CN101701796A - Device for detecting thickness of photoresist on curved surface and method for detecting thickness of photoresist on curved surface point by point - Google Patents
Device for detecting thickness of photoresist on curved surface and method for detecting thickness of photoresist on curved surface point by point Download PDFInfo
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- CN101701796A CN101701796A CN200910154354A CN200910154354A CN101701796A CN 101701796 A CN101701796 A CN 101701796A CN 200910154354 A CN200910154354 A CN 200910154354A CN 200910154354 A CN200910154354 A CN 200910154354A CN 101701796 A CN101701796 A CN 101701796A
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Abstract
The invention discloses a device for detecting thickness of photoresist on a curved surface and a method for detecting thickness of photoresist on the curved surface point by point. The device comprises a laser transmitter, a guide, a beam splitter prism, a first optical power meter, a second optical power meter and a lens, wherein the beam splitter prism is arranged on the guide; the light rays transmitted by the laser transmitter irradiate the beam splitter prism; the transmitted light rays passing through the beam splitter prism irradiate the first optical power meter; the reflected light rays passing through the beam splitter prism irradiate the lens; the light rays passing through the lens enter along the direction of the center of sphere of the curved surface on a photoresist layer of a detected sample, return along an entrance light path after being reflected by the detected curved surface on the photoresist layer and irradiate the second optical power meter after passing through the lens and the beam splitter prism in turn. The invention can realize point-by-point measurement of the thickness and distribution of the photoresist on the substrate of the curved surface without destruction.
Description
Technical field
The present invention relates to the method for spot measurement that the suprabasil photoresist thickness of curved surface be can't harm.
Background technology
Along with the development of photoetching technique, curved surface laser direct-writing technology becomes the new direction of photoetching technique development.The thickness distribution of curved surface glue-line has determined the effect of final three-dimensional relief microstructure.Thick being distributed in of curved surface substrate glue is exactly uneven in theory, and unevenness is relevant with the curvature of substrate, so just need obtain the accurate thickness distribution of glue-line.
Step instrument method and ellipsometry method comparatively are fit to the thick measurement of glue in the existing measuring technique.Step instrument method is a tension type, destroys the glue-line surface, and can only the measurement plane glue-line, and is powerless to the curved surface glue-line.Ellipsometry method has higher measuring accuracy, is fit to the detection of plane glue-line.But in the measurement of curved surface glue-line, can not guarantee precision and accuracy, need revise for the result after the measurement.So the thick measurement of curved surface glue is a blank technically, there is not specific method to obtain the thickness distribution of photoresist.
Summary of the invention
The purpose of this invention is to provide method and pick-up unit that a kind of pointwise that the suprabasil photoresist thickness of curved surface be can't harm detects.
The present invention realizes that the technical scheme that its goal of the invention is taked is:
This curved surface glue thickness detector mainly comprises generating laser, guide rail, Amici prism, first light power meter, second light power meter and lens, described Amici prism is arranged on the guide rail, the irradiate light that generating laser sends is on Amici prism, be radiated on first light power meter through the transmitted ray behind the Amici prism, be radiated on the lens through the reflection ray behind the Amici prism, the light of process lens is along the glue-line curved surface centre of sphere direction incident of test sample, light returns along input path behind tested glue-line camber reflection, successively through being radiated on second light power meter behind lens and the Amici prism.
Further, laser emitter of the present invention is a frequency stabilized laser.
The method of using pick-up unit of the present invention to carry out the thick pointwise detection of curved surface glue mainly comprises the steps:
1) emergent ray that sends of generating laser is radiated on the Amici prism that is arranged on the guide rail, is radiated on first light power meter through the transmitted ray behind the Amici prism, is radiated on the lens through the reflection ray behind the Amici prism;
2) through the glue-line curved surface centre of sphere direction incident of the light of lens, behind described glue-line camber reflection, return, be radiated at once more on the lens along input path along test sample, after be radiated on second light power meter through Amici prism;
3) change the reflectance of certain glue-line on a bit that obtains test sample according to the light intensity that obtains on first light power meter and second light power meter, and further obtain the bondline thickness of this point;
4) change the emergent ray direction by the Amici prism on the moving guide rail, to measure a bondline thickness on the line;
5) test sample is used the clamper clamping, vertically rotated test sample, obtain the interior bondline thickness of whole audience scope of test sample.
