TWI377889B - Bonding apparatus - Google Patents

Description

1.377889 101. The modification of the replacement page on the 21st of the 21st. 6. Description of the Invention: [Technical Field] The present invention relates to the field of manufacturing technology of printed circuit boards, and in particular to a bonding apparatus. [Prior Art] [0002] The flexible printed circuit board (FPC) has the advantages of small size, light weight, three-dimensional assembly and dynamic flexibility, and is widely used. Among the various portable electronic products, especially mobile phones, digital cameras, handheld computers and other thin and portable electronic products. See the article Takao Yamazaki,

Yoshimichi Sogawa, Rieka Yoshino, Keiichiro Kata, Ichiro Hazeyama, and Sakae Kitajo,

Real Chip Size Three-Dimensional Stacked Package, IEEE Transactions on Advanced Packaging, 2005, 28(3), 397-403. [0003] At present, the FPC manufacturing process includes a plurality of bonding processes to meet the performance requirements of the final product. For example, the FPC surface is laminated with a conductive cloth for high FPC anti-electromagnetic interference capability. Generally, the bonding of the conductive cloth is manually adhered, that is, the soldering iron is first used to select a bonding point on the conductive cloth having the rubber surface, and the conductive cloth is aligned with the FPC, so that the rubber surface of the conductive cloth is in contact with the FPC. Then, the glue surface corresponding to the bonding point required for heating the conductive cloth by the hot pen is melted, and the rubber of the rubber surface is melted and the conductive cloth is bonded to the FPC. Finally, it is cured to bond the conductive cloth to the FPC. However, in the manual bonding process, the soldering iron is used to heat the bonding point. If the number of bonding points to be heated is large, the worker needs to select the heating bonding point one by one by using a soldering iron and a hot stamping, such as 09911226. # A0101 Page 3 of 24 1013065495-0 1377889 On February 21, 2011, the replacement page is a waste of time. It can also make the position of the contact between the hot pen and the conductive cloth deviate from the position of the actual bonding point. Thereby reducing the bonding efficiency and accuracy. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a laminating device to improve production efficiency and reduce fitting error. [0005] Hereinafter, a bonding apparatus will be described by way of embodiments.

A bonding device includes a pressing device and a heating device. The pressing device includes a first bonding plate and a second bonding plate hinged to the first bonding plate. The second bonding plate is provided with a first through hole. The heating device is fixed to the second bonding plate, and comprises a fixing plate and a heating member disposed on the fixing plate. The heating member corresponds to the first through hole for extending from the second bonding plate through the first through hole to heat the object placed between the first bonding plate and the second bonding plate for bonding.

