TWI381523B - 具有多邊形晶片載置器的顯示裝置 - Google Patents

具有多邊形晶片載置器的顯示裝置 Download PDF

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Publication number
TWI381523B
TWI381523B TW099111698A TW99111698A TWI381523B TW I381523 B TWI381523 B TW I381523B TW 099111698 A TW099111698 A TW 099111698A TW 99111698 A TW99111698 A TW 99111698A TW I381523 B TWI381523 B TW I381523B
Authority
TW
Taiwan
Prior art keywords
display device
wafer carrier
substrate
wafer
axes
Prior art date
Application number
TW099111698A
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English (en)
Chinese (zh)
Other versions
TW201119026A (en
Inventor
羅納德S 寇克
Original Assignee
全球Oled科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 全球Oled科技公司 filed Critical 全球Oled科技公司
Publication of TW201119026A publication Critical patent/TW201119026A/zh
Application granted granted Critical
Publication of TWI381523B publication Critical patent/TWI381523B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/129Chiplets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
TW099111698A 2009-04-15 2010-04-14 具有多邊形晶片載置器的顯示裝置 TWI381523B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/424,060 US7973472B2 (en) 2009-04-15 2009-04-15 Display device with polygonal chiplets

Publications (2)

Publication Number Publication Date
TW201119026A TW201119026A (en) 2011-06-01
TWI381523B true TWI381523B (zh) 2013-01-01

Family

ID=42396962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099111698A TWI381523B (zh) 2009-04-15 2010-04-14 具有多邊形晶片載置器的顯示裝置

Country Status (7)

Country Link
US (1) US7973472B2 (https=)
EP (1) EP2419934B1 (https=)
JP (1) JP5275510B2 (https=)
KR (1) KR20120020109A (https=)
CN (1) CN102396067A (https=)
TW (1) TWI381523B (https=)
WO (1) WO2010120742A1 (https=)

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US8125472B2 (en) * 2009-06-09 2012-02-28 Global Oled Technology Llc Display device with parallel data distribution
US8072437B2 (en) 2009-08-26 2011-12-06 Global Oled Technology Llc Flexible multitouch electroluminescent display
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
GB2500579B (en) * 2012-03-23 2015-10-14 Cambridge Display Tech Ltd Semiconductor Application Method and Product
US10141378B2 (en) * 2013-10-30 2018-11-27 Industrial Technology Research Institute Light emitting device free of TFT and chiplet
TWI586012B (zh) * 2014-01-02 2017-06-01 財團法人工業技術研究院 發光元件
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
US10468397B2 (en) * 2017-05-05 2019-11-05 X-Celeprint Limited Matrix addressed tiles and arrays
US11348968B2 (en) * 2018-01-02 2022-05-31 Hongyu Liu Display device structure
CN110827676A (zh) * 2018-08-14 2020-02-21 上海和辉光电有限公司 一种柔性有机发光显示基板、显示面板及显示装置
CN111710312B (zh) * 2020-07-06 2021-08-27 北京显芯科技有限公司 驱动电路、lcd显示屏以及电子设备
CN115662981A (zh) * 2020-11-30 2023-01-31 湖北长江新型显示产业创新中心有限公司 一种显示面板及显示装置
US11599484B2 (en) * 2020-12-01 2023-03-07 Micron Technology, Inc. Semiconductor device having plural signal buses for multiple purposes
KR20230038359A (ko) * 2021-09-10 2023-03-20 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
CN119002102A (zh) * 2023-05-17 2024-11-22 华为技术有限公司 一种芯片、光电模块及光通信设备

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US7352062B2 (en) * 2002-10-15 2008-04-01 Lsi Logic Corporation Integrated circuit package design

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TW200626998A (en) * 2005-01-21 2006-08-01 Au Optronics Corp Display panel
US20070057263A1 (en) * 2005-09-14 2007-03-15 Eastman Kodak Company Quantum dot light emitting layer

Also Published As

Publication number Publication date
US20100264816A1 (en) 2010-10-21
EP2419934B1 (en) 2018-02-14
TW201119026A (en) 2011-06-01
WO2010120742A1 (en) 2010-10-21
KR20120020109A (ko) 2012-03-07
EP2419934A1 (en) 2012-02-22
JP5275510B2 (ja) 2013-08-28
JP2012524298A (ja) 2012-10-11
CN102396067A (zh) 2012-03-28
US7973472B2 (en) 2011-07-05

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