TWI468900B - All-in-one type computer - Google Patents
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- TWI468900B TWI468900B TW99107726A TW99107726A TWI468900B TW I468900 B TWI468900 B TW I468900B TW 99107726 A TW99107726 A TW 99107726A TW 99107726 A TW99107726 A TW 99107726A TW I468900 B TWI468900 B TW I468900B
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Description
本發明涉及一種一體式電腦。 The invention relates to an integrated computer.
目前,個人電腦大致分為台式電腦和筆記型電腦兩種。台式電腦之主要優點係價格相對便宜且硬體升級及維修較為方便,惟其體積、重量較大,移動不便。而筆記型電腦雖然小巧,移動靈活,惟其價格較高,硬體升級及維修不便。 Currently, personal computers are roughly classified into desktop computers and notebook computers. The main advantage of desktop computers is that the price is relatively cheap and the hardware upgrade and maintenance are more convenient, but the volume, weight and movement are inconvenient. The notebook computer is small and mobile, but its price is high, hardware upgrade and maintenance are inconvenient.
隨著液晶顯示幕等平面顯示技術之發展日趨成熟,一體式電腦逐漸出現並開始發展。傳統之一體式電腦架構通常係將主板、電源及硬碟等硬體設備直接集成至液晶顯示幕之背面,惟,上述設計導致液晶顯示幕之厚度過大,較難發揮液晶顯示幕輕巧便捷、節省桌面空間等優點。 With the development of flat display technology such as liquid crystal display screens becoming more and more mature, integrated computers gradually emerged and began to develop. One of the traditional computer architectures usually integrates hardware devices such as motherboards, power supplies, and hard disks directly into the back of the LCD screen. However, the above design leads to an excessive thickness of the liquid crystal display screen, making it difficult to play the liquid crystal display screen. Advantages of desktop space.
有鑒於此,有必要提供一種可降低顯示幕厚度之一體式電腦。 In view of this, it is necessary to provide a computer that can reduce the thickness of the display screen.
一種一體式電腦,包括顯示幕、主板、電源及支撐顯示幕之支撐機構。支撐機構包括基座和固定設於基座上並與顯示幕相連之支撐架。支撐架內形成有收容槽,主板和電源收容於收容槽並分別與顯示幕電連接。 An integrated computer, including a display screen, a motherboard, a power supply, and a supporting mechanism for supporting the display screen. The support mechanism includes a base and a support frame fixedly mounted on the base and connected to the display screen. A receiving slot is formed in the support frame, and the main board and the power source are received in the receiving slot and electrically connected to the display screen respectively.
上述一體式電腦將主板和電源設置於支撐架內,可有效降低顯示 幕之厚度。 The above-mentioned integrated computer sets the main board and the power supply in the support frame, which can effectively reduce the display. The thickness of the curtain.
100‧‧‧一體式電腦 100‧‧‧One-piece computer
10‧‧‧顯示幕 10‧‧‧ display screen
13‧‧‧開口 13‧‧‧ openings
20‧‧‧支撐機構 20‧‧‧Support institutions
21‧‧‧基座 21‧‧‧Base
22‧‧‧支撐架 22‧‧‧Support frame
221‧‧‧連接部 221‧‧‧Connecting Department
223‧‧‧鉸鏈結構 223‧‧‧Hinged structure
225‧‧‧凹槽 225‧‧‧ Groove
227‧‧‧收容槽 227‧‧‧storage trough
228‧‧‧散熱孔 228‧‧‧ vents
229、11‧‧‧通孔 229, 11‧‧‧through holes
30‧‧‧主板 30‧‧‧ motherboard
40‧‧‧硬碟 40‧‧‧ Hard disk
50‧‧‧電源 50‧‧‧Power supply
60‧‧‧散熱模組 60‧‧‧ Thermal Module
61‧‧‧散熱器 61‧‧‧ radiator
611‧‧‧第一散熱部 611‧‧‧First heat sink
613‧‧‧第二散熱部 613‧‧‧second heat sink
62‧‧‧導熱管 62‧‧‧Heat pipe
63‧‧‧第一散熱風扇 63‧‧‧First cooling fan
65‧‧‧第二散熱風扇 65‧‧‧Second cooling fan
70‧‧‧第一外部介面模組 70‧‧‧First external interface module
71‧‧‧固定板 71‧‧‧Fixed plate
73‧‧‧外部介面 73‧‧‧ external interface
80‧‧‧吸入式光碟機 80‧‧‧Inhalation CD player
81‧‧‧光碟進出口 81‧‧‧Disc import and export
圖1係本發明實施方式之一體式電腦之組裝示意圖。 1 is a schematic view showing the assembly of a personal computer according to an embodiment of the present invention.
