TWI389978B - Insulating silicone rubber composition - Google Patents
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- TWI389978B TWI389978B TW095104932A TW95104932A TWI389978B TW I389978 B TWI389978 B TW I389978B TW 095104932 A TW095104932 A TW 095104932A TW 95104932 A TW95104932 A TW 95104932A TW I389978 B TWI389978 B TW I389978B
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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Description
本發明係有關熱硬化型聚矽氧橡膠組成物,特別有關不僅於室溫下,即使於高溫仍具十足良好的抗靜電性之絕緣性聚矽氧橡膠組成物。The present invention relates to a thermosetting polyoxyxene rubber composition, and particularly relates to an insulating polyoxyxene rubber composition which is excellent in antistatic properties not only at room temperature but also at a high temperature.
聚矽氧橡膠因具有良好的耐氣候性、電氣特性、低壓縮永久變形性、耐熱性、耐寒性等特性,因此,被廣泛利用於電氣機器、汽車、建築、醫療、食品之各種領域。如:做為搖控器、打字機、文書處理機、電腦終端機、樂器等之橡膠接點所使用之小型鍵盤;建築用墊圈;聲頻裝置等之防振橡膠;連接封條、火星塞護板等汽車部品、電腦所使用之CD用襯墊、麵包、蛋糕之塑模等用途例者。目前聚矽氧橡膠之需求日益高漲,被期待開發更具良好特性之聚矽氧橡膠。Polyoxymethylene rubber is widely used in various fields of electrical equipment, automobiles, construction, medical care, and food because of its excellent weather resistance, electrical properties, low compression set, heat resistance, and cold resistance. Such as: small keyboard used as a rubber contact for remote control, typewriter, word processor, computer terminal, musical instrument, etc.; construction gasket; anti-vibration rubber for audio device; connection seal, spark plug shield, etc. For use in automotive parts, CD pads for use in computers, bread, and molds for cakes. At present, the demand for polyoxyxene rubber is increasing, and it is expected to develop polyoxyxene rubber with better characteristics.
此等聚矽氧橡膠通常以含有高聚合度之有機聚矽氧烷與補強性填充材料之組成物形態供給之。此組成物係使用筒混合器、雙根滾輥等混合裝置藉由混合補強性填充材料、各種分散劑於原料聚合物中所調整者。有機聚矽氧烷、二氧化矽等補強性填充材料為電氣絕緣材料者,配合其所得之聚矽氧橡膠組成物及其硬化物之聚矽氧橡膠經與各種物質接觸後將產生靜電、導致吸附空氣中之灰塵等問題點。These polyoxyxene rubbers are usually supplied in the form of a composition containing a high degree of polymerization of an organopolyoxane and a reinforcing filler. This composition is adjusted by mixing a reinforcing filler and various dispersants in a raw material polymer using a mixing device such as a cartridge mixer or a double roller. If the reinforcing filler material such as organic polyoxane or cerium oxide is an electrical insulating material, the polyfluorene rubber composition obtained by blending the polyfluorene oxide rubber composition and the cured product thereof will generate static electricity after being contacted with various substances, resulting in static electricity. Adsorption of dust and other problems in the air.
先前技術中,抗靜電橡膠係使用做為抗靜電劑之聚醚系(專利文獻1)、碳黑(專利文獻2、3)。使用聚醚時於高溫時將分解聚醚,而無法出現有效的抗靜電效果之問題點產生。特別是僅於熱硬化型聚矽氧橡膠進行公知之後處理仍幾無抗靜電效果。使用碳黑時,則不易維持電氣絕緣性,受限於黑色之問題點存在。另外,特開2003-82232號公報(專利文獻4)中被揭示添加鋰鹽之半導電滾筒用聚矽氧橡膠組成物,惟,半導體範圍中,無法適用於非得使用絕緣物質不可之電線被覆、小型鍵盤等問題點的存在。In the prior art, the antistatic rubber is a polyether (Patent Document 1) and carbon black (Patent Documents 2 and 3) which are antistatic agents. When a polyether is used, the polyether is decomposed at a high temperature, and the problem of an effective antistatic effect cannot occur. In particular, only after the heat-curable polyoxyxene rubber is known to be treated, there is still no antistatic effect. When carbon black is used, it is difficult to maintain electrical insulation, and it is limited by the problem of black. Japanese Patent Laid-Open Publication No. 2003-82232 (Patent Document 4) discloses a polyoxyxene rubber composition for a semiconductive roller to which a lithium salt is added. However, in the semiconductor range, it cannot be applied to a wire covered with an insulating material. The existence of problems such as small keyboards.
[專利文獻1]特表2002-500237號公報[專利文獻2]特表2002-507240號公報[專利文獻3]特表2002-327122號公報[專利文獻4]特表2003-82232號公報[Patent Document 1] Japanese Laid-Open Patent Publication No. 2002-507240 (Patent Document 3) Japanese Laid-Open Patent Publication No. JP-A No. 2002- 277
本發明之目的係提供一種可維持絕緣性、抗靜電性優異,即使曝露於高溫下仍可維持優異抗靜電特性之聚矽氧橡膠之絕緣性聚矽氧橡膠組成物。An object of the present invention is to provide an insulating polyoxyxene rubber composition which is excellent in insulating properties and antistatic properties and which can maintain excellent antistatic properties even when exposed to high temperatures.
本發明者為達成上述目的而進行精心研討後,結果發現熱硬化型聚矽氧橡膠組成物中添加少量之離子導電性抗靜電劑後,可解決上述課,進而完成本發明。亦即,本發明係提供於熱硬化型聚矽氧橡膠組成物100質量份中含有離子導電性抗靜電劑0.0001~5質量份之具良好抗靜電性能的絕緣性聚矽氧橡膠組成物。The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, it has been found that a small amount of an ion conductive antistatic agent is added to the thermosetting polyoxyxene rubber composition, and the above-mentioned lessons can be solved, and the present invention can be completed. In other words, the present invention provides an insulating polyoxyxene rubber composition having a good antistatic property of 0.0001 to 5 parts by mass of an ion conductive antistatic agent in 100 parts by mass of the thermosetting polyoxyxene rubber composition.
