KR20150025885A - Manufacturing method of circuit board for car black box - Google Patents

Manufacturing method of circuit board for car black box Download PDF

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KR20150025885A
KR20150025885A KR20130104024A KR20130104024A KR20150025885A KR 20150025885 A KR20150025885 A KR 20150025885A KR 20130104024 A KR20130104024 A KR 20130104024A KR 20130104024 A KR20130104024 A KR 20130104024A KR 20150025885 A KR20150025885 A KR 20150025885A
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South Korea
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dry film
circuit board
copper plating
circuit
plating layer
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KR20130104024A
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Korean (ko)
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KR101519545B1 (en
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정찬붕
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두두테크 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

The present invention relates to a method of manufacturing a circuit board for a black box for vehicles and, more specifically, to the method of manufacturing a circuit board for a black box for vehicles which reduces a width of a circuit and a spacing between lines in the circuit formed on the circuit board, thereby miniaturizing and reducing weights of the circuit board and the black box for vehicles. The method comprises: a copper plating step in which a copper plating layer is formed on a surface of a raw plate; a soft etching step in which soft etching is performed on a surface of the copper plating layer; a laminating step in which a dry film is attached to the surface of the copper plating layer which has undergone the soft etching step; an exposure step in which an artwork film with a printed circuit pattern is arranged on the dry film, and an ultraviolet (UV) ray is illuminated to cure a portion of the dry film; a developing step in which a non-cured portion is removed from the dry film; and an etching step in which the copper plating layer, which has undergone the developing step to be exposed, is corroded to be removed, wherein the UV ray illuminated in the exposure step is illuminated in parallel toward the dry film. According to the method as above, the dry film can be tightly attached to the surface of the copper plating layer which has undergone the soft etching step, and a structure, which irradiates the dry film with the UV ray for curing the dry film, minimizes a scattering of the UV ray which arrives at the dry film, such that a more precise circuit pattern is formed by using the dry film. Also, since the more precise circuit pattern is formed, a width of the circuit and a spacing between lines in the circuit formed on the circuit board can be decreased, thereby miniaturizing and reducing weights of the circuit board and the black box for vehicles.

Description

차량 블랙박스용 회로기판의 제조방법{Manufacturing method of circuit board for car black box}BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit board for a vehicle black box,

본 발명은 차량 블랙박스용 회로기판의 제조방법에 관한 것으로서, 더욱 상세하게는 회로기판에 형성되는 회로의 폭과 간격을 축소시킴으로써 회로기판 및 차량용 블랙박스를 소형화 및 경량화할 수 있도록 한 차량 블랙박스용 회로기판의 제조방법에 관한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a method of manufacturing a circuit board for a vehicle black box, and more particularly, to a circuit board and a vehicle black box by reducing a width and an interval of a circuit formed on the circuit board, And a method for manufacturing the circuit board.

일반적으로 차량용 블랙박스는 차량의 운행 및 사고발생시 당시의 상황 정보를 영상과 음성으로 기록하여 당시 상황을 더욱 정확하게 판단할 수 있도록 하는 장치이다.In general, a vehicle black box is a device for recording situation information of a vehicle at the time of a vehicle operation and an accident in a video and voice so as to more accurately determine the situation at that time.

이러한 차량용 블랙박스는 대개 차량 내부에 매달려 사용됨에 따라 소형화 및 경량화가 요구되며, 이를 위하여 차량용 블랙박스에 내장된 회로기판 또한 소형화 및 경량화할 수 있도록, 회로기판에 형성되는 회로의 폭과 간격을 축소시킬 수 있는 기술이 요구된다.
Such a black box for a vehicle is usually used hanging inside a vehicle, so that it is required to be downsized and lightened. To this end, a circuit board built in a vehicle black box is also reduced in size and weight, Technology is required.

한편, 회로의 폭과 간격을 축소시킬 수 있도록 한 회로기판의 제조방법에 관한 기술로는 대한민국 등록특허공보 제10-0619349호(2006.09.08.공개, 이하 '선행기술'이라고 함) "인쇄회로기판의 회로패턴 형성방법"이 제시되어 있다.On the other hand, as a technique relating to a method of manufacturing a circuit board capable of reducing the width and spacing of a circuit, there is disclosed in Korean Patent Registration No. 10-0619349 (disclosed as "Prior Art" A method of forming a circuit pattern on a substrate "

상기 선행기술은The prior art

"내층에 소정의 회로패턴이 형성되고 양면에 절연층이 적층된 원판을 제공하는 단계;"Providing an original plate in which a predetermined circuit pattern is formed in an inner layer and an insulating layer is laminated on both sides;

상기 원판 및 상기 절연층에 비아홀을 형성하고, 상기 절연층 및 상기 비아홀 영역에 무전해 동도금층을 형성하는 단계;Forming a via hole in the original plate and the insulating layer, and forming an electroless copper plating layer in the insulating layer and the via hole region;

상기 무전해 동도금층상에 포토레지스트 필름 및 마일라 필름을 포함하는 드라이 필름을 도포하고, 상기 마일라 필름을 박리하여 제거하는 단계;Applying a dry film including a photoresist film and a mylar film on the electroless copper plating layer, peeling off the mylar film, and removing the dry film;

자외선 레이저를 이용하여 상기 포토레지스트 필름의 일부가 경화하도록 자외선을 조사함으로써, 상기 포토레지스트 필름에 소정의 패턴을 형성하는 단계;Forming a predetermined pattern on the photoresist film by irradiating ultraviolet rays so that a part of the photoresist film is cured by using an ultraviolet laser;

상기 포토레지스트 필름을 현상하여 도금 레지스트 패턴을 형성하는 단계;Developing the photoresist film to form a plating resist pattern;

상기 도금 레지스트 패턴을 이용하여 상기 무전해 동도금층에 전해 동도금층을 형성하는 단계;Forming an electrolytic copper plating layer on the electroless copper plating layer using the plating resist pattern;

상기 도금 레지스트 패턴으로 이용된 상기 포토레지스트 필름을 박리하여 제거하는 단계; 및Peeling and removing the photoresist film used as the plating resist pattern; And

상기 전해 동도금층이 형성되지 않은 부분의 상기 무전해 동도금층을 제거하는 단계를 포함"하여 이루어진 것으로서, 자외선의 산란성을 최소화하여 미세한 회로패턴을 형성시킬 수 있도록 한 기술이다.
And removing the electroless copper plating layer at a portion where the electro-copper plating layer is not formed. This technique is capable of forming a fine circuit pattern by minimizing scattering of ultraviolet rays.

상기 선행기술은 자외선 레이저를 이용하여 포토레지스트 필름을 경화시킴으로써 미세한 회로패턴을 형성시킬 수 있도록 하고는 있으나,Although the prior art is capable of forming a fine circuit pattern by curing a photoresist film using an ultraviolet laser,

별도의 레이저 장비를 구비해야 함으로써 설비투자 비용이 증가하게 되는 문제가 있다.
There is a problem that equipment investment costs are increased due to the necessity of providing separate laser equipment.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서,SUMMARY OF THE INVENTION The present invention has been made to solve the above problems,

회로기판에 형성되는 회로의 폭과 간격을 축소시킴으로써 회로기판 및 차량 블랙박스를 소형화 및 경량화할 수 있도록 하되, 설비투자 비용에 대한 부담을 최소화할 수 있도록 한 차량 블랙박스용 회로기판의 제조방법을 제공하는 것을 목적으로 한다.
A method of manufacturing a circuit board for a vehicle black box, which is capable of reducing the size and weight of circuit boards and vehicle black boxes by reducing the width and spacing of circuits formed on the circuit board, The purpose is to provide.

상기와 같은 과제를 해결하기 위하여 본 발명에 의한 차량 블랙박스용 회로기판의 제조방법은,According to an aspect of the present invention, there is provided a method of manufacturing a circuit board for a vehicle black box,

원판의 표면에 동도금층을 형성시키는 동도금 단계;A copper plating step of forming a copper plating layer on the surface of the original plate;

상기 동도금층의 표면에 소프트에칭을 실시하는 소프트에칭 단계;A soft-etching step of soft-etching the surface of the copper-plated layer;

소프트에칭을 거친 동도금층의 표면에 드라이필름을 부착시키는 라미네이팅 단계;A laminating step of attaching a dry film to the surface of the copper-plated layer after the soft etching;

상기 드라이필름에 회로패턴이 인쇄된 아트워크필름을 배치한 후 자외선을 조사하여 드라이필름의 일부를 경화시키는 노광 단계;An exposure step of disposing an artwork film on which a circuit pattern is printed on the dry film and irradiating ultraviolet rays to cure a part of the dry film;

상기 드라이필름에서 비경화된 부분을 제거하는 현상 단계; 및A developing step of removing an unhardened portion in the dry film; And

상기 현상 단계를 거친 후 노출된 동도금층을 부식시켜 제거하는 에칭 단계;An etching step of etching and removing the exposed copper plating layer after the development step;

를 포함하되,, ≪ / RTI &

상기 노광 단계에서 조사되는 자외선은 상기 드라이필름을 향해 평행하게 조사되는 것을 특징으로 한다.
And the ultraviolet rays irradiated in the exposure step are irradiated parallel to the dry film.

본 발명에 의한 차량 블랙박스용 회로기판의 제조방법은,A method of manufacturing a circuit board for a vehicle black box, according to the present invention,

드라이필름이 소프트에칭 단계를 거친 동도금층의 표면에 면밀하게 밀착될 수 있으며, 드라이필름의 경화를 위하여 조사되는 자외선이 드라이필름을 향해 평행하게 조사되는 구조를 가짐으로써 드라이필름에 도달한 자외선의 산란이 최소화되고, 이에 따라 드라이필름을 이용하여 더욱 정밀한 회로패턴을 형성시킬 수 있는 효과가 있다.The dry film can be closely adhered to the surface of the copper plating layer that has undergone the soft etching step and the ultraviolet rays irradiated for curing of the dry film are irradiated parallel to the dry film, So that a more precise circuit pattern can be formed by using the dry film.

또한, 더욱 정밀한 회로패턴을 형성할 수 있게 됨에 따라 회로기판에 형성되는 회로의 폭과 간격을 축소시킬 수 있게 되며, 이에 의해 회로기판 및 차량용 블랙박스를 소형화 및 경량화할 수 있는 효과가 있다.
Further, since it is possible to form a more precise circuit pattern, it is possible to reduce the width and the interval of the circuit formed on the circuit board, thereby making it possible to miniaturize and lighten the circuit board and the vehicle black box.

도 1은 본 발명의 실시예에 의한 차량 블랙박스용 회로기판 제작방법의 흐름도.
도 2는 본 발명의 실시예에 의한 차량 블랙박스용 회로기판의 제작방법에서 노광 단계의 구현예를 도시한 개략적 구성도.
도 3은 차량 블랙박스용 회로기판의 단면 구성도.1 is a flowchart of a method of manufacturing a circuit board for a vehicle black box according to an embodiment of the present invention;
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a circuit board for a vehicle black box,
3 is a cross-sectional view of a circuit board for a vehicle black box.

이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

'도 1'에 도시된 바와 같이, 본 발명의 실시예에 의한 차량 블랙박스용 회로기판의 제조방법은 크게 동도금 단계(S10), 소프트에칭 단계(S20), 라미네이팅 단계(S30), 노광 단계(S40), 현상 단계(S50), 에칭 단계(S60), PSR인쇄 단계(S70) 및 금도금 단계(S80)로 이루어진다.
As shown in FIG. 1, a method of manufacturing a circuit board for a vehicle black box according to an embodiment of the present invention includes a copper plating step S10, a soft etching step S20, a laminating step S30, S40, a developing step S50, an etching step S60, a PSR printing step S70, and a gold plating step S80.

각 단계에 대해 살펴보면,
Looking at each step,

동도금 단계(S10)는 원판(100)의 표면에 동도금층(200)을 형성시키는 단계이다.The copper plating step S10 is a step of forming the copper plating layer 200 on the surface of the disk 100. [

여기서 원판(100)은 공지의 동박적층판이 사용될 수 있으며, 도시되지는 않았지만 원판(100)에는 공지의 비아홀(via hole)이 형성될 수 있다.Here, the disc 100 may be a known copper clad laminate. Although not shown, a known via hole may be formed in the disc 100.

동도금층(200)은 무전해도금, 증착 등의 방식을 이용함으로써 형성시킬 수 있으며, 이때 동도금층(200)은 20㎛의 두께로 형성되는 것이 바람직하다.
The copper plating layer 200 may be formed by a method such as electroless plating or vapor deposition, and the copper plating layer 200 is preferably formed to a thickness of 20 탆.

소프트에칭 단계(S20)는 동도금층(200)의 표면에 소프트에칭을 실시하는 단계이다.The soft-etching step S20 is a step of soft-etching the surface of the copper-plated layer 200.

여기서 소프트에칭은 동도금층(200)을 부식시켜 동도금층(200)의 표면에 조도(粗度)를 형성시키는 공정으로써, 소프트에칭을 거친 동도금층(200)은 0.2~0.5㎛의 표면 조도를 갖게 되며, 이로 인하여 후술될 드라이필름(300), 불변성잉크 등이 동도금층(200)에 더욱 면밀하게 밀착될 수 있다.
The soft etching is a step of etching the copper plating layer 200 to form a roughness on the surface of the copper plating layer 200. The copper-plated layer 200 subjected to soft etching has a surface roughness of 0.2 to 0.5 μm Whereby the dry film 300, invariable ink, and the like to be described later can be more closely attached to the copper plating layer 200.

라미네이팅 단계(S30)는 소프트에칭을 거친 동도금층(200)의 표면에 드라이필름(300)을 부착시키는 단계이다.
The laminating step S30 is a step of attaching the dry film 300 to the surface of the copper-plated layer 200 which has been soft-etched.

노광 단계(S40)는 드라이필름(300)에 회로패턴이 형성된 포토마스크(400)를 배치한 후 자외선을 조사하여 드라이필름(300)의 일부를 경화시키는 단계이다.The exposure step S40 is a step of placing a photomask 400 on which a circuit pattern is formed on the dry film 300 and then curing a part of the dry film 300 by irradiating ultraviolet rays.

이 단계에서는 '도 2'에 도시된 바와 같이, 노광램프(11)에서 발산되는 확산광을 반사경(12)을 통해 평행광으로 변환하여 조사하는 구조를 갖는 팽행광 노광기(10)를 사용하여 드라이필름(300)에 자외선을 조사하게 된다.In this step, as shown in FIG. 2, the diffused light emitted from the exposure lamp 11 is converted into parallel light through the reflecting mirror 12, The film 300 is irradiated with ultraviolet rays.

결국, 이 단계에서 조사되는 자외선은 드라이필름(300)을 향해 평행하게 조사되는 특징을 갖는데, 이에 의해 드라이필름(300)에 도달하게 되는 자외선의 산란이 최소화되고, 따라서 드라이필름을 이용하여 더욱 정밀한 회로패턴을 형성시킬 수 있게 된다.
Ultraviolet rays irradiated at this stage are characterized by being irradiated parallel to the dry film 300, thereby minimizing the scattering of the ultraviolet rays reaching the dry film 300, So that a circuit pattern can be formed.

현상 단계(S50)는 노광 단계(S40)를 거친 드라이필름(300)에서 비(非)경화된 부분을 제거하는 단계이다.The development step S50 is a step of removing the non-cured portion from the dry film 300 through the exposure step S40.

이 단계에서는 현상액을 이용하여 드라이필름(300)의 비경화된 부분을 용해, 제거하게 된다.
In this step, the unhardened portion of the dry film 300 is dissolved and removed using a developing solution.

에칭 단계(S60)는 현상 단계(S50)를 거친 후 노출된 동도금층(200)을 부식시켜 제거하는 단계이다.The etching step S60 is a step of etching and removing the exposed copper plating layer 200 after the developing step S50.

이 단계에서는 에칭액을 이용하여 동도금층(200)에서 경화된 드라이필름(300)이 덮여지지 않은 부분, 즉 회로패턴이 아닌 부분을 제거하게 되며, 이후 불필요해진 경화 드라이필름(300)을 함께 제거하게 된다.
In this step, a portion of the copper plating layer 200 that is not covered with the dry film 300, that is, a portion that is not a circuit pattern, is removed using the etchant, and then the unnecessary cured dry film 300 is removed together do.

PSR(Photo imageable Solder Regist)인쇄 단계(S70)는 에칭 단계(S60)를 거쳐 형성된 회로에 불변성 잉크를 코팅하는 단계이다.The PSR (Photo imageable Solder Regist) printing step S70 is a step of coating the ink formed on the circuit formed through the etching step S60 with the invariable ink.

이 단계에서 코팅된 불변성 잉크는 회로를 보호하고, 회로기판에 부품 실장 시 실시하는 웨이브 납땜(wave soldering)공정에서 회로와 회로 사이에 땜납 걸침(solder bridge) 현상이 발생하는 것을 방지하게 된다.
At this stage, the coated invariant ink protects the circuit and prevents the solder bridge from developing between the circuit and the circuit in the wave soldering process when component mounting on the circuit board.

금도금 단계(S80)는 회로의 산화를 방지하고 전기전도율을 향상시키기 위하여, 회로의 표면에 니켈과 금을 도금하는 단계이다
The gold plating step S80 is a step of plating nickel and gold on the surface of the circuit to prevent oxidation of the circuit and improve electrical conductivity

금도금 단계(S80)를 거친 회로기판은 필요에 따라 라우팅(routing), 성능 검사, 육안 검사 등의 공정을 거쳐 제작이 완료된다.
The circuit board having undergone the gold plating step (S80) is completed through processes such as routing, performance inspection, and visual inspection as necessary.

이상에서 설명한 바와 같이 이루어진 본 발명의 실시예에 의한 차량 블랙박스용 회로기판의 제조방법에 의하면, 드라이필름(300)이 소프트에칭 단계를 거친 동도금층(200)의 표면에 면밀하게 밀착될 수 있으며, 드라이필름(300)의 경화를 위하여 조사되는 자외선이 드라이필름(300)을 향해 평행하게 조사되는 구조를 가짐으로써 드라이필름(300)에 도달한 자외선의 산란이 최소화되고, 이에 따라 드라이필름(300)을 이용하여 더욱 정밀한 회로패턴을 형성시킬 수 있다.According to the method for manufacturing a circuit board for a vehicle black box according to an embodiment of the present invention as described above, the dry film 300 can be closely attached to the surface of the copper plating layer 200 through the soft etching step The ultraviolet rays irradiated for the curing of the dry film 300 are irradiated parallel to the dry film 300 so that the scattering of the ultraviolet rays reaching the dry film 300 is minimized, ) Can be used to form a more precise circuit pattern.

또한, 더욱 정밀한 회로패턴을 형성할 수 있게 됨에 따라 회로기판에 형성되는 회로의 폭과 간격을 축소시킬 수 있게 되며, 이에 의해 회로기판 및 차량용 블랙박스를 소형화 및 경량화할 수 있다.Further, since it is possible to form a more precise circuit pattern, it is possible to reduce the width and the interval of the circuit formed on the circuit board, thereby making it possible to miniaturize and lighten the circuit board and the black box for a vehicle.

'도 3'을 참조하여 예를 들면, 일반적인 회로기판 제조방법에 의해 제작된 차량 블랙박스용 회로기판의 경우 회로(c)의 폭(w)이 80~100㎛, 회로(c)의 간격(g)이 100㎛ 수준의 크기를 갖게 되지만, 본 발명의 실시예에 의해 제작된 차량 블랙박스용 회로기판의 경우 회로의 폭(w)을 50~60㎛, 회로의 간격(g)을 60~70㎛ 수준으로 축소시킬 수 있게 되는 것이다.
Referring to FIG. 3, for example, in the case of a circuit board for a vehicle black box manufactured by a general circuit board manufacturing method, the width w of the circuit c is 80 to 100 mu m, the width w of the circuit is set to 50 to 60 mu m and the interval g of the circuit is set to 60 to 60 mu m. In the case of the circuit board for vehicle black box manufactured according to the embodiment of the present invention, Mu] m.

이상에서 본 발명을 설명함에 있어 첨부된 도면을 참조하여 특정 형상과 구조를 갖는 "차량 블랙박스용 회로기판의 제조방법"을 위주로 설명하였으나 본 발명은 당업자에 의하여 다양한 변형 및 변경이 가능하고, 이러한 변형 및 변경은 본 발명의 보호범위에 속하는 것으로 해석되어야 한다.
While the present invention has been described with reference to the accompanying drawings, it is to be understood that the present invention is not limited to the disclosed embodiments, Modifications and variations are to be construed as falling within the scope of protection of the present invention.

10 ; 노광기
11 ; 노광램프 12 ; 반사경
100 ; 원판
200 ; 동도금층
300 ; 드라이필름
400 ; 포토마스크10; Exposure machine
11; An exposure lamp 12; Reflector
100; negative
200; Copper plating layer
300; Dry film
400; Photomask

Claims (1)

원판(100)의 표면에 동도금층(200)을 형성시키는 동도금 단계(S10);
상기 동도금층(200)의 표면에 소프트에칭을 실시하는 소프트에칭 단계(S20);
소프트에칭을 거친 동도금층(200)의 표면에 드라이필름(300)을 부착시키는 라미네이팅 단계(S30);
상기 드라이필름(300)에 회로패턴이 형성된 포토마스크(400)를 배치한 후 자외선을 조사하여 드라이필름(300)의 일부를 경화시키는 노광 단계(S40);
상기 드라이필름(300)에서 비경화된 부분을 제거하는 현상 단계(S50); 및
상기 현상 단계(S50)를 거친 후 노출된 동도금층(200)을 부식시켜 제거하는 에칭 단계(S60);
를 포함하되,
상기 노광 단계(S40)에서 조사되는 자외선은 상기 드라이필름(300)을 향해 평행하게 조사되는 것을 특징으로 하는 차량 블랙박스용 회로기판의 제조방법.
A copper plating step (S10) of forming a copper plating layer (200) on the surface of the original plate (100);
A soft-etching step (S20) of soft-etching the surface of the copper plating layer (200);
A laminating step (S30) of attaching the dry film (300) to the surface of the copper-plated layer (200) after the soft etching;
An exposure step (S40) of arranging a photomask (400) having a circuit pattern on the dry film (300) and irradiating ultraviolet rays to cure a part of the dry film (300);
A developing step (S50) of removing the unhardened portion in the dry film (300); And
An etching step (S60) of etching and removing the exposed copper plating layer (200) after the developing step (S50);
, ≪ / RTI &
Wherein the ultraviolet rays irradiated in the exposure step (S40) are irradiated parallel to the dry film (300).
KR1020130104024A 2013-08-30 2013-08-30 Manufacturing method of circuit board for car black box KR101519545B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111698844A (en) * 2020-06-11 2020-09-22 深圳市新宇腾跃电子有限公司 Method for plating copper in FPC hole, manufacturing method of FPC and FPC

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5276950B2 (en) 2008-10-30 2013-08-28 新日鉄住金化学株式会社 Method for manufacturing circuit wiring board
JP4820883B2 (en) 2009-03-10 2011-11-24 旭化成株式会社 Printing plate manufacturing method and manufacturing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111698844A (en) * 2020-06-11 2020-09-22 深圳市新宇腾跃电子有限公司 Method for plating copper in FPC hole, manufacturing method of FPC and FPC

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