TWI377646B - Substrate structures applied in flexible electrical devices and fabrication method thereof - Google Patents

Substrate structures applied in flexible electrical devices and fabrication method thereof Download PDF

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TWI377646B
TWI377646B TW098126043A TW98126043A TWI377646B TW I377646 B TWI377646 B TW I377646B TW 098126043 A TW098126043 A TW 098126043A TW 98126043 A TW98126043 A TW 98126043A TW I377646 B TWI377646 B TW I377646B
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Taiwan
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substrate
release layer
flexible
flexible substrate
resin
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TW098126043A
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TW201106447A (en
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Yueh Chuan Huang
Chyi Ming Leu
Tien Shou Shieh
Chi Fu Tseng
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Priority to US12/629,019 priority patent/US8182892B2/en
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

1377646 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種基板結構，特別是有關於一種應 用於軟性電子元件之基板結構及其製造方法。 【先前技術】 軟性顯示器已成為新世代新穎顯示器的發展趨勢，而 發展主動式軟性顯不益更是主流趙勢，世界各大研發公司 均由現行厚重且易破碎的玻璃基板跨入非玻璃系且重量更 輕的軟性塑膠基板材料發展，並朝向主動式全彩的TFT顯 示面板邁進。目前，針對開發主動式軟性顯示器的技術有 a-Si TFT、LPTS TFT及〇ρΤ三種選擇，在顯示介質的部 分包含 EPD、ECD、LCD 及 EL。 在製造方式的選擇可以分成batch type及roll to roll 兩種方式’若選擇batch type方式進行TFT元件製造，可 利用現有TFT設備進行製作，具有相當優勢，但必須發展 所謂基板轉移或離膜技術，將軟性顯示器從玻璃上轉移到 其它塑耀·基板上或取下。而以roll to roll方式則必須利用 全新設備來進行’並必須克服轉動及接觸所引發的相關問 題。 以batch type方式進行製造TFT結構主要有三種方 式，一為SEC利用PES當基板轉貼於石夕晶片上，利用低溫 a-Si TFT 技術開發 7” VGA (640x480) plastic LCD，而此法 需要一耐高溫、低熱膨脹係數、低光遲滯性且抗化性佳的 高透明基板材料’並配合適當的膠材及良好的離型技術。 1377646 二為Seiko Epson以LPTS transfer技術進行TFT背板開 發，於玻璃基板上進行LPTS TFT背板製作，完成後，Seiko Epson再利用雷射回火（laser annealing)。所謂transfer技術 主要優點為TFT元件製程溫度不受塑膠基板的限制，因 此’有較好的特性，故一般具高透光性塑膠基板便可以被 用來使用，但其transfer機制及轉貼技術顯得更加重要。另 外’第三種為Philips利用聚亞醯胺(PI)塗佈於玻璃上，進 行a-Si TFT-EPD顯示器的開發，並利用transfer技術將pi 基板於玻璃上取下。此技術雖然利用傳統PI塑膠基板而具 有耐高溫的特性，直接塗佈於玻璃上，不但製程溫度可以 超過300 C，又可以省去轉貼的步驟，但仍必須利用雷射 去除玻璃基板。 I發明内容】 本發明之實施例，提供一種應用於軟性電子元件之
