, when the side surface of the hard portion and the side surface of the frame are covered with a photosensitive resin, even if the photosensitive resin is adhered to the side surface of the flexible portion, the photosensitive resin is not exposed and is removed by the development process. Therefore, the flexibility necessary as the above-described flexible portion can be maintained. On the other hand, the side surface of the hard portion in which the fibers of the glass or the like constituting the base material are exposed is formed by the outer shape forming, and the photosensitive resin is coated.

In this aspect of the invention, the photosensitive resin coating operation in which the side surface of the hard portion is coated with a photosensitive resin is also used as the distribution of the wiring board. The resistive resin coating operation of the line pattern or the photoresist resin which uses the above-mentioned photosensitive resin as the wiring pattern can be applied to an existing manufacturing process (existing manufacturing equipment) or a manufacturing material.

This aspect of the present invention is for manufacturing a component for a component of a soft and hard composite wiring board composed of a hard portion and a flexible portion and connected to the first frame via the first connecting portion. The method of the substrate is applied to retain the first connecting portion and the second connecting portion while being connected to the second frame via the second connecting portion between the component mounting substrates. After the outer shape of the soft and hard composite wiring board is formed into the through groove, the side surface of the hard portion and the side surfaces of the first frame and the second frame are covered with a photosensitive resin, and then exposed from the side of the flexible portion by exposure and development. After the photosensitive resin is removed, the method of manufacturing the second connecting portion is cut. According to this manufacturing method, since the above-described component mounting substrates can be connected in a state of being connected via the second connecting portion, the above-described process of applying, exposing, developing, and the like of the photosensitive resin can be reduced. The scale of the work is collected and processed in a unified manner.

The first housing may be an example of the first holding portion. The second housing may be an example of the second holding portion. The second joint may not contain fibers. The second joint may be an organic material that does not contain fibers. The above fiber may be a glass fiber contained in a glass epoxy resin substrate (FR4). The above fiber may be an example of a dusting substance.

A component mounting substrate according to a second aspect of the present invention is a component mounting substrate obtained by connecting a hard and soft composite wiring board including a hard portion and a flexible portion to a frame via a connecting portion. It is characterized in that the side surface of the hard portion and the side surface of the frame are covered with a resin, but at least a side surface of the flexible portion is not coated with a resin. According to this aspect of the present invention, it is possible to suppress dust generation while maintaining the flexibility necessary for the flexible portion of the soft and hard composite wiring board. Therefore, if any resin is located in the flexible portion, it is not appropriate. Further, it is preferable that the top surface or the bottom surface of the flexible portion does not impair the flexibility required for the flexible portion. However, the flexibility required as the flexible portion can be maintained by applying the resin to at least the side surface of the flexible portion. The resin may, for example, be a photosensitive resin or a thermosetting resin.

In the above aspect of the invention, the substrate for component assembly, wherein the resin is preferably a photosensitive resin used for insulation of a wiring pattern of the wiring board.

According to the aspect of the invention, the resin is a photosensitive resin used for the insulation of the wiring pattern of the wiring board, and the insulating resin located on the top surface of the wiring board and the side surface of the wiring board are covered. Since the resin is the same resin, it can be handled in a unified manner without a new manufacturing process.

In the aspect of the present invention, the component mounting substrate, wherein the connecting portion and the flexible portion are preferably made of an organic material that does not contain fibers such as glass. The amount of dust generated from the cut side surface of the connecting portion and the flexible portion can be extremely reduced.

According to a third aspect of the invention, there is provided a method of manufacturing a substrate for component mounting, comprising: a step of preparing a substrate, the substrate having a hard portion in which a wiring pattern is formed, and a flexible portion connected to the hard portion a flexible portion; at least a first holding portion for holding the hard portion; and a first connecting portion for connecting the hard portion and the first holding portion; at least a photosensitive resin is applied to a side surface of the hard portion and the first portion a step of at least an inner surface of the holding portion; and exposing and developing the photosensitive resin, wherein the photosensitive resin remains on a side surface of the hard portion and at least an inner side surface of the first holding portion, and the photosensitive resin is substantially The stage does not remain on at least the side surface of the flexible portion.

In the method of manufacturing the substrate for the component assembly, the step of preparing the substrate may include forming a through-groove by superposing a hard substrate including fibers and a flexible wiring substrate having a flexible flexible substrate. The stage of forming the above substrate. In the method of manufacturing a component mounting substrate, the substrate may have a plurality of the hard portions, the flexible portion, and the first connecting portion, and the plurality of hard portions may pass through the plurality of first connecting portions And connected to the first holding portion.

In the method of manufacturing a component mounting substrate, the flexible portion may not contain a dusting substance. In the method of manufacturing a component mounting substrate, the first connecting portion may not contain a dusting substance. In the method of manufacturing a component mounting substrate, the substrate includes at least a plurality of the first holding portions to which the hard portion is coupled, and a second holding portion for holding the plurality of first holding portions; And a plurality of second connecting portions that respectively connect the plurality of first holding portions and the second holding portions.