本發明之絕緣性聚矽氧橡膠組成物之硬化物係可維持絕緣性,具良好抗靜電性、曝露於高溫下仍可維持良好的抗靜電特性。又,亦可自由著色。The cured product of the insulating polyoxyxene rubber composition of the present invention can maintain insulation properties, has good antistatic properties, and can maintain good antistatic properties when exposed to high temperatures. Also, you can freely color.
以下,進行本發明之詳細說明。Hereinafter, the detailed description of the present invention will be made.
做為熱硬化型聚矽氧橡膠組成物者,只要經由加熱硬化之聚矽氧橡膠組成物者,並未特別限定,一般於分子中至少具2個做為基劑聚合物之烯基之有機聚矽氧烷中必要時配合補強性二氧化矽等填充劑後,使用做為硬化劑之加成反應型硬化劑及/或有機過氧化物硬化劑者宜。其形狀可為銑刀加工型或液狀形態。The composition of the thermosetting polyoxyxene rubber is not particularly limited as long as it is a composition of the polyoxyethylene rubber which is hardened by heat, and is generally organic having at least two alkenyl groups as a base polymer in the molecule. In the case of a polyoxyalkylene, if necessary, a filler such as a reinforcing cerium oxide is used, and an addition reaction type curing agent and/or an organic peroxide curing agent which is a curing agent are preferably used. The shape can be a milling cutter or a liquid form.
做為(A)成份者可使用下述平均組成式(I)所示者。As the component (A), the following average composition formula (I) can be used.
RaSiO( 4 - 2 ) / 2 (I)RaSiO ( 4 - 2 ) / 2 (I)
(式中,R為相同或相異之碳數1~10之非取代或取代一價烴基,a為1.8~2.3之正數)(wherein R is an unsubstituted or substituted monovalent hydrocarbon group having the same or different carbon number of 1 to 10, and a is a positive number of 1.8 to 2.3)
其中,R為相同或相異之碳數1~10,較佳者為1~8之非取代或取代之一價烴基,具體例如:甲基、乙基、丙基、異丙基、丁基、異丁基、第三-丁基、戊基、新戊基、己基、環己基、辛基、壬基、癸基等之碳數1~10之烷基、苯基、甲苯基、二甲苯基、萘基等碳數6~10之芳基、苄基、苯基乙基、苯基丙基等芳烷基、乙烯基、烯丙基、丙烯基、異丙烯基、丁烯基、己烯基、環己烯基、辛烯基等碳數2~10烯基,此等基之部份或全部氫原子被氟、溴、氯等鹵原子、氰基等取代者,如:氯甲基、氯丙基、溴乙基、三氟丙基、氰乙基等例。此等中又以甲基、乙烯基、苯基、三氟丙基為較佳,R至少以50莫耳%以上,特別以80莫耳%以上為甲基者宜。此時,R至少有2個務必為烯基(碳數2~8者宜,更佳為2~6)。烯基之含量為R中之0.0001~20莫耳%,特別以0.001~10莫耳%為較佳。此烯基可鍵結於分子鏈末端之矽原子,亦可鍵結於分子鏈途中之矽原子,或鍵結於兩者均可。Wherein R is the same or different carbon number of 1 to 10, preferably 1 to 8 of an unsubstituted or substituted monovalent hydrocarbon group, specifically, for example, methyl, ethyl, propyl, isopropyl, butyl , isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, decyl, decyl, etc., alkyl having 1 to 10 carbon atoms, phenyl, tolyl, xylene An aryl group such as an aryl group having 6 to 10 carbon atoms, a benzyl group, a phenylethyl group or a phenylpropyl group, a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, or the like. Alkenyl, cyclohexenyl, octenyl and the like have 2 to 10 alkenyl groups, and some or all of the hydrogen atoms of these groups are replaced by a halogen atom such as fluorine, bromine or chlorine, a cyano group or the like, such as: Examples of chloropropyl, bromoethyl, trifluoropropyl, cyanoethyl and the like. Among these, methyl, vinyl, phenyl, and trifluoropropyl are preferred, and R is at least 50 mol% or more, and particularly preferably 80 mol% or more. In this case, at least two of R must be an alkenyl group (the carbon number is preferably 2 to 8, more preferably 2 to 6). The content of the alkenyl group is 0.0001 to 20 mol% in R, particularly preferably 0.001 to 10 mol%. The alkenyl group may be bonded to a ruthenium atom at the end of the molecular chain, or may be bonded to a ruthenium atom in the middle of the molecular chain, or may be bonded to both.
a為1.8~2.3,較佳者為1.9~2.1之正數,此有機聚矽氧烷基本上為直鏈狀,惟,在不損及橡膠彈性之範圍下亦可為部份支鏈狀者。分子量未特別限定,一般由黏度低之液狀至黏度高之生橡膠狀均可使用,但是為了硬化成為橡膠狀彈性體,其聚合度以100~100,000者宜,特別以150~20,000為更佳。a is 1.8 to 2.3, preferably a positive number of 1.9 to 2.1. The organopolyoxane is substantially linear, but may be partially branched without detracting from the rubber elasticity. The molecular weight is not particularly limited. It is generally used in the form of a rubber having a low viscosity and a high viscosity. However, in order to harden the rubbery elastomer, the degree of polymerization is preferably from 100 to 100,000, particularly preferably from 150 to 20,000.
另外,(A)成份之有機聚矽氧烷可為1種,或併用2種以上不同之分子構造或聚合度。Further, the organopolyoxane of the component (A) may be one type or a combination of two or more different molecular structures or degrees of polymerization.
