1-374692 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電磁能隙结構，更特定地，係關 於一種電磁能隙結構以及一種具有此結構的印刷電路板， 用以防止預定頻率帶之訊號被傳輸。 【先前技術】 新式電子設備和通訊設備日益變得更小、更薄、更輕， 反應現今社會對行動能力的重視。 這些電子和通訊設備都具有各樣可用來執行其功能與 操作的複雜電子電路（亦即，類比電路和數位電路）。這些 電子電路一般透過實施在印刷電路板（PCB)上來實現其功 能。PCB上的這些電子電路一般相互具有不同的操作頻率。 一般用來實施各樣電子電路板的 PCB通常都會因為 一電子電路與另一電子電路之操作頻率及其相應之諧波成 份，產生電磁波（EM)的傳輸與干擾，而有雜訊（亦即，混合 訊號）問題。這種傳輸雜訊大致可分成無線電雜訊和傳導雜 訊。 無線電雜訊問題可藉由在電子電路上覆蓋一保護蓋來 輕易地克服》但是，消除傳導雜訊（參考第1圖之元件符號 150)並非如此容易，因為傳導雜訊是經由電路板内的一訊 號傳輸路徑而傳輸的。 此雜訊問題將參照第1圖來更加詳細地描述。第1圖 係圖示包括兩個電子電路（具有不同的操作頻率）的印刷電 5 1-374692 路板的剖視圖。雖然第1圖圖示四層的印刷電路板100, 但顯然地，該印刷電路板100能被改良成具有雙層、六層 或八層结構。 如第1圖所示，印刷電路板100包括金屬層110-1、 110-2、110-3和110-4(以下，統稱為110)，和設在金屬層 110之間的介電層120-卜120-2、120-3(以下，統稱為120)， 印刷電路板100最頂部的金屬層110-1以如下方式實施： 具有不同操作頻率的兩電子電路 130、140(以下分別稱為 第一電子電路130和第二電子電路140)。在一行動通訊設 備中，舉例來說，諸如行動電話，具有不同操作頻率的兩 電子電路1 3 0、1 4 0，可分別是做為微處理器的數位電路， 和用來接收和傳送射頻訊號的射頻電路（亦即，類比電路）。 在此，如果假設元件符號1 1 0 - 2所代表的金屬層是接 地層，且元件符號11 0-3所代表的金屬層是電源層，則第 一電子電路130和第二電子電路140之每一接地接腳電性 地連接至元件符號1 1 0-2所代表的金屬層上，且每一電源 接腳被電性地連接至元件符號110-3所代表的金屬層上。 在印刷電路板1 0 0中，每一接地層也經由貫孔而彼此電性 地連接。類似地，每一電源層也也經由貫孔而彼此電性地 連接（參照第1圖的元件符號1 60)。 如果第一電子電路130和第二電子電路140具有不同 的操作頻率，因第一電子電路130之操作頻率及其諧波成 份所致之傳導雜訊150被傳送至第二電子電路140上。此 對第二電子電路140的準確功能/操作有不良影響。 6 ^/4692 隨著電子設備越趨複雜且數位電路需要更高的操作頻 率下，這種傳導雜訊問題也變得愈來愈棘手。特別地，隨 著電子設備所用頻帶愈來愈高，典型用來解決導電雜訊問 題的旁路電容方法或去耦合電容方法，已經不足以解決問 題。 此外’當需要在複雜的配線板上（其具有各式形成在同 板上的電子電路），或在諸如封裝系統（system in package, WP)之狹小空間中，實施數種主動元件（device)和被動元 件時’或當需要高頻做為操作頻率時（如，網路板），上述 的解決方案也不夠用。 【發明内容】 本發明提供一種電磁能隙結構以及一種具有該電磁能 隙結構的印刷電路板，它們藉由具備精簡尺寸及低能隙頻 率來降低一特定頻率帶之雜訊。 本發明也提供一種電磁能隙結構以及一種具有該電磁 能隙結構的印刷電路板’藉由以下方式使其易於設計：。 當在狹窄區域（諸如SIP)上施加許多主動元件和被動元件 時’具有精簡尺寸並獲得高阻抗和高電感。 此外’本發明提供一種電磁能隙結構以及一種具有該 電磁能隙結構的印刷電路板，其可解決在同一電路板上包 括RF電路和數位電路之電子設備（如，行動通訊設備）中的 混合訊號問題。 本發明之一態樣以一種電磁能隙結構為特點，該電磁 7 1374692 能隙結構包括介電層、複數個導電板和連通貫孔，該連通 貫孔係配置成使任何兩個導電板彼此電性地連接》在此， 該連通貫孔可包括第一貫孔，該第一貫孔貫穿該介電層且 具有末端部分（設在與該兩導電板中任一者相同的平面 上）；第二貫扎，該第二貫孔貫穿該介電層且具有末端部分 (設在與該兩導電板中另一者相同的平面上）；連接式樣， 具有一個末端部分連接至該第一貫孔之另一末端部分，且 另一末端部份連接至該第二貫礼之另一末端部分；和第一 延伸式樣，設在與該等導電板中任一導電板相同的平面 上，且具有一個末端部分連接至該第一貫孔之該一個末端 部分，且另一末端部份連接至該等導電板中任一導電板上。 此電磁能隙結構可更包括導電層。在此，介電層可設 在導電板與導電層之間。此時，導電層可包括：間隙孔（a clearance hole) >且該導電式樣可被容納在該間隙孔内β 該連通貫孔可更包括第二延伸式樣，該第二延伸式樣 設在與另一導電板相同的平面上，且具有一個末端部份連 接至第二貫礼的一個末端部份，且另一末端部份被連接至 另一導電板上。 該導電板可設置在相同的平面上。該導電板可具有相 同的大小。或者，該導電板可被分成複數個具有不同導電 板大小之群組。此外，該導電板可為多邊形、圓形或橢圓 形。 本發明之另一態樣以一種印刷電路板為特點，該印刷 電路板包括有電磁能隙結構，該印刷電路板配置成包括介 8 1374692 電層、複數個導電板和連通貫孔，用以將任何兩個導電 彼此電性地連接，並配置在該印刷電路板之雜訊源點與 訊阻絕終點之間的雜訊轉移路徑的區域上。 在此，該連通貫扎可包括一第一貫孔，該第一貫孔 穿該介電層，且具有末端部分（設在與該兩導電板中任一 相同的平面上）：第二貫孔，該第二貫孔貫穿該介電層 具有末端部分（設在與該兩導電板中另一者相同的平 上）；連接式樣，具有一個末端部分連接至該第一貫孔之 一末端部分，且另一末端部份連接至該第二貫孔之另一 端部分；和第一延伸式樣，設在與該等導電板中任一導 板相同的平面上，且具有一個末端部分連接至該第一貫 之該一個末端部分，且另一末端部份連接至該等導電板 任一導電板上。 此印刷電路板可更包括導電層。.在此，介電層可設 導電板與導電層之間。此時，導電層可包括：間隙孔， 該導電式樣可被容納在該間隙孔内。 該導電層可以是接地層或電源層，且該導電板可電 地連接至另-導電板。 該導電層可以是接地層，且該導電板可電性地連接 訊號層。 該連通貫孔更可包括第二延伸式樣，該第二延伸式 設在與另一導電板相同的平面上，且具有一個末端部分 接至第二貫孔的一個末端部分，且另一末端部份被連接 另一導電板上。 板 雜 貫 者 且 面 另 末 電 孔 中 在 且 性 至 樣 連 至 9 1374692 該導電板可設置在相同的平面上。該導電板可具有相 同的大小。或者，此導電板可被分成複數個具有不同導電 板大小之群组。此外，此導電板可為多邊形、圓形或橢圓 形。 具有不同操作頻率的兩電子電路可實施在該印刷電路 板上，且該雜訊源點與該雜訊阻絕終點可分別對應至一位 置與另一位置，該兩電子電路將在該等位置實施。 本發明之該等特點、態樣與優點將參照以下之描述、 所附請求項及隨附圖示而能更清楚地理解。 【實施方式】 由於本發明可有各樣變化及實施例，因此將參照隨附 圖式以闡釋及描述特定實施例。不過，此並非意欲將本發 明限制在這些特定實施例，且應詮釋為包括涵蓋在本發明 範疇内之所有變化、等效物及替代物。在圖式中，相同元 件以相同參考元件符號表示。在本發明之敘述中，當描述 某些技術乃無關於本發明之要點時，則省略對該等技術的 詳細說明。 諸如「第一」和「第二」之類的用語可被用來描述各 樣元件，但上述元件不應受限於上述用語。上述用語只用 來區分一元件與另一元件。舉例來說，在不悖離本發明請 求項之範疇下，第一元件可被稱為第二元件，反之亦然。 用語「和/或」應包含複數個所列舉項目的組合或是複數個 所列舉項目中之任一者。 10 1-374692 當一元件被描述為「連接（connected)」或「存 (accessed)」至另一元件時，應被詮釋為被直接連接或存 至另一元件，但其中也可能包括另一元件。相反的，如 一元件被描述為「直接連接（directly connected) j或「 接存取（directly accessed)」至另一元件時，應被解讀為 中不包括其他元件。 用於本說明書中的用語僅意欲用於敘述特定實施例 並非意欲限制本發明。除非明確地使用，否則單數表達 蓋複數意義。在本說明書中，諸如「包含」或「具有」 表達係意欲指明特徵、數目、步驟、動作、元件及其組 或部份，而不應詮釋為排除一或多個其他特徵、數目、 驟、動作、組件、元件或其組合或部份之存在或可能性 除非額外定義，所有在此所用之用語（包含：技術用 和科學用語）的意涵與本發明所屬領域之習知技藝人士 其之一般認知一樣。任何一般字典中定義的用語，應被 釋為與相關領域之文意具有相同意涵，且除非另有明顯 義.，否則不應被解讀為具有概念上之意涵或過度形式上 意涵。 以下將參照第2 A至2 C圖來說明根據本發明一些實 例之具有一連通貫扎的電磁能隙結構之一些例子，以做 比較物件，以於參照隨附圖式描述電磁能隙結構和描述 有此電磁能隙結構的印刷電路板之前，容易理解本發明 雖然在本發明之電磁能隙結構的描述令使用金屬層 金屬板，但習知技藝人士將能明顯理解，任何其他金屬 取 取 果 直 其 涵 等 合 步 〇 語 對 詮 定 之 施 為 具 〇 與 層 11 1374692 與金屬板可代替該金屬層及該金眉板。 此外，雖然第2A圖、第2B圖和第3圖為闡釋簡便起 見，只圖示兩金屬板，但如第4A圖至第7B圖所示，此電 磁能隙結構可具有複數個金屬板做為其元件。 第2A圖所圖示之電磁能隙結構2 00可包括一金屬板 210、與該金屬板210間隔一段距離的複數個金屬板230-1 和23 0-2 (以下稱為第一金屬板230- 1和第二金屬板230-2) 和連通貫孔24 0。換言之，第2A圖所圖示之電磁能隙結構 200可具有雙層狀結構形式，包括：第一層（為金屬層210 所在處）和第二層（為複數個金屬板230- 1和 230-2所在 處）。介電層220可置於該金屬層210與該複數個金屬板 2 3 0- 1 和 230-2 之間》 在此，為簡便起見，第2A圖僅圖示用以構成電磁能 隙結構（即，構成該雙層狀電磁能隙的一部分，包括：該連 通貫孔）的元件。因此，第2A圖中設有第一金屬層210之 第一層和第2B圖中設有該複數個金屬板230-1和230-2 之第二層，可為多層印刷電路板之任何兩層。 換言之，顯然在金屬層210下方、金屬板230-1和230-2 上方及/或金屬層210與金屬板230-1和230-2之間，可具 有至少一額外的金屬層。 舉例來說，在一多層印刷電路板中，可將第2 A圖所 圖示的電磁能隙結構200設在任何兩金屬層（其分別做為 電源層與接地層）之間，以阻絕導電雜訊（此也適用於根據 本發明之其他實施例之第2B圖與第3圖中所圖示的電磁 12 1374692 間隙結構）。 由於導電雜訊問題並不限於電源層與接地層間的空 間，第2A圖至第4B圖中的電磁能隙結構可被設在任何兩 接地層之間或任何兩電源層之間（該兩接地層或兩電源層 相互設在多層印刷電路板中的不同層上）。 因此，金屬層210可為用來傳送印刷電路板中一電子 訊號的任一金屬層。舉例來說，金屬層210可為做為電源 層或接地層的任一金屬層，或是可為做為訊號層（構成訊號 線）之任一金屬層。 金屬層210可設在與複數個金屬板所在平面不同的平 面上，並與該複數個金屬板23 0- 1、23 0-2彼此電性分隔。 換言之，就印刷電路板中之電子訊號而言，金屬層210可 形成一與該複數個金屬板230-1、230-2彼此不同的層。 舉例來說，如果金屬層210是一電源層，該等金屬板 可以電性地連接至接地層。如果金屬層210是一接地層， 該等金屬板可電性地連接至電源層。或者，如果金屬層210 是一訊號層，該等金屬板可以電性地連接至接地層。如果 金屬層210是一接地層，該性地金屬板可電性地連接至訊 號層。 該等金屬板230-1、230-2可設在該金屬層210上方的 一平面上"任何兩金屬板可經由一連通貫孔而彼此電性地 連接。如此，將任何兩金屬板彼此電性地連接的每一連通 貫孔，可電性地連接每一金屬板而成為一電路。 在此，第2A圖圖示金屬板和其相鄰金屬板可經由每 13 1374692 一連通貫孔彼此電性地連接的形式（即，第6圖的形式）， 且使得每一金屬板可彼此電性地連接。但是，只要所有的 金屬板可經由彼此電性地連接而形成一封閉迴路，即可使 用任一種經由連通貫孔而將金屬板彼此電性地連接的方 法。 此外，為方便闡述，第2A圖僅圖示出具有相同大小 的兩方形形狀金屬板，但各樣其他改良都是可能的（此也適 用於第2B圖和第3圖）。此將參照第6A圖至第6E圖而簡 述。 舉例來說，該等金屬板形狀可具有各樣多邊形，包括 但不限於：如第6A圖所圖示的矩形，和第6B圖所圖示的 三角形，及六邊形、八邊形。當然，金屬板可不限於特定 形狀，諸如圓形或櫥圓形。每一金屬板的大小（亦即，面積 與厚度）也可相同，如第6A圖、第6B圖和第6C圖所圖示。 如果金屬板的大小不同，可如第6D圖或第6E圖所示，依 據大小不同之複數個群體之每一者，區別並放置金屬板。 在第6D圖之情況下，可交替配置具有相對來說較大 尺寸的金屬板B和具有相對來說較小尺寸的金屬板C，且 每一金屬板可經由連通貫孔而分別與相鄰的金屬板電性地 連接。 在第 6E圖之情況下，可配置具有相對來說較大尺寸 的金屬板D和具有相對來說較小尺寸的金屬板E1、E2、 E3和E4。可將小尺寸之金屬板El、E2、E3和E4集結成 2x2形式，每一群由4片小尺寸的金屬板El、E2、E3和 14 1374692 E4组成，並可佔據與金屬板D面積大略相同的區域。小金 屬板E1、E2、E3和E4可經由4個連通貫孔電性地連接至 相應的鄰接金屬板上。此外，因為有8塊小金屬板環繞大 金屬板D，較大的金屬板D可經由8個連通貫孔而電性地 連接至相鄰的小金屬板上。 由於第6A圖至第6E圖圖示出從上表面俯瞰配置在印 刷電路板上的每一電磁能隙結構，每一金屬板可對應至該 電磁能隙結構的每一小區（cell)。 特別地，第6A圖、第6B圖、第6D圖和第6E圖圖 示電磁能隙結構被重覆地配置在印刷電路板内面之整體部 分上的情況。第 6C圖則圖示出電磁能隙結構被重覆地配 置在印刷電路板内表面之一小部分上的情形況。 簡言之，當電磁能隙結構的多個小區可如第6A圖所 圖示，被緊密地配置在印刷電路板内面之整體部分上時， 該等小區可自然地配置在如第6C圖所圖示的一些路徑上。 舉例來說，如第6C圖所圖示，如果假設點11與一雜 訊源點相關，且點1 2與一雜訊阻絕終點相關，該等小區可 沿著該雜訊源點 1 1與雜訊阻絕終點 12間的雜訊轉移路 徑，而被重覆地配置在至少一條線上。或者，如第 6C圖 所圖示，如果假設點21與一雜訊源點相關，且點2 2與一 雜訊阻絕終點相關，該等小區可被排列在至少一條線上， 以在該雜訊源點2 1與雜訊阻絕終點2 2之間，具有越過並 阻隔雜訊轉移路徑之形狀（亦即，被阻絕屏障所遮蔽的形 狀）。 15 1374692 在此，如果假設具有不同操作頻率的任1 1圖中如上所述的第一電路130和第二電路 一印刷電路板上，則雜訊源點與雜訊阻絕终 實施此兩電路的位置之每一者。 連通貫扎可將該等金屬板中的任何兩金 地連接。此說明書中所有圖式皆圖示連通貫 屬板彼此電性地連接。但是，任何經由連通 兩金屬板不必然彼此相鄰。 此外，即使圖示一塊金屬板係經由一個 接至另一金屬板，但顯然地，電磁能隙結構 任何兩金屬板的連通貫孔的數目毋需限制。 然而，所有以下之描述將聚焦在兩相鄰 一個連通貫孔而彼此連接的情況。 連通貫孔240可形成為包括：一第一貫 二貫孔242和一連接式樣243，以電性地連 板。 在此，可如下形成第一貫孔241:由一個 開始連接至第一金屬板230-1並貫穿介電層 下形成第二貫孔242 :由一個末端部份242a 二金屬板230-2並貫穿介電層220。連接式 與金屬層210相同的平面上，並具有一個末 第一貫孔241的另一末端部分24 lb，且連接 一末端部分則連接至第二貫孔242的另一末 此時，顯然地，可在每一貫孔的一個末 阿兩電路（指第 140)被實施在 點可對應至將 屬板彼此電性 孔將兩相鄰金 貫孔而連接的 連通貫孔而連 之電性地連接 金屬板係經由 孔241 、 一第 接兩相鄰金屬 末端部份2 4 1 a 220，且可如 開始連接至第 樣243可設在 端部分連接至 式樣243之另 端部分242b。 端部分與另一 16 1374692 末端部分形成具有比貫孔更大尺寸的貫孔 land)，用以減少在形成貫孔時之鑽孔製程之位置 此，將省略相關之詳細敘述。 此外，在連通貫孔240的連接式樣243的一 成一間隙孔250，以避免金屬板230-1、230-2被 接至金屬層210上。換言之，連接式樣24 3可被 隙孔2 5 0内。 顯然地，此處為了容許金屬板彼此電性地連 在連通貫孔240的第一貫孔241内側壁和第二貫 側壁上形成一電鍍層，或是在連通貫孔240内部 材料（亦即，導電性糊料（conductive paste))，且 243係諸如金屬的導電材料。 結果，兩相鄰金屬板 230-1、230-2不必然 2A圖之電磁能隙結構的同一平面上》相反的，兩 板23 0- 1、23 0-2可藉由連通貫孔240而經由另-即，與金屬層210相同的平面）彼此連接。因此， 相鄰金屬在同一平面彼此連接，具有第2A圖連i| 的電磁能隙结構200可更容易地在同樣條件下， 之電感元件。 此外，由於本發明之相鄰金屬板藉由連通貫 此連接，因此不必要為了電性地連接位於兩層的 而形成額外的式樣。這可使金屬板之間相隔的距 因此，可增加相鄰金屬板之間所形成的電容組件 以下敘述第 2 Α圖所圖示結構可做為阻絕特 地面（via 錯誤。因 邊緣上形 電性地連 容納在間 接，需要 孔242内 填充導電 連接式樣 連接在第 相鄰金屬 -平面（亦 相較於將 貫孔240 得至更長 孔2 40彼 金屬板， 離變窄。 