[0007] Compared with the prior art, when the second bonding plate of the bonding device is placed on the first bonding plate, the plurality of heating members of the heating device simultaneously protrude from the second bonding plate through the first through hole at the same time, and The heat is supplied to all the bonding points of the body to be bonded, thereby completing the bonding. The laminating device saves time by heating the laminating points one by one, and reduces the positional deviation of the contact position of the heating member with the body to be attached and the actual fitting point. [Embodiment] The bonding apparatus provided in the embodiments of the present technical solution will be further described in detail below with reference to the accompanying drawings and the embodiments. Referring to FIG. 1 and FIG. 2, a first embodiment of the present invention provides a bonding apparatus 10 including a pressing device 100 and a heating device 200. The heating device _226 production order number A 〇 101 page 4 / total 24 pages 1013065495-0 1.377889 101 years _ 02 months to replace the «br 200 is fixed to the pressing device 100. [0010] The pressing device 100 includes a first bonding board 110 and a second bonding board 120 hinged to the first bonding board 11A. The first ply 11 can be rotated around the hinge to place the first ply 110 on the second ply 120 and cooperate with the second ply 120 for the first ply and the second ply The body to be attached between the plywoods 120. [0011] The first bonding plate 110 has a bearing surface 111. The bearing surface 111 is a surface facing the second bonding plate 120 when the first bonding plate 110 is rotated to be placed on the second bonding plate 120. In this embodiment, the bearing surface Π 1 is provided with a positioning member 112 for cooperating with the positioning hole of the body to be attached, and fixing the body to be attached to the bearing surface 111 to ensure accurate positioning of the body to be attached. The positioning member 112 can be disposed on the bearing surface 111 by direct fixing, sliding setting or other different manners, so that the position of the positioning member 112 at the bearing surface ill can be easily adjusted and finally fixed to the first bonding board 110. In this embodiment, the bearing surface 111 defines a plurality of first fixing holes 113, and one end of the positioning member 112 is fixed to the first fixing hole 113. Of course, the positioning member 112 can be correspondingly provided with a thread, and the first fixing hole 113 is also provided with a corresponding thread. By controlling the depth of the positioning member 112 to be screwed into the first fixing hole 113, the positioning member 112 is adjusted from the bearing surface 111. The height of the protrusion is fixed to the first bonding plate 110 by mating with the nut. The number of the first fixing holes 113 is larger than the number of the positioning members 112 to facilitate adjusting the position of the positioning member 112 on the bearing surface 111 according to different bodies to be attached. Of course, the bearing surface 111 may not be provided with the positioning member 112, and a groove corresponding to the body to be attached is opened inward from the bearing surface 111 for placing and fixing the body to be attached to the bearing surface 111. [0012] The second plywood 120 is made of metal, plastic, etc., which can withstand a high temperature of about 300 degrees. 09711226^^^ A0101 Page 5 of 24 pages 1013065495-0 1377889 101. The body to be bonded is placed between the first bonding board 110 and the second bonding board 120 to be bonded to the first bonding board 11 。. In this embodiment, the second bonding plate 120 and the first bonding plate 11 are connected by two relatively chains, and the two hinges are connected by a rotating pin to realize a rotational connection. The second bonding plate 120 has a first surface 121 and a second surface 122 disposed opposite the first surface 121. The first surface 121 is a surface facing the first bonding board 11 when the first bonding board 110 is rotated and placed on the second bonding board 120. The second surface 122 is for fixing the heating device 2 〇〇 the second bonding plate 120 defines a first through hole 123 ′ extending through the first surface 121 and the second surface 122 for accommodating the heating component of the heating device 200 . The second bonding plate 12 is further configured to open a second through hole 124 corresponding to the fixed member 11 2 . The second through hole 124 extends through the first surface 121 and the second surface 122. When the first bonding plates 11 are opposed to the second bonding plates 120, they are used to receive the positioning members 112 so that the positioning members 112 do not block the first bonding plates no. The diameter or depth of the first through hole 123 and the second through hole 124 may be the same or different. In this embodiment, the diameter of the first through hole 123 is smaller than that of the second through hole 124. [0013] In addition, the position of the positioning hole and the bonding point of the same body to be bonded are different, but for different bodies to be attached, there may be a positioning hole to be attached to the body and another body to be bonded. The position of the bonding point is the same, and the second through hole 12 4 and the first through hole 123 corresponding to the positioning hole and the bonding point respectively may be the same hole, as long as the second through hole 124 corresponding to the same object A through hole 123 can be positioned differently. Therefore, the diameters of the second through holes 124 and the first through holes 123 may also be the same. [0014] The heating device 200 includes a fixing plate 21 and a heating member 220 disposed on the fixing plate 21A. The fixing plate 21 is fixedly connected to the second surface of the second bonding board 丨2〇. 1013065495-0 09711226 Production order number Α〇101 帛6 pages/ Total 24 pages 1377889

