TWI391623B - Measuring device and measuring method - Google Patents

Measuring device and measuring method Download PDF

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TWI391623B
TWI391623B TW097149226A TW97149226A TWI391623B TW I391623 B TWI391623 B TW I391623B TW 097149226 A TW097149226 A TW 097149226A TW 97149226 A TW97149226 A TW 97149226A TW I391623 B TWI391623 B TW I391623B
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image
light
measuring device
tested
light beam
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TW097149226A
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TW201024659A (en
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Fangjung Shiou
Chimeng Chan
Chiahao Hsu
Chiayun Chang
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Ship & Ocean Ind R & D Ct
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Description

量測裝置及量測方法Measuring device and measuring method

本發明是有關於一種量測裝置及量測方法,且特別是有關於一種用於量測具有高反射率之表面特性的量測裝置及量測方法。The present invention relates to a measuring device and a measuring method, and more particularly to a measuring device and a measuring method for measuring surface characteristics having high reflectivity.

在量測表面特性的技術中,一般機械接觸式的量測方法(例如比較量測法、探針式量測儀、電容測定法及放射性同位素量測法)可達到需求之量測標準及精度,但因量測速度慢,且會因接觸力直接對待測表面產生破壞。因此,近年來以光學量測技術為主之非接觸式量測方法已蓬勃發展。應用非接觸式量測方法之量測裝置具有量測速度快、避免破壞待測表面、良好之穩定性與可靠性等優點,已廣泛地應用於高精密度量測中。光學量測技術依照其應用模式,主要又可分為被動式量測及主動式量測兩類。In the technique of measuring surface characteristics, general mechanical contact measurement methods (such as comparative measurement, probe type measurement, capacitance measurement, and radioisotope measurement) can meet the measurement standard and accuracy of demand. However, because the measurement speed is slow, and the surface to be measured is directly damaged by the contact force. Therefore, in recent years, the non-contact measurement method based on optical measurement technology has flourished. The measuring device using the non-contact measuring method has the advantages of fast measuring speed, avoiding damage to the surface to be tested, good stability and reliability, and has been widely used in high-precision metrology. According to its application mode, optical measurement technology can be divided into passive measurement and active measurement.

被動式量測需利用多組攝影機,經由不同視角擷取同一待測面之影像,再配合影像處理產生待測面之幾何模型,並且藉由幾何模型計算取得表面特性。此種方式之量測裝置結構複雜、量測步驟繁複,更無法有效提升量測精確度,因此較少為業界所採用。Passive measurement requires multiple sets of cameras to capture images of the same surface to be tested through different viewing angles, and then combines image processing to generate a geometric model of the surface to be tested, and obtains surface characteristics by geometric model calculation. The measurement device of this type is complicated in structure and complicated in measurement steps, and can not effectively improve the measurement accuracy, so it is less used by the industry.

另外,在主動式之量測方法中,係將雷射光或已知圖案之結構光線以已知角度投射在待測面,並且由攝影機朝向待測面取得待測面上之光線圖案。藉由分析待測面上之 光線圖案,取得待測面之表面特性。然而,此種方式在量測高反射度之表面時,由於攝影機取得之光線圖案對比差異度低,會大幅影響量測之精確度,使得量測裝置的應用受到限制。In addition, in the active measuring method, the structured light of the laser light or the known pattern is projected on the surface to be tested at a known angle, and the light pattern on the surface to be tested is obtained by the camera toward the surface to be tested. By analyzing the surface to be tested The light pattern obtains the surface characteristics of the surface to be tested. However, when measuring the surface of high reflectivity, the difference in the contrast of the light patterns obtained by the camera is low, which greatly affects the accuracy of the measurement, so that the application of the measuring device is limited.

因此,如何能夠有效量測高反射度待測面之表面特性,實為目前亟待解決的問題之一。Therefore, how to effectively measure the surface characteristics of the high-reflection surface to be tested is one of the problems to be solved at present.

因此本發明的目的就是在提供一種量測裝置及量測方法,用以量測具有高反射度之一待測表面的表面特性。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a measuring device and a measuring method for measuring surface characteristics of a surface to be tested having high reflectance.

