TWI390174B - An architecture for measuring the thickness and refractive index of transparent substrates - Google Patents

An architecture for measuring the thickness and refractive index of transparent substrates Download PDF

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TWI390174B
TWI390174B TW98126435A TW98126435A TWI390174B TW I390174 B TWI390174 B TW I390174B TW 98126435 A TW98126435 A TW 98126435A TW 98126435 A TW98126435 A TW 98126435A TW I390174 B TWI390174 B TW I390174B
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light
transparent substrate
head
refractive index
thickness
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TW201105923A (en
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Univ Nat Formosa
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一種量測透明基板厚度與折射率之架構An architecture for measuring the thickness and refractive index of a transparent substrate

本發明係關於一種透明基板之量測技術領域,特別是指一種操作簡單、準確性高的量測透明基板厚度與折射率之架構,藉以提高精度,降低系統成本,有效改善量測品質。The invention relates to the technical field of measuring a transparent substrate, in particular to a structure with simple operation and high accuracy for measuring the thickness and refractive index of a transparent substrate, thereby improving precision, reducing system cost and effectively improving measurement quality.

按,近年來光學科技的量測技術不斷的演繹之下,精密工業與光電產業的關係更是密不可分,發展出高精確度之檢測機構似乎早已成為重要趨勢。精密光學儀器設備中所使用的光學薄膜、玻璃或透明基板,以及許多光學或生物、醫學上所使用的精密光學設備的物鏡、鍍於透鏡上薄膜或透明基板,皆需要非常準確的規格,若無法提供準確的參數規格,那麼實驗的可信度絕對是相對降低的。因此提供精密光學設備中使用的可穿透式的光學薄膜、玻璃或透明基板的厚度與折射率量測是否準確,就直接影響到該透明基板的品質。According to the continuous deduction of optical technology measurement technology in recent years, the relationship between precision industry and optoelectronic industry is inseparable. It seems that the development of high-precision testing institutions has become an important trend. Optical films, glass or transparent substrates used in precision optical instruments, as well as many objective lenses for optical or biological, medically used precision optical devices, thin film coated on lenses or transparent substrates, require very accurate specifications, if Unable to provide accurate parameter specifications, the reliability of the experiment is definitely relatively reduced. Therefore, it is directly affected by the thickness and refractive index measurement of the transmissive optical film, glass or transparent substrate used in the precision optical device to directly affect the quality of the transparent substrate.

而對於光學薄膜、玻璃或透明基板的厚度與折射率的量測方法早已有不錯的開發,例如:橢圓偏光儀所使用之橢圓偏光法(Ellipsometry)、光度法(Photometry)、多光束干涉法、光纖法、溶液法、光波導量測法、m-line法…等,皆可以同時且有效測得薄膜之厚度及折射率。For the measurement of the thickness and refractive index of optical films, glass or transparent substrates, for example, Ellipsometry, Photometry, multi-beam interferometry, etc. used in ellipsometers, The optical fiber method, the solution method, the optical waveguide measurement method, the m-line method, etc., can simultaneously and effectively measure the thickness and refractive index of the film.

但其中橢圓偏光法(Ellipsometrv)無法直接測量該待測 透明基板的物理參數,而是必須藉由一模型來描述待測透明基板的物理性質,以數值分析求得實際上樣品的物理參數,並且在數值分析的方法上需要使用歸零式的消光法或相位調制光度量測法等複雜方法。而光度法(Photometry)是以量測光透過或反射自待測透明基板後,強度的變化來求得各項係數,由於在對於強吸收材料的量測上有諸多侷限性,因此使用範圍並不廣泛;雖然利用光纖量測法可以提升量測速度,但是價格較為昂貴。至於多光束干涉法與溶液量測法則需要煩雜的計算,且架構龐大,並不定因素較多。另m-line法是利用肉眼觀察到m線時記錄下角度,即可計算得到有效折射率,但由於人眼誤差較大,且對於一些m-line法不易被觀察到的特殊情況(如波導損耗較大或光波波長較長等情況),故m-line法就不大有效了。But the elliptical polarization method (Ellipsometrv) cannot directly measure the test The physical parameters of the transparent substrate, but the physical properties of the transparent substrate to be tested must be described by a model, the physical parameters of the actual sample are obtained by numerical analysis, and the method of numerical analysis is required to use the zeroing method. Or complex methods such as phase modulation photometrics. Photometry is to measure the intensity of light after passing through or reflecting from a transparent substrate to be tested. Since there are many limitations in the measurement of strongly absorbing materials, the scope of use is Not extensive; although fiber measurement can increase the measurement speed, but the price is more expensive. As for the multi-beam interferometry method and the solution measurement method, complicated calculations are required, and the structure is large, and there are many uncertain factors. Another m-line method is to record the angle when observing the m-line by the naked eye, and then the effective refractive index can be calculated, but the human eye has a large error and is not easy to be observed for some m-line methods (such as waveguide The m-line method is not very effective if the loss is large or the wavelength of the light wave is long.

換言之,如能改善前述量測方法的問題,而能由簡易的光學零組件構成,則可降低其量測成本,且如能進一步微小化,即可簡化現有繁雜的計算過程,讓使用簡易的幾何公式便可輕易求解,以達到操作便利及快速量測之效,並能提高量測的精度。In other words, if the problem of the above-described measurement method can be improved, and it can be composed of simple optical components, the measurement cost can be reduced, and if it can be further miniaturized, the existing complicated calculation process can be simplified, and the use is simple. The geometric formula can be easily solved to achieve convenient operation and fast measurement, and to improve the accuracy of measurement.