此有機聚矽氧烷可藉由公知之方法,如:有機鹵化矽烷之1種或2種以上經由(共)水解縮合,或使環狀聚矽氧烷利用鹼性或酸性觸媒經由開環聚合取得。The organopolyoxane can be condensed by (co)hydrolysis by one or more of organic halogenated decane, or by cyclic or polyoxane using an alkaline or acidic catalyst via ring opening. Aggregated.
熱硬化型聚矽氧橡膠組成物為附與機械性強度等,因此於(A)成份之有機聚矽氧烷中配合(B)補強性二氧化矽者宜。The thermosetting polyoxyxene rubber composition is mechanically strong or the like, and therefore it is preferable to blend (B) a reinforcing cerium oxide with the organopolysiloxane of the component (A).
做為(B)補強性二氧化矽如,煙霧質二氧化矽、沈澱(濕式)二氧化矽。此等二氧化矽以BET法之比表面積為50m2 /g以上者宜,特別以100~400m2 /g為更佳。As (B) reinforcing cerium oxide, such as aerosolous cerium oxide, precipitated (wet) cerium oxide. These cerium oxides preferably have a specific surface area of 50 m 2 /g or more in the BET method, and more preferably 100 to 400 m 2 /g.
此二氧化矽於必要時亦可使其表面使用以有機聚矽氧橡膠、矽氨烷、氯矽烷、烷氧基矽烷等表面處理劑所處理之二氧化矽。又,於(A)成份之有機聚矽氧烷配合此等微粉末二氧化矽時,亦可配合上述表面處理劑。The cerium oxide may also have a surface treated with a surface treatment agent such as an organic polyoxyethylene rubber, a decane, a chlorosilane or an alkoxy decane, if necessary. Further, when the organic polysiloxane of the component (A) is blended with the fine powder of cerium oxide, the surface treating agent may be blended.
(B)成份之配合可為任意者,而一般對於(A)成份之有機聚矽氧烷100質量份,以0~100質量份者宜,較佳者為1~80質量份,特別以5~50質量份。為配合量太少時,則將無法取得充足之橡膠強度。更且,以生橡膠做為原料之銑刀加工橡膠時,有時加工性降低。又,調配量太多時有時不易調配,亦有降低橡膠物性之情況。(B) The combination of the components may be any, and generally 100 parts by mass of the organopolyoxane of the component (A) is preferably 0 to 100 parts by mass, preferably 1 to 80 parts by mass, particularly 5 ~50 parts by mass. If the amount is too small, sufficient rubber strength will not be obtained. Further, when a rubber is processed using a raw rubber as a raw material, the workability may be lowered. Moreover, when the amount of the mixture is too large, it may be difficult to mix, and the rubber property may be lowered.
熱硬化型聚矽氧橡膠組成物在不損及本申請目的範圍下,除上述成份外,必要時亦可任意添加粉碎石英、結晶性二氧化矽、矽藻土、碳酸鈣等填充劑、著色劑、提昇張裂強度劑、提昇氧化鐵、氧化鈰等之耐熱性劑、氧化鈦、鉑化合物等難燃性提昇劑、耐酸劑、提昇氧化鋁、氮化硼等之導熱率劑、脫模劑、填充劑用分散劑之各種烷氧基矽烷、特別是含苯基之烷氧基矽烷及其水解物、二苯基矽烷二醇、碳功能矽烷、含矽基之低分子矽氧烷等熱硬化型聚矽氧橡膠組成物中之公知填充劑、添加劑。The thermosetting polyoxyxene rubber composition may be optionally added with a filler such as pulverized quartz, crystalline cerium oxide, diatomaceous earth, calcium carbonate, or the like, in addition to the above components, without damaging the scope of the present application. Agent, lifting tensile strength agent, heat-resistant agent such as iron oxide or cerium oxide, flame retardant agent such as titanium oxide and platinum compound, acid resistance agent, thermal conductivity agent for lifting alumina, boron nitride, etc. Various alkoxydecanes for dispersants, especially phenyl-containing alkoxydecanes and hydrolyzates thereof, diphenyldecanediol, carbon functional decane, fluorenyl-containing low molecular oxiranes, etc. A known filler or additive in the thermosetting polyoxyxene rubber composition.
(C)硬化劑例如:上述之(C-1)加成反應型硬化劑與(C-2)有機過氧化物硬化劑。(C) Hardener: For example, the above (C-1) addition reaction type hardener and (C-2) organic peroxide hardener.
做為(C-1)加成反應型硬化劑者可組合使用有機氫化聚矽氧烷與矽氫化(hydrosilation)觸媒。As the (C-1) addition reaction type hardener, an organic hydrogenated polyoxyalkylene and a hydrosilation catalyst can be used in combination.
氫甲矽烷基化觸媒係使(A)成份之烯基與有機氫化聚矽氧烷之矽原子鍵結氫原子(SiH基)進行加成反應之觸媒。The hydroformylation catalyst is a catalyst for subjecting an alkenyl group of the component (A) to a hydrogen atom (SiH group) bonded to a ruthenium atom of an organohydrogenated polyoxyalkylene oxide.