According to a fourth aspect of the present invention, a method of manufacturing a component mounting substrate includes: a first hard portion; a second hard portion; and flexibility and electrical properties. a flexible portion that combines the first hard portion and the second hard portion; a first holding portion that holds the first hard portion and the second hard portion; and the first holding portion and the first hard portion or the a first connecting portion of the second hard portion; at least a step of applying a photosensitive resin to a side surface of the first hard portion, a side surface of the second hard portion, and at least an inner side surface of the first holding portion; and exposing and displaying In the photosensitive resin, the photosensitive resin remains on the side surface of the first hard portion, the side surface of the second hard portion, and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain. a stage on at least one side of the flexible portion.

According to a fifth aspect of the present invention, a substrate for component mounting includes: a hard portion in which a wiring pattern is formed; a flexible portion that is connected to the hard portion and has flexibility; and at least the hard portion is held a first holding portion; and a first connecting portion that connects the hard portion and the first holding portion; wherein a resin for suppressing dust generation from the side surface is disposed on a side surface of the hard portion, and the flexible portion is At least the side surface is substantially not provided with the same kind of resin as the above resin. In the above-described component mounting substrate, the resin may include the same material as the insulating resin used for the insulation of the wiring pattern of the hard portion.

According to a sixth aspect of the present invention, a substrate for a component assembly is provided, which is obtained by first preparing a substrate having a hard portion in which a wiring pattern is formed, and being connected to the hard portion to be flexible a flexible portion; at least a first holding portion for holding the hard portion; and a first connecting portion for connecting the hard portion and the first holding portion; and then applying at least a photosensitive resin to a side surface of the hard portion and the The photosensitive resin is exposed and developed on at least the inner surface of the first holding portion, and the photosensitive resin remains on the side surface of the hard portion and at least the inner surface of the first holding portion, and the photosensitive property is caused. The resin does not substantially remain on at least the side surface of the flexible portion.

According to a seventh aspect of the present invention, a substrate for a component assembly includes: a first hard portion; a second hard portion; and a flexible, electrically bonded first and second hard portions a flexible portion; a first holding portion that holds the first hard portion and the second hard portion; and a first connecting portion that connects the first holding portion and the first hard portion or the second hard portion; A resin for suppressing dust generation from the side surface is disposed on a side surface of the first hard portion and a side surface of the second hard portion, and a resin of the same kind as the resin is not substantially disposed on at least a side surface of the flexible portion.

According to an eighth aspect of the invention, there is provided a method of manufacturing a soft and hard composite wiring board, comprising: a step of preparing a substrate, the substrate having a hard portion in which a wiring pattern is formed; and being connected to the hard portion and being flexible a flexible portion; at least a first holding portion for holding the hard portion; and a first connecting portion for connecting the hard portion and the first holding portion; at least a photosensitive resin is applied to a side surface of the hard portion and the first portion a step of at least an inner surface of the holding portion; exposing and developing the photosensitive resin, wherein the photosensitive resin remains on a side surface of the hard portion and at least an inner surface of the first holding portion, and the photosensitive resin is substantially a stage that does not remain on at least one side surface of the flexible portion; and a stage in which the first holding portion and the hard portion are separated.

In the method for manufacturing a soft and hard composite wiring board, the step of separating the first holding portion and the hard portion may further include a step of attaching the component to the hard portion.

A ninth aspect of the present invention provides a method of manufacturing a soft and hard composite wiring board, comprising: a step of preparing a substrate, the substrate having: a first hard portion; a second hard portion; having flexibility and electrical properties a flexible portion that combines the first hard portion and the second hard portion; a first holding portion that holds the first hard portion and the second hard portion; and the first holding portion and the first hard portion or the a first connecting portion of the second hard portion; at least a step of applying a photosensitive resin to a side surface of the first hard portion, a side surface of the second hard portion, and at least an inner side surface of the first holding portion; exposure and display In the photosensitive resin, the photosensitive resin remains on the side surface of the first hard portion, the side surface of the second hard portion, and at least the inner surface of the first holding portion, and the photosensitive resin is substantially not a step of remaining on at least one side surface of the flexible portion; and a step of separating the first holding portion and the first hard portion and the second hard portion.

According to a tenth aspect of the present invention, a soft and hard composite wiring board comprising: a hard portion in which a wiring pattern is formed; and a flexible portion that is connected to the hard portion and has flexibility; wherein the hard portion is The side surface of the portion is provided with a resin for suppressing dust generation from the side surface, and at least a side surface of the flexible portion is substantially not provided with a resin of the same kind as the resin.

In the above-described soft and hard composite wiring board, the resin may include the same material as the insulating resin used for the insulation of the wiring pattern of the hard portion.