圖2係圖1所示一體式電腦之立體分解圖。 2 is an exploded perspective view of the integrated computer shown in FIG. 1.
圖3係圖2所示一體式電腦之進一步立體分解圖。 3 is a further perspective exploded view of the integrated computer shown in FIG. 2.
下面將結合附圖及實施方式對本發明之一體式電腦作進一步詳細說明。 A computer of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖1,本發明實施方式之一體式電腦100包括顯示幕10和用於支撐顯示幕10之支撐機構20。支撐機構20包括基座21和固定設於基座21上並與顯示幕10可轉動相連之支撐架22。 Referring to FIG. 1 , a personal computer 100 according to an embodiment of the present invention includes a display screen 10 and a support mechanism 20 for supporting the display screen 10 . The support mechanism 20 includes a base 21 and a support frame 22 fixedly disposed on the base 21 and rotatably coupled to the display screen 10.
請參閱圖2,支撐架22大致為中空之方形柱體,其由電磁遮罩性能較好且具有一定機械強度之金屬材料製成。支撐架22面向顯示幕10之一側面向外延伸形成一連接部221,其靠近支撐架22之頂部。一體式電腦100還包括設於連接部221上,並與顯示幕10相連之鉸鏈結構223。鉸鏈結構223之作用係便於調節顯示幕10相對支撐機構20之俯仰角度。支撐架22上遠離連接部221之一側上開設有便於用手握持之凹槽225。支撐架22內部開設有大致為方形之收容槽227。一體式電腦100還包括收容於收容槽227內之主板30、硬碟40、電源50、散熱模組60及第一外部介面模組70。 Referring to FIG. 2, the support frame 22 is substantially a hollow square cylinder made of a metal material having a good electromagnetic shielding performance and a certain mechanical strength. The support frame 22 extends outwardly from one side of the display screen 10 to form a connecting portion 221 adjacent to the top of the support frame 22. The integrated computer 100 further includes a hinge structure 223 disposed on the connecting portion 221 and connected to the display screen 10. The function of the hinge structure 223 is to facilitate adjustment of the pitch angle of the display screen 10 relative to the support mechanism 20. A recess 225 for holding by hand is provided on a side of the support frame 22 away from the connecting portion 221 . A substantially square receiving groove 227 is defined in the support frame 22. The integrated computer 100 further includes a main board 30, a hard disk 40, a power source 50, a heat dissipation module 60, and a first external interface module 70 housed in the receiving slot 227.
請一併參閱圖3,主板30與標準之BTX(Balanced Technology Extended)主板大致相同,其上設有CPU(Central Processing Unit,中央處理器)、記憶體條(均未標示)等電子器件。主板30 藉由複數導線(圖未示)分別與顯示幕10、硬碟40、電源50、散熱模組60及第一外部介面模組70電連接。為了節約空間,主板30亦可採用Micro-BTX主板或筆記型主板等寬度較窄、集成度較高之主板。 Referring to FIG. 3 together, the main board 30 is substantially the same as the standard BTX (Balanced Technology Extended) main board, and is provided with electronic components such as a CPU (Central Processing Unit) and a memory strip (not labeled). Motherboard 30 The plurality of wires (not shown) are electrically connected to the display screen 10, the hard disk 40, the power source 50, the heat dissipation module 60, and the first external interface module 70, respectively. In order to save space, the motherboard 30 can also use a motherboard with a narrow width and high integration such as a Micro-BTX motherboard or a notebook motherboard.
硬碟40大致為方形,其可採用標準之IDE硬碟或STAT硬碟,更為優選之係採用尺寸較小之筆記本硬碟。硬碟40緊鄰主板30之一側,且硬碟40面積較大之一側面與主板30平行。 The hard disk 40 is generally square in shape, and can be a standard IDE hard disk or a STAT hard disk, and more preferably a smaller notebook hard disk. The hard disk 40 is adjacent to one side of the main board 30, and one side of the hard disk 40 is larger in parallel with the main board 30.
電源50之形狀與硬碟40之形狀大致相同。電源50與硬碟40緊密排布在與主板30平行之同一平面上,以充分利用收容槽227之有限空間,儘量縮小支撐架22之厚度。 The shape of the power source 50 is substantially the same as the shape of the hard disk 40. The power source 50 and the hard disk 40 are closely arranged on the same plane parallel to the main board 30 to make full use of the limited space of the receiving slot 227 to minimize the thickness of the support frame 22.
散熱模組60包括設於主板30上並與CPU相接觸之散熱器61,及設於主板30邊緣之第一散熱風扇63和第二散熱風扇65。散熱器61為具有導熱管62之鰭片式散熱器,其包括大致為方形之第一散熱部611和從第一散熱部611一側延伸形成之第二散熱部613。第一散熱部611位於硬碟40之一側,第二散熱部613位於硬碟40與主板30之間。第一散熱風扇63與第一散熱部611相對設置,且位於收容槽227之頂部。第二散熱風扇65與第一散熱風扇63相鄰,且與電源50相對設置。通電運轉時,第一散熱風扇63產生之風流吹向散熱器61,以將CPU及硬碟40所產生之熱量迅速導出。第二散熱風扇65產生之風流吹向電源50,以將電源50所產生之熱量迅速導出。為了進一步提升散熱模組60之散熱功效,支撐架22之頂部與第一散熱風扇63和第二散熱風扇65相對應部位開設有與收容槽227相通之複數散熱孔228。 The heat dissipation module 60 includes a heat sink 61 disposed on the main board 30 and in contact with the CPU, and a first heat dissipation fan 63 and a second heat dissipation fan 65 disposed at the edge of the main board 30. The heat sink 61 is a fin type heat sink having a heat transfer tube 62, and includes a first heat dissipation portion 611 having a substantially square shape and a second heat dissipation portion 613 extending from a side of the first heat dissipation portion 611. The first heat dissipation portion 611 is located on one side of the hard disk 40, and the second heat dissipation portion 613 is located between the hard disk 40 and the main board 30. The first heat dissipation fan 63 is disposed opposite to the first heat dissipation portion 611 and is located at the top of the receiving groove 227. The second heat dissipation fan 65 is adjacent to the first heat dissipation fan 63 and disposed opposite to the power source 50. During the energization operation, the wind generated by the first cooling fan 63 is blown toward the heat sink 61 to quickly derive the heat generated by the CPU and the hard disk 40. The wind generated by the second cooling fan 65 is blown toward the power source 50 to quickly derive the heat generated by the power source 50. In order to further improve the heat dissipation function of the heat dissipation module 60, a plurality of heat dissipation holes 228 are formed in the top of the support frame 22 corresponding to the first heat dissipation fan 63 and the second heat dissipation fan 65.
第一外部介面模組70包括與主板30相鄰之固定板71及依次排列在 固定板71上之複數外部介面73。複數外部介面73包括電源線介面、USB(Universal Serial Bus,通用串列匯流排)介面及網線介面等。支撐架22上開設有凹槽225之側面對應上述複數外部介面73還開設有複數通孔229。 The first external interface module 70 includes a fixing plate 71 adjacent to the main board 30 and is sequentially arranged in A plurality of external interfaces 73 on the fixed plate 71. The plurality of external interfaces 73 include a power line interface, a USB (Universal Serial Bus) interface, and a network cable interface. A plurality of through holes 229 are defined in the side surface of the support frame 22 on which the recess 225 is formed corresponding to the plurality of external interfaces 73.
一體式電腦100還包括設於顯示幕10內之第二外部介面模組(圖未示)。該第二外部介面模組包括與主板30電連接之音頻介面、USB介面、存儲卡介面等外部介面。顯示幕10一側面開設有與該複數外部介面相對應之複數通孔11。 The integrated computer 100 further includes a second external interface module (not shown) disposed in the display screen 10. The second external interface module includes an external interface such as an audio interface, a USB interface, and a memory card interface electrically connected to the motherboard 30. A plurality of through holes 11 corresponding to the plurality of external interfaces are opened on one side of the display screen 10.
一體式電腦100還包括設於顯示幕10內之吸入式光碟機80。吸入式光碟機80與主板30電連接,其具有光碟進出口81。顯示幕10具有複數通孔11之一側壁上開設有與光碟進出口81相對應之開口13。 The all-in-one computer 100 further includes a slot-in disc drive 80 disposed in the display screen 10. The slot-in disc drive 80 is electrically connected to the main board 30, and has a disc inlet/outlet 81. The display screen 10 has an opening 13 corresponding to the optical disk inlet and outlet 81 on one side wall of the plurality of through holes 11.