做為氫甲矽烷基化觸媒例如:鉑金屬系觸媒例,鉑族金屬單體及其化合物,於此,可使用先行技術公知之做為加成反應硬化型聚矽氧橡膠組成物之觸媒者。如:吸附於二氧化矽、氧化鋁、或二氧化矽凝膠類之載體之微粒子狀鉑金屬、氯化鉑、氯化鉑酸、氯化鉑酸6鉬之醇溶液、鈀觸媒、銠觸媒等例,其中又以鉑或鉑化合物為較佳。觸媒之添加量只要可促進加成反應即可,通常以鉑金屬量換算後,對於(A)成份之有機聚矽氧烷使用1ppm~1重量%者,又以10~500pppm為較佳。當添加量未達1ppm則將未能有效促進加成反應,出現硬化不足,反之,超出1重量%則再大量對於反應性仍無任何影響,反而不經濟。As the hydroformylation catalyst, for example, a platinum metal catalyst, a platinum group metal monomer, and a compound thereof can be used as an addition reaction hardening type polyoxyethylene rubber composition, which is known in the prior art. Catalyst. For example, a particulate platinum metal adsorbed on a carrier of cerium oxide, aluminum oxide or cerium oxide gel, platinum chloride, chloroplatinic acid, chloroplatinic acid 6 molybdenum alcohol solution, palladium catalyst, ruthenium In the case of a catalyst or the like, platinum or a platinum compound is preferred. The addition amount of the catalyst may be such that the addition reaction can be promoted, and it is usually 10 to 500 pppm in terms of the amount of the platinum metal, and the amount of the organopolysiloxane of the component (A) is from 1 to 1% by weight. When the addition amount is less than 1 ppm, the addition reaction will not be effectively promoted, and insufficient hardening will occur. On the contrary, if it exceeds 1% by weight, a large amount will still have no influence on the reactivity, and it is not economical.
做為有機氫化聚矽氧烷者,只要1分子中含有2個以上,較佳者為3個以上之SiH基即可,可為直鏈狀、支鏈狀或環狀,做為加成反應熱硬化型聚矽氧橡膠組成物之交聯劑者可使用公知之有機氫化聚矽氧烷,如:可使用下述平均組成式(II)所示之有機氫化聚矽氧烷。As the organic hydrogenated polyoxyalkylene, as long as one molecule contains two or more, preferably three or more SiH groups, it may be linear, branched or cyclic, and is used as an addition reaction. As the crosslinking agent of the thermosetting polyoxyethylene rubber composition, a known organic hydrogenated polyoxyalkylene can be used. For example, an organic hydrogenated polyoxyalkylene represented by the following average composition formula (II) can be used.
R1 p Hq SiO( 4 - p . q ) / 2 (II)R 1 p H q SiO ( 4 - p . q ) / 2 (II)
上述平均組成式(II)中,R1代表非取代或取代之一價烴基,相同或相異者均可,不含脂肪族不飽和鍵者宜。一般以碳數1~12者宜,特別以1~8為較佳,具體例如:甲基、乙基、丙基等之烷基、環己基等之環烷基、乙烯基、烯丙基、丁烯基、己烯基等烯基、苯基、甲苯基等芳基、苄基、2-苯基乙基、2-苯基丙基等的芳烷基,及此等基之部份或全部氫原子被鹵原子等取代之基,如:3,3,3-三氟丙基等例。又,p,q為滿足0≦p<3、較佳者為1≦p≦2.2,0<q≦3、較佳者為0.002≦q≦1,0<p+q ≦3、較佳者為1.002≦p+q≦3之正數。In the above average composition formula (II), R1 represents an unsubstituted or substituted one-valent hydrocarbon group, which may be the same or different, and preferably does not contain an aliphatic unsaturated bond. Generally, the carbon number is preferably from 1 to 12, particularly preferably from 1 to 8. Specifically, for example, an alkyl group such as a methyl group, an ethyl group or a propyl group, a cycloalkyl group such as a cyclohexyl group, a vinyl group, an allyl group, or the like. An alkenyl group such as a butenyl group or a hexenyl group; an aryl group such as a phenyl group or a tolyl group; an aralkyl group such as a benzyl group, a 2-phenylethyl group or a 2-phenylpropyl group; and a part of such a group or A group in which all hydrogen atoms are replaced by a halogen atom or the like, such as a 3,3,3-trifluoropropyl group. Further, p, q satisfy 0 ≦ p < 3, preferably 1 ≦ p ≦ 2.2, 0 < q ≦ 3, preferably 0.002 ≦ q ≦ 1, 0 < p + q ≦ 3, preferably 1.002正p+q≦3 is a positive number.
有機氫化聚矽氧烷係1分子中具有2個以上,較佳者為3個以上之SiH基,而此可於分子鏈末端,亦可於分子鏈途中,或於其兩者均可。另外,做為此有機氫化聚矽氧烷者,其25℃之黏度以0.5~10,000cSt者宜,特別以1~300cSt為較佳。The organic hydrogenated polyoxyalkylene system has two or more molecules, preferably three or more SiH groups, and this may be at the end of the molecular chain, in the middle of the molecular chain, or both. Further, as the organic hydrogenated polyoxyalkylene, the viscosity at 25 ° C is preferably 0.5 to 10,000 cSt, particularly preferably 1 to 300 cSt.
做為此有機氫化聚矽氧烷者其具體例可示例如下述構造式之化合物。As a specific example of the organic hydrogenated polyoxyalkylene, the compound of the following structural formula can be exemplified.
(式中,k為2~10之整數,s及t為0~10之整數)(where k is an integer from 2 to 10, and s and t are integers from 0 to 10)
上述有機氧化矽氧烷之配合量係對於(A)成份100重量份以0.1~40重量份較佳。又,對於(A)成份之脂肪族不飽和鍵(烯基及二烯基等)1個,鍵結於矽原子之氫原子(≡SiH基)之比例以0.5~10之範圍為宜,較佳為0.7~5之範圍。當未達0.5時,則交聯不足,無法取得充足的機械性強度,反之,超出10則將降低硬化後之物理特性,特別是導致耐熱性與永久壓縮變形之惡化。The amount of the above organic oxoxane is preferably 0.1 to 40 parts by weight based on 100 parts by weight of the component (A). Further, in the case of one of the aliphatic unsaturated bonds (alkenyl group and dienyl group) of the component (A), the ratio of the hydrogen atom (≡SiH group) bonded to the ruthenium atom is preferably in the range of 0.5 to 10, more preferably Good range of 0.7~5. When it is less than 0.5, the crosslinking is insufficient, and sufficient mechanical strength cannot be obtained. On the contrary, if it exceeds 10, the physical properties after hardening are lowered, particularly, the deterioration of heat resistance and permanent compression deformation is caused.
