TW595757U - Card-type liquid cooling heat sink module - Google Patents
Card-type liquid cooling heat sink module Download PDFInfo
- Publication number
- TW595757U TW595757U TW92201628U TW92201628U TW595757U TW 595757 U TW595757 U TW 595757U TW 92201628 U TW92201628 U TW 92201628U TW 92201628 U TW92201628 U TW 92201628U TW 595757 U TW595757 U TW 595757U
- Authority
- TW
- Taiwan
- Prior art keywords
- card
- type liquid
- heat
- liquid
- fan
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
595757 :、案號 Γ作說明⑴ 【新型所屬之 腦i本劊作係 有ΐ機中,利 板,方便裝卸 ,而使得散 點敢熱的優 先前技術】 ^ 按’隨著 ;,於是生產 、電腦主機運 ’於是傳 者投入水冷式 熱系統(如第 士,利用循環 交換器上設置 熱風扇,其熱 接觸傳遞,而 置方式較差之 到處充滿了熱 方式,導致結 92201628 m 曰 修正 技術領域】 為一種卡式液冷散熱模組,尤指一種 用液冷散熱系統結構與卡 及控制結構大小之功能, 熱效果提昇,並藉由分歧 點。 座結合的設 且於吸熱埠 器的設置’ 運用於電|·|·,而具 内設置隔 而具有牙 、結構佔空 創作人有 散熱模組,其 於盒體的模組 而達到具有安 易 科技的進步,人們對於電 電腦的廠商無不競相推出 算速度越來越快,其處理 統的氣冷式散熱系統已不 散熱系統的開發及製造, 1、2、3圖所示)係將吸熱 幫浦將水經由導管流到冷 一散熱鰭片,再藉由一安 水之熱量需經由冷熱交換 後再由風扇吹冷,此種間 故,而使得熱交換效果較 空氣,並且其堆疊式的冷 構龐大而不易找尋安裝的 間,且散熱方式的效果較 鑒於上述缺失,所以設計 中係利用液冷散熱系統結 化設計,而將主要散熱結 裝簡便、散熱效果佳、不 腦效能的要 更先進的產 晶片的發熱 敷使用。目 但此習知的 埠設置於發 熱交換器, 裝於散熱鰭 器表面與散 接熱傳遞以 差,且整個 熱交換器更 位置,造成 差。 出了本創作 構與卡座結 構整合至一 佔空間、多 求越來越 品,但隨 量亦大為 前雖有業 水冷式散 熱晶片 並於冷熱 片上之散 熱鰭片的 及風扇配 主機内部 因其組合 了安裝不 卡式液冷 合或組裝 卡座内, 點散熱等595757 :, case number Γ for explanation. [The new type of brain i this operation system has a machine, a sharp plate, convenient for loading and unloading, so that the scattered points dare to be the priority of the prior technology] ^ Press' with ;, so production 、 The host computer was transported, so the passer-by put in a water-cooled thermal system (such as Dixie, which uses a heat fan on the circulation exchanger to transfer heat to the heat exchanger, and the poor installation method is filled with thermal methods everywhere, resulting in 92201628 m correction technology Field] It is a card-type liquid-cooled heat dissipation module, especially a function that uses the liquid-cooled heat dissipation system structure and the size of the card and the control structure to improve the thermal effect and pass through the points of difference. Setting 'is applied to electricity | · | ·, and there is a cooling module with internal partitions and teeth, and the structure is occupied. The creator has a cooling module, and the module in the box has reached the progress of Anyi Technology. All race to launch the calculation speed is getting faster and faster, the air-cooled heat dissipation system of its processing system has not been developed and manufactured, (shown in Figures 1, 2, and 3). The tube flows to the cooling and cooling fins, and then the heat of a water needs to be cooled by the fan after the cold and heat exchange, which makes the heat exchange effect more air than the air, and its stacked cold structure is huge. It is not easy to find the installation space, and the effect of the heat dissipation method is more than the above-mentioned. Therefore, the design of the liquid cooling system is used in the design. Wafer is used for heating. However, the conventional port is installed in a heat exchanger, and the heat transfer between the surface of the heat sink and the diffuser is poor, and the entire heat exchanger is repositioned, resulting in poor performance. With the integration of the creative structure and the card holder structure into an occupied space, more and more products are required, but the quantity is also large. Although there are industrial water-cooled heat sink chips and heat sink fins on the hot and cold fins, and the interior of the fan with the host Because it combines the installation of non-card type liquid cooling or assembly in the card seat, point heat dissipation, etc.
