CN102131343A - Ultra wide band electromagnetic band gap structure for suppressing ground bounce noise of high speed circuit/microwave circuit - Google Patents
Ultra wide band electromagnetic band gap structure for suppressing ground bounce noise of high speed circuit/microwave circuit Download PDFInfo
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- CN102131343A CN102131343A CN201110064525.8A CN201110064525A CN102131343A CN 102131343 A CN102131343 A CN 102131343A CN 201110064525 A CN201110064525 A CN 201110064525A CN 102131343 A CN102131343 A CN 102131343A
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- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 230000001413 cellular effect Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 238000002474 experimental method Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 230000001629 suppression Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 241001620634 Roger Species 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
The invention provides a novel ultra wide band electromagnetic band gap structure which belongs to the technical field of information. The structure is mainly used for replacing a power layer of the traditional high speed circuit/microwave circuit so as to suppress ground bounce noise in the structures and realize better power integrity. The structure has a typical three-layer circuit board structure comprising a dielectric layer in the middle and two metal layers up and down, wherein the electromagnetic band gap structure is arranged on the upper layer. In the invention, a typical example is verified, i.e. a sample prepared in an experiment is tested through a network analyzer, which confirms that the structure provided by the invention can realize noise suppression superior to -30dB to any two ports in a frequency range from 500MHz to 5.5GHz.
Description
Technical field:
The present invention relates to a kind of novel ultra broadband electromagnetic bandgap structure, belong to areas of information technology, its main application is to replace the bus plane of existing high speed circuit/microwave circuit, thereby is suppressed at the ground bullet noise that exists in these structures, realizes power supply integrality preferably.
Background technology:
Electronic technology, particularly chip and encapsulation technology have two-forty just gradually now, intensive one-tenth, and characteristics such as low-power consumption, its demand for the power supply integrality also strengthens thereupon.Traditional circuit board is because working frequency range is lower, and electric supply system generally adopts the normal power cord power supply, and ohmic loss is also very little, therefore has extraordinary power supply integrality.But along with such as processor, the rising gradually of electronic device working frequency range such as internal memory, the ohmic loss of power line itself and the electromagnetic interference of peripheral devices might be disturbed the supply power voltage of other chip, thereby influence the power supply integrality of system, serious in addition the operate as normal that hinders circuit.In order to overcome this problem, power line develops into bus plane gradually, and the latter has littler ohmic loss.But along with operating frequency further improves, to surpassing 500MHz and entering in the microwave frequency band, a kind of new problem promptly plays the power supplying efficiency that noise further influences bus plane.Ground plays noise and it is generally acknowledged the inductive element that originates from chip and the encapsulation technology, and small current disturbing produces bigger voltage fluctuation, and this voltage fluctuation is harmful to whole system, therefore plays noise with being called.And at microwave frequency band, except inductive element and, the resonance of circuit board self then plays the prior inducement of noise with becoming, be in the frequency of resonance at some, the electric current variation of chip piece will be easy to propagate in circuit board, cause the variation of other chip power supply voltages, thereby destroyed the power supply integrality of whole system.The present invention promptly proposes a kind of scheme, to solve this problem that exists on high speed circuit/microwave circuit.
Summary of the invention:
Goal of the invention: the present invention is directed to prior art problems, a kind of novel ultra broadband electromagnetic bandgap structure is proposed, it wants purposes to be to replace the bus plane of existing high speed circuit/microwave circuit, to be suppressed at the ground bullet noise that exists in these structures, realizes power supply integrality preferably.
Technical scheme: ultra broadband electromagnetic bandgap structure of the present invention has typical microstrip structure.Agent structure is divided three layers, and wherein, the intermediate layer is high speed circuit/microwave-medium plate, can be media such as polytetrafluoroethylene, FR4, Roger series, dielectric thickness can not wait to 2mm for 0.2mm, two-layerly up and down all cover metallic copper respectively as the bus plane and the stratum of electric power system, copper thickness is the 18um or the 35um of standard, lower floor is as the stratum, do not make etching, the upper strata is a bus plane, need etch electromagnetic bandgap structure.