又,除上述觸媒外,為調整硬化速度之目的,亦可使用加成交聯抑制劑。具體例如:乙炔環己醇等之乙炔醇系抑制劑、四環甲基乙烯聚矽氧烷等例。Further, in addition to the above-mentioned catalyst, an addition-crosslinking inhibitor may be used for the purpose of adjusting the curing rate. Specific examples thereof include an acetylene alcohol-based inhibitor such as acetylene cyclohexanol and a tetracyclomethylethylene polyoxane.
做為(C-2)有機過氧化物例者如:苯甲醯過氧化物、2,4-二氯苯甲醯過氧化物、p-甲基苯甲醯過氧化物、o-甲基苯甲醯過氧化物、2,4-二枯基過氧化物、2,5-二甲基-雙(2,5-第三-丁基過氧化物)己烷、二-第三-丁基過氧化物、第三-丁基過苯甲酸酯、1,6-己二醇-雙-第三-丁基過化碳酸酯、等例。As (C-2) organic peroxides such as: benzamidine peroxide, 2,4-dichlorobenzamide peroxide, p-methylbenzamide peroxide, o-methyl Benzamidine peroxide, 2,4-dicumyl peroxide, 2,5-dimethyl-bis(2,5-tri-butyl peroxide) hexane, di-third-butyl Base peroxide, tri-butyl perbenzoate, 1,6-hexanediol-bis-tert-butyl percarbonate, and the like.
有機過氧化物之添加量係對於(A)成份100重量份,以0.1~10重量份較佳,特別以0.2~5重量份為更佳。The amount of the organic peroxide added is preferably from 0.1 to 10 parts by weight, particularly preferably from 0.2 to 5 parts by weight, per 100 parts by weight of the component (A).
熱硬化型聚矽氧橡膠組成物可將上述成份以捏合器、班伯理式高速混合器、雙輥等公知之混煉機經由混合後取得,而,一般係混合(A)成份之有機聚矽氧烷與(B)成份之補強性二氧化矽後,再添加(C)成份之硬化劑較佳。The thermosetting polyoxyxene rubber composition can be obtained by mixing the above components with a known kneader such as a kneader, a Banbury-type high-speed mixer, or a twin roll, and generally, mixing the organic polymerization of the component (A). It is preferred to add a hardener of the component (C) after the cerium oxide and the reinforcing cerium oxide of the component (B).
熱硬化型聚矽氧橡膠組成物亦可使用市售品。Commercially available products can also be used as the thermosetting polyoxyxene rubber composition.
含於本申請絕緣性聚矽氧橡膠組成物之離子導電性抗靜電劑只要不是碳黑類之電子導電性物質,而是離子導電性物質時,則無特別限定,一般以鋰鹽較佳。The ion conductive antistatic agent contained in the insulating polyoxyethylene rubber composition of the present application is not particularly limited as long as it is not an electron conductive material of carbon black type but an ion conductive material, and a lithium salt is generally preferred.
具體例如:LiBF4 、LiClO4 、LiPF6 、LiAsF6 、LiSbF6 、LiSO3 CF3 、LiN(SO2 CF3 )2 、LiSO3 C4 F9 、LiC(SO2 CF3 )3 、LiB(C6 H5 )4 等示例。此等可單獨使用,亦可合併2種以上使用之。Specifically, for example, LiBF 4 , LiClO 4 , LiPF 6 , LiAsF 6 , LiSbF 6 , LiSO 3 CF 3 , LiN(SO 2 CF 3 ) 2 , LiSO 3 C 4 F 9 , LiC(SO 2 CF 3 ) 3 , LiB ( Examples such as C 6 H 5 ) 4 . These may be used alone or in combination of two or more.
離子導電性抗靜電劑為了提昇熱硬化型聚矽氧橡膠組成物中之分散性,發揮穩定效果,使有機聚矽氧烷進行糊化為佳。此時有機聚矽氧烷係與(A)成份相同或相異,可為生橡膠狀或油狀。較佳為二甲基聚矽氧烷、甲基乙烯基聚矽氧烷。又,此糊化時,為了提昇作業性,可添加補強性二氧化矽、矽藻土等填充劑。糊化時離子導電性抗靜電劑之濃度以2~90質量%者宜,較佳者為5~80質量%,特別以10~50質量%為更佳。The ion-conductive antistatic agent exhibits a stabilizing effect in order to improve the dispersibility in the thermosetting polyoxyxene rubber composition, and it is preferable to gelatinize the organopolysiloxane. At this time, the organopolyoxyalkylene is the same as or different from the component (A), and may be in the form of a raw rubber or oil. Preferred is dimethyl polyoxyalkylene or methyl vinyl polyoxyalkylene. Further, in the case of gelatinization, a filler such as reinforcing cerium oxide or diatomaceous earth may be added in order to improve workability. The concentration of the ion conductive antistatic agent in the gelatinization is preferably from 2 to 90% by mass, preferably from 5 to 80% by mass, particularly preferably from 10 to 50% by mass.
離子導電性抗靜電劑之添加量係對於熱硬化型聚矽氧橡膠組成物100質量份,以添加0.0001~5質量份為宜,0.0005~3質量份更佳,更佳者為0.001~1質量份,特別以0.001~0.5質量份為最佳。當少於0.0001質量份時,則抗靜電效果將不足,反之,大於5質量份則無法維持絕緣性,對於聚矽氧橡膠之物性,耐熱性等均有不良影響。The amount of the ion-conductive antistatic agent to be added is preferably 0.0001 to 5 parts by mass, more preferably 0.0005 to 3 parts by mass, more preferably 0.001 to 1 part by mass for 100 parts by mass of the thermosetting polyoxyxene rubber composition. The portion is particularly preferably 0.001 to 0.5 parts by mass. When the amount is less than 0.0001 part by mass, the antistatic effect will be insufficient. On the other hand, if it is more than 5 parts by mass, the insulating property cannot be maintained, and the physical properties of the polyoxyxene rubber, heat resistance and the like are adversely affected.