本發明實施方式之一體式電腦100將主板30、硬碟40及電源50等元件收容於支撐架22內,故可有效降低顯示幕10之厚度。另,主板30、硬碟40等元件與顯示幕10分開設置不僅有利於防止顯示幕10受到電磁干擾,亦有利於用戶拆卸、更換硬碟40、記憶體條等元件。 The personal computer 100 of the embodiment of the present invention accommodates components such as the main board 30, the hard disk 40, and the power source 50 in the support frame 22, so that the thickness of the display screen 10 can be effectively reduced. In addition, the components of the main board 30, the hard disk 40 and the like are disposed separately from the display screen 10, which not only helps to prevent the display screen 10 from being subjected to electromagnetic interference, but also facilitates the user to disassemble and replace the components such as the hard disk 40 and the memory strip.
可理解,第一外部介面模組70、第二外部介面模組、吸入式光碟機80及散熱模組60亦可省略。若一體式電腦100使用外接硬碟,則硬碟40亦可省略。 It can be understood that the first external interface module 70, the second external interface module, the slot-in optical disc drive 80, and the heat dissipation module 60 can also be omitted. If the integrated computer 100 uses an external hard disk, the hard disk 40 can also be omitted.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之 精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Anyone who is familiar with the skill of this case is assisted by the present invention. Equivalent modifications or variations made by the spirit are to be covered by the following patents.
10‧‧‧顯示幕 10‧‧‧ display screen
20‧‧‧支撐機構 20‧‧‧Support institutions
21‧‧‧基座 21‧‧‧Base
22‧‧‧支撐架 22‧‧‧Support frame
221‧‧‧連接部 221‧‧‧Connecting Department
223‧‧‧鉸鏈結構 223‧‧‧Hinged structure
225‧‧‧凹槽 225‧‧‧ Groove
227‧‧‧收容槽 227‧‧‧storage trough
30‧‧‧主板 30‧‧‧ motherboard
40‧‧‧硬碟 40‧‧‧ Hard disk
50‧‧‧電源 50‧‧‧Power supply
60‧‧‧散熱模組 60‧‧‧ Thermal Module
70‧‧‧第一外部介面模組 70‧‧‧First external interface module
Claims (8)
Priority Applications (1)
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TW99107726A TWI468900B (en) | 2010-03-17 | 2010-03-17 | All-in-one type computer |
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TW99107726A TWI468900B (en) | 2010-03-17 | 2010-03-17 | All-in-one type computer |
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TW201133177A TW201133177A (en) | 2011-10-01 |
TWI468900B true TWI468900B (en) | 2015-01-11 |
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TW99107726A TWI468900B (en) | 2010-03-17 | 2010-03-17 | All-in-one type computer |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI634811B (en) * | 2016-12-28 | 2018-09-01 | 晶達光電股份有限公司 | Double-sided display device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104238629A (en) * | 2013-06-07 | 2014-12-24 | 鸿富锦精密工业(深圳)有限公司 | Integrated computer |
TWI634414B (en) * | 2017-07-13 | 2018-09-01 | 技嘉科技股份有限公司 | Computer system |
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US20070097609A1 (en) * | 2002-06-13 | 2007-05-03 | Gerald Moscovitch | Graphics and monitor controller assemblies in multi-screen display systems |
US20080024971A1 (en) * | 2001-04-11 | 2008-01-31 | Hewlett-Packard Development Company, L.P. | Flat panel computer having an integrally housed flat panel display |
TWM362441U (en) * | 2009-02-17 | 2009-08-01 | Giga Byte Tech Co Ltd | An electric device having a power supply device |
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Patent Citations (3)
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US20080024971A1 (en) * | 2001-04-11 | 2008-01-31 | Hewlett-Packard Development Company, L.P. | Flat panel computer having an integrally housed flat panel display |
US20070097609A1 (en) * | 2002-06-13 | 2007-05-03 | Gerald Moscovitch | Graphics and monitor controller assemblies in multi-screen display systems |
TWM362441U (en) * | 2009-02-17 | 2009-08-01 | Giga Byte Tech Co Ltd | An electric device having a power supply device |
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TWI634811B (en) * | 2016-12-28 | 2018-09-01 | 晶達光電股份有限公司 | Double-sided display device |
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