緣是,本案發明人乃鑑於前述現有透明基板於厚度與折射率量測時所面臨的問題,並藉由發明人從事相關產業的研發經驗,積極尋求解決之道,經不斷努力之研究與試作,終於成功的開發出一種量測透明基板厚度與折射率之架構,藉 以解決現有結構複雜、操作不便及準確性不佳的困擾。The reason is that the inventors of the present invention, in view of the problems faced by the above-mentioned conventional transparent substrate in thickness and refractive index measurement, and actively seek solutions through the research and development experience of the inventors in related industries, have been continuously researching and trialing. Finally, successfully developed a framework for measuring the thickness and refractive index of transparent substrates. To solve the problem of the existing structure is complicated, the operation is inconvenient and the accuracy is not good.

本發明之目的即在於提供一種量測透明基板厚度與折射率之架構,藉以簡化現有繁雜的計算過程,讓使用簡易的幾何公式便可輕易求解,而能提高量測的精度,本發明之次一目的係在於提供一種量測透明基板厚度與折射率之架構,其整體架構簡單、體積小、操作便利、共軛焦式頭及半導體雷射頭成本低廉且能快速運算參數,本發明之另一目的係在於提供一種量測透明基板厚度與折射率之架構,不需利用其他樣品來做依據,可降低誤差,提高量測的準確度。The object of the present invention is to provide a structure for measuring the thickness and refractive index of a transparent substrate, thereby simplifying the existing complicated calculation process, which can be easily solved by using a simple geometric formula, and can improve the accuracy of measurement, and the present invention. One object is to provide an architecture for measuring the thickness and refractive index of a transparent substrate, which has a simple overall structure, small volume, convenient operation, low cost of a conjugated focal head and a semiconductor laser head, and fast calculation parameters, and another method of the present invention. One objective is to provide an architecture for measuring the thickness and refractive index of a transparent substrate without using other samples as a basis for reducing errors and improving measurement accuracy.

可達成上述發明目的之量測透明基板厚度與折射率之架構,包括有:一共軛焦式頭,其可產生光源,該共軛焦式頭具有一可射出雷射光之雷射二極體,且共軛焦式頭於雷射二極體一側設有一可將雷射光分成穿透光與反射光之分光鏡,又分光鏡下方設有一可將線偏極光變為圓偏極光的四分之一波片,且四分之一波片下方並設有一能將圓偏極光變成平行光束之準直透鏡,再者分光鏡上方設有一可將光聚焦成不同大小方向之光點的半圓柱透鏡,而半圓柱透鏡上方設有一供接收前述光點之光檢測器;一物鏡,其係設於共軛焦式頭下方,該物鏡可產生聚焦 效果;一反射鏡,其係設於前述物鏡下方,該反射鏡與物鏡間形成有一待測空間,且反射鏡可將光束依反射定律反向射出;一半導體雷射頭,設於前述共軛焦式頭的另一側,該半導體雷射頭的軸線與共軛焦式頭的軸線為一固定角度θ ,且半導體雷射頭具有一可發出雷射光之雷射二極體,又雷射二極體前方設有一能正、逆轉之轉動裝置,且轉動裝置上設有一聚焦透鏡;一四象限感測器,係設於半導體雷射頭之雷射二極體雷射光穿經待測區一側的軸線上,該四象限感測器可用於接收失焦信號。An architecture for measuring the thickness and refractive index of a transparent substrate that achieves the above objects includes: a conjugated focal head that produces a light source, the conjugated focal head having a laser diode that emits laser light, The conjugated focal head is provided on the side of the laser diode with a beam splitter that can separate the laser light into the transmitted light and the reflected light, and a four-pointer that can change the line-polar light into a circular apolar light under the beam splitter. One of the wave plates, and a quarter-wave plate is provided with a collimating lens capable of turning the circularly polarized light into a parallel beam, and a semi-cylindrical lens is arranged above the beam splitter to focus the light into different sizes of light spots. a lens, and a photodetector for receiving the light spot is disposed above the semi-cylindrical lens; an objective lens is disposed under the conjugate focal head, the objective lens can produce a focusing effect; and a mirror is disposed on the objective lens Below, a space to be measured is formed between the mirror and the objective lens, and the mirror can reversely emit the light beam according to the law of reflection; a semiconductor laser head is disposed on the other side of the conjugated focus head, the semiconductor laser Head axis and conjugate focal length The angle [theta] is a fixed axis, and a head having a semiconductor laser can emit laser light of a laser diode, laser diode front and can be provided with a positive reversal of the rotation means, and the rotation is provided with a focusing device A four-quadrant sensor is disposed on an axis of a laser diode of a semiconductor laser that passes through a side of the region to be tested, and the four-quadrant sensor can be used to receive a defocus signal.