4. method of carrying out the thick pointwise detection of curved surface glue according to claim 3 is characterized in that described bondline thickness obtains by following steps:
A) according to the projection of the splitting ratio of known Amici prism and lens than the light intensity I1 that, first light power meter is write down, obtain through the light intensity I2 of the reflection ray of Amici prism and through behind the lens along the light intensity I3 of the light of the glue-line curved surface centre of sphere direction incident of test sample;
B) write down the light intensity I5 that is obtained by second light power meter, and obtain the light intensity I4 of light behind the glue-line camber reflection of test sample according to the splitting ratio of Amici prism and the transmittance of lens;
C) by light the light intensity I4 behind the glue-line camber reflection of test sample with obtain glue-line reflectance through the ratio along the light intensity I3 of the light of the glue-line curved surface centre of sphere direction incident of test sample behind the lens, the light of two kinds of different wave lengths successively launching by generating laser, the glue-line reflectance of two the wavelength light of certain that obtains test sample on a bit calculates the bondline thickness of this point by glue-line reflectance;
D) by changing Amici prism test sample on position on the guide rail and rotation clamper, repeating step a) obtains bondline thickness in the whole audience scope of test sample to step c).
Compared with prior art, the invention has the beneficial effects as follows: (1) is chosen in the light source of the non-photosensitive area of photoresist on measurement light source, glue-line is played a protective role.The thickness distribution of measurement photoresist layer that (2) can real-time online obtains curved surface bondline thickness distribution situation accurately.What (3) the present invention used is contactless detection method, and pick-up unit does not also produce exposure effect to photoresist, the measurement that can can't harm the suprabasil photoresist thickness of tested curved surface.
Description of drawings
Fig. 1 is the structural representation of the thick pointwise pick-up unit of curved surface glue of the present invention;
Fig. 2 is to use the structural representation of the thick pointwise pick-up unit of curved surface glue of the present invention;
Fig. 3 is to use the thick pointwise pick-up unit of curved surface glue of the present invention to detect the measuring principle figure of the curved surface bondline thickness of test sample;
Fig. 4 is to use the thick pointwise pick-up unit of curved surface glue of the present invention to detect the measuring principle figure of the curved surface bondline thickness of test sample;
Among the figure, 1 generating laser, 2 guide rails, 3 Amici prisms, 4 first light power meters, 5 second light power meters, 6 lens, 7 glue-lines, 8 substrates.
Embodiment
As shown in Figure 1, the thick pointwise pick-up unit of curved surface glue of the present invention mainly comprises: generating laser 1, guide rail 2, Amici prism 3, first light power meter 4, second light power meter 5 and lens 6.Wherein, Amici prism 3 is arranged on the guide rail 2.This Amici prism 3 can move along guide rail 2, to change the direction via the emergent ray of Amici prism 3.The curved surface centre of sphere of test sample is positioned at the focal position of lens 6, test sample clamper clamping.The transmitted ray of first light power meter 4 and second light power meter, 5 synchronous recording Amici prisms 3 reaches from the light intensity of the reflection ray of substrate glue-line reflected back.
When using pick-up unit of the present invention to carry out the thick pointwise of curved surface glue to detect, as depicted in figs. 1 and 2, the output laser of generating laser 1 makes photoresist not produce exposure effect at the non-photosensitive region of photoresist.The emergent ray of generating laser 1 is radiated on the Amici prism 3 that is arranged on the guide rail 2, and light is radiated on first light power meter 4 through the transmitted ray behind the Amici prism 3, and light is radiated on the lens 6 through the reflection ray behind the Amici prism 3.Through the curved surface centre of sphere direction incident of the light of lens 6 along the glue-line of test sample, behind tested camber reflection, return along original optical path, be radiated at once more on the lens 6, after be radiated on second light power meter 5 through Amici prism 3.The beam split of the Amici prism 3 when transmittance of lens 6 is known.Obtain glue-line reflectance by calculating, distribute thereby obtain bondline thickness.Concrete calculation procedure is as follows: 1) emergent ray of generating laser 1 is radiated on the Amici prism 3, transmitted ray is radiated on first light power meter 4, reflection ray is radiated on the lens 6, the projection ratio of the splitting ratio of known Amici prism 3 and lens 6, first light power meter, 4 record light intensity I1, splitting ratio according to Amici prism 3 calculates from the light intensity I2 of the light of Amici prism reflection, according to the projection ratio of lens 6, calculate the light intensity I3 of light through the emergent ray (this emergent ray is the incident ray of the curved surface of the glue-line 7 that is radiated at test sample) of lens 6.2) light intensity of light behind tested camber reflection is I4, after former input path is returned, be radiated on second light power meter 5 through lens 6 and Amici prism 3, second light power meter, 5 record light intensity I5 calculate the value of light intensity I4 according to the transmittance of the splitting ratio of Amici prism 3 and lens 6.3) ratio of I4 and I3 obtains glue-line reflectance, and generating laser 1 is successively launched the light of two kinds of different wave lengths, obtains the glue-line reflectance of two wavelength light of this point, calculates this bondline thickness by glue-line reflectance.4) distribute by changing the glue-line that tested element obtains in the whole audience scope on the position of Amici prism 3 on guide rail 2 and the rotation clamper.