595757 案號 92201628 νϋ月 曰 修正 一 …一···--. , ‘ 、 五、創作說明(2) —一 ' ' 優點。 【新型内容】 本創作卡式液冷散熱模組之主要目的,係提供一種液冷 散熱系統結構與卡座結合或組裝於盒體的模組化設計,以具 有安裝簡便、不佔空間的優點。 本創作卡式液冷散熱模組之另一目的,係提供一種液冷散熱 系統結構中,藉由分歧器的設置,而具有多點散熱的功能。 本創作卡式液冷散熱模組之再一目的,係提供一種散熱 佳之冷熱交換器以提升整體散熱模組的效率,其中主要利用 散熱性較佳之金屬管為材以螺旋方式環繞,藉此而形成一較 大的散熱面積,進而增進散熱模組散熱效益。 本創作卡式液冷散熱模組之又一目的,係提供一種密閉 循環式的液冷散熱系統,藉由液冷散熱系統結構與卡座結合 的密閉設計,而直接將熱源排放到主機殼外,更可將電腦主 機内部熱空氣排出,而具有較佳的散熱效果。 【實施方式】 有關本創作之詳細說明及技術内容,現配合圖式說明如 下: 第1圖 第2圖 第3圖 第4圖 圖; 第5圖 不意圖 係為習知之液冷系統結構立體示意圖; 係為習知之一冷熱交換器立體示意圖; 係為習知之另一冷熱交換器立體示意圖; 係為本創作卡式液冷散熱模組之實施例一立體示意 係為本創作卡式液冷散熱模組之實施例一立體分解595757 Case No. 92201628 νϋ 月 Said to amend one… one ........., ‘, five, creation instructions (2) — one '' advantages. [New content] The main purpose of the creation of the card-type liquid cooling module is to provide a modular design that combines the structure of the liquid cooling system with the card holder or is assembled in the box to have the advantages of simple installation and no space required . Another purpose of this creative card-type liquid-cooled heat dissipation module is to provide a liquid-cooled heat-dissipation system structure with the function of multi-point heat dissipation through the setting of a splitter. Another purpose of this creative card-type liquid-cooled heat dissipation module is to provide a cold heat exchanger with good heat dissipation to improve the efficiency of the overall heat dissipation module. Among them, a metal pipe with better heat dissipation is used to spirally surround the material. Forming a larger heat dissipation area, thereby improving the heat dissipation efficiency of the heat dissipation module. Another purpose of this creative card-type liquid-cooled heat dissipation module is to provide a closed-cycle liquid-cooled heat-dissipation system. Through the closed design of the combination of the liquid-cooled heat-dissipation system structure and the card holder, the heat source is directly discharged to the main casing In addition, it can discharge the hot air inside the computer host, which has better heat dissipation effect. [Embodiment] The detailed description and technical content of this creation are described below in conjunction with the drawings: Figure 1, Figure 2, Figure 3, Figure 4; Figure 5 is not intended to be a conventional three-dimensional schematic diagram of the structure of a liquid cooling system ; Is a three-dimensional schematic diagram of one of the known cold heat exchangers; is a three-dimensional schematic diagram of another known cold heat exchanger; is a three-dimensional illustration of the embodiment of the creative card-type liquid-cooled heat dissipation module; Example 1 of the module
第7頁 595757 案號9220] fi沏Page 7 595757 Case No. 9220] fi brew
修正 五、創作說明(3) ::圖,係為本創作卡式液冷散熱模組之實 施例一正視示意 第7圖,係為本創作卡式液冷散孰 圖; ........且之實施例一側視示意 I第8圖,係為本創作卡式液冷散埶模 |施例一立體示意圖; 、、也之與電腦主機結合實 第9圖,係為本創作卡式液冷散熱模 示意圖; 之結構實施例二正視 第1 0圖,係為本創作卡式液冷散孰 示意圖; ’,、、、組之結構實施例三正視 第11圖,係為本創作卡式液冷散 圖; 、,且之貫施例四正視示意 第1 2圖’係為本創作卡式液冷耑孰 I機結合側視示意圖; 夂貰狍例四興電腦主 第1 3圖,係為本創作卡式液冷散熱模組之 機結合立體示意圖。 、电細主 第1 4-1圖,係為本創作卡式液冷散熱模組實施於卡座之 另一實施例俯視圖。 屬 第1 4 - 2圖’係為本創作卡式液冷散熱模組實施於卡座之 另一實施例側視圖。 屬 第1 5 - 1圖’係為本創作卡式液冷散熱模組實施於盒體之 另一實施例俯視圖。 屬 I第15-2圖’係為本創作卡式液冷散熱模組實施於盒體之風 1另一實施例側視圖。 