Performance Evaluation: say traditionally, a kind of simple proposal is arranged, promptly see the transfger impedance between any two ports, if this resistance value is lower than a preset threshold, we think that the power supply integrality is good, and issuable big current fluctuation will can not have influence on other chips on a slice chip.And in reality is measured, we adopt another kind of index usually, i.e. insertion loss S21 between two ports, it has identical variation tendency with transfger impedance, be that S21 is more near 1, it is more little to insert loss, and transfger impedance is big more, and the change of a port will more easily propagate on the another one port.Guarantee that reasonably suppressing ground plays noise, the insertion loss threshold value that we set is-30dB, promptly only is lower than this threshold value, and we think that just the power supply integrality is good, realize noise suppressed preferably.
Beneficial effect: we have at first prepared the typical sample of the three-decker that proposes in the technical scheme.Wherein Zhong Jian dielectric-slab is FR4, and its dielectric constant is 4.4, and typical thickness is 0.4mm, and copper is covered on the two sides, and one side is etching not, keeps continuously, and one side need be etched into the electromagnetic bandgap structure that needs.In order to verify its performance, we have prepared a typical sample, and the checking that experimentizes of the vector network instrument of the E8363 of the Agilent company that buys by my school, the result confirms that the present invention can be in the frequency range from 500MHz to 5.5GHz, can both realize any two ports being better than-effect of 30dB, suppress to be in this frequency range effectively and play noise interiorly, realize good power supply integrality.
Description of drawings:
Fig. 1 is the overall schematic that is used to replace the electromagnetic bandgap structure of common power layer of the present invention.Be divided into three-decker, the centre is a dielectric layer; Lower floor is the stratum, covers copper, and structure is continuous; The upper strata is a bus plane, covers copper, need be etched into electromagnetic bandgap structure, and adds peripheral metal.
Fig. 2 is a ultra broadband electromagnetic bandgap structure domain front view on the bus plane of the present invention.Wherein scheme the front view that a is a cellular construction, in order to verify its specific performance, we provide a representative instance, concrete parameter is a=30mm, w=0.5mm, g=0.5mm, p=1mm, figure b is the front view of total, and after it was actually the folded assembly of 9 cellular constructions, adding a circle in the periphery wide again was the metallic copper of 10cm.
Fig. 3 is the specific performance of having verified by experiment of the present invention, and specimen has Fig. 1 and provide canonical parameter.
Embodiment:
At first need prepare sample as the three-decker that proposes in the technical scheme.The centre is a dielectric-slab, and material can be selected as polytetrafluoroethylene, FR4, and media such as Roger series, the two-layer up and down copper that covers, one side simultaneously need be etched into the electromagnetic bandgap structure as Fig. 2 continuously.
After the completion of processing, need by concrete experimental verification, when confirmation its in certain frequency range, can both realize any two ports being lower than-the insertion loss of 30dB, it can be taken substituting of the bus plane make common high speed circuit/microwave circuit, to realize playing over the ground Noise Suppression.
Claims (5)
1. a novel wideband electromagnetic band gap (hereinafter to be referred as EBG, Electromagnetic Bandgap) structure.Comprise three layer circuit board structures, wherein, the intermediate layer is high speed circuit/microwave-medium plate (1); Copper is covered in lower floor, as stratum (2), does not need etching; Copper is covered on the upper strata, as bus plane (3), need be etched into the EBG structure.
2. the structure that proposes according to claim 1, intermediate layer dielectric-slab (1) material can but be not limited to media such as polytetrafluoroethylene, PMMA, FR4.
3. the structure that proposes according to claim 1, lower floor stratum (2), cover copper thickness can but be not limited to 18 microns or 35 microns of standard.
4. the structure that proposes according to claim 1, upper strata bus plane (3), cover copper thickness can but be not limited to 18 microns or 35 microns of standard.