其量測方法係為:首先,該共軛焦式頭射出雷射光,使雷射光入射物鏡,並使雷射光開始聚焦,再入射一待測之透明基板,使雷射光產生折射,入射於反射鏡上,產生失焦信號反射回原光路,再入射共軛焦式頭,得到一個位移值△x1;接著,使半導體雷射頭發出雷射光,並利用轉動裝置,轉動半導體雷射頭前的聚焦透鏡,使雷射光入射聚焦透鏡並開始聚焦,再入射透明基板,使雷射光產生折射,入射於四象限感測器上,並接收失焦信號,且得到一個位移值△x2;之後,將得到的△x1和△x2代入解立方程式中,即可得 到該待測之透明基板的折射率和厚度。The measuring method is as follows: First, the conjugate focal head emits laser light, so that the laser light enters the objective lens, and the laser light starts to focus, and then enters a transparent substrate to be tested, so that the laser light is refracted and incident on the reflection On the mirror, the defocus signal is reflected back to the original optical path, and then incident on the conjugated focal head to obtain a displacement value Δx1; then, the semiconductor laser is laser-exposed, and the rotating device is used to rotate the semiconductor laser head. Focusing the lens, causing the laser light to enter the focusing lens and start focusing, then incident on the transparent substrate, causing the laser light to refract, incident on the four-quadrant sensor, and receiving the out-of-focus signal, and obtaining a displacement value Δx2; The obtained Δx1 and △x2 are substituted into the solution equation, and The refractive index and thickness of the transparent substrate to be tested.

藉此,透過本發明前述技術手段的展現,使得本發明可不需如現有者要龐大的量測設備及其他的樣品,來做為量測的依據,且量測操作步驟簡單,而能同時準確得到該待測透明基板之厚度與折射率,藉以提高其量測的精度,降低系統成本,而有效改善量測品質。Therefore, through the display of the foregoing technical means of the present invention, the present invention can be used as a basis for measurement without the need for a large measuring device and other samples as in the prior art, and the measuring operation step is simple, and can be accurate at the same time. The thickness and the refractive index of the transparent substrate to be tested are obtained, thereby improving the accuracy of the measurement, reducing the system cost, and effectively improving the measurement quality.

為使 貴審查委員能進一步了解本發明的構成、特徵及其他目的,以下乃舉本發明之若干較佳實施例,並配合圖式詳細說明如后,同時讓熟悉該項技術領域者能夠具體實施。The following is a description of the preferred embodiments of the present invention, and is described in detail with reference to the drawings, and the .

請參閱圖一,本發明所提供之量測透明基板厚度與折射率之架構,主要包括有:一共軛焦式頭10、一物鏡20、一反射鏡30、一半導體雷射頭40及一四象限感測器50所構成;其中該共軛焦式頭10具有一可射出雷射光之雷射二極體11,且共軛焦式頭10於雷射二極體11一側設有一可將雷射光分成穿透光與反射光之分光鏡12,該分光鏡12可令雷射二極體11之雷射光束轉折呈垂直交錯方向射出,又分光鏡12下方設有一可將線偏極光變為圓偏極光的四分之一波片13,且四分之一波片13下方並設有一能將圓偏極光變成平行光束之準直透鏡14,再者分光鏡12上方設有一半圓柱透鏡15,該半圓柱透鏡15可將光聚焦成不同大小方向的光點, 且半圓柱透鏡15上方另設有一光檢測器16(PDIC),使共軛焦式頭10處於正焦狀態,而該光檢測器16可用於將光訊號轉換成電訊號,以供電腦判讀;該物鏡20係設於共軛焦式頭10之準直透鏡14下方,可使準直透鏡14射出之平行光束能產生聚焦效果;又前述反射鏡30係設於該物鏡20下方,且於反射鏡30與物鏡20間形成有一供擺置待測透明基板60之待測空間,且該反射鏡30可將光束依反射定律反向射出;至於半導體雷射頭40設於前述共軛焦式頭10的另一側、且位於前述待測透明基板60之斜上方,又半導體雷射頭40的軸線與共軛焦式頭10的軸線為一固定角度θ ,其半導體雷射頭40的軸線與共軛焦式頭10的軸線界定的夾角是介於30度~80度之間,且半導體雷射頭40具有一可發出雷射光之雷射二極體41,該半導體雷射頭40並於雷射二極體41前方設有一能正、逆轉之轉動裝置42,且轉動裝置42上設有一位於雷射二極體41前方的聚焦透鏡43,供利用轉動裝置42的正、逆轉作用,以改變聚焦位置;而前述四象限感測器50係設於半導體雷射頭40之雷射二極體41雷射光穿經透明基板60一側的軸線上,該四象限感測器50可用於接收失焦信號,並將光訊號轉換為電訊號,以供電腦判讀;藉此,可組構成一結構簡單、且精準度高的量測透明基 被厚度與折射率之架構者。Referring to FIG. 1 , the architecture for measuring the thickness and refractive index of a transparent substrate provided by the present invention mainly includes: a conjugate focal length head 10, an objective lens 20, a mirror 30, a semiconductor laser head 40, and a fourth. The quadrant sensor 50 is configured; wherein the conjugated focal head 10 has a laser diode 11 that can emit laser light, and the conjugated focal head 10 is provided on the side of the laser diode 11 The laser beam is divided into a beam splitter 12 that transmits light and reflects light. The beam splitter 12 can cause the laser beam of the laser diode 11 to be turned in a vertical staggered direction, and a light deflecting light can be changed under the beam splitter 12. It is a quarter-wave plate 13 with a circular apolar light, and a collimating lens 14 capable of turning a circularly polarized light into a parallel beam is disposed under the quarter-wave plate 13, and a semi-cylindrical lens is disposed above the beam splitter 12 15. The semi-cylindrical lens 15 can focus the light into spots of different magnitudes, and a photodetector 16 (PDIC) is disposed above the semi-cylindrical lens 15 to place the conjugated coke head 10 in a positive focus state. The photodetector 16 can be used to convert the optical signal into an electrical signal for interpretation by a computer; The 20 series is disposed under the collimating lens 14 of the conjugate focal head 10, so that the parallel beam emitted by the collimating lens 14 can produce a focusing effect; and the mirror 30 is disposed under the objective lens 20 and is disposed on the mirror 30. A space for detecting the transparent substrate 60 to be tested is formed between the objective lens 20, and the mirror 30 can reversely emit the light beam according to the law of reflection; and the semiconductor laser head 40 is disposed on the conjugated focal head 10 The other side is located obliquely above the transparent substrate 60 to be tested, and the axis of the semiconductor laser head 40 is at a fixed angle θ with the axis of the conjugated focal head 10, and the axis and conjugate of the semiconductor laser head 40 are conjugated. The angle defined by the axis of the focal head 10 is between 30 degrees and 80 degrees, and the semiconductor laser head 40 has a laser diode 41 capable of emitting laser light, and the semiconductor laser head 40 is coupled to the laser. A positive and reverse rotating device 42 is disposed in front of the diode 41, and a rotating lens 42 is disposed on the rotating device 42 in front of the laser diode 41 for positive and negative rotation of the rotating device 42 to change the focus. Position; and the aforementioned four-quadrant sensor 50 is disposed on a semiconductor laser 40 laser diode 41 laser light passes through the axis of one side of the transparent substrate 60, the four-quadrant sensor 50 can be used to receive the defocus signal, and convert the optical signal into an electrical signal for computer interpretation; Therefore, it is possible to form a structure with a simple structure and high precision to measure the thickness of the transparent substrate and the refractive index.