1 第1 6 - 1圖’係為本創作卡式液冷散熱模組之循環幫浦實施於 國 第8頁 595757Amendment V. Creation Instructions (3) :: Picture, which is the front view of the first embodiment of the creative card-type liquid-cooled cooling module, Figure 7, which is the creative card-type liquid-cooled dispersion diagram; ..... ... and the side view of the embodiment is shown in FIG. 8 which is a creative card-type liquid-cooled dispersing mold | Example 1 is a three-dimensional schematic diagram; Schematic diagram of the creative card-type liquid-cooled heat-dissipating model; The second embodiment of the structure of the creative card type is shown in FIG. 10, which is a schematic diagram of the creative card-type liquid-cooled dispersion; This creative card-type liquid-cooled scatter diagram; and, the fourth embodiment of the fourth embodiment is shown in the front view of Figure 12 is a schematic view of the creative card-type liquid-cooled machine I combined with the side view; Figure 13 is a three-dimensional schematic diagram of the combination of the machine for creating a card-type liquid cooling module. 1. The main picture of the electronic finesse Figures 4-1 are top views of another embodiment of the creative card-type liquid-cooled cooling module implemented on the card holder. Figure 1 4-2 is a side view of another embodiment of the creative card-type liquid-cooled heat dissipation module implemented on the card holder. Fig. 15-1 is a plan view of another embodiment of the creative card-type liquid-cooled heat dissipation module implemented in a box. Figure 15-2 of genus I is a side view of another embodiment of the creative card-type liquid-cooled heat-dissipating module implemented in the box body 1. 1 Figure 1 6-1 ′ is the circulation pump of the creative liquid-cooled cooling module for the country. Page 8 595757
卡座外之另 第16-2圖, 盒體之另一 係為本創作卡式液冷散熱模組之循環幫浦實施於 —實施例正視圖。 實施例正視圖。 第Π立1,’係為本創作卡式液冷散熱模組之結構實施例五正 視示意圖; 第1 7 - 2圖, 視示意圖; 係為本創作卡式液冷散熱模組之結構實施例五側 一 、=參閱『第4、5圖』’圖中係揭示本創作之實施例 一 > 4 Γ圖及實施例一立體分解示意圖,圖中見悉本創作 之,一之冷散熱模組係包含有一風扇卜一卡座2、一循環幫 浦3、a吸熱埠4、—接頭及一冷熱交換器7所形成,其中卡 座2係。又置有—L型卡榫2 1,於L型卡榫2 1兩端係分別設置有 ’凸片2 2及一螺絲槽2 3供與電腦主機固接,並於中間設置有 一散熱孔24與散熱風扇1唯一的侧面排風口 11相對應供熱空 氣排出’而L型卡榫2 1之内側連接有一基板2 5,於基板2 5下 緣設置有複數個插片2 5 1與電腦主機内的插槽A做一接制,且 該基板2 5上靠近L型卡榫2 1之一侧開設有一圓孔2 5 2,並於圓 孔2 5 2的周圍設置有複數個螺絲孔253,供基板25下方的散熱 風扇1上所設置的螺絲孔丨2對應後做一鎖制, 方係設置有一冷熱交換器7 ; 、圓Figure 16-2 outside the card holder, the other part of the box body is the circulation pump of the creative liquid-cooled cooling module implemented in the front view of the embodiment. Example front view. Chapter II, '1 is a schematic view of the fifth embodiment of the structure of the creative card-type liquid-cooled heat dissipation module; Figures 17-2 are schematic views of the structure; Five sides, one, = see "Figures 4 and 5" The figure shows the first embodiment of the creation > 4 Γ and the three-dimensional exploded view of the first embodiment. The system consists of a fan, a card holder 2, a circulating pump 3, a heat absorption port 4, a joint and a cold heat exchanger 7, wherein the card holder 2 is formed. There are also-L-shaped tenon 21, and two ends of the L-shaped tenon 21 are provided with a 'convex sheet 2 2 and a screw slot 2 3 for fixed connection with the computer host, and a heat dissipation hole 24 is provided in the middle. Corresponds to the only side air outlet 11 of the cooling fan 1 for heating air to be discharged ', and a base plate 2 5 is connected to the inner side of the L-shaped tenon 2 1, and a plurality of inserts 2 5 1 and a computer host are arranged at the lower edge of the base plate 2 5 The inner slot A is made one by one, and a circular hole 2 5 2 is opened on one side of the base plate 25 near the L-shaped tenon 2 1, and a plurality of screw holes 253 are provided around the circular hole 2 5 2. For the screw holes 丨 2 provided on the cooling fan 1 below the base plate 25, a lock is made after corresponding, and a cold heat exchanger 7 is provided on the side;