5. according to claim 4, complete bus plane (3) need etch the cellular construction with dicyclo EBG structure (4), again with the synthetic integral body of some cellular constructions, further covers the copper (5) of certain width in the periphery, could finally form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110064525.8A CN102131343A (en) | 2011-03-17 | 2011-03-17 | Ultra wide band electromagnetic band gap structure for suppressing ground bounce noise of high speed circuit/microwave circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110064525.8A CN102131343A (en) | 2011-03-17 | 2011-03-17 | Ultra wide band electromagnetic band gap structure for suppressing ground bounce noise of high speed circuit/microwave circuit |
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| Publication Number | Publication Date |
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| CN102131343A true CN102131343A (en) | 2011-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110064525.8A Pending CN102131343A (en) | 2011-03-17 | 2011-03-17 | Ultra wide band electromagnetic band gap structure for suppressing ground bounce noise of high speed circuit/microwave circuit |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102395245A (en) * | 2011-07-22 | 2012-03-28 | 西安电子科技大学 | U-shaped electromagnetic band gap circuit board with low-frequency simultaneous switching noise inhibiting function |
| CN102957310A (en) * | 2012-10-26 | 2013-03-06 | 上海交通大学 | Power supply distribution network based on local electromagnetic band gap structure |
| CN103997200A (en) * | 2014-05-20 | 2014-08-20 | 浙江工业大学 | Power distribution network based on plane C-type bridge electromagnetic band gap structure |
| CN103997201A (en) * | 2014-05-20 | 2014-08-20 | 浙江工业大学 | Power distribution network based on plane hybrid-bridge electromagnetic band gap structure |
| CN104332677A (en) * | 2014-10-24 | 2015-02-04 | 上海交通大学 | Ultra-wideband plane electromagnetic band-gap structure for suppressing high-speed circuit ground bounce noise |
| CN107896420A (en) * | 2017-11-10 | 2018-04-10 | 英业达科技有限公司 | Circuit board and its electromagnetic bandgap structure |
| WO2022227735A1 (en) * | 2021-04-28 | 2022-11-03 | 荣耀终端有限公司 | Electronic device and communication system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090038840A1 (en) * | 2007-08-07 | 2009-02-12 | Samsung Electro-Mechanics Co., Ltd. | Electromagnetic bandgap structure and printed curcuit board |
| CN101453828A (en) * | 2007-12-07 | 2009-06-10 | 三星电机株式会社 | Electromagnetic bandgap structure and printed circuit board |
| CN101714681A (en) * | 2008-10-08 | 2010-05-26 | 三星电机株式会社 | Electro-magnetic bandgap structure |
| CN101938023A (en) * | 2010-07-13 | 2011-01-05 | 东南大学 | Bragg rectangular two-dimensional electromagnetic band gap (EBG) high-impedance backboard plane structure |
-
2011
- 2011-03-17 CN CN201110064525.8A patent/CN102131343A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090038840A1 (en) * | 2007-08-07 | 2009-02-12 | Samsung Electro-Mechanics Co., Ltd. | Electromagnetic bandgap structure and printed curcuit board |
| CN101453828A (en) * | 2007-12-07 | 2009-06-10 | 三星电机株式会社 | Electromagnetic bandgap structure and printed circuit board |
| CN101714681A (en) * | 2008-10-08 | 2010-05-26 | 三星电机株式会社 | Electro-magnetic bandgap structure |
| CN101938023A (en) * | 2010-07-13 | 2011-01-05 | 东南大学 | Bragg rectangular two-dimensional electromagnetic band gap (EBG) high-impedance backboard plane structure |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102395245A (en) * | 2011-07-22 | 2012-03-28 | 西安电子科技大学 | U-shaped electromagnetic band gap circuit board with low-frequency simultaneous switching noise inhibiting function |
| CN102395245B (en) * | 2011-07-22 | 2013-06-12 | 西安电子科技大学 | U-shaped electromagnetic band gap circuit board with low-frequency simultaneous switching noise inhibiting function |
| CN102957310A (en) * | 2012-10-26 | 2013-03-06 | 上海交通大学 | Power supply distribution network based on local electromagnetic band gap structure |
| CN103997200A (en) * | 2014-05-20 | 2014-08-20 | 浙江工业大学 | Power distribution network based on plane C-type bridge electromagnetic band gap structure |
| CN103997201A (en) * | 2014-05-20 | 2014-08-20 | 浙江工业大学 | Power distribution network based on plane hybrid-bridge electromagnetic band gap structure |
| CN103997200B (en) * | 2014-05-20 | 2017-01-11 | 浙江工业大学 | Power distribution network based on plane C-type bridge electromagnetic band gap structure |
| CN104332677A (en) * | 2014-10-24 | 2015-02-04 | 上海交通大学 | Ultra-wideband plane electromagnetic band-gap structure for suppressing high-speed circuit ground bounce noise |
| CN107896420A (en) * | 2017-11-10 | 2018-04-10 | 英业达科技有限公司 | Circuit board and its electromagnetic bandgap structure |
| WO2022227735A1 (en) * | 2021-04-28 | 2022-11-03 | 荣耀终端有限公司 | Electronic device and communication system |
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Application publication date: 20110720 |