至於本發明有關透明基板60之實際量測,係如圖二所示者,由共軛焦式頭10的雷射二極體11射發出雷射光束L1,該雷射光束L1入射分光鏡12後產生反射光L2-1,再入射該四分之一波片13,並產生雷射光線L3-1,同時再經過準直透鏡14將雷射光線變為平行光束L4-1,使該平行光束L4-1入射出至物鏡20,使該平行光束L4-1開始聚焦,而產生聚焦光L5-1,再入射於反射鏡30上,並反射回原光路產生反射光L5-2,處於再入射物鏡20,進而產生雷射光線L4-2,再入射準直透鏡14,並產生雷射光束L3-2,且再經過四分之一波片13後產生雷射光線L2-2,並入射分光鏡12產生穿透光L6,再穿射半圓柱透鏡15聚焦成不同大小方向的光點L7入射至光檢測器16,由光檢測器16接收該光訊號、且轉換成電訊號供電腦判讀,且使共軛焦式頭10處於正焦狀態;接著,該半導體雷射頭40之雷射二極體41發出雷射光L16,且利用轉動裝置42轉動聚焦透鏡43,當雷射光束入射該聚焦透鏡43後開始聚焦,並產生聚焦光束L17入射於四象限感測器50,使前述聚焦光束L17處於四象限感測器50的焦點狀態;之後,將待測的透明基板60放入位於物鏡20與反射鏡30之間的待測區中,並令透明基板60與該共軛焦式頭10平行,使共軛焦式頭10的雷射二極體11射發出雷射光束L1, 且入射分光鏡12後產生反射光L2-1,再入射該四分之一波片13產生雷射光線L3-1,同時再經過準直透鏡14將雷射光線變為平行光束L4-1,使平行光束入射出至物鏡20,令雷射光開始聚焦,而產生聚焦光L5-1,接著入射該待測之透明基板60,造成第一次折射,產生折射光後出射該待測之透明基板60,造成第二次折射,產生折射光L8經反射鏡30後,產生反射光L9,反射光入射透明基板60,造成第一次折射,產生折射光後出射待測物,造成第二次折射光L10,再入射物鏡20產生雷射光線L11,再入射準直透鏡14,產生雷射光線L12)經過四分之一波片13產生雷射光線L13,入射分分光鏡12產生穿透光L14,再穿射至半圓柱透鏡15聚焦成不同大小方向的光點L15入射至光檢測器16,且由該光檢測器16接收信號,所接收到的為光的信號,光檢測器將接收到的光信號轉換成為電壓信號,而得到一個位移值△x1;接著半導體雷射頭40之雷射二極體41發出雷射光L16,且利用轉動裝置42轉動聚焦透鏡43,使雷射光束入射聚焦透鏡(43)並開始裝焦,產生聚焦光束L17,入射透明基板60,使雷射光產生第一次折射光,再出射透明基板60產生第二次折射光L18,入射於四象限感測器50上,並接收失焦信號,且得到一個位移值△x2;最後將得到的△x1和△x2在分別帶入厚度與折射率的聯立方程式後,即可得出該待測之透明基板60的折射率和厚度。As for the actual measurement of the transparent substrate 60 of the present invention, as shown in FIG. 2, the laser diode L1 is emitted from the laser diode 11 of the conjugate focal head 10, and the laser beam L1 is incident on the beam splitter 12. Then, the reflected light L2-1 is generated, and then the quarter wave plate 13 is incident, and the laser light L3-1 is generated, and at the same time, the laser beam is converted into the parallel light beam L4-1 by the collimator lens 14, so that the parallel The light beam L4-1 is incident on the objective lens 20, so that the parallel light beam L4-1 starts to focus, and the focused light L5-1 is generated, which is incident on the mirror 30, and is reflected back to the original light path to generate the reflected light L5-2. The incident objective lens 20, which in turn generates the laser beam L4-2, is incident on the collimator lens 14, and generates the laser beam L3-2, and passes through the quarter-wave plate 13 to generate the laser beam L2-2 and is incident. The beam splitter 12 generates the transmitted light L6, and the spotted light is incident on the photodetector 16 by focusing on the light spot L7 of the different size directions. The light detector 16 receives the optical signal and converts it into an electrical signal for computer interpretation. And the conjugated focal head 10 is in a positive focus state; then, the laser diode 41 of the semiconductor laser head 40 emits a laser L16, and the focusing lens 43 is rotated by the rotating device 42, when the laser beam is incident on the focusing lens 43, the focusing is started, and the focused beam L17 is incident on the four-quadrant sensor 50, so that the focused beam L17 is in the four-quadrant sensor. The focus state of 50; after that, the transparent substrate 60 to be tested is placed in the area to be tested between the objective lens 20 and the mirror 30, and the transparent substrate 60 is parallel to the conjugate focal head 10 to make the conjugate focal length The laser diode 11 of the head 10 emits a laser beam L1, And after the incident beam splitter 12 is generated, the reflected light L2-1 is generated, and then the quarter wave plate 13 is incident to generate the laser light L3-1, and at the same time, the laser beam is converted into the parallel light beam L4-1 by the collimating lens 14. The parallel light beam is incident on the objective lens 20, and the laser light starts to focus, thereby generating the focused light L5-1, and then incident on the transparent substrate 60 to be tested, causing the first refraction, generating the refracted light and then exiting the transparent substrate to be tested. 60, causing the second refraction, generating the refracted light L8 through the mirror 30, generating the reflected light L9, the reflected light is incident on the transparent substrate 60, causing the first refraction, generating the refracted light and then emitting the object to be tested, resulting in the second refraction The light L10, the re-incidence objective lens 20 generates the laser light L11, and then enters the collimator lens 14 to generate the laser beam L12. The laser beam L13 is generated through the quarter-wave plate 13, and the incident beam splitter 12 generates the transmitted light L14. Then, the light spot L15, which is incident on the semi-cylindrical lens 15 and focused in different magnitude directions, is incident on the photodetector 16, and the signal is received by the photodetector 16, and the received light signal is received by the photodetector. The optical signal is converted into a voltage signal, and a displacement value Δx1; then the laser diode 41 of the semiconductor laser head 40 emits laser light L16, and the focusing lens 43 is rotated by the rotating device 42, so that the laser beam is incident on the focusing lens (43) and begins to focus, resulting in Focusing the light beam L17, entering the transparent substrate 60, causing the laser light to generate the first refracted light, and then exiting the transparent substrate 60 to generate the second refracted light L18, incident on the four-quadrant sensor 50, and receiving the defocus signal, and obtaining A displacement value Δx2; finally, the obtained Δx1 and Δx2 are respectively brought into a cubic equation of thickness and refractive index, and the refractive index and thickness of the transparent substrate 60 to be tested are obtained.