According to an eleventh aspect of the present invention, a soft and hard composite wiring board is provided which is prepared by first preparing a substrate having: a hard portion formed with a wiring pattern; and connecting the hard portion to have a a flexible flexible portion; at least a first holding portion for holding the hard portion; and a first connecting portion for connecting the hard portion and the first holding portion; and then applying at least a photosensitive resin to a side surface of the hard portion The photosensitive resin is exposed and developed on at least the inner surface of the first holding portion, and the photosensitive resin remains on the side surface of the hard portion and at least the inner surface of the first holding portion, and the photosensitive material is exposed. The resin does not substantially remain on at least the side surface of the flexible portion, and then separates the first holding portion from the hard portion.

According to a twelfth aspect of the present invention, a soft and hard composite wiring board includes: a first hard portion; a second hard portion; and a flexible, electrically coupled first hard portion and second portion a flexible portion of the hard portion; wherein a side surface of the first hard portion and a side surface of the second hard portion are provided with a resin for suppressing dust generation from the side surface, and at least a side surface of the flexible portion is substantially The same kind of resin as the above resin was not disposed.

Further, the summary of the above invention does not recite all of the essential features of the present invention, and a sub-combination of these feature groups may also be an invention.

According to this aspect of the invention, when the side surface of the hard portion is coated with a photosensitive resin, even if the photosensitive resin is adhered to the flexible portion, it is not exposed to light and is removed by development processing. Therefore, the flexibility necessary as the above-described flexible portion is maintained. On the other hand, the side surface of the said hard part is covered with the photosensitive resin. In addition, since the connecting portion and the flexible portion are made of a resin material that does not contain fibers such as glass, the amount of dust generated from the cut side surface of the connecting portion and the flexible portion can be extremely reduced. Therefore, according to the present invention, a substrate for component mounting can be realized, and while maintaining the flexibility required as the flexible portion, the side surface of the hard portion can be selectively covered with a photosensitive resin to prevent dust generation.

Hereinafter, the best mode for carrying out the invention will be described with reference to the drawings.

Hereinafter, this aspect of the present invention will be described by way of an embodiment of the invention, but the following embodiments are not intended to limit the invention claimed in the claims, and in addition, combinations of features described in the embodiments. All is not necessarily necessary for the solution of the invention.

(Substrate for component mounting according to an embodiment of the present invention)

Fig. 1(a) is a schematic view showing an example of a component mounting substrate 1 according to an embodiment of the present invention, and Fig. 1(b) is an AA cross section of the component mounting substrate 1. Fig. 1(c) is a BB cross-sectional view of the component mounting substrate 1, and Fig. 1(d) is a side view of the component mounting substrate 1. In the present embodiment, a plurality of (four illustrated in the first drawing) soft and hard composite wiring boards 2 as small-sized substrates are connected to the housing 5 of the housing 5 via the connecting portion 4. Further, the side faces 7a and 7b (the outer side surface 7a and the inner side surface 7b) of the hard portion 7 of the soft and hard wiring board 2 and the side faces 5a and 5b (the outer side surface 5a and the inner side surface 5b) of the frame 5 are The photosensitive resin 9 is covered. However, the side surface 8a (outer side surface 8a) of the flexible portion 8, the top surface 8c of the flexible portion 8, and the bottom surface 8d are not coated with the photosensitive resin 9. Therefore, the substrate 1 for a component of the present embodiment is selectively used while maintaining the flexibility required as the flexible portion 8 without applying the photosensitive resin 9 to the side surface 8a of the flexible portion 8. The coating photosensitive resin 9 is prevented from generating dust on the side faces 7a and 7b of the hard portion 7 and the side faces 5a and 5b of the frame 5.

The photosensitive resin 9 is also an insulating resin that is used as a wiring pattern (a wiring pattern to be connected to the top surface wiring electrode 54) of the top surface 7c of the hard portion 7. This is intended to simplify the manufacturing method described below. The main component of the resin material of the hard portion 7 is an epoxy compound, and the main component of the photosensitive resin 9 is also an epoxy compound. This is to improve the adhesion between the photosensitive resin 9 and the hard portion 7. The resin material of the flexible portion 8 is a polyimide which does not contain fibers such as glass. The resin material of the connecting portion 4 is also composed of a polyimide which does not contain fibers such as glass. This is to reduce the amount of dust generated from the side surface 8a of the flexible portion 8 not covered with the photosensitive resin 9 or the side surface 4a of the connecting portion 4. In addition, after the component is assembled, the connection portion 4 is cut. However, since the connection portion 4 is made of polyimide which does not contain fibers such as glass, the amount of dust generated from the side surface of the cut connection portion 4 is small. .

The component mounting substrate 1 and the soft and hard composite wiring board 2 can be separated by the separation frame 5 and the hard portion 7. The casing 5 can be an example of the first holding portion. The side surface 5b of the casing 5 can be an example of the inner side surface. The hard portion 7 may be an example of the first hard portion or the second hard portion.

In the present embodiment, the case where the side surface 5a and the side surface 5b of the casing 5 are covered with the photosensitive resin 9 has been described, but the invention is not limited thereto. For example, at least the side surface 5b of the casing 5 may be covered with a photosensitive resin. For example, the side surface 5b of the frame 5 is covered with a resin, but the side surface 5a may not be covered with a resin. The outer side surface 5a is farther away from the mounting area of the component such as the image sensor, and the influence of the dusting substance scattered from the outer side surface 5a is affected by the dusting substance scattered from the inner side surface 5b. More, the system is smaller.