〇 定頻帶訊 17 1374692 號之電磁能隙結構的主要原理。 介電層220可位於金屬層210與金屬板230-1、230-2 之間。這可促成電容组件在金屬層210與金屬板230-1、 230-2之間形成，及在兩相鄰金屬板之間形成。此外，電 感組件也可能藉由連通貫孔240，在兩相鄰金屬板之間經 由第一貫孔241—連接式樣243—第二貫孔242而連接。 此時，可依據諸如金屬層210與金屬板230-1、230-2 之間的間距以及兩相鄰金屬板間的間距、形成介電層 2 2 0 之介電材料的介電常數和金屬板的大小、形狀與面積等各 樣因素，來改變電容組件的數值。此外，也可依據諸如第 一貫孔241、第二貫孔242和/或連接式樣243的形狀、長 度、深度、寬度和面積等各樣因素，來改變電感組件的值。 因此，適當地調整及設計各樣前述因素，可使第2A 圖的結構得以做為電磁能隙結構（即，帶阻濾波器），以去 除或阻絕目標頻帶之特定訊號或特定雜訊。這可透過第2C 圖中的等效電路來輕易了解。 將第2C圖中的等效電路與第2A圖中的電磁能隙結構 互相比較，電感組件L 1可對應至第一貫孔24 1，且電感組 件L2可對應至第二貫孔242。電感組件L3可對應至連接 式樣243。C1可為一電容組件，該電容組件係藉由金屬板 230-1、230-2和欲設置在金屬板230-1、230-2上的另一介 電層與另一金屬層。C2和C3可為電容組件，該電容組件 係藉由與連接式樣243位於相同平面上的金屬層210，及 欲設置在連接式樣24 3之平面下方的另一介電層與另一金 18 1374692 屬層。 第2A圖所圖示之電磁能隙結構可做為一種帶阻濾 器，根據上述等效電路，該帶阻濾波器阻絕一特定頻帶 訊號。 換言之，如第 2C圖所圖示的等效電路，低頻帶的 號X (參照第2 C圖）和高頻帶的訊號y (參照第2 C圖）可 過此電磁能隙結構，且介於低頻帶與高頻帶的特定頻帶 訊號zl、z2和z3被該電磁能隙結構所阻絕。 因此，如果將第2A圖的結構重覆地配置在印刷電 板内面之整體部分（參照第6A、6B、6D和6E圖）上，或 刷電路内面之一部份（參照第6 C圖）上，而做為雜訊轉移 徑，該重複結構可做為防止特定頻帶的訊號被轉移之電 能隙結構。 可將同樣或類似概念應用在第2 B圖的電磁能隙結 上。 相較於第2A圖的電磁能隙結構，第2B圖的電磁能 結構沒有對應至金屬層2 1 0的金屬層。 電磁能隙結構可能不必然具有包括金屬層的連通 孔，該金屬層設置在有連通貫孔末端的區域下方。此可 是因為連通貫孔240的連接式樣243不必然形成在沒有 屬層的空間上。 換言之，如果相同平面上有一金屬層對應至將形成 接式樣243的區域上，則可將此連接式樣243製造成被 納在間隙孔2 5 0中，該間隙孔2 5 0形成於相同平面上之 波 的 訊 通 的 路 印 路 磁 構 隙 貫 能 金 連 容 金 19 1374692 屬層210内，如第2A圖所圖示。但是，將形成連 243的區域中不會填入額外金屬，如第2B圖所圖示 可能會有介電層22 0在第2B圖之金屬層下方。 此外，包括連通貫孔的雙層電磁能隙結構不必 為具有堆疊結構形式，在該堆疊結構形式中，金屬去 及230-2被堆疊在介電層220中，且介電層220被 金屬層210中。換言之，包括連通貫孔的雙爽層電 結構可形成為具有另一結構形狀，該結構形狀包括 置金屬板的下層、可設置金屬板的上層、位於在上 層之間的介電層和貫穿該介電層的連通貫孔（亦即， 下層的結構位置與第2A圖相反之結構形式）。當然 期第2A圖所圖示的電磁能隙結構具有與第2B圖之 隙結構相同或類似的雜訊阻絕效應。 以下，將參照第3圖至第5 C圖和第7 A圖至第 來詳細地敘述更廣泛地運用依據本發明實施例之上 雜訊基本原理的電磁能隙結構。 首先，相關圖式所圖示的依據本發明某些特定 式之電磁能隙結構，除了連通貫孔更包括一延伸式 具有與第2A圖至第2C圖之電磁能隙結構相同的 式。因此，習知技藝人士可清楚地了解，第2A圖j 圖與第6A和6E圖所圖示的上述電磁能隙結構之一 及阻絕雜訊的原理，可同樣或類似地應用在下述根 明實施例之電磁能隙結構中。 第3圖的3-D透視圖圖示包括連通貫孔之電磁 接式樣 。當然， 然形成 Ϊ 230-1 堆受在 磁能隙 =可設 層與下 上層與 ，可預 電磁能 7C圖， 述阻絕 實施方 樣外， 結構形 L第2C 般細節 據本發 能隙結 20 1374692 構，該電磁能隙結構符合本發明第一實施例。 示第3圖所圖示之電磁能隙結構的連接式樣， 圖示第3圖所圖示之電磁能隙結構的延伸式樣 如第3圖至第4B圖所示，依據本發明一 磁能隙結構300可包括：金屬層310、複數個4 和金屬板 330-2(以下分別稱此為第一金屬層 層），該金屬板330-2位於與金屬層310和連通 隔一段距離之處。 如此，電磁能隙結構300可具有雙平面結 例來說，金屬層310可設在第一層，且金屬板 屬板330-2可設在第二層。或者，如上述，金 設在第二層且金屬板330-1和金屬板 330-2 層。此時，介電層320可設於第一和第二層之 為簡化起見，第3圖僅圖示兩金屬板，而 板，該兩金屬板在縱長方向上彼此相鄰，可在 之左側、右側、上方和/或下方之任一區域配置 金屬板。 依據本發明，連通貫孔340可形成為包括 341、第二貫孔342和連接式樣343，藉以電性 兩相鄰金屬板，與第2 A圖類似。特別地，第 可貫穿介電層320，並具有位在與第一金屬板 的平面上之一末端部分341a，且第二貫孔342 層3 20，並具有位在與第一金屬板330-2相同 一末端部分342a。 第4A圖圖 且第4B圖 〇 實施例之電 r屬板330-1 和第二金屬 貫孔340間 構形式。舉 330-1和金 屬層3 10可 可設在第一 間。 非多個金屬 任一金屬板 複數個其他 :第一貫礼 地彼此連接 一貫孔3 4 1 330-1相同 可貫穿介電 的平面上之 21 1374692 連接式樣343也可設在相同平面上，並具 份連接至第一貫孔341的另一末端部分341b， 末端部分連接至第二貫孔342的另一末端部分 連通貫孔 34 0的連接式樣 3 43之邊緣上形 350，以避免金屬板330- 1和 330-2電性地連 3 10° 當然，不會在將形成連接式樣343的區域 金屬（參照上述第2 B圖的描述及第3圖的金屬 這種情況下，可能不需如上述般額外納入一間 在依據本發明另一實施例的電磁能隙結構 連通貫孔340可更包括延伸式樣344、345 (以 為第一延伸式樣和第二延伸式樣）。 在此，第一延伸式樣344可形成為從第一 末端部份341a開始，並從同一平面（即，第一金 延伸的式樣，且第二延伸式樣345可形成為從澤 的末端部份342a開始，並從同一平面（即， 3 30-2)延伸的式樣。 換言之，第一延伸式樣344的一個末端部 一貫孔341的末端部份341a，且第一延伸式樣 末端部份則連接至第一金屬板 330-1，藉此可 341與第一金屬板330-1電性地連接。類似的 式樣345的一末端部分連接至第二貫孔342 342a，且第二延伸式樣345的另一末端部份則 金屬板33 0-2，藉此可使第二貫孔342與第二4 有一末端部 且具有另一 342b °可在 成一間隙孔 接至金屬層 上置放任何 層3 10) »在 隙孔。 300中，此 下分別稱其 貫孔3 4 1的 屬板330-1) ;二貫孔342 第二金屬板 分連接至第 344的另一 使第一貫孔 ，第二延伸 的末端部份 連接至第二 -屬板330-2 22 Γ374692 電性地連接。 可依據第一貫孔341末端部分34la之相鄰區域内蝕刻 孔36丨的形狀’和第二貫孔342末端部分342a之相鄰地區 内蝕刻孔3 62的形狀，來相應地決定货 〜卑一延伸式樣344與 第二延伸式樣345的式樣。 因此，即使此說明書中每一圖政 %圖示延伸式樣為條 形，延伸式樣可具有各樣類型（亦即，~ 鞭跡型（trace type) 和螺旋型（spiral type))，其前提是不逝 〜金屬板斷開。因此， 可能需要將蝕刻孔3 6 1和蝕刻孔 3 6 2形成在開放的曲形 上，而非封閉的曲形上，以使金屬拓 双不會從延伸式樣上斷 開。 因此，依據本發明，兩相鄰金思 屬板330-1和330_2可 經由連通貫礼3 4 0而以下列順序彼 此電性地連接：第一金 屬板3 3 0- 1 —第一延伸式樣344->第— 貫孔341—連接式樣 343 —第二貫孔342—第二延伸★ ^ m 八樣345—第二金属板 330-2(假設訊號是從第一金屬板3化 屬板 33〇_2)。 丨傳送至第二金屬板 換言之’相較於第2A圖，由於 3圖的連通貫；f| 可更包括延伸式樣，因此相較於第2 貝札340 可額外地獲得和經由延伸式樣而延 ”午下’ 感值。因丨，如果僅使用第-延伸 長度組件等量的電 樣345兩者之…即可滿足對必要;樣344和第二延伸式 略另一者。 電感值的要求，則可省 刷電路板中電源層和 此時，金屬層310可做為典型印 23 1374692 接地層中之任一者。也可藉由允許每一相鄰金屬板 接，而能將複數個金屬板330-1和330-2形成一密 路，藉此可做為電源層和接地層中另一者來使用。 或者，如果假設將本發明的電磁能隙結構300 一封裝系统t ，金屬層310可做為接地層，且經由 孔340而彼此連接之複數個金屬板330-1和330-2 用以傳輸訊號的訊號層。 依據上述的原則，可將電磁能隙結構3 00配置 雜訊源點與雜訊阻絕終點之間的雜訊轉移路徑區域 此阻絕或減少特定頻率帶的雜訊。此雜訊源點與雜 終點可分別對應至一位置與另一位置，而兩電子電 施於該等位置處。 前述第3圖至第4B圖中的電磁能隙結構係依 金屬板可連接至另一金屬板的假設來進行說明，且 屬板係經由相對應的連通貫孔而被配置在該金屬 方、下方、左側及右側，使得所有的金屬板可位於 平面上，且每一金屬板的形狀、大小相同。 但是，顯然本發明並不偈限於上述實施例，且 他各樣實施例及修改。舉例來說，在電磁能隙結構 一金屬板可具有各樣形狀（如，多邊形、圓形和橢E 不同大小。或者，每一金屬板可被單獨地、共同地 特定規則而配置在兩平面或更多不同的平面上。 如果至少一金屬板係堆疊在與其他堆疊金屬板 面不同的平面上，此電磁能隙結構將具有兩層或多 彼此連 閉的電 應用在 連通貫 可做為 在介於 上，藉 訊阻絕 路將實 據任一 每一金 板的上 一相同 可有其 中，每 3形）和 或依據 所在平 層。但 24 1374692 是，所增加的層數對於應用本發明電磁能隙結構的多層 路板設計沒有不良影響。 此外，第5A圖至第5C圖圖示依據本發明各樣實施 及修改的延伸式樣的各種實例。特別地，第5 A圖至第 圖圖示依據第一貫孔341與第二貫孔342的形成位置， 將延伸式樣設計成具有不同位置與方位。在此，虛線指 第5A圖至第5C圖中的連接式樣。 第7A圖至第7B圖圖示依據本發明之一實施例，用 檢查電磁能隙結構雜訊阻絕機率的實例模型，且第7C 圖示應用第7A、7B圖之實例模型後，所模擬出來的每 結果圖。第7A圖圖示該實例模型之延伸式樣343，且 7B圖圖示延伸式樣344及345。 第7C圖圖示頻率特性圖形11和21。圖形21代表 括延伸式樣及連通貫孔之電磁能隙結構的頻率特性。圖 1 1代表比較物件電磁能隙結構的頻率特性，該比較物件 包括有一延伸式樣及連通貫孔之電磁能隙結構具有相同 計，但不包括延伸式樣。 如第7C圖所圖示，可認知，在阻絕率-50 dB之基 上，本發明之電磁能隙結構在約2.3〜5 GHz間有一能隙 率。但是，在阻絕率· 5 0 d B之基礎上，比較物件電磁能 結構具有約4.3GHz之低限頻率。 這個結果顯示，因本發明電磁能隙結構可藉由連通 孔的延伸式樣，而取得較比較物件電磁能隙結構更大的 感值，因此能隙頻率之低限值會隨之降低。 電 例 5C 而 出 以 圖 第 包 形 與 設 礎 頻 隙 貫 電 25 Γ374692 雖然第7圖的模擬结果圖示本發明能隙頻帶介於2.3 至5 GHz間，但可依據設計值的變化（諸如，構成連通貫孔 340的第一貫孔、第二貫孔、連接式樣和延伸式樣的形狀、 長度、面積和寬度）來改變能隙頻帶。此外，顯然地，可依 據設計值的變化（諸如，金屬板的大小、形狀和面積，以及 形成介電層之介電材料的介電常數）來改變能隙頻率和阻 絕率。 如上述，本發明可藉由利用包括連通貫孔（連通貫孔之 長度延伸穿過延伸式樣）的電磁能隙結構，來阻絕所欲阻絕 頻率帶的電磁波。可容易地了解，當電磁能隙結構被設計 或配置在印刷電路板上時，本發明能改善設計限制與配置 困難，且本發明具有多種訊號完整性的優點。 雖然已敘述本發明一些實施例，本發明所屬領域中任 一具有通常知識者應可理解，可大量變化而不偏離本發明 範圍及精神及本發明之相等物，該相等物應僅以所附請求 項所定義。 【圖式簡單說明】 第1圖係圖示包括一類比電路和一數位電路之印刷電 路板的剖視圖； 第2A圖係圖示包括連通貫孔之電磁能隙結構之一實 例（可做為本發明一比較物件之）的3 - D透視圖； 第2B圖係圖示包括連通貫孔之電磁能隙結構之另一 實例（可做為本發明一比較物件之）的3 -D透視圖； 26 1374692 第2C圖圖示第2A圖圖示之電磁能隙結構的等效電路 Γ^Ί · 園， 第3圖係圖示依據本發明第一實施例之包括連通貫孔 之電磁能隙结構的3-D透視圖； 第4Α圖圖示第3圖圖示之電磁能隙結構的連接式樣； 第4Β圖圖示第3圖圖示之電磁能隙結構的延伸式樣； 第5 Α圖至第5 C圖係分別依據本發明第二至四實施例 之電磁能隙結構的平面圖； 第6A圖係圖示包括一矩形金屬板的電磁能隙結構之 配置的平面圖； 第 6B圖係圖示包括一三角形金屬板的電磁能隙結構 之配置的平面圖； 第6C圖係圖示一電磁能隙結構的帶狀配置的平面圖； 第6D和6E圖係圖示包括多群具有不同大小之金屬板 的電磁能隙結構配置的平面圖； 第7A和7B圖圖示依據本發明一實施例，用來檢查電 磁能隙結構雜訊阻絕機率的實例模型；及 第7C圖圖示應用第7A圖及第7B圖之模型後，所模 擬出來的每-結果。 【主要元件符號說明】 100 印刷電珞板 110-1、110-2' 110-3' 1 10-4 金屬層 120 、 120-1 、 120-2 、 120-3 介電層 27 Γ374692 130 第一電子 電路 140 第二電子電路 200 電磁能隙結構 210 金屬層 230-1 ' 230-2 金屬板 240 連通貫孔 241 第一貫礼 24 1 a、 241b、242a ' 242b 末端部分 242 第二貫礼 243 連接式樣 250 間隙孔 300 電磁能隙結構 3 10 金屬層 320 介電層 3 30-1 、3 30-2 金屬板 340 連通貫孔 341 第一貫孔 342 第二貫孔 341a， 341b、342a ' 342b 末端部分 343 連接式樣 344、 345 延伸式樣 350 間隙孔 361、 362 蝕刻孔 281-374692 IX. Description of the Invention: [Technical Field] The present invention relates to an electromagnetic energy gap structure, and more particularly to an electromagnetic energy gap structure and a printed circuit board having the same, for preventing The signal of the predetermined frequency band is transmitted. [Prior Art] New electronic devices and communication devices are becoming smaller, thinner, and lighter, reflecting the importance of mobility in today's society. These electronic and communication devices have a variety of complex electronic circuits (i.e., analog circuits and digital circuits) that can be used to perform their functions and operations. These electronic circuits are typically implemented by implementing them on a printed circuit board (PCB). These electronic circuits on the PCB generally have different operating frequencies from each other. Generally, PCBs used to implement various electronic circuit boards usually generate electromagnetic waves (EM) transmission and interference due to the operating frequency of one electronic circuit and another electronic circuit and their corresponding harmonic components, and there is noise (ie, , mixed signal) problem. This transmission noise can be roughly divided into radio noise and conduction noise. Radio noise problems can be easily overcome by covering a protective cover on an electronic circuit. However, eliminating