The replacement page 122 is corrected on February 21, 101, and the heating member 220 is passed through the first through hole 123 corresponding to the heating member 220. [0015] The fixing plate 210 has a first plane 211 and a second plane 212 disposed opposite to the first plane 211. The first surface 211 is opposite to the second surface 122 of the second bonding board 120 and is fixed to the second surface 122 of the second bonding board 120 by soldering, adhesive bonding or other connection. The first plane 211 further defines a plurality of second fixing holes 214 for fixing one end of the heating member 220 to the fixing plate 210, so that the heating member 220 can be adjusted to the position of the first plane 211 in the second fixing hole 214 as needed. The number of the second fixing holes 214 of the fixing plate 210 is larger than the number of the heating members 220, so that the heating member 220 is selectively fixed to the fixing plate 210 according to the design of the bonding point of the body to be attached. Of course, the number of the second fixing holes 214 may also be equal to the number of the heating members 220. In addition, the first plane 211 of the fixing plate 210 can also open a plurality of sliding grooves having a certain length, so that the heating member 220 slides in the sliding groove and is fixed to any position of the fixing plate 210 by the cooperation with the locking member. Of course, the manner in which the heating member 220 is disposed on the first plane 211 of the fixing plate 210 can be determined according to the actual bonding needs, and is not limited to the embodiment. [0016] In this embodiment, the number of the second fixing holes 214 of the fixing plate 210 is equal to the number of the first through holes 123, and the position and size of the second fixing holes 214 correspond to the first through holes 123 so as to be fixed to The heating member 220 of each of the second fixing holes 214 has a first through hole 123 matched with the heating member 220 for the heating member 220 to pass freely, so as to satisfy the body to be attached with different bonding points. Hehe. [0017] The heating element 220 from the first plane 211 to the second table 120 of the second bonding plate 120 1013065495-0 Q9711226 production number A0101 page 7 / total 24 pages 1377889 101 February 21 shuttle replacement page 122 direction Projected with an axis perpendicular to the first plane 211. Each of the heating elements 220 extends through the first through hole 123 corresponding thereto, and protrudes from the first surface 121 of the second bonding board 120 for providing heat to be placed on the first bonding board 110 and the second bonding board 120. The point of attachment of the body to be attached. The heating element 220 is electrically connected to a power source (not shown) to heat the heating element 220 to a desired temperature, thereby providing heat by heating the heating element 220 to heat the corresponding bonding point of the component to be attached and fitting the same. object.