In the present embodiment, the board|substrate assembly board|substrate 1 has the several soft-hard-bonding wiring board 2 and the several connection part 4, and the several soft-hard- The case is connected to the inner side of the casing 5. However, the substrate for component mounting is not limited thereto, and for example, the shape of the first holding portion may be a plate shape, a rod shape, or an H shape.

Further, in the present embodiment, the case where the soft and hard composite wiring board 2 has the two hard portions 7 and the flexible portion 8 electrically couples the two hard portions 7 has been described, but the soft and hard composite wiring board is not limited thereto. For example, the soft and hard composite wiring board may be provided with at least one hard portion and a flexible portion connected to the hard portion. The soft and hard composite wiring board may have, for example, a hard portion, one end of the flexible portion being connected to the hard portion, and the other end of the flexible portion being provided with a connector. Further, in the present specification, not only the state in which the components are attached to the hard portion but also the state in which the components are mounted on the hard portion is referred to as a soft and hard composite wiring board.

(Method of Manufacturing Substrate Assembly Substrate According to an Embodiment of the Present Invention)

Fig. 2 is a process flow diagram showing an example of a manufacturing procedure of the component mounting substrate 1 of the present invention. An example of a method of manufacturing the component mounting substrate 1 to which the present invention is applied will be described below based on the process flow chart of Fig. 2 .

First, the workpiece (multilayer wiring board) in which the flexible substrate (the substrate serving as the flexible portion 8) and the hard substrate (the substrate serving as the hard portion 7) are integrally molded is subjected to outer shape processing (S1). Here, the outer shape processing means that the connecting portion 4 is retained by a tool (processing equipment) such as a mold or a router, and the outer shape of the soft and hard composite wiring board 2 is formed to form a through groove. 6. The positioning hole 57 of the hard portion 7 and the component mounting hole 56 are also processed in the process of S1.

Then, if necessary, the surface of the electrode such as copper for forming the wiring pattern of the top surface of the workpiece (multilayer wiring board) is removed, or the pre-processing for forming a moderate unevenness is performed (not shown). In order to improve the adhesion to the photosensitive resin 9. Examples of the pretreatment include pickling, caustic washing, and the like.

After the outer shape processing (S1), the photosensitive resin 9 is applied to the top surface 7c of the hard portion 7 of the workpiece (multilayer wiring board), the side surfaces 7a and 7b of the hard portion 7, and the side surfaces 5a and 5b of the housing 5 ( S2). As a method of applying the photosensitive resin 9, for example, a spray coating method, a curtain coating method, a roll coating method, a screen printing method, or the like can be applied, but it is preferably applied by a spray coating method. The photosensitive resin 9 can be applied by a spray coating method in which the shape of the above-mentioned workpiece (multilayer wiring board) is wide-angled. That is, even if the side faces 7a and 7b of the hard portion 7 or the side faces 5a and 5b of the frame 5 have irregularities, the photosensitive resin 9 can be surely applied.

After the photosensitive resin is applied (S2), the workpiece (multilayer wiring board) is subjected to a drying treatment to evaporate the organic solvent of the applied photosensitive resin 9 (S3). Here, the photosensitive resin coating (S2) and the drying process (S3) are continuously performed by a spraying device (spray line).

After the drying treatment (S3), the mask film formed by the artwork is adhered to the workpiece (multilayer wiring board), and then exposed to ultraviolet light to react the photosensitive group of the photosensitive resin 9 at the exposure ( Photopolymerization) (S4).

The photosensitive resin 9 can be exemplified by a positive-type resist in which an exposure field is eluted by a developing process, and a negative-type photoresist which does not elute in an exposure field by a developing process. By using a positive photoresist, the photosensitive resin 9 can be selectively left in a portion where light such as a through hole (through hole) does not reach. Further, as a photosensitive resin which is widely used for a negative photoresist, an existing solder resist device (solder resist photoresist line) can be used.

First, a case where the photosensitive resin 9 is a negative photoresist will be described. The field in which the photosensitive resin 9 is to be removed in the subsequent process, that is, the top surface wiring electrode 54, the component rear portion 55, the side surface 8a of the flexible portion 8, and the top surface 8c and the bottom surface 8d of the flexible portion 8 are borrowed. The photomask film is shielded from light. Further, in the subsequent process, the field of the photosensitive resin 9 is not removed, that is, the wiring pattern of the top surface 7c of the hard portion 7 (the wiring pattern to be connected to the top surface wiring electrode 54), the side surface 7a of the hard portion 7, 7b and the side faces 5a, 5b of the casing 5 are exposed (S4).

