201133177 [0001] [0002] Ο [0003] 〇 [0004] 發明說明： 【發明所屬之技術領域】 本發明涉及一種一體式電腦。 【先前技術】 目前，個人電腦大致分為台式電腦和筆記型電腦兩種。 台式電腦之主要優點係價格相對便宜且硬體升級及維修 較為方便，惟其體積、重量較大，移動不便。而筆記型 電腦雖然小巧，移動靈活，惟其價格較高，硬體升級及 維修不便。 隨著液晶顯示幕等平面顯示技術之發展日趨成熟，一體 式電腦逐漸出現並開始發展。傳統之一體式電腦架構通 常係將主板、電源及硬碟等硬體設備直接集成至液晶顯 示幕之背面，惟，上述設計導致液晶顯示幕之厚度過大 ，較難發揮液晶顯示幕輕巧便捷、節省桌面空間等優點 〇 【發明内容】 有鑒於此，有必要提供一種可降低顯示幕厚度之一體式 電腦。 [0005] 一種一體式電腦，包括顯示幕、主板、電源及支撐顯示 幕之支撐機構。支撐機構包括基座和固定設於基座上並 與顯示幕相連之支撐架。支撐架内形成有收容槽，主板 和電源收容於收容槽並分別與顯示幕電連接。 上述一體式電腦將主板和電源設置於支撐架内，可有效 降低顯示幕之厚度。 099107726 表單編號Α0101 第3頁/共13頁 0992013896-0 [0006] 201133177 [0007] :實施方式】 下面將結合附圖 —步詳細說明。 Λ知方式對本發明之—體式電腦作進 [0008] [0009] 二本發明實施方式之-體式電腦1〇°包括顯示 括=於切顯㈣1Q之切機構2卜切機獅包 之支推架2#2固疋汉於基座21上並與顯示幕1G可轉動相連 2閱圖2 ’支推架22大致為中空之方形柱體，其由電磁 ^ &讀好且具有—定機械強,金屬材料製成。支 ^、22面向顯示幕1Q之-側面向外延伸形成-連接部221 :、靠近支揮架22之頂部…體式電塘剛還包括設於連 P221上’並與顯示幕1Q相連之鉸鏈結構223。鉸鏈結 之作用係便於調節顯示幕10相對支撐機構20之俯仰 角度支擇架22上遠離連接部221之一側上開設有便於用 =握持之凹槽225。切架22内卵設有大致為方形之收 槽227體式電腦100瑱包括收容於收容槽227内之 板3〇硬碟40、電源50、散熱模組6〇及第一外部介面 模組7 0。 月併參閱圖3 ’主板30與標準之BTX(Balanced Tech-n〇l〇gy Extended)主板大致相同，其上設有 CPU(Central Processing Unit，中央處理器）、記憶 體條Μ未標示）等電子器件。主板3G藉由複數導線（圖未 τ)刀别與顯不幕10、硬碟40、電源50、散熱模組60及 f外部介面棋組7〇電連接。為了節約空間主板3〇亦 ^^Micro~BTX主板或筆記型主板等寬度較窄集成 099107726 表單編號A0101 第4頁/共13頁 0992013896-0 201133177 度較高之主板。 [0011] 硬碟40大致為方形，其可採用標準之IDE硬碟或STAT硬 碟’更為優選之係採用尺寸較小之筆記本硬碟。硬碟4〇 緊鄰主板30之一側，且硬碟4〇面積較大之一側面與主板 30平行。 [0012] 電源50之形狀與硬碟40之形狀大致相同。電源50與硬碟 40緊密排布在與主板3〇平行之同一平面上，以充分利用 收容槽227之有限空間，儘量縮小支撐架22之厚度。 、 [⑻13] 散熱模組60包括設於主板30上並與CPU相揲觸之散熱器 61 ’及設於主板30邊緣之第一散熱風扇63和第二散熱風 扇65。散熱器61為具有導熱管62之錄片式散熱器，其包 括大致為方形之第一散熱部611和從第一散熱部611—側 延伸形成之第二散熱部613。第一散熱部611位於硬碟40 之一侧’第二散熱部613位於硬碟40與主板30之間。第一 散熱風扇63與第一散熱部611相對設置，且位於收容槽 ^ 227之頂部。第二散熱風扇65與第一散熱風扇63相鄰，且 與電源50相對設置。通電運轉時，第一散熱風扇63產生 之風流吹向散熱器61，以將CPU及硬碟40所產生之熱量迅 速導出。第二散熱風扇65產生之風流吹向電源50，以將 電源50所產生之熱量迅速導出。為了進一步提升散熱模 組60之散熱功效，支撐架22之頂部與第一散熱風扇63和 第二散熱風扇65相對應部位開設有與收容槽227相通之複 數散熱孔228。 [0014]第一外部介面模組70包括與主板30相鄰之固定板71及依 0992013896-0 099107726 表單編號A0101 第5頁/共13頁 201133177 次排列在固定板71上之複數外部介面73。複數外部介面 73 包括電源線介面、USB(Universal Serial Bus，通 用串列匯流排）介面及網線介面等。支撐架22上開設有凹 槽225之側面對應上述複數外部介面73還開設有複數通孔 229。 [0015] 一體式電腦100還包括設於顯示幕10内之第二外部介面模 組（圖未示）。該第二外部介面模組包括與主板30電連接 之音頻介面、USB介面、存儲卡介面等外部介面。顯示幕 10 —側面開設有與該複數外部介面相對應之複數通孔11 〇 [0016] 一體式電腦100還包括設於顯示幕10内之吸入式光碟機80 。吸入式光碟機80與主板30電連接，其具有光碟進出口 81。顯示幕10具有複數通孔11之一側壁上開設有與光碟 進出口 81相對應之開口 13。 [0017] 本發明實施方式之一體式電腦100將主板30、硬碟40及電 源50等元件收容於支撐架22内，故可有效降低顯示幕10 之厚度。另，主板30、硬碟40等元件與顯示幕10分開設 置不僅有利於防止顯示幕10受到電磁干擾，亦有利於用 戶拆卸、更換硬碟40、記憶體條等元件。 [0018] 可理解，第一外部介面模組70、第二外部介面模組、吸 入式光碟機80及散熱模組60亦可省略。若一體式電腦100 使用外接硬碟，則硬碟40亦可省略。 [0019] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 099107726 表單編號A0101 第6頁/共13頁 0992013896-0 201133177 [0020] 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施方式之一體式電腦之組裝示意圖。 [0021] 圖2係圖1所示一體式電腦之立體分解圖。 [0022] 圖3係圖2所示一體式電腦之進一步立體分解圖。 〇 [0023] 【主要元件符號說 一體式電腦100 [0024] 顯示幕10 [0025] 開口 13 [0026] 支撐機構20 [0027] 基座21 [0028] 支撐架22 ^ [0029] 連接部221 [0030] 鉸鏈結構223 [0031] 凹槽225 [0032] 收容槽227 [0033] 散熱孔228 [0034] 通孔229、11 [0035] 主板30 099107726 表單編號Α0101 第7頁/共13頁 0992013896-0 201133177 [0036] 硬碟40 [0037] 電源5 0 [0038] 散熱模組6 0 [0039] 散熱器61 [0040] 第一散熱部611 [0041] 第二散熱部613 [0042] 導熱管62 [0043] 第一散熱風扇63 [0044] 第二散熱風扇65 [0045] 第一外部介面模組70 [0046] 固定板71 [0047] 外部介面7 3 [0048] 吸入式光碟機80 [0049] 光碟進出口 81 099107726 表單編號A0101 第8頁/共13頁 0992013896-0201133177 [0001] [0002] [0003] [0004] Description of the Invention: [Technical Field] The present invention relates to an integrated computer. [Prior Art] At present, personal computers are roughly classified into desktop computers and notebook computers. The main advantage of desktop computers is that they are relatively inexpensive and hardware upgrades and maintenance are more convenient, but their size, weight and mobility are inconvenient. The notebook computer is small and mobile, but its price is high, hardware upgrade and maintenance are inconvenient. With the development of flat display technologies such as liquid crystal display screens, integrated computers have gradually emerged and developed. One of the traditional computer architectures usually integrates hardware devices such as motherboards, power supplies, and hard disks directly into the back of the LCD screen. However, the above design leads to an excessive thickness of the liquid crystal display screen, making it difficult to play the liquid crystal display screen. Advantages of desktop space, etc. [Invention] In view of this, it is necessary to provide a computer that can reduce the thickness of the display screen. [0005] An all-in-one computer includes a display screen, a main board, a power source, and a support mechanism for supporting the display screen. The support mechanism includes a base and a support frame fixedly mounted on the base and connected to the display screen. A receiving slot is formed in the support frame, and the main board and the power source are received in the receiving slot and electrically connected to the display screen respectively. The above-mentioned integrated computer sets the main board and the power supply in the support frame, which can effectively reduce the thickness of the display screen. 099107726 Form No. Α0101 Page 3 of 13 0992013896-0 [0006] 201133177 [Embodiment] Embodiments will be described in detail below with reference to the accompanying drawings. Λ 方式 对 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体2#2 solid foundation on the base 21 and rotatably connected with the display screen 1G 2Fig. 2 'The push frame 22 is a hollow square cylinder, which is read by the electromagnetic ^ & Made of metal material. The support member 22 faces the display screen 1Q and extends outwardly to form a connecting portion 221: near the top of the support frame 22. The body electric pond just includes a hinge structure disposed on the connecting P221 and connected to the display screen 1Q. 223. The function of the hinge knot is to facilitate adjustment of the pitch angle of the display screen 10 relative to the support mechanism 20. The recess 22 is provided on the side of the support frame 22 away from the connecting portion 221 for easy gripping. The egg in the cutting frame 22 is provided with a substantially square receiving groove 227. The computer 100 includes a plate 3, a hard disk 40, a power source 50, a heat dissipation module 6 and a first external interface module 70. . Referring to Figure 3, the motherboard 30 is roughly the same as the standard BTX (Balanced Tech-n〇l〇gy Extended) motherboard, which has a CPU (Central Processing Unit) and a memory strip (not