至於本發明之折射率與厚度的實際運算,則係採用像散法與司乃耳定律(Snell’s Law)之運算公式,其中像散法則係如圖三所示,其係利用光線經過半圓柱透鏡15在聚焦點前後會造成不同的像差,剛好在聚焦點上時光點會為一個正圓(如圖四a),在近焦(如圖四b)和遠焦(如圖四c)時光點會為橢圓,接著再由光檢測器16判別聚焦的位置是否正確。As for the actual calculation of the refractive index and thickness of the present invention, the astigmatism method and the algorithm of Snell's Law are used, wherein the astigmatism law is shown in FIG. 3, which uses light through a semi-cylindrical lens. 15 will cause different aberrations before and after the focus point, just at the focus point, the light spot will be a perfect circle (as shown in Figure 4a), in near focus (as shown in Figure 4b) and far focus (as shown in Figure 4c). The point will be an ellipse, and then the photodetector 16 will determine whether the position of the focus is correct.

至於司乃耳定律(Snell’s Law)則係如圖五所示,其可描述光線行進於不同介質間的關係。當光線L1由介質1入射至介質2,有反射光L2、有穿透光L3,θ 1代表入射角、θ r代表反射角、θ t代表折射角。而n1 、n2 則分別為介質1與介質2的折射率,又司乃耳定律(Snell’s Law)並應遵守以下關係式:θ 1=θrAs for Snell's Law, as shown in Figure 5, it describes the relationship of light travel between different media. When the light ray L1 is incident on the medium 2 from the medium 1, there is reflected light L2, there is transmitted light L3, θ 1 represents an incident angle, θ r represents a reflection angle, and θ t represents a refraction angle. And n 1 and n 2 are the refractive indices of medium 1 and medium 2, respectively, and Snell's Law should follow the following relationship: θ 1 =θr

n1×sinθi=n2×sinθtN1 × sin θi = n2 × sin θt

又本發明之共軛焦式頭10公式則係當待測物未置入量測區時,由圖六相對區塊可知f為本發明聚焦透鏡43的等校焦距,w為平行光束入射聚焦透鏡43之入瞳半徑,而為本發明光束的入射角,因此根據三角定理可求得如下(1-1)式所示: In addition, the conjugated coke head 10 formula of the present invention is when the object to be tested is not placed in the measurement area, and the relative block of FIG. 6 shows that f is the equi-focus distance of the focus lens 43 of the present invention, and w is the parallel beam incident focus. The entrance radius of the lens 43 is the incident angle of the beam of the present invention, so that the following equation (1-1) can be obtained according to the triangle theorem:

當量測區置入厚度為d之物件時,根據司乃耳定律 (Snell’s Law)可得知當光線線穿透不同介質時會產生折射,其中n1 為空氣折射率、n2 為待測透明基板60折射率、θ 2 為光束的入射待測透明基板60的折射角,利用此定理可得如下(1-2)式所示:n1 sinθ 1 =n2 sinθ 2 (1-2)When the equivalent measuring zone is placed into an object of thickness d, according to Snell's Law, it is known that when the light ray penetrates different media, refraction occurs, where n 1 is the refractive index of air and n 2 is the measured The refractive index of the transparent substrate 60 and θ 2 are the angles of refraction of the transparent substrate 60 incident on the light beam. Using this theorem, the following equation (1-2) can be obtained: n 1 sin θ 1 =n 2 sin θ 2 (1- 2)

由於光束入射在不同介質上,因此等效焦距將改變為f’,且由平面鏡延原光路反射回共軛焦雷射探頭並且接收,得到待測誤失焦誤差訊號,經由換算後得到一像散位移量△X,並且由圖可知f’=f+△X,由圖可知藍色區塊為光經過待測物時產生折射的行徑方向,並且做伸長線L得知光位移為z,可得如下(1-3)式所示: Since the beam is incident on different media, the equivalent focal length will be changed to f', and the plane mirror is extended back to the conjugated laser probe and received, and the error error signal to be measured is obtained, and an astigmatic displacement is obtained after conversion. The quantity △X, and f'=f+△X is known from the figure. It can be seen from the figure that the blue block is the direction of the refracting direction when the light passes through the object to be tested, and the extension line L is known to have the light displacement of z, which can be obtained as follows (1-3) shows:

由△ABC得知下式: The following formula is known from △ABC:

由△ABD得知下式: The following formula is known from △ABD:

由(1-4)、(1-5)式整理可得 It can be obtained by (1-4) and (1-5)

由(1-1)、(1-3)式整理可得tanθ 1 ×f=w tanθ 1 ×f+tanθ 1 ×△X=w+z z=tanθ 1 ×△X (1-7)According to the formulas (1-1) and (1-3), tan θ 1 × f = w tan θ 1 × f + tan θ 1 × ΔX = w + zz = tan θ 1 × ΔX (1-7 )

將(1-7)帶入(1-6)中可得出 Bring (1-7) into (1-6) to get

而根據高斯定理,當光束通過聚焦透鏡後,其孔徑大小為W,NA 0 為系統數值孔徑,得到如下式1-9所示: According to the Gauss's theorem, when the beam passes through the focusing lens, its aperture size is W, and NA 0 is the numerical aperture of the system, which is obtained as shown in the following formula 1-9:

可由前1-2式的司乃耳定律(Snell’s Law),整理成1-10式,並由三角定理推得如下1-11式及1-12式:NA 0 =n 1 sinθ 1 =n 2 sinθ 2 (1-10)It can be sorted into 1-10 by the Snell's Law of the former 1-2, and the following formulas 1-11 and 1-12 are derived from the triangle theorem: NA 0 = n 1 sin θ 1 = n 2 sin θ 2 (1-10)

由(1-9)、(1-10)帶入(1-8),並且n 1 為光在空氣中的折射率,故n 1 =1,最後可表示成如下1-13所示:可得到下式 (1-9), (1-10) bring in (1-8), and n 1 is the refractive index of light in air, so n 1 =1, and finally can be expressed as shown in the following 1-13: Get the following

在此先將△X標記為△X1以便和四象限感測器50部份做一區別。Here, ΔX is first marked as ΔX1 to make a difference from the four-quadrant sensor 50 portion.

至於半導體雷射頭40的公式,則係當其雷射二極體41發出雷射光束打入待測物時如圖七所示,其入射角稱為θ 1 ,進入待測之透明基板60產生折射角θ 2 ,利用θ 1θ 2 導出三角關係式:由△ABC得知下式: As for the formula of the semiconductor laser head 40, when the laser diode 41 emits a laser beam and enters the object to be tested, as shown in FIG. 7, the incident angle is called θ 1 , and enters the transparent substrate 60 to be tested. A refraction angle θ 2 is generated, and a triangular relationship is derived using θ 1 and θ 2 : the following formula is known from ΔABC:

由△ABD得知下式: The following formula is known from △ABD:

由(2-1)、(2-2)式可得 Available from (2-1) and (2-2)

所以將(2-5)帶入方程式(2-4)可得出 So taking (2-5) into equation (2-4) gives

由司乃耳定律(Snell’s Law)n1 sinθ 1 =n2 sinθ 2 (2-7)By Snell's Law n 1 sin θ 1 =n 2 sin θ 2 (2-7)

而且n1 =1(空氣),所以n2 sinθ 2 =sinθ 1 And n 1 =1 (air), so n 2 sin θ 2 = sin θ 1

由三角公式推導,可得到 Derived from the trigonometric formula, you can get

將(2-9)帶回(2-6)式可得到 Bring (2-9) back to (2-6)

在此把△X標記為△X2以便和共軛焦式頭部份做一區別,並且共軛焦式頭公式所得的(1-11)式與半導體雷射頭公式所得的(2-10),兩者聯立,便可同時得出厚度以及折射率。Here, ΔX is marked as ΔX2 to make a difference from the conjugated focal head portion, and the (1-11) equation obtained by the conjugated focal head formula and the semiconductor laser head formula (2-10) are obtained. When the two are connected, the thickness and the refractive index can be obtained at the same time.