After the exposure processing (S4), the above-described workpiece (multilayer wiring board) is subjected to development (S5). The development methods include a dipping method, a spraying method, a stirring method, and the like. The top surface wiring electrode 54, the component rear portion 55, the side surface 8a of the flexible portion 8, the top surface 8c of the flexible portion 8, and the bottom surface 8d which are shielded by the above-described mask film are applied by the development processing. The adhered photosensitive resin 9 is dissolved in the developing solution. As the developing liquid, for example, an alkaline aqueous solution can be used.

After the development processing (S5), water washing and water removal (not shown) are performed, and then the workpiece (multilayer wiring board) is heated by heating means (S6). By heating, the wiring pattern of the top surface 7c of the coated hard portion 7 (the wiring pattern to be connected to the top surface wiring electrode 54), the side surfaces 7a and 7b of the hard portion 7, and the side surfaces 5a and 5b of the casing 5 are exposed. Resin 9, completely hardened. As the heating means, for example, a hot plate can be employed. In the case where necessary, after the development process (S5), the workpiece is further irradiated with ultraviolet rays to completely react the photosensitive group of the photosensitive resin 9 at the exposure place, and then the workpiece (multilayer wiring board) is heated by heating means. And it hardens (S6).

The component mounting substrate 1 of the present embodiment is manufactured by the above-described manufacturing method. In the component mounting substrate 1 of the present embodiment which is produced by the above-described manufacturing method, the side faces 7a and 7b of the hard portion 7 and the side faces 5a and 5b of the frame 5 are covered with the photosensitive resin 9, but The photosensitive resin 9 is not applied to the side surface 8a of the flexible portion 8, the top surface 8c of the flexible portion 8, and the bottom surface 8d. Therefore, the side surfaces 7a and 7b of the hard portion 7 selectively coat the photosensitive resin 9.

In the above-described manufacturing method, the wiring pattern of the top surface 7c of the hard portion 7 (the wiring pattern to be connected to the top surface wiring electrode 54) and the hard portion 7 of the hard portion 7 are coated with the photosensitive resin 9 for the purpose of rationalizing the manufacturing process. The side faces 7a, 7b, and the side faces 5a, 5b of the frame 5, but each process can also be separately.

In the above-described production method, the case where the photosensitive resin 9 is a negative photoresist is described, but the photosensitive resin 9 may be a positive photoresist. In other words, when the photosensitive resin 9 is a positive type resist, in the process of exposure (S4), in the subsequent process, the field of the photosensitive resin 9 is not removed, that is, the wiring of the top surface 7c of the hard portion 7. The pattern (the wiring pattern to be connected to the top surface wiring electrode 54), the side surfaces 7a and 7b of the hard portion 7, and the side surfaces 5a and 5b of the frame body 5 are shielded from light by the above-described mask film. Further, in the subsequent process, the field in which the photosensitive resin 9 is to be removed, that is, the top surface wiring electrode 54, the zero-intermediate portion 55, the side surface 8a of the flexible portion 8, the top surface 8c of the flexible portion 8, and The bottom surface 8d is exposed (S4). Further, after the exposure (S4), the workpiece (multilayer wiring board) is subjected to development (S5). The top surface wiring electrode 54 exposed by the photomask film, the component rear portion 55, the side surface 8a of the flexible portion 8, the top surface 8c of the flexible portion 8, and the bottom surface 8d are attached by development. The photosensitive resin 9 is dissolved in a developing solution. After the development process (S5), the above heating process is performed (S6).

In the above-described manufacturing method, the manufacturing method in the state of the sub-substrate (corresponding to the sub-substrate 52 of FIG. 3) has been described, but in the state of the mother substrate (corresponding to the mother substrate 51 of FIG. 3), After the manufacturing method is the same, the separation sub-substrate is cut out from the second connection portion (corresponding to the second connection portion 14 of FIG. 3) as the component mounting substrate 1 (for example, the state of FIG. 1). At this time, in the state in which the above-described component mounting substrates 1 are connected via the second connecting portion 14, a plurality of processes such as the above-described outer shape processing and photosensitive resin coating are processed and integrated.

The component mounting substrate 1 thus manufactured is attached to a component mounting process, and components such as precision optical components are to be mounted.

Thus, for example, according to the following steps, a substrate for component mounting can be manufactured, comprising: a hard portion in which a wiring pattern is formed; a flexible portion connected to the hard portion and having flexibility; and at least the hard portion is held And a first connecting portion that connects the hard portion and the first holding portion; wherein a resin for suppressing dusting from the side surface is disposed on a side surface of the hard portion, and the flexible portion is disposed at the flexible portion At least the side surface is substantially not provided with the same kind of resin as the above resin. The resin may include the same material as the insulating resin used for the insulation of the wiring pattern of the hard portion. In the present specification, the term "substantially unreacted resin" includes not only the case where the resin is not disposed, but also the extent to which the resin remains without impairing the flexibility necessary for the flexible portion.