labeled). Electronic device. The main board 3G is electrically connected to the display 10, the hard disk 40, the power supply 50, the heat dissipation module 60, and the f external interface board by a plurality of wires (not shown). In order to save space, the motherboard 3〇 ^^Micro~BTX motherboard or notebook motherboard and other narrow width integration 099107726 Form No. A0101 Page 4 / Total 13 0992013896-0 201133177 Higher motherboard. [0011] The hard disk 40 is generally square in shape, and may be a standard IDE hard disk or a STAT hard disk. More preferably, a smaller notebook hard disk is used. The hard disk 4 is adjacent to one side of the main board 30, and one side of the hard disk 4 is larger in parallel with the main board 30. [0012] The shape of the power source 50 is substantially the same as the shape of the hard disk 40. The power source 50 and the hard disk 40 are arranged closely on the same plane parallel to the main board 3's to fully utilize the limited space of the receiving slot 227 to minimize the thickness of the support frame 22. [(8)13] The heat dissipation module 60 includes a heat sink 61' disposed on the main board 30 and in contact with the CPU, and a first heat dissipation fan 63 and a second heat dissipation fan 65 disposed at the edge of the main board 30. The heat sink 61 is a document type heat sink having a heat transfer tube 62, and includes a substantially square first heat radiating portion 611 and a second heat radiating portion 613 extending from the first heat radiating portion 611 side. The first heat radiating portion 611 is located on one side of the hard disk 40. The second heat radiating portion 613 is located between the hard disk 40 and the main board 30. The first heat dissipation fan 63 is disposed opposite to the first heat dissipation portion 611 and is located at the top of the receiving groove ^ 227. The second heat radiating fan 65 is adjacent to the first heat radiating fan 63 and disposed opposite to the power source 50. During the energization operation, the wind generated by the first cooling fan 63 is blown toward the heat sink 61 to quickly derive the heat generated by the CPU and the hard disk 40. The wind generated by the second cooling fan 65 is blown toward the power source 50 to quickly derive the heat generated by the power source 50. In order to further improve the heat dissipation function of the heat dissipation module 60, the top of the support frame 22 and the first heat dissipation fan 63 and the second heat dissipation fan 65 are provided with a plurality of heat dissipation holes 228 communicating with the receiving slots 227. The first external interface module 70 includes a fixing plate 71 adjacent to the main board 30 and a plurality of external interfaces 73 arranged on the fixing plate 71 according to the form number A0101, page 5 of the total number of pages 20113177. The plurality of external interfaces 73 include a power line interface, a USB (Universal Serial Bus) interface, and a network cable interface. A plurality of through holes 229 are defined in the side surface of the support frame 22 on which the recess 225 is formed corresponding to the plurality of external interfaces 