595757 --92201628’ 4‘,f朱 r 月 曰 修正_ 五、創作說明一 — 3 1 ·’當中當液體經過冷熱交換器7時設於下方的風扇1則進行 氣冷的交換’藉由螺旋的設計讓液體能迂迴於風扇1上方, 以提供較大的散熱面積使整體散熱系統的效益更高;而循環 幫浦3之液體出口 3 2則與迴路導管7 2—端連接另一端則與吸 熱埠4輸入端固接,以傳送經冷熱交換器7已經冷卻的液體至 吸熱埠4。 其中循環幫浦3係固設於基板2 5上之矩形孔2 5 4中,且於 基板2 5上圓孔2 5 2與矩形孔2 5 4中間,設置的固定架2 6上開設 有複數個U型槽26卜26 2供迴路導管7卜T 3容置固定,595757 --92201628 '4', f Zhur Yue Yue correction_ V. Creative Instructions I— 3 1 · 'Among them, when the liquid passes through the cold heat exchanger 7, the fan 1 located below is for air-cooled exchange' The design allows the liquid to bypass the fan 1 to provide a larger heat dissipation area and make the overall cooling system more efficient. The liquid outlet 3 2 of the circulation pump 3 is connected to the circuit duct 7 2-and the other end is connected to The input end of the heat absorption port 4 is fixedly connected to transmit the liquid that has been cooled by the cold heat exchanger 7 to the heat absorption port 4. Among them, the circulation pump 3 is fixed in the rectangular holes 2 5 4 on the substrate 25, and between the circular holes 2 5 2 and the rectangular holes 2 5 4 on the substrate 25, a plurality of fixed frames 2 6 are provided. U-shaped grooves 26, 26, 2 for the loop ducts, 7 and T 3,
承上述吸熱埠4係為一矩形盒體4 1内形成有一容置槽 42’該容置槽42内設置有複數個隔板43、43’、43’’,其中 隔板4 3之一端係與容置槽4 2的一侧内璧銜接,另一端則不與 另一侧内璧相接,而隔板4 3,的設置與隔板4 3相反,如此交 錯設置而形成一曲繞的S形迴路好讓液體於吸熱埠4能完整的 循環並將熱能完整的帶走,所以矩形盒體41之底部係貼附於 電腦晶片上以傳導晶片於運算時所產生的熱能。 另於矩形盒體41開口一端之周圍延伸有凸緣44,並於凸 緣4 4上設置有複數個穿孔4 4 1與防漏墊片4 5邊緣周圍設置的 穿孔4 5 1相對應,且再與一蓋體4 6之邊緣周圍設置穿孔4 6 1對 應’利用螺絲的鎖合將蓋體46、防漏墊片45與矩形盒體4 1逐· 一組合形成一吸熱埠4。 承上述請同時參閱『第6、7、8圖』,圖中係揭示本創 作之實施例一正視示意圖、實施例一側視示意圖及與電腦主 機結合實施例一立體示意圖,圖中見悉本創作之卡式液冷散 熱模組係於卡座2中的基板2 5下緣,設置有複數個插片2 5 1與The above-mentioned heat absorption port 4 is a rectangular box body 41. An accommodating groove 42 'is formed in the accommodating groove 42. A plurality of partition plates 43, 43', 43 '' are arranged in the accommodating groove 42. One end of the partition plate 4 3 is It is connected with the inner cymbal on one side of the accommodation groove 4 2, but the other end is not connected with the inner cymbal on the other side, and the partition plate 4 3 is arranged opposite to the partition plate 43. The S-shaped circuit allows the liquid to be completely circulated in the heat absorption port 4 and completely removes the heat energy, so the bottom of the rectangular box body 41 is attached to a computer chip to conduct the heat energy generated by the chip during operation. In addition, a flange 44 is extended around the open end of the rectangular box body 41, and a plurality of perforations 4 4 1 are provided on the flange 4 4 corresponding to the perforations 4 5 1 provided around the edge of the leakproof gasket 4 5, and Correspondingly, a perforation 4 6 1 is provided around the edge of a cover body 4 6. The cover body 46, the leakproof gasket 45 and the rectangular box body 4 are combined one by one to form a heat absorption port 4 by screwing. For the above, please also refer to "Figures 6, 7, and 8". The figure is a schematic view of the first embodiment of the creation, a schematic view of the side view of the embodiment, and a three-dimensional schematic view of the embodiment combined with the computer host. The created card-type liquid-cooled heat dissipation module is located on the lower edge of the base plate 2 5 in the card holder 2, and is provided with a plurality of inserts 2 5 1 and