根據本發明之上述目的,提出一種量測裝置,包括一殼體、一光源、一成像幕以及一影像擷取單元。光源設置於殼體內,用以投射一光束,此光束係通過殼體之一開口投射至待測表面,經反射後,投射於成像幕上。成像幕設置於殼體內,待測表面反射之光束係形成一影像於成像幕上。影像擷取單元設置於殼體內,用以擷取形成在成像幕上的影像。According to the above object of the present invention, a measuring device is provided, comprising a housing, a light source, an imaging screen and an image capturing unit. The light source is disposed in the housing for projecting a light beam, and the light beam is projected to the surface to be tested through an opening of the housing, and is reflected and projected onto the image forming screen. The imaging screen is disposed in the housing, and the beam reflected by the surface to be tested forms an image on the imaging screen. The image capturing unit is disposed in the housing for capturing an image formed on the image forming screen.

根據本發明之另一目的,提出一種高反射率表面特性之量測方法,首先朝待測表面投射一光束。接著,投射光束經由待測表面反射之一影像至於一成像幕。其次,擷取成像幕上之影像。然後,藉由運算單元分析與計算所擷取之影像,便可取得待測表面之一表面特性。According to another object of the present invention, a method of measuring high reflectivity surface characteristics is proposed, first to project a light beam toward a surface to be tested. Then, the projected beam reflects one of the images through the surface to be tested to an imaging screen. Second, capture the image on the screen. Then, by analyzing and calculating the captured image by the arithmetic unit, one surface characteristic of the surface to be tested can be obtained.

本發明之光源所投射的光束經過反射之後,首先成像於成像幕上,接著再利用影像擷取單元對成像幕上的影像 取像。以此方式,可以提升擷取之影像的對比差異度,並且提升影像鑑別度,進一步提升量測精確度。此外,量測裝置中光源、成像幕以及影像擷取元件均設置於殼體內,可以提升量測裝置之整合性及可攜性。After the light beam projected by the light source of the present invention is reflected, it is first imaged on the image forming screen, and then the image capturing unit is used to image the image on the screen. Take the image. In this way, the contrast difference of the captured image can be improved, and the image discrimination degree is improved, and the measurement accuracy is further improved. In addition, the light source, the imaging screen and the image capturing component are disposed in the housing, which can improve the integration and portability of the measuring device.

依照本發明較佳實施例之量測裝置及量測方法,利用擷取反射光束所形成之影像的方式,進行測待測表面之表面特性量測,可以提升影像對比差異度,提升表面特性量測之準確度。According to the measuring device and the measuring method of the preferred embodiment of the present invention, the surface characteristic measurement of the surface to be tested is measured by capturing the image formed by the reflected light beam, thereby improving the image contrast difference and improving the surface characteristic amount. The accuracy of the measurement.

首先針對依照本發明較佳實施例之量測裝置進行說明。請參照第1圖,其繪示依照本發明一較佳實施例之量測裝置的立體圖。量測裝置100用以量測一待測表面S,量測裝置100包括一殼體101、一光源103、一成像幕105以及一影像擷取單元107。殼體101具有一開口101a。光源103設置於殼體101內,用以投射一光束L。光束L通過開口101a投射至待測表面S,待測表面S係反射此光束L。成像幕105設置於殼體101內,經由待測表面S反射之光束L’係形成一影像P於成像幕105上。影像擷取單元107設置於殼體101內,用來擷取形成於成像幕105上之影像P。量測裝置100係根據擷取之影像P量測待測表面S之一表面特性。First, a measurement apparatus according to a preferred embodiment of the present invention will be described. Please refer to FIG. 1 , which is a perspective view of a measuring device according to a preferred embodiment of the present invention. The measuring device 100 is configured to measure a surface S to be tested. The measuring device 100 includes a housing 101, a light source 103, an imaging screen 105, and an image capturing unit 107. The housing 101 has an opening 101a. The light source 103 is disposed in the housing 101 for projecting a light beam L. The light beam L is projected through the opening 101a to the surface S to be tested, and the surface S to be measured reflects the light beam L. The image forming screen 105 is disposed in the casing 101, and an image P is formed on the image forming screen 105 by the light beam L' reflected by the surface S to be tested. The image capturing unit 107 is disposed in the casing 101 for capturing the image P formed on the image forming screen 105. The measuring device 100 measures a surface characteristic of the surface to be tested S based on the captured image P.