離子性抗靜電劑可添加於熱硬化型聚矽氧橡膠組成物,亦可添加於導熱性聚矽氧橡膠組成物製造時。The ionic antistatic agent may be added to the thermosetting polyoxymethylene rubber composition or may be added to the heat conductive polyoxymethylene rubber composition.
本發明絕緣性聚矽氧橡膠組成物係藉由熱硬化後成絕緣性良好之聚矽氧橡膠者。做為成形方法者只要選擇注入成形、壓縮成形、射出成形、壓延成形、擠壓成形、塗層、網版印刷等方法例。做為硬化條件者亦以其成形方法之公知條件即可,通常,於60℃~450℃之溫度下,數秒~1天左右。又,為降低硬化物之壓縮永久變形,降低殘存於聚矽氧橡膠中之低分子聚矽氧烷成份,或去除有機過氧化物之分解物等目的下,以200℃以上、較佳者為200℃~250℃之烤箱等進行1小時以上、較佳者為1小時~70小時、更佳者為1小時~10小時之後硬化(2次硬化)亦可。The insulating polyoxyxene rubber composition of the present invention is a polyoxyxene rubber which is excellent in insulation by heat curing. As the molding method, a method of injection molding, compression molding, injection molding, calender molding, extrusion molding, coating, screen printing, or the like is selected. As a curing condition, a known condition of the molding method may be used, and usually, it is at a temperature of 60 ° C to 450 ° C for several seconds to one day. Further, in order to reduce the compression set of the cured product, to lower the low molecular weight polyoxane component remaining in the polyoxyxene rubber, or to remove the decomposition product of the organic peroxide, the temperature is 200 ° C or higher, preferably The oven of 200 ° C to 250 ° C may be used for 1 hour or longer, preferably 1 hour to 70 hours, and more preferably 1 hour to 10 hours, and then hardened (2 times hardened).
硬化物之體積電阻率為1G Ω.m以上宜,特別以2G Ω.m以上為佳,電線包覆,小型鍵盤用途等時,均可做成可充份利用之絕緣水準。The volume resistivity of the hardened material is 1G Ω. More than m, especially 2G Ω. When the m or more is good, the wire is covered, and the small keyboard is used, the insulation level can be fully utilized.
又,做為抗靜電性能者使用靜電功能測定計(CCDO靜電氣(股份)製)於聚矽氧橡膠成形物表面經由電暈放電使靜電氣做成6kV進料,其靜電壓為一半時間(半衰期)以2分鐘以內,特別以1分鐘以內為較佳。Further, as an antistatic property, an electrostatic function meter (CCDO Electrostatic Gas (manufactured by CCTV)) was used to make a static electricity gas into a 6 kV feed via a corona discharge on a surface of a polyoxyethylene rubber molded article, and the static voltage was half time ( The half-life is preferably within 2 minutes, particularly within 1 minute.
以下,依實施例與比較例所示,進行本發明具體說明,惟,本發明並未受限於以下之實施例。Hereinafter, the present invention will be specifically described by way of examples and comparative examples, but the present invention is not limited to the following examples.
依下述方法測定靜電量及體積電阻。The amount of static electricity and the volume resistance were measured by the following methods.
使用靜電功能測定計(CCDO靜電氣(股份)製,於成形物表面經由電暈放電使靜電進料後,測定其靜電壓為一半之時間。An electrostatic function meter (CCDO static electricity (manufactured by CO., Ltd.) was used, and after the electrostatic charge was applied to the surface of the molded article via corona discharge, the static voltage was measured for half of the time.
以JIS-K6249為基準測定之。It is measured based on JIS-K6249.
如下述調整抗靜電劑糊化。The antistatic agent is gelatinized as described below.
將末端以二甲基乙烯矽氧烷基所封端之二甲基聚矽氧烷生橡膠42質量份、比表面積為110m2 /g之疏水化處理之矽鎂石(R-972、日本Aerozil(股份)製)、LiN(SO2 CF3 )2 之含20質量之己二酸酯50質量份進行混練,調製抗靜電劑糊料1。42 parts by mass of a dimethylpolyoxane raw rubber terminated with a dimethyl oxiranyl group and a hydrophobized tourmaline having a specific surface area of 110 m 2 /g (R-972, Japan Aerozil) 50 parts by mass of 20% by mass of adipate of LiN(SO 2 CF 3 ) 2 was kneaded to prepare an antistatic agent paste 1.
抗靜電劑者係混練末端以二甲基乙烯矽氧烷基所封端之二甲基聚矽氧烷生橡膠42質量份,比表面積為110m2 /g之疏水化處理之矽鎂石(R-972,日本Aerozil(股份)製8質量份,25℃之黏度為75cs之聚醚改性聚矽氧油(KF351F信越化學工業(股份)製)50質量份,調製抗靜電劑糊料2。The antistatic agent is a hydrophobized tourmaline (R) having a specific surface area of 110 m 2 /g, which is 42 parts by mass of a dimethylpolyoxane raw rubber which is terminated with a dimethyl oxiranyl group. - 972, an antistatic agent paste 2 was prepared by dissolving 50 parts by weight of a polyether modified polysiloxane (KF351F Shin-Etsu Chemical Co., Ltd.) having a viscosity of 75 cs at a temperature of 25 ° C in an amount of 8 parts by mass.