基板結構，包括：-切髓；—軟性基板，與該支撑載 體相對置，.離H層，形成於該軟性基板相對於該支撐 載體之Φ上’以及一膠材，形成於該支撲载體與該離型 層與該軟&基板之間，其中該膠材之面積大於該離型層之 面積且該，材對該軟性基板之密著度大於該離 軟性基板之密著度。 本發明之一實施例， 基板結構之製造方法，2供:種應用於軟性電子元件之 ^ ^ 匕括.耠供一支撐載體；提供一軟 土 ；h支撐載體；形成一離型層於該軟性基板 相對於該支撐載體之一面、 板與該離型層於該支 :以及以—膠材固定該軟性基 離型層之面積，且 膠材之面積大於該 型層對該軟性基板之轉度奸性基板之密著度大於該離 驟包括塗佈該膠材於。層:該支撐裁體上之步 支撐載體與該離型層與該軟性’ 該膠材結合該 離型層與該她基板相 2 =疋—轉材於該 本發明主要===_載體。 上的基板結構^於軟性電子或相關軟性產業 -膠材與一支严巷二：構包含-軟性基板、-離型層、 不佳，而膠^私/、t用離型材料與軟性基板密著度 擇載體上二:、人性基板密著度甚佳的特性，使轉貼於支 有:=基板在後續製程中不致脫落，並在完成所 技社旦姑可幸里易分離。本發明可使在支撐載體上之製程 1易轉移至軟性基板上’並在軟性基板上製作高精密 度之晝素。 為讓本發明之上述目的、特徵及優點能更明顯易懂， 寺牛較佳實施例’並配合所附圖式，作詳細說明如 下： 【實施方式】 #%參閱第1圖，根據一實施例，說明本發明應用於軟 包子凡件之基板結構。一基板結構10包括一支撐載體 1377646 首先’於10cm*10cm的PEN基板上鍍上8cm*8cm的 parylene (3〇〇nm)。之後，塗佈100μπι的環氧樹脂膠材於 l〇cm*l〇cm的玻璃上。接著，以80〇c預烤2〇min，並以壓 合機將鍍上parylene的PEN基板黏合於塗有環氧樹脂膠 材的玻璃上。之後，放入烘箱，以15〇〇C硬烤6〇min，即 完成本實施例聚萘二甲酸乙二醇酯（PEN)/paryiene/環氧樹 脂/玻璃基板結構之製作。 離膜測試·續以刀片於7.5cm*7.5cm的位置切開，此 • 部份可輕易將pen基板與玻璃分離，而其他部分與玻璃密 著良好’不會與玻璃分開，結果如表一所示。 I實施例3】 .‘ .， * · · - +: - 聚萘二甲酸乙二醇酯（PEN)/parylene/環氧樹脂/玻璃 基板結構之製作及離膜測試 首先，於10cm*l〇cm的PEN基板上鍍上8cm*8cm的
Parylene(300nm)。之後，塗佈1〇Ομΐη的環氧樹脂膠材於鍍 上Parylene的ΡΕΝ基板。接著，以80〇C預烤20min，並 以壓合機將塗有環氧樹脂膠材且鍍上parylene的pEN基 板黏合於玻璃上。之後，放入烘箱，以15〇〇c硬烤6〇min， 即完成本實施例聚萘二甲酸乙二醇酯(pEN)/parylene/環氧 樹脂/玻璃基板結構之製作。 離膜測試：續以刀片於75em*75em的位置切開，此 部份可輕M PEN基板與麵分離，而其他部分*玻璃密 著良好，不會與玻璃分開，結果如表一所示。 1377646 【實施例4】 聚萘二甲酸乙二醇酯（PEN)/Zeonor/環氧樹脂/玻璃基 板結構之製作及離膜測試 首先’將3wt%的Zeonor溶於二曱苯(xylene)。之後’ 利用 50μηι 刮刀塗佈 8cm*8crn 的 Zeonor 於 10cm*10cm 的 PEN基板’並於5〇〇c與12〇〇c下各烘5min。接著，塗佈 的環氧樹脂膠材於10cm*10cm的玻璃上。之後，以 80oC預烤2〇min ’並以壓合機將塗有zeonor的PEN基板 黏合於塗有環氧樹脂膠材的玻璃上。接著，放入烘箱，以 150°C硬烤60min’即完成本實施例聚萘二曱酸乙二醇酯 (PEN)/Zeonor/環氧樹脂/玻璃基板結構之製作。 .離膜測試:續以刀片於7.5cm*7.5cm的位置切開，此 部份可輕易將PEN基板與破璃分離，而其他部分與玻璃密 著良好’不會與破璃分開，結果如表一所示。 【實施例5】 聚萘二曱睃乙二醇酯（PEN)/Zeonor/環氧樹脂/玻璃基 板結構之製作及雜膜測試 首先’將3wt%的Zeonor溶於二甲苯(xylene)。之後， 利用 ΙΟΟμιη 刮刀塗饰 8cm*gcin 的 Zeonor 於 l〇cm*l〇cm 的 PEN基板’並於5〇〇c與120°C下各烘5min。接著，塗佈 1〇〇μΠ1的環氧樹脂膠材於塗有Zeonor的PEN基板。之後， 以80°C預烤2〇min，並以壓合機將塗有環氧樹脂膠材及 Zeonor的；p£N基板黏合於玻璃上。接著，放入焕箱，以 150°C硬烤6〇min，即完成本實施例聚萘二甲酸乙二醇酯 12 1377646 (PEN)/Zeonor/環氧樹脂/玻璃基板結構之製作。 