更進一步來說,成像幕105係設置於殼體101之相對於光源103之一內側表面。在不同之實施方式中,殼體101 之相對於光源103之內側表面即可作為形成影像P之成像幕105。本發明較佳實施例之量測裝置100及量測方法其特點為,藉由開口101a至成像幕105之適當反射距離,相對於直接對待測物表面擷取投射之影像,若對成像幕105擷取反射之影像P,經由公式計算分析,可以提升擷取影像P的對比差異度,並且提升對不同等級對待測表面S之影像P鑑別度,進而提升量測精確度。量測裝置100更包括一透鏡109,設置於光源103及開口101之間。本實施例中,光源103例如為一扇形雷射光產生器,光源103投射之光束L為一扇形雷射光,且較佳地為高單色性、高亮度及單一線型光。當光束L穿透通過透鏡109之後,便會由透鏡109折射為平行光,使得光束L接下來投射至待測表面S以及反射至成像幕105形成影像P時,均維持相同的寬度,以利於後續計算。Furthermore, the imaging screen 105 is disposed on an inner side surface of the housing 101 with respect to the light source 103. In various embodiments, the housing 101 The inner surface of the light source 103 can be used as the image forming screen 105 for forming the image P. The measuring device 100 and the measuring method of the preferred embodiment of the present invention are characterized in that the projected image is captured relative to the surface of the object to be directly measured by the appropriate reflection distance from the opening 101a to the imaging screen 105. The image P of the reflection is extracted and analyzed by the formula, the contrast difference of the captured image P can be improved, and the discrimination of the image P of the surface S to be measured at different levels can be improved, thereby improving the measurement accuracy. The measuring device 100 further includes a lens 109 disposed between the light source 103 and the opening 101. In this embodiment, the light source 103 is, for example, a sector-shaped laser light generator, and the light beam L projected by the light source 103 is a sector-shaped laser light, and is preferably high-monochromatic, high-brightness, and single-line type light. When the light beam L penetrates through the lens 109, it is refracted by the lens 109 into parallel light, so that the light beam L is projected to the surface to be tested and reflected to the image forming screen 105 to form the image P, which maintains the same width, so as to facilitate the same width. Subsequent calculations.

此外,量測裝置100更可包括至少一遮罩,用以提升擷取影像P的品質。如第1圖所示,本實施例之量測裝置100更包括一第一遮罩111或/及一第二遮罩112。第一遮罩111設置於光源103及開口101a之間,更詳盡地來說,本實施例之第一遮罩111設置於光源103及透鏡109之間。第一遮罩111用以濾除多餘之扇行光束,以避免造成散射光束增加殼體101內部之亮度或二次反射,藉以提升影像擷取單元107取像之品質。第二遮罩112設置於光源103及該口101a之間,更詳盡地來說,本實施例之第二遮罩112係設置於透鏡109及開口101a之間。第二遮罩112用以均勻化光束L,係可提升成像幕105上成像的品質。本實施 例中係以第一遮罩111及第二遮罩112進行說明,然於本發明所屬技術領域中具有通常知識者,可瞭解遮罩之配置方式並不限制於此。例如,量測裝置100可以僅包括第一遮罩111及第二遮罩112兩者之一,或者包括更多的遮罩,例如一第三遮罩。第三遮罩可設置於光源103及開口101a之間,用以圖案化光束L並形成一結構光,藉以進一步提升經待測表面S反射後之光束L’其反射特性改變的鑑別度。另外,第二遮罩112亦可設置於殼體101之對應於開口101a處的內側表面上,以簡化量測裝置100的結構。In addition, the measuring device 100 further includes at least one mask for improving the quality of the captured image P. As shown in FIG. 1 , the measuring device 100 of the embodiment further includes a first mask 111 or/and a second mask 112 . The first mask 111 is disposed between the light source 103 and the opening 101a. In more detail, the first mask 111 of the embodiment is disposed between the light source 103 and the lens 109. The first mask 111 is used to filter out the excess fan beam to avoid causing the scattered beam to increase the brightness or secondary reflection inside the casing 101, thereby improving the quality of the image capturing unit 107. The second mask 112 is disposed between the light source 103 and the port 101a. More specifically, the second mask 112 of the present embodiment is disposed between the lens 109 and the opening 101a. The second mask 112 is used to homogenize the light beam L to improve the quality of the image on the imaging screen 105. This implementation In the example, the first mask 111 and the second mask 112 are described. However, those skilled in the art to which the present invention pertains can understand that the configuration of the mask is not limited thereto. For example, the measurement device 100 may include only one of the first mask 111 and the second mask 112, or include more masks, such as a third mask. The third mask may be disposed between the light source 103 and the opening 101a for patterning the light beam L and forming a structured light, thereby further enhancing the discrimination of the change of the reflection characteristic of the light beam L' reflected by the surface S to be tested. In addition, the second mask 112 may also be disposed on the inner side surface of the housing 101 corresponding to the opening 101a to simplify the structure of the measuring device 100.