添加二甲基矽氧烷單位99.825莫耳%、甲基乙烯矽氧烷單位0.15莫耳%、二甲基乙烯矽氧烷單位0.025莫耳%所成,平均聚合度約為6000之有機聚矽氧烷100質量份、BET法比表面積為200m2 /g之矽鎂石(Aerozil 200日本Aerozil(股份)製)45質量份,作為分散劑之具兩末端矽烷醇基、平均聚合度15、25℃之黏度為30cs之二甲基聚矽氧烷10質量份,以捏合器進行混練,170℃下進行加熱處理2小時後,調製組成物。Adding dimethyl methoxyoxane unit 99.825 mol%, methyl vinyl siloxane unit 0.15 mol%, dimethyl vinyl fluorene unit 0.025 mol%, organic polymerization with an average degree of polymerization of about 6000 100 parts by mass of oxyalkylene and 45 parts by mass of a BET specific surface area of 200 m 2 /g (Aerozil 200 Japan Aerozil Co., Ltd.), as a dispersing agent, having both terminal stanol groups and an average degree of polymerization of 15, 25 10 parts by mass of 30 Cs of dimethyl polyoxane at a viscosity of ° C, and kneading was carried out in a kneader, and heat treatment was performed at 170 ° C for 2 hours to prepare a composition.
對於此組成物100質量份,添加0.05質量份之抗靜電劑糊料1,交聯劑之2,5-二甲基-2,5-雙(第三丁基過氧)己烷0.4質量份,然後以雙輥均勻混合後,於165℃,70kgf/cm2 之條件下進行加壓硬化10分鐘後,製作2mm厚之薄片。再於200℃之烤箱中進行後硬化4小時。To 100 parts by mass of the composition, 0.05 parts by mass of the antistatic agent paste 1 and 0.4 parts by mass of 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane as a crosslinking agent were added. Then, the mixture was uniformly mixed by a double roll, and then press-hardened for 10 minutes at 165 ° C under a condition of 70 kgf / cm 2 to prepare a sheet having a thickness of 2 mm. The post-hardening was carried out in an oven at 200 ° C for 4 hours.
將此聚矽氧橡膠回復至室溫,測定靜電量(半衰期)、體積電阻。同樣的,針對置入200℃烤箱50小時、100小時、400小時者測定其靜電量、體積電阻。The polyoxyxene rubber was returned to room temperature, and the amount of static electricity (half-life) and volume resistance were measured. Similarly, the amount of static electricity and volume resistance were measured for 50 hours, 100 hours, and 400 hours in a 200 ° C oven.
結果示於表1。The results are shown in Table 1.
抗靜電劑糊料1之添加量做成0.01質量份之外,與實施例1同法測定靜電量、體積電阻。The amount of static electricity and volume resistance were measured in the same manner as in Example 1 except that the amount of the antistatic agent paste 1 added was 0.01 parts by mass.
結果示於表1。The results are shown in Table 1.
分子鏈主鏈之二有機矽氧烷單位中含有甲基乙烯矽氧烷單位10莫耳%與二甲基矽氧烷單位90莫耳%,黏度為500mPa.s之分子鏈兩末端以三甲基矽氧烷基封端之二甲基矽氧烷.甲基乙烯矽氧烷共聚物100質量份、比表面積為110m2 /g之疏水化處理之矽鎂石(R-972日本Aerozil(股份)製)5質量份,結晶性二氧化矽(crysterlite Vx-S龍森(股份)製)38質量份,黏度為9mPa.s之分子鏈兩末端及分子鏈非末端具有SiH基之二甲基矽氧烷,甲基氫化矽氧烷共聚物(鍵結於矽原子之氫原子:0.51質量%)1.5份,1-乙炔環己醇0.03份,氯化鉑酸與二乙烯四甲基二矽氧烷之錯合物以鉑金屬之質量換算,對於分子鏈兩末端以三甲基矽氧烷基封端之二甲基矽氧烷.甲基乙烯矽氧烷共聚物添加15ppm,調製組成物。The diorganotoxioxane unit of the main chain of the molecular chain contains methyl methoxide unit 10 mol% and dimethyl methoxy oxane unit 90 mol%, and the viscosity is 500 mPa. The dimethyl group of s is terminated with a trimethyl methoxyalkyl group at both ends of the molecular chain. Hydrophobized tourmaline (R-972 Japan Aerozil Co., Ltd.) 5 parts by mass, crystalline ceria (crysterlite Vx), 100 parts by mass of a methylvinyl siloxane copolymer and a specific surface area of 110 m 2 /g -S Longsen (share) system) 38 parts by mass, viscosity 9mPa. a dimethyl methoxyoxane having a SiH group at both ends of the molecular chain of s and a non-terminal end of the molecular chain, a methyl hydride hydride copolymer (a hydrogen atom bonded to a ruthenium atom: 0.51% by mass), 1.5 parts, 1-acetylene 0.03 parts of cyclohexanol, a complex of chloroplatinic acid and diethylenetetramethyldioxane in terms of mass of platinum metal, dimethyl group terminated with trimethylphosphonyl group at both ends of the molecular chain Hexane. The composition was prepared by adding 15 ppm of methylvinyl siloxane copolymer.
對於此組成物100重量份,添加0.1重量份之抗靜電劑糊料1,於120℃、100kgf/cm2 之條件下,進行加壓硬化10分鐘。再於200℃之烤箱中進行後硬化4小時。To 100 parts by weight of the composition, 0.1 part by weight of the antistatic agent paste 1 was added, and press hardening was carried out for 10 minutes at 120 ° C and 100 kgf / cm 2 . The post-hardening was carried out in an oven at 200 ° C for 4 hours.
將此聚矽氧橡膠回復至室溫,測定靜電量(半衰期)、體積電阻。同樣於200℃烤箱中針對置入50小時、100小時、400小時者測定其靜電量、體積電阻。The polyoxyxene rubber was returned to room temperature, and the amount of static electricity (half-life) and volume resistance were measured. The amount of static electricity and volume resistance were measured in the oven at 200 ° C for 50 hours, 100 hours, and 400 hours.
結果示於表1。The results are shown in Table 1.
除抗靜電劑糊料1做成0.05重量份之外,與實施例3同法測定靜電量、體積電阻。結果如表1所示。The amount of static electricity and the volume resistance were measured in the same manner as in Example 3 except that the antistatic agent paste 1 was made into 0.05 part by weight. The results are shown in Table 1.