73. [0015] The integrated computer 100 further includes a second external interface module (not shown) disposed in the display screen 10. The second external interface module includes an external interface such as an audio interface, a USB interface, and a memory card interface electrically connected to the motherboard 30. The display screen 10 has a plurality of through holes 11 corresponding to the plurality of external interfaces. [0016] The integrated computer 100 further includes a slot-type optical disc drive 80 disposed in the display screen 10. The slot-in disc drive 80 is electrically connected to the main board 30, and has an optical disc inlet/outlet 81. The display screen 10 has an opening 13 corresponding to the optical disk inlet and outlet 81 on one of the side walls of the plurality of through holes 11. [0017] The personal computer 100 of the embodiment of the present invention accommodates components such as the main board 30, the hard disk 40, and the power source 50 in the support frame 22, so that the thickness of the display screen 10 can be effectively reduced. In addition, the components of the main board 30, the hard disk 40 and the display screen 10 are not only beneficial for preventing the display screen 10 from being subjected to electromagnetic interference, but also facilitating the user to disassemble and replace the components such as the hard disk 40 and the memory strip. [0018] It can be understood that the first external interface module 70, the second external interface module, the inhaled optical disc drive 80, and the heat dissipation module 60 may also be omitted. If the integrated computer 100 uses an external hard disk, the hard disk 40 can also be omitted. [0019] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only the preferred embodiment of the present invention. 099107726 Form No. A0101 Page 6 of 13 0992013896-0 201133177 [0020] The formula cannot limit the scope of the patent application. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the assembly of a personal computer according to an embodiment of the present invention. 2 is an exploded perspective view of the integrated computer shown in FIG. 1. [0022] FIG. 3 is a further perspective exploded view of the integrated computer shown in FIG. 2.主要[0023] [Main component symbol says integrated computer 100 [0024] Display screen 10 [0025] Opening 13 [0026] Support mechanism 20 [0027] Base 21 [0028] Support frame 22 ^ [0029] Connection portion 221 [ 0030] hinge structure 223 [0031] groove 225 [0032] receiving groove 227 [0033] heat dissipation hole 228 [0034] through hole 229, 11 [0035] main board 30 099107726 form number Α 0101 page 7 / total 13 page 0992013896-0 201133177 [0036] hard disk 40 [0037] power supply 50 [0038] heat dissipation module 6 0 [0039] heat sink 61 [0040] first heat dissipation portion 611 [0041] second heat dissipation portion 613 [0042] heat pipe 62 [ 0043] First cooling fan 63 [0044] Second cooling fan 65 [0045] First external interface module 70 [0046] Fixed plate 71 [0047] External interface 7 3 [0048] Inhaled optical disk drive 80 [0049] Optical disk Import and export 81 099107726 Form number A0101 Page 8 / Total 13 pages 0992013896-0