[0018] In order to adjust the height of the protruding portion of the heating member 220 from the first plane 211, the heating member 220 is provided with a thread. Correspondingly, the second fixing hole 21 4 is provided with a thread corresponding to the thread of the heating member 220, so that the heating member 220 and the second fixing hole 214 adjust the heating member 220 from the first plane 211 by screwing. The height. The height of the protruding portion of the heating member 220 from the first plane 211 is at least greater than the thickness of the second bonding plate 120 to ensure that the heating member 220 passes through the first through hole 123, and can be placed on the first bonding plate 110 and the second portion. The bonding points of the to-be-bonded bodies between the bonding plates 120 are in contact. [0019] In addition, after the heating member 220 is heated, the surface temperature thereof is high, and the fixing plate 210 of the fixed heating member 220 and the first through hole 123 of the second bonding plate 120 through which the heating member 220 passes are subjected to a long time. bake. Therefore, the outer surface of the heating member 220 and the end surface fixed to the fixing plate 210 can wrap the heat insulating layer to avoid damage of the bonding device 10. At this time, the end surface of the wrapped heat insulating layer is fixed to the fixing plate 210 for preventing heat transfer to the fixing plate 210, and the other end surface of the heating member 220 not wrapping the heat insulating layer is used for contacting and heating the bonding point of the body to be attached. Make a fit. The outer side of the wrapped heat insulating layer is disposed in the first through hole 123 of the second bonding plate 120, and is disposed opposite to the inner wall of the first through hole 123 for preventing heat transfer to the second bonding plate 120. In addition, the single number A〇101 page 8/24 pages 1013065495-0 1377889 101. The second day of the second hole 214 and the second through hole 214 are respectively provided with a heat insulating layer. . [0020] Referring to FIG. 3, the bonding apparatus 20 provided by the second embodiment of the present invention has substantially the same structure as the bonding apparatus 10 provided in the first embodiment, and the heating device 400 further includes an ejector device. 430. The heating device 400 is fixed to the second surface 322 of the second bonding plate 320 of the pressing device 3 by the pusher device 430. Specifically, the ejector device 430 is fixed to the second surface 322 of the second bonding board 320 by the connecting member 440, thereby forming a receiving space. The fixing plate 410 is fixed to the ejector device 430' and is located in the accommodating space formed by the second bonding plate 320 and the ejector device 430. [0021] The ejector device 430 includes a substrate 431 and a braking portion 432. The substrate 431 has a support surface 4311. The supporting surface 4311 is opposite to the fixing plate 410 and is used for fixing the braking portion 432 and fixing the second bonding plate and the 320. In this embodiment, the supporting surface 4311 of the substrate 431 is fixed to the second surface 322 of the second bonding board 320 by the connecting member 440, so that the substrate 431 and the second bonding board are disposed in parallel, so that the substrate 431 and the first The two bonding plates 32 〇 form a space for accommodating the braking portion 432 and the fixing plate 410. The substrate 431 and the second bonding plate 32 〇 can also be fixed or fixed by integral molding, and the fixing manner can be according to the bonding device. [0022] The braking portion 432 is fixed to the supporting surface 4311 of the substrate 431 for driving the fixing plate 410 and the heating member 420 to reciprocate. The reciprocating motion is repeated for the fixing plate 410 to be close to or away from the first The movement of the second bonding plate 320 causes the heating member 420 disposed on the fixing plate 410 to be extended or retracted from the first through hole 323 of the second bonding plate 320 by the fixing plate 41. The ejector device 430 can be According to the need to design a different structure, as long as the heating element can be realized 42〇A0101 page 9 / 24 pages 1013065495-0 1377889 101 February 2011 revised replacement page [0023] [0024] [0025] 0971122# single number It can be expanded and contracted. In this embodiment, push The device 430 includes three braking portions 432 having the same structure and model. The three braking portions 432 are linearly arranged in the center of the substrate 431. It can be understood that the size, thickness, and the number of preset fittings of the components to be attached are The design of the ejector device 4 3 亦 also needs to be changed accordingly. For example, the area of the body to be attached is small, and the area of the fixing plate 410 is also small, and the ejector unit 43 only needs to provide a single braking portion 432. The ejector fixing plate 410 works normally. Conversely, if the area of the body to be attached is large, the fixing plate 410 needs to be enlarged correspondingly, and at this time, a few braking parts 0 432 may not be able to push the fixing plate 41 to work normally. In addition, an auxiliary ejector member may be added to the substrate 431 to assist the movement of the ejector fixing plate 41 使 to reciprocate the fixed slab 410 at the same time by the same urging force, thereby ensuring that each of the fixing plates 410 is disposed. The heating members 420 can all protrude or retract from the first through holes 323 at the same time, and the heating member 420 has the same amount of change from the first surface 321 of the second bonding plate 320. The auxiliary ejector member can be elastic. The support member or other retractable support member is preferably adapted to not affect the movement of the fixed plate 41. φ The brake portion 432 includes a push top 4321, a brake 4322, and a control portion 4323. The push top 4321 is disposed at the end of the brake 4322. The other end of the push top portion 4321 is fixed to the fixed plate 410 by the driving of the brake 4322, so that the fixing plate 41 can be reciprocated between the second bonding plate 320 and the substrate 431 by the pushing top 4321. The expansion and contraction of the heating member 420 in the first through hole 323 is achieved. The stopper 4322 is fixed to the support surface 4311 of the substrate 431 for providing the urging power to the push top 4321. In this embodiment, the brake 4322 is a gas A0101 first page / a total of 24 pages 1013065495-0 1377889 101 · year. February 21st shuttle is the g-page pressure pushing device, that is, the brake 4322 is provided with a pneumatic valve (Figure Not shown). The air pressure valve draws in and releases the gas to cause the heating member 42 to protrude or retract in the first through hole 323 of the second bonding plate 320. Of course, the brake 4322 can also be a hydraulic ejector, an electric ejector, a hydraulic ejector or a device that can be used for ejector. The 戎 control unit 4323 is coupled to the brake 4322 to control the actuation of the brake 4322. In the present embodiment, the 'three brakes 4322 are simultaneously electrically connected to the same control unit 4323' for simultaneously controlling the actuation of the three brakes 4322. In conjunction with the pneumatic ejector of the brake 4322, the control unit 4323 is designed as a pedal controller that presses the pedal to draw the gas and release gas from the pneumatic valve of the brake 4322 to cause the heating element 42 to smash onto the second laminate 320. The first through hole 323 is extended or retracted, which is convenient for the staff to use hands and feet and save time. It can be understood that the control unit 4323 can also be a single or other quantity, which can also be a manual controller, an automatic controller or other forms of controller, so that the brake 4322 can be conveniently controlled. [0027] Referring to FIG. 3 to FIG. 5, the following is a description of the use of the bonding device 20 provided by the embodiment of the present invention, which includes the following steps. [0028] The first step: providing the circuit board 40 and the conductive cloth 30 » [0029] As shown in FIG. 4, the circuit board 4 is a circuit board 40 which has been fabricated and adhered to the protective layer. The circuit board 4 includes a peripheral portion 42 of the plurality of circuit board units 41 and the circuit board unit 41. The circuit board unit 41 corresponds to an area enclosed by a broken line in the circuit board 40 of Fig. 4. The circuit board 4 has a bonding surface 43 and a fixing surface 44 disposed opposite to the bonding surface 43. The bonding surface 43 is used for bonding conductive 1013065495-0 09711226_单号儿〇1〇1 page V total 24 pages 1377889 On February 21, 101, Shuttle was replacing page cloth 30. The peripheral region 42 is provided with a circuit board positioning hole 45 for positioning of the positioning member 312 of the bonding device 20. The board positioning holes 45 can be single or plural.