The point-to-point measurement principle that curved surface substrate glue is thick is as follows:
As shown in Figure 3, light is with θ
0Angle incident, n
0Be air refraction, be known as 1.N is unknown glue-line refractive index, n
GBe known glass medium refractive index, the bondline thickness of h for measuring.
Uptake is minimum, disregards the absorption of film and glass medium all below several microns because glue is thick, and when light source normal incidence, the reflectance of monofilm is:
Wherein δ is the phase differential that causes of two light beam light path differences in succession,
Whole substrate after the gluing, light total transmittance are τ
τ＝τ
1τ
2 (3)
Wherein, τ
1Be the glued membrane transmittance, ρ=1-τ
1, (4)
τ
2Be the transmittance of light by substrate medium lower surface, during normal incidence,
τ
2＝1-ρ
2， (6)
When substrate was transparent, the light source transmittance difference of different wave length calculated light source transmittance τ separately, application of formula (3), and formula (4), formula (5) is obtained different glue-line reflectance ρ with formula (6).When substrate was opaque, the source reflection of different wave length can directly calculate reflectance ρ than also different.Application of formula (1) again, formula (2) can be listed and contain unknown number n, the equation of h.Solving equation can obtain bondline thickness h.
When being the convex surface glue-line, index path as shown in Figure 4.When light during, will return along the former road of input path from the light of glue-line substrate interface reflected back, and will penetrate from another direction from the light of substrate 8 reflections along the direction incident in the substrate center of circle.As long as separate the incident ray and the reflection ray of going the same way like this, just can access the reflectance ρ of photoresist layer, just can access the bondline thickness h of this point as above-mentioned measuring principle.
Claims (4)
1. curved surface glue thickness detector, it is characterized in that: comprise generating laser (1), guide rail (2), Amici prism (3), first light power meter (4), second light power meter (5) and lens (6), described Amici prism (3) is arranged on the guide rail (2), the irradiate light that generating laser (1) sends is on Amici prism (3), be radiated on first light power meter (4) through the transmitted ray behind the Amici prism (3), be radiated on the lens (6) through the reflection ray behind the Amici prism (3), the light of process lens (6) is along the glue-line curved surface centre of sphere direction incident of test sample, light returns along input path behind tested glue-line camber reflection, is radiated on second light power meter (5) after passing through lens (6) and Amici prism (3) successively.
2. curved surface glue thickness detector according to claim 1 is characterized in that: described laser emitter is a frequency stabilized laser.
3. one kind is used the pick-up unit of claim 1 to carry out the method that the thick pointwise of curved surface glue detects, and it is characterized in that comprising the steps:
1) emergent ray that sends of generating laser (1) is radiated on the Amici prism (3) that is arranged on the guide rail (2), be radiated on first light power meter (4) through the transmitted ray behind the Amici prism (3), be radiated on the lens (6) through the reflection ray behind the Amici prism (3);
2) through the light of lens (6) along the glue-line curved surface centre of sphere direction incident of test sample, behind described glue-line camber reflection, return along input path, be radiated at once more on the lens (6), after be radiated on second light power meter (5) through Amici prism (3);
3) go up the reflectance that the light intensity that obtains changes certain glue-line on a bit that obtains test sample according to first light power meter (4) and second light power meter (5), and further obtain the bondline thickness of this point;
4) change the emergent ray direction by the Amici prism (3) on the moving guide rail (2), to measure a bondline thickness on the line;
5) test sample is used the clamper clamping, vertically rotated test sample, obtain the interior bondline thickness of whole audience scope of test sample.