conductive noise (refer to component symbol 150 in Figure 1) is not so easy because the transmitted noise is via the board. A signal transmission path is transmitted. This noise problem will be described in more detail with reference to Figure 1. Figure 1 is a cross-sectional view of a printed circuit 5 1-374692 including two electronic circuits (having different operating frequencies). Although Fig. 1 illustrates a four-layer printed circuit board 100, it is apparent that the printed circuit board 100 can be modified to have a two-layer, six-layer or eight-layer structure. As shown in FIG. 1, the printed circuit board 100 includes metal layers 110-1, 110-2, 110-3, and 110-4 (hereinafter collectively referred to as 110), and a dielectric layer 120 disposed between the metal layers 110. - Bu 120-2, 120-3 (hereinafter collectively referred to as 120), the metal layer 110-1 at the top of the printed circuit board 100 is implemented as follows: two electronic circuits 130, 140 having different operating frequencies (hereinafter referred to as The first electronic circuit 130 and the second electronic circuit 140). In a mobile communication device, for example, a mobile phone, two electronic circuits 1 3 0, 1 4 0 having different operating frequencies, respectively, can be digital circuits as microprocessors, and used to receive and transmit radio frequencies. The RF circuit of the signal (ie, the analog circuit). Here, if it is assumed that the metal layer represented by the component symbol 1 1 0 - 2 is a ground layer, and the metal layer represented by the component symbol 11 0-3 is a power supply layer, the first electronic circuit 130 and the second electronic circuit 140 Each grounding pin is electrically connected to the metal layer represented by the component symbol 1 1 0-2, and each power pin is electrically connected to the metal layer represented by the component symbol 110-3. In the printed circuit board 100, each of the ground layers is also electrically connected to each other via a through hole. Similarly, each of the power supply layers is also electrically connected to each other via a through hole (refer to the component symbol 1 60 of Fig. 1). If the first electronic circuit 130 and the second electronic circuit 140 have different operating frequencies, the conductive noise 150 due to the operating frequency of the first electronic circuit 130 and its harmonic components is transmitted to the second electronic circuit 140. This has an adverse effect on the exact function/operation of the second electronic circuit 140. 6 ^/4692 As electronic devices become more complex and digital circuits require higher operating frequencies, this problem of conducted noise becomes more and more difficult. In particular, as the frequency bands used in electronic devices become higher and higher, the bypass capacitor method or the decoupling capacitor method typically used to solve the problem of conductive noise has not been solved. In addition, when it is required to be on a complicated wiring board (which has various electronic circuits formed on the same board), or in a small space such as a system in package (WP), several active devices are implemented. The same solution is not sufficient when using passive components or when high frequencies are required as operating frequencies (eg, network boards). SUMMARY OF THE INVENTION The present invention provides an electromagnetic energy gap structure and a printed circuit board having the electromagnetic energy gap structure, which reduces noise of a specific frequency band by having a reduced size and a low energy gap frequency. The present invention also provides an electromagnetic energy gap structure and a printed circuit board having the electromagnetic energy gap structure which is easy to design by: When many active and passive components are applied on a narrow area such as SIP, it has a reduced size and high impedance and high inductance. Furthermore, the present invention provides an electromagnetic energy gap structure and a printed circuit board having the electromagnetic energy gap structure, which can solve a mixture in an electronic device (eg, a mobile communication device) including an RF circuit and a digital circuit on the same circuit board. Signal problem. One aspect of the present invention features an electromagnetic energy gap structure including a dielectric layer, a plurality of conductive plates, and a communication via, the interconnected via being configured such that any two conductive plates are in contact with each other Electrically connected herein, the communication through hole may include a first through hole penetrating the dielectric layer and having an end portion (provided on the same plane as any of the two conductive plates) a second through hole, the second through hole penetrating the dielectric layer and having an end portion (provided on the same plane as the other of the two conductive plates); the connection pattern having an end portion connected to the first The other end portion of the through hole is connected to the other end portion of the second pass; and the first extending pattern is disposed on the same plane as any of the conductive plates And having one end portion connected to the one end portion of the first through hole, and the other end portion is connected to any one of the conductive plates. The electromagnetic energy gap structure may further include a conductive layer. Here, a dielectric layer may be disposed between the conductive plate and the conductive layer. At this time, the conductive layer may include: a clearance hole > and the conductive pattern may be accommodated in the clearance hole β. The communication through hole may further include a second extension pattern, and the second extension pattern is disposed in The other conductive plate has the same plane and has one end portion connected to one end portion of the second pass and the other end portion is connected to the other conductive plate. The conductive plates can be placed on the same plane. The conductive plates can have the same size. Alternatively, the conductive plate can be divided into a plurality of groups having different conductive plate sizes. Further, the conductive plate may be polygonal, circular or elliptical. Another aspect of the present invention features a printed circuit board including an electromagnetic energy gap structure, the printed circuit board configured to include a dielectric layer of 1 1374692, a plurality of conductive plates, and a communication via for Any two conductive wires are electrically connected to each other and disposed on a region of the noise transfer path between the noise source point of the printed circuit board and the end point of the signal blocking. Here, the connecting via may include a first through hole penetrating the dielectric layer and having an end portion (provided on the same plane as any of the two conductive plates): the second through a second through hole having a terminal portion (provided on the same level as the other of the two conductive plates) through the dielectric layer; and a connection pattern having an end portion connected to one end of the first through hole a portion, and the other end portion is connected to the other end portion of the second through hole; and the first extending pattern is disposed on the same plane as any one of the conductive plates, and has one end portion connected to The first end portion of the one end portion and the other end portion are connected to any of the conductive plates of the conductive plates. The printed circuit board may further comprise a conductive layer. . Here, the dielectric layer may be disposed between the conductive plate and the conductive layer. At this time, the conductive layer may include a clearance hole, and the conductive pattern may be accommodated in the clearance hole. The conductive layer can be a ground or power layer and the conductive plate can be electrically connected to the other conductive plate. The conductive layer can be a ground layer, and the conductive plate can be electrically connected to the signal layer. The connecting through hole further includes a second extending pattern disposed on the same plane as the other conductive plate, and having one end portion connected to one end portion of the second through hole, and the other end portion The parts are connected to another conductive plate. The plates are interspersed and the other holes in the face are connected to each other. 