離膜測試·續以刀片於7.5cm*7.5cm的位置切開，此 部份可輕易將PEN基板與破璃分離，而其他部分與玻璃密 者良好，不會與玻璃分開’結果如表一所示。 【實施例6】 聚乙稀對苯二甲酸醋（PET)/parylene/環氧樹脂/玻璃 基板結構之製作及離膜測試 首先’於10cm*10cm的PET基板上鍍上8cm*8cm的 parylene (300nm)。之後，塗佈ι〇〇μιη的環氧樹脂膠材於 10cm*10cm的玻璃上。接著，以壓合機將鍍上parylene的 PET基板黏合於塗有環氧樹脂膠材的玻璃上。之後，放入 烘箱，以100°C硬烤60mih，即完成本實施例聚乙烯對苯 二曱酸酯（PET)/parylene/環氧樹脂/玻璃基板結構之製作。 離膜測試：續以刀片於7.5cm*7.5cm的位置切開，此 部份可輕易將PET基板與玻璃分離，而其他部分與玻璃密 著良好，不會與玻璃分開，結果如表一所示。 【實施例7】 聚乙烯對苯二甲睃酯（PET)/parylene/環氧樹脂/破璃 基板結構之製作及離膜測試 首先’於10cm*10cm的PET基板上鍍上8cm*8cm的 parylene (300nm)。之後’塗佈ΐΟΟμϊη的環氧樹脂膠材於鍍 上parylene的PET基板。接著，以壓合機將塗有環氧樹脂 膠材且鍍上parylene的PET基板黏合於玻璃上。之後，放 13 1377646 =烘箱，以100°C硬烤60min，即完成本實施例聚乙烯姆 苯二曱酸酯（PET)/paTylene/環氧樹脂/破璃基板結構之制 、 作。 衣 離膜測試：續以刀片於7.5cm*7 5cm的位置切開此 部份可輕易將PET基板與破璃分離，而其他部分與玻璃密 著良好，不會與玻璃分開，結果如表一所示。 … 【比較實施例1】 聚萘二甲酸乙二醇酯（PEN)/環氧樹脂/玻璃基板結構鲁 之製作及離膜測試 首先，於lOcmMOcm的PEN基板上塗上100μιη的環 氧樹脂膠材。接著，以80〇C預烤2〇min，並以壓合機將塗 有環氧樹脂膠材的PEN基板黏合於破璃上。之後，放入烘 箱’以150°C硬烤60min，即完成聚萘二甲酸乙二醇酯 (PEN)/環氧樹脂/玻璃基板結構之製作。 離膜測試：續以刀片於7.5cm*7.5cm的位置切開，結 果發現，PEN基板無法與玻璃分開，結果如表一所示。 φ 表一 實施例 軟性 基板J 離型層 膠材厚度/ 基材 貼合條件 結果 實施例2 PEN parylene ΙΟΟμπι/ 80°C/20min 貼合良好， 玻璃 150°C/60min 離膜測試 OK 實施例3 PEN parylene ΙΟΟμπι/ 80°C/20min 貼合良好， 1377646
parylene/PEN 150°C/60min 離膜測試 OK 實施例4 PEN Zeonor ΙΟΟμηι/ 玻璃 80°C/20min 150°C/60min 貼合良好， 離膜測試 OK 實施例5 PEN Zeonor ΙΟΟμηι/ Zeonor/PEN 80°C/20min 150°C/60min 貼合良好， 離膜測試 OK 實施例6 PET parylene ΙΟΟμηι/ 破璃 100°C/60min 貼合良好， 離膜測試 OK .實施.例7 . PET parylene ΙΟΟμηι/ parylene/PET 100°C/60min 貼合良好， 離膜測試 OK 比較 實施例1 PEN 無 1 ΟΟμπι/ PEN 80°C/20min 150°C/60min 貼合良好， 離膜測試 NG 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此項技藝者，在不脫離本發明之精 神和範圍内，當可作更動與潤飾，因此本發明之保護範圍 當視後附之申請專利範圍所界定者為準。 15 1377646 【圖式簡單說明】 第1圖係根據本發明之一實施例，一種應用於軟性電 子元件之基板結構剖面示意圖。 第2A〜2C圖係為本發明之一實施例，一種應用於軟性 電子元件之基板結構製造方法剖面示意圖。 第3A〜3C圖係為本發明之一實施例，一種應用於軟性 電子元件之基板結構製造方法剖面示意圖。 【主要元件符號說明】 10〜基板結構， 12〜支撐載體； 14〜軟性基板.； 16〜離型層； 18〜膠材， A1〜離型層面積； A2〜膠材面積。

Claims (1)