First, a substrate is provided which includes: a hard portion in which a wiring pattern is formed; a flexible portion that is connected to the hard portion and has flexibility; a first holding portion that holds at least the hard portion; and the hard portion and the The first connecting portion of the first holding portion. Next, at least a photosensitive resin is applied to at least the inner side surface of the first holding portion on the side surface of the hard portion. Thereafter, the photosensitive resin is exposed and developed, and the photosensitive resin remains on at least the inner side surface of the hard portion and the first holding portion, and the photosensitive resin does not substantially remain in the flexible portion. At least on the side of the part.

Further, for example, according to the following steps, a soft and hard composite wiring board having a hard portion in which a wiring pattern is formed and a flexible portion connected to the hard portion and having flexibility can be manufactured. The side surface of the hard portion is provided with a resin for suppressing dust generation from the side surface, and at least a side surface of the flexible portion is substantially not provided with a resin of the same kind as the resin. The resin may include the same material as the insulating resin used for the insulation of the wiring pattern of the hard portion.

First, a substrate is provided which includes: a hard portion in which a wiring pattern is formed; a flexible portion that is connected to the hard portion and has flexibility; a first holding portion that holds at least the hard portion; and the hard portion and the The first connecting portion of the first holding portion. Next, at least a photosensitive resin is applied to at least the inner side surface of the first holding portion on the side surface of the hard portion. Then, the photosensitive resin is exposed and developed, and the photosensitive resin remains on at least the inner side surface of the hard portion and the first holding portion, and the photosensitive resin does not substantially remain in the flexible portion. At least on the side of the part. Thereafter, the first holding portion and the hard portion are separated.

Further, in the present embodiment, a case has been described in which a substrate is provided, and the hard portion 7, the flexible portion 8, and the first holding portion are an example of the frame 5 and the first connecting portion, that is, the connecting portion 4 In the case of manufacturing the component mounting substrate 1, the method of manufacturing the component mounting substrate is not limited thereto. For example, as the substrate, a substrate may be prepared having a plurality of first holding portions to which a soft and hard composite wiring board is connected, a second holding portion for holding the plurality of first holding portions, and a connection portion a plurality of second connecting portions of the plurality of first holding portions and the second holding portions.

(Example)

According to the manufacturing method of the present embodiment, the substrate 1 for component mounting is produced. The size of the substrate 1 for component mounting is 110 mm in length and 60 mm in width. The existing photosensitive resin 9 is applied by an existing solder resist photoresist processing apparatus, and then subjected to drying, exposure, development, and heat hardening treatment. The component assembly was performed on the completed component mounting substrate 1, and it was found that the amount of dust generated was reduced as compared with the conventional article. This is considered to be because the side faces 7a and 7b of the hard portion 7 of the component mounting substrate 1 and the side faces 5a and 5b of the frame body 5 are covered with the photosensitive resin 9. Further, the flexible portion 8 of the component mounting substrate 1 can maintain the flexibility required as the flexible portion 8. This is considered to be because the photosensitive resin 9 is not applied to the side surface 8a of the flexible portion 8 of the component mounting substrate 1, the top surface 8c of the flexible portion, and the bottom surface 8d.

The above is not limited to the above embodiment. For example, even if the base material of the connection portion 4 is a glass epoxy compound (FR4), dust can be prevented by applying the photosensitive resin 9 to the top surface of the connection portion 4 or the side surface 4a of the connection portion. Thus, the present invention can be appropriately modified within the scope of the invention.

The present invention has been described above using the embodiment, but the technical scope of the present invention is not limited to the scope described in the above embodiment. It will be apparent to those skilled in the art that various changes or modifications can be made to the above-described embodiments. It is to be understood from the description of the scope of the patent application that such a modified or improved form may be included in the technical scope of the present invention.

The order of execution of the processes, procedures, procedures, and stages in the devices, systems, programs, and methods shown in the patent application, the specification, and the drawings is not specifically indicated as "before", "first", etc. Moreover, the output of the previous processing is not limited to use in subsequent processing, and may be implemented in any order. The operation flow in the patent application scope, the specification, and the drawings is described using "first", "continued", etc. for convenience of explanation, but does not mean that it must be implemented in this order.

[Industry use possibility]

It is possible to maintain the flexibility necessary for the flexible portion of the soft and hard composite wiring board having the hard portion and the flexible portion, and can be applied to the production of the substrate for component mounting.

1. . . Substrate assembly substrate (sub-substrate)

2. . . Soft and hard composite wiring board (small substrate, wiring board)

4. . . Connecting portion (first connecting portion)

4a. . . Side of the joint

5. . . Frame (first frame, first holding portion)

5a. . . Side of the frame

5b. . . Side of the frame

6. . . Through groove (first through groove)

7. . . Hard part

7a. . . Side of the hard part

7b. . . Side of the hard part

7c. . . Top surface of the hard part

8. . . Flexible part

8a. . . Side of the flexible portion

8c. . . Top surface of the flexible portion

8d. . . Bottom of the flexible portion

9. . . Resin (photosensitive resin, solder resist)

14. . . Second joint

15. . . Second frame (second holding portion)

51. . . Mother substrate

52. . . Subsubstrate

53. . . Small substrate

54. . . Top wiring electrode

55. . . Part of the part

56. . . Part mounting hole

57. . . Positioning hole

Fig. 1(a) is a schematic view showing a substrate for component mounting to which an embodiment of the present invention is applied.