9 1374692 The conductive plates can be placed on the same plane. The conductive plates can have the same size. Alternatively, the conductive plate can be divided into a plurality of groups having different conductive plate sizes. In addition, the conductive plate may be polygonal, circular or elliptical. Two electronic circuits having different operating frequencies can be implemented on the printed circuit board, and the noise source point and the noise blocking end point can respectively correspond to a position and another position, and the two electronic circuits will be implemented at the positions . The features, aspects, and advantages of the present invention will be more clearly understood from the following description, appended claims and appended claims. DETAILED DESCRIPTION OF THE INVENTION The present invention is described and described with reference to the accompanying drawings However, it is intended that the invention not be construed as being limited In the drawings, the same elements are denoted by the same reference element symbols. In the description of the present invention, a detailed description of the techniques will be omitted when describing certain techniques without departing from the gist of the invention. Terms such as "first" and "second" can be used to describe various elements, but the above elements should not be limited to the above terms. The above terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and vice versa, without departing from the scope of the invention. The term "and/or" shall include a combination of a plurality of listed items or any of a plurality of listed items. 10 1-374692 When an element is described as "connected" or "accessed" to another element, it shall be interpreted as being directly connected or stored to another element, but may also include another element. Conversely, when an element is referred to as "directly connected" or "directly connected" to another element, it should be construed that the other elements are not included. The words used in the specification are for the purpose of describing particular embodiments. A singular expression is used in the plural unless it is used explicitly. In the present specification, the words "including" or "having" are intended to indicate a feature, a number, a step, an action, an element, and a group or part thereof, and should not be construed as excluding one or more other features, numbers, The existence or possibility of actions, components, elements or combinations or parts thereof, unless otherwise defined, all the terms used herein (including technical and scientific terms) are intended to be used by those skilled in the art to which the invention pertains. Generally cognitive. Any term defined in a general dictionary shall be interpreted as having the same meaning as the context of the relevant art, and unless otherwise expressly defined. Otherwise, it should not be interpreted as having a conceptual meaning or an excessive formal meaning. Some examples of an electromagnetic energy gap structure having a continuous connection according to some examples of the present invention will be described below with reference to FIGS. 2A to 2C for comparison of objects to describe the electromagnetic energy gap structure and the accompanying drawings. Before describing a printed circuit board having such an electromagnetic energy gap structure, it will be readily understood that although the description of the electromagnetic energy gap structure of the present invention permits the use of a metal layer metal plate, those skilled in the art will readily appreciate that any other metal extraction will be apparent. If the straight culverts and other slang slang are applied to the inscription, the layer 11 1374692 and the metal plate can replace the metal layer and the gold eyebrow. In addition, although FIGS. 2A, 2B, and 3 are for simplicity of explanation, only two metal plates are illustrated, but as shown in FIGS. 4A to 7B, the electromagnetic energy gap structure may have a plurality of metal plates. As its component. The electromagnetic energy gap structure 200 illustrated in FIG. 2A may include a metal plate 210, and a plurality of metal plates 230-1 and 23 0-2 spaced apart from the metal plate 210 (hereinafter referred to as a first metal plate 230). - 1 and the second metal plate 230-2) and the communication through hole 240. In other words, the electromagnetic energy gap structure 200 illustrated in FIG. 2A may have a two-layer structure including: a first layer (where the metal layer 210 is located) and a second layer (for a plurality of metal plates 230-1 and 230) -2 where). A dielectric layer 220 may be disposed between the metal layer 210 and the plurality of metal plates 2 3 0-1 and 230-2. Here, for the sake of simplicity, FIG. 2A is only illustrated to form an electromagnetic energy gap structure. (ie, an element that forms part of the two-layered electromagnetic energy gap, including: the communicating through-hole). Therefore, the first layer of the first metal layer 210 and the second layer of the plurality of metal plates 230-1 and 230-2 are provided in FIG. 2A, which may be any two of the multilayer printed circuit boards. Floor. In other words, it is apparent that there may be at least one additional metal layer under the metal layer 210, over the metal plates 230-1 and 230-2, and/or between the metal layer 210 and the metal plates 230-1 and 230-2. For example, in a multilayer printed circuit board, the electromagnetic energy gap structure 200 illustrated in FIG. 2A can be disposed between any two metal layers (which are respectively used as a power layer and a ground layer) to block Conductive noise (this also applies to the electromagnetic 12 1374692 gap structure illustrated in Figures 2B and 3 of other embodiments of the present invention). Since the problem of conductive noise is not limited to the space between the power supply layer and the ground layer, the electromagnetic energy gap structure in FIGS. 2A to 4B can be disposed between any two ground layers or between any two power layers (the two connections) The formation or two power layers are placed on different layers of the multilayer printed circuit board. Thus, metal layer 210 can be any metal layer used to transport an electronic signal in a printed circuit board. For example, the metal layer 210 can be any metal layer as a power layer or a ground layer, or can be any metal layer as a signal layer (constituting a signal line). The metal layer 210 may be disposed on a different plane from the plane in which the plurality of metal plates are located, and electrically separated from the plurality of metal plates 23 0-1, 23 0-2. In other words, in the case of an electronic signal