1377646 - 七、申請專利範圍： L 一種應用於軟性電子元件之基板結構，包括： 一支撐载體； 一軟性基板，與該支撐载體相對設置； 離型層，形成於該軟性基板相對於該支撐載體之一 面上；以及 膠材，形成於該支撐载體與該離型層與該軟性基板 之間，其中該膠材之面積大於該離塑層之面積，且該膠材 對該軟性基板之密著度大於該離型層對該軟性基板之密著 度。 2.如申請專利範圍第1項所述之應用於軟性電子元 件之基板結構，其中該離型層對該軟性基板之密著度為 0B。 3.如申請專利範圍第1項所述之應用於軟性電子元 件之基板結構’其中該膠材對該軟性基板之密著度為 1 〜5B 〇 4·如申請專利範圍第1項所述之應用於軟性電子元 件之基板結構其中該支撐載體包括玻璃或矽晶圓。 5.如申請專利範圍第1項所述之應用於軟性電子元 件之基板結構’其中該軟性基板包括聚亞酿胺(polyimide, PI)、聚碳酸酯（polycarbonate，PC)、聚醚楓(p〇iyethersulfone， PES)、聚丙烯酸酯（polyacrylate，PA)、聚原冰烯 (polynorbornene，PNB)、聚乙烯對苯二曱酸酯（p〇lyethylene terephthalate, PET)、聚醚醚酮（p〇iyetheretherket〇ne， 17 1377646 PEEK)、聚萘二甲酸乙二醇酯（Po^yethykne naphthalate， pen)、聚醚亞醯胺(p〇1yetherimide,PEI)或金屬。 6. 如申請專利範圍第1項所述之應用於軟性電子元 件之基板結構，其中該離型層包括聚對二甲苯(Parykne)或 環稀共聚物（cyclic 〇lefin c〇p〇1ymers，c〇c)。 7. 如申請專利範圍第1項所述之應用於軟性電子元 件之基板結構，其中該膠材包括紫外光硬化型樹脂、熱硬 化型樹脂或紫外光加熱硬化型樹脂。 8. 如申請專利範圍第7項所述之應用於軟性電子元 件之基板結構，其中該膠材包括壓克力樹脂、環氧樹脂、 經壓克力樹脂改質之環氧樹脂、聚氨基曱酸樹脂、矽氧烷 樹脂、聚醯胺樹脂、酮醛缚脂、酚醛樹脂、呋喃樹脂、脲 醛樹脂或其混合物。 9· 一種應用於軟性電子元件之基板結構之製 法，包括： ，供一支擇载體； 提供軟性基板，相對於該支標載體； 之 上；以及 、=離型層於該軟性基板相對於該支樓載體 Μ及 上，其中^膠疋該軟性基板與該離型層於該支撐載骨 該軟性美^之面積大於該離型層之面積，且該膠材重 度。土 费著度大於該離型層對該軟性基板之密^ IV·/·如 件之基板結構:製=第=== 1377646 ' 式形成於該軟性基板相對於該支撐載體之一面上。 11. 如申請專利範圍第9項所述之應用於軟性電子元 件之基板結構之製造方法，其中固定該軟性基板與該離型 層於該支撐載體上之步驟包括塗佈該膠材於該支撐載體 上，以及以該膠材結合該支撐截體與該離型層與該軟性基 板。 12. 如申請專利範圍第9項所述之應用於軟性電子元 件之基板結構之製造方法，其中固定該軟性基板與該離型 • 層於該支撐載體上之步驟包括塗佈該膠材於該離型層與該 • 軟性基板相對於該支撐載體之一面上，以及以該膠材結合 該軟性基板與該離型層與該支撐載體。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012102131A1 (de) 2011-03-18 2013-04-11 Eternal Chemical Co., Ltd. Verfahren zur Herstellung eines flexiblen Bauelements

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419091B (zh) * 2009-02-10 2013-12-11 Ind Tech Res Inst 可轉移的可撓式電子裝置結構及可撓式電子裝置的製造方法
TWI433625B (zh) 2011-07-04 2014-04-01 Ind Tech Res Inst 軟性電子元件的製法
CN103137629B (zh) * 2011-11-25 2016-01-20 群康科技(深圳)有限公司 软性基板、具有该软性基板的显示装置及其制造方法
TWI491324B (zh) * 2011-11-25 2015-07-01 群康科技(深圳)有限公司 軟性基板、具有其之顯示裝置及其製造方法
TWI469872B (zh) 2011-12-13 2015-01-21 Ind Tech Res Inst 低熱膨脹係數聚酯薄膜與其形成方法
WO2013119737A2 (en) * 2012-02-08 2013-08-15 Corning Incorporated Processing flexible glass with a carrier
TWI615367B (zh) 2012-10-12 2018-02-21 康寧公司 具有保留強度之物品
KR101978371B1 (ko) * 2012-10-29 2019-05-15 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조 방법