[0030] The conductive cloth 30 has a rubber surface 33. The surface 33 has no viscosity when it is solid, and has viscosity when heated to a molten state. If the molten rubber surface 33 is brought into contact with other objects, the conductive cloth 30 will be firmly adhered to the object after curing. The conductive cloth 30 further has a bonding point 31 and defines a conductive cloth positioning hole 32. The bonding point 31 is a region where the conductive cloth 30 and the circuit board 40 are bonded to each other by the rubber surface 33, and corresponds to a region enclosed by a broken line in the conductive cloth 30 of Fig. 4. The conductive cloth positioning hole 32 corresponds to the circuit board positioning hole 45 of the circuit board 40 for positioning of the positioning member 312. When the positioning member 312 passes through the corresponding conductive cloth positioning hole 32 and the circuit board positioning hole 45, the circuit board 40 and the conductive cloth 30 can be accurately positioned 'to satisfy the circuit unit 41 of the circuit board 40 completely covered by the conductive cloth 30, and The bonding point 31 is located on the conductive cloth 30 and the corresponding area of the peripheral unit 42 for subsequent bonding. [〇〇31] The second step: the conductive cloth 30 and the circuit board 40 are sequentially placed on the first bonding board 310 of the bonding apparatus 2 to perform positioning. [〇〇32] According to the position and axial length of the respective positioning holes of the circuit board 40 and the conductive cloth 30, the positioning member 312 of the appropriate size and height is selected, and the height of the outwardly protruding portion of the positioning member 312 from the bearing surface 311 is adjusted. And corresponding to the board positioning hole 45 at the position of the bearing surface 311, and fixing the positioning member 312 to the first bonding board 310. Page 12 of 24 C〇33] The fixing surface 44 of the circuit board 40 faces the first bonding board 31, and the positioning member 312 passes through the circuit board positioning hole 45 of the corresponding circuit board 4, and is placed on the first sticker. 〇9711226 households, single dock number Α0101 1013065495-0 1.377889 101.02.21, the shuttle is replacing the plywood 310' to bring the fixing surface 44 into contact with the bearing surface 311. The winning surface 33 of the conductive cloth 30 is placed on the bonding surface 43 of the circuit board 40, and is placed on the bonding surface 43. The positioning member 312 passes through the corresponding conductive cloth positioning hole 32 of the conductive cloth 30 to complete the conductive cloth 30 and The positioning of the circuit board 40. Thereby, the conductive cloth 3〇 and the circuit board 4〇 which have been accurately positioned and overlapped are obtained. [0034] The third step: bonding the conductive cloth 30 and the circuit board 40. [0035] According to the position of the bonding point 31 of the conductive cloth 3, the heating member 420 of the bonding device 20 is adjusted to the position of the fixing plate 410 so as to correspond to the bonding point 31, and the heating member 420 is fixed and fixed. The position of the heating element 420 and the bonding point 31 in the plate 41 表示 here indicates that the end of the heating element 420 is in contact with the bonding point 31 when the second bonding plate 320 is disposed on the first bonding plate 310. [0036] rotating the second bonding plate 320 along the hinge to bring the second bonding plate 320 toward the first bonding plate 310 until the first surface 321 of the second bonding plate 32 is parallel to the bearing surface 311 of the first bonding plate 310. Settings. At the same time, the heating element 420 is energized to raise it to the desired temperature. In this embodiment, the melting point of the rubber surface 33 is greater than or specific to the degree, and accordingly, the heating member 420 is heated to 3 degrees or more than 300 degrees. [37] When the control unit 4323 activates the brake 4322, the fixing plate 41 is brought closer to the second bonding plate 320, so that the heating member 42 that has been heated to a desired temperature is driven by the fixing plate 410. The first through hole 323 of the second bonding plate 320 protrudes from the first surface 321 and is in contact with the bonding point 31 of the conductive cloth 30. At this time, the heating member 420 provides heat to the bonding point 31 to make the bonding point. The glue in zone 31 is heated to a molten state and bonded to the circuit board 4〇. Then, similarly to the actuating brake 4322, the control unit 4323 is used to make the ejector device 13th/total 24 page 09711226"^ single number A01〇l 1013065495-0 1377889, the 21st of the 21st, the replacement of the 430 brake 4322 The fixing plate 410 is remote from the second bonding plate 32 〇 to drive the heating member 420 into the first through hole 323 from the first surface 321 . At this time, the heated bonding point 31 is cooled and solidified, and the conductive cloth 3 is firmly bonded to the bonding surface 43 of the circuit board 40. In the present embodiment, the control unit 4323 is a pedal controller, and the brake 4322 is a pneumatic ejector device. Therefore, by pressing the pedal of the control portion 4323, the brake 4322 is inhaled to bring the fixing plate 410 close to the second sticker. The plate member 320 has a heating member 420 extending through the first through hole 323 from the second bonding plate 32. Then, the pedal of the stepped control unit 4323 is opened, and the brake 4322 is released to move the fixing plate 410 away from the second bonding plate 32, and the heating member 420 is retracted from the second bonding plate 320 into the first through hole 323. Inside. [0039] The fourth step: removing the bonded circuit board 4〇 and the conductive cloth 3〇. [0040] rotating the second bonding board 320 away from the first bonding board 31 () along the hinge, and removing the integrated conductive cloth 3 and the circuit board 40' from the bearing surface 311 of the first bonding board 310. Subsequent operations such as cutting the rod. [0041] Of course, if the circuit board 40 needs to be double-sidedly attached to the conductive cloth 3, the same operation process can be continued on the other side of the circuit board 40 to complete the double-sided bonding of the conductive cloth 30. [〇〇42] In summary, the invention has indeed met the requirements of the invention patent and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. [Simple diagram description] 1013065495-0

09711226^*^ A0101 ^ 14 I / * 24 I 1377889 101. February 21st revised replacement page [0043] Fig. 1 is a perspective exploded view of the bonding apparatus provided by the first embodiment of the present technical solution. 2 is a perspective view of a bonding apparatus provided in a first embodiment of the present technical solution. 3 is a perspective exploded view of a bonding apparatus according to a second embodiment of the present technical solution. 4 is an exploded perspective view of a circuit board to be bonded and a conductive cloth provided by an embodiment of the present technical solution. [0047] FIG. 5 is a schematic view showing a state in which the bonding apparatus provided in the second embodiment of the present invention is attached to the circuit board and the conductive cloth in FIG. [Main component symbol description] Laminating device: 10, 20 [0049] Pressing device: 100, 300 [0050] First plywood: 110, 310 [0051] Bearing surface: 111, 311 [0052 Positioning member: 112, 312 [0053] First fixing hole: 11 3 [0054] Second bonding plate: 120, 320 [0055] First surface: 121, 321 [0056] Second surface: 122, 322 [0057] ] First through hole: 123, 323 [0058] Second through hole: 124 09711226^^ A〇101 Page 15 / Total 24 page 1013065495-0 1377889 [0059] Heating device: 200 ' 4 [0060] Fixing plate: 210, 410 [0061] First plane: 211 [0062] Second plane: 212 [0063] Second fixing hole: 214 [0064] Heating element: 220, 420 [0065] Ejecting device: 430 [0066] Substrate: 431 [0067] Support surface: 4311 [0068] Brake: 432 [0069] Push top: 4321 [0070] Brake: 4322 [0071] Control: 4323 [0072] Connector: 440 [0073] Conductive cloth: 30 [ 0074] Fitting point: 31 [0075] Conductive cloth positioning hole: 32 [0076] Glue surface: 33 [0077] Circuit board: 40 Single number A〇101 Page 16 / Total 24 pages 101 February 21 Day correction replacement page 1013065495-0