第10頁 595757 修正 案號 92201628 五、創作說明(6) ............. 電腦主機内的插槽A做一接制,再經由延伸的迴路導管7 2、 7 3與吸熱埠4固接,其中吸熱埠4係貼附於發熱晶片B上而完 成本創作卡式液冷散熱模組,其中: 利用循環幫浦3的抽送功能而使得液體得以循環流動, 將冷熱交換器7内的液體由迴路導管71送入,再經由迴路導 管7 2輸入吸熱埠4内,藉由吸熱埠4内設置的隔板4 3、4 3 ’、 4 3 ’’的交錯迂迴的設計使得液體呈一 S型的曲繞方式,而利 用液體吸熱的功能得吸收晶片B的熱源導至吸熱埠4並經由迴 路導管73帶出導入連接的冷熱交換器7 ;然另於側面為出風 口之風扇1吸風而產生空氣的流動,進而將冷熱交換器7内的 水溫散出,並由出風口 1 1排出電腦主機殼外。 請參閱『第9圖』所示,圖中見悉本創作之卡式液冷散 熱模組係將風扇1、循環幫浦3及冷熱交換器7設置於卡座2 中,另於循環幫浦3連接的迴路導管7 2之一端與分歧器6連 接,並由分歧器6的另一端所設置的出口分別連接有迴路導 管74、77,該迴路導管7 4之另一端係與吸熱埠4之液體入口 4a連接,吸熱埠4之液體出口 4b則與迴路導管75連接再連接 至分歧器6 ’;另於,迴路導管7 7之另一端利用接頭與吸熱埠 4’之液體入口 4a’連接,而液體出口 4b’經迴路導管7 8連接至 分歧器6 ’,該分歧器6 ’則連接有一迴路導管7 6與冷熱交換器 7延伸的迴路導管7 3連接,而使得吸熱埠4、4 ’成一並聯循環 模式。 另請參閱『第1 0圖』,圖中見悉本創作之卡式液冷散熱 模組係包含有兩個吸熱埠4、4 ’,其連接方式係為,循環幫 浦3連接的迴路導管72之另一端與吸熱埠4’的液體入口 4a’連Page 10 595757 Amendment No. 92201628 V. Creative Instructions (6) ............. Slot A in the host computer is made one-to-one, and then through the extended circuit conduit 7 2, 7 3 is fixedly connected to the heat absorption port 4, wherein the heat absorption port 4 is attached to the heating chip B to complete the creative card-type liquid-cooled heat dissipation module, in which: the circulation function of the circulation pump 3 is used to make the liquid circulate, The liquid in the cold heat exchanger 7 is sent in by the return pipe 71, and then input into the heat absorption port 4 through the return pipe 72, and the staggered circuits of the partition plates 4 3, 4 3 ′, 4 3 ”are arranged in the heat absorption port 4. The design makes the liquid take the form of an S-shaped winding, and the heat source of the liquid that absorbs the heat of the wafer B is guided to the heat absorption port 4 and taken out through the return conduit 73 to the cold heat exchanger 7 connected to it; The fan 1 at the air outlet draws air to generate air flow, and further dissipates the temperature of the water in the cold heat exchanger 7 and is discharged out of the computer main body through the air outlet 11. Please refer to the "Figure 9", which shows that the card-type liquid-cooled heat dissipation module of this creation is equipped with a fan 1, a circulating pump 3, and a cold heat exchanger 7 in the card holder 2, and the circulating pump 3 One end of the connected loop duct 7 is connected to the branch 6 and the outlets provided at the other end of the branch 6 are connected to loop ducts 74 and 77 respectively. The other end of the loop duct 7 4 is connected to the heat sink 4 The liquid inlet 4a is connected, and the liquid outlet 4b of the heat absorption port 4 is connected to the circuit conduit 75 and then connected to the branch 6 '; In addition, the other end of the circuit conduit 7 7 is connected to the liquid inlet 4a' of the heat absorption port 4 'through a joint, The liquid outlet 4b 'is connected to the branch 6' via the return pipe 7 8 which is connected to a return pipe 7 6 and the return pipe 7 3 extending from the cold heat exchanger 7 so that the heat absorption ports 4 and 4 ' Into a parallel cycle mode. Please also refer to "Figure 10", which shows that the card-type liquid-cooled heat dissipation module of this creation contains two heat absorption ports 4, 4 ', and its connection method is the loop duct connected to the circulation pump 3. The other end of 72 is connected to the liquid inlet 4a 'of the heat absorption port 4'.