透過前述的架構設計及量測方法,本發明可提供高其量測之精度,並降低整體架構之成本,且由於架構大幅簡化,故量測操作上更為便利,且量測速度極快,同時可在不破壞待測之透明基板60的前提下,得到該待測透明基板60的資訊,有效改善量測品質,針對於製作可穿透式的透明基板、光學玻璃、薄膜等,於檢測其厚度及折射率時提供更佳的量測品質與準確度。Through the foregoing architecture design and measurement method, the present invention can provide high measurement accuracy and reduce the cost of the overall architecture, and because the architecture is greatly simplified, the measurement operation is more convenient, and the measurement speed is extremely fast. At the same time, without obtaining damage to the transparent substrate 60 to be tested, the information of the transparent substrate 60 to be tested can be obtained, and the measurement quality can be effectively improved, and the transparent substrate, the optical glass, the film, etc. can be manufactured for the detection. Provides better measurement quality and accuracy in terms of thickness and refractive index.

綜上所述,本案不但在空間型態上確屬創新,並能較習用物品增進上述多項功效,應已充分符合新穎性及進步性之法定發明專利要件,爰依法提出申請,懇請 貴局核准本件發明專利申請案,以勵發明,至感德便。In summary, this case is not only innovative in terms of space type, but also can enhance the above-mentioned multiple functions compared with the customary items. It should fully comply with the statutory invention patent requirements of novelty and progressiveness, and apply for it according to law. This invention patent application, in order to invent invention, to the sense of virtue.

10‧‧‧共軛焦式頭10‧‧‧Conjugate focal head

11‧‧‧雷射二極體11‧‧‧Laser diode

12‧‧‧分光鏡12‧‧‧beam splitter

13‧‧‧四分之一玻片13‧‧‧ Quarter Slide

14‧‧‧準直透鏡14‧‧‧ Collimating lens

15‧‧‧半圓柱透鏡15‧‧‧Semi-cylindrical lens

16‧‧‧光檢測器16‧‧‧Photodetector

20‧‧‧物鏡20‧‧‧ Objective lens

30‧‧‧反射鏡30‧‧‧Mirror

40‧‧‧半導體雷射頭40‧‧‧Semiconductor laser head

41‧‧‧雷射二極體41‧‧‧Laser diode

42‧‧‧轉動裝置42‧‧‧Rotating device

43‧‧‧聚焦透鏡43‧‧‧focus lens

50‧‧‧四象限感測器50‧‧‧ four-quadrant sensor

60‧‧‧透明基板60‧‧‧Transparent substrate

圖一為本發明之量測透明基板厚度與折射率的系統架構示意圖;圖二為該量測透明基板厚度與折射率的系統光路示意圖; 圖三為該本發明應用之像散法示意圖;圖四為該本發明應用之像散法的成像示意圖,其中(A)為焦點、(B)為近焦、(C)為遠焦;圖五為該本發明應用之司乃耳定律(Snell’s Law)示意圖;圖六為該本發明中共軛焦式頭之光路示意圖;以及圖七為該本發明中半導體雷射頭之光路示意圖。1 is a schematic diagram of a system architecture for measuring the thickness and refractive index of a transparent substrate according to the present invention; and FIG. 2 is a schematic diagram of a system optical path for measuring the thickness and refractive index of a transparent substrate; 3 is a schematic diagram of the astigmatism method applied in the present invention; FIG. 4 is a schematic diagram of imaging of the astigmatism method applied in the present invention, wherein (A) is the focus, (B) is the near focus, and (C) is the far focus; 5 is a schematic diagram of the Snell's Law applied in the present invention; FIG. 6 is a schematic diagram of the optical path of the conjugated focal head in the present invention; and FIG. 7 is a schematic diagram of the optical path of the semiconductor laser head in the present invention.

10‧‧‧共軛焦式頭10‧‧‧Conjugate focal head

11‧‧‧雷射二極體11‧‧‧Laser diode

12‧‧‧分光鏡12‧‧‧beam splitter

13‧‧‧四分之一玻片13‧‧‧ Quarter Slide

14‧‧‧準直透鏡14‧‧‧ Collimating lens

15‧‧‧半圓柱透鏡15‧‧‧Semi-cylindrical lens

16‧‧‧光檢測器16‧‧‧Photodetector

20‧‧‧物鏡20‧‧‧ Objective lens

30‧‧‧反射鏡30‧‧‧Mirror

40‧‧‧半導體雷射頭40‧‧‧Semiconductor laser head

41‧‧‧雷射二極體41‧‧‧Laser diode

42‧‧‧轉動裝置42‧‧‧Rotating device

43‧‧‧聚焦透鏡43‧‧‧focus lens

50‧‧‧四象限感測器50‧‧‧ four-quadrant sensor

60‧‧‧透明基板60‧‧‧Transparent substrate

Claims (10)