Fig. 1(b) is a schematic view showing a substrate for component mounting to which an embodiment of the present invention is applied.

Fig. 1(c) is a schematic view showing a substrate for component mounting to which an embodiment of the present invention is applied.

Fig. 1(d) is a schematic view showing a substrate for component mounting to which an embodiment of the present invention is applied.

Fig. 2 is a flow chart showing the manufacturing process of the above embodiment.

Fig. 3 is a schematic view showing a workpiece (multilayer wiring board) in the prior manufacturing process.

1. . . Substrate assembly substrate (sub-substrate)

2. . . Soft and hard composite wiring board (small substrate, wiring board)

4. . . Connecting portion (first connecting portion)

4a. . . Side of the joint

5. . . Frame (first frame, first holding portion)

5a. . . Side of the frame

5b. . . Side of the frame

6. . . Through groove (first through groove)

7. . . Hard part

7a. . . Side of the hard part

7b. . . Side of the hard part

7c. . . Top surface of the hard part

8. . . Flexible part

8a. . . Side of the flexible portion

8c. . . Top surface of the flexible portion

8d. . . Bottom of the flexible portion

9. . . Resin (photosensitive resin, solder resist)

54. . . Top wiring electrode

55. . . Part of the part

56. . . Part mounting hole

57. . . Positioning hole

Claims (23)