595757 .正替換 案號 9220162¾ 修正 曰 …' 卞 ^ , 五、創作說明(7) i —"“ 接,而液體出口 4b’則經由迴路導管79連接至另一吸熱埠4的 液體入口 4a,該吸熱埠4則於液體出口 4b再經由迴路導管791 與冷熱交換器7所延伸的迴路導管7 3連接,而使得吸熱埠4、 4 ’成一串聯循環模式。 另請參閱『第1 1、1 2及1 3圖』,圖中係揭示本創作之實 施例四正視示意圖、實施例四與電腦主機結合側視示意圖、 實施例四與電腦主機結合立體示意圖,圖中見悉本創作之卡 式液冷散熱模組係可實施於盒體8之中,而依序設有風扇1、 冷熱交換器7與循環幫浦3,其中冷熱交換器7與循環幫浦3之 間亦藉由迴路導管7 1連結,並經由循環幫浦3所延伸迴路管 體7 2至吸熱埠4之後再回流至迴路管體7 3完成整體的循環, 且藉由風扇1將熱氣抽吸並由盒體8側部之排風口 8 3排出;其 中與前述實施例之差異僅於風扇1的配置位置,此方式係將 風扇1以水平橫置的方式配置後可減少液冷散熱模組所需的 厚度,藉此即可實施於行動電腦等電子產品結構中。 請參閱『第1 4 - 1、1 4 - 2圖』,係為一離心式風扇示意 圖,本創作之卡式液冷散熱模組係可係將離心式風扇1 a取代 實施例一(請參照第5圖)的風扇1,該離心式風扇1 a係於頂部 設有一入風口 1 a 3供葉片1 a 2將熱氣吸入,再將由排氣口 lal 排出。 請參閱『第1 5 - 1、1 5 - 2圖』,係為一橫流式風扇示意 圖,本創作之卡式液冷散熱模組係可係將橫流式風扇1 b取代 實施例四(請參照第1 1圖)的風扇1,該橫流式風扇1 b係於對 應的兩側各設置有入風口 lb3及排氣口 lbl,經由葉片lb2的 轉動,可由入風口 lb 3做一橫向的吸入和排氣口 1 b 1做一橫向595757. Is replacing case number 9220162¾ Amendment said ... '卞 ^, V. Creative Instructions (7) i — " ", and the liquid outlet 4b' is connected to the liquid inlet 4a of the other heat absorption port 4 via the return pipe 79, The heat absorption port 4 is connected to the liquid outlet 4b and the circuit pipe 7 3 extended by the cold heat exchanger 7 through the circuit pipe 791, so that the heat absorption ports 4 and 4 ′ are connected in a series circulation mode. See also "sections 1 and 1 2 and 1 3 "are the front view of the fourth embodiment of the creation, the side view of the fourth embodiment combined with the computer host, and the three-dimensional view of the fourth embodiment combined with the computer host. The liquid-cooled heat dissipation module can be implemented in the box 8 and is provided with a fan 1, a cold heat exchanger 7 and a circulating pump 3 in order, and a circuit duct is also connected between the cold heat exchanger 7 and the circulating pump 3. 7 1 is connected and passes through the loop pipe 7 extended by the circulation pump 3 to the heat absorption port 4 and then flows back to the loop pipe 7 3 to complete the overall cycle, and the hot air is sucked by the fan 1 and is passed from the side of the box 8 The exhaust port 8 of the part is exhausted; The difference between the examples is only in the configuration position of the fan 1. This method is to arrange the fan 1 horizontally and horizontally to reduce the thickness required for the liquid-cooled heat dissipation module, which can be implemented in electronic products such as mobile computers. Please refer to "Figures 1-4 and 1-4-2", which is a schematic diagram of a centrifugal fan. The card-type liquid-cooled cooling module of this creation can replace the centrifugal fan 1 a with the first embodiment (please (Refer to Figure 5) Fan 1, the centrifugal fan 1 a is provided with an air inlet 1 a 3 at the top for the blades 1 a 2 to suck in hot air and then exhaust it through the exhaust port lal. Please refer to "P. 1 5-1 "1, 2-5" is a schematic diagram of a cross-flow fan. The card-type liquid-cooled cooling module of this creation can be a cross-flow fan 1 b instead of the fan 1 of the fourth embodiment (please refer to Figure 11). The cross-flow fan 1 b is provided with an air inlet lb3 and an air outlet lbl on the corresponding two sides. Through the rotation of the blade lb2, the air inlet lb 3 can be used as a horizontal suction and air outlet 1 b 1 as a Horizontal
ϋ'ιϋ'ι
第12頁 595757Page 12 595757