一種量測透明基板厚度與折射率之架構,包括有:一共軛焦式頭,其可產生雷射光,其一側設有一可將雷射光分成穿透光與反射光之分光鏡,又分光鏡下方設有一可將線偏極光變為圓偏極光的四分之一波片,且四分之一波片下方並設有一能將圓偏極光變成平行光束之準直透鏡,再者分光鏡上方設有一可將光聚焦成不同大小方向之光點的半圓柱透鏡,而半圓柱透鏡上方設有一供接收光點之光檢測器;一物鏡,係設於共軛焦式頭下方,該物鏡可產生聚焦效果;一反射鏡,係設於物鏡下方,該反射鏡與物鏡間形成有一待測空間,且反射鏡可將光束依反射定律反向射出;一半導體雷射頭,設於共軛焦式頭的另一側,該半導體雷射頭的軸線與共軛焦式頭的軸線以一夾角設置,且雷射二極體前方設有一轉動裝置,轉動裝置上設有一聚焦透鏡;一四象限感測器,係設於半導體雷射頭之雷射二極體雷射光穿經待測區一側的軸線上,該四象限感測器可用於接收失焦信號。 An architecture for measuring the thickness and refractive index of a transparent substrate comprises: a conjugated focal head capable of generating laser light, and a splitter mirror for splitting the laser light into the reflected light and the reflected light, and a beam splitter Below is a quarter-wave plate that converts the line-polarized light into a circularly polarized light, and a quarter-wave plate is provided with a collimating lens that can convert the circularly polarized light into a parallel beam, and then above the beam splitter a semi-cylindrical lens is provided for focusing light into spots of different magnitudes, and a photodetector for receiving a light spot is disposed above the semi-cylindrical lens; an objective lens is disposed under the conjugate focal head, the objective lens can be Producing a focusing effect; a mirror is disposed under the objective lens, a space to be measured is formed between the mirror and the objective lens, and the mirror can reversely emit the light beam according to the law of reflection; a semiconductor laser head is disposed at the conjugate focal length On the other side of the head, the axis of the semiconductor laser head is disposed at an angle with the axis of the conjugated focal head, and a rotating device is disposed in front of the laser diode, and a focusing lens is disposed on the rotating device; Sensor, The semiconductor laser provided on the head of the laser diode via the laser beam through the measuring region on the side of the axis, the four-quadrant sensor operable to receive defocus signal. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該共軛焦式頭射出雷射光,使雷射 光入射物鏡,並使雷射光開始聚焦,再入射一待測之透明基板,使雷射光產生折射,入射於反射鏡上,產生失焦信號反射回原光路,再入射共軛焦式頭,而得到一個位移值△x1;接著,使半導體雷射頭發出雷射光,且利用轉動裝置,轉動半導體雷射頭前的聚焦透鏡,使雷射光入射聚焦透鏡並開始聚焦,再入射透明基板,使雷射光產生折射,入射於四象限感測器上,並接收失焦信號,且得到一個位移值△x2;將得到的△x1和△x2分別帶入厚度與折射率的聯立方程式中,並且解聯立方程式,即可得到該待測之透明基板的折射率和厚度。A structure for measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the conjugated focal head emits laser light, causes the laser light to enter the objective lens, and causes the laser light to start focusing, and then enters the incident Measuring the transparent substrate, causing the laser light to refract, incident on the mirror, generating a defocus signal reflected back to the original light path, and then incident on the conjugated focal head to obtain a displacement value Δx1; then, causing the semiconductor laser to exit Laser light, and using a rotating device, rotates the focusing lens in front of the semiconductor laser head, so that the laser light enters the focusing lens and starts focusing, and then enters the transparent substrate to refract the laser light, is incident on the four-quadrant sensor, and receives Defocusing the signal, and obtaining a displacement value Δx2; taking the obtained Δx1 and Δx2 into a simultaneous equation of thickness and refractive index, and decomposing the cubic equation, the refractive index of the transparent substrate to be tested is obtained. thickness. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該光檢測器可將接收至半圓柱透鏡上不同大小方向的光點之光訊號使其轉為電訊號,以供電腦判讀。An architecture for measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the photodetector converts the optical signals received to the light spots of different sizes on the semi-cylindrical lens into electrical signals. For computer interpretation. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該半導體雷射頭其光波具有高度的指向性與同調性。An apparatus for measuring thickness and refractive index of a transparent substrate according to claim 1 , wherein the semiconductor laser head has a high directivity and coherence. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該轉動裝置可以為順時針或逆時針旋轉,用以改變聚焦位置。A structure for measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the rotating device can be rotated clockwise or counterclockwise to change the focus position. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該四象限感測器可接收其反射雷射光之光訊號轉為電訊號,以供電腦判讀。The structure of measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the four-quadrant sensor can receive the optical signal of the reflected laser light and convert it into an electrical signal for computer interpretation. 如申請專利範圍第2 項所述之一種量測透明基板厚度與折射率之架構,其中該透明基板可以是穿透式的量測物。A structure for measuring the thickness and refractive index of a transparent substrate according to claim 2 , wherein the transparent substrate may be a transmissive measuring object. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該共軛焦式頭具有一可射出雷射光之雷射二極體。An architecture for measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the conjugated focal head has a laser diode that emits laser light. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該半導體雷射頭的軸線與共軛焦式頭的軸線為一固定角度θA structure for measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the axis of the semiconductor laser head is at a fixed angle θ with the axis of the conjugated focal head. 如申請專利範圍第1 項所述之一種量測透明基板厚度與折射率之架構,其中該半導體雷射頭具有一可發出雷射光之雷射二極體。An architecture for measuring the thickness and refractive index of a transparent substrate according to claim 1 , wherein the semiconductor laser head has a laser diode capable of emitting laser light.
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