in a printed circuit board, the metal layer 210 can form a layer different from the plurality of metal plates 230-1, 230-2. For example, if metal layer 210 is a power plane, the metal sheets can be electrically connected to the ground plane. If the metal layer 210 is a ground layer, the metal plates can be electrically connected to the power supply layer. Alternatively, if the metal layer 210 is a signal layer, the metal plates may be electrically connected to the ground layer. If the metal layer 210 is a ground layer, the metal plate can be electrically connected to the signal layer. The metal plates 230-1, 230-2 may be disposed on a plane above the metal layer 210. Any two metal plates may be electrically connected to each other via a through hole. Thus, each of the through holes of any two metal plates electrically connected to each other can be electrically connected to each of the metal plates to form an electric circuit. Here, FIG. 2A illustrates a form in which the metal plate and its adjacent metal plates are electrically connected to each other via a through-hole per 13 1374692 (ie, in the form of FIG. 6), and each metal plate can be mutually connected Electrically connected. However, any method in which all of the metal plates can be electrically connected to each other to form a closed circuit can be used by electrically connecting the metal plates to each other via the communication through holes. Further, for convenience of explanation, Fig. 2A only shows two square-shaped metal plates having the same size, but various other modifications are possible (this also applies to Figs. 2B and 3). This will be briefly described with reference to Figs. 6A to 6E. For example, the metal plate shapes may have various polygons including, but not limited to, a rectangle as illustrated in Fig. 6A, and a triangle illustrated in Fig. 6B, and a hexagon, an octagon. Of course, the metal plate may not be limited to a specific shape such as a circle or a cabinet circle. The size (i.e., area and thickness) of each metal plate may be the same as illustrated in Figs. 6A, 6B, and 6C. If the size of the metal plates is different, the metal plates can be distinguished and placed according to each of a plurality of groups of different sizes as shown in Fig. 6D or Fig. 6E. In the case of FIG. 6D, the metal plate B having a relatively large size and the metal plate C having a relatively small size may be alternately arranged, and each of the metal plates may be adjacent to each other via the communication through hole. The metal plates are electrically connected. In the case of Fig. 6E, a metal plate D having a relatively large size and metal plates E1, E2, E3 and E4 having a relatively small size can be arranged. Small-sized metal plates El, E2, E3, and E4 can be assembled into a 2x2 form, each group consisting of four small-sized metal plates El, E2, E3, and 14 1374692 E4, and can occupy roughly the same area as the metal plate D. Area. The small metal plates E1, E2, E3 and E4 can be electrically connected to corresponding adjacent metal plates via four communicating through holes. Further, since there are eight small metal plates surrounding the large metal plate D, the larger metal plate D can be electrically connected to the adjacent small metal plates via the eight communication through holes. Since FIGS. 6A to 6E illustrate each electromagnetic energy gap structure disposed on the printed circuit board from the upper surface, each metal plate may correspond to each cell of the electromagnetic energy gap structure. In particular, Figs. 6A, 6B, 6D, and 6E illustrate the case where the electromagnetic energy gap structure is repeatedly disposed on the entire inner surface of the printed circuit board. Fig. 6C illustrates the case where the electromagnetic energy gap structure is repeatedly disposed on a small portion of the inner surface of the printed circuit board. In short, when a plurality of cells of the electromagnetic energy gap structure can be closely arranged on an integral part of the inner surface of the printed circuit board as illustrated in FIG. 6A, the cells can be naturally arranged as shown in FIG. 6C. Some of the paths shown. For example, as illustrated in FIG. 6C, if point 11 is associated with a noise source point and point 12 is associated with a noise blocking endpoint, the cells may be along the noise source point 1 1 The noise blocks the noise transfer path between the endpoints 12 and is repeatedly placed on at least one line. Alternatively, as illustrated in FIG. 6C, if point 21 is associated with a noise source point and point 2 2 is associated with a noise blocking endpoint, the cells may be arranged on at least one line to be in the noise. Between the source point 2 1 and the noise blocking end point 2 2 , there is a shape that crosses and blocks the noise transfer path (that is, the shape blocked by the barrier). 15 1374692 Here, if it is assumed that the first circuit 130 and the second circuit as described above in the any one of the drawings having different operating frequencies are on the printed circuit board, the noise source point and the noise block are finally implemented. Each of the locations. The connecting bars can connect any two of the metal plates. All of the figures in this specification illustrate that the communication plates are electrically connected to each other. However, any two metal plates via the communication are not necessarily adjacent to each other. Further, even if one metal plate is illustrated as being connected to the other metal plate, it is apparent that the number of the communication through holes of any two metal plates of the electromagnetic energy gap structure is not limited. However, all of the following description will focus on the case where two adjacent ones are connected to each other and connected to each other. The communication through hole 240 may be formed to include a first through hole 242 and a connection pattern 243 to electrically connect the plates. Here, the first through hole 241 may be formed as follows: a first through hole is formed from the first metal plate 230-1 and a second through hole 242 is formed under the dielectric layer: the second metal plate 230-2 is formed by one end portion 242a Through the dielectric layer 220. The connection is the same plane as the metal layer 210, and has the other end portion 24 lb of the last first through hole 241, and the connecting one end portion is connected to the other end of the second through hole 242 at this time, obviously One terminal circuit (referred to as 140th) in each of the consistent holes can be electrically connected to the connecting through hole which can connect the two adjacent gold through holes to each other. The connecting metal plate is connected to the other end portion 242b of the pattern 243 via the hole 241, a second adjacent metal end portion 2 4 1 a 220, and may be connected to the first piece 243 as it is. The end portion and the other end portion of the 16 1374692 portion form a through hole having a larger size than the through hole to reduce the position of the drilling process when the through hole is formed. The detailed description will be omitted. In addition, the gap pattern 250 of the connection pattern 243 of the through hole 240 is formed to prevent the metal plates 230-1, 230-2 from being attached to the metal layer 210. In other words, the connection pattern 24 3 can be enclosed by the aperture 250. Obviously, in order to allow the metal plates to be electrically connected to each other, a plating layer is formed on the inner side wall and the second side wall of the first through hole 241 of the communication through hole 240, or the material is connected in the through hole 240 (ie, , a conductive paste, and 243 is a conductive material such as a metal. As a result, the two adjacent metal plates 230-1, 230-2 are not necessarily opposite to each other on the same plane of the electromagnetic energy gap structure of FIG. 2A, and the two plates 23 0-1 and 23 0-2 can be connected through the through holes 240. They are connected to each other via another, that is, the same plane as the metal layer 210. Therefore, the adjacent metals are connected to each other in the same plane, and the electromagnetic energy gap structure 200 having the 2A diagram and i| can be more easily under the same conditions, the inductance element. Furthermore, since the adjacent metal sheets of the present invention are connected by communication, it is not necessary to form an additional pattern for electrically connecting the two layers. This allows the distance between the metal plates to be separated. Therefore, the capacitance component formed between adjacent metal plates can be increased. The structure illustrated in the second drawing can be used as a barrier ground (via error. Inductively accommodated indirectly, the hole 242 is required to be filled with a conductive connection pattern to be connected to the adjacent metal-plane (also compared to the hole 240 to obtain a longer hole 2 40 of the metal plate, which is narrowed. The main principle of the electromagnetic gap structure of No. 17 1374692. The dielectric layer 220 can be located between the metal layer 210 and the metal plates 230-1, 230-2. This can contribute to the capacitor component in the metal layer 210 and the metal plate 230-1 Formed between 230-2, and formed between two adjacent metal plates. In addition, the inductance component may also be connected to the pattern 243 between the two adjacent metal plates via the first through hole 241 by connecting the through holes 240. a second via hole 242. At this time, the dielectric layer 2 2 0 may be formed depending on, for example, the spacing between the metal layer 210 and the metal plates 230-1, 230-2 and the spacing between two adjacent metal plates. Dielectric constant of dielectric material and size, shape and surface of metal plate Various factors, such as product, are used to change the value of the capacitor assembly. In addition, various factors such as the shape, length, depth, width, and area of the first through hole 241, the second through hole 242, and/or the connection pattern 243 may be used. To change the value of the inductive component. Therefore, proper adjustment and design of various factors can make the structure of Figure 2A be an electromagnetic energy gap structure (ie, a band-stop filter) to remove or block the target band. Specific signal or specific noise. This can be easily understood through the equivalent circuit in Figure 2C. Comparing the equivalent circuit in Figure 2C with the electromagnetic energy gap structure in Figure 2A, the inductor component L 1 can correspond The first through hole 24 1 and the inductive component L2 can correspond to the second through hole 242. The inductive component L3 can correspond to the connection pattern 243. C1 can be a capacitor component, which is formed by a metal plate 230-1, 230-2 and another dielectric layer and another metal layer to be disposed on the metal plates 230-1, 230-2. C2 and C3 may be capacitor components which are in the same plane as the connection pattern 243 Upper metal layer 210, and to be placed in the connection The other dielectric layer below the plane of the sample 24 3 and the other gold 18 1374692 layer. The electromagnetic energy gap structure illustrated in FIG. 2A can be used as a band rejection filter, and the band rejection filter according to the above equivalent circuit The device blocks a specific frequency band signal. In other words, the equivalent circuit shown in FIG. 2C, the low-band number X (see FIG. 2C) and the high-band signal y (see FIG. 2C) can pass the electromagnetic The energy gap structure, and the specific frequency band signals z1, z2, and z3 between the low frequency band and the high frequency band are blocked by the electromagnetic energy gap structure. Therefore, if the structure of FIG. 2A is repeatedly placed on the entire inner surface of the printed circuit board Part (refer to Figures 6A, 6B, 6D and 6E), or part of the inner surface of the brush circuit (refer to Figure 6 C), and as a noise transfer path, the repeat structure can be used as a specific frequency band The signal gap is transferred to the power gap structure. The same or similar concepts can be applied to the electromagnetic energy gap junction of Figure 2B. The electromagnetic energy structure of Fig. 2B does not correspond to the metal layer of the metal layer 2 10 compared to the electromagnetic energy gap structure of Fig. 2A. The electromagnetic energy gap structure may not necessarily have a communication hole including a metal layer which is disposed under a region having an end portion communicating with the through hole. This is because the connection pattern 243 connecting the through holes 240 is not necessarily formed in the space without the genus layer. In other words, if a metal layer on the same plane corresponds to the area where the pattern 243 is to be formed, the connection pattern 243 can be fabricated to be received in the gap hole 250, which is formed on the same plane. The wave of the signal is printed in the layer 210, as shown in Figure 2A. However, no additional metal will be filled in the region where the junction 243 will be formed. As illustrated in Figure 2B, there may be a dielectric layer 22 0 below the metal layer of Figure 2B. In addition, the two-layer electromagnetic energy gap structure including the communication via holes does not have to have a stacked structure in which the metal removal 230-2 is stacked in the dielectric layer 220, and the dielectric layer 220 is formed of a metal layer. 210. In other words, the double-sand-layer electrical structure including the connecting through-holes may be formed to have another structural shape including a lower layer of the metal plate, an upper layer on which the metal plate may be disposed, a dielectric layer between the upper layers, and a through-hole layer The through hole of the dielectric layer (that is, the structural position of the lower layer is opposite to the structure of FIG. 2A). Of course, the electromagnetic energy gap structure illustrated in Fig. 2A has the same or similar noise blocking effect as the gap structure of Fig. 2B. Hereinafter, the electromagnetic energy gap structure in which the basic principle of noise according to the embodiment of the present invention is more widely applied will be described in detail with reference to Figs. 3 to 5C and Fig. 7A to Fig. 3 . First, the electromagnetic energy gap structure according to some specific embodiments of the present invention illustrated in the related drawings includes an extension having the same formula as the electromagnetic energy gap structure of Figs. 2A to 2C except that the communication through hole further includes an extension. Therefore, those skilled in the art can clearly understand that one of the above-mentioned electromagnetic energy gap structures illustrated in FIG. 2A and FIG. 6A and FIG. 6E and the principle of blocking noise can be applied to the following or similarly. In the electromagnetic energy gap structure of the embodiment. The 3-D perspective view of Fig. 3 includes an electromagnetic connection pattern that communicates through the through holes. Of course, the formation of Ϊ 230-1 is subject to the magnetic energy gap = the settable layer and the lower upper layer, and the pre-electromagnetic energy can be 7C, and the structural shape L 2C-like details are based on the energy-gap junction 20 1374692, the electromagnetic energy gap structure conforms to the first embodiment of the present invention. The connection pattern of the electromagnetic energy gap structure illustrated in FIG. 3, the extension pattern of the electromagnetic energy gap structure illustrated in FIG. 3 is shown in FIGS. 3 to 4B, and a magnetic energy gap structure according to the present invention is shown. 300 may include a metal layer 310, a plurality of 4, and a metal plate 330-2 (hereinafter referred to as a first metal layer, respectively), the metal plate 330-2 being located at a distance from the metal layer 310 and the communication. As such, the electromagnetic energy gap structure 300 can have a dual plane. For example, the metal layer 310 can be disposed on the first layer, and the metal plate 330-2 can be disposed on the second layer. Alternatively, as described above, the gold is provided on the second layer and the metal plate 330-1 and the metal plate 330-2 layer. At this time, the dielectric layer 320 may be disposed on the first and second layers for the sake of simplicity. FIG. 3 only shows two metal plates, and the plates are adjacent to each other in the longitudinal direction. A metal plate is disposed in any of the left side, the right side, the upper side, and/or the lower side. According to the present invention, the communication through hole 340 may be formed to include a 341, a second through hole 342, and a connection pattern 343 by which two adjacent metal plates are electrically similar to the second A picture. In particular, the first through the dielectric layer 320, and has one end portion 341a on the plane of the first metal plate, and the second through hole 342 layer 3 20, and has a position on the first metal plate 330- 2 the same end portion 342a. Fig. 4A and Fig. 4B are an intermediate configuration of the electric plate 330-1 and the second metal through hole 340 of the embodiment. The 330-1 and the metal layer 3 10 may be provided in the first space. Any of a plurality of metal plates other than a plurality of metals: the first pass is connected to each other. The hole 3 4 1 330-1 can be penetrated through the dielectric plane. 21 1374692 The connection pattern 343 can also be disposed on the same plane, and The other end portion 341b of the first through hole 341 is connected to the other end portion 341b of the first through hole 341, and the other end portion of the second through hole 342 is connected to the edge of the connecting pattern 34 of the through hole 34 0 to form a shape 350 to avoid the metal plate. 330-1 and 330-2 are electrically connected to 3 10°. Of course, the metal of the region where the connection pattern 343 is to be formed will not be formed (refer to the description of FIG. 2B and the metal of FIG. 3, which may not be required). Additionally, as described above, an electromagnetic energy gap structure communication through hole 340 according to another embodiment of the present invention may further include extension patterns 344, 345 (as a first extension pattern and a second extension pattern). The extension pattern 344 can be formed from the first end portion 341a and from the same plane (i.e., the pattern of the first gold extension, and the second extension pattern 345 can be formed from the end portion 342a of the screen and from the same Plane (ie, 3 30-2) extension In other words, one end portion of the first extension pattern 344 is consistent with the end portion 341a of the hole 341, and the end portion of the first extension pattern is connected to the first metal plate 330-1, whereby the first metal can be 341 and the first metal The plate 330-1 is electrically connected. One end portion of the similar pattern 345 is connected to the second through hole 342 342a, and the other end portion of the second extended pattern 345 is a metal plate 33 0-2, thereby The second through hole 342 and the second through hole 342 and the second portion 4 have another end portion and have another 342 b° to be placed on the metal layer to form any layer 3 10) in the slot. 300, respectively, the bottom hole 3 4 1 of the plate 330-1); the second through hole 342, the second metal plate is connected to the other of the 344, the first through hole, and the second extended end portion is connected to the second-plate 330-2 22 Γ 374692 Electrically connected. The shape of the etching hole 36丨 in the adjacent region of the end portion 34la of the first through hole 341 and the shape of the etching hole 3 62 in the adjacent region of the end portion 342a of the second through hole 342 can be determined accordingly. A pattern of the extended pattern 344 and the second extended pattern 345. Therefore, even if each of the figures in this specification shows that the extension pattern is a strip shape, the extension pattern may have various types (that is, a trace type and a spiral type), provided that Undead ~ the metal plate is broken. Therefore, it may be necessary to form the etched holes 361 and the etched holes 326 on the open curved shape instead of the closed curved shape so that the metal extension does not break away from the extended pattern. Therefore, according to the present invention, the two adjacent Jinsi panels 330-1 and 330_2 can be electrically connected to each other in the following order via the communication ceremony: the first metal plate 3 3 0-1 - the first extension pattern 344-> first through hole 341 - connection pattern 343 - second through hole 342 - second extension ★ ^ m eight sample 345 - second metal plate 330-2 (assuming the signal is from the first metal plate 3 33〇_2).丨 transmitted to the second metal plate in other words, compared to Figure 2A, due to the continuity of Figure 3; f| may include an extended pattern, so it may be additionally obtained and extended via the extended pattern compared to the 2nd Beza 340 "Midday" sense value. Because, if only the first extension length component is used, the same amount of the electric sample 345 can be satisfied. The sample 344 and the second extension are slightly different. , the power layer in the circuit board can be saved and at this time, the metal layer 310 can be used as one of the typical printed ground layers of 23 1374692. It can also be used by allowing each adjacent metal plate to be connected. The metal plates 330-1 and 330-2 form a dense path, whereby they can be used as the other of the power supply layer and the ground layer. Alternatively, if the electromagnetic energy gap structure 300 of the present invention is assumed to be a package system t, metal The layer 310 can be used as a ground layer, and a plurality of metal plates 330-1 and 330-2 connected to each other via the hole 340 are used to transmit a signal layer of the signal. According to the above principle, the electromagnetic energy gap structure 300 can be configured. The noise transfer path area between the source point and the noise blocking end point Absolutely reducing the noise of a specific frequency band. The noise source point and the impurity end point may correspond to one position and another position, respectively, and two electrons are applied to the positions. The foregoing figures 3 to 4B The electromagnetic energy gap structure is described on the assumption that the metal plate can be connected to another metal plate, and the plate is disposed on the metal side, the lower side, the