A method of manufacturing a component mounting substrate for manufacturing a component mounting substrate obtained by connecting a hard and soft composite wiring board composed of a hard portion and a flexible portion to a frame via a connecting portion In the method, the connecting portion is formed, and a through groove is formed along the outer shape of the soft and hard composite wiring board, and then a side surface of the hard portion and at least an inner surface of the frame are covered with a photosensitive resin, and then exposed, Development, the photosensitive resin is removed from the side surface of the flexible portion. The method of manufacturing a component mounting substrate according to the first aspect of the invention, wherein the connecting portion and the flexible portion are made of an organic material that does not contain fibers such as glass. A component mounting substrate which is a component assembly substrate obtained by connecting a hard and soft composite wiring board composed of a hard portion and a flexible portion to a frame via a connecting portion, characterized in that the hard substrate The side surface of the portion and at least the inner surface of the frame are covered with a resin, but at least a side surface of the flexible portion is not coated with a resin. The substrate for component mounting according to the third aspect of the invention, wherein the resin is a photosensitive resin used for insulation of a wiring pattern of the wiring board. The substrate for component assembly according to the third aspect of the invention, wherein the connecting portion and the flexible portion are made of an organic material that does not contain fibers such as glass. A method of manufacturing a substrate for component mounting, comprising: a step of preparing a substrate, the substrate having a hard portion in which a wiring pattern is formed; and a flexible portion connected to the hard portion and having flexibility; and maintaining at least the hard portion a first holding portion of the portion; and a first connecting portion that connects the hard portion and the first holding portion; at least a step of applying a photosensitive resin to at least an inner side surface of the hard portion and the first holding portion; And exposing and developing the photosensitive resin, wherein the photosensitive resin remains on at least an inner side surface of the hard portion and the first holding portion, and the photosensitive resin does not substantially remain in the flexible portion. At least the stage on the side. The method for producing a substrate for a component according to claim 6, wherein the step of preparing the substrate includes a hard substrate including fibers and a flexible substrate having flexibility. The multilayer wiring board is formed by forming a through-groove to form the substrate. The method of manufacturing a component mounting substrate according to claim 6 or 7, wherein the substrate has a plurality of the hard portions, the flexible portion, and the first connecting portion; and the plurality of hard portions are respectively The first connecting portion is connected to the first holding portion via the plurality of first connecting portions. The method for producing a substrate for component assembly according to claim 6 or 7, wherein the flexible portion does not contain a dusting substance. The method of manufacturing a component mounting substrate according to claim 6 or 7, wherein the first connecting portion does not contain a dusting substance. The method of manufacturing a component mounting substrate according to claim 6 or 7, wherein the substrate has at least a plurality of the first holding portions to which the hard portion is coupled, and further includes: a second holding portion of the first holding portion; and a second connecting portion that connects the plurality of the first holding portion and the second holding portion. A method for manufacturing a component mounting substrate, comprising: a first hard portion; a second hard portion; and a flexible, electrically coupled first hard portion and second portion a flexible portion of the hard portion; a first holding portion that holds the first hard portion and the second hard portion; and a first connecting portion that connects the first holding portion and the first hard portion or the second hard portion; Coating at least a photosensitive resin on a side surface of the first hard portion, a side surface of the second hard portion, and at least an inner surface of the first holding portion; and exposing and developing the photosensitive resin to cause the photosensitive property Residual resin remains on a side surface of the first hard portion, a side surface of the second hard portion, and at least an inner surface of the first holding portion, and the photosensitive resin does not substantially remain on at least a side surface of the flexible portion stage. A component mounting substrate comprising: a hard portion in which a wiring pattern is formed; a flexible portion that is connected to the hard portion and has flexibility; at least a first holding portion that holds the hard portion; and a connection between the hard portion a first connecting portion of the first holding portion; wherein a resin for suppressing dust generation from the side surface is disposed on a side surface of the hard portion, and substantially no resin is disposed on at least a side surface of the flexible portion The same kind of resin. The substrate for component mounting according to claim 13, wherein the resin includes the same material as the insulating resin used for the insulation of the wiring pattern of the hard portion. A substrate for component assembly obtained by first preparing a substrate having a hard portion in which a wiring pattern is formed, and a flexible portion connected to the hard portion and having flexibility; at least maintaining the hard portion a first holding portion of the portion; and a first connecting portion that connects the hard portion and the first holding portion; and then applies at least a photosensitive resin to at least an inner side surface of the hard portion and the first holding portion Next, exposing and developing the photosensitive resin, leaving the photosensitive resin on the side surface of the hard portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain in the flexible portion At least on the side. A component mounting substrate comprising: a first hard portion; a second hard portion; a flexible portion that is flexible and electrically coupled to the first hard portion and the second hard portion; and the first hard portion is held a first holding portion of the second hard portion; and a first connecting portion connecting the first holding portion and the first hard portion or the second hard portion; wherein a side surface of the first hard portion and the The side surface of the second hard portion is provided with a resin for suppressing dust generation from the side surface, and at least a side surface of the flexible portion is substantially not provided with a resin of the same kind as the resin. A method for manufacturing a soft and hard composite wiring board, comprising: a step of preparing a substrate, the substrate having a hard portion in which a wiring pattern is formed; and a flexible portion connected to the hard portion and having flexibility; and maintaining at least the hard portion a first holding portion of the portion; and a first connecting portion that connects the hard portion and the first holding portion; at least a step of applying a photosensitive resin to at least an inner side surface of the hard portion and the first holding portion; And developing the photosensitive resin, wherein the photosensitive resin remains on at least an inner side surface of the hard portion and the first holding portion, and the photosensitive resin does not substantially remain on at least a side surface of the flexible portion a step of the upper portion; and a step of separating the first holding portion and the hard portion. The method for manufacturing a soft and hard composite wiring board according to claim 17, wherein the step of separating the first holding portion and the hard portion further includes a step of assembling the component to the hard portion. . A method for manufacturing a soft and hard composite wiring board, comprising: preparing a substrate, the substrate having: a first hard portion; a second hard portion; a flexible portion electrically connecting the first hard portion and the second hard portion; maintaining the first retention of the first hard portion and the second hard portion And a first connecting portion that connects the first holding portion and the first hard portion or the second hard portion; at least a photosensitive resin is applied to a side surface of the first hard portion, a side surface of the second hard portion, and a step of at least the inner surface of the first holding portion; exposing and developing the photosensitive resin, leaving the photosensitive resin on a side surface of the first hard portion, a side surface of the second hard portion, and the first holding portion a step of separating the first holding portion and the first hard portion and the second hard portion at least on the inner side surface of the photosensitive resin without substantially remaining on the side surface of the flexible portion; . A soft and hard composite wiring board comprising: a hard portion formed with a wiring pattern; and a flexible portion connected to the hard portion and having flexibility; wherein a side surface of the hard portion is disposed to suppress The dust-removing resin on the side surface is substantially not disposed on the resin at least on the side surface of the flexible portion The same kind of resin, the resin for suppressing dust generation from the side surface, includes a first resin composed of an organic material containing no dusting substance, and a second resin obtained by exposing and developing a photosensitive resin. The soft and hard composite wiring board according to claim 20, wherein the resin comprises the same material as the insulating resin used for the insulation of the wiring pattern of the hard portion. A soft and hard composite wiring board obtained by first preparing a substrate having: a hard portion formed with a wiring pattern; and a flexible portion connected to the hard portion; at least maintaining the hard portion a first holding portion of the portion; and a first connecting portion that connects the hard portion and the first holding portion; and then applies at least a photosensitive resin to at least an inner side surface of the hard portion and the first holding portion Next, exposing and developing the photosensitive resin, leaving the photosensitive resin on the side surface of the hard portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain in the flexible portion At least the side surface, and then separating the first holding portion and the hard portion. A soft and hard composite wiring board, which has: a first hard portion; a second hard portion; and a flexible portion that is flexible and electrically coupled to the first hard portion and the second hard portion; wherein a side surface of the first hard portion and the second hard portion The side surface of the portion is provided with a resin for suppressing dust generation from the side surface, and at least a side surface of the flexible portion is substantially not provided with a resin of the same kind as the resin, and the resin for suppressing dust generation from the side surface is The method includes a first resin composed of an organic material containing no dusting substance, and a second resin obtained by exposing and developing a photosensitive resin.