1377007 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種散熱H尤其是__種可供同時 連接數種熱源的散熱模組。 【先前技術】 現今各式電子產品於實際運作過程中，容易產生各 種熱源’因此，為使電子產品可正常運作，通常會於熱源 之預定部位結合散熱模組，以避免電子產品因過熱而損 壞。 请參照第1圖所示，如中華民國第M358217號「風 扇固定架」專利案’係揭示第-種習知散熱模組7，該散 熱模組7包含一散熱鰭片組71、數個熱導管72及一風扇 73。該散熱鰭片組71具有複數散熱鰭片711;該數個熱 導官72插設於該複數散熱鰭片711，以加速熱傳導效 果，該風扇73結合於該散熱鰭片組71之一端。藉此，該 散熱鰭片組71可結合於電子產品之—熱源（如中央處裡 單兀、主機板、各種電子晶片或發光模組等），以利用該 散熱韓片組71及該熱導管72傳導該熱源所產生的高熱， 並配合該風扇73導引氣流對該散熱則組71強制進行散 熱，使該電子產品可正常運作。 然而，前述第一種習知散熱模組7在實際使用時， 仍具有如下所述之諸多問題： 1、不易安裝於電子產品：由於該散熱鰭片組71係 結合於該風扇73之—側端，因此，兩者相互結合後所構 ^的該散熱模組7之體積及軸向高度並不易縮減；當 產品之熱源周遭可供該散熱模組7組裝空叫目當有 則容易造成錄熱模組7在喊上受到崎 利完成安裝作業。 …、遗貭 〜2,m容易受限：該習知散熱模組7必須透過 ㈣散热鳍物/1正確地結合於雜源之駄a卩位 可提供财之散減果，故造成目前市面上常見之相 型的散熱额7，基本上皆僅適驗結合單__，而較 不適用於㈣結合各種不同熱源，因此，i知散熱漁7 在實際使用上亦受到相當大的限制。 3、板裝便利性不佳：該習知散熱模組7欲進行散 熱時，仍必須先將該散細；：；組71與該風扇η相互址 結合後’柯針對㈣子產品之_進行絲，因此 組裝使用上相當不便。 4、 結構娜：該習知散熱難7之構件繁多且結 構組成亦树獅，導致製造成本偏高，並相對造成該習 知散熱模組7不易設計成更為輕薄短小化，因此，益法應 甩於微型化之電子產品。 〜 5、 散熱效果科：該習知散熱模組7之風扇73在 導引氣流進入該散_片組71的各散熱籍片711之間 時，氣流容易立即自該散熱轉片组71之相對兩侧散發至 外界空間，故熱傳導效果相當有限，料容f形成擾流現 象，因此，習知散熱模組7之散熱效果不佳。 請參照第2圖所示，如中華民國第M261013號「運 用於散熱器的散熱風扇」專利案，係揭示第二_知散熱 1377007 模組8,該散熱模組8包含一中空匠座8i，該中空· 81内部形成一風道如’並設有連通該風道8ΐι的一進風 口 812及一出風口如；另外，該中空昆座81之風道8ιι 内設有-脉82 ’該扇輪82對位該進風口 812 ;再者， 該中空ϋ座81内口I5及外部分別形成數個散熱韓片83，其 中形成於該中空匣座81内部的數個散熱鰭片83係位於該 出風口 813。藉此，該中空匣座81可結合於電子產品之 一熱源，且利用該扇輪82自該進風口 812導入氣流通過 該中空匣座81内部的數個散熱鰭片83，並經由該出風口 813將該熱源所庫生的鬲熱排散至外界空間，以提供一散 熱作用。 然而，前述第二種習知散熱模組8係省略如第一種 習知散熱模組7之散熱鰭片組71，並直接於該中空匣座 81之預定部位成型數個散熱鰭片83。惟該第二種習知散 熱模組8之中空匣座81外部仍具有散熱鰭片83，導致體 積仍無法有效縮小且結構較為複雜，當電子產品之熱源周 遭可供組裝該散熱模組8的空間有限時，亦會造成該散熱 模組8在組裝上受到限制；再者，該習知散熱模組8仍較 不適用於同時結合各種不同熱源，且該習知散熱模組8之 組裝便利性亦不佳。 另外’該第二種習知散熱模組8之中空匣座81内部 所形成之數個散熱鳍片83係位於該出風口 813位置，當 S 2導引氣流進入該風道Μ〗後，氣流容易立即通 二①座81内部所形成之散熱鰭片83而散發至外界 空間’其熱傳導效果相當有限，因此，習知散熱模組8之 —6 — 1377007 散熱效果仍有待改善。 請參照第3圖所示，如中華民國第M335723號「可 P方塵之風扇散熱裝置」專利案，係揭示第三種習知散熱模 組9，該散熱模組9包含一風扇裝置91、一防塵濾網92 及一導流殼體93。該風扇裝置91設置於該導流殼體93 内，該導流殼體93包含一空氣導入口 931及一空氣導出 口 932 ’該風扇裝置91之·一進風口（並標不）對位該空 氣導入口 931，該風扇裝置91之一出風口（並標示）對 位該空氣導出口 932，並於該導流殼體93之空氣導出口 932設有散熱鰭片94，該防塵濾網92結合於該空氣導入 口 931❶藉此，該導流殼體93可結合於電子產品之一熱 源，且利用該風扇裝置91導引氣流依序通過該空氣導入 口 931、進風口、出風口、散熱鰭片94及空氣導出口 932，以提供一散熱作用。 然而’刖述第三種習知散熱模組9係省略如第一種 習知散熱模組7之散熱鰭片組71，並僅於該導流殼體％ 内部成型散熱則94。惟該第三種習知散熱模組9係將 該風扇裝置91另行組裝於該導流殼體93内部，因此，仍 具有體積不易縮小、結構複雜及組裝不便等諸多缺點，且 該習知散熱漁9同樣衫適用於同時結合:種不同轨 源。再者’該第三種習知散熱模組9與前述第二種習知散 熱模纽8補似’亦即鱗流殼體93㈣所形成之散轨 籍片94係位於該空氣導出口 932位置，因此，習知散熱 模組9所能提供的散熱效果仍相當有限。 —7 — 【發明内容】 本發明目的乃改良上述各種f知散熱模組之缺點， =提供—種散熱模組，使該散熱模組無須佔據電子產品過 夕空間即可完成組裝者。 、本發H的係提供一種散減組，該散熱模組 可適用於时結合各種不同熱源者。 本發明再一目的係提供一種散熱模組，該散熱模組 具有更佳之組裝便利性者。 本發明又一目的係提供一種散熱模組，該散熱模組 可有效降低結構複雜度者。 本發明另一目的係提供一種散熱模組，該散熱模組 可提供較佳之散熱效果者。 根據本發明散熱模組，係包含一扇框、一定子、一 扇輪及數排政熱II片。該扇框具有一底板，讓底板周緣結 合一侧牆，該側牆設有至少一導熱部，且該側牆圍繞形成 一谷室，並設有連通該容室的一入風口及一出風口；該定 子結合於該扇框之容室内；該扇輪結合該定子；該數排散 熱鰭片設於該側牆之至少一導熱部且位於該容室内。 .根據本發明散熱模組，係包含一扇框、一定子、一 扇輪、一上蓋及數排散熱鰭片。該扇框具有一底板，該底 板周緣結合一側踏，該侧踏圍繞形成一容室，且該侧牆設 有連通該容室的一入風口及一出風口；該定子結合於該扇 框之容室内；該扇輪結合該定子；該上蓋結合於該扇框之 入風口，該上蓋設有與該入風口相對的一進風孔，且該上 蓋設有至少一導熱部；該數排散熱鰭片設於該上蓋之至少 一導熱部且位於該容室内。 根據本發明散熱模組，係包含一扇框、一定子、一 1輪及^排放熱，鰭片^該扇柜具有_底板’該底板周緣結 二―側肽該側牆圍繞形成一容室，且該侧牆設有連通該 =至人風π及—出風σ ’另於該底板設有至少一導熱 1 ^疋子、 ^贫於铋扇框之容室内；該扇輪結合該定手； 該數個散_片設於該底板之至少-導熱部且位於該容室 内0 【實施方式】 ^本發明之上述及其他目的、特徵及優點能更明 ^ ’下文特舉本發明之較佳實施例，並配 式，作詳細說明如下： μ 4圖所7F ’本發明第—實施例之散熱模组1 Μ。：扇：1丄、一定子12、一扇輪13及數排散熱鰭片 扇框H 為鼓風式扇框；該奸12結合於該 排散熱鰭/14，1 3 τ旋轉地結合該定子12;該數 藉此&於該扇框11之_面的預定導熱位置。 二各與該數排散熱鰭片14相對之外侧面可供 ;::=r原'以供應用於各式電子產品，並提供更 嫌ΐί 具有—底板11卜該絲m周緣結合一 A熱部=上2設有至少—導熱部113，其中該至 可集中於該側牆m二]牆==熱傳導功能之部位’ 特疋&域，亦可分散於該側牆 112之數個不同區域；該侧牆112另圍繞形成一容室114 ，且該側牆112設有連通該容室114的一入風口 115及一 出風口 116 ^另外，本實施例之扇框1]L較佳可依據該侧 腾112之結構空間型態、導熱部113之數量及分佈區域的 不同，而大致區分為如下所述之數種實施方式： 其一、如第4及5圖所示，該側牆112係由數片側板 112a、112b、112c 所構成’該數片側板 112a、112b、112c 可為一體成型設計或為可拆裝之設計；如圖所示之實施例 ，係揭示其中相對之二侧板112b、U2C自該底板in周 緣一體延伸所形成，另一侧板112a則可以卡接、焊接或 黏合等方式與該二側板l12b、112c及底板ιη相互固定 。另外，該數片側板112a、112b、112c圍繞形成該容室 114，其中一侧板U2a設有該導熱部η]。 其二、如第6圖所示，該侧牆112係由數片側板 md、me、mf所構成；如圖所示之實施例’係揭示該 數片侧板112d、112e、ll2f皆自該底板m周緣一體延 伸所形成（亦可依實際需求為可拆裝之設計），而該數片 侧板㈣、U2e、112彼此相互連接。另外，該數片側板 112d ' 112e、112f圍繞形成該容室114，且該數片侧板 112d、112e、112f各設有該導熱部⑴。 其二、如第7圖所示’該侧牆112係為一半環片 112g’該耗片112g自該底板⑴周緣—體延伸所形成 (亦可依實際需求為可拆裝之設計h另外，該 ，且該半環片⑽設有該導熱 之實上述僅揭示數個實施方式，其他未揭示 識者可_:為相！^念且為該技術領域中具有通常知 =者，仍應涵蓋於本發明散熱模組的範圍内。 ^定子12結合於該扇框η之容室U4，該定子以 較佳可包含如線圈組、驅動電路或軸座等構件（未標示 ，甲孩釉座亦可選擇結合該扇框π);藉此，該定子 可供該扇輪13可旋轉地結合，並能夠控制該扇輪i 作動。 之齊 該扇輪13可旋轉地結合該定子12，其中該扇輪13 具有一輪轂131及數個葉片132。如第8圖所示，該輪轂 131用以結合該定子12，且該輪轂131之外周面與該扇才^ 11之侧牆112的内周面之間形成一蓄壓風道133 ;該數個 葉片132分別結合於該輪轂131之外周面，且該數個葉片 132位於該蓄壓風道133内；藉此，使該扇輪13自該扇 框π之入風口 115導入氣流後，該數個葉片132可利用 該蓄壓風道133蓄集氣流，以便增加氣流之風壓，並將氣 流推向該扇框11之出風口 116方向，令氣流可經由該出 風口 116排至外界空間。 該數排散熱鰭片14設於該侧牆112之至少一導熱部 113，且該數排散熱鰭片14位於該容室114内；另外，該 數排散熱鰭片14之間可分別形成環繞該輪轂131且垂 於該扇輪13之軸向的徑向流道141，其中，該徑向流道 141較佳係位於該蓄壓風道133之範圍内；藉此，當該扇 輪13之婁ii個葉片132經由該蓄壓風道133將氣流推向该 出風口 116的過程中，該氣流能夠不受阻礙地經由該徑向 _ 11 — 1377007 道141自該出風口 116散發至外界空間’以提井孰 效果及減少擾流現象。 ^ 更詳言之，如第4及5圖所揭示之實施例中，每一 排散熱鰭片14皆形成於該侧板ii2a之内周面，並分別由 數個凸柱所構成；如第6圖所揭示之實施例中，係於該數 片侧板112d、112e、112f之内周面分別形成數排散熱籍 片14，且每一片侧板112d、112e、mf所屬之數排散^ 籍片14彼此之間呈未連接狀態，另外，每一排散熱轉片 14分別為一凸條狀設計；如第7圖所揭示之實施例中， 係於該半環片mg之内周面形成數排散熱鰭片'14，且每 -排散_片14分別為連續狀之—凸條。再者，上述僅 揭示散熱則丨4的數個實施方式，其他未揭示之實施方 式’如為相同概念且為該技術領域中具有通常知識者可預 期者，仍應涵蓋於本發明散熱模組的範圍内。 睛參照第9及1〇圖所示，本發明第二實施例之散孰 模組2係包含-扇框2卜一定子22、一扇輪23、一上蓋 24及數排散熱鰭片25。 該扇框21具有-底板211，該底板211周緣結合一 侧牆212，該侧牆212 ®繞形成一容室213，且該側牆 犯設有連通該容室213 #一入風口 214及一出風口 215 〇 ,該定子22結合於該扇框21之容室213，該定子22 ，佳可包合如線圈組、驅動電路或轴座等構件；藉此，該 =子22可供該扇輪23可旋轉地結合，並能夠控制該扇輪 23旋轉作動。 ~ 12 ~ 1377007 1 該扇輪23可旋轉地結合該定子22,其中該扇輪23 具有-輪轂231及數個葉片232，該輪穀23ι之外周面與 該扇框21之側時212的内周面之間形成一蓄壓風道如 (該畜壓風道233之作用與第一實施例所揭示之蓄壓風道 133相同，容不贅述）；該數個葉片232分別結合於該輪 轂231之片周面，且該數個葉片说位於該蓄壓風道233 内1377007 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, in particular, a heat dissipation module capable of simultaneously connecting several heat sources. [Prior Art] Nowadays, various electronic products are prone to generate various heat sources in the actual operation process. Therefore, in order to make the electronic products operate normally, the heat dissipation module is usually combined with the heat source at a predetermined part to avoid damage of the electronic products due to overheating. . Please refer to FIG. 1 , for example, the "Fan Fixation" patent of the Republic of China No. M358217 discloses a first conventional heat dissipation module 7, which comprises a heat dissipation fin set 71 and a plurality of heats. A conduit 72 and a fan 73. The heat dissipation fin set 71 has a plurality of heat dissipation fins 711; the plurality of heat guides 72 are inserted into the plurality of heat dissipation fins 711 to accelerate the heat conduction effect, and the fan 73 is coupled to one end of the heat dissipation fin group 71. Thereby, the heat dissipation fin group 71 can be combined with a heat source of the electronic product (such as a single unit in the center, a motherboard, various electronic chips or a light emitting module, etc.) to utilize the heat dissipation group 71 and the heat pipe. 72. Conducting the high heat generated by the heat source, and guiding the airflow with the fan 73 to force the heat dissipation of the group 71 to enable the electronic product to operate normally. However, the first conventional heat dissipation module 7 still has the following problems in practical use: 1. It is not easy to be mounted on an electronic product: since the heat dissipation fin group 71 is coupled to the side of the fan 73 Therefore, the volume and axial height of the heat dissipation module 7 constructed by combining the two are not easily reduced; when the heat source of the product is available for assembly, the heat dissipation module 7 is easy to be recorded. The thermal module 7 is satisfactorily completed to perform the installation work. ..., wills ~ 2, m is easy to be restricted: the conventional heat-dissipating module 7 must pass through (4) the heat-dissipating fins / 1 correctly combined with the 源 卩 卩 卩 卩 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可The heat dissipation amount 7 of the common phase type is basically only suitable for combining the single __, and is not suitable for (4) combining various heat sources. Therefore, the heat dissipation fish 7 is also considerably limited in practical use. 3. Poor board convenience: When the conventional heat dissipation module 7 wants to dissipate heat, it must still be firstly divided;:; group 71 and the fan η are combined with each other, and then 'co for (4) sub-products Silk, so it is quite inconvenient to assemble and use. 4, structure Na: the conventional heat dissipation 7 has a large number of components and the structure of the tree lion, resulting in high manufacturing costs, and relatively caused the conventional heat dissipation module 7 is not easy to design to be lighter and thinner, therefore, the benefits Should be shackled by miniaturized electronic products. 〜5. Heat Dissipation Effect Section: When the fan 73 of the conventional heat dissipation module 7 is guided between the heat dissipation sheets 711 of the scatter sheet group 71, the airflow is easily immediately from the heat dissipation rotator group 71. The two sides are radiated to the external space, so the heat conduction effect is rather limited, and the material capacity f forms a spoiler phenomenon. Therefore, the heat dissipation effect of the conventional heat dissipation module 7 is not good. Please refer to FIG. 2, for example, the Patent No. M261013 of the Republic of China, "Dissipation Fan for Radiator", discloses the second _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The inside of the hollow 81 forms a duct such as 'and has an air inlet 812 and an air outlet that communicates with the duct 8ΐ. In addition, the air duct 8 of the hollow block 81 is provided with a pulse 82' The wheel 82 is aligned with the air inlet 812. Further, the inner cavity I5 of the hollow sill 81 and the outside are respectively formed with a plurality of heat dissipating pieces 83, wherein a plurality of heat dissipating fins 83 formed inside the hollow sill 81 are located Air outlet 813. Therefore, the hollow sill 81 can be coupled to a heat source of the electronic product, and the fan wheel 82 is used to introduce airflow from the air inlet 812 through the plurality of heat dissipation fins 83 inside the hollow sill 81, and through the air outlet. 