1.377889 101.02.21 Modified replacement 100 [0078] Circuit board unit: 41 [0079] Peripheral area: 42 [0080] Fitting surface: 43 [0081] Fixed surface: 44 [0082] Board positioning hole: 45

〇9711226f Single number A〇101 Page 17 of 24 1013065495-0

Claims (1)

1377889 February 21, 101 Nuclear Replacement Hundred Seven, Patent Application Range: 1. A fitting device comprising a pressing device and a heating device, the pressing device comprising a first bonding plate and hinged to the first bonding plate a second bonding plate, the second bonding plate is provided with a first through hole; the heating device is fixed to the second bonding plate, and comprises a fixing plate and a heating member disposed on the fixing plate, the heating element and the first through hole The holes correspond to extend from the second bonding plate through the first through holes to heat the object placed between the first bonding plate and the second bonding plate for bonding. 2. The bonding device of claim 1, wherein the first bonding plate has a bearing surface and is provided with a positioning member, the bearing surface defines a first fixing hole, and the positioning member is fixed to the first fixing In the hole, the number of fixing holes is larger than the number of the positioning members. The bonding device of claim 2, wherein the second bonding plate defines a second through hole corresponding to the positioning member for receiving the positioning member. 4. The laminating device of claim 1, wherein the fixing plate is fixed to the second plywood. 5. The bonding device of claim 1, wherein the fixing plate has a first plane and a second plane disposed opposite to the first plane, the first plane being opposite to the second bonding board, and There is a second fixing hole, and one end of the heating member is fixed in the second fixing hole. 6. The bonding apparatus of claim 5, wherein the first through hole and the inner wall of the second fixing hole are respectively provided with a heat insulating layer. 7. The laminating device of claim 5, wherein the number of fixing holes of the heating member is larger than the number of heating members. 8. The laminating device according to claim 1, wherein the heating order number A_ page 18/24 pages 1013065495-0 1377889 on February 21, 2011, the shuttle replacement page further includes a push The top device is fixed to the second bonding plate, and the fixing plate is fixed to the ejector device and located between the ejector device and the second bonding plate. 9. The bonding device of claim 8, wherein the ejector device comprises a substrate and a braking portion; the braking portion includes a push top, a brake fixed to the substrate, and a controller; the push top end is disposed at The brake is provided with a fixing plate at the other end, and the controller is used for controlling the reciprocating movement of the brake driving push top pushing fixing plate between the substrate and the second bonding plate, so that the heating member moves with the fixing plate to the first of the second bonding plate. The through hole is extended and retracted. 10. The laminating device according to claim 9, wherein the brake is a pneumatic ejector device, and the control portion is a pedal controller. 11. The laminating device of claim 9, wherein the ejector device further comprises an auxiliary ejector member, the auxiliary ejector member being fixed to the substrate. 12. The laminating device according to claim 1, wherein the outer side of the heating member and the end surface fixed to the fixing plate are wrapped with a heat insulating layer. Single No. A0101 Page 19 of 24 1013065495-0