JP2004158641A - Housing of electronic apparatus - Google Patents

Housing of electronic apparatus Download PDF

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Publication number
JP2004158641A
JP2004158641A JP2002322802A JP2002322802A JP2004158641A JP 2004158641 A JP2004158641 A JP 2004158641A JP 2002322802 A JP2002322802 A JP 2002322802A JP 2002322802 A JP2002322802 A JP 2002322802A JP 2004158641 A JP2004158641 A JP 2004158641A
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JP
Japan
Prior art keywords
housing
electronic
air
heat exchanger
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002322802A
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Japanese (ja)
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JP2004158641A5 (en
Inventor
Yoshio Okinishi
佳雄 沖西
Original Assignee
Mitsubishi Electric Corp
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, 三菱電機株式会社 filed Critical Mitsubishi Electric Corp
Priority to JP2002322802A priority Critical patent/JP2004158641A/en
Publication of JP2004158641A publication Critical patent/JP2004158641A/en
Publication of JP2004158641A5 publication Critical patent/JP2004158641A5/ja
Pending legal-status Critical Current

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Abstract

An object of the present invention is to improve the cooling efficiency of an electronic device and to suppress a rise in temperature inside a housing due to external heat received by solar radiation or the like.
An electronic device is provided with a housing closed portion, a housing open portion through which outside air can flow, and a heat exchanger that performs heat exchange between the housing closed portion and the housing open portion. In the electronic device housing 1 composed of 2 and 3, a ventilation path is provided between the side wall and the front wall of the housing sealing unit 100 and the electronic device. Further, the exhaust side air and the intake side air of the heat exchangers 2 and 3 are separated by a partition plate to prevent mixing of high temperature air and low temperature air.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic device housing.
[0002]
[Prior art]
2. Description of the Related Art In recent years, the heat generation of electronic devices housed in electronic device housings has been increasing. In order to obtain heat radiation performance corresponding to the amount of heat generated, some measures have been taken, such as installing a plurality of heat exchangers in parallel.
[0003]
For example, in a conventional electronic device housing, a partition plate is provided vertically between a plurality of sets of cooling fans facing each other to prevent mixing of exhaust air from the cooling fans. (For example, see Patent Document 1)
[0004]
[Patent Document 1]
JP-A-6-204673 (FIG. 1)
[0005]
[Problems to be solved by the invention]
As described above, there has been a demand for further improving the cooling efficiency of the electronic device housing with the increase in heat generation of the electronic device.
[0006]
In addition, particularly in an electronic device housing installed outdoors, there is a problem that it is necessary to suppress a rise in the temperature of the housing sealing portion due to external heat received by solar radiation.
[0007]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to obtain an electronic device housing with high cooling efficiency for electronic devices.
[0008]
[Means for Solving the Problems]
An electronic device housing according to the present invention includes a housing closed portion in which the electronic device is installed, a housing open portion through which outside air can flow, and a heat exchanger that performs heat exchange between the housing closed portion and the housing open portion. The air conditioner further includes an exchanger, and a ventilation path through which the air cooled by the heat exchanger descends is provided between the side wall of the enclosure and the electronic device.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, various embodiments of the present invention will be described.
Embodiment 1 FIG.
FIG. 1 is a front view of an electronic device housing according to Embodiment 1 of the present invention. As shown in the figure, the electronic device housing 1 includes a lower housing sealing portion 100 and an upper housing opening portion 200. Heat is exchanged between the casing closed part 100 and the casing opening part 200 by the heat exchanger (left) 2 and the heat exchanger (right) 3. Electronic devices 34 to 36 having a unit shape and an electronic device 14 having a board shape are provided below the housing sealing portion 100. While the casing sealing portion 100 is substantially sealed to protect the electronic device, the casing opening portion 200 allows air to flow for cooling the inside of the casing. The high-temperature air heated by the heat generated by these electronic devices is pushed up to the upper part of the enclosure unit 100 by the fan unit 37 and is sucked from the heat exchanger internal intake ports 4 and 6, and the heat exchanger internal exhaust ports 5 and 6. Exhausted from 7 At this time, in the process of conducting heat through the finned heat pipes 12 and 13 of the left and right heat exchangers, the sucked high-temperature air is taken into the housing opening portion 200 through the ventilation holes 67 and 68 and taken out of the heat exchanger. It exchanges heat with the low-temperature air sucked from the ports 8 and 10. The air heated to a high temperature by the heat exchange is exhausted from the heat exchanger external exhaust ports 9 and 11, and is exhausted to the outside of the electronic device housing 1.
[0010]
A partition plate 38 is provided at a portion where high-temperature air exhausted from the heat exchanger external exhaust ports 9 and 11 interferes with each other. Further, partition plates 39 and 40 are provided to separate low-temperature air taken into the heat exchanger external intake ports 8 and 10 and high-temperature air exhausted from the heat exchanger external exhaust ports 9 and 11. Similarly, partition plates 41 and 42 are provided to partition the intake side and the exhaust side inside the heat exchanger.
[0011]
Partition plates 43 and 44 are provided between the side walls of the enclosure 100 and the internal devices (the board-shaped electronic device 14, the unit-shaped electronic devices 34 to 36, and the fan unit 37). The plates 43 and 44 extend downward continuously from the partition plates 41 and 42. The partition plates 43 and 44 and the side wall of the casing sealing portion 100 define ventilation paths 45 and 46 for allowing the low-temperature air exhausted from the heat exchanger internal exhaust ports 5 and 7 to flow to the bottom of the electronic device casing 1. are doing. Further, between the partition plates 43 and 44 and the unit-shaped electronic device 36, ventilation passages 47 and 48 for passing low-temperature air for cooling the unit-shaped electronic device 36 are formed.
[0012]
FIG. 2 is a cross-sectional view taken along the line AA shown in FIG. As shown in the figure, between the front panels 52 to 57 and the front wall of the enclosure 100, a ventilation path 49 for ventilating the bottom of the electronic device enclosure 1 to the upper part of the enclosure 100 is provided. Be composed. At the lower part of the front panel 57, there are provided ventilation holes 50 for sending low-temperature air, which has passed through the ventilation passages 45 and 46 to the bottom of the electronic device housing 1, to the ventilation passage 49. A ventilation hole 51 is provided in an upper part of the front panel 52.
[0013]
FIG. 3 is a sectional view taken along the line BB shown in FIG. As shown in the figure, a Y-shaped partition is formed between the facing heat exchanger external exhaust ports 9 and 11 by the partition plates 38 and 60 to prevent interference of the exhausted high-temperature air, Ventilation passages 58 and 59 are provided for rectifying the air discharged from the exchanger external exhaust ports 9 and 11 and exhausting the rectified air toward the ventilation holes 64 provided on the back surface of the electronic device housing 1.
[0014]
FIG. 4 is an enlarged view of a portion C shown in FIG. As shown in the figure, a ventilation path 61 is formed above the unit-shaped electronic device 36 to allow the low-temperature air to flow through the board-shaped electronic device 14 and allows the low-temperature air to flow through the unit-shaped electronic devices 34 and 35. Ventilation passages 62 and 63 are formed.
[0015]
Next, circulation of the low-temperature air and the high-temperature air in the housing closed portion 100 and the housing open portion 200 of the electronic device housing 1 will be described.
As shown in FIG. 1, low-temperature air discharged from the heat exchanger internal exhaust ports 5 and 7 is collected at the bottom of the enclosure 100 through the ventilation passages 45 and 46. The low-temperature air collected at the bottom is sent around the unit-shaped electronic devices 34 to 36 and the board-shaped electronic device 14 by the fan unit 37 to cool them. The high-temperature air heated by the unit-shaped electronic devices 34 to 36, the board-shaped electronic device 14, and the like is passed through the ventilation path 66 by the fan unit 37 and guided to the heat exchanger internal intake ports 4 and 6.
[0016]
The high-temperature air heated by the unit-shaped electronic devices 34 to 36 and the substrate-shaped electronic device 14 and the like and the low-temperature air discharged from the heat exchanger internal exhaust ports 5 and 7 are separated by the partition plates 41, 42 and 43 and 44. They are separated and not mixed. Thereby, the high-temperature air is efficiently taken into the heat exchangers 2 and 3, and the low-temperature air is effectively blown to the electronic device.
[0017]
Further, the ventilation passages 47 and 48 formed by the side surfaces of the unit-shaped electronic device 36 and the partition plates 43 and 44 installed at the lowermost part of the enclosure 100 have a small cross-sectional area. The wind speed of the low-temperature air passing through 48 can be increased. By arranging the unit-shaped electronic devices 34 and 35 near the outlets of the ventilation passages 47 and 48 where the wind speed is high, the ventilation passages 62 and 63 are configured as shown in FIG. 4, and the cooling efficiency can be improved. .
[0018]
In addition, as shown in FIG. 4, the low-temperature air that has risen in the ventilation path 48 is passed through the ventilation path 61 to the board-shaped electronic device 14.
[0019]
The low-temperature air sucked from the ventilation holes 67 and 68 on the side surface of the housing opening 200 is sucked into the heat exchangers 2 and 3 from the heat exchanger external air inlets 8 and 10 and from the heat exchanger external air outlets 9 and 11. The air is exhausted to the center of the housing opening 200. The exhausted high-temperature air is exhausted from the ventilation holes 64 on the back of the electronic device housing 1 through the ventilation paths 58 and 59 shown in FIG. At this time, the high-temperature air exhausted from the heat exchangers 2 and 3 is efficiently guided to the rear surface of the housing by the Y-shaped rectifying plate formed by the partition plates 38 and 60.
[0020]
As shown in FIG. 2, the low-temperature air exhausted from the heat exchanger internal exhaust ports 5 and 7 and collected at the bottom of the enclosure 100 is discharged to the ventilation path 49 through the ventilation hole 50, and And is taken into the heat exchangers 2 and 3 from the ventilation holes 51. Thus, a layer of circulating air is formed on the front surface of the housing enclosure 100, so that the electronic device housing 1 can be insulated from the outside, and the internal temperature of the electronic device housing 1 due to external heat received by solar radiation or the like. The rise can be suppressed.
[0021]
As for the side surface and the back surface of the enclosure 100, ventilation passages 45 and 46 are formed on the side surface, and a ventilation passage 65 is formed between the back wall and the electronic device as shown in FIG. In addition, an air layer is formed between the electronic device housing and the outside, so that a temperature rise due to external heat reception can be suppressed.
[0022]
Next, the heat exchange processing by the heat exchangers 2 and 3 will be described.
As shown in FIG. 1, the wind direction is opposite between the heat exchangers 2 and 3 on the housing closed portion 100 side and the housing open portion 200 side. With such a configuration, the characteristics of the finned heat pipes 12 and 13 can be utilized, and the cooling efficiency can be increased.
[0023]
As described above, according to the first embodiment, the ventilation passages 45 and 46 are provided on the side surfaces of the enclosure unit 100 to prevent mixing of the high-temperature air and the low-temperature air, and efficiently discharge the low-temperature air. There is an effect that the cooling efficiency is improved by being supplied to the equipment.
[0024]
Further, according to the first embodiment, the fan unit 37 is provided below the heat exchangers 2 and 3 of the enclosure unit 100, so that the high-temperature air generated from the electronic device can be efficiently removed by the heat exchangers 2 and 3. 3 can be supplied.
[0025]
According to the first embodiment, the partition plates 41, 42, 43, and 44 of the housing closed portion 100 and the partition plates 39 and 40 of the housing opening portion 200 are provided to provide heat exchangers 2 and 3. By separating the air on the intake side and the air on the exhaust side, mixing of high-temperature air and low-temperature air can be prevented, and the cooling efficiency can be improved.
[0026]
Further, according to the first embodiment, since the ventilation passage 66 is formed by the partition plates 41 and 42 in the casing sealing portion 100, the high-temperature air is rectified and the heat exchangers 2, 3 are efficiently rectified. Can be supplied to
[0027]
Further, according to the first embodiment, the Y-shaped rectifying plate is formed by the partition plates 38 and 60 at positions where the high-temperature air exhausted from the heat exchanger interferes with each other in the housing opening portion 200. Therefore, the high-temperature air can be rectified and efficiently guided to the ventilation holes 64.
[0028]
Further, according to the first embodiment, the ventilation passage 49 provided on the front surface of the enclosure 100, the ventilation passages 45 and 46 provided on the side surface, and the ventilation passage 65 provided on the back surface of the housing sealed portion 100, Since a layer of flowing air is formed between the housing wall and the electronic device, there is an effect that a rise in temperature inside the housing due to external heat reception can be suppressed.
[0029]
Further, according to the first embodiment, since the cross-sectional areas of the ventilation paths 47 and 48 on the side of the electronic device are reduced by the partition plates 43 and 44, the wind speed of the low-temperature air supplied to the electronic device is increased, and the cooling is performed. Efficiency can be improved.
[0030]
Further, according to the first embodiment, since the unit-shaped electronic devices 34 and 35 having a large calorific value are installed near the outlets of the ventilation passages 47 and 48 having a small sectional area, a large wind speed is used. Cooling efficiency can be increased.
[0031]
Further, according to the first embodiment, the wind directions of the heat exchangers 2 and 3 are opposite to each other in the case closed portion 100 and the case open portion 200, so that the characteristics of the finned heat pipe are utilized. The cooling efficiency can be increased.
[0032]
Embodiment 2 FIG.
In the first embodiment, the configuration in which the unit-shaped electronic devices 34 and 35 are disposed above the ventilation path 48 has been described, but the unit-shaped electronic devices 34 and 35 may be disposed above the ventilation path 47. Similar effects can be obtained.
[0033]
Embodiment 3 FIG.
In the first embodiment, the configuration in which the fan unit 37 is disposed above the unit-shaped electronic devices 34 and 35 and the board-shaped electronic device 14 has been described. The same effect can be obtained by disposing the electronic device under the electronic device 35 and the board-shaped electronic device 14.
[0034]
Embodiment 4 FIG.
In the unit-shaped electronic device 36, the electronic device may be stored in a sealed unit, or a ventilation path may be provided in the vertical direction of the unit. In such a case, the low-temperature air passes through the unit-shaped electronic device 36 without providing the ventilation paths 47 and 48. In this case, by arranging the unit-shaped electronic devices 34 and 35 at the center of the outlet of the unit-shaped electronic device 36 having the highest air flow velocity, the same effect as in the first embodiment can be obtained.
[0035]
Embodiment 5 FIG.
In the first embodiment, the two heat exchangers 2 and 3 are installed to face each other. However, the number and type of the heat exchangers and the number and characteristics of the fans attached to the heat exchangers are changed. Is also good.
[0036]
【The invention's effect】
As described above, according to the present invention, the cooling efficiency of the electronic device is high by providing the ventilation passage through which the air cooled by the heat exchanger descends between the side wall of the enclosure and the electronic device. There is an effect that an electronic device housing can be obtained.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic device housing according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along a line AA shown in FIG. 1 according to the first embodiment of the present invention.
FIG. 3 is a sectional view taken along the line BB shown in FIG. 1 according to the first embodiment of the present invention.
FIG. 4 is an enlarged view of a portion C shown in FIG. 1 according to the first embodiment of the present invention.
[Explanation of symbols]
1 Electronic equipment housing, 2 heat exchanger (left), 3 heat exchanger (right), 4 heat exchanger (left) internal air intake, 5 heat exchanger (left) internal exhaust, 6 heat exchanger ( (Right) internal air inlet, 7 heat exchanger (right) internal air outlet, 8 heat exchanger (left) external air inlet, 9 heat exchanger (left) external air outlet, 10 heat exchanger (right) , An external exhaust port of the heat exchanger (right), a finned heat pipe of the heat exchanger (left), a finned heat pipe of the heat exchanger (right), a board-shaped electronic device, 34, 35, 36 unit-shaped electronic device, 37 fan unit, 38, 39, 40, 41, 42, 43, 44, 60 partition plate, 45, 46, 47, 48, 49, 58, 59, 61, 62 , 63, 65, 66 ventilation passages, 50, 51, 64, 67, 68 ventilation holes, 52, 53, 54, 55, 6,57 front panel 100 housing sealing section, 200 housing opening.

Claims (11)

  1. An electronic device housing including a housing closed portion in which an electronic device is installed, a housing open portion through which outside air can flow, and a heat exchanger that performs heat exchange between the housing closed portion and the housing open portion. In the body,
    An electronic device housing, wherein a ventilation path through which air cooled by the heat exchanger descends is provided between a side wall of the housing sealing portion and the electronic device.
  2. 2. The electronic device housing according to claim 1, wherein a fan unit is provided in the housing sealing portion.
  3. 3. The electronic device casing according to claim 1, further comprising a partition for separating air sent to the heat exchanger from air flowing from the heat exchanger.
  4. The electronic device housing according to any one of claims 1 to 3, wherein an air passage for rectifying the high-temperature air and sending it to the heat exchanger is provided in the housing sealing portion.
  5. The air flow path for rectifying the air exhausted from the heat exchanger and discharging the air to the outside of the electronic device housing is provided in the housing opening portion. 2. The electronic device housing according to claim 1.
  6. 6. The electronic device according to claim 5, wherein a ventilation path is provided by installing a Y-shaped partition in a portion where the air exhausted from the heat exchanger interferes with each other in the housing opening. Equipment housing.
  7. The electronic device housing according to any one of claims 1 to 6, wherein a ventilation path is provided between the front wall of the housing sealing portion and the electronic device.
  8. The electronic device housing according to any one of claims 1 to 7, wherein a cross-sectional area of a ventilation path in a side surface portion of the electronic device is smaller than a cross-sectional area immediately before in the housing sealing portion. .
  9. 9. The electronic device housing according to claim 8, wherein in the housing sealing portion, an electronic device that generates a larger amount of heat is arranged at a position where the wind speed of the low-temperature air passing through the ventilation path is higher.
  10. 2. The heat exchanger according to claim 1, wherein a fan is attached to the heat exchanger, and a wind direction of the heat exchanger is reversed in a portion located in the housing closed portion and in a portion located in the housing opening portion. An electronic device housing according to any one of claims 1 to 9.
  11. The electronic device housing according to any one of claims 1 to 10, wherein a ventilation path is provided between the back wall and the electronic device in the housing sealing portion.
JP2002322802A 2002-11-06 2002-11-06 Housing of electronic apparatus Pending JP2004158641A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002322802A JP2004158641A (en) 2002-11-06 2002-11-06 Housing of electronic apparatus

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Application Number Priority Date Filing Date Title
JP2002322802A JP2004158641A (en) 2002-11-06 2002-11-06 Housing of electronic apparatus

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JP2004158641A5 JP2004158641A5 (en) 2005-08-18

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008164802A (en) * 2006-12-27 2008-07-17 Sharp Corp Display apparatus
JP2008171850A (en) * 2007-01-09 2008-07-24 Mitsubishi Electric Corp Power supply board
JP2009192094A (en) * 2008-02-12 2009-08-27 Panasonic Corp Heat exchange device and heating element storing device using the same
JP2009243775A (en) * 2008-03-31 2009-10-22 Panasonic Corp Heat exchange device and heating element storage device using the same
WO2010007821A1 (en) * 2008-07-17 2010-01-21 日本電気株式会社 Electronic apparatus, image display, and method of cooling electronic apparatus
JP2010019455A (en) * 2008-07-09 2010-01-28 Panasonic Corp Heat exchange device, and device for containing heat generating body using the same
JP2012023295A (en) * 2010-07-16 2012-02-02 Sanken Electric Co Ltd Heat absorption structure for outdoor device
JP2012177959A (en) * 2011-02-25 2012-09-13 Hitachi Ltd Server device and electronic apparatus cooling system
WO2013080897A1 (en) * 2011-12-01 2013-06-06 日本電気株式会社 Electronic board containing device and electronic apparatus
WO2014132591A1 (en) * 2013-02-26 2014-09-04 日本電気株式会社 Electronic device and cooling device
JP2016024917A (en) * 2014-07-18 2016-02-08 Hoya Candeo Optronics株式会社 Light irradiation device
WO2018179050A1 (en) * 2017-03-27 2018-10-04 日本電気株式会社 Temperature control device, control method for temperature control device, and non-transitory storage medium storing control program for temperature control device
KR102092830B1 (en) * 2018-11-02 2020-03-24 한국로봇융합연구원 Structure of a lightweight waterproof plastic housing with a heat dissipating device for internal heat discharge in a confined space

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008164802A (en) * 2006-12-27 2008-07-17 Sharp Corp Display apparatus
JP4498367B2 (en) * 2007-01-09 2010-07-07 三菱電機株式会社 power panel
JP2008171850A (en) * 2007-01-09 2008-07-24 Mitsubishi Electric Corp Power supply board
JP2009192094A (en) * 2008-02-12 2009-08-27 Panasonic Corp Heat exchange device and heating element storing device using the same
JP2009243775A (en) * 2008-03-31 2009-10-22 Panasonic Corp Heat exchange device and heating element storage device using the same
JP2010019455A (en) * 2008-07-09 2010-01-28 Panasonic Corp Heat exchange device, and device for containing heat generating body using the same
WO2010007821A1 (en) * 2008-07-17 2010-01-21 日本電気株式会社 Electronic apparatus, image display, and method of cooling electronic apparatus
US8698010B2 (en) 2008-07-17 2014-04-15 Nec Corporation Electronic apparatus, image display apparatus and method of cooling electronic apparatus
JP2012023295A (en) * 2010-07-16 2012-02-02 Sanken Electric Co Ltd Heat absorption structure for outdoor device
JP2012177959A (en) * 2011-02-25 2012-09-13 Hitachi Ltd Server device and electronic apparatus cooling system
JPWO2013080897A1 (en) * 2011-12-01 2015-04-27 日本電気株式会社 Electronic substrate housing equipment and electronic device
CN103959926A (en) * 2011-12-01 2014-07-30 日本电气株式会社 Electronic board containing device and electronic apparatus
WO2013080897A1 (en) * 2011-12-01 2013-06-06 日本電気株式会社 Electronic board containing device and electronic apparatus
WO2014132591A1 (en) * 2013-02-26 2014-09-04 日本電気株式会社 Electronic device and cooling device
JPWO2014132591A1 (en) * 2013-02-26 2017-02-02 日本電気株式会社 Electronic device and cooling device
US9820407B2 (en) 2013-02-26 2017-11-14 Nec Corporation Electronic device and cooling system
JP2016024917A (en) * 2014-07-18 2016-02-08 Hoya Candeo Optronics株式会社 Light irradiation device
WO2018179050A1 (en) * 2017-03-27 2018-10-04 日本電気株式会社 Temperature control device, control method for temperature control device, and non-transitory storage medium storing control program for temperature control device
KR102092830B1 (en) * 2018-11-02 2020-03-24 한국로봇융합연구원 Structure of a lightweight waterproof plastic housing with a heat dissipating device for internal heat discharge in a confined space

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