US9023448B2 (en) * 2013-02-22 2015-05-05 Industrial Technology Research Institute Substrate structures applied in flexible devices
KR20140122677A (ko) * 2013-04-09 2014-10-20 주식회사 엘지화학 폴리이미드계 필름 및 이의 제조방법
US9302248B2 (en) * 2013-04-10 2016-04-05 Evonik Corporation Particulate superabsorbent polymer composition having improved stability
TW201500306A (zh) * 2013-05-22 2015-01-01 Corning Inc 利用玻璃載體處理可撓性薄片玻璃基板之方法
CN104512075B (zh) 2013-10-04 2017-06-23 财团法人工业技术研究院 离型层、基板结构、与柔性电子元件工艺
CN105024018B (zh) * 2014-04-29 2018-05-08 Tcl集团股份有限公司 一种柔性显示器及其制作方法
CN105098088B (zh) * 2014-05-05 2017-06-06 Tcl集团股份有限公司 一种柔性显示器及其薄膜封装方法
CN105321428B (zh) * 2014-08-04 2018-03-30 上海和辉光电有限公司 一种柔性显示器件的离型方法
US10074816B2 (en) 2014-12-22 2018-09-11 Industrial Technology Research Institute Substrate structure for electronic device and production method thereof
CN109192077B (zh) * 2018-11-07 2019-09-03 深圳秋田微电子股份有限公司 柔性液晶显示装置的制作方法
CN110289372A (zh) * 2019-07-02 2019-09-27 京东方科技集团股份有限公司 一种显示面板、显示装置和有机发光组件的封装方法
US11589464B2 (en) 2020-12-22 2023-02-21 Hamilton Sundstrand Corporation Protective coating for electrical components and method of making the protective coating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6589623B2 (en) * 2001-03-22 2003-07-08 Ncr Corporation Duplex label pocket
KR101170845B1 (ko) * 2003-02-05 2012-08-02 후루카와 덴키 고교 가부시키가이샤 다이싱 다이본딩 테이프
GB0327093D0 (en) * 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
US8147640B2 (en) * 2005-05-13 2012-04-03 Lg Display Co., Ltd. Fabricating method of flexible display
TWI276191B (en) * 2005-08-30 2007-03-11 Ind Tech Res Inst Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
KR100831562B1 (ko) 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
US20080176477A1 (en) * 2007-01-19 2008-07-24 Samsung Electronics Co., Ltd. Method for manufacturing a display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012102131A1 (de) 2011-03-18 2013-04-11 Eternal Chemical Co., Ltd. Verfahren zur Herstellung eines flexiblen Bauelements

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