_1¾. 五、創作說明(8) 排氣。 又另見於 冷散熱模組之 視圖’圖中見 施;同理,本 體8模組以外纪 限。 又另見於 冷散熱模組之 與第7圖所示, 調換,使風扇 換,屆時再經 的偈限。 綜合以上 已,並非用來 利範圍所做的 蓋。 修正 92201628 Μ_a 『第1 6 - :l、1 6 - 2圖』所示,係為本創作卡式液 循環幫浦實施於卡座外或盒體之另一實施例正 悉其中循環幫浦3可與卡座2以分離的方式實 創作卡式液冷散熱模組之循環幫浦3設置於盒 丨方式實施,藉此以迎合設置環境的條件的偈 『第17-;1、17-2圖』所示,係為本創作卡式液 實施例五之正視圖及側視圖,承如上述第6圖 其中係可將風扇1與冷熱交換器7之上下位置 φ 1以吹送的方式與冷熱交換器7之熱量進行交 由散熱孔2 4排出,藉此以迎合設置環境的條件 所述者,僅為本創作所運用之較佳實施例而 限定本創作實施之範圍。即凡依本創作申請專 均等變化與修飾,皆為本創作專利範圍所涵 595757 Ίψ 修正 案號 92201628 /束 牟 圖式簡單說明 '' 第1圖,係為習知之液冷系統結構立體示意圖; 第2圖,係為習知之一冷熱交換器立體示意圖; 第3圖,係為習知之另一冷熱交換器立體示意圖; 第4圖,係為本創作卡式液冷散熱模組之實施例一立體示意 圖, 第5圖,係為本創作卡式液冷散熱模組之實施例一立體分解 不意圖, 第6圖,係為本創作卡式液冷散熱模組之實施例一正視示意 圖, 第7圖,係為本創作卡式液冷散熱模組之實施例一側視示意 圖, 第8圖,係為本創作卡式液冷散熱模組之與電腦主機結合實 施例一立體示意圖; 第9圖,係為本創作卡式液冷散熱模組之結構實施例二正視 不意圖, 第1 0圖,係為本創作卡式液冷散熱模組之結構實施例三正視 不意圖, 第1 1圖,係為本創作卡式液冷散熱模組之實施例四正視示意 圖; 第1 2圖,係為本創作卡式液冷散熱模組之實施例四與電腦主 機結合側視示意圖; 第1 3圖,係為本創作卡式液冷散熱模組之實施例四與電腦主 機結合立體不意圖。 第1 4 - 1圖,係為本創作卡式液冷散熱模組實施於卡座之風扇 另一實施例俯視圖。_1¾. V. Creation Instructions (8) Exhaust. See also in the view of the cooling module's view '. See the same figure; for the same reason, the body 8 module is not restricted. See also Figure 7 in the cooling module. Replace the fan, and then change the fan limit. Taken together, this is not a cover for the benefit of the scope. Amendment 92201628 Μ_a "Figure 16-: 1, 16-2" shows that another embodiment of the creative cassette fluid circulation pump is implemented outside the card holder or the box body. It is understood that the circulation pump 3 The circulating pump 3 of the card-type liquid-cooled heat-dissipating module can be realized separately from the card holder 2 by being installed in a box, and thereby meeting the conditions of the installation environment. 偈 『第 17- ; 1,17-2 As shown in the figure, it is a front view and a side view of the fifth embodiment of the creative cassette fluid. As shown in FIG. 6 above, the upper and lower positions φ 1 of the fan 1 and the cold heat exchanger 7 can be blown and cooled. The heat of the exchanger 7 is discharged through the heat dissipation holes 24, so as to meet the conditions of the setting environment, as described above, the scope of the implementation of this creation is limited only by the preferred embodiment used in this creation. That is to say, all equal changes and modifications applied to this creative application are covered by the scope of the creative patent 595757 Ίψ amendment No. 92201628 / simple description of the beam diagram '' Figure 1, which is a three-dimensional schematic diagram of the structure of a conventional liquid cooling system; Fig. 2 is a three-dimensional schematic diagram of a conventional cold heat exchanger; Fig. 3 is a three-dimensional schematic diagram of another conventional cold heat exchanger; and Fig. 4 is a first embodiment of a creative liquid-cooled heat sink module. The three-dimensional schematic diagram, FIG. 5 is a schematic illustration of the first embodiment of the creative card-type liquid-cooled heat dissipation module, and the sixth diagram is a front-view schematic diagram of the first embodiment of the creative card-type liquid-cooled heat dissipation module. FIG. 7 is a schematic side view of the embodiment of the creative card-type liquid-cooled heat dissipation module, and FIG. 8 is a three-dimensional schematic view of the embodiment of the creative card-type liquid-cooled heat dissipation module in combination with a computer host; The figure shows the structure of the creative card-type liquid-cooled heat dissipation module according to the second embodiment, Fig. 10, which shows the structure of the creative card-type liquid-cooled heat dissipation module, the third embodiment, without the front view. Figure, this is the creative card Embodiment 4 of the liquid-cooled heat-dissipation module of the fourth embodiment is a front view; Fig. 12 is a side view of the combination of the fourth embodiment of the card-type liquid-cooled heat-dissipation module and the computer host; The fourth embodiment of the card-type liquid-cooled heat dissipation module is not intended to be integrated with the computer host. Figures 14-1 are top views of another embodiment of the fan for the creative card-type liquid-cooled cooling module implemented on the card holder.