813 dissipates the heat generated by the heat source to the external space to provide a heat dissipation effect. However, the second conventional heat dissipation module 8 omits the heat dissipation fin set 71 of the first conventional heat dissipation module 7, and forms a plurality of heat dissipation fins 83 directly at predetermined portions of the hollow socket 81. However, the outer portion of the hollow sill 81 of the second conventional heat dissipation module 8 still has the heat dissipation fins 83, so that the volume cannot be effectively reduced and the structure is complicated. When the heat source of the electronic product is around, the heat dissipation module 8 can be assembled. When the space is limited, the heat dissipation module 8 is also limited in assembly. Moreover, the conventional heat dissipation module 8 is still unsuitable for combining various heat sources at the same time, and the assembly of the conventional heat dissipation module 8 is convenient. Sex is also not good. In addition, a plurality of heat dissipating fins 83 formed in the hollow sill 81 of the second conventional heat dissipating module 8 are located at the air outlet 813. When the S 2 guides the airflow into the air duct, the airflow It is easy to immediately pass the heat-dissipating fins 83 formed inside the two-seat 81 to the external space. The heat-conducting effect is quite limited. Therefore, the heat-dissipating effect of the conventional heat-dissipating module 8-6- 1377007 still needs to be improved. Please refer to FIG. 3, for example, the patent of the "F-Party Fan Cooling Device" of the Republic of China No. M335723, discloses a third conventional heat dissipation module 9, which includes a fan device 91, A dust filter 92 and a flow guiding housing 93. The fan device 91 is disposed in the flow guiding housing 93. The air guiding housing 93 includes an air inlet 931 and an air outlet 932. The fan device 91 has an air inlet (not labeled). The air inlet 931, the air outlet (not shown) of the fan device 91 is aligned with the air outlet 932, and the air outlet 932 of the flow guide housing 93 is provided with a heat dissipation fin 94. The dust filter 92 is provided. The air guiding port 931 is coupled to the heat source of the electronic product, and the fan device 91 is used to guide the airflow through the air inlet port 931, the air inlet, the air outlet, and the heat dissipation. The fins 94 and the air outlet 932 provide a heat dissipation effect. However, the third conventional heat dissipation module 9 is omitted from the heat dissipation fin set 71 of the first conventional heat dissipation module 7, and the heat dissipation 94 is formed only inside the flow guide housing %. However, the third conventional heat dissipation module 9 separately assembles the fan device 91 into the interior of the flow guiding housing 93, and therefore has many disadvantages such as difficulty in volume reduction, complicated structure, and inconvenient assembly, and the conventional heat dissipation. Fishing 9 same shirt is suitable for simultaneous combination: different kinds of rail sources. Furthermore, the third conventional heat dissipating module 9 and the second conventional heat dissipating mold 8 complement each other, that is, the loose rail housing 94 formed by the scale housing 93 (four) is located at the air outlet 932. Therefore, the heat dissipation effect provided by the conventional heat dissipation module 9 is still quite limited. The purpose of the present invention is to improve the shortcomings of the above various heat dissipation modules, and to provide a heat dissipation module, so that the heat dissipation module can complete the assembly without occupying the space of the electronic product. The present invention provides a decentralized group, and the heat dissipation module can be adapted to combine various heat sources. Still another object of the present invention is to provide a heat dissipation module which has better assembly convenience. Another object of the present invention is to provide a heat dissipation module which can effectively reduce structural complexity. Another object of the present invention is to provide a heat dissipation module that can provide better heat dissipation. The heat dissipation module according to the present invention comprises a frame, a stator, a fan wheel and a plurality of rows of political heat II pieces. The fan frame has a bottom plate, and the periphery of the bottom plate is combined with a side wall. The side wall is provided with at least one heat conducting portion, and the side wall surrounds and forms a valley chamber, and is provided with an air inlet and an air outlet connecting the chamber. The stator is coupled to the housing of the fan frame; the fan wheel is coupled to the stator; the plurality of rows of heat dissipation fins are disposed on the at least one heat conducting portion of the side wall and located in the housing. The heat dissipation module according to the present invention comprises a frame, a stator, a fan wheel, an upper cover and a plurality of rows of heat dissipation fins. The fan frame has a bottom plate, the bottom edge of the bottom plate is combined with one side, the side step is formed around a cavity, and the side wall is provided with an air inlet and an air outlet connecting the chamber; the stator is coupled to the frame The fan wheel is coupled to the stator; the upper cover is coupled to the air inlet of the fan frame, the upper cover is provided with an air inlet hole opposite to the air inlet, and the upper cover is provided with at least one heat conducting portion; The heat dissipation fin is disposed on the at least one heat conducting portion of the upper cover and located in the cavity. The heat dissipation module according to the present invention comprises a frame, a stator, a wheel and a heat of discharge. The fan has a bottom plate. The bottom edge of the bottom plate has a side-side peptide. The side wall surrounds a chamber. And the side wall is provided with a connection between the = to the human wind π and - the outlet σ ' and the bottom plate is provided with at least one heat conducting 1 ^ 疋子, ^ poor in the 铋 fan frame; the fan wheel is combined with the The above-mentioned and other objects, features and advantages of the present invention are set forth in the above-mentioned and other objects, features and advantages of the present invention. The preferred embodiment, and the configuration, will be described in detail as follows: μ 4 Figure 7F 'The heat dissipation module 1 of the first embodiment of the present invention. : fan: 1丄, stator 12, a wheel 13 and a number of rows of fins fan frame H is a blast fan frame; the trait 12 is combined with the row of fins /14, 1 3 τ rotationally coupled to the stator 12; the number is taken & at a predetermined thermal conduction position of the face of the fan frame 11. Two opposite sides of the row of fins 14 are available;::=r original 'supplied for use in various electronic products, and provides more ΐ 具有 具有 底板 底板 底板 底板 底板 底板 底板 底板 底板 底板 底板 m m m m The upper part 2 is provided with at least a heat conducting portion 113, wherein the position can be concentrated on the side wall m2] wall == the part of the heat conduction function 'special area>, and the plurality of side walls 112 can also be dispersed The side wall 112 is further formed around a chamber 114, and the side wall 112 is provided with an air inlet 115 and an air outlet 116 that communicate with the chamber 114. In addition, the fan frame 1]L of the embodiment is preferably According to the structural space type of the side wall 112, the number of the heat conducting portions 113, and the distribution area, it can be roughly divided into several embodiments as follows: First, as shown in FIGS. 4 and 5, the side The wall 112 is composed of a plurality of side panels 112a, 112b, 112c. The plurality of side panels 112a, 112b, 112c may be integrally formed or detachable; as shown in the embodiment, the relatives are disclosed. The two side plates 112b and U2C are integrally formed from the periphery of the bottom plate in the other side, and the other side plate 112a can be snapped, welded or The bonding and the like are fixed to the two side plates l12b, 112c and the bottom plate. Further, the plurality of side plates 112a, 112b, 112c surround the chamber 114, and the one side plate U2a is provided with the heat conducting portion η]. Secondly, as shown in FIG. 6, the side wall 112 is composed of a plurality of side plates md, me, and mf; the embodiment shown in the drawing shows that the plurality of side plates 112d, 112e, and ll2 are from the same. The peripheral edge of the bottom plate m is integrally extended (also can be disassembled according to actual needs), and the plurality of side plates (4), U2e, 112 are connected to each other. Further, the plurality of side plates 112d' 112e, 112f surround the chamber 114, and the plurality of side plates 112d, 112e, 112f are each provided with the heat transfer portion (1). Secondly, as shown in Fig. 7, the side wall 112 is a half ring piece 112g. The consumer piece 112g is formed from the peripheral edge of the bottom plate (1). (The design can also be removable according to actual needs. In this case, the half ring piece (10) is provided with the heat conduction. The above only discloses a few embodiments, and other undisclosed persons can be included in the technical field and should be covered in the technical field. Within the scope of the heat dissipation module of the present invention, the stator 12 is coupled to the chamber U4 of the frame n, which preferably includes components such as a coil assembly, a drive circuit or a shaft base (not labeled, Optionally, the fan frame π) is coupled; thereby, the stator is rotatably coupled to the fan wheel 13 and is capable of controlling the movement of the fan wheel i. The fan wheel 13 is rotatably coupled to the stator 12, wherein The fan wheel 13 has a hub 131 and a plurality of blades 132. As shown in Fig. 8, the hub 131 is used to join the stator 12, and the outer circumference of the hub 131 and the inner circumference of the side wall 112 of the fan 11 A pressure accumulating air passage 133 is formed between the faces; the plurality of blades 132 are respectively coupled to the outer circumferential surface of the hub 131, and the number The vane 132 is located in the accumulator air duct 133; after the fan wheel 13 is introduced into the air flow from the air inlet 115 of the fan frame π, the plurality of vanes 132 can use the accumulator air duct 133 to accumulate airflow. Increasing the air pressure of the airflow, and pushing the airflow toward the air outlet 116 of the fan frame 11, so that the airflow can be discharged to the external space through the air outlet 116. The plurality of rows of heat dissipation fins 14 are disposed on at least one of the side walls 112. The heat conducting portion 113 is disposed in the chamber 114. The plurality of rows of fins 14 are respectively formed in a radial direction surrounding the hub 131 and perpendicular to the axial direction of the fan wheel 13 The flow passage 141, wherein the radial flow passage 141 is preferably located within the range of the pressure accumulation air passage 133; thereby, when the fan blades 13 of the fan wheel 13 pass through the pressure accumulation air passage 133, the air flow is pushed During the process of the air outlet 116, the airflow can be unimpededly transmitted from the air outlet 116 to the external space via the radial _11 - 1377007 lane 141 to improve the effect and reduce the turbulence phenomenon. In other words, in the embodiments disclosed in FIGS. 4 and 5, each row of fins 14 is formed in The inner peripheral surface of the side plate ii2a is composed of a plurality of studs; as in the embodiment disclosed in FIG. 6, the inner peripheral surfaces of the plurality of side plates 112d, 112e, and 112f are respectively formed in rows. The heat dissipating fins 14 and the plurality of dispersing fins 14 belonging to each of the side panels 112d, 112e, and mf are unconnected with each other, and each row of the heat dissipating fins 14 is a convex strip design; In the embodiment disclosed in FIG. 7, a plurality of rows of heat-dissipating fins '14 are formed on the inner circumferential surface of the half-ring piece mg, and each of the rows-distributing sheets 14 are continuous-shaped ridges. Furthermore, the above description only discloses several embodiments of the heat dissipation 丨4, and other undisclosed embodiments, as the same concept and which are generally expected in the technical field, should still be included in the heat dissipation module of the present invention. In the range. Referring to Figures 9 and 1, the dilator module 2 of the second embodiment of the present invention comprises a fan frame 2, a stator 22, a fan wheel 23, an upper cover 24 and a plurality of rows of fins 25. The fan frame 21 has a bottom plate 211. The bottom plate 211 is joined to the side wall 212. The side wall 212 is formed to form a chamber 213. The side wall is connected to the chamber 213. The air outlet 215 〇, the stator 22 is coupled to the chamber 213 of the fan frame 21, and the stator 22 preferably includes components such as a coil group, a driving circuit or a shaft seat; thereby, the = 22 is available for the fan The wheel 23 is rotatably coupled and is capable of controlling the rotation of the fan wheel 23. ~ 12 ~ 1377007 1 The fan wheel 23 rotatably couples the stator 22, wherein the fan wheel 23 has a hub 231 and a plurality of blades 232, and the outer surface of the wheel valley 23i and the side of the frame 21 are 212 A pressure accumulating air passage is formed between the circumferential surfaces. For example, the function of the livestock pressure air passage 233 is the same as that of the pressure storage air passage 133 disclosed in the first embodiment, and the plurality of blades 232 are respectively coupled to the hub. a peripheral surface of 231, and the plurality of blades are said to be located in the pressure accumulation duct 233
該上蓋24結合於該扇框21之入風口 214，且該上蓋 24设有與該入風口 214相對的一進風孔241 ;另外，該上 蓋24設有數個導熱部242 (亦可為單一導熱部242)，該 數個導熱部2彳2係、指該上蓋24具有熱傳導功能之部位。 藉此’當該扇框21結合有該上蓋Μ時，可藉由該上蓋 24知_供如導流、增壓及散熱等作用。The upper cover 24 is coupled to the air inlet 214 of the fan frame 21, and the upper cover 24 is provided with an air inlet 241 opposite to the air inlet 214. In addition, the upper cover 24 is provided with a plurality of heat conducting portions 242 (also can be a single heat conduction) The portion 242), the plurality of heat conducting portions 2彳2, refers to a portion of the upper cover 24 having a heat conduction function. Therefore, when the upper frame 结合 is coupled to the frame 21, the upper cover 24 can be used to provide functions such as diversion, supercharging, and heat dissipation.
該數排散熱鰭片25分別設於該上蓋24之數個導熱 部242，且該數排散熱鰭片25位於該容室213内；另外 ，該數排散熱鰭ϋ 25之間可分別形成環繞該扇輪23之輪 轂231且垂直於該扇輪23之軸向的徑向流道251，該徑 向流道251較佳係位於該蓄壓風道233之範圍内，其中該 控向流道251之作用與第一實施例所揭示之徑向流道ι41 相同，容不贅述。 請參照第11及12圖所示，本發明第三實施例之散熱 模組3係包含一扇框31、一定子32、一扇輪33及數排散 熱鰭片34。 該扇框31具有一底扳311，該底板311周緣結合一 側牆312，該側牆312圍繞形成一容室313，且該側牆 —13 — 1=T3的一入風口 314及-出風口 315 更較佳設有數個辅助導流片316，以便 氣流通過該出風口化。另外，該底板 ^汉有—導熱部317 (亦可為數個 部311指該底板311具有熱傳導功能之部位。 >該疋子32結合於該扇框31之容室313，該定子32 ，佳可包含如線圈組、驅動電路或軸座等構件；藉此，該 疋子32可供該屬輪％可雜地結合，並能触制該扇輪 33旋轉作動。 該扇輪33可旋轉地結合較子32，其中該扇輪％ :、有輪轂331及數個葉片332，該輪轂331之外周面與 該扇框31之侧牆312的内周面之間形成一蓄壓風道333 (該蓄壓風道333之作用與第一實施例所揭示之蓄壓風道 133相同’容不贅述）；該數個葉片332分別結合於該輪 穀331之外周面，且該數個葉片332位於該蓄壓風道333 内。 該數排散熱鰭片34設於該底板311之導熱部317， 且該數排散熱鰭片34位於該容室313内；另外，該數排 散熱鰭片34之間可分別形成環繞該扇輪33之輪轂331且 垂直於該扇輪33之軸向的徑向流道341，該徑向流道341 較佳係位於該蓄壓風道333之範圍内，其中該徑向流道 341之作用與第一實施例所揭示之徑向流道14ι相同’容 不贅述。 本發明第三實施例之散熱模組3較佳另包含一上蓋 35，該上蓋35結合於該扇框31之入風口 314，且該上蓋 35設有與該入風口 314相對的一進風孔351。另外’該上 蓋35相鄰於該出風口 315之一側形成一導流板352，該 導流板352朝向該底板311方向傾斜延伸；藉此，當該扇 輪33之數個葉片332經由該蓄壓風道333將氣流推向該 出風口 315後，該導流板352可進一步導引氣流順利地經 由該出風口 315排放至外界空間，並提供一增壓效果。 本發明散熱模組1、2、3於實際使用時，可供用於 結合各種不同熱源，並藉由單一散熱模組1、2、3同時對 數値熱源提供散熱作用。舉例而言，以本發明第一實施例 之第6圖所示的散熱模組1為例，請配合參照第13圖所 不’該散熱模組1之侧牆112的各侧板ii2d、112e、112f 所分別形成的導熱部113之外側面各可結合一導熱管4， 該數個導熱管4可連接如中央處理單元、主機板、各種電 子晶.片或發光模組等各種不同熱源；或以本發明第一實施 例之第7圖所示的散熱模組1為例，請配合參照第14圖 所示，該散熱模組1之側牆112的導熱部113之外侧面亦 可直接結合熱源（如圖所示係為數個發光模組5);另外 其他如本發明第5圖所示之導熱部113、如第9及1〇 圖所示之上盍24所具有的導熱部242、如第^及12圖 斤示之底板311所具有的導熱部317，同樣可結合數個不 同的熱源（树;τκ)。因此，上述各種不同熱源所產生的 高熱可經由該導熱部113、如、317傳導至該散熱籍片 4、25、34’並配合該扇輪13、23、33導引氣流繞行通 過該散熱^14、25、34，並經由該出風口116、215、 315同時將該數個熱源所產生的高熱排散至外界空間。另 1377007 外’本發明散熱模組1、2、3在同時結合數個熱源的前提 條件下，為不影響散熱效果，亦可選用散熱效率較高的散 熱模組卜2、3進行散熱作業。 藉由上述本發明各實施例所揭示之散熱模組1、2、3 可知’本發明散熱模組1、2、3可選擇於扇框11、21、 31之預定部位設有至少一導熱部113、242、317，例如： 侧牆112、上蓋24 (可歸類為屬於扇框的一部分）及底板 3U等部位；並於該至少一導熱部113、242、317的内側 面對應設有數排散熱鰭片14、25、34，而該至少一導熱 4 113 ' 242、317的外侧面則可供結合數個不同熱源，藉 此，以達到利用單一散熱模組1、2、3同時對數個熱源提 供散熱作用之功能。更詳言之，雖然本發明各實施例僅分 別揭示該側牆112、上蓋24及底板3Π各設有至少一導 熱部113、242、317，惟本發明散熱模組1、2、3之扇框 11、21、31亦可同時於該側牆112、上蓋24及底板311 設有轉至少-導熱部113、242、317。例如：該扇框之側 牆及上蓋皆設有該至少一導熱部；該扇框之侧牆及底板皆 設有該至少-導熱部；或該扇框之_、上蓋及底板皆設 有該至少一導熱部，以此類推。 藉由前揭各實施例之散熱模組卜2、3的結構特徵 ，本發明散熱模組卜2、3可達到如下所述之諸多功效： 1、易於女裝在電子產品：該散熱模組丨、2、3係 將該散熱鰭片14、25、34整合於該扇框u、2卜31内 部，亦即該散熱模组卜2、3之體積及轴向高度即為該扇 框1卜2卜31本身之體積及㈣高度；她於習知散熱 1377007 模組7、8、9’本發明散 積及抽向高度，以便4=上 更纽縮減體 品，並可順利結合該電子產有限之電子產 袓卜2、3產熱源，因此，使該散熱模 ，，且1 2 3以爾電子產品 達到不佔㈣之功b 且裝’Μ 夕戶^ 上較不受限制：藉由該散熱模組卜2、3 / 、21、31的至少一導熱部113、242、317對庫 數排散熱.鳍片Η、25、34的結構設計，該至少一導熱; 113、242、317的外侧面則可供結合數個不同熱源，而並 非僅限定結合單-熱源；因此，該散_組卜2、3可適 用於同時結合各_同_，以達到提升使肢利性之 效。 3、 組裝便利性佳：相較於習知散熱模組7、8、9 具有組裝錢等缺點；本發明賴模组丨、2、3已將該散 熱鰭片14、25、34整合於該扇框”、21、31内部，因 此’在實關於電子產品時，無須透過複雜的組裝作業， 即可使用該散減組卜2、3，故具有組裝便利性佳之功 效。 4、 結構精簡：本發明散熱模、纟且1、2、3之構件數 罝及結構組成相當精簡，因此，可有效降低結構複雜度， 以達到降低製造成本及可設計成更為輕薄短小化等功效。 5、 散熱效果佳：當該散熱模組1、2、3結合各種 不同熱源時，各種熱源所產生的高熱係經由該導熱部 113、242、317傳導至該散熱鰭片14、25、34，而該扇輪 13、23、33則配合導引氣流、、繞行"通過該散熱鰭片 — 17 — 1377007 25 34因此’可相對延長氣流流動於該散熱鰭片 之時間，以提升_導效果，且可減少擾流現象，故 具有可提升散熱效果之功效。 ^如上所述，本發明散熱模組1、2、3確實具有易於 安裝在f子產品、制上財受限制、組裝便利性佳、处 構精簡及散触果㈣特點，因此，適合應祕各式電= 產品，以提供較佳之散熱品質。 雖然本發明已利用上述較佳實施例揭示，然其並非 用以，定本發明’任何熟習此技藝者在不脫離本發明之精 神和範圍之内’相對上述實施例進行各種更動與修改仍屬 本發明所賴之麟料，因此本發明之健範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖：習知第一種散熱模組的立體外觀圖。 第2圖.習知第二種散熱模組的立體外觀圖。 第3圖.習知第三種散熱模組的立體外觀圖。 第4圖：本發明第一實施例散熱模組的立體分解圖。 第5圖：本發明第一實施例散熱模組的立體外觀圖。 第6圖：本發明第一實施例散熱模組之扇框另一實施 方式的立體分解圖。 第7圖：本發明第一實施例散熱模組之扇框再一實施 方式的立體分解圖。 第8圖：本發明第一實施例散熱模組的俯視圖。 第9圖：本發明第二實施例散熱模組的立體分解圖。 1377007 I i 第10圖：本發明第二實施例散熱模組的組合剖視圖。 第11圖：本發明第三實施例散熱模組的立體分解圖。 第12圖··本發明第三實施例散熱模組的組合剖視圖。 第13圖：本發明散熱模組供散熱管結合之使用狀態參 考圖。 • 苐14圖：本發明散熱模組供發光模組結合之使用狀態 ' 參考圖。 【主要元件符號說明】 〔本發明〕 1 散熱模組 11 扇框 111 底板 112 側牆 112g半環片 112a l、112b、112c、 112d、112e、 U2f側板 113 導熱部 114 容室ί 115 入風口 116 出風口 12 定子 13 扇輪 131 輪轂 132 葉片 133 蓄壓風道 14 散熱鰭片 141 徑向流道 2 散熱模、组 21 扇框 211 底板 212 侧牆 213 容室 214 入風口 215 出風口 —19 — 1377007 22 定子 23 扇輪 231 輪轂 232 葉片 233 蓄壓風道 24 上蓋 241 進風孔 242 導熱部 25 散熱鰭片 251 徑向流道 3 散熱模組 31 扇框 311 底板 312 側牆 313 容室 314 入風口 315 出風口 316辅助導流片 317 導熱部 32 定子 33 扇輪 331 輪轂 332 葉片 333 蓄壓風道 34 散熱鰭片 341 徑向流道 35 上蓋 351 進風孔 352 導流板 4 導熱管 5 發光模組 〔習知:〕 7 散熱模組 71 散熱鰭片組 711 散熱鰭片 72 熱導管 73 風扇 8 散熱模組 81 中空匣座 811 風道 812 進風口 813 出風口 82 扇輪 83 散熱鰭片 9 散熱模組The plurality of rows of heat dissipation fins 25 are respectively disposed on the plurality of heat conducting portions 242 of the upper cover 24, and the plurality of rows of heat dissipation fins 25 are located in the chamber 213; The hub 231 of the fan wheel 23 is perpendicular to the radial flow passage 251 of the axial direction of the fan wheel 23. The radial flow passage 251 is preferably located within the range of the pressure accumulation air passage 233, wherein the steering flow passage is The function of 251 is the same as that of the radial flow path ι41 disclosed in the first embodiment, and will not be described again. Referring to Figures 11 and 12, the heat dissipation module 3 of the third embodiment of the present invention comprises a frame 31, a stator 32, a fan wheel 33 and a plurality of rows of heat dissipation fins 34. The fan frame 31 has a bottom plate 311. The bottom plate 311 is combined with a side wall 312. The side wall 312 surrounds a cavity 313, and the side wall 13-13 = an air inlet 314 and an air outlet of the T3. More preferably, a plurality of auxiliary baffles 316 are provided for airflow through the vent. In addition, the bottom plate has a heat conducting portion 317 (may also be a plurality of portions 311 indicating a portion of the bottom plate 311 having a heat conducting function. > the latch 32 is coupled to the chamber 313 of the fan frame 31, preferably the stator 32 A member such as a coil set, a drive circuit or a shaft base may be included; whereby the catch 32 is splicably coupled to the race wheel and can be rotated to actuate the wheel 33. The fan wheel 33 is rotatably In combination with the comparator 32, wherein the fan wheel %: has a hub 331 and a plurality of blades 332, a pressure accumulating air passage 333 is formed between the outer circumferential surface of the hub 331 and the inner circumferential surface of the side wall 312 of the fan frame 31 ( The function of the accumulator air duct 333 is the same as that of the accumulating air duct 133 disclosed in the first embodiment. The plurality of vanes 332 are respectively coupled to the outer circumferential surface of the trough 331 and the plurality of vanes 332 The plurality of rows of fins 34 are disposed in the heat conducting portion 317 of the bottom plate 311, and the rows of fins 34 are located in the chamber 313. In addition, the rows of fins 34 are arranged. Radial flow passages 341 may be formed between the hubs 331 surrounding the fan wheel 33 and perpendicular to the axial direction of the fan wheel 33, respectively. The passage 341 is preferably located within the range of the pressure accumulating duct 333, wherein the radial flow passage 341 functions as the radial flow passage 141 disclosed in the first embodiment, and the third embodiment of the present invention is omitted. The heat dissipation module 3 preferably further includes an upper cover 35. The upper cover 35 is coupled to the air inlet 314 of the fan frame 31, and the upper cover 35 is provided with an air inlet hole 351 opposite to the air inlet 314. A deflector 352 is formed adjacent to one side of the air outlet 315, and the deflector 352 extends obliquely toward the bottom plate 311; thereby, when the plurality of blades 332 of the fan wheel 33 pass through the pressure accumulating air passage After the airflow is pushed to the air outlet 315, the air deflector 352 can further guide the airflow to be smoothly discharged to the external space through the air outlet 315, and provide a supercharging effect. The heat dissipation module 1, 2, 3 of the present invention. In actual use, it can be used to combine various heat sources, and provide heat dissipation by a single heat dissipation module 1, 2, 3 simultaneously to the heat source. For example, as shown in FIG. 6 of the first embodiment of the present invention For example, the heat dissipation module 1 is the same as the reference to Fig. 13 The outer side surfaces of the heat conducting portions 113 respectively formed by the side plates ii2d, 112e, and 112f of the side wall 112 of the thermal module 1 can be combined with a heat transfer tube 4, and the plurality of heat transfer tubes 4 can be connected, for example, a central processing unit and a motherboard. And various heat sources such as various electronic crystal chips or light-emitting modules; or the heat-dissipating module 1 shown in FIG. 7 of the first embodiment of the present invention is taken as an example, please refer to FIG. 14 for the heat-dissipating module The outer side of the heat conducting portion 113 of the side wall 112 of the first wall 112 may be directly combined with a heat source (as shown in the figure, a plurality of light emitting modules 5); and other heat conducting portions 113 as shown in Fig. 5 of the present invention, such as the ninth and The heat conducting portion 242 of the upper crucible 24 shown in Fig. 1 and the heat conducting portion 317 of the bottom plate 311 shown in Figs. 12 and 12 can also be combined with a plurality of different heat sources (trees; τκ). Therefore, the high heat generated by the various heat sources can be conducted to the heat dissipating fins 4, 25, 34' via the heat conducting portion 113, for example, 317, and the airflow is guided by the fan wheels 13, 23, 33 to bypass the heat dissipation. ^14, 25, 34, and through the air outlets 116, 215, 315, the high heat generated by the several heat sources is simultaneously discharged to the external space. In addition, under the premise of combining several heat sources at the same time, the heat dissipation modules 1, 2, and 3 of the present invention can also perform heat dissipation operation by using the heat dissipation modules 2 and 3 with high heat dissipation efficiency so as not to affect the heat dissipation effect. According to the heat dissipation modules 1, 2, and 3 disclosed in the above embodiments of the present invention, the heat dissipation modules 1, 2, and 3 of the present invention may be provided with at least one heat conduction portion at predetermined portions of the fan frames 11, 21, and 31. 113, 242, 317, for example: a side wall 112, an upper cover 24 (which can be classified as belonging to a part of the fan frame), and a bottom plate 3U and the like; and corresponding rows on the inner side of the at least one heat conducting portion 113, 242, 317 The heat dissipating fins 14, 25, 34, and the outer side of the at least one heat conducting portion 4 113 ' 242, 317 can be combined with a plurality of different heat sources, thereby achieving simultaneous use of a single heat dissipating module 1, 2, 3 The heat source provides the function of heat dissipation. In more detail, although the embodiments of the present invention only disclose that the side wall 112, the upper cover 24, and the bottom plate 3 are respectively provided with at least one heat conducting portion 113, 242, 317, the fan of the heat dissipation module 1, 2, and 3 of the present invention. The frame 11, 21, 31 can also be provided with at least the heat conducting portions 113, 242, 317 at the side wall 112, the upper cover 24 and the bottom plate 311. For example, the side wall and the upper cover of the fan frame are provided with the at least one heat conducting portion; the side wall and the bottom plate of the fan frame are all provided with the at least heat conducting portion; or the frame, the upper cover and the bottom plate are provided with the At least one heat conducting portion, and so on. By the structural features of the heat dissipation modules 2 and 3 of the embodiments, the heat dissipation modules 2 and 3 of the present invention can achieve the following functions: 1. Easy to wear women's products in electronic products: the heat dissipation module丨, 2, 3 are integrated into the fan frame u, 2, 31 inside the fan frame u, 2, 31, that is, the volume and axial height of the heat dissipation module 2, 3 is the fan frame 1 Bu 2 Bu 31 itself and the volume of (4); she knows the heat dissipation of the 1377007 module 7, 8, 9' of the present invention, and the height of the pumping and drawing, so that the body can be smoothly combined with the body. The production of limited electronic products, 2, 3 heat source, therefore, the heat-dissipation model, and 1 2 3 Eyre electronic products to achieve no (four) work b and installed 'Μ 户 ^ ^ ^ is not restricted: borrow The heat dissipation modules 113, 242, and 317 of the heat dissipation module 2, 3/, 21, and 31 heat-dissipate the number of banks. The structure design of the fins 25, 25, 34, the at least one heat conduction; 113, 242, The outer side of the 317 can be combined with several different heat sources, and not only the single-heat source is combined; therefore, the scattered _ group 2, 3 can be applied to simultaneously combine the same _ the same _ In order to achieve lift-profit effect that the limb. 3. Good assembly convenience: compared with the conventional heat dissipation modules 7, 8, 9 have the disadvantages of assembly money; the present invention, the modules 2、, 2, 3 have integrated the heat dissipation fins 14, 25, 34 into the The inside of the fan frame, 21, 31, therefore, when the electronic product is actually used, it is not necessary to pass through complicated assembly work, and the dust reduction group 2 and 3 can be used, so that the assembly convenience is good. 4. Structure simplification: The heat-dissipating mold of the invention has a relatively simple number of components and a structural composition of 1, 2, and 3, so that the structural complexity can be effectively reduced, thereby reducing the manufacturing cost and designing into a lighter, thinner, shorter, and the like. The heat dissipation effect is good: when the heat dissipation modules 1, 2, and 3 are combined with various heat sources, the high heat generated by the various heat sources is conducted to the heat dissipation fins 14, 25, 34 via the heat conduction portions 113, 242, and 317, and The fan wheels 13, 23, 33 cooperate with the guiding airflow, and bypass the "through the heat sink fins - 17 - 1377007 25 34" so that the airflow can be relatively extended to the heat radiating fins to improve the guiding effect. And can reduce the phenomenon of spoiler, so it can be improved The effect of the thermal effect. As described above, the heat dissipating modules 1, 2, and 3 of the present invention have the characteristics of being easy to be installed in the sub-product, the restriction on the production, the convenience of assembly, the compactness of the structure, and the touch-off fruit (4). Therefore, it is suitable for the various types of electricity = products to provide better heat dissipation quality. Although the present invention has been disclosed by the above-described preferred embodiments, it is not intended to be used in the art of the present invention. Within the spirit and scope, various modifications and changes to the above-described embodiments are still within the scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. Fig. 1 is a perspective view of a first type of heat dissipation module. Fig. 2 is a perspective view of a second type of heat dissipation module. Fig. 3 is a perspective view of a third type of heat dissipation module. 4 is a perspective exploded view of a heat dissipation module according to a first embodiment of the present invention. FIG. 5 is a perspective view of a heat dissipation module according to a first embodiment of the present invention. FIG. 6 is a heat dissipation module according to a first embodiment of the present invention. Another implementation of the fan frame Fig. 7 is a perspective exploded view of still another embodiment of the heat dissipation module of the first embodiment of the present invention. Fig. 8 is a plan view of the heat dissipation module of the first embodiment of the present invention. An exploded perspective view of a heat dissipation module according to a second embodiment of the present invention. 1377007 I i FIG. 10 is a cross-sectional view of a heat dissipation module according to a second embodiment of the present invention. FIG. 11 is a perspective exploded view of a heat dissipation module according to a third embodiment of the present invention. Fig. 12 is a sectional view showing the combination of the heat dissipation module of the third embodiment of the present invention. Fig. 13 is a reference diagram of the use state of the heat dissipation module of the present invention for the combination of the heat dissipation tubes. Light-emitting module combined use state 'reference picture. 【Main component symbol description】 [Invention] 1 heat-dissipation module 11 fan frame 111 bottom plate 112 side wall 112g half-ring piece 112a l, 112b, 112c, 112d, 112e, U2f side plate 113 Heat transfer part 114 Room ί 115 Air inlet 116 Air outlet 12 Stator 13 Fan wheel 131 Hub 132 Blade 133 Accumulator duct 14 Heat sink fin 141 Radial flow path 2 Heat sink, group 21 Fan frame 211 Floor 212 Wall 213 chamber 214 air inlet 215 air outlet - 19 - 1377007 22 stator 23 fan wheel 231 hub 232 blade 233 accumulator air duct 24 upper cover 241 air inlet hole 242 heat transfer portion 25 heat sink fin 251 radial flow path 3 heat dissipation module 31 Fan frame 311 Base plate 312 Side wall 313 Room 314 Air inlet 315 Air outlet 316 Auxiliary baffle 317 Heat transfer part 32 Stator 33 Fan wheel 331 Hub 332 Blade 333 Accumulator air duct 34 Heat sink fin 341 Radial flow path 35 Upper cover 351 air inlet 352 deflector 4 heat pipe 5 light module [scientific:] 7 heat dissipation module 71 heat sink fin group 711 heat sink fin 72 heat pipe 73 fan 8 heat dissipation module 81 hollow sill 811 air duct 812 Air inlet 813 air outlet 82 fan wheel 83 heat sink fin 9 heat dissipation module