1378342 1101年09月14日核正番換 六、發明說明： 【發明所屬之技術領威】 [0001]本發明涉及一種散熱裝置，特別涉及一種筆記本電腦散 熱裝置。 【先前技術】 [0002] 如今，筆記本電腦以其重量輕、攜帶方便獲得了廣大使 用者的青睞。筆記本電腦在使用過程中，會產生熱量， 特別是CPU、北橋等高頻率工作的部分，產生熱量大，溫 度上升快，會影響筆記本電腦的正常工作《現有筆記本 電腦將熱量傳到散熱片，由風扇將熱量通過散熱孔驅散 出去，這在一定程度上驅散了熱量，但隨著熱量不斷導 入’散熱片的溫度會上升，當散熱片的溫度上升至一定 值後，導熱效率會大大降低，將不利於散熱，熱量不能 及時散出，存在使筆記本電腦内元件溫度過高而影響筆 記本電腦工作的缺陷。 【發明内容】 國t於此，有必要提供—種能及時散發熱量的筆記本電腦 散熱裝置。 一種筆記本電腦健裝置，安裝於筆記本電腦的殼體内 ’破體上安裝有電路板，電路板上電連接有發熱元件， 發熱70件上置有導熱片，所述筆記本電腦散熱裝置包括 傳熱單元、主散熱單元及輔助散熱單/0，所述傳熱單元 包括傳熱體和驅動子單元，傳熱體與導熱片連接，並在 2述驅動子單4動下交替地運動至主散熱單元'輔助 散熱里开.卜。 第4頁/共14頁 099誦8产單编號A〇101 1013349662-0 Γ378342 -- 101年.09月14日修正替換頁 [0005] 上述散熱裝置由於交替使用主散熱單元及輔散熱單元進 行散熱，提高了散熱效率，可避免發熱元件產生的熱量 使其溫度過高而影響筆記本電腦的工作。 【實施方式】 [0006] 請參閱圖1，筆記本電腦100包括本體20、蓋體60及樞軸 ' 地連接本體20與蓋體60的轉軸90。本體20包括鍵盤22、 承載鍵盤22的上殼體24及與上殼體24相扣合的下殼體26 〇 [0007] 請參閱圖2、圖3，下殼體26内安裝有電路板28，電路板 28上電連接有發熱元件10。本實施方式中，發熱元件10 包括CPU12、北橋14。發熱元件10上置有導熱片16。導 熱片16用於吸收發熱元件10在工作過程中產生的熱量。 下殼體26還安裝有傳熱單元30、主散熱單元40及輔助散 熱單元50。傳熱單元30與導熱片16連接，並交替地置於 主散熱單元40、輔助散熱單元50上。在本實施方式中， 下殼體26内還包括第一溫度感測器11、第二溫度感測器 13，分別用於感測主散熱單元40、輔助散熱單元50的溫 度。傳熱單元30根據第一溫度感測器11、第二溫度感測 器13感測到的溫度，交替地運動至主散熱單元40及輔助 散熱單元50上，從而交替地將導熱片16聚集的熱量傳導 至主散熱單元40、輔助散,熱單元50，由主散熱單元40、 ；_ 輔助散熱單元50驅散熱量。 [0008] 電路板28形成有第一凹槽（圖未標）、第二凹槽（圖未 標）。第一凹槽、第二凹槽位於導熱片16的兩側，分別 . 用於容置主散熱單元40、輔助散熱單元50。 09910808#單編號 AQ1G1 帛 5 頁 / 共 14 頁 1013349662-0 1378342 _： 101年09月14日梭正替換頁 [0009] 主散熱單元40容置於第一凹槽並固定於下殼體26。主散 熱單元40包括主風扇42及面向主風扇42出風口的複數主 散熱片44。 [0010] 輔助散熱單元50容置於第二凹槽並固定於下殼體26。輔 助散熱單元50包括輔風扇52及面向輔風扇52出風口的複 數輔散熱片54。 [0011] 導熱片16形成有通孔18，用於連接傳熱單元30。 [0012] 傳熱單元30包括置入通孔18的傳熱體38及驅動子單元36 。驅動子單元36用於驅動傳熱體38沿通孔18往復運動。 驅動子單元36包括與下殼體26固定的馬達32、與馬達32 連接的齒輪34。傳熱體38呈長條狀，面向齒輪34的侧面 形成有複數齒（圖未示），用於與齒輪34嚙合。CPU12與 馬達32電連接，並控制馬達32正轉或反轉，在馬達32驅 動下，齒輪34順時針或逆時針轉動，從而帶動傳熱體38 沿通孔18運動至主散熱片44或輔散熱片54上。在其他實 施方式中，驅動子單元36為一步進電機，驅動傳熱體38 運動。 [0013] 請參閱圖2，當利用主散熱單元40散熱時，傳熱體38將導 熱片16聚集的CPU12、北橋14產生的熱量不斷傳導至主 散熱片44，主散熱片44p不斷溫度升高，當第一溫度感 測器11感測到主散熱片44的溫度達到一預定值時，請參 閱圖3，CPU12發出信號控制馬達32轉動。馬達32驅動齒 輪34帶動傳熱體38沿通孔18向輔助散熱單元50運動，使 傳熱體38承載於輔散熱片54上，此時，傳熱體38將導熱 099麵8,單編號A0101 第6頁/共14頁 1013349662-0 1378342 101年09月14日梭正替換頁 片16聚集的由CPU1 2、北橋14產生的熱量傳導至輔散熱 片54，由輔風扇52驅散熱量。由於輔散熱片54的溫度低 於主散熱片44的溫度，傳熱體38與輔散熱片54的溫差更 大，利於熱量傳導，以達到快速散熱的目的。 [0014] 當第二溫度感測器13感測到輔散熱片54的溫度達到一預 定值時，CPU1 2發出信號控制馬達32逆轉。馬達32驅動 齒輪34帶動傳熱體38沿通孔18向主散熱單元40運動，使 傳熱體38返回於主散熱片44上，由主風扇42驅散熱量， 如此循環。 [0015] 上述傳熱體38交替地與主散熱片44、輔散熱片54連接， 更有利於熱量傳導，提高散熱效率，可避免CPU12、北橋 14產生的熱量使其溫度過高而影響筆記本電腦100的工作 〇 【圖式簡單說明】 [0016] 圖1為一實施方式中筆記本電腦的立體圖。 [0017] 圖2為圖1中的筆記本電腦利用主散熱單元散熱的立體圖 〇 [0018] 圖3為圖1中的筆記本電腦利用輔助散熱單元散熱的立體 圖。 【主要元件符號說明】 [0019] 筆記本電腦：100 [0020] 本體：20 [0021] 蓋體：60 〇991_8#單編號 A〇101 第7頁/共14頁 1013349662-0 1378342 [0022] 轉轴：90 [0023] 鍵盤：22 [0024] 上殼體：24 [0025] 下殼體：26 [0026] 電路板：28 [0027] 發熱元件：10 [0028] 導熱片：16 [0029] 傳熱單元：30 [0030] 主散熱單元：40 [0031] 輔助散熱單元：50 [0032] CPU ： 12 [0033] 北橋：14 [0034] 主風扇：42 [0035] 主散熱片：44 [0036] 輔風扇：52 [0037] 輔散熱片：54 [0038] 通孔：18 [0039] 驅動子單元：36 [0040] 傳熱體：38 09910808#單编號 A〇101 第8頁/共14頁 101年09月14日修正替換頁 1013349662-0 1378342 [0041] 馬達 ：32 [0042] 齒輪 ：34 [0043] 第一 溫度感測器 [0044] 第二 溫度感測器 ：11 13 101年09月14日慘正替換頁 09910808^^^^ A〇101 第9頁/共14頁 1013349662-01378342 September 14th, 1101, the company is in charge of the invention. 6. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a heat sink, and more particularly to a notebook computer heat sink. [Prior Art] [0002] Today, notebook computers are favored by a large number of users because of their light weight and portability. During the use of the notebook, heat will be generated, especially in the high-frequency parts such as the CPU and the North Bridge. The heat generated is high and the temperature rises rapidly, which will affect the normal operation of the notebook. The existing laptop transmits heat to the heat sink. The fan dissipates heat through the cooling holes, which dissipates heat to a certain extent, but as the heat is continuously introduced, the temperature of the heat sink will rise. When the temperature of the heat sink rises to a certain value, the heat transfer efficiency will be greatly reduced. It is not conducive to heat dissipation, heat can not be dissipated in time, and there is a defect that the temperature of components in the notebook computer is too high and affects the work of the notebook computer. SUMMARY OF THE INVENTION In this regard, it is necessary to provide a notebook heat sink capable of dissipating heat in time. A notebook computer device installed in a casing of a notebook computer has a circuit board mounted on the broken body, a heating element is electrically connected to the circuit board, and a heat conducting piece is disposed on the heat generating 70, and the heat sink of the notebook computer includes heat transfer The unit, the main heat dissipating unit and the auxiliary heat dissipating unit/0, the heat transfer unit comprises a heat transfer body and a driving subunit, and the heat transfer body is connected with the heat conducting sheet, and alternately moves to the main heat dissipating under the action of the driving sub-single 4 The unit 'assisted heat dissipation. Bu. Page 4 of 14 Page 099诵8 Production Order No. A〇101 1013349662-0 Γ378342 -- 101. September 14 Revision Replacement Page [0005] The above heat sink is replaced by the main heat sink unit and the auxiliary heat sink unit. The heat dissipation improves the heat dissipation efficiency, and the heat generated by the heating element is prevented from being overheated, which affects the work of the notebook computer. [0006] Referring to FIG. 1, a notebook computer 100 includes a body 20, a cover 60, and a pivot shaft 90 that pivotally connects the body 20 and the cover 60. The main body 20 includes a keyboard 22, an upper casing 24 carrying the keyboard 22, and a lower casing 26 that is engaged with the upper casing 24. Referring to Figures 2 and 3, a circuit board 28 is mounted in the lower casing 26. The heating element 10 is electrically connected to the circuit board 28. In the present embodiment, the heat generating component 10 includes a CPU 12 and a north bridge 14. A heat conductive sheet 16 is placed on the heat generating component 10. The heat guide 16 is for absorbing heat generated by the heat generating component 10 during operation. The lower casing 26 is also mounted with a heat transfer unit 30, a main heat radiating unit 40, and an auxiliary heat radiating unit 50. The heat transfer unit 30 is connected to the heat transfer sheet 16 and alternately placed on the main heat dissipation unit 40 and the auxiliary heat dissipation unit 50. In the present embodiment, the lower housing 26 further includes a first temperature sensor 11 and a second temperature sensor 13 for sensing the temperature of the main heat dissipation unit 40 and the auxiliary heat dissipation unit 50, respectively. The heat transfer unit 30 alternately moves to the main heat dissipation unit 40 and the auxiliary heat dissipation unit 50 according to the temperature sensed by the first temperature sensor 11 and the second temperature sensor 13, thereby alternately gathering the heat conductive sheets 16 The heat is transferred to the main heat dissipating unit 40, the auxiliary dissipating heat unit 50, and the main heat dissipating unit 40, the auxiliary heat dissipating unit 50 dissipates heat. The circuit board 28 is formed with a first recess (not labeled) and a second recess (not shown). The first recess and the second recess are located at two sides of the heat conducting sheet 16, respectively, for accommodating the main heat dissipating unit 40 and the auxiliary heat dissipating unit 50. 09910808#单号 AQ1G1 帛 5 pages / Total 14 pages 1013349662-0 1378342 _: September 14th, 2011 Shuttle replacement page [0009] The main heat dissipation unit 40 is housed in the first recess and is fixed to the lower casing 26. The main heat sink unit 40 includes a main fan 42 and a plurality of main fins 44 facing the air outlet of the main fan 42. [0010] The auxiliary heat dissipation unit 50 is housed in the second recess and fixed to the lower casing 26. The auxiliary heat dissipation unit 50 includes an auxiliary fan 52 and a plurality of auxiliary fins 54 facing the air outlet of the auxiliary fan 52. [0011] The heat conductive sheet 16 is formed with a through hole 18 for connecting the heat transfer unit 30. [0012] The heat transfer unit 30 includes a heat transfer body 38 and a drive subunit 36 that are placed in the through hole 18. The driving subunit 36 is for driving the heat transfer body 38 to reciprocate along the through hole 18. The drive subunit 36 includes a motor 32 fixed to the lower casing 26 and a gear 34 coupled to the motor 32. The heat transfer body 38 has an elongated shape, and a plurality of teeth (not shown) are formed on the side surface facing the gear 34 for meshing with the gear 34. The CPU 12 is electrically connected to the motor 32 and controls the motor 32 to rotate forward or reverse. When the motor 32 is driven, the gear 34 rotates clockwise or counterclockwise, thereby driving the heat transfer body 38 to move along the through hole 18 to the main heat sink 44 or auxiliary. On the heat sink 54. In other embodiments, drive subunit 36 is a stepper motor that drives heat transfer body 38 to move. Referring to FIG. 2, when heat is dissipated by the main heat dissipating unit 40, the heat transfer body 38 continuously conducts heat generated by the CPU 12 and the north bridge 14 where the heat conductive sheets 16 are concentrated to the main heat sink 44, and the main heat sink 44p continuously rises in temperature. When the first temperature sensor 11 senses that the temperature of the main heat sink 44 reaches a predetermined value, referring to FIG. 3, the CPU 12 sends a signal to control the rotation of the motor 32. The driving gear 34 of the motor 32 drives the heat transfer body 38 to move along the through hole 18 to the auxiliary heat dissipating unit 50, so that the heat transfer body 38 is carried on the auxiliary heat sink 54. At this time, the heat transfer body 38 will conduct heat to the 099 face 8, single number A0101. Page 6 of 14 Page 1013349662-0 1378342 On September 14, 101, the heat generated by the CPU 1 2 and the north bridge 14 is transferred to the auxiliary heat sink 54 and the heat is dissipated by the auxiliary fan 52. Since the temperature of the auxiliary heat sink 54 is lower than the temperature of the main heat sink 44, the temperature difference between the heat transfer body 38 and the auxiliary heat sink 54 is larger, which facilitates heat conduction for the purpose of rapid heat dissipation. [0014] When the second temperature sensor 13 senses that the temperature of the auxiliary heat sink 54 reaches a predetermined value, the CPU 12 issues a signal to control the motor 32 to reverse. The motor 32 drives the gear 34 to move the heat transfer body 38 along the through hole 18 to the main heat dissipating unit 40, so that the heat transfer body 38 returns to the main fin 44, and the main fan 42 dissipates heat and circulates. [0015] The heat transfer body 38 is alternately connected to the main heat sink 44 and the auxiliary heat sink 54, which is more favorable for heat conduction and improves heat dissipation efficiency, and can avoid the heat generated by the CPU 12 and the north bridge 14 to make the temperature thereof too high and affect the notebook computer. [Operation of 100] [0016] FIG. 1 is a perspective view of a notebook computer in an embodiment. 2 is a perspective view of the notebook computer of FIG. 1 using the main heat dissipation unit for heat dissipation. [0018] FIG. 3 is a perspective view of the notebook computer of FIG. 1 using the auxiliary heat dissipation unit for heat dissipation. [Description of main component symbols] [0019] Laptop: 100 [0020] Body: 20 [0021] Cover: 60 〇 991_8# Single No. A 〇 101 Page 7 / Total 14 Page 1013349662-0 1378342 [0022] : 90 [0023] Keyboard: 22 [0024] Upper housing: 24 [0025] Lower housing: 26 [0026] Circuit board: 28 [0027] Heating element: 10 [0028] Thermal sheet: 16 [0029] Heat transfer Unit: 30 [0030] Main Cooling Unit: 40 [0031] Auxiliary Cooling Unit: 50 [0032] CPU: 12 [0033] North Bridge: 14 [0034] Main Fan: 42 [0035] Main Heat Sink: 44 [0036] Fan: 52 [0037] Auxiliary heat sink: 54 [0038] Through hole: 18 [0039] Drive subunit: 36 [0040] Heat transfer body: 38 09910808# Single number A〇101 Page 8 of 14 Amendment Page 1013349662-0 1378342 [0041] Motor: 32 [0042] Gear: 34 [0043] First Temperature Sensor [0044] Second Temperature Sensor: 11 13 September 14, 2014 Japanese Miserable Replacement Page 09910808^^^^ A〇101 Page 9 of 14 Page 1013349662-0