第14頁 595757 案號 92201628 桊;^月 曰 修正 圖式簡單說明 第1 4-2圖,係為本創作卡式液冷散熱模組實施於卡座之風扇 另一實施例側視圖。 第1 5 - 1圖,係為本創作卡式液冷散熱模組實施於盒體之風扇 另一實施例俯視圖。 第1 5 - 2圖,係為本創作卡式液冷散熱模組實施於盒體之風扇 另一實施例側視圖。 第1 6 - 1圖,係為本創作卡式液冷散熱模組之循環幫浦實施於 卡座外之另一實施例正視圖。 第1 6 - 2圖,係為本創作卡式液冷散熱模組之循環幫浦實施於 盒體之另一實施例正視圖。 第1 7 - 1圖,係為本創作卡式液冷散熱模組之結構實施例五正 視示意圖; 第1 7-2圖,係為本創作卡式液冷散熱模組之結構實施例五側 視示意圖;Page 14 595757 Case No. 92201628 桊; 月 月 Correction Brief Description of Drawings Figures 1 4-2 are side views of another embodiment of the fan of the creative card-type liquid-cooled cooling module implemented on the card holder. Figures 15-1 are top views of another embodiment of the fan of the creative card-type liquid-cooled heat dissipation module implemented in the box. Figures 15-2 are side views of another embodiment of the fan of the creative card-type liquid-cooled cooling module implemented in the box. Figures 16-1 are front views of another embodiment of the cyclic pump of the creative liquid-cooled cooling module implemented outside the card holder. Figures 16-2 are front views of another embodiment of the circulating pump of the creative liquid-cooled cooling module implemented in the box. Figures 17-1 are schematic diagrams of the fifth embodiment of the structure of the creative card-type liquid-cooled heat dissipation module; Figures 1 7-2 are the five sides of the structural embodiment of the creative card-type liquid-cooled heat dissipation module. View diagram;
第15頁Page 15
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92201628U TW595757U (en) | 2003-01-29 | 2003-01-29 | Card-type liquid cooling heat sink module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92201628U TW595757U (en) | 2003-01-29 | 2003-01-29 | Card-type liquid cooling heat sink module |
Publications (1)
Publication Number | Publication Date |
---|---|
TW595757U true TW595757U (en) | 2004-06-21 |
Family
ID=34059857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92201628U TW595757U (en) | 2003-01-29 | 2003-01-29 | Card-type liquid cooling heat sink module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW595757U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711414B (en) * | 2012-04-20 | 2015-07-08 | 华为技术有限公司 | Liquid cooling device |
TWI725422B (en) * | 2018-05-31 | 2021-04-21 | 技嘉科技股份有限公司 | Liquid cooling device, coolant circulation system , and liquid leaking detection method |
TWI785409B (en) * | 2020-10-30 | 2022-12-01 | 大陸商深圳昂湃技術有限公司 | Easily expanded liquid-cooled heat sink |
-
2003
- 2003-01-29 TW TW92201628U patent/TW595757U/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711414B (en) * | 2012-04-20 | 2015-07-08 | 华为技术有限公司 | Liquid cooling device |
US9961800B2 (en) | 2012-04-20 | 2018-05-01 | Huawei Technologies Co., Ltd. | Liquid cooling apparatus |
TWI725422B (en) * | 2018-05-31 | 2021-04-21 | 技嘉科技股份有限公司 | Liquid cooling device, coolant circulation system , and liquid leaking detection method |
TWI785409B (en) * | 2020-10-30 | 2022-12-01 | 大陸商深圳昂湃技術有限公司 | Easily expanded liquid-cooled heat sink |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI684853B (en) | Liquid-cooled heat exchange device | |
US20080135211A1 (en) | Heat-Exchanger Device and Cooling System | |
CN206411572U (en) | Card insert type cooling cabinet | |
JP2011061201A (en) | Radiator module | |
CN106774740A (en) | Board-like water-cooled graphic card radiator | |
TWI304168B (en) | ||
TW201231907A (en) | Heat exchanger | |
US20080006396A1 (en) | Multi-stage staggered radiator for high performance liquid cooling applications | |
JP2004158641A (en) | Housing of electronic apparatus | |
TW595757U (en) | Card-type liquid cooling heat sink module | |
TWI761086B (en) | Liquid cooling module and its liquid cooling head | |
TWI305574B (en) | Fin assembly and heat dissipation device with such fin assembly | |
KR100513010B1 (en) | Cooler of notebook personal computer and fabricating method of the same | |
CN209914356U (en) | Heat radiation structure of condenser | |
JP2007004765A (en) | Liquid-cooled computer device | |
KR101897931B1 (en) | System for cooling a processor in electronic device | |
CN216596944U (en) | Heat radiator for hard disk in server system | |
CN206480615U (en) | Integral type liquid-cooling heat radiator | |
TW201013368A (en) | Housing structure of portable electronic device | |
JP3137709U (en) | Water cooling module for electronic equipment | |
TWI803099B (en) | Immersion cooling system | |
TWM256682U (en) | Cooling device for electronic device | |
TWM624738U (en) | Servo cabinet heat removal device | |
TWM643829U (en) | Integrated liquid cooling system | |
JP2009239118A (en) | Heat sink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |