TWI374696B - - Google Patents

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Publication number
TWI374696B
TWI374696B TW097139033A TW97139033A TWI374696B TW I374696 B TWI374696 B TW I374696B TW 097139033 A TW097139033 A TW 097139033A TW 97139033 A TW97139033 A TW 97139033A TW I374696 B TWI374696 B TW I374696B
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Taiwan
Prior art keywords
sleeve
screw
clamp
perforation
tool
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TW097139033A
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TW201016082A (en
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Priority to TW097139033A priority Critical patent/TW201016082A/zh
Priority to US12/574,719 priority patent/US8291583B2/en
Publication of TW201016082A publication Critical patent/TW201016082A/zh
Priority to US13/483,644 priority patent/US8893369B2/en
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Publication of TWI374696B publication Critical patent/TWI374696B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Description

1374696 修王版修SL日期：2012/8/ια 九、發明說明： 【發明所屬之技術領域】 2發明賴於—獅㈣獅結合於印㈣路板之封 裝：法’尤指-種可使套筒螺絲之套筒設置時，達到精準、 不偏移、不歪斜及易於設置之功效者。 【先前技術】 d第一至五圖分別為套筒螺絲之示意圖一、示意圖二、 習知封裝方法之示意圖-、示意圖二及示意圖三，按，一 般^用將套筒螺絲結合於印刷電路板上時，係將具有螺絲 頭1、螺#5 2及套筒5 3之-套筒螺絲5，以套筒螺 絲5之套筒5 3對應於一印刷電路板7之穿孔7工上 下麗螺絲頭51，使套筒螺絲5之套筒53具鑛齒狀之凸 緣5 3 1壓設於穿孔7 !巾以使套筒獅5結合 路板7上。 雖然上述習用之方法可將套筒螺絲5結合於印刷電路 板7之穿孔7 i中，但是套筒螺絲5於設置時係以轉筒 53直接對應穿孔71，其螺絲頭51與套筒53益法壓 縮固設，所以需要使用人工放置，且所使用之套筒螺絲5 體積與穿孔7 1孔徑皆較小，因此，當套筒螺絲5套筒5 3之凸緣5 3 1欲設於穿孔7工時’易因人工放置時產生 誤差，使套筒5 3之凸緣5 3 1無法順利對準穿孔7工， 造成印刷電路板壓合不良導致機板損毁，且當套筒5 3之 凸緣5 3 1無法-次設於穿孔7丄時’常“二電路= 1374696 修正版修正日期：2012/8/10 7平面精度不準確，而使套筒5 3之凸緣5 3 1設置於穿 孔7 1時，無法完全壓合於穿孔7 1中，而容易有偏移及 歪斜之現象產生。另外，使用壓合方式組裝套筒螺絲5必 須取用每一顆套筒螺絲5作壓合，因此無法利用業界廣泛 使用之表面黏著技術使組裝套筒螺絲5的效率最佳化。 【發明内容】 因此，本發明之主要目的係在於，可使套筒螺絲之套 筒設置時，達到精準、不偏移、不歪斜及易於設置之功效。 為達上述之目的，本發明之一種將套筒螺絲結合於印 刷電路板之封裝方法，係包含下列步驟： (1) 提供一套筒螺絲，該套筒螺絲具有一螺絲頭、延 伸出該螺絲頭一端面之一螺桿及活動套設於該 螺桿外且限位於該螺桿上之一套筒； (2) 將一夾具抵壓該螺絲頭，以使該螺絲頭抵頂於該 套筒之一端，並使部分該螺桿伸出該套筒外，再 使該夾具夾制於該套筒外； (3) 提供具有穿孔之一印刷電路板，並使該印刷電路 板佈設一焊錫層； (4) 使一工具接觸該夾具以取用該套筒螺絲，並移動 該工具使該螺桿對應該穿孔； (5) 使該工具釋放該夾具，並使該套筒之一凸緣設於 該穿孔内； (6) 使該焊錫層加熱熔錫後再冷卻回復常溫以使該 W4696 修正版修正日期：2012/8/10 烊錫層硬化，並使該套筒固設於該穿孔。 【實施方式】 請參閱『第六至十二圖』所示，係分別為本發明之 流程圖、套筒螺絲之示意圖、夹具夾制套筒之示意圖、 螺桿對應穿孔之示意圖、套筒螺絲許之示意圖、凸緣 固設於穿孔之示意圖及移除夾具之示意圖。如圖所示： 本發明之一種將套筒螺絲結合於印刷電路板之封裝方 法，其至少包含下列步驟： (1) 提供一套筒螺絲1，該套筒螺絲丄具有一螺絲頭工 1、延伸出該螺絲頭11一端面之一螺桿丄2及活 動套设於該螺桿1 2外且限位於於該螺桿1 2上 之一套筒13; (2) 將一夾具1 5抵壓該螺絲頭〗丄，以使該螺絲頭工 1抵頂於該套筒1 3之一端，並使部分該螺桿工2 伸出該套筒13外，再使該央具！5夾制於該套筒 1 3外； (3) 提供具有穿孔3工之一印刷電路板3，並使該印刷 電路板3佈設一焊錫層3 2 ; (4) 使一工具4接觸該夾具i 5以取用該套筒螺絲 1，並移動該工具4使該螺桿12對應該穿孔3 1，並使該套筒螺絲1之該伸縮套筒^ 3下緣距該 牙孔3 1周緣約0.4公厘； (5) 使該工具4釋放該夾具2 5，並使該套筒丄3之一 7 ^/4696 修正版修正日期：2012/8/10 凸緣1 3 1設於該穿孔3 1内； ⑹使該料層3 2加熱溶錫後再冷卻回復常溫以使 該焊錫層3 2硬化，並使該套筒工3固設於孔 3 1° 卞述方法更可包含步驟⑺移除該夹具丄5，以使該螺 由該彈簧14回彈，並使該螺桿12收回於該 奮间1 3内。 上述套筒螺絲1更可具有一彈簀1 4，該彈簧工4之 -端抵頂於該螺絲頭玉2之該端面，該彈菩工4之另一端_ 抵頂於該套筒13 ’藉由該彈簧14，該套筒"可彈性 移動於該螺桿1 2上。 上述套筒1 3外可環設有-凹槽工3 2，使該夹且工 5夾制於該凹槽132，以更穩固固定該螺 螺桿1 2與該套筒2 3。 上述工具4可為一真空吸附工具。 如此可使本發明於封裝時，先藉由央具m吏螺絲 頭1 1抵頂於套筒：L 3之一端，使部分螺桿丄2露出於套 筒^ 3外’亚使套筒螺絲工封裝為統一平面封裝高度，使 套同13之凸緣13 1可精準導人印刷電路板3之穿孔3 1内，而不會產生偏移及歪斜之情形。 綜上所述，本發明將套筒螺絲結合於印刷電路板之封 裝方法可有效改善習用之種種缺點，可使套筒螺絲之套筒 设置時，達到精準、不偏移、不歪斜及易於設置之功效， 進而使本發明之產生能更進步、更實用、更符合使用者之 8 1374696 修正版修正日期：2012/8/10 所需，確已符合發明專利申請之要件，爰依法提出專利申 請。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍；故，凡依本發明申請專利 • 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 " 應仍屬本發明專利涵蓋之範圍内。 > 【圖式簡單說明】 第一圖，係套筒螺絲之示意圖一。 第二圖，係套筒螺絲之示意圖二。 第三圖，係習知封裝方法之示意圖一。 第四圖，係習知封裝方法之示意圖二。 第五圖，係習知封裝方法之示意圖三。 第六圖，係本發明之流程圖。 第七圖，係本發明套筒螺絲之示意圖。 > 第八圖，係本發明夾具夾制套筒之示意圖。 第九圖，係本發明螺桿對應穿孔之示意圖。 第十圖，係本發明套筒螺絲落下之示意圖。 第十一圖，係本發明凸緣固設於穿孔之示意圖。 第十二圖，係本發明移除夾具之示意圖。 【主要元件符號說明】 (習用部份） 5 套筒螺絲 9 1374696 修正版修正日期：2012/8/10 5 1 螺絲頭 5 2 螺桿 5 3 套筒 5 3 1凸緣 7 印刷電路板 7 1 穿孔 (本創作部份） (1)〜(6)步驟 1 套筒螺絲 11 螺絲頭 12 螺桿 13 套筒 13 1凸緣 13 2凹槽 14 彈簧 15 夾具 3 印刷電路板 3 1 穿孔 3 2 焊錫層

Claims (1)

1374696 十、申請專利範圍： 修正&修正日期：2012軸 1.:筒螺絲結合於印刷—，其包含 延伸轉筒螺絲具有—螺絲頭、 外且限位於該螺捍上之—套7桿及活動套設於該螺捍 (2)將一夾具抵壓該 該套筒之-端，相’以使該螺絲頭抵頂於 夾具夾制於該套筒外Γ 5亥螺桿伸出該套筒外，再使該 _供具有穿孔之—印刷㈣ 路板佈設一焊錫層； 卫便忒印刷電 (4)使一工具接觸該夾具 動該工具使該螺桿對應該穿孔；"《螺絲’並移 於該(穿5)Γ内該工具釋放該夹具，並使該套筒之一凸緣設 ⑹使該焊錫層加純錫後再冷相 、θ錫層魏’並使該套筒固設於該穿孔。 ^ .2請專簡項所叙料料 步驟（7)移除該夾具。 γ更匕3 3. 虫t申請專利範圍第1項所述之封U法，其中，該套筒 該端面及該套筒。〃 ^刀別抵頂於該螺絲頭之 4. ^請專利範圍第1項所述之封裝方法，其中，該套筒 卜％设有一凹槽，該夹具夾制於該凹槽。 1374696 修正版修正日期：2012/8/10 5 .如申請專利範圍第1項所述之封裝方法，其中，該工具 為一真空吸附工具。
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TW097139033A 2008-10-09 2008-10-09 Packaging method of combining sleeve screw with printed circuit board TW201016082A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097139033A TW201016082A (en) 2008-10-09 2008-10-09 Packaging method of combining sleeve screw with printed circuit board
US12/574,719 US8291583B2 (en) 2008-10-09 2009-10-07 Packaging method for assembling captive screw to printed circuit board
US13/483,644 US8893369B2 (en) 2008-10-09 2012-05-30 Packaging structure for assembling to printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097139033A TW201016082A (en) 2008-10-09 2008-10-09 Packaging method of combining sleeve screw with printed circuit board

Publications (2)

Publication Number Publication Date
TW201016082A TW201016082A (en) 2010-04-16
TWI374696B true TWI374696B (zh) 2012-10-11

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TW097139033A TW201016082A (en) 2008-10-09 2008-10-09 Packaging method of combining sleeve screw with printed circuit board

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US (1) US8291583B2 (zh)
TW (1) TW201016082A (zh)

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