除未添加抗靜電劑之外,與實施例1同法測定靜電量、體積電阻。The amount of static electricity and the volume resistance were measured in the same manner as in Example 1 except that the antistatic agent was not added.
結果示於表1The results are shown in Table 1.
使用抗靜電劑糊料2取代抗靜電劑糊料1外,與實施例1同法測定靜電量、體積電阻。The amount of static electricity and volume resistance were measured in the same manner as in Example 1 except that the antistatic agent paste 2 was used instead of the antistatic agent paste 1.
結果示於表1。The results are shown in Table 1.
除未添加抗靜電劑之外,與實施例3同法測定靜電量、體積電阻。The amount of static electricity and volume resistance were measured in the same manner as in Example 3 except that the antistatic agent was not added.
結果示於表1。The results are shown in Table 1.
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JP4873167B2 (en) * | 2006-09-22 | 2012-02-08 | 信越化学工業株式会社 | Condensation reaction curable silicone rubber composition for forming large stretch rolls for industrial use |
JP2008266412A (en) * | 2007-04-18 | 2008-11-06 | Shin Etsu Chem Co Ltd | Antistatic silicone rubber molding material |
JP5309714B2 (en) * | 2007-07-04 | 2013-10-09 | 信越化学工業株式会社 | Silicone pressure-sensitive adhesive composition having antistatic properties and silicone pressure-sensitive adhesive tape |
US7781555B2 (en) | 2007-09-03 | 2010-08-24 | Shin-Etsu Chemical Co., Ltd. | Microcontact printing stamp |
JP4706868B2 (en) * | 2007-09-03 | 2011-06-22 | 信越化学工業株式会社 | Antistatic micro-contact printing plate |
TWI588210B (en) | 2007-12-27 | 2017-06-21 | 邁圖高新材料日本合同公司 | Thermosetting silicone rubber composition |
TWI457398B (en) | 2007-12-27 | 2014-10-21 | Momentive Performance Mat Jp | Thermosetting Silicone Oxygenated Compounds |
US8222341B2 (en) * | 2009-03-17 | 2012-07-17 | Mearthane Products Corporation | Semi-conductive silicone polymers |
CN101805521A (en) * | 2010-03-19 | 2010-08-18 | 东莞市宏达新材料有限公司 | Antistatic silica gel composition and preparation method thereof |
JP5916457B2 (en) | 2012-03-23 | 2016-05-11 | 住友理工株式会社 | Insulating silicone rubber composition |
JP5835100B2 (en) * | 2012-05-22 | 2015-12-24 | 信越化学工業株式会社 | Antistatic silicone rubber composition and method for inhibiting yellowing of cured antistatic silicone rubber |
JP5758845B2 (en) * | 2012-05-23 | 2015-08-05 | 信越化学工業株式会社 | Silicone rubber composition |
JP5776650B2 (en) * | 2012-08-29 | 2015-09-09 | 信越化学工業株式会社 | Insulating silicone rubber composition |
JP5462425B1 (en) * | 2012-11-05 | 2014-04-02 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermosetting silicone rubber composition |
KR102151512B1 (en) * | 2012-11-05 | 2020-09-03 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | Thermosetting silicone rubber composition |
KR20170118090A (en) * | 2015-02-16 | 2017-10-24 | 다우 코닝 도레이 캄파니 리미티드 | Sponge-forming silicone rubber composition and silicone rubber sponge |
JP2017002218A (en) * | 2015-06-12 | 2017-01-05 | 信越化学工業株式会社 | High dielectric insulation silicone rubber composition |
JP6497291B2 (en) * | 2015-10-14 | 2019-04-10 | 信越化学工業株式会社 | Insulating heat dissipation sheet |
CN105219093A (en) * | 2015-11-04 | 2016-01-06 | 东莞星海丰电子有限公司 | A kind of silica gel product and preparation technology thereof |
CN106893158A (en) * | 2017-04-20 | 2017-06-27 | 马鞍山市润启新材料科技有限公司 | A kind of environmental protection type antistatic insulating materials |
TWI841640B (en) | 2019-01-17 | 2024-05-11 | 美商陶氏有機矽公司 | Antistatic silicone rubber composition |
TW202035647A (en) * | 2019-01-17 | 2020-10-01 | 美商陶氏有機矽公司 | Antistatic silicone rubber composition |
WO2024053440A1 (en) * | 2022-09-05 | 2024-03-14 | 信越化学工業株式会社 | Thermally conductive millable silicone rubber composition and thermally conductive sheet |
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JPH04103666A (en) * | 1990-08-23 | 1992-04-06 | Hokushin Ind Inc | Molded article of silicone rubber |
JP3330771B2 (en) * | 1995-01-19 | 2002-09-30 | 三菱エンジニアリングプラスチックス株式会社 | Permanent antistatic polycarbonate resin composition |
JP3115519B2 (en) * | 1995-05-15 | 2000-12-11 | 三洋化成工業株式会社 | Antistatic agent for silicone resin |
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CN1280351C (en) * | 2000-12-07 | 2006-10-18 | 钟渊化学工业株式会社 | Semiconductive resion composition and semiconductive member |
JP4769924B2 (en) * | 2001-02-06 | 2011-09-07 | 三光化学工業株式会社 | High antistatic rubber composition |
JP3766619B2 (en) * | 2001-08-30 | 2006-04-12 | 三光化学工業株式会社 | Antistatic composition, method for producing the same, and molded article using the same |
JP2003082232A (en) * | 2001-09-07 | 2003-03-19 | Shin Etsu Chem Co Ltd | Silicone rubber composition for semiconductive roller and semiconductive roller |
JP3914511B2 (en) * | 2003-05-07 | 2007-05-16 | 信越化学工業株式会社 | Rubber composition for roll and ion conductive rubber roll using the same |
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