4. method of carrying out the thick pointwise detection of curved surface glue according to claim 3 is characterized in that described bondline thickness obtains by following steps:
A) according to the projection of the splitting ratio of known Amici prism (3) and lens (6) compare, the light intensity I1 that write down of first light power meter (4), obtain through the light intensity I2 of the reflection ray of Amici prism (3) with through the light intensity I3 of lens (6) back along the light of the glue-line curved surface centre of sphere direction incident of test sample;
B) write down the light intensity I5 that is obtained by second light power meter (5), and obtain the light intensity I4 of light behind the glue-line camber reflection of test sample according to the splitting ratio of Amici prism (3) and the transmittance of lens (6);
C) by the light intensity I4 of light behind the glue-line camber reflection of test sample with obtain glue-line reflectance through lens (6) back along the ratio of the light intensity I3 of the light of the glue-line curved surface centre of sphere direction incident of test sample, by generating laser (1) the successively light of two kinds of different wave lengths of emission, the glue-line reflectance of two the wavelength light of certain that obtains test sample on a bit calculates the bondline thickness of this point by glue-line reflectance;
D) by changing Amici prism (3) test sample on position on the guide rail (2) and rotation clamper, repeating step a) obtains bondline thickness in the whole audience scope of test sample to step c).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910154354A CN101701796A (en) | 2009-11-30 | 2009-11-30 | Device for detecting thickness of photoresist on curved surface and method for detecting thickness of photoresist on curved surface point by point |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910154354A CN101701796A (en) | 2009-11-30 | 2009-11-30 | Device for detecting thickness of photoresist on curved surface and method for detecting thickness of photoresist on curved surface point by point |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590030A (en) * | 2012-01-18 | 2012-07-18 | 浙江大学 | Small-passage gas-liquid phase flow pattern identification device and method based on photovoltaic array sensor |
| CN103217274A (en) * | 2013-04-16 | 2013-07-24 | 北极光电(深圳)有限公司 | Method for detection and judgment of optical characteristic qualified region of deformed thin film filter |
| CN103217137A (en) * | 2013-03-29 | 2013-07-24 | 东莞市三文光电技术有限公司 | Adhesive layer thickness measurement method |
| CN108685161A (en) * | 2017-04-12 | 2018-10-23 | 索迪门股份公司 | The method and system of the source orbit of product for determining the tobacco industry, Cigarette inspection station |
| CN113567437A (en) * | 2021-07-27 | 2021-10-29 | 中国科学院半导体研究所 | Dispensing quality detection device, dispensing quality detection method, electronic equipment and storage medium |
-
2009
- 2009-11-30 CN CN200910154354A patent/CN101701796A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590030A (en) * | 2012-01-18 | 2012-07-18 | 浙江大学 | Small-passage gas-liquid phase flow pattern identification device and method based on photovoltaic array sensor |
| CN103217137A (en) * | 2013-03-29 | 2013-07-24 | 东莞市三文光电技术有限公司 | Adhesive layer thickness measurement method |
| CN103217137B (en) * | 2013-03-29 | 2016-02-10 | 东莞市三文光电技术有限公司 | Bondline thickness measuring method |
| CN103217274A (en) * | 2013-04-16 | 2013-07-24 | 北极光电(深圳)有限公司 | Method for detection and judgment of optical characteristic qualified region of deformed thin film filter |
| CN108685161A (en) * | 2017-04-12 | 2018-10-23 | 索迪门股份公司 | The method and system of the source orbit of product for determining the tobacco industry, Cigarette inspection station |
| CN108685161B (en) * | 2017-04-12 | 2022-03-25 | 索迪门股份公司 | Method and system for determining the origin trajectory of products of the tobacco processing industry, cigarette inspection station |
| CN113567437A (en) * | 2021-07-27 | 2021-10-29 | 中国科学院半导体研究所 | Dispensing quality detection device, dispensing quality detection method, electronic equipment and storage medium |
| CN113567437B (en) * | 2021-07-27 | 2024-02-27 | 中国科学院半导体研究所 | Dispensing quality detection device, detection method, electronic equipment and storage medium |
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Open date: 20100505 |