left side, and the right side via the corresponding communicating through holes, so that all the metals The plates may be located on a plane, and each metal plate has the same shape and size. However, it is obvious that the present invention is not limited to the above embodiments, and various embodiments and modifications thereof. For example, a metal in the electromagnetic energy gap structure The plates may have various shapes (eg, polygons, circles, and ellipses E of different sizes. Alternatively, each of the metal plates may be individually or collectively arranged in two planes or more different planes. If at least one The metal plate is stacked on a plane different from the surface of the other stacked metal plates. The electromagnetic energy gap structure will have two or more electrical connections that are connected to each other. The communication can be used as the middle, and the blocking is blocked. The road will be the same as the previous one of each of the gold plates, every 3) and or according to the leveling layer. However, 24 1374692 is the number of layers added to the multi-layered road plate to which the electromagnetic energy gap structure of the present invention is applied. The design has no adverse effects. In addition, Figures 5A through 5C illustrate various examples of extended patterns that are variously implemented and modified in accordance with the present invention. In particular, Figures 5A through Illustrated are based on first through holes 341 and The formation position of the second through hole 342 is designed to have different positions and orientations. Here, the broken line refers to the connection pattern in the 5A to 5C drawings. The 7A to 7B are diagrams according to the present invention. In one embodiment, an example model of the noise rejection probability of the electromagnetic energy gap structure is examined, and the 7C shows an example of each result that is simulated after applying the example model of FIGS. 7A and 7B. Figure 7A illustrates an extended pattern 343 of the example model, and Figure 7B illustrates extended patterns 344 and 345. Fig. 7C illustrates frequency characteristic patterns 11 and 21. Figure 21 represents the frequency characteristics of the electromagnetic gap structure of the extended pattern and the communicating via. Fig. 1 1 represents the frequency characteristic of the electromagnetic gap structure of the comparative object, and the comparative object includes an extension pattern and an electromagnetic energy gap structure connecting the through holes having the same meter, but excluding the extension pattern. As illustrated in Fig. 7C, it can be recognized that the electromagnetic energy gap structure of the present invention is about 2. There is a band gap between 3 and 5 GHz. However, on the basis of the resistivity · 50 d B, the electromagnetic energy structure of the comparative object has about 4. Low frequency of 3GHz. This result shows that since the electromagnetic energy gap structure of the present invention can obtain a larger inductance value than the electromagnetic energy gap structure of the comparative object by the extension pattern of the communication hole, the lower limit value of the energy gap frequency is also reduced. The example 5C is shown in Fig. 1 and the design of the frequency band is 25 Γ 374692. Although the simulation result of Fig. 7 shows that the band gap of the present invention is between 2. Between 3 and 5 GHz, but the energy gap can be changed according to changes in design values, such as the shape of the first through hole, the second through hole, the connection pattern and the extension pattern constituting the through hole 340, the length, the area, and the width. frequency band. Moreover, it is apparent that the energy gap frequency and the rejection ratio can be varied depending on changes in design values such as the size, shape and area of the metal plate, and the dielectric constant of the dielectric material forming the dielectric layer. As described above, the present invention can block electromagnetic waves of the desired frequency band by utilizing an electromagnetic energy gap structure including a communicating through hole (the length of the communicating through hole extends through the extended pattern). It will be readily appreciated that the present invention can improve design constraints and configuration difficulties when the electromagnetic energy gap structure is designed or disposed on a printed circuit board, and the present invention has the advantages of multiple signal integrity. While some embodiments of the invention have been described, it should be understood by those of ordinary skill in the art of the invention that the invention can be varied widely without departing from the scope and spirit of the invention and the equivalents of the invention. The request item is defined. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a printed circuit board including an analog circuit and a digital circuit; FIG. 2A is an example of an electromagnetic energy gap structure including a communication via hole (which can be used as a a 3-D perspective view of a comparative object; FIG. 2B is a 3-D perspective view showing another example of an electromagnetic energy gap structure connecting the through holes (which can be used as a comparative object of the present invention); 26 1374692 FIG. 2C is a diagram showing an equivalent circuit of the electromagnetic energy gap structure illustrated in FIG. 2A, and FIG. 3 is a view showing an electromagnetic energy gap structure including a connecting through hole according to the first embodiment of the present invention. The 3-D perspective view; the fourth diagram illustrates the connection pattern of the electromagnetic energy gap structure illustrated in FIG. 3; the fourth diagram illustrates the extension pattern of the electromagnetic energy gap structure illustrated in FIG. 3; 5C is a plan view of an electromagnetic energy gap structure according to second to fourth embodiments of the present invention, respectively; FIG. 6A is a plan view showing a configuration of an electromagnetic energy gap structure including a rectangular metal plate; FIG. 6B is a plan view Plan view of the configuration of an electromagnetic energy gap structure including a triangular metal plate 6C is a plan view showing a strip configuration of an electromagnetic energy gap structure; FIGS. 6D and 6E are diagrams showing a plan view of a plurality of electromagnetic energy gap structure configurations having metal plates of different sizes; FIGS. 7A and 7B. An example model for checking the probability of noise suppression of an electromagnetic energy gap structure according to an embodiment of the present invention; and FIG. 7C illustrates a simulation of each result after applying the models of FIGS. 7A and 7B. [Main component symbol description] 100 printed electric raft board 110-1, 110-2' 110-3' 1 10-4 metal layer 120, 120-1, 120-2, 120-3 dielectric layer 27 Γ 374692 130 first Electronic circuit 140 second electronic circuit 200 electromagnetic energy gap structure 210 metal layer 230-1 '230-2 metal plate 240 connecting through hole 241 first consistent ceremony 24 1 a, 241b, 242a ' 242b end portion 242 second pass 243 Connection pattern 250 clearance hole 300 electromagnetic energy gap structure 3 10 metal layer 320 dielectric layer 3 30-1, 3 30-2 metal plate 340 communication through hole 341 first continuous hole 342 second through hole 341a, 341b, 342a '342b End portion 343 connection pattern 344, 345 extension pattern 350 clearance holes 361, 362 etching hole 28