另外一方面,量測裝置100更包括一運算單元。請同時參照第2圖,其繪示第1圖之量測裝置的功能方塊圖。運算單元115連接於影像擷取單元107,用以接收擷取之影像P,藉以計算、分析待測表面S之表面特性。於一實施方式中,運算單元115可為一電子計算機(computer)(例如筆記型電腦),並且利用高速通訊協定(如GigaEByte)連接影像擷取單元107。本實施例中,影像擷取單元107為一電耦合元件(Charge-Coupled Device)攝影機。然而,影像擷取單元107並不以此為限,其他可擷取成像幕105上之影像P的元件,均可應用於此。In another aspect, the measuring device 100 further includes an arithmetic unit. Please also refer to FIG. 2, which shows a functional block diagram of the measuring device of FIG. 1. The operation unit 115 is connected to the image capturing unit 107 for receiving the captured image P, thereby calculating and analyzing the surface characteristics of the surface S to be tested. In an embodiment, the computing unit 115 can be a computer (such as a notebook computer) and connected to the image capturing unit 107 by using a high speed communication protocol (such as GigaEByte). In this embodiment, the image capturing unit 107 is a Charge-Coupled Device camera. However, the image capturing unit 107 is not limited thereto, and other components that can capture the image P on the imaging screen 105 can be applied thereto.

量測裝置100更包括一電源113,如第1圖及第2圖所示,電源113連接於光源103及影像擷取單元107,用以提供電力。本實施例中電源113係設置於殼體101外側;然於不同之實施方式中,電源113亦可設置於殼體101內,提升量測裝置100之整合性。The measuring device 100 further includes a power source 113. As shown in FIG. 1 and FIG. 2, the power source 113 is connected to the light source 103 and the image capturing unit 107 for supplying electric power. In the embodiment, the power source 113 is disposed outside the casing 101. However, in different embodiments, the power source 113 may be disposed in the casing 101 to improve the integration of the measuring device 100.

實際應用上,本實施例之量測裝置100中,光源103 投射之扇形雷射光光束L穿過透鏡109之後形成平行光,並投射於待測表面S。接著,光束L由待測表面S反射,反射之光束L’在成像幕105上形成影像P。光束L投射在待測表面S上之後,投射在不同位置之光束L會因為待測表面S的高低變化,使得反射之光束L’具有不同的反射特性,例如線寬及輪廓之變化。再來,利用電耦合元件攝影機擷取影像P。運算單元115擷取影像P之後,進行光束L’線寬及中心線輪廓變化之分析計算,以量化待測表面S之表面特性,包括表面粗糙度、表面波紋以及表面螺紋印現象等。光束L投射至待測表面S之前,更可有利地經過第一遮罩111、第二遮罩112或/及第三遮罩,以濾除散射之光束、均勻化通過透鏡109後之光束L以及圖案化光束L,並形成結構光。In practical applications, in the measuring device 100 of the embodiment, the light source 103 The projected fan-shaped laser beam L passes through the lens 109 to form parallel light and is projected onto the surface S to be tested. Then, the light beam L is reflected by the surface S to be measured, and the reflected light beam L' forms an image P on the image forming screen 105. After the light beam L is projected on the surface S to be tested, the light beam L projected at different positions changes due to the height of the surface S to be measured, so that the reflected light beam L' has different reflection characteristics such as line width and contour change. Then, the image P is captured by the electric coupling element camera. After the image unit P captures the image P, the analysis and calculation of the line width of the light beam L' and the contour of the center line are performed to quantify the surface characteristics of the surface S to be tested, including surface roughness, surface ripple, and surface thread printing. Before the light beam L is projected onto the surface S to be tested, it may be advantageously passed through the first mask 111, the second mask 112 or/and the third mask to filter out the scattered light beam and homogenize the light beam L passing through the lens 109. And patterning the light beam L and forming structured light.

以下針對本發明較佳實施例之高反射率之表面特性之量測方法進行說明。請同時參照第3圖,其繪示依照本發明一較佳實施例之量測方法之流程圖。首先,如步驟S1所示,朝待測表面S投射光束L。本實施例中應用光源103投射扇形之雷射光。光束L通過殼體101之開口101a投射至待測表面S。接著,於步驟S2中,投射光束L經待測表面S反射後之影像P投射至成像幕105。而後,進行擷取成像幕105上之影像P的步驟,如步驟S3所示。本實施例係應用影像擷取單元107擷取形成於成像幕105上的影像P。然後執行步驟S4,根據影像P,藉由運算單元115分析與計算所擷取之影像P,便可取得待測表面S之表面特性。本實施例中係應用連接於影像擷取單元107之運算單元 115進行運算,以取得待測表面S之表面粗糙度、表面波紋度及表面螺紋印現象等表面特性。Hereinafter, a method of measuring the surface characteristics of high reflectance according to a preferred embodiment of the present invention will be described. Please also refer to FIG. 3, which illustrates a flow chart of a measurement method in accordance with a preferred embodiment of the present invention. First, as shown in step S1, the light beam L is projected toward the surface S to be tested. In this embodiment, the light source 103 is applied to project a fan-shaped laser light. The light beam L is projected through the opening 101a of the casing 101 to the surface S to be tested. Next, in step S2, the image P of the projected light beam L reflected by the surface to be tested S is projected onto the image forming screen 105. Then, the step of capturing the image P on the imaging screen 105 is performed as shown in step S3. In this embodiment, the image capturing unit 107 is used to capture the image P formed on the imaging screen 105. Then, step S4 is executed, and according to the image P, the image P of the surface to be tested is obtained by analyzing and calculating the captured image P by the operation unit 115. In this embodiment, an arithmetic unit connected to the image capturing unit 107 is applied. 115 performs an operation to obtain surface characteristics such as surface roughness, surface waviness, and surface thread printing of the surface S to be tested.

更進一步來說,本實施例之待測表面之量測方法更包括聚焦光束L之步驟,用以使光束L形成平行光。於量測裝置100中,係應用透鏡109來聚焦光束。另外,本實施例之待測表面S之量測方法,可更包括濾除散射之光束L的步驟、均勻化光束L的步驟以及圖案化光束L的步驟。本實施例中,量測裝置100中利用第一遮罩111濾除多餘之扇行光束,以降低殼體101內散射之光束L對於擷取影像P造成的影響,而第二遮罩112係用以均勻化光束L,以提升成像的品質。第三遮罩用以圖案化光束L,以形成結構光,可以進一步提升光束L’反射特性改變的鑑別度,更有益於擷取影像P後的後續運算。Furthermore, the measuring method of the surface to be tested of the embodiment further includes the step of focusing the light beam L to form the light beam L into parallel light. In the measuring device 100, a lens 109 is applied to focus the light beam. In addition, the measuring method of the surface S to be tested in this embodiment may further include the steps of filtering out the scattered light beam L, the step of homogenizing the light beam L, and the step of patterning the light beam L. In this embodiment, the first mask 111 is used to filter out the excess fan beam in the measuring device 100 to reduce the influence of the scattered light beam L in the casing 101 on capturing the image P, and the second mask 112 is Used to homogenize the beam L to improve the quality of the image. The third mask is used to pattern the light beam L to form structured light, which can further enhance the discrimination of the change of the reflection characteristic of the light beam L', and is more beneficial for subsequent operations after capturing the image P.

由上述本發明較佳實施例可知,利用擷取成像幕上之影像的方式,可對於高反射率之待測表面擷取其反射之影像,取得對比差異度大的影像,具有提高量測準確度之優點。此外,藉由將主要元件整合設置於殼體內之方式,可以有效縮減量測裝置之體積,具有提高可攜性之優點。再者,只要光束可以經由待測表面反射至成像幕上即可進行量測,可將量測裝置就大面積待測表面設置,不需將待測表面進行試片裁切,並且可適用於各種傾斜角度之待測表面,提升量測的便利性及應用範圍。According to the preferred embodiment of the present invention, by using the image captured on the image screen, the reflected image can be captured for the surface with high reflectivity, and the image with large contrast is obtained, which improves the measurement accuracy. The advantage of degree. In addition, by integrating the main components in the casing, the volume of the measuring device can be effectively reduced, and the portability is improved. Furthermore, as long as the light beam can be measured by being reflected onto the image forming screen through the surface to be tested, the measuring device can be set on a large area to be tested, and the surface to be tested can be cut without being tested, and can be applied to The surface to be tested with various tilt angles enhances the convenience of measurement and the range of applications.

雖然本發明已以一較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and it is obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Invention The scope of protection is subject to the definition of the scope of the patent application attached.

100‧‧‧量測裝置100‧‧‧Measurement device

101‧‧‧殼體101‧‧‧shell

101a‧‧‧開口101a‧‧‧ openings

103‧‧‧光源103‧‧‧Light source

105‧‧‧成像幕105‧‧‧Image screen

107‧‧‧影像擷取單元107‧‧‧Image capture unit

109‧‧‧透鏡109‧‧‧ lens

111‧‧‧第一遮罩111‧‧‧First mask

112‧‧‧第二遮罩112‧‧‧ second mask

113‧‧‧電源113‧‧‧Power supply

115‧‧‧運算單元115‧‧‧ arithmetic unit

L‧‧‧光束L‧‧‧beam

L’‧‧‧光束L’‧‧‧ Beam

P‧‧‧影像P‧‧‧ images

S‧‧‧待測表面S‧‧‧ surface to be tested

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之詳細說明如下:The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

第1圖繪示依照本發明一較佳實施例之量測裝置的立體圖。1 is a perspective view of a measuring device in accordance with a preferred embodiment of the present invention.

第2圖繪示第1圖之量測裝置的功能方塊圖。FIG. 2 is a functional block diagram of the measuring device of FIG. 1.

第3圖繪示依照本發明一較佳實施例之量測方法的流程圖。FIG. 3 is a flow chart showing a measurement method according to a preferred embodiment of the present invention.

100‧‧‧量測裝置100‧‧‧Measurement device

101‧‧‧殼體101‧‧‧shell

101a‧‧‧開口101a‧‧‧ openings

103‧‧‧光源103‧‧‧Light source

105‧‧‧成像幕105‧‧‧Image screen

107‧‧‧影像擷取單元107‧‧‧Image capture unit

109‧‧‧透鏡109‧‧‧ lens

111‧‧‧第一遮罩111‧‧‧First mask

112‧‧‧第二遮罩112‧‧‧ second mask

113‧‧‧電源113‧‧‧Power supply

115‧‧‧運算單元115‧‧‧ arithmetic unit

L‧‧‧光束L‧‧‧beam

L’‧‧‧光束L’‧‧‧ Beam

P‧‧‧影像P‧‧‧ images

S‧‧‧待測表面S‧‧‧ surface to be tested

Claims (7)

一種量測裝置,用以量測一待測表面,該量測裝置包括:一殼體,具有一開口;一光源,設置於該殼體內,用以投射一光束,該光束係通過該開口投射至該待測表面,其中,該光源為一扇形雷射光產生器,該光束為一扇形雷射光;一透鏡,設置於該光源及該開口之間,通過該透鏡後之該光束為平行光;一第一遮罩,設置於該光源及該開口之間,用以濾除多餘之散射光束;一第二遮罩,設置於該光源及該開口之間,用以均勻化該光束;一第三遮罩,設置於該光源及該開口之間,用以圖案化該光束,以形成一結構光;一成像幕,設置於該殼體內,該待測表面反射之該光束係形成一影像於該成像幕上;以及一影像擷取單元,設置於該殼體內,用以擷取該影像;其中,該量測裝置係根據擷取之該影像取得該待測表面之一表面特性。 A measuring device for measuring a surface to be tested, the measuring device comprising: a housing having an opening; a light source disposed in the housing for projecting a light beam, the beam is projected through the opening To the surface to be tested, wherein the light source is a sector-shaped laser light generator, the light beam is a fan-shaped laser light; a lens is disposed between the light source and the opening, and the light beam passing through the lens is parallel light; a first mask disposed between the light source and the opening for filtering out excess scattered light beam; a second mask disposed between the light source and the opening for homogenizing the light beam; a three-mask, disposed between the light source and the opening, for patterning the light beam to form a structured light; an imaging screen disposed in the housing, the light beam reflected by the surface to be tested forms an image And an image capturing unit disposed in the housing for capturing the image; wherein the measuring device obtains a surface characteristic of the surface to be tested according to the captured image. 如申請專利範圍第1項所述之量測裝置,其中該量測裝置更包括:一運算單元,連接於該影像擷取單元,用以接收擷取之該影像,並分析與計算所擷取之該影像,便可取得待測表面之該表面特性。 The measuring device of claim 1, wherein the measuring device further comprises: an computing unit connected to the image capturing unit for receiving the captured image, and analyzing and calculating the image With this image, the surface characteristics of the surface to be tested can be obtained. 如申請專利範圍第2項所述之量測裝置,其中該運算單元為一電子計算機(computer)。 The measuring device of claim 2, wherein the computing unit is a computer. 如申請專利範圍第1項所述之量測裝置,其中該量測裝置更包括:一電源,連接於該光源及該影像擷取單元,用以提供電力。 The measuring device of claim 1, wherein the measuring device further comprises: a power source connected to the light source and the image capturing unit for providing power. 如申請專利範圍第1項所述之量測裝置,其中該影像擷取單元為一電耦合元件(Charge-Coupled Device)攝影機。 The measuring device of claim 1, wherein the image capturing unit is a Charge-Coupled Device camera. 如申請專利範圍第1項所述之量測裝置,其中該表面特性至少包括表面粗糙度、表面波紋度及表面螺紋印現象。 The measuring device according to claim 1, wherein the surface characteristic comprises at least surface roughness, surface waviness and surface thread printing. 一種高反射率表面特性之量測方法,包括:朝一待測表面投射一光束;投射該光束經該待測表面反射後之一影像投射於一成像幕,其中,係由一扇形雷射光產生器產生該光束,該光束為一扇形雷射光;聚焦該光束,使該光束形成平行光;濾除多餘之散射光束;均勻化該光束;圖案化該光束,以形成一結構光;擷取該成像幕上之該影像;以及根據該影像取得該待測表面之一表面特性。A method for measuring surface characteristics of high reflectivity includes: projecting a light beam toward a surface to be tested; projecting the image of the light beam reflected by the surface to be tested and projecting on an image forming screen, wherein a sector-shaped laser light generator is used Generating the beam, the beam being a sector of laser light; focusing the beam to form parallel light; filtering out the excess scattered beam; homogenizing the beam; patterning the beam to form a structured light; capturing the image The image on the screen; and obtaining a surface characteristic of the surface to be tested according to the image.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608527A (en) * 1995-03-08 1997-03-04 Optical Dimensions, Llc Apparatus and method for dynamic measurement of surface roughness
US6930784B2 (en) * 2001-01-08 2005-08-16 Board Of Trustees Of Southern Illinois University Apparatus and method for showing contour lines in modeling
TWM345227U (en) * 2008-03-12 2008-11-21 United Ship Design & Amp Dev Ct An optical fringe projection measuring system that can measure the surface roughness and the profile of sheet materials at the same time

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608527A (en) * 1995-03-08 1997-03-04 Optical Dimensions, Llc Apparatus and method for dynamic measurement of surface roughness
US6930784B2 (en) * 2001-01-08 2005-08-16 Board Of Trustees Of Southern Illinois University Apparatus and method for showing contour lines in modeling
TWM345227U (en) * 2008-03-12 2008-11-21 United Ship Design & Amp Dev Ct An optical fringe projection measuring system that can measure the